CN110379327B - Display module assembly of matrix SMD-LED structure - Google Patents
Display module assembly of matrix SMD-LED structure Download PDFInfo
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- CN110379327B CN110379327B CN201910744851.XA CN201910744851A CN110379327B CN 110379327 B CN110379327 B CN 110379327B CN 201910744851 A CN201910744851 A CN 201910744851A CN 110379327 B CN110379327 B CN 110379327B
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- 239000011159 matrix material Substances 0.000 title claims abstract description 14
- 239000011324 bead Substances 0.000 claims abstract description 49
- 238000003466 welding Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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Abstract
The invention relates to a display module of a matrix SMD-LED structure, which comprises a plurality of lamp bead modules and a driving module, wherein the lamp bead modules are arranged in an array, the driving module is electrically connected with the lamp bead modules, and the driving module is used for driving the lamp bead modules to display and close; the wiring mode of the pins of the common electrode on the circuit board is vertical wiring. The invention ensures that the brightness of the display of the lamp bead modules at the left side and the right side of the display module is balanced, effectively reduces the problem of high contrast interference among different chips, and improves the user experience.
Description
Technical Field
The invention relates to the technical field of LED display modules, in particular to a display module with a matrix SMD-LED structure.
Background
Currently, the common electrode of the chips of most display modules is in a horizontal wiring mode, and the horizontal wiring means that the connection line of the common electrode is arranged along the direction of the horizontal line, that is, the horizontal wiring is consistent with the left-right direction of a common observation object. The horizontal wiring mode can lead to the color displayed by the display module to deviate to a certain color system and uneven brightness, such as red or blue color. The problem of the color system bias is mainly that the human eye is usually sensitive to the left-right (horizontal) direction when observing objects, and the human eye can easily perceive when the display brightness of one side is brighter than the display brightness of the other side; meanwhile, under the effect of the impedance of the public line, the current of the public electrode close to the power end is larger than that of the public electrode far away from the power end, so that the pixel chip close to the power end emits light to be brighter, and the brightness displayed on the left side and the right side is uneven. Because the human eyes are sensitive to the display brightness on the left side and the right side, and the common electrode of the horizontal wiring leads to uneven brightness of the display on the left side and the right side, the uneven brightness observed by the human eyes and the deviation to a certain color system are comprehensively caused.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a display module with a matrix SMD-LED structure, which can solve the problem of uneven display brightness in the left-right direction of a display module observed by human eyes.
The technical scheme for realizing the purpose of the invention is as follows: the display module comprises a plurality of lamp bead modules and a driving module, wherein the lamp bead modules and the driving module are arranged in an array, the driving module is electrically connected with the lamp bead modules, and the driving module is used for driving the lamp bead modules to display and close;
The lamp bead module at least comprises a pixel point, wherein the pixel point corresponds to a pixel chip, the pixel chip comprises a red chip for displaying red, a green chip for displaying green and a blue chip for displaying blue, and the lamp bead module also comprises a common electrode, and the common electrode is a common cathode or a common anode which is connected together by the red chip, the green chip and the blue chip and corresponds to three cathode pins or three anode pins;
The wiring mode of the pins of the common electrode on the circuit board is vertical wiring, and the vertical wiring means that the wiring trend of the pins of the common electrode is vertical to the horizontal direction of the display module which is normally used by a user, so that the brightness of the display of the lamp bead modules at the left side and the right side of the display module is balanced.
Further, each lamp bead module is printed on one side of the circuit board in an array mode according to a certain distance, and the driving module is printed on the other side of the circuit board.
Further, the bead module is packaged with M×N pixel points in rows and columns.
Further, the R pole pins of N pixel chips in the same row or M pixel chips in the same column of the M x N pixel points are connected together, a corresponding Pad is arranged at the other end of the printed circuit and is electrically connected with the R pole pins connected together,
The G electrode pins of N pixel chips in the same row or M pixel chips in the same column are connected together, a corresponding Pad is arranged at the other end of the printed circuit and is electrically connected with the G electrode pins connected together,
The B pole pins of N pixel chips in the same row or M pixel chips in the same column are connected together, and a corresponding Pad is arranged at the other end of the printed circuit and is electrically connected with the B pole pins connected together.
Further, the m×n pixel points are connected by a common cathode or a common anode.
Further, the mxn is 2×2.
Further, the driving module comprises a driving chip, and the driving chip is a row-column driving integrated chip.
Further, the driving module further comprises a signal amplifying chip for amplifying current and outputting the current to the lamp bead module.
