CN110376240A - A kind of longitudinal heat flux method micro wire test device of thermal conductivity coefficient - Google Patents
A kind of longitudinal heat flux method micro wire test device of thermal conductivity coefficient Download PDFInfo
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Abstract
本发明公开了一种纵向热流法微米线导热系数测试装置，该装置由测试器件、基座、以及可选的用于连接两者的压块构成。测试器件采用低热导率绝缘板材切制，器件中心是一个热源和一个热沉，在热源和热沉表面制备有加热和检测用金属线圈，其中加热线圈用于产生焦耳热以加热热源，检测线圈用于检测热源、热沉温度。热源和热沉分别通过六根细长梁同器件的边缘相连。样品悬放在测试器件的热源和热沉中间，器件由基座两端支撑，支撑处为细长梁连接的器件两边缘，使用压块将测试器件和基座连接在一起。从测试器件边缘的焊盘上接出引线，连接至外部测试系统。此发明装置结构简单，操作方便，能够准确地测试绝缘微米线的纵向导热系数。The invention discloses a test device for thermal conductivity of micron wires by longitudinal heat flow method. The device is composed of a test device, a base and an optional pressing block for connecting the two. The test device is cut from a low thermal conductivity insulating plate. The center of the device is a heat source and a heat sink. Metal coils for heating and detection are prepared on the surface of the heat source and heat sink. The heating coil is used to generate Joule heat to heat the heat source, and the detection coil Used to detect heat source and heat sink temperature. The heat source and heat sink are respectively connected to the edge of the device through six slender beams. The sample is suspended in the middle of the heat source and heat sink of the test device. The device is supported by both ends of the base, and the two edges of the device are connected by slender beams at the support. The test device and the base are connected together using a pressure block. Take the leads from the pads on the edge of the test device and connect to the external test system. The inventive device has simple structure and convenient operation, and can accurately test the longitudinal thermal conductivity of the insulated micron wire.
Description
技术领域technical field
本发明涉及一种测试装置，具体涉及一种纵向热流法微米线导热系数测试装置，属于固体材料热物性参数测试技术领域。The invention relates to a test device, in particular to a test device for thermal conductivity of micron wires by longitudinal heat flow method, and belongs to the technical field of thermal physical property parameter testing of solid materials.
背景技术Background technique
本发明所述的微米线泛指直径在微米量级的纤维，或者厚度在微米量级的条状薄膜。微米线纵向导热系数可以采用直接通电法或3ω法来测量。这两种方法都需要在被测样品上施加直流或交流的加热电流，因此要求被测材料为导体或半导体。如果样品是绝缘体，需要在样品表面沉积一层金属膜，然后再进行测试。但是由于所沉积的金属膜在样品长度方向上厚度和质量的一致性无法保证，导致测试结果具有很大的不确定性。The micron wires in the present invention generally refer to fibers with diameters on the order of microns, or strip-shaped films with thicknesses on the order of microns. The longitudinal thermal conductivity of micron wires can be measured by the direct energization method or the 3ω method. Both of these methods need to apply a DC or AC heating current to the sample to be tested, so the material to be tested is required to be a conductor or a semiconductor. If the sample is an insulator, a metal film needs to be deposited on the surface of the sample before testing. However, the thickness and quality consistency of the deposited metal film in the sample length direction cannot be guaranteed, resulting in great uncertainty in the test results.
