CN110379793A - One kind covering copper ceramic substrate motherboard structure - Google Patents

Abstract

The present invention provides a copper-clad ceramic substrate mother board structure, including the mother board, the front or back of the mother board is also engraved with cutting lines, and the outer sides of the front and back sides of the mother board are provided with corresponding reinforced copper foil process edges, The enhanced copper foil process edge includes four upper, lower, left, and right copper foil process edges; the cutting line includes a horizontal cutting line and a vertical cutting line for separating the copper foil process edge on the motherboard from the motherboard, and the horizontal cutting line or the vertical cutting line. Both ends extend to the outer edge of the motherboard; the cutting line also includes a mesh internal cutting line for breaking off a single small substrate on the motherboard, and the horizontal cutting line extends from the top, bottom, left, and right directions of the mesh internal cutting line and longitudinal cutting lines. This patent increases the strength of the edge of the mother board and reduces the damage and cracks of the ceramic edge of the mother board through the corresponding enhanced copper foil process edge.

Description

A copper-clad ceramic substrate motherboard structure

technical field

The invention relates to the technical field of semiconductor processing equipment, in particular to a mother board of a copper-clad ceramic substrate.

Background technique

Copper-clad ceramic substrate (DBC substrate), referred to as ceramic copper-clad laminate. Copper-clad ceramic substrates are graphic circuit boards manufactured by motherboards, and are often used as power device substrates in the field of electronic packaging.

In order to improve the production efficiency of power device packaging, the current welding process of components such as DBC substrates and chips is gradually changing from small piece welding to overall motherboard welding, and then divided into small pieces after welding. However, since the base material of the motherboard is ceramic, and it has been laser cut before delivery (with cutting lines on the surface), there are many problems in production:

1) Ceramics at the edge of the motherboard are prone to breakage and cracks, and these damages and cracks tend to expand toward the interior of the motherboard graphics, resulting in product scrapping.

2) During the packaging and welding process or during delivery and transportation, the mother board is easy to crack along the cutting line, resulting in product breakage.

Contents of the invention

Aiming at the problems existing in the prior art, the present invention provides a copper-clad ceramic substrate motherboard structure to solve the problem that the edge of the existing traditional motherboard is easily damaged and cracks, and also solves the traditional , the technical problem that the mother board is easy to crack along the cutting line.

The technical solution of the present invention is: a copper-clad ceramic substrate motherboard structure, including a motherboard, the front or back of the motherboard is also engraved with criss-cross cutting lines, it is characterized in that the front and back of the motherboard The outer sides of both sides are provided with corresponding reinforced copper foil process edges;

The reinforced copper foil process side includes four copper foil sides arranged on the four sides of the upper, lower, left, and right outside the mother board;

The cutting line includes a transverse cutting line and a longitudinal cutting line for separating the copper foil edge on the motherboard from the motherboard, and the two ends of the transverse cutting line or the longitudinal cutting line extend to the outer edge of the motherboard; There are two transverse cutting lines and two longitudinal cutting lines, and the two transverse cutting lines intersect with the two longitudinal cutting lines to form a rectangle;

The cutting line also includes a mesh internal cutting line for breaking off a single small substrate on the motherboard. The horizontal cutting line and the vertical cutting line extend in the four directions of the mesh internal cutting line, but still On the inner side of the adjacent copper foil edge.

In this patent, the outer edges of the square sides of the traditional motherboard are equipped with corresponding reinforced copper foil process edges, through the copper foil edge, the strength of the edge of the motherboard is increased, and the damage and cracks of the ceramic edge of the motherboard are reduced. At the same time, the copper foil edge can prevent damage and cracks from expanding to the inside of the mother board. Due to the protection of the copper foil edge, the cutting line inside the motherboard cannot run through the entire motherboard, reducing the risk of the motherboard breaking along the cutting line.

Further preferably, at least one of the four corners of the motherboard is chamfered. Through the chamfer structure, the positioning or fool-proofing of the mother board is realized. The angle of the chamfer structure is 10°-80°.

Further preferably, there is a gap between the outer sides of all copper foil sides and the outer edge of the motherboard, and the distance between the outer sides of all copper foil sides and the outer edge of the motherboard is greater than 3 mm.

Further preferably, the distance between adjacent sides of adjacent copper foil sides is greater than 0.6 mm, and the adjacent sides of adjacent copper foil sides are separated by the longitudinal cutting line or the transverse cutting line.

Further preferably, all the copper foil sides are the upper copper foil side on the upper side, the lower copper foil side on the lower side, the left copper foil side on the left side and the right copper foil side on the right side;

The upper copper foil side and the lower copper foil side are arranged symmetrically up and down;

The left copper foil side and the right copper foil side are mirror-symmetrically arranged.

Further preferably, the distance between the inner side of the left copper foil side and the right copper foil side and the adjacent longitudinal cutting line is greater than 0.3mm, and the inner side of the upper copper foil side and the lower copper foil side and the adjacent transverse cutting line The distance between the cutting lines is greater than 0.3mm.