The beneficial effects of the invention are as follows: the invention ensures that the display brightness of the lamp bead modules at the left side and the right side of the display module is balanced, effectively reduces the problem of high-contrast interference among different chips, and improves the user experience feeling. Meanwhile, the bearable thrust of the lamp bead module is improved, and the anti-collision capacity is improved.
Drawings
FIG. 1 is a schematic diagram of a common pole vertical trace;
FIG. 2 is a schematic diagram of a matrix-type common cathode connection;
Fig. 3 is a schematic diagram of a matrix type common anode connection.
Detailed description of the preferred embodiments
The invention will be further described with reference to the accompanying drawings and detailed description:
As shown in fig. 1 to 3, a display module of matrix SMD-LED structure includes a plurality of bead modules arranged in an array and a driving module, each bead module is printed on one surface of a circuit board in an array according to a certain distance, the driving module is printed on the other surface of the circuit board, the driving module is electrically connected with the bead modules, and the driving module is used for driving the bead modules to display and close.
The lamp bead module comprises an R pole pin, a G pole pin, a B pole pin and a public pole pin, wherein the R pole pin, the G pole pin and the B pole pin are pins of a chip for displaying red pixels, a chip for displaying green pixels and a chip for displaying blue pixels respectively, namely, a pixel point formed by the lamp bead module comprises three chips for displaying red, green and blue colors respectively, namely, a red chip, a green chip and a blue chip, namely, an RGB three primary colors form a pixel point. The common electrode is a common cathode or a common anode which is connected together by three chips of a red chip, a green chip and a blue chip corresponding to three cathode pins or three anode pins.
As shown in fig. 1, the wiring manner of the pins of the common electrode on the circuit board is a vertical wiring, and the vertical wiring means that the wiring trend of the pins of the common electrode is perpendicular to the horizontal direction of the display module which is normally used by the user, that is, the wiring trend of the pins of the common electrode is perpendicular to the horizontal ground, which is determined according to the normal use habit of the user. Because the pin of the public pole is a vertical wiring mode, all the pixel chips (red chip, green chip and blue chip) connected with the public pole are positioned at the geometric center position of the outgoing line point of the pin of the public pole, so that the output of the pin of the public pole of the pixel chip can be conveniently connected at the center of the printed circuit board, the line voltage drop of the pixel chips at the left end and the right end of the public pole can be controlled to be consistent, the reverse bias voltage of an LED is reduced, the brightness of the display of the lamp bead modules at the left side and the right side of the display module is balanced, and the problem of high contrast interference among different chips is effectively reduced. Although the vertical wiring of the pins of the common electrode may cause uneven brightness of the lamp bead module in the vertical direction, and may be bright on the upper side and dark on the lower side, or dark on the upper side and bright on the lower side, since the human eyes observe the object, the human eyes usually notice the left-right direction (i.e. the horizontal direction), and the corresponding vertical direction (i.e. the vertical direction) is insensitive, even if the brightness of the display on the upper side and the lower side is uneven, the human eyes usually do not notice the observation. Through the vertical wiring mode of the common electrode, the user experience feeling can be improved.
Preferably, the bead module is packaged with m×n pixel points in rows and columns, so as to form a matrix display module. When m=n=1, the lamp bead module has only one pixel, namely a display module consisting of single pixels; when M and N are greater than 1, one lamp bead module is packaged with M multiplied by N pixel points, namely a display module composed of a plurality of pixel points. Similarly, the vertical wiring mode of the common electrode is suitable for both a display module of a single pixel point and a display module of multiple pixel points. One pixel point corresponds to one pixel chip, and one pixel chip comprises a red chip, a green chip, a blue chip and a common electrode, wherein the common electrode is a common cathode or a common anode which is formed by connecting three corresponding cathode pins or three anode pins of the red chip, the green chip and the blue chip.
