CN110364540A - Photosensitive component, camera module and manufacturing method thereof - Google Patents

Abstract

The invention provides a photosensitive component, comprising: a photosensitive chip, which has a photosensitive area and a non-photosensitive area surrounding the photosensitive area; a color filter, which is located above the photosensitive chip; and an annular support, which is glued by the chip The conjunctiva forming material is formed and located between the photosensitive chip and the color filter; the lower surface of the annular support is in contact with and adhered to the position corresponding to the non-photosensitive area on the upper surface of the photosensitive chip , and the upper surface of the annular support is in contact with and bonded to the lower surface of the color filter. The invention also provides the corresponding camera module and the manufacturing method of the photosensitive component and the camera module. The present invention can effectively reduce the height dimension of the module, so as to meet the requirements of full-screen and light and thin mobile phones and other electronic equipment. The invention also provides a reliable process for attaching the color filter directly to the surface of the chip. The invention can improve product yield.

Description

Photosensitive component, camera module and manufacturing method thereof

technical field

The invention relates to the field of optical technology, in particular, the invention relates to a photosensitive component and a camera module, and a method for making the photosensitive component and the camera module.

Background technique

With the rapid development of smartphones and other electronic devices, the demand for miniaturization of camera modules is becoming more and more intense as the screens of mobile phones tend to be full-screen and thinner.

Fig. 1 has shown a kind of typical conventional camera module in the prior art, under normal circumstances, camera module comprises a mirror base 1, a lens 2, a circuit board 3 and a photosensitive chip 4, lens 2 is installed on the mirror The base 1 and the mirror base 1 are installed on the circuit board 3 , and the photosensitive chip 4 is installed on the circuit board 3 , that is, the lens 1 and the circuit board 3 are assembled through the mirror base 1 . Furthermore, there is a color filter 5 between the lens 2 and the photosensitive chip 4 to filter the infrared light, so that the photosensitive chip 4 can collect image information with better quality.

In the prior art, the color filter 5 is usually installed on the mirror base 2, and the color filter 5 is located below the lens 1, so in order to facilitate the installation of the color filter 5, the mirror base 1 needs to provide an inner boss 6 to The edge of the color filter 5 is supported, so that the color filter 5 is supported in the mirror holder 1 and located between the lens 1 and the photosensitive chip 4 .

It can be seen from the conventional module structure that first, the color filter 1 is installed on the inner boss 6 of the mirror base, the inner boss has a certain thickness, and is located between the lens and the photosensitive chip, and the photosensitive chip usually passes through The arc-shaped gold wire is connected to the circuit board. In addition, capacitors and resistors need to be installed around the chip. Therefore, it is necessary to maintain a certain avoidance height between the color filter and the photosensitive chip because of the need to avoid the above-mentioned electronic components (gold wire/capacitor resistor, etc.) to prevent Damage the above-mentioned electronic components, which increases the size of the camera module in the direction perpendicular to the optical axis; secondly, because the color filter is installed on a higher plane, the image plane of the last lens of the lens often needs a certain safety distance; Third, the color filter is a thin sheet, and it needs a higher level of craftsmanship to be installed on the inner boss. At present, the thickness of the color filter usually used is 0.3mm or 0.2mm, and the color filter with a smaller thickness is assembled. It is more difficult and the yield rate is low. These factors make the mechanical back focus BFL (back focal length) of the camera module often designed to be relatively large, and it is not easy to reduce; the increase of the mechanical back focus often leads to an increase in the height of the camera module. big.

From the above analysis, it can be seen that the height of the color filter and its installation mode of the existing typical camera module is relatively large due to various factors. The trend of development requires. For example, in the application of the mobile phone camera module, one of the main factors limiting the overall thickness of the mobile phone is the height required by the camera module itself.

If the color filter is directly installed on the photosensitive chip, the above problems can be effectively solved, so as to better meet the trend of application products to be thinner and lighter, and at the same time help to reduce the warping of the photosensitive chip. However, there is currently no mature process suitable for mass production of color filters directly mounted on photosensitive chips. The introduction of a new production process may face problems such as insufficient reliability, cumbersome procedures, and substandard optical imaging quality. The economic value of the product declines, and even cannot be put into mass production.