As a preferred solution, the upper and lower ends of the longitudinal cutting line extend to the outer edge of the mother board, and the left and right ends of the transverse cutting line extend beyond the longitudinal cutting line, but are still inside the adjacent copper foil edge.

The separation sequence in the later stage of this structure is to first split the left copper foil side and the right copper foil side vertically along the longitudinal cutting line, and then split the upper copper foil side and the lower copper foil side horizontally along the horizontal cutting line.

As another preferred solution, the left and right ends of the transverse cutting line extend to the outer edge of the motherboard, and the longitudinal cutting line extends out of the transverse cutting line and the longitudinal cutting line, but is still inside the adjacent aluminum foil edge.

The separation sequence in the later stage of this structure is to first split the upper copper foil edge and the lower copper foil edge horizontally along the horizontal cutting line, and then vertically split the left copper foil edge and the right copper foil edge along the longitudinal cutting line.

Description of drawings

FIG. 1 is a schematic structural view of Embodiment 1 of the present invention.

Fig. 2 is the partial enlarged view of specific embodiment 1 of the present invention;

Fig. 3 is the partial enlarged view of specific embodiment 1 of the present invention;

Fig. 4 is a kind of structural representation of specific embodiment 2 of the present invention;

Fig. 5 is a schematic structural view of the corner of Embodiment 3 of the present invention;

Fig. 6 is a structural schematic diagram of the present invention with 1-4 chamfering structures.

In the figure: 1 is the copper foil edge, 2 is the motherboard, A1 is the left copper foil edge, A2 is the right copper foil edge, B1 is the upper copper foil edge, B2 is the lower copper foil edge, M is the longitudinal cutting line, L is Horizontal cutting lines.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings.

Specific embodiment 1: Referring to FIG. 1 to FIG. 3, a copper-clad ceramic substrate mother board structure includes a mother board 2, and the front or back of the mother board 2 is also engraved with criss-crossing cutting lines, and the front and back of the mother board 2 The outer sides of both sides are provided with corresponding enhanced copper foil process edges; the enhanced copper foil process edges include four copper foil edges 1 respectively arranged on the upper, lower, left, and right sides outside the motherboard; the cutting line includes the upper, lower The set copper foil side 1 is separated from the mother board by the horizontal cutting line L and the copper foil side 1 set on the left and right sides of the mother board is used to separate the longitudinal cutting line M from the motherboard, and the two ends of the horizontal cutting line L protrude The longitudinal cut line extends to the outside edge of the motherboard, but remains inside the adjacent foil edge. There are two transverse cutting lines and two longitudinal cutting lines, and the intersection of the two transverse cutting lines and the two longitudinal cutting lines forms a rectangle. Ends of the transverse cutting lines all extend out of the longitudinal cutting lines. The ends of the longitudinal cutting lines extend from the transverse cutting lines.

The cutting line also includes the mesh internal cutting line used to break off a single small substrate on the motherboard. The horizontal cutting line and the vertical cutting line extend in the four directions of the mesh internal cutting line, but they are still adjacent to each other. the inner side of the copper foil edge. Specifically, that is, two transverse cutting lines respectively extend in the upper and lower directions of the mesh inner cutting line, and two longitudinal cutting lines extend respectively in the left and right directions of the mesh inner cutting line.

In this patent, the outer edges of the square sides of the traditional motherboard are equipped with corresponding reinforced copper foil process edges, through the copper foil edge, the strength of the edge of the motherboard is increased, and the damage and cracks of the ceramic edge of the motherboard are reduced. At the same time, the copper foil edge can prevent damage and cracks from expanding to the inside of the mother board. Due to the protection of the copper foil edge, the cutting line inside the motherboard cannot run through the entire motherboard, reducing the risk of the motherboard breaking along the cutting line.

All the copper foil edges are the front copper foil edge B1 on the upper side, the rear copper foil edge B2 on the lower side, the left copper foil edge A1 on the left side and the right copper foil edge A2 on the right side; the upper copper foil The side B1 and the lower copper foil side B2 are mirror-symmetrically set up and down; the left copper foil side A1 and the right copper foil side A2 are mirror-symmetrically set up and down.

The distance d between the upper copper foil side B1 and the lower copper foil side B2 and the adjacent transverse cutting line L is 0.3 mm˜1.0 mm.

The distance e between the left copper foil edge A1 and the right copper foil edge A2 and the adjacent longitudinal cutting line M is 0.3 mm˜1.0 mm.

There is a gap between the outer sides of all copper foil sides and the outer edge of the mother board, and the distance b between the outer sides of the upper copper foil side and the lower copper foil side and the outer edge of the mother board is greater than 3 mm. The distance a between the outer side of the left copper foil side and the outer side of the right copper foil side and the outer edge of the mother board is greater than 3 mm. The distance c between the tops of the right copper foil side and the left copper foil side and adjacent transverse cutting lines is 0.3mm˜1.0mm.