纵向热流法可以用于测试微米线纵向导热系数。在该方法中，微米线放置于热源、热沉上，测试时热量从热源经过被测样品传导至热沉，并最终由热沉传导至基底上。同直流通电法或3ω法相比，该方法的优点是对被测样品的导电性能没有要求。然而，要使用该方法实现微米线纵向导热系数的高精度测量，同样存在一些困难。例如，为了提高热沉温度测量的相对精度，要求通过被测微米线传导的热量可以在热沉上产生足够高的温升。这就要求热沉和基底之间的热阻不能太小，要和被测微米线的热阻相当。这给纵向热流法微米线导热系数测试装置的设计带来了很大的挑战。本领域的技术人员一直尝试解决上述问题，但是现有技术中的方案均不理想。The longitudinal heat flow method can be used to test the longitudinal thermal conductivity of micron wires. In this method, the micron wire is placed on a heat source and a heat sink. During the test, heat is conducted from the heat source to the heat sink through the sample under test, and finally to the substrate from the heat sink. Compared with the DC energization method or the 3ω method, the advantage of this method is that there is no requirement for the conductivity of the sample to be tested. However, there are also some difficulties in using this method to achieve high-precision measurement of the longitudinal thermal conductivity of micron wires. For example, in order to improve the relative accuracy of heat sink temperature measurement, it is required that the heat conducted through the measured micron wire can generate a sufficiently high temperature rise on the heat sink. This requires that the thermal resistance between the heat sink and the substrate should not be too small, and should be equivalent to the thermal resistance of the measured micron wire. This has brought great challenges to the design of the thermal conductivity test device for micron wires by the longitudinal heat flow method. Those skilled in the art have been trying to solve the above problems, but none of the solutions in the prior art is ideal.
发明内容Contents of the invention
本发明正是针对现有技术中存在的问题，提供一种纵向热流法微米线导热系数测试装置，该技术方案通过合理设计热源、热沉与基底之间的热阻，该装置可以实现微米线纵向导热系数的高精度测量。当被测样品为导体或半导体时，该装置还可以实现样品的电导率和塞贝克系数的测量。The present invention is aimed at the problems existing in the prior art, and provides a longitudinal heat flow micron wire thermal conductivity testing device. The technical solution can realize the micron wire thermal conductivity by rationally designing the thermal resistance between the heat source, the heat sink and the substrate. High-precision measurement of longitudinal thermal conductivity. When the sample to be tested is a conductor or a semiconductor, the device can also measure the conductivity and Seebeck coefficient of the sample.
为了实现上述目的，本发明的技术方案如下，一种纵向热流法微米线导热系数测试装置，由测试器件、基座、以及可选的用于连接两者的压块构成；In order to achieve the above object, the technical solution of the present invention is as follows, a longitudinal heat flow method micron wire thermal conductivity test device is composed of a test device, a base, and an optional pressing block for connecting the two;
所述测试器件采用低导热系数绝缘板材切制，器件中心是一个热源和一个热沉，热源和热沉分别通过六根细长梁同器件的边缘相连。在热源的一个表面上制备均布的金属加热线圈，对加热线圈施加电流，线圈会产生焦耳热，从而实现热源的升温。The test device is cut from insulating boards with low thermal conductivity. The center of the device is a heat source and a heat sink. The heat source and the heat sink are respectively connected to the edge of the device through six slender beams. A uniformly distributed metal heating coil is prepared on one surface of the heat source, and a current is applied to the heating coil, and the coil will generate Joule heat, thereby realizing the temperature rise of the heat source.
采用电阻测温法实现热源与热沉温度的测量。为此需要在热沉一个表面上制备均布的金属检测线圈，通过检测线圈电阻的变化来得到热沉的温度。对于热源而言，可以同时将加热线圈用作检测线圈，也可以在热源的另一个表面再制备一个专门的检测线圈。第一种方案可以简化器件的制备过程，但加热电路和检测电路耦合在一起，增加了检测难度。第二种方案通过增加一道制备工序，将加热电路和检测电路独立开来，降低了检测难度。The temperature measurement of the heat source and heat sink is realized by the resistance temperature measurement method. For this reason, uniformly distributed metal detection coils need to be prepared on one surface of the heat sink, and the temperature of the heat sink can be obtained by detecting changes in coil resistance. For the heat source, the heating coil can be used as the detection coil at the same time, or a special detection coil can be prepared on another surface of the heat source. The first scheme can simplify the fabrication process of the device, but the heating circuit and the detection circuit are coupled together, which increases the difficulty of detection. The second scheme separates the heating circuit and the detection circuit by adding a preparation process, which reduces the difficulty of detection.
当被测样品为导体或半导体时，为了避免加热/检测线圈同被测样品电短路，将加热线圈和检测线圈使用绝缘胶封装。When the sample to be tested is a conductor or semiconductor, in order to avoid electrical short circuit between the heating/detection coil and the sample to be tested, the heating coil and detection coil are packaged with insulating glue.
