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CN110366366B - Method and apparatus for processing radial electronics - Google Patents

Method and apparatus for processing radial electronics Download PDF

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Publication number
CN110366366B
CN110366366B CN201910287293.9A CN201910287293A CN110366366B CN 110366366 B CN110366366 B CN 110366366B CN 201910287293 A CN201910287293 A CN 201910287293A CN 110366366 B CN110366366 B CN 110366366B
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China
Prior art keywords
leads
pitch
radial
lead
bending
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CN201910287293.9A
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Chinese (zh)
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CN110366366A (en
Inventor
S·瓦柳斯
K·萨沃莱宁
P·库奥斯马宁
P·海尔凯莱
J·坎特拉
V·梅凯莱
P·努门佩
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Salcomp Oyj
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Salcomp Oyj
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0421—Feeding with belts or tapes with treatment of the terminal leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)

Abstract

The invention provides a method and apparatus for processing radial electronics (130, 230). In the invention, the radial electronic device (130, 230) is processed by bending the first lead (131, 231) and/or the second lead (132, 232) of the radial electronic device (130, 230) such that the pitch of the leads (131, 132, 231, 232) is different from the pitch of the holes in the circuit board, and by obliquely cutting the first lead (131, 231) and the second lead (132, 232).

Description

Method and apparatus for processing radial electronics
Technical Field
The present invention relates to a method and apparatus for processing radial electronic components. The invention also relates to a feeding device (feeder) for feeding radial electronics.
Background
In the prior art, various techniques for mounting electronic devices on a circuit board are known. One of these techniques is a through-hole mounting technique that can be used to mount radial electronics. In through-hole mounting, leads (leads) of radial electronic devices are inserted into holes on a circuit board, and ends of the leads extending through to a surface of the circuit board remote from the device body are soldered to a circuit pattern of the surface.
One problem associated with known through-hole mounting techniques is: the ends of the leads must be bent (i.e., clinched) prior to soldering to hold the radial electronics in place in the circuit board. The radial electronics are likely to fall out of the circuit board without bending the leads. Another problem associated with known through-hole mounting techniques is: due to manufacturing tolerances of radial electronics, the pitch of the leads (pitch) is difficult to be the same as the pitch of the holes, and thus inserting the leads into the holes of the circuit board is difficult. In some device mounting apparatuses, radial electronic devices with incorrect spacing are discarded, which are unsatisfactory both from a cost and ecological point of view. In some device mounting apparatuses, attempts have been made to solve the pitch problem by checking the pitch of the leads using a vision system, and then correcting the pitch with a pitch calibration system as necessary before insertion. However, this is a slow and complicated process (process) that significantly reduces the speed of mounting the electronic device.
Object of the Invention
The main object of the present invention is to reduce or even eliminate the above mentioned problems of the prior art.
It is an object of the present invention to provide a method and apparatus for processing radial electronics such that the radial electronics are suitable for mounting on a circuit board. In more detail, it is an object of the invention to provide a method and an apparatus which enable mounting of radial electronic devices on a circuit board without bending the ends of the leads of the radial electronic devices after the leads have been inserted into holes of the circuit board. It is another object of the present invention to provide a method and apparatus that eliminates the prior art problems associated with mis-spacing of leads of radial electronics.
To achieve the object defined above, the method and device of the invention are characterized by what is presented in the characterizing parts of the appended independent claims. Advantageous embodiments of the invention are described in the dependent claims.
Disclosure of Invention
A method for processing radial electronics according to the invention comprises: bending the first leads and/or the second leads of the radial electronic device such that the pitch of the leads is different from the pitch of holes in the circuit board into which the leads are to be inserted; and obliquely cutting the first and second leads.
The method according to the invention is intended for use in through-hole mounting solutions to treat the leads of radial electronic devices before the leads are inserted into holes in a circuit board. Radial electronics may refer to electronics having leads that protrude substantially parallel (side-by-side) from the same end of the device body. When placed on the circuit board, the radial electronics stand substantially vertically on the circuit board. Radial electronics may also refer herein to electronics having leads protruding from opposite ends of the device body, and where one lead has been bent into a U-shape such that it is eventually adjacent and parallel (side-by-side) to the other lead, or where both leads have been bent into an L-shape such that the ends of the leads are substantially parallel to each other. Examples of radial electronics are resistors, capacitors and inductors.