The R pole pins of N pixel chips in the same row or M pixel chips in the same column are connected together, a corresponding Pad is arranged at the other end of the printed circuit and is electrically connected with the R pole pins connected together, the G pole pins of N pixel chips in the same row or M pixel chips in the same column are connected together, a corresponding Pad is arranged at the other end of the printed circuit and is electrically connected with the G pole pins connected together, the B pole pins of N pixel chips in the same row or M pixel chips in the same column are connected together, a corresponding Pad is arranged at the other end of the printed circuit and is electrically connected with the B pole pins connected together, the R pole pins connected together can be connected together through copper wires of the printed circuit board, the G pole pins connected together are connected together through copper wires of the printed circuit board, and the B pole pins connected together are connected together through copper wires of the printed circuit board. The common poles of the M pixel chips of the same column are connected together by copper wires of the printed circuit board. Thus, a matrix array display module composed of a plurality of lamp bead modules, each of which includes an M×N pixel chip, can be formed on a printed circuit board. In such a connection mode, the display module of the matrix type M×N pixel points only needs 3a+2 welding spots, wherein a takes a larger value of M and N, namely, if M is less than or equal to N, only 3N+2 welding spots are needed, otherwise, only 3M+2 welding spots are needed. For the conventional display module, for the display module including m×n pixels, 4×m×n pads are required. The welding spots are far smaller than the welding spots required by the existing display module under the condition of the same pixel points.
As shown in fig. 2 and 3, an example in which 2×2 pixel points are packaged by one bead module is illustrated. The numbers 1-4 in the figure represent the first pixel chip to the fourth pixel chip, R, G, B represent the red chip, the green chip and the blue chip respectively, R+, G+ and B+ represent the anodes of the diodes of the pixel chips, and correspondingly, R-, G-, B-represent the anodes of the diodes of the pixel chips. Fig. 2 shows a matrix-type common cathode connection, and fig. 3 shows a matrix-type common anode connection. In fig. 2, the pins of r+, g+, b+ of the first pixel chip and the third pixel chip are respectively connected together, the pins of r+, g+, b+ of the second pixel chip and the fourth pixel chip are respectively connected together, and the common poles of the four pixel chips are connected together and form a first common pole and a second common pole, which are collectively referred to as a common pole. Therefore, only 8 (i.e. 3×2+2) pins are needed for the four pixel chips, and the four pixel chips are packaged on the printed circuit board to form a lamp bead module, and only 8 pins are needed to be welded on the printed circuit board, so that 8 welding spots are correspondingly formed. Compared with the conventional display module, each bead module is provided with only one pixel chip, each pixel chip has 4 pins, and the four pixel chips need 16 (i.e. 4×2×2) pins to be welded on the printed circuit board, so that 16 welding spots need to be formed. The application reduces welding spots, saves the occupied space of the printed circuit, and enables the printed circuit board with the same area to package more lamp bead modules; meanwhile, compared with a lamp bead module formed by a single pixel chip, the lamp bead module is increased from 4 welding spots to 8 welding spots, so that the capability of adsorbing the lamp bead module on a printed circuit board is enhanced, and the anti-collision capability of the lamp bead module is enhanced. Actual measurement shows that compared with the existing display module adopting the discrete LED, the lamp bead module can bear more than 50N of thrust, which is more than 2 times of the original thrust.
Preferably, the driving module comprises a driving chip, the model of the driving chip is MY9748QFN, and the driving chip is a row-column driving integrated chip.
Preferably, the driving module further comprises a signal amplifying chip, the model of the signal amplifying chip is 74HC245, and the signal amplifying chip is used for amplifying current and outputting the current to the lamp bead module, so that the current required by normal display of the lamp bead module is maintained.
The embodiment disclosed in the present specification is merely an illustration of one-sided features of the present invention, and the protection scope of the present invention is not limited to this embodiment, and any other functionally equivalent embodiment falls within the protection scope of the present invention. Various other corresponding changes and modifications will occur to those skilled in the art from the foregoing description and the accompanying drawings, and all such changes and modifications are intended to be included within the scope of the present invention as defined in the appended claims.
Claims (8)
1. The display module of the matrix SMD-LED structure comprises a plurality of lamp bead modules arranged in an array and a driving module, wherein the driving module is electrically connected with the lamp bead modules and is used for driving the lamp bead modules to display and close,
The lamp bead module at least comprises a pixel point, wherein the pixel point corresponds to a pixel chip, the pixel chip comprises a red chip for displaying red, a green chip for displaying green and a blue chip for displaying blue, and the lamp bead module also comprises a common electrode, and the common electrode is a common cathode or a common anode which is connected together by the red chip, the green chip and the blue chip and corresponds to three cathode pins or three anode pins;
The wiring mode of the pins of the common electrode on the circuit board is vertical wiring, wherein the vertical wiring means that the wiring trend of the pins of the common electrode is vertical to the horizontal direction of the display module which is normally used by a user, so that the brightness of the display of the lamp bead modules at the left side and the right side of the display module is balanced,
The pixel chips connected with the common electrode are located at the geometric center position of the outlet point of the pin of the common electrode, so that the output of the pin of the common electrode of the pixel chip can be connected at the center of the printed circuit board, and the line voltage drop of the pixel chips at the left end and the right end of the common electrode is controlled to be consistent.