在热源、热沉的正面上，二者相邻的边缘位置处，各自制备两条裸露的电极。这四条电极用于导体、半导体微米线的导电性能和塞贝克系数的测量。On the front of the heat source and the heat sink, two bare electrodes are respectively prepared at the adjacent edge positions of the two. These four electrodes are used for the measurement of the conductivity and Seebeck coefficient of conductors and semiconductor micro-wires.
被测样品搭接在热源、热沉上。当只需要测试样品的导热系数时，在被测样品和热源、热沉接触处涂抹银胶或类似产品，降低被测样品同热源、热沉之间的接触热阻。当不仅需要测试样品的导热系数，还需要同时测试样品的导电性能和塞贝克系数时，要保证被测样品同热源、热沉上的裸露电极充分接触，并在接触处涂抹导电胶，保证样品和电极之间具有良好的电接触。The sample to be tested is lapped on the heat source and heat sink. When it is only necessary to test the thermal conductivity of the sample, apply silver glue or similar products on the contact between the tested sample and the heat source and heat sink to reduce the contact thermal resistance between the tested sample and the heat source and heat sink. When it is necessary not only to test the thermal conductivity of the sample, but also to test the electrical conductivity and Seebeck coefficient of the sample at the same time, it is necessary to ensure that the sample to be tested is in full contact with the exposed electrodes on the heat source and heat sink, and apply conductive glue on the contact to ensure that the sample There is good electrical contact between the electrodes.
器件的边缘部位制备有焊盘。热源、热沉上面的加热线圈、检测线圈、以及电极都经过器件的细长梁连接到焊盘上，通过在焊盘上焊接导线与外部电路连接。Pads are prepared on the edge of the device. The heat source, the heating coil on the heat sink, the detection coil, and the electrodes are all connected to the pads through the slender beams of the device, and connected to the external circuit by soldering wires on the pads.
器件由基座两端支撑，支撑处为细长梁连接的器件两边缘。这样器件的热源、热沉即变为悬置，热源、热沉上的热量需要通过细长梁传导至器件边缘，进而传导至基座中。由于器件由低热导率绝缘板材切制出来，同时细长梁具有小的横截面积，通过调整细长梁的长度，可以保证热沉和基座之间的热阻与被测微米线的热阻可比，从而保证通过被测微米线传导的热量可以在热沉上产生足够高的温升。The device is supported by two ends of the base, and the support is the two edges of the device connected by slender beams. In this way, the heat source and heat sink of the device become suspended, and the heat on the heat source and heat sink needs to be conducted to the edge of the device through the slender beam, and then to the base. Since the device is cut from an insulating sheet with low thermal conductivity, and the slender beam has a small cross-sectional area, by adjusting the length of the slender beam, the thermal resistance between the heat sink and the base can be guaranteed to be consistent with the thermal resistance of the measured micron wire. The resistance is comparable, so as to ensure that the heat conducted by the measured micron wire can generate a high enough temperature rise on the heat sink.
为了将器件细长梁上传输来的热量及时传导出去，保证器件边缘温度为环境温度，基底材料需要具有高的热导率。同时还要保证器件的边缘同基座紧密贴合，降低二者之间的接触热阻。为此，可以用一个压块来实现器件和基座之间的紧密贴合。为了达到贴合的效果同时保证器件不会被压坏，压块可由刚性材料和柔性材料叠加而成。In order to conduct the heat transmitted from the slender beam of the device in time to ensure that the edge temperature of the device is at ambient temperature, the substrate material needs to have high thermal conductivity. At the same time, it is necessary to ensure that the edge of the device is closely attached to the base to reduce the contact thermal resistance between the two. For this purpose, a pressure block can be used to achieve a tight fit between the device and the base. In order to achieve the bonding effect and ensure that the device will not be crushed, the pressing block can be made of rigid materials and flexible materials.
测试时，器件放置于真空恒温腔中，以消除对流换热对测试结果的影响，同时给基座提供一个设定的环境温度。During the test, the device is placed in a vacuum constant temperature chamber to eliminate the influence of convective heat transfer on the test results, and at the same time provide a set ambient temperature for the base.