In the method according to the invention, the first and/or second leads of the radial electronic device are bent such that the pitch of the leads is smaller or larger than the pitch of the holes in the circuit board. The leads of the radial electronics can be bent in the following manner: bending only the first lead or only the second lead, or bending both the first lead and the second lead. The bending of one or more leads can be performed in various ways as long as the pitch of the leads after bending is different from the pitch of the holes into which the leads are to be inserted. The pitch of the leads refers to the distance between the centers of the ends of the leads. The pitch of the holes refers to the distance between the centers of the holes.
In the method according to the invention, the first and second leads of the radial electronic device are cut obliquely. This means that the wire is cut at an angle with respect to the transverse direction of the wire. In other words, the wire is cut in such a manner that the cut surface of the wire is inclined. The leads of the radial electronics may be cut before or after the leads are bent. Preferably, the leads of the radial electronic device are cut obliquely so that the cut surfaces have opposite orientations. Preferably, the leads are cut obliquely so that the cut surfaces of the leads face toward or away from each other. Preferably, the leads are cut to the same length.
Radial electronic components that have been treated with the method according to the invention can be mounted on a circuit board by placing the ends of the leads into holes in the circuit board and by pressing the component body against the circuit board. When the leads protrude into the holes of the circuit board, the leads are pressed against the edges of the holes because the pitch of the leads and the pitch of the holes are different from each other. The edges of the holes bend the leads closer to or further from each other, depending on whether the pitch of the leads is greater or less than the pitch of the holes. The chamfered ends (levelled ends) of the leads help to insert the leads into the holes.
The method according to the invention has the advantage that radial electronic components which have been treated with the method according to the invention can be mounted on a circuit board without the need to bend the ends of the leads of the radial electronic components after the leads have been inserted into the holes of the circuit board. Friction between the leads and the edges of the holes holds the radial electronics in place in the circuit board before and during soldering of the ends of the leads to the circuit board. Bevel cutting of the leads facilitates insertion of the leads into holes in the circuit board.
According to an embodiment of the present invention, the first lead and/or the second lead are bent such that the pitch of the leads differs from the pitch of the holes by at least 0.1 mm. This difference has been found to be sufficient to hold the radial electronics in place in the circuit board. To increase the retention, the pitch of the leads may be set at least 0.15mm or at least 0.3mm different from the pitch of the holes.
According to an embodiment of the invention, the first and second leads are cut at an angle of 20 to 70 degrees with respect to the longitudinal axis of the leads. This range has been found to be preferable because it allows the lead wire to be easily inserted into the hole. Preferably, the first and second leads are cut at an angle of 30 to 60 degrees relative to the longitudinal axis of the leads, more preferably, at an angle of 40 to 50 degrees relative to the longitudinal axis of the leads. Preferably, the wires are cut at the same angle, but with the cut surfaces of the wires having opposite orientations.
According to an embodiment of the present invention, the first lead and/or the second lead is bent such that the pitch of the leads is smaller than the pitch of the holes, and the first lead and the second lead are obliquely cut such that the cut surfaces of the leads face each other. Cutting surfaces towards each other means that the ends of the leads are beveled inwards and have opposite orientations. The mathematical relationship between the pitch of the leads and the pitch of the holes and the diameters of the leads and the holes can be expressed by the following expressions:
p H -d H -d L <p L <p H ，
wherein p is H Denotes the pitch of the holes, p L Denotes the pitch of the leads, d H Denotes the diameter of the hole, and d L The diameter of the wire is indicated.
According to an embodiment of the invention, the step of bending the first and/or second leads of the radial electronic device comprises providing a spacer having opposite first and second sides between the first and second leads and pushing the first lead against the first side of the spacer and the second lead against the second side of the spacer. The first push arm can be used to push the first lead against the first side of the separator and the second push arm can be used to push the second lead against the second side of the separator. The pitch of the leads after radial electronics processing is equal to the sum of the spacer thickness and the lead diameter. The spacer is preferably used in the case where the pitch of the leads is smaller than the pitch of the holes.