2. The display module of claim 1, wherein the bead modules are printed in an array at a distance on one side of a circuit board, and the driving module is printed on the other side of the circuit board.
3. The display module of claim 1, wherein the bead module is packaged with M x N pixels in rows and columns.
4. The matrix SMD-LED structured display module of claim 3, wherein the R-electrode pins of the N pixel chips in the same row or the M pixel chips in the same column of the mxn pixel points are connected together, and a corresponding Pad is disposed at the other end of the printed circuit and electrically connected to the R-electrode pins connected together,
The G electrode pins of N pixel chips in the same row or M pixel chips in the same column are connected together, a corresponding Pad is arranged at the other end of the printed circuit and is electrically connected with the G electrode pins connected together,
The B pole pins of N pixel chips in the same row or M pixel chips in the same column are connected together, and a corresponding Pad is arranged at the other end of the printed circuit and is electrically connected with the B pole pins connected together.
5. The display module of claim 4, wherein the M x N pixels are connected by a common cathode or a common anode.
6. A matrix SMD-LED structured display module as claimed in claim 3, characterized in that M x N is 2 x 2.
7. The matrix SMD-LED structured display module of claim 1, wherein said driving module comprises a driving chip, said driving chip being a row-column driving integrated chip.
8. The display module of claim 1, wherein the driving module further comprises a signal amplifying chip for amplifying the current and outputting the amplified current to the lamp bead module.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910744851.XA CN110379327B (en) | 2019-08-13 | 2019-08-13 | Display module assembly of matrix SMD-LED structure |
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| CN201910744851.XA CN110379327B (en) | 2019-08-13 | 2019-08-13 | Display module assembly of matrix SMD-LED structure |
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| CN110379327B true CN110379327B (en) | 2024-07-16 |
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| CN114764997B (en) * | 2020-12-31 | 2025-04-29 | 深圳市奥拓电子股份有限公司 | LED display structure, display module and LED display screen |
| CN114360450A (en) * | 2022-01-14 | 2022-04-15 | 南京浣轩半导体有限公司 | Line and row high-integration LED display driving chip and application |
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| CN109065528A (en) * | 2018-08-14 | 2018-12-21 | 厦门凌阳华芯科技有限公司 | A kind of encapsulation of LED chip and light-emitting diode display |
| CN210167058U (en) * | 2019-08-13 | 2020-03-20 | 深圳视爵光旭电子有限公司 | Display module assembly of matrix SMD-LED structure |
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| JP2001092413A (en) * | 1999-09-24 | 2001-04-06 | Semiconductor Energy Lab Co Ltd | EL display device and electronic device |
| JP3870807B2 (en) * | 2001-12-20 | 2007-01-24 | ソニー株式会社 | Image display device and manufacturing method thereof |
| TWI640109B (en) * | 2016-08-11 | 2018-11-01 | 億光電子工業股份有限公司 | Display device |
| CN108110121A (en) * | 2017-12-20 | 2018-06-01 | 西安智盛锐芯半导体科技有限公司 | LED lamp panel and LED lamp |
| CN108389880B (en) * | 2018-02-23 | 2020-11-10 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and OLED display |
| CN108828862A (en) * | 2018-08-22 | 2018-11-16 | 惠科股份有限公司 | Array substrate and manufacturing method thereof |
| CN109445646B (en) * | 2018-12-29 | 2022-07-05 | 上海中航光电子有限公司 | A touch display panel and a touch display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065528A (en) * | 2018-08-14 | 2018-12-21 | 厦门凌阳华芯科技有限公司 | A kind of encapsulation of LED chip and light-emitting diode display |
| CN210167058U (en) * | 2019-08-13 | 2020-03-20 | 深圳视爵光旭电子有限公司 | Display module assembly of matrix SMD-LED structure |
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Effective date of registration: 20191016 Address after: 518108, Shenzhen, Guangdong province Baoan District Shiyan street, Tong Tau community, Tong Tau, Nangang third industrial park, 18A building, building 1-3 Applicant after: SHENZHEN INFILED ELECTRONICS Co.,Ltd. Applicant after: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Address before: 1-3 / F, workshop 18a, Tangtou Nangang third industrial park, Tangtou community, Shiyan street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN INFILED ELECTRONICS Co.,Ltd. |
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