CN110379606B - High-frequency low-loss PCB winding device for transformer and inductor - Google Patents
High-frequency low-loss PCB winding device for transformer and inductor Download PDFInfo
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- CN110379606B CN110379606B CN201810327933.XA CN201810327933A CN110379606B CN 110379606 B CN110379606 B CN 110379606B CN 201810327933 A CN201810327933 A CN 201810327933A CN 110379606 B CN110379606 B CN 110379606B
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- copper
- clad
- winding
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- cycle
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- 238000004804 winding Methods 0.000 title claims abstract description 119
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 8
- 230000008878 coupling Effects 0.000 abstract description 5
- 238000010168 coupling process Methods 0.000 abstract description 5
- 238000005859 coupling reaction Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Of Transformers For General Uses (AREA)
Abstract
The invention discloses a high-frequency low-loss PCB winding device for a transformer and an inductor, which comprises a multilayer PCB and a plurality of through holes formed on the multilayer PCB, wherein the multilayer PCB comprises a winding and a first terminal and a second terminal of the winding, or the multilayer PCB comprises two windings and a third terminal, a fourth terminal and a fifth terminal; the winding comprises a plurality of parallel coil layers; the PCB winding designed by the invention effectively ensures the advantages of small size and low cost of the transformer and the inductor, and greatly reduces the high-frequency loss, so that the PCB winding can be used for a novel high-frequency converter. And the nearly identical coupling coefficient of the magnetic field in the two windings can be realized within the realization range of the PCB production process and the transformer assembly process, so that the winding currents are balanced.
Description
Technical Field
The invention relates to the field of PCB windings, in particular to a high-frequency low-loss PCB winding device.
Background
The vehicle-mounted DC/DC of the new energy automobile and the charger have to reduce the product size due to limited space. Where magnetic components such as transformers, inductors occupy a lot of space in such products. In addition, such products are mass-produced, so that high demands are also made on cost reduction. The use of Printed Circuit Board (PCB) windings in transformers and inductors results in a significant reduction in the height of such products and in material costs. As shown in fig. 1, an example transformer winding is schematically illustrated.
U.S. patent No. 6429763B1 uses eight layers of PCB boards to realize primary and secondary parallel windings of a transformer, one for each layer. The design method can increase the number of turns of the primary winding and the conductivity of the secondary winding, and is suitable for a high-voltage-to-low-voltage converter. With the popularization of resonant converters, and technological breakthroughs, cost reduction of silicon carbide (SiC) and gallium nitride (GaN) power devices, high frequency converters have become possible and have been popularized. Since such PCB winding designs generate large winding losses at high frequencies of operation, it has been difficult to adapt them to high frequency converters.
The high frequency litz wire is more suitable for high frequency converters but takes up a larger space. And compared with a PCB winding, the magnetic element produced by using the litz wire has higher cost, more complex process and poorer product consistency.
Furthermore, when litz wire is used in transformers like the secondary S1 and S2 double windings of fig. 1, the capacitance causes non-uniform coupling of the magnetic field in S1 and S2, resulting in an unbalanced winding current.
Summary of the invention
Aiming at the problems existing in the prior art, the invention aims to provide a high-frequency low-loss PCB winding device for a transformer and an inductor, and the PCB winding designed by the invention effectively ensures the advantages of the transformer, the inductor and the inductor, and the high-frequency loss is greatly reduced, so that the high-frequency low-loss PCB winding device is possible to be used for a novel high-frequency converter. And the nearly identical coupling coefficient of the magnetic field in the two windings can be realized within the realization range of the PCB production process and the transformer assembly process, so that the winding currents are balanced.
In order to achieve the above object, a high-frequency low-loss PCB winding device for transformers and inductors comprises a multi-layer PCB board, a through hole arranged on the PCB board,
the multi-layer PCB board comprises a winding and a first terminal and a second terminal of the winding, or comprises two windings and a third terminal, a fourth terminal and a fifth terminal;
the winding comprises a plurality of parallel coil layers;
the coil layer includes first half week and covers the copper wire and walk the line with the latter half week, first half week covers the copper wire and walks the line with the latter half week and be located different PCB layers, and first half week covers the copper wire and walks the line with the latter half week and link to each other by the through-hole, just coil layer first half week covers the copper wire and is located PCB layer edge portion, and the latter half covers the copper wire and is located PCB layer middle part, or first half week covers the copper wire and is located PCB layer middle part, and the latter half covers the copper wire and is located PCB layer edge portion.