According to an embodiment of the present invention, the first lead and/or the second lead are bent such that the pitch of the leads is larger than the pitch of the holes, and the first lead and the second lead are obliquely cut such that the cut surfaces of the leads are away from each other. The cutting surfaces being away from each other means that the ends of the leads are chamfered outwards and have an opposite orientation. The mathematical relationship between the pitch of the leads and the pitch of the holes and the diameter of the leads and the diameter of the holes can be expressed by the following expressions:
p H <p L <p H +d H +d L ，
wherein p is H Denotes the pitch of the holes, p L Denotes the pitch of the leads, d H Denotes the diameter of the hole, and d L Indicating the straightness of the leadAnd (4) diameter.
According to an embodiment of the invention, the step of bending the first and/or second lead of the radial electronic device comprises arranging the first and second lead in a space between the first and second spacer arms and pushing the first lead against the first spacer arm and the second lead against the second spacer arm. A third push arm can be used to push the first lead against the first spacing arm and a fourth push arm can be used to push the second lead against the second spacing arm. After the radial electronics have been processed, the pitch of the leads is equal to the distance between the first and second spacer arms minus the diameter of the leads. The spacer arms are preferably used in cases where the pitch of the leads is greater than the pitch of the holes.
According to an embodiment of the invention, the method includes inserting the first lead and the second lead into a hole of the circuit board. After the step of bending the first and/or second leads of the radial electronic device and the step of obliquely cutting the first and second leads are performed, the leads are inserted into the holes.
The invention also relates to an apparatus for processing radial electronics. The device according to the invention comprises: bending means for bending the first leads and/or the second leads of the radial electronic device such that the pitch of the leads is different from the pitch of holes in the circuit board into which the leads are to be inserted; and a cutting device for obliquely cutting the first and second leads.
The apparatus according to the present invention can be used in an electronic device mounting apparatus to process leads of radial electronic devices before the radial electronic devices are mounted on a circuit board. Radial electronic components that have been processed with the apparatus according to the present invention can be mounted on a circuit board by placing the ends of the leads into holes in the circuit board and pressing the component body against the circuit board. When the leads are projected into the holes of the circuit board, the leads are pressed against the edges of the holes because the pitch of the leads and the pitch of the holes are different from each other. The edges of the holes bend the leads closer to or further from each other, depending on whether the pitch of the leads is greater or less than the pitch of the holes. The chamfered end of the lead facilitates insertion of the lead into the hole.
The bending device is configured to bend the first and/or second leads of the radial electronic device such that the pitch of the leads becomes smaller or larger than the pitch of the holes in the circuit board. The bending means can be arranged to bend the leads of the radial electronic device in such a way that only the first lead or only the second lead or both the first and the second lead are bent. The cutting device is used for obliquely cutting the first lead and the second lead of the radial electronic device. The cutting device can be arranged to cut the wire before or after bending the wire with the bending device.
The apparatus according to the invention has the advantage that radial electronic components which have been processed with the apparatus according to the invention can be mounted on a circuit board without the need to bend the ends of the leads of the radial electronic components after the leads have been inserted into the holes of the circuit board. The friction between the leads and the edges of the holes holds the radial electronics in place in the circuit board before and during soldering of the leads to the circuit board. The bevel cutting of the leads facilitates insertion of the leads into holes in the circuit board.
According to an embodiment of the present invention, the bending device is configured to bend the first lead and/or the second lead closer to each other, and the cutting device is configured to cut the first lead and the second lead obliquely such that the cut surfaces of the leads face each other. The bending means is configured to bend the first lead and/or the second lead closer to each other such that the pitch of the leads becomes smaller than the pitch of the holes in the circuit board.
According to an embodiment of the present invention, the bending device includes a spacer that may be disposed between the first lead and the second lead, a first push arm for pushing the first lead against a first side of the spacer, and a second push arm for pushing the second lead against a second side of the spacer. The diaphragm and the push arm move together with an actuator (e.g., a pneumatic or electric cylinder). After the radial electronics have been processed, the pitch of the leads is equal to the sum of the thickness of the spacer and the diameter of the leads. The spacer is preferably used in the case where the pitch of the leads is smaller than the pitch of the holes.