根据傅里叶定律建立热传导模型，可以得到被测微米线的热导率Gs为：According to Fourier's law to establish a heat conduction model, the thermal conductivity G s of the measured micron wire can be obtained as:
其中，Qh、Ql分别是加热线圈和一个细长梁上产生的焦耳热，通过测量加热电流、线圈和细长梁上的电压降计算得到。ΔTh、ΔTs分别为热源和热沉上的温升，且可以分别表示为：Among them, Q h and Q l are the Joule heat generated on the heating coil and a slender beam respectively, which are calculated by measuring the heating current, the voltage drop on the coil and the slender beam. ΔT h and ΔT s are the temperature rise on the heat source and heat sink respectively, and can be expressed as:
式中，R(I)和R(0)分别为加热电流为I和0时的检测线圈的电阻，α为电阻温度系数，下标h和s分别表示热源和热沉。在测试中，使用交流四脚欧姆法测试检测线圈的电阻，得到R(I)和R(0)，基于不同温度下R(0)可以得到α，并由上面公式计算得到ΔTh、ΔTs。In the formula, R(I) and R(0) are the resistance of the detection coil when the heating current is I and 0, respectively, α is the temperature coefficient of resistance, and the subscripts h and s represent the heat source and heat sink, respectively. In the test, use the AC four-leg ohm method to test the resistance of the detection coil to obtain R(I) and R(0). Based on R(0) at different temperatures, α can be obtained, and ΔT h and ΔT s can be calculated from the above formula .
在得到样品纵向热导率Gs后，可以计算出样品的导热系数κ：After obtaining the longitudinal thermal conductivity G s of the sample, the thermal conductivity κ of the sample can be calculated:
其中，A为测试微米线样品的横截面积，L为悬空段样品长度。Among them, A is the cross-sectional area of the test micron wire sample, and L is the sample length of the suspended section.
相对于现有技术，本发明具有如下优点，(1)该技术方案通过合理设计热源、热沉与基底之间的热阻，该装置可以实现微米线纵向导热系数的高精度测量；(2)此装置不仅可以测试微米线的纵向导热系数，当被测样品导电时，还可以同时测量样品的导电性能和塞贝克系数。Compared with the prior art, the present invention has the following advantages: (1) the technical solution can realize high-precision measurement of the longitudinal thermal conductivity of micron wires by rationally designing the thermal resistance between the heat source, the heat sink and the substrate; (2) This device can not only test the longitudinal thermal conductivity of micron wires, but also measure the electrical conductivity and Seebeck coefficient of the sample simultaneously when the tested sample conducts electricity.
附图说明Description of drawings
图1是本发明整体结构装配示意图；Fig. 1 is the assembly schematic diagram of overall structure of the present invention;
图2是器件正面结构示意图；Figure 2 is a schematic diagram of the front structure of the device;
图3是器件背面结构示意图。Fig. 3 is a schematic diagram of the back structure of the device.
具体实施方式：Detailed ways:
实施例1：参见图1、图2，一种纵向热流法微米线导热系数测试装置，由测试器件100、基座200、以及可选的用于连接两者的压块300构成；所述测试器件采用低导热系数绝缘板材切制，器件中心是一个热源101和一个热沉107，热源和热沉分别通过六根细长梁同器件的边缘相连。在热源的一个表面上制备均布的金属加热线圈108，对加热线圈施加电流，线圈会产生焦耳热，从而实现热源的升温。Embodiment 1: Referring to Fig. 1, Fig. 2, a kind of longitudinal heat flow method micron wire thermal conductivity testing device is made of test device 100, base 200, and optional pressing block 300 for connecting the two; the test The device is cut from insulating boards with low thermal conductivity. The center of the device is a heat source 101 and a heat sink 107. The heat source and the heat sink are respectively connected to the edge of the device through six slender beams. A uniformly distributed metal heating coil 108 is prepared on one surface of the heat source, and an electric current is applied to the heating coil, and the coil will generate Joule heat, thereby realizing the temperature rise of the heat source.