As an embodiment of the present invention, based on the above, except that the multi-layer PCB board includes one winding, and first and second terminals of the winding; the coil layers in parallel are connected at a first terminal and at a second terminal.
Further, the first half-cycle copper-clad wire or the second half-cycle copper-clad wire of the coil layer is formed by connecting a plurality of copper-clad wires in parallel, and the copper-clad wires connected in parallel are connected at the first terminal and the second terminal; the copper-clad wire of the front half-cycle copper-clad wire positioned in the middle of the inner side of the PCB layer is connected to the copper-clad wire of the rear half-cycle copper-clad wire positioned at the edges of the two sides of the inner side of the PCB layer through the through hole; the copper-clad wires of the first half circle copper-clad wires positioned at the two side edges of the layer are connected to the copper-clad wires of the second half circle copper-clad wires positioned at the middle of the layer through the through holes.
As another embodiment of the present invention, based on the above, the multi-layer PCB board includes two windings of the first winding and the second winding, and a third terminal, a fourth terminal, and a fifth terminal;
one end of the first winding is connected to the third terminal, and the other end is connected to the fourth terminal; the second winding has one end connected to the fourth terminal and the other end connected to the fifth terminal.
Further, the winding direction of the first winding from the third terminal to the fourth terminal is the same as the winding direction of the second winding from the fourth terminal to the fifth terminal.
Further, the first winding and the second winding each comprise a plurality of parallel coil layers, the first winding coil layers being connected at a third terminal and connected at a fourth terminal; the second winding coil layers are connected at a fourth terminal and connected at a fifth terminal.
Further, the front half-cycle copper-clad wire or the rear half-cycle copper-clad wire is formed by connecting a plurality of copper-clad wires in parallel, and the copper-clad wires connected in parallel are connected at a third terminal and a fourth terminal; the copper-clad wire with the copper-clad wire at the front half cycle positioned in the middle of the layer is connected to the copper-clad wire with the copper-clad wire at the rear half cycle positioned at the two side edges of the layer through the through hole; the copper-clad wires with the front half-cycle copper-clad wires positioned at the two side edges of the layer are connected to the copper-clad wires with the rear half-cycle copper-clad wires positioned at the middle of the layer through holes
Further, in each layer of the PCB, the first half-cycle copper-clad wire belongs to a first winding, and the second half-cycle copper-clad wire belongs to a second winding; or the first half-cycle copper-clad wire belongs to the second winding, and the second half-cycle copper-clad wire belongs to the first winding.
Compared with the prior art, the design of the invention has the following beneficial effects:
the PCB winding designed by the invention effectively ensures the advantages of small size and low cost of the transformer and the inductor, and greatly reduces the high-frequency loss, so that the PCB winding can be used for a novel high-frequency converter. And the nearly identical coupling coefficient of the magnetic field in the two windings can be realized within the realization range of the PCB production process and the transformer assembly process, so that the winding currents are balanced.
Drawings
FIG. 1 is a schematic diagram of an example transformer winding;
FIG. 2 is a schematic diagram of one embodiment of the present invention;
FIG. 3 is a schematic view of another embodiment of the present invention;
FIG. 4 is a schematic diagram of another embodiment of the present invention;
FIG. 5 is a schematic diagram of the different layers of the winding coil connection design of the present invention;
FIG. 6 is a first layer of the PCB winding product of the present invention;
FIG. 7 is a second layer of the PCB winding product of the present invention;
FIG. 8 is a third layer of the PCB winding product of the present invention;
fig. 9 is a fourth layer of the PCB winding product of the present invention;
FIG. 10 is a fifth layer of the PCB winding product of the present invention;
fig. 11 is a sixth layer of the PCB winding product of the present invention.
Detailed Description
The design of the present invention will be further described with reference to the accompanying drawings.
As shown in fig. 2-4, a high frequency low loss PCB winding apparatus for a transformer and an inductor, includes a multi-layered PCB board, a through hole formed on the PCB board,
the multi-layer PCB board comprises a winding and a first terminal and a second terminal of the winding, or comprises two windings and a third terminal, a fourth terminal and a fifth terminal;
the winding comprises a plurality of parallel coil layers;
as shown in fig. 5, the coil layer includes a first half-cycle copper-clad wire and a second half-cycle copper-clad wire, the first half-cycle copper-clad wire and the second half-cycle copper-clad wire are located on different PCB layers, and the first half-cycle copper-clad wire and the second half-cycle copper-clad wire are connected by a through hole, and the first half-cycle copper-clad wire of the coil layer is located at an edge portion of the PCB layer, the second half-cycle copper-clad wire is located in a middle portion of the PCB layer, or the first half-cycle copper-clad wire is located in the middle portion of the PCB layer, and the second half-cycle copper-clad wire is located at an edge portion of the PCB layer.