According to an embodiment of the present invention, the bending means is configured to bend the first lead and/or the second lead away from each other, and the cutting means is configured to cut the first lead and the second lead obliquely such that the cut surfaces of the leads are away from each other. The bending device is configured to bend the first lead and/or the second lead away from each other such that a pitch of the leads becomes larger than a pitch of the holes in the circuit board.
According to an embodiment of the invention, the bending device comprises: a first spacer arm and a second spacer arm defining a space in which the first lead and the second lead can be disposed; a third push arm for pushing the first lead against the first spacing arm; and a fourth pushing arm for pushing the second lead against the second spacing arm. The spacer arm and the push arm move together with an actuator (e.g., a pneumatic or electric cylinder). The pitch of the leads after the radial electronics have been processed is equal to the distance between the first and second spacer arms minus the diameter of the leads. The spacer arms are preferably used in cases where the pitch of the leads is greater than the pitch of the holes.
According to an embodiment of the invention, the cutting device comprises a first cutting member and a second cutting member, which are movably arranged with respect to each other. Preferably, the first cutting member and the second cutting member are substantially planar and arranged to be movable in the same plane with respect to each other. The first and second cutting members can be attached to an actuator configured to move the cutting members toward and away from each other. The first cutting member may comprise a protruding portion for pressing the leads of the radial electronic device against the edge of the slot in the second cutting member. When the cutting members are moved towards each other, the projections project into the slots, with the result that the edges of the slots cut the wire. Preferably, the projection and the groove have corresponding shapes, such that the projection can be slid into the groove in such a way that a surface of the projection abuts snugly against a corresponding surface of the groove. Preferably, the cross-sectional shapes of the projections and the grooves are triangular, allowing the wire to be cut obliquely so that the cut surfaces of the wire have opposite orientations. Depending on the orientation of the triangle, the leads may be cut obliquely such that the cut surfaces face toward or away from each other. Preferably, the cutting member is configured to cut the wires to the same length.
According to an embodiment of the invention, the device comprises insertion means for inserting the first and second leads into the hole of the circuit board.
The invention also relates to a supply device for supplying radial electronic components. The feed device of the invention comprises an apparatus for processing radial electronics according to the invention. The feeding device according to the present invention can be used in an electronic component mounting apparatus for feeding electronic components to a pickup apparatus which mounts the electronic components on a circuit board one at a time.
The exemplary embodiments of the invention presented herein are not intended to limit the applicability of the appended claims. The verb "to comprise" is used herein as an open limitation that does not exclude the presence of also unrecited features. The features recited in the dependent claims may be freely combined with each other, unless explicitly stated otherwise.
The exemplary embodiments presented herein and their advantages relate to applicable parts of the method and the device according to the present invention, even if not always mentioned separately.
Drawings
Fig. 1 shows an apparatus for processing radial electronics according to a first embodiment of the invention;
FIGS. 2A-2D illustrate bending leads of radial electronics using the apparatus of FIG. 1;
FIGS. 3A-3B illustrate cutting a lead of a radial electronic device using the apparatus of FIG. 1;
FIG. 4 shows radial electronics processed with the apparatus of FIG. 1;
fig. 5 shows an apparatus for processing radial electronics according to a second embodiment of the invention;
FIGS. 6A-6D illustrate bending leads of radial electronics using the apparatus of FIG. 5;
FIGS. 7A-7B illustrate cutting a lead of a radial electronic device using the apparatus of FIG. 5; and
fig. 8 shows radial electronics processed with the apparatus of fig. 5.
Detailed Description
Fig. 1 shows an apparatus for processing radial electronics according to a first embodiment of the invention. The apparatus comprises bending means 110 for bending the leads of the radial electronic device (not shown in fig. 1) closer to each other. The bending apparatus 110 is configured to bend the leads so that the pitch of the leads becomes smaller than the pitch of holes in a circuit board (not shown in fig. 1) into which the leads are to be inserted. The apparatus further comprises a cutting device 120 for obliquely cutting the leads of the radial electronic device such that the cut surfaces of the leads are inclined towards each other. The bending device 110 and the cutting device 120 are sequentially disposed such that the lead is first bent by the bending device 110 and then cut by the cutting device 120. The radial electronic components to be processed are preferably transported with a component tape (not shown in fig. 1) from which the radial electronic components are separated with a cutting device 120.