Contents of the invention

The present invention aims to provide a solution capable of overcoming at least one drawback of the prior art.

According to one aspect of the present invention, there is provided a photosensitive component, comprising: a photosensitive chip having a photosensitive area and a non-photosensitive area surrounding the photosensitive area; a color filter located above the photosensitive chip; and an annular support , which is formed of a die-bonding film molding material and located between the photosensitive chip and the color filter; the lower surface of the annular support is in contact with and bonded to the upper surface of the photosensitive chip corresponding to the The position of the non-photosensitive area, and the upper surface of the annular support body contacts and adheres to the lower surface of the color filter.

In one embodiment, the contact area between the support body and the photosensitive chip is smaller than the contact area between the support body and the color filter.

In one embodiment, on a section passing through the axis of the photosensitive chip, the support body is in the shape of an inverted trapezoid.

In one embodiment, the photosensitive chip further includes a welding pad located in the non-photosensitive area, surrounding or partially surrounding the outside of the photosensitive chip; and, in the non-photosensitive area provided with the welding pad, the ring The contact surface of the support body and the photosensitive chip is located between the pad and the photosensitive area.

In one embodiment, the photosensitive component further includes a circuit board, and the lower surface of the photosensitive chip is in contact with and fixed on the circuit board.

In one embodiment, the welding pad is electrically connected to the circuit board through a metal wire.

In one embodiment, the photosensitive component further includes: a molding part, which is formed on the surface of the circuit board through a molding process, surrounds the photosensitive chip, extends toward the photosensitive chip, and contacts the photosensitive chip.

In one embodiment, the photosensitive assembly further includes electronic components formed on the surface of the circuit board, and the molding part covers the metal wires and the electronic components.

In one embodiment, the molding part covers at least a part of the edge region of the color filter and contacts the outer surface of the annular support.

In one embodiment, the molding part has a flat top surface of the molding part formed by mold pressing, and the top surface of the molding part is higher than the upper surface of the color filter.

According to another aspect of the present invention, there is also provided a camera module, which includes the photosensitive assembly described in any one of the foregoing implementation manners.

According to another aspect of the present invention, there is also provided a camera module, which includes the photosensitive assembly described in any one of the foregoing embodiments, and the bottom surface of the lens assembly bears against the top surface of the molded part.

According to another aspect of the present invention, there is also provided a photosensitive component manufacturing method, comprising:

Through the screen printing process, an annular support is formed on the surface of the color filter by die bonding film molding material, wherein the area surrounded by the annular support matches the photosensitive area of the photosensitive chip; the color filter and The photosensitive chip is aligned so that the surface of the annular support corresponds to the non-photosensitive area of the photosensitive chip, wherein the non-photosensitive area surrounds the photosensitive area; the surface of the annular support is close to and contacting the surface of the photosensitive chip; and bonding the annular support to the photosensitive chip.

In one embodiment, the step of forming the annular support includes: covering the surface of the color filter with a screen printing plate, the screen printing plate has a hollow pattern corresponding to the shape of the annular support; coating a paste-like die-bonding film forming material on the printing plate and the color filter and filling the hollow pattern; separating the screen printing plate from the color filter and the annular support; and The die bonding film forming material is pre-cured to form a solid annular support body.

In one embodiment, in the step of forming the annular support, the screen printing plate includes a pattern layer and a screen surface layer; and in the substep of covering the surface of the color filter with the screen printing plate, The pattern layer is in contact with the color filter, the screen surface layer is located on a side facing away from the color filter, and the hollow pattern is located on the pattern layer.

In one embodiment, the coating sub-step includes: coating a paste-like die-bonding film forming material on the screen printing plate and the color filter; and leveling the surface layer of the screen with a scraper.

In one embodiment, in the step of forming the annular support, the hollow pattern is trapezoidal in a cross-sectional view perpendicular to the screen printing plate, and the hollow pattern is located on the surface layer of the screen. The opening area on one side is smaller than the opening area on the other side facing away from the screen surface layer.