采用电阻测温法实现热源与热沉温度的测量。为此需要在热沉一个表面上制备均布的金属检测线圈，通过检测线圈电阻的变化来得到热沉的温度。对于热源而言，可以同时将加热线圈用作检测线圈，也可以在热源的另一个表面再制备一个专门的检测线圈。第一种方案可以简化器件的制备过程，但加热电路和检测电路耦合在一起，增加了检测难度。第二种方案通过增加一道制备工序，将加热电路和检测电路独立开来，降低了检测难度。The temperature measurement of the heat source and heat sink is realized by the resistance temperature measurement method. For this reason, uniformly distributed metal detection coils need to be prepared on one surface of the heat sink, and the temperature of the heat sink can be obtained by detecting changes in coil resistance. For the heat source, the heating coil can be used as the detection coil at the same time, or a special detection coil can be prepared on another surface of the heat source. The first scheme can simplify the fabrication process of the device, but the heating circuit and the detection circuit are coupled together, which increases the difficulty of detection. The second scheme separates the heating circuit and the detection circuit by adding a preparation process, which reduces the difficulty of detection.
当被测样品为导体或半导体时，为了避免加热/检测线圈同被测样品电短路，将加热线圈和检测线圈使用绝缘胶封装。在热源、热沉的正面上，二者相邻的边缘位置处，各自制备两条裸露的电极。这四条电极用于导体、半导体微米线的导电性能和塞贝克系数的测量。When the sample to be tested is a conductor or semiconductor, in order to avoid electrical short circuit between the heating/detection coil and the sample to be tested, the heating coil and detection coil are packaged with insulating glue. On the front of the heat source and the heat sink, two bare electrodes are respectively prepared at the adjacent edge positions of the two. These four electrodes are used for the measurement of the conductivity and Seebeck coefficient of conductors and semiconductor micro-wires.
被测样品搭接在热源、热沉上。当只需要测试样品的导热系数时，在被测样品和热源、热沉接触处涂抹银胶或类似产品，降低被测样品同热源、热沉之间的接触热阻。当不仅需要测试样品的导热系数，还需要同时测试样品的导电性能和塞贝克系数时，要保证被测样品同热源、热沉上的裸露电极充分接触，并在接触处涂抹导电胶，保证样品和电极之间具有良好的电接触。The sample to be tested is lapped on the heat source and heat sink. When it is only necessary to test the thermal conductivity of the sample, apply silver glue or similar products on the contact between the tested sample and the heat source and heat sink to reduce the contact thermal resistance between the tested sample and the heat source and heat sink. When it is necessary not only to test the thermal conductivity of the sample, but also to test the electrical conductivity and Seebeck coefficient of the sample at the same time, it is necessary to ensure that the sample to be tested is in full contact with the exposed electrodes on the heat source and heat sink, and apply conductive glue on the contact to ensure that the sample There is good electrical contact between the electrodes.
器件的边缘部位制备有焊盘。热源、热沉上面的加热线圈、检测线圈、以及电极都经过器件的细长梁连接到焊盘上，通过在焊盘上焊接导线与外部电路连接。Pads are prepared on the edge of the device. The heat source, the heating coil on the heat sink, the detection coil, and the electrodes are all connected to the pads through the slender beams of the device, and connected to the external circuit by soldering wires on the pads.
器件由基座两端支撑，支撑处为细长梁连接的器件两边缘。这样器件的热源、热沉即变为悬置，热源、热沉上的热量需要通过细长梁传导至器件边缘，进而传导至基座中。由于器件由低热导率绝缘板材切制出来，同时细长梁具有小的横截面积，通过调整细长梁的长度，可以保证热沉和基座之间的热阻与被测微米线的热阻可比，从而保证通过被测微米线传导的热量可以在热沉上产生足够高的温升。The device is supported by two ends of the base, and the support is the two edges of the device connected by slender beams. In this way, the heat source and heat sink of the device become suspended, and the heat on the heat source and heat sink needs to be conducted to the edge of the device through the slender beam, and then to the base. Since the device is cut from an insulating sheet with low thermal conductivity, and the slender beam has a small cross-sectional area, by adjusting the length of the slender beam, the thermal resistance between the heat sink and the base can be guaranteed to be consistent with the thermal resistance of the measured micron wire. The resistance is comparable, so as to ensure that the heat conducted by the measured micron wire can generate a high enough temperature rise on the heat sink.