The apparatus of fig. 1 can be used in an electronics mounting apparatus to process the leads of radial electronics prior to mounting the radial electronics on a circuit board. Radial electronic devices processed using the apparatus of fig. 1 can be mounted onto a circuit board by placing the ends of the leads into holes in the circuit board and by pressing the device body against the circuit board. When the leads protrude into the holes of the circuit board, the leads are pressed against the edges of the holes because the pitch of the leads and the pitch of the holes are different from each other. The friction between the leads and the edges of the holes holds the radial electronics in place in the circuit board before and during soldering of the leads to the circuit board. The chamfered end of the lead facilitates insertion of the lead into the hole.
The bending device 110 comprises a diaphragm 111, which diaphragm 111 is intended to be arranged between the leads of the radial electronic device. The bending device 110 further comprises pushing arms 112 and 113 for pushing the leads against different sides of the spacer 111. The push arms 112 and 113 move together with an actuator 114, and the actuator 114 rotates the push arms 112 and 113 about pivots 115 and 116. The pitch of the leads after radial electronics processing is equal to the sum of the thickness of the spacer 111 and the diameter of the leads.
The cutting device 120 comprises cutting members 121 and 122, which cutting members 121 and 122 are attached to an actuator 123, which actuator 123 is capable of moving the cutting members 121 and 122 towards and away from each other. The cutting members 121 and 122 are substantially planar and arranged to be movable relative to each other in the same plane. The cutting member 121 comprises a protruding portion 124, which protruding portion 124 may protrude into a slot 125 in the cutting member 122 when the cutting members 121 and 122 are moved towards each other. When the cutting members 121 and 122 are moved toward each other, the protruding portion 124 can press the lead of the radial electronic device against the edge of the groove 125, whereby the lead can be cut obliquely. The protrusion 124 and the groove 125 have corresponding triangular cross-sectional shapes so that the protrusion 124 can slide into the groove 125 in such a way that the surface of the protrusion 124 snugly abuts against the corresponding surface of the groove 125. The triangular shape is oriented in such a way that the cutting device 120 is able to cut the wire obliquely so that the cut surfaces face each other.
Fig. 2A-2D illustrate bending leads of radial electronics using the apparatus of fig. 1. In fig. 2A-2D, radial electronics 130 are shown as transparent for illustrative purposes to provide a view of leads 131 and 132 and spacer 111 and push arms 112 and 113. In fig. 2A, the situation is shown where the radial electronic device 130 attached to the device tape 133 has been moved to a position where it can be handled with the bending apparatus 110. In fig. 2B, the case where the bending apparatus 110 has been moved forward so that the diaphragm 111 is positioned between the leads 131 and 132 is shown. In fig. 2C, a case is shown in which the lead wires 131 and 132 have been pushed against the partition 111 by the push arms 112 and 113, whereby the lead wires 131 and 132 are bent closer to each other. In fig. 2D, a situation is shown where the push arms 112 and 113 have moved away from the partition 111 and the bending device 110 has moved backwards, so that the radial electronics 130 can move forwards to the cutting device 120.
Fig. 3A-3B illustrate cutting leads of radial electronics using the apparatus of fig. 1. In fig. 3A-3B, radial electronics 130 are shown as transparent for illustrative purposes to provide a view of leads 131 and 132 and tabs 124 and slots 125. In fig. 3A, the radial electronic device 130 attached to the device tape 133 is shown having been moved from the bending apparatus 110 to a position where it can be processed with the cutting apparatus 120. The cutting members 121 and 122 are disposed in the open position with the leads 131 and 132 disposed between the protruding portion 124 and the slot 125. In fig. 3B, a case is shown where the cutting members 121 and 122 are disposed in the closed position, whereby the protruding portion 124 has protruded into the groove 125, and thus the edge of the groove 125 has obliquely cut the leads 131 and 132. The radial electronics 130 are now ready to be picked up and placed on the circuit board.
Fig. 4 shows radial electronics processed with the apparatus of fig. 1. As can be seen from fig. 4, the leads 131 and 132 are bent such that the distance between the leads 131 and 132 is greater at one end of the device body 134 than at the other end. The leads 131 and 132 are cut obliquely such that the cut surfaces of the leads 131 and 132 are inclined toward each other and at an angle of about 45 degrees with respect to the longitudinal axis of the leads 131, 132.