In one embodiment, the pre-curing includes: heating or exposing the pasty die-bonding film forming material to increase its hardness to become a rigid dam and reduce its viscosity to a threshold value.

In one embodiment, the step of bonding the annular support to the photosensitive chip includes: bonding the chip on the contact surface between the annular support and the photosensitive chip through high-temperature hot-pressing treatment. melting and restoring viscosity of the film forming material; and permanently curing the die-bonding film forming material on the contact surface of the ring-shaped support and the photosensitive chip, thereby bonding the ring-shaped support to the photosensitive chip.

In one embodiment, the step of permanent curing includes: baking the combination of the photosensitive chip, the annular support and the color filter, so that The contact surface of the die attach film molding material is permanently cured.

In one embodiment, the manufacturing method of the photosensitive assembly further includes: after the step of bonding the annular support to the photosensitive chip, bonding the photosensitive chip, the annular support and the color filter The combination is mounted on a circuit board, wherein the photosensitive chip is mounted on the surface of the circuit board.

In one embodiment, the manufacturing method of the photosensitive component further includes: connecting metal wires between the bonding pads of the photosensitive chip and the circuit board, and installing electronic components on the surface of the circuit board.

In one embodiment, the manufacturing method of the photosensitive component further includes: forming a molding part on the surface of the circuit board through a molding process that surrounds the photosensitive chip and extends toward the photosensitive chip and contacts the photosensitive chip, so The molding part covers the metal wire and the electronic component, covers at least a part of an edge area of the color filter, and contacts an outer surface of the annular support.

In one embodiment, the step of forming the molded part through a molding process further includes: forming a flat top surface of the molded part by mold pressing, and the top surface of the molded part is higher than that of the color filter upper surface.

In one embodiment, the step of forming the annular support includes: forming an array of annular supports on the color filter substrate; and cutting the color filter substrate to obtain a color filter corresponding to a single photosensitive chip and an annular support. combination.

In one embodiment, the manufacturing method of the photosensitive component further includes: arranging a plurality of the photosensitive chips on the substrate to form a photosensitive chip array; The chip array is aligned so that the surface of each annular support body corresponds to the non-photosensitive area of one of the photosensitive chips; the surface of the annular support body approaches and contacts the corresponding photosensitive chip. surface; bonding each of the ring-shaped supports to the corresponding photosensitive chip; and removing the substrate.

In one embodiment, in the step of forming the annular support body, the screen printing plate is firstly separated from the color filter and the annular support body, and then the die-bonding film molding material is Pre-cured to shape it into a solid annular support.

In one embodiment, in the step of forming the annular support, the screen printing board has a separator formed on a surface of the screen printing board that is in contact with the die attach film forming material; and Firstly, the die bonding film forming material is pre-cured to form a solid annular support, and then the screen printing plate is separated from the color filter and the annular support.

According to still another aspect of the present invention, there is also provided a method for manufacturing a camera module, which includes: using the method for manufacturing a photosensitive component described in any one of the preceding embodiments to manufacture a photosensitive component; and assembling the lens component and the photosensitive component in Together, get the camera module.

Compared with the prior art, the present invention has at least one of the following technical effects:

1. The present invention can effectively reduce the height dimension of the module (dimension along the optical axis direction), so as to meet the requirements of full-screen and thinner mobile phones and other electronic devices.

2. The present invention can effectively reduce the length and width of the module (dimensions perpendicular to the optical axis direction), so as to meet the needs of full-screen and thinner mobile phones and other electronic devices.

3. The present invention provides a feasible production process for installing the color filter on the photosensitive chip.

4. The present invention can effectively guarantee the reliability of color filter installation and help to improve the yield rate.

5. The present invention can effectively protect the chip surface and help improve product yield.

6. The present invention can provide a technical solution in which the color filter is directly attached to the surface of the chip through the support body, without additional bonding means.

Description of drawings

Exemplary embodiments are shown in the referenced drawings. The embodiments and drawings disclosed herein are to be regarded as illustrative rather than restrictive.