为了将器件细长梁上传输来的热量及时传导出去，保证器件边缘温度为环境温度，基底材料需要具有高的热导率。同时还要保证器件的边缘同基座紧密贴合，降低二者之间的接触热阻。为此，可以用一个压块来实现器件和基座之间的紧密贴合。为了达到贴合的效果同时保证器件不会被压坏，压块可由刚性材料和柔性材料叠加而成。In order to conduct the heat transmitted from the slender beam of the device in time to ensure that the edge temperature of the device is at ambient temperature, the substrate material needs to have high thermal conductivity. At the same time, it is necessary to ensure that the edge of the device is closely attached to the base to reduce the contact thermal resistance between the two. For this purpose, a pressure block can be used to achieve a tight fit between the device and the base. In order to achieve the bonding effect and ensure that the device will not be crushed, the pressing block can be made of rigid materials and flexible materials.
测试时，器件放置于真空恒温腔中，以消除对流换热对测试结果的影响，同时给基座提供一个设定的环境温度。During the test, the device is placed in a vacuum constant temperature chamber to eliminate the influence of convective heat transfer on the test results, and at the same time provide a set ambient temperature for the base.
根据傅里叶定律建立热传导模型，可以得到被测微米线的热导率Gs为：According to Fourier's law to establish a heat conduction model, the thermal conductivity G s of the measured micron wire can be obtained as:
其中，Qh、Ql分别是加热线圈和一个细长梁上产生的焦耳热，通过测量加热电流、线圈和细长梁上的电压降计算得到。ΔTh、ΔTs分别为热源和热沉上的温升，且可以分别表示为：Among them, Q h and Q l are the Joule heat generated on the heating coil and a slender beam respectively, which are calculated by measuring the heating current, the voltage drop on the coil and the slender beam. ΔT h and ΔT s are the temperature rise on the heat source and heat sink respectively, and can be expressed as:
式中，R(I)和R(0)分别为加热电流为I和0时的检测线圈的电阻，α为电阻温度系数，下标h和s分别表示热源和热沉。在测试中，使用交流四脚欧姆法测试检测线圈的电阻，得到R(I)和R(0)，基于不同温度下R(0)可以得到α，并由上面公式计算得到ΔTh、ΔTs。In the formula, R(I) and R(0) are the resistance of the detection coil when the heating current is I and 0, respectively, α is the temperature coefficient of resistance, and the subscripts h and s represent the heat source and heat sink, respectively. In the test, use the AC four-leg ohm method to test the resistance of the detection coil to obtain R(I) and R(0). Based on R(0) at different temperatures, α can be obtained, and ΔT h and ΔT s can be calculated from the above formula .
在得到样品纵向热导率Gs后，可以计算出样品的导热系数κ：After obtaining the longitudinal thermal conductivity G s of the sample, the thermal conductivity κ of the sample can be calculated:
其中，A为测试微米线样品的横截面积，L为悬空段样品长度。Among them, A is the cross-sectional area of the test micron wire sample, and L is the sample length of the suspended section.
应用实施例1：参见图1-图3，本实施案例中的纵向热流法微米线导热系数测试装置如图1所示，由测试器件100、基座200、以及可选的用于连接两者的压块300构成。Application Example 1: Referring to Fig. 1-Fig. 3, the longitudinal heat flow method micron wire thermal conductivity testing device in this embodiment case is shown in Fig. 1, which consists of a test device 100, a base 200, and an optional device for connecting the two The briquetting block 300 constitutes.