As an embodiment of the present invention, based on the above, except that the multi-layered PCB board includes one winding, and first and second terminals of the winding, as shown in fig. 2; the coil layers in parallel are connected at a first terminal and at a second terminal.
Further, the first half-cycle copper-clad wire or the second half-cycle copper-clad wire of the coil layer is formed by connecting a plurality of copper-clad wires in parallel, and the copper-clad wires connected in parallel are connected at the first terminal and the second terminal; the copper-clad wire of the front half-cycle copper-clad wire positioned in the middle of the inner side of the PCB layer is connected to the copper-clad wire of the rear half-cycle copper-clad wire positioned at the edges of the two sides of the inner side of the PCB layer through the through hole; the copper-clad wires of the first half circle copper-clad wires positioned at the two side edges of the layer are connected to the copper-clad wires of the second half circle copper-clad wires positioned at the middle of the layer through the through holes.
In this embodiment, preferably, the PCB is a four-layer board; the winding has two terminals and four layers of copper-clad coils are connected in parallel. The left half circle of the first layer is connected to the right half circle of the second layer through a through hole 1; the left half circle of the second layer is connected to the right half circle of the first layer through a through hole 2; the left half circle of the third layer is connected to the right half circle of the fourth layer through a through hole 1; the fourth layer left half turn is connected to the third layer right half turn by a via 2. The first to four layers of left half turns are connected in parallel to terminal 1 (0 °); the first to four right half turns are connected in parallel to terminal 2 (360 °). Such lamination causes the current from the outer layer to travel to the inner layer and the current from the inner layer to travel to the outer layer. Fig. 5 is an example of a method of designing copper-clad wiring lines per layer. Each coil is composed of 3 wires in parallel, and the parallel wires are connected at terminals. The coils are plated through vias on opposite sides (180) of the terminals and the peripheral traces and the intermediate traces are plated. The solid and dashed lines in the figure indicate that the left and right turns of the coil are in different PCB layers. The intra-layer wiring mode enables current at the edge to go to the middle part, intra-layer current exchange enables current density to tend to be balanced in the copper-clad coils at all parts of the PCB, and skin effect is greatly weakened.
As another embodiment of the present invention, based on the above, except that the multi-layer PCB board includes two windings of the first winding and the second winding, and third, fourth and fifth terminals as shown in fig. 3 or 4;
one end of the first winding is connected to the third terminal, and the other end is connected to the fourth terminal; the second winding has one end connected to the fourth terminal and the other end connected to the fifth terminal.
Further, the winding direction of the first winding from the third terminal to the fourth terminal is the same as the winding direction of the second winding from the fourth terminal to the fifth terminal.
Further, the first winding and the second winding each comprise a plurality of parallel coil layers, the first winding coil layers being connected at a third terminal and connected at a fourth terminal; the second winding coil layers are connected at a fourth terminal and connected at a fifth terminal.
Further, the front half-cycle copper-clad wire or the rear half-cycle copper-clad wire is formed by connecting a plurality of copper-clad wires in parallel, and the copper-clad wires connected in parallel are connected at a third terminal and a fourth terminal; the copper-clad wire with the copper-clad wire at the front half cycle positioned in the middle of the layer is connected to the copper-clad wire with the copper-clad wire at the rear half cycle positioned at the two side edges of the layer through the through hole; the copper-clad wires with the front half-cycle copper-clad wires positioned at the two side edges of the layer are connected to the copper-clad wires with the rear half-cycle copper-clad wires positioned at the middle of the layer through holes
Further, in each layer of the PCB, the first half-cycle copper-clad wire belongs to a first winding, and the second half-cycle copper-clad wire belongs to a second winding; or the first half-cycle copper-clad wire belongs to the second winding, and the second half-cycle copper-clad wire belongs to the first winding.