The distance f of the mesh internal cutting line beyond the transverse cutting line L or the longitudinal cutting line M is: 0<f<c, d, e. See Figure 3.

The left and right ends of the transverse cutting line L extend to the outer edge of the motherboard.

The order of separation in the later stage of this structure is to first split the upper copper foil edge B1 and the lower copper foil edge B2 horizontally along the transverse cutting line L, and then cut the left copper foil edge A1 and the right copper foil edge along the longitudinal cutting line M. A2 is arranged in the direction of splitting vertically.

The copper foil on the long side of the motherboard can be broken off first.

Specific embodiment 2, referring to FIG. 4 , the upper and lower ends of the longitudinal cutting line M extend to the outer edge of the motherboard.

The separation sequence in the later stage of this structure is as follows: First, the left copper foil edge A1 and the right copper foil edge A2 are vertically separated along the longitudinal cutting line M, and then the upper copper foil edge B1 and the lower copper foil edge B1 are separated along the transverse cutting line L. Side B2 is split apart laterally.

Specific embodiment 3, referring to FIG. 5 and FIG. 6 , on the basis of specific embodiment 1 or 2, at least one of the four corners of the motherboard is a chamfered structure. Through the chamfer structure, the positioning or fool-proofing of the mother board is realized. The angle of the chamfer structure is 10°-80°. The four corners of the motherboard can be inverted with 1 to 4 bevels. (A) in FIG. 6 is a schematic diagram of chamfering a corner. (B) is a schematic diagram of chamfering two corners. (C) is a schematic diagram of chamfering three corners. (D) is a schematic diagram of chamfering four corners. The edge of the aluminum foil adjacent to the chamfer structure is also a chamfer structure.

The above are only preferred embodiments of the present invention, and it should be pointed out that for those of ordinary skill in the art, some improvements and modifications can also be made without departing from the principle of the present invention, and these improvements and modifications should also be considered Be the protection scope of the present invention.

Claims (8)

1. one kind covers copper ceramic substrate motherboard structure, including motherboard, the front or the back side of the motherboard are also carved to be equipped with and be handed in length and breadth The cutting line of mistake setting, which is characterized in that corresponding enhancing copper foil technique is provided on the outside of the positive and negative two sides of motherboard Side；

The enhancing copper foil technique edges include the copper foil side of four four sides up and down being separately positioned on the outside of motherboard；

The cutting line include on motherboard copper foil side broken from motherboard from transverse cut and longitudinally cutting line, the cross The outer edge of the motherboard is extended to the both ends of cutting line or longitudinally cutting line；

There are two the transverse cut and the longitudinally cutting line are set, two transverse cuts intersect with two longitudinally cutting lines Surround a rectangle；

The cutting line further include on motherboard single small substrate broken from netted inside cutlines, the netted inside Extend transverse cut and longitudinally cutting line on the four direction up and down of cutting line, but still in neighbouring copper foil side Inside.

2. one kind according to claim 1 covers copper ceramic substrate motherboard structure, it is characterised in that: four angles of the motherboard At least one corner is chamfering structure in portion.

3. one kind according to claim 1 covers copper ceramic substrate motherboard structure, it is characterised in that: outside all copper foil sides There is gap between side and the outer edge of the motherboard, and the outside on all copper foil sides and the outer peripheral spacing of the motherboard are equal Greater than 3mm.

4. one kind according to claim 1 covers copper ceramic substrate motherboard structure, it is characterised in that: the neighbour on adjacent copper foil side Spacing between nearside is greater than 0.6mm, and adjacent copper foil side adjacent side passes through the longitudinally cutting line or transverse cut Separate.

5. one kind according to claim 1 covers copper ceramic substrate motherboard structure, it is characterised in that: all copper foil side difference For positioned at the upper copper foil of upside while, positioned at the lower copper foil of downside while, positioned at the left copper foil side in left side and positioned at the right copper on right side Foil side；

Upper copper foil mirror symmetry setting up and down while with the lower copper foil；

Left copper foil mirror symmetry while with the right copper foil or so is arranged.

6. one kind according to claim 5 covers copper ceramic substrate motherboard structure, it is characterised in that: the left copper foil side and The spacing of the inside on the right copper foil side and neighbouring longitudinally cutting line is greater than 0.3mm, the upper copper foil side and the lower copper The spacing of the inside on foil side and neighbouring transverse cut is greater than 0.3mm.

7. one kind according to claim 1 covers copper ceramic substrate motherboard structure, it is characterised in that: the longitudinally cutting line Upper and lower ends extend to the outer edge of motherboard, and longitudinally cutting line is extended in the left and right ends of the transverse cut, but still in The inside on neighbouring copper foil side.

8. one kind according to claim 1 covers copper ceramic substrate motherboard structure, it is characterised in that: the transverse cut Left and right ends extend to the outer edge of motherboard, and the longitudinally cutting line extends transverse cut and longitudinally cutting line, but still Inside in neighbouring copper foil side.