所述测试器件100如图2所示，整体采用厚度为1mm的FR-4板材切制而成。FR-4板材具有较低的导热性能，其热导率约为0.294W/m-K。器件100包括一个热源101和一个热沉107，热源101、热沉107分别通过六根细长梁103同器件100的边缘104相连。热源101、热沉107为正方形，边长为10mm。依据测试需要，热源101与热沉107间的距离可为4-16mm不等。在热源101、热沉107的背面制备均布的铜加热线圈108，其中铜线宽0.2mm，厚35μm，总长度约为285mm。为了使用方便，我们在热源101和热沉107的背面都制备了铜加热线圈108，这样器件100的热源101、热沉107是完全对称的，在同外部电路接线时无需区分哪边是热源101，哪边是热沉107。As shown in FIG. 2 , the test device 100 is cut from an FR-4 plate with a thickness of 1 mm as a whole. FR-4 sheet has low thermal conductivity, and its thermal conductivity is about 0.294W/m-K. The device 100 includes a heat source 101 and a heat sink 107 , the heat source 101 and the heat sink 107 are respectively connected to the edge 104 of the device 100 through six elongated beams 103 . The heat source 101 and the heat sink 107 are square with a side length of 10mm. According to the test requirements, the distance between the heat source 101 and the heat sink 107 may vary from 4 mm to 16 mm. Prepare evenly distributed copper heating coils 108 on the back of the heat source 101 and the heat sink 107, wherein the copper wires are 0.2 mm wide, 35 μm thick, and the total length is about 285 mm. For ease of use, we have prepared copper heating coils 108 on the back of the heat source 101 and the heat sink 107, so that the heat source 101 and the heat sink 107 of the device 100 are completely symmetrical, and there is no need to distinguish which side is the heat source 101 when wiring with an external circuit , which side is the heat sink 107.
在热源101、热沉107正面制备相同的铜检测线圈102，通过检测线圈102电阻的变化可以得到热源101、热沉107的温度变化。检测线路铜线宽0.1mm，厚35μm，总长273mm。为了避免检测线圈102同被测的导电样品400直接连通，在检测线圈102上涂抹一层油墨阻焊(PSR-4000GF5)。The same copper detection coil 102 is prepared on the front of the heat source 101 and the heat sink 107 , and the temperature change of the heat source 101 and the heat sink 107 can be obtained by detecting the change of the resistance of the coil 102 . The copper wire of the detection circuit is 0.1mm wide, 35μm thick, and 273mm in total length. In order to prevent the detection coil 102 from directly communicating with the conductive sample 400 to be tested, a layer of ink solder resist (PSR-4000GF5) is applied on the detection coil 102 .
在热源101、热沉107正面，二者相邻的边缘位置，各自制备两条裸露的铜电极106。电极106宽度分别为0.5mm和0.3mm，间隔0.9mm。这四条电极106外接电源1000和电流表900、电压表1100，用于导体、半导体的导电性能和塞贝克系数的测量。On the front of the heat source 101 and the heat sink 107 , at their adjacent edge positions, two bare copper electrodes 106 are respectively prepared. The widths of the electrodes 106 are 0.5mm and 0.3mm respectively, and the interval is 0.9mm. The four electrodes 106 are externally connected with a power supply 1000, an ammeter 900, and a voltmeter 1100, and are used for measuring the conductivity and Seebeck coefficient of conductors and semiconductors.
被测样品400搭接在热源101、热沉107上。当只需要测试样品400的导热系数时，在被测样品400和热源101、热沉107接触处涂抹导电银胶或类似产品，降低被测样品400同热源101、热沉107之间的接触热阻。当不仅需要测试样品400的导热系数，还需要同时测试样品400的导电性能和塞贝克系数时，要保证被测样品400同热源101、热沉107上的电极106充分接触，并涂抹导电银胶于样品400和电极106接触处，保证样品400和电极106之间具有良好的电接触。The tested sample 400 is lapped on the heat source 101 and the heat sink 107 . When it is only necessary to test the thermal conductivity of the sample 400, apply conductive silver glue or similar products to the contact between the tested sample 400 and the heat source 101 and the heat sink 107 to reduce the contact heat between the tested sample 400 and the heat source 101 and the heat sink 107 resistance. When not only the thermal conductivity of the sample 400 needs to be tested, but also the electrical conductivity and Seebeck coefficient of the sample 400 need to be tested at the same time, it is necessary to ensure that the sample 400 to be tested is in full contact with the heat source 101 and the electrode 106 on the heat sink 107, and apply conductive silver glue Where the sample 400 is in contact with the electrode 106 , ensure good electrical contact between the sample 400 and the electrode 106 .