In this embodiment, the PCB is preferably six layers, including winding 1 and winding 2, corresponding to the S1 and S2 windings of fig. 1. As shown in fig. 5, the connection mode is also shown in fig. 5, the terminal 1 corresponds to the upper terminal of S1, the terminal 2 corresponds to the terminal to which S1 and S2 are connected, and the terminal 3 corresponds to the lower terminal of S2. Each layer of copper-clad wire is shown in fig. 3, and the edge copper-clad wire current is transferred to the middle copper-clad wire after the layer is changed by the through hole. The first layer and the fifth layer left half turns of winding 1 are exchanged to the third layer right half turns at 180 ° positions; the fourth layer left half turn is swapped to the second and sixth layer right half turns at 180 deg. positions. As shown in fig. 6-11, the second and sixth layers of winding 2 are exchanged for the fourth layer of right half turns in the 540 ° position. The method comprises the steps of carrying out a first treatment on the surface of the The third layer left half turn is swapped to the first layer and fifth layer right half turn at a 540 deg. position. Thus, the current of the outer layer goes to the inner layer at the opposite end of the terminal, and the inner copper coating is fully utilized. Furthermore, this arrangement allows complete symmetry of windings 1 and 2, and current inconsistencies due to inconsistent coupling of the magnetic fields can be minimized.
While the invention has been provided with several practical examples, it should be understood that the disclosed method may be embodied in many other specific forms without departing from the spirit or scope of the invention. The present examples are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details given herein. For example, the number of layers implementing the PCB windings is not limited to four, six or eight layers, nor is the number of copper-clad traces in parallel within a layer limited to three.
Claims (3)
1. A high-frequency low-loss PCB winding device for transformers and inductors is characterized by comprising a multi-layer PCB board and through holes arranged on the PCB board,
the multilayer PCB comprises a winding, and a first terminal and a second terminal of the winding;
the winding comprises a plurality of parallel coil layers;
the coil layer comprises a front half-cycle copper-clad wire and a rear half-cycle copper-clad wire, the front half-cycle copper-clad wire and the rear half-cycle copper-clad wire are positioned on different PCB layers, the front half-cycle copper-clad wire and the rear half-cycle copper-clad wire are connected through a through hole, the front half-cycle copper-clad wire of the coil layer is positioned at the edge part of the PCB layer, the rear half-cycle copper-clad wire is positioned at the middle part of the PCB layer, or the front half-cycle copper-clad wire is positioned at the middle part of the PCB layer, and the rear half-cycle copper-clad wire is positioned at the edge part of the PCB layer;
the multilayer PCB comprises a winding, and a first terminal and a second terminal of the winding; the coil layers connected in parallel are connected at a first terminal and connected at a second terminal;
the first half-cycle copper-clad wire or the second half-cycle copper-clad wire of the coil layer is formed by connecting a plurality of copper-clad wires in parallel, and the copper-clad wires connected in parallel are connected at the first terminal and the second terminal; the copper-clad wire of the front half-cycle copper-clad wire positioned in the middle of the inner side of the PCB layer is connected to the copper-clad wire of the rear half-cycle copper-clad wire positioned at the edges of the two sides of the inner side of the PCB layer through the through hole; the copper-clad wires of the first half circle copper-clad wires positioned at the two side edges of the layer are connected to the copper-clad wires of the second half circle copper-clad wires positioned at the middle of the layer through the through holes.
2. The high-frequency low-loss PCB winding device for the transformer and the inductor is characterized by comprising a multilayer PCB and a through hole formed in the PCB, wherein the multilayer PCB comprises a first winding, a second winding, a third terminal, a fourth terminal and a fifth terminal;
the winding comprises a plurality of parallel coil layers;
the coil layer comprises a front half-cycle copper-clad wire and a rear half-cycle copper-clad wire, the front half-cycle copper-clad wire and the rear half-cycle copper-clad wire are positioned on different PCB layers, the front half-cycle copper-clad wire and the rear half-cycle copper-clad wire are connected through a through hole, the front half-cycle copper-clad wire of the coil layer is positioned at the edge part of the PCB layer, the rear half-cycle copper-clad wire is positioned at the middle part of the PCB layer, or the front half-cycle copper-clad wire is positioned at the middle part of the PCB layer, and the rear half-cycle copper-clad wire is positioned at the edge part of the PCB layer;
one end of the first winding is connected to the third terminal, and the other end is connected to the fourth terminal; one end of the second winding is connected to the fourth terminal, and the other end is connected to the fifth terminal;
the winding direction of the first winding from the third terminal to the fourth terminal is the same as the winding direction of the second winding from the fourth terminal to the fifth terminal;
the first half-cycle copper-clad wire or the second half-cycle copper-clad wire is formed by connecting a plurality of copper-clad wires in parallel, and the copper-clad wires connected in parallel with the first winding are connected at a third terminal and a fourth terminal; the copper-clad wire with the copper-clad wire at the front half cycle positioned in the middle of the layer is connected to the copper-clad wire with the copper-clad wire at the rear half cycle positioned at the two side edges of the layer through the through hole; the copper-clad wires of the front half-cycle copper-clad wires positioned at the two side edges of the layer are connected to the copper-clad wires of the rear half-cycle copper-clad wires positioned at the middle of the layer through holes; the copper-clad wiring of the second winding in parallel connection is connected at the fourth terminal and the fifth terminal; the copper-clad wire with the copper-clad wire at the front half cycle positioned in the middle of the layer is connected to the copper-clad wire with the copper-clad wire at the rear half cycle positioned at the two side edges of the layer through the through hole; the copper-clad wires of the first half circle copper-clad wires positioned at the two side edges of the layer are connected to the copper-clad wires of the second half circle copper-clad wires positioned at the middle of the layer through holes.