Fig. 5 shows an apparatus for processing radial electronics according to a second embodiment of the invention. The apparatus comprises bending means 210 for bending the leads of the radial electronic device (not shown in fig. 5) away from each other. The bending device 210 is configured to bend the leads so that the pitch of the leads becomes larger than the pitch of holes (not shown in fig. 5) in the circuit board into which the leads are to be inserted. The apparatus further comprises cutting means 220 for obliquely cutting the leads of the radial electronic device such that the cut surfaces of the leads are inclined away from each other. The bending means 210 and the cutting means 220 are sequentially disposed such that the lead is first bent by the bending means 210 and then cut by the cutting means 220. The radial electronic components to be processed are preferably transported with a component tape (not shown in fig. 5) from which the radial electronic components are separated by a cutting device 220.
As with the apparatus of fig. 1, the apparatus of fig. 5 can be used in an electronics mounting apparatus to process the leads of radial electronics prior to mounting the radial electronics on a circuit board.
The bending device 210 comprises spacer arms 211 and 212, the spacer arms 211 and 212 defining a space in which the leads of the radial electronic device are intended to be arranged. The bending device 210 further comprises pushing arms 213 and 214 for pushing the leads against the spacer arms 211 and 212. The push arms 213 and 214 move together with the actuator 215, and the actuator 215 rotates the push arms 213 and 214 about the pivots 216 and 217. After the radial electronics have been processed, the pitch of the leads is equal to the distance between the spacer arms 211 and 212 minus the diameter of the leads.
The cutting device 220 comprises cutting members 221 and 222, the cutting members 221 and 222 being attached to an actuator 223, which actuator 223 can move the cutting members 221 and 222 towards and away from each other. The cutting members 221 and 222 are substantially planar and arranged to be movable relative to each other in the same plane. Cutting member 221 includes a projection 224, and when cutting members 221 and 222 are moved toward each other, projection 224 may extend into a slot 225 in cutting member 222. When the cutting members 221 and 222 are moved toward each other, the protruding portion 224 can press the lead of the radial electronic device against the edge of the groove 225, thereby obliquely cutting the lead. The projection 224 and the slot 225 have corresponding triangular cross-sectional shapes such that the projection 224 can slide into the slot 225 with the surface of the projection 224 snugly abutting against the corresponding surface of the slot 225. The triangular shape is oriented in such a way that the cutting device 220 is able to cut the wire obliquely so that the cut surfaces are far away from each other.
Fig. 6A-6D illustrate bending leads of radial electronics using the apparatus of fig. 5. In fig. 6A-6D, the radial electronics 230 are shown as transparent for illustrative purposes to provide a view of the leads 231 and 232 and the spacer arms 211 and 212 and the push arms 213 and 214. In fig. 6A, the radial electronic device 230 attached to the device tape 233 is shown having been moved to a position where it can be handled with the bending apparatus 210. In fig. 6B, the bending apparatus 210 is shown as having moved forward such that the leads 231 and 232 are in the space defined by the spacer arms 211 and 212. In fig. 6C, a case is shown in which the lead wires 231 and 232 have been pushed against the spacer arms 211 and 212 by the push arms 213 and 214, whereby the lead wires 231 and 232 are bent away from each other. In fig. 6D, a situation is shown where the push arms 213 and 214 have moved away from the spacer arms 211 and 212 and the bending device 210 has moved backwards, so that the radial electronics 230 can move forward to the cutting device 220.
Fig. 7A-7B illustrate cutting leads of radial electronics using the apparatus of fig. 5. In fig. 7A-7B, radial electronics 230 are shown as transparent for illustrative purposes to provide a view of leads 231 and 232, as well as projection 224 and slot 225. In fig. 7A, the situation is shown where the radial electronic device 230 attached to the device tape 233 has been moved from the bending device 210 to a position where it can be processed with the cutting device 220. The cutting members 221 and 222 are disposed in the open position and the leads 231 and 232 are disposed between the projection 224 and the slot 225. In fig. 7B, a case is shown in which the cutting members 221 and 222 are disposed in the closed position, whereby the protruding portion 224 protrudes into the groove 225, with the result that the edges of the groove 225 have obliquely cut the leads 231 and 232. The radial electronics 230 are now ready to be picked up and placed on the circuit board.
Fig. 8 shows radial electronics processed using the apparatus of fig. 5. As can be seen from fig. 8, the leads 231 and 232 are bent such that the distance between the leads 231 and 232 is smaller at one end of the device body 234 than at the other end. The leads 231 and 232 are cut obliquely such that the cut surfaces of the leads 231 and 232 are inclined away from each other and at an angle of about 45 degrees with respect to the longitudinal axis of the leads 231, 232.
In which only advantageous exemplary embodiments of the invention are described. It is obvious to the person skilled in the art that the invention is not limited solely to the examples given above, but that it may be varied within the scope of the appended claims. The dependent claims describe some possible embodiments of the invention and should not be considered as limiting the scope of protection of the invention.