器件100的边缘104的正面制备焊盘105。热源101、热沉107上面的加热线圈108、检测线圈102、以及电极106都经过器件100的细长梁103连接到焊盘105上，通过在焊盘105上焊接导线与外部电路连接。Pads 105 are prepared on the front side of the edge 104 of the device 100 . The heat source 101 , the heating coil 108 on the heat sink 107 , the detection coil 102 , and the electrode 106 are all connected to the pad 105 through the elongated beam 103 of the device 100 , and connected to the external circuit by soldering wires on the pad 105 .
器件100由基座200两端支撑，支撑处为细长梁103连接的器件100两边缘104。这样器件100的热源101、热沉107即变为悬置，热源101、热沉107上的热量需要通过细长梁103传导至器件100的边缘104，进而传导至基座200中。The device 100 is supported by two ends of the base 200 , and the supports are two edges 104 of the device 100 connected by elongated beams 103 . In this way, the heat source 101 and the heat sink 107 of the device 100 become suspended, and the heat on the heat source 101 and the heat sink 107 needs to be conducted to the edge 104 of the device 100 through the slender beam 103 , and then transferred to the base 200 .
器件100是由导热系数为0.294W/m-K的绝缘FR-4板材切制出来，加上细长梁103的横截面积只有0.6mm2，细长梁103的单根长度为13mm，因此从热沉107和基座200之间的总热导约为8.14154×10-5W/K。假设被测微米线的悬空段长度为5mm，宽度为1mm，厚度为10μm，样品的导热系数为10W/m-K，则样品热导率约为2×10-5W/K。两者比例约为4：1。从而保证通过被测微米线传导的热量可以在热沉107上产生足够高的温升。The device 100 is cut out of an insulating FR-4 plate with a thermal conductivity of 0.294W/mK. In addition, the cross-sectional area of the slender beam 103 is only 0.6mm 2 , and the single length of the slender beam 103 is 13mm. The total thermal conductance between the sink 107 and the base 200 is about 8.14154×10 −5 W/K. Assuming that the length of the suspended segment of the measured micron wire is 5 mm, the width is 1 mm, and the thickness is 10 μm, and the thermal conductivity of the sample is 10 W/mK, then the thermal conductivity of the sample is about 2×10 -5 W/K. The ratio of the two is about 4:1. Therefore, it is ensured that the heat conducted by the measured micron wire can generate a sufficiently high temperature rise on the heat sink 107 .
为了将器件100的细长梁103上传输来的热量及时传导出去，保证器件100的边缘104的温度为环境温度，使用导热系数约为409W/m-K的无氧铜制作基座200。同时还要保证器件100的边缘104同基座200紧密贴合，降低二者之间的接触热阻。为此，用一个压块300来实现器件100和基座200之间的紧密贴合。为了达到贴合的效果，热源101、热沉107背面的加热线圈108需要接引到正面，再通过细长梁103连接到焊盘105上。为了保证器件100不会被压坏，压块300由铜片和PDMS薄膜叠加而成。In order to conduct the heat transmitted from the slender beam 103 of the device 100 in time, and ensure that the temperature of the edge 104 of the device 100 is at ambient temperature, the base 200 is made of oxygen-free copper with a thermal conductivity of about 409W/m-K. At the same time, it is also necessary to ensure that the edge 104 of the device 100 is in close contact with the base 200 to reduce the thermal contact resistance between the two. To this end, a pressure block 300 is used to achieve a tight fit between the device 100 and the base 200 . In order to achieve the bonding effect, the heat source 101 and the heating coil 108 on the back of the heat sink 107 need to be connected to the front, and then connected to the pad 105 through the slender beam 103 . In order to ensure that the device 100 will not be crushed, the pressing block 300 is made of a copper sheet and a PDMS film.
测试时，器件100放置于真空恒温腔中，以消除对流换热对测试结果的影响，同时给基座200提供一个设定的环境温度。During the test, the device 100 is placed in a vacuum constant temperature chamber to eliminate the influence of convective heat transfer on the test results, and at the same time provide a set ambient temperature for the base 200 .
需要说明的是上述实施例，并非用来限定本发明的保护范围，在上述技术方案的基础上所作出的等同变换或替代均落入本发明权利要求所保护的范围。It should be noted that the above-mentioned embodiments are not used to limit the protection scope of the present invention, and equivalent transformations or substitutions made on the basis of the above-mentioned technical solutions all fall within the protection scope of the claims of the present invention.
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