3. A high frequency low loss PCB winding arrangement for transformers and inductors according to claim 2, characterized in that in each layer of the PCB board the first half-cycle copper clad tracks belong to a first winding and the second half-cycle copper clad tracks belong to a second winding; or the first half-cycle copper-clad wire belongs to the second winding, and the second half-cycle copper-clad wire belongs to the first winding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810327933.XA CN110379606B (en) | 2018-04-12 | 2018-04-12 | High-frequency low-loss PCB winding device for transformer and inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810327933.XA CN110379606B (en) | 2018-04-12 | 2018-04-12 | High-frequency low-loss PCB winding device for transformer and inductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110379606A CN110379606A (en) | 2019-10-25 |
| CN110379606B true CN110379606B (en) | 2024-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810327933.XA Active CN110379606B (en) | 2018-04-12 | 2018-04-12 | High-frequency low-loss PCB winding device for transformer and inductor |
Country Status (1)
| Country | Link |
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| CN (1) | CN110379606B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4689594A (en) * | 1985-09-11 | 1987-08-25 | Murata Manufacturing Co., Ltd. | Multi-layer chip coil |
| JPH06151179A (en) * | 1992-11-02 | 1994-05-31 | Murata Mfg Co Ltd | Coil |
| JPH09102425A (en) * | 1995-10-04 | 1997-04-15 | Yokogawa Electric Corp | Laminated molded coil transformer |
| CN102103923A (en) * | 2009-12-18 | 2011-06-22 | 鸿富锦精密工业（深圳）有限公司 | Planar transformer |
| CN103943332A (en) * | 2014-03-07 | 2014-07-23 | 杭州电子科技大学 | Winding design method for multi-winding output planar transformer |
| KR20150018206A (en) * | 2013-08-09 | 2015-02-23 | 삼성전기주식회사 | Laminated Inductor |
| TW201526044A (en) * | 2013-12-31 | 2015-07-01 | Wen-Hsiang Wuli | Modular coil layer, coil assembly including such coil layer and planar transformer using the same |
| CN105453200A (en) * | 2013-07-29 | 2016-03-30 | 株式会社村田制作所 | Multilayer chip coil |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6429763B1 (en) * | 2000-02-01 | 2002-08-06 | Compaq Information Technologies Group, L.P. | Apparatus and method for PCB winding planar magnetic devices |
-
2018
- 2018-04-12 CN CN201810327933.XA patent/CN110379606B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4689594A (en) * | 1985-09-11 | 1987-08-25 | Murata Manufacturing Co., Ltd. | Multi-layer chip coil |
| JPH06151179A (en) * | 1992-11-02 | 1994-05-31 | Murata Mfg Co Ltd | Coil |
| JPH09102425A (en) * | 1995-10-04 | 1997-04-15 | Yokogawa Electric Corp | Laminated molded coil transformer |
| CN102103923A (en) * | 2009-12-18 | 2011-06-22 | 鸿富锦精密工业（深圳）有限公司 | Planar transformer |
| CN105453200A (en) * | 2013-07-29 | 2016-03-30 | 株式会社村田制作所 | Multilayer chip coil |
| KR20150018206A (en) * | 2013-08-09 | 2015-02-23 | 삼성전기주식회사 | Laminated Inductor |
| TW201526044A (en) * | 2013-12-31 | 2015-07-01 | Wen-Hsiang Wuli | Modular coil layer, coil assembly including such coil layer and planar transformer using the same |
| CN103943332A (en) * | 2014-03-07 | 2014-07-23 | 杭州电子科技大学 | Winding design method for multi-winding output planar transformer |
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| Publication number | Publication date |
|---|---|
| CN110379606A (en) | 2019-10-25 |
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