Claims (17)

1. A method for processing radial electronics, the method comprising:
-bending the first and/or second leads of the radial electronic device such that the pitch of the leads is different from the pitch of holes in a circuit board into which the leads are to be and can be inserted, and
-obliquely cutting the first and second leads,
bending the first and/or second leads such that the pitch of the leads is smaller than the pitch of the holes, and obliquely cutting the first and second leads such that the cut surfaces of the leads face each other, the pitch of the leads being a distance between end centers of the leads.
2. The method of claim 1, wherein the step of bending the first and/or second leads of the radial electronic device comprises:
-providing a separator between the first and second leads, the separator having opposing first and second sides; and
-pushing the first lead against a first side of the separator and the second lead against a second side of the separator.
3. The method of any of claims 1-2, wherein the first and/or second leads are bent such that a pitch of the leads differs from a pitch of the holes by at least 0.1 mm.
4. The method of any of claims 1-2, wherein the first and second leads are cut at an angle of 20 to 70 degrees relative to a longitudinal axis of the leads.
5. The method of claim 3, wherein the first and second leads are cut at an angle of 20 to 70 degrees relative to a longitudinal axis of the leads.
6. A method for processing radial electronics, the method comprising:
-bending the first and/or second leads of the radial electronic device such that the pitch of the leads is different from the pitch of holes in a circuit board into which the leads are to be and can be inserted, and
-obliquely cutting the first and second leads,
wherein the first and/or second leads are bent such that the pitch of the leads is greater than the pitch of the holes, and the first and second leads are obliquely cut such that cut surfaces of the leads are away from each other, the pitch of the leads being a distance between end centers of the leads.
7. The method of claim 6, wherein the step of bending the first and/or second leads of the radial electronic device comprises:
-providing the first and second leads in a space between a first and a second spacer arm; and
-pushing the first lead against the first spacer arm and the second lead against the second spacer arm.
8. The method of any of claims 6-7, wherein the first and/or second leads are bent such that the pitch of the leads differs from the pitch of the holes by at least 0.1 mm.
9. The method of any of claims 6-7, wherein the first and second leads are cut at an angle of 20 to 70 degrees relative to a longitudinal axis of the leads.
10. The method of claim 8, wherein the first and second leads are cut at an angle of 20 to 70 degrees relative to a longitudinal axis of the lead.
11. An apparatus for processing radial electronics, the apparatus comprising:
-bending means for bending the first and/or second leads of the radial electronic device such that the pitch of the leads differs from the pitch of holes in a circuit board into which the leads are to be and can be inserted, and
-a cutting device for obliquely cutting the first and second leads,
wherein the bending means is configured to bend the first and/or second leads closer to each other, and the cutting means is configured to cut the first and second leads obliquely such that the cut surfaces of the leads face each other, the pitch of the leads being a distance between end centers of the leads.
12. The apparatus of claim 11, wherein the bending device comprises: a separator that is capable of being disposed between the first lead and the second lead; a first push arm for pushing the first lead against a first side of the separator; and a second push arm for pushing the second lead against the second side of the separator.
13. Apparatus according to any one of claims 11-12, characterized in that the cutting device comprises a first cutting member and a second cutting member, which are arranged to be movable relative to each other.
14. An apparatus for processing radial electronics, the apparatus comprising:
-bending means for bending the first and/or second leads of the radial electronic device such that the pitch of the leads differs from the pitch of holes in a circuit board into which the leads are to be and can be inserted, and
-a cutting device for obliquely cutting the first and second wires,
wherein the bending means is configured to bend the first and/or second leads away from each other, and the cutting means is configured to cut the first and second leads obliquely such that the cut surfaces of the leads are away from each other, the pitch of the leads being a distance between end centers of the leads.
15. The apparatus of claim 14, wherein the bending device comprises: a first spacer arm and a second spacer arm defining a space in which the first lead and the second lead can be disposed; a third push arm for pushing the first lead against the first spacing arm; and a fourth push arm for pushing the second lead against the second spacer arm.
16. Apparatus according to any one of claims 14-15, characterized in that the cutting device comprises a first cutting member and a second cutting member, which are arranged to be movable relative to each other.
17. A feeding device for feeding radial electronic components, characterized in that it comprises an apparatus for processing radial electronic components according to any one of claims 11 to 16.
CN201910287293.9A 2018-04-11 2019-04-11 Method and apparatus for processing radial electronics Active CN110366366B (en)

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EP18166861.7A EP3554201B1 (en) 2018-04-11 2018-04-11 Method and device for processing a radial electronic component
EP18166861 2018-04-11

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CN110366366B true CN110366366B (en) 2022-08-26

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GB2069382A (en) * 1980-02-14 1981-08-26 Storimans F J A Machine for forming the leads of electronic components
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CN206164999U (en) * 2016-09-30 2017-05-10 联合汽车电子有限公司 Receive tin piece and selection and weld device

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JP3476800B2 (en) * 2001-08-22 2003-12-10 Ｔｄｋ株式会社 Radial lead type multilayer ceramic electronic components

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Publication number Priority date Publication date Assignee Title
GB895321A (en) * 1959-12-14 1962-05-02 Dubilier Condenser Co 1925 Ltd Improvements in or relating to terminals for electrical components
GB2069382A (en) * 1980-02-14 1981-08-26 Storimans F J A Machine for forming the leads of electronic components
CN2202981Y (en) * 1994-09-12 1995-07-05 黄月云 Terminal spacer with multiple radial claws
JP2006019620A (en) * 2004-07-05 2006-01-19 Funai Electric Co Ltd Soldering iron
CN1988141A (en) * 2005-12-19 2007-06-27 夏普株式会社 Lead terminal leadout type electronic component, manufacturing method therefor and electronic equipment
TW201306386A (en) * 2011-07-27 2013-02-01 Delta Electronics Inc Component with pins fixed on circuit board
CN206164999U (en) * 2016-09-30 2017-05-10 联合汽车电子有限公司 Receive tin piece and selection and weld device

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BR102019006551A2 (en) 2019-10-29
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EP3554201B1 (en) 2023-05-17

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