Fig. 1 shows a typical conventional camera module in the prior art;

FIG. 2 shows a schematic cross-sectional view of a photosensitive assembly 1000 according to an embodiment of the present invention;

FIG. 3 shows a schematic cross-sectional view of a photosensitive assembly 1000 according to another embodiment of the present invention;

FIG. 4 shows a schematic cross-sectional view of a camera module 2000 according to an embodiment of the present invention;

FIG. 5 shows a schematic cross-sectional view of a camera module 2000 according to another embodiment of the present invention;

Figure 6a shows a schematic cross-sectional view of a screen printing plate 8000 in one embodiment of the present invention;

Figure 6b shows a top view of the pattern layer 801 shown in Figure 6a;

FIG. 7a shows a schematic diagram of covering the surface of the color filter substrate 1020 with a screen printing plate 8000;

FIG. 7b shows a schematic diagram of coating a paste-like die bonding film forming material 1030 on the screen printing plate 8000 and the color filter of the color filter substrate 1020;

FIG. 7c shows a schematic diagram of separating the screen printing plate 8000 from the color filter substrate 1020 and the annular support 102;

Figure 7d shows a schematic diagram of forming an annular support 102 on the surface of the color filter 101 by a die bonding film forming material through a screen printing process;

FIG. 8 shows a schematic diagram of cutting the assembly obtained in step 140;

Fig. 9a shows a schematic diagram of making the surface of the annular support 102 approach and contact the surface of the photosensitive chip 103 in one embodiment of the present invention;

Figure 9b shows a schematic diagram of high-temperature autoclaving in one embodiment of the present invention;

FIG. 9 c shows a schematic diagram of baking the combination of the photosensitive chip 103 , the annular support 102 and the color filter 101 in one embodiment of the present invention.

Detailed ways

For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are descriptions of exemplary embodiments of the application only, and are not intended to limit the scope of the application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in this specification, expressions of first, second, etc. are only used to distinguish one feature from another, and do not represent any limitation on the features. Accordingly, a first body discussed hereinafter may also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size and shape of objects have been slightly exaggerated for convenience of illustration. The drawings are examples only and are not strictly drawn to scale.

It should also be understood that the terms "comprises", "comprises", "has", "comprises" and/or "comprising", when used in this specification, means that there are stated features, integers, steps, operations , elements and/or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or combinations thereof. Furthermore, expressions such as "at least one of," when preceding a list of listed features, modify the entire listed feature and do not modify the individual elements of the list. In addition, when describing the embodiments of the present application, the use of "may" means "one or more embodiments of the present application". Also, the word "exemplary" is intended to mean an example or illustration.

As used herein, the terms "substantially", "about", and similar terms are used as terms of approximation, not as terms of degree, and are intended to illustrate what would be recognized by one of ordinary skill in the art, measure Inherent bias in a value or calculated value.

Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It should also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted to have a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless It is expressly so defined herein.

It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

FIG. 2 shows a schematic cross-sectional view of a photosensitive assembly 1000 according to an embodiment of the present invention. Referring to FIG. 2 , the photosensitive assembly 1000 includes: a color filter 101 , an annular support 102 , a photosensitive chip 103 , a circuit board 104 , gold wires 105 and electronic components 107 . Wherein, the photosensitive chip 103 has a photosensitive area 1031 and a non-photosensitive area 1032 surrounding the photosensitive area 1031 . The color filter 101 is located above the photosensitive chip 103 . The annular support body 102 is formed of die bonding film molding material and located between the photosensitive chip 103 and the color filter 101 . The lower surface of the annular support 102 is in contact with and bonded to the position corresponding to the non-photosensitive region 1032 on the upper surface of the photosensitive chip 103, and the upper surface of the annular support 102 is in contact with and bonded to the filter. The lower surface of the color chip 101. Among them, the die-bonding film molding material is the die-bonding film puree. The English name of die bonding film is Die Attach Film, abbreviated as DAF. Existing die attach films are usually attached to the backside of the wafer to attach the die cut from the wafer to other surfaces (such as the surface of a circuit board or the surface of another chip). In the present invention, the supporting body is formed by using some properties of the die bonding film slurry, so as to obtain a photosensitive assembly 1000 suitable for mass production that can make the color filter 101 closer to the surface of the photosensitive chip 103 . The photosensitive chip 103 also includes a welding pad 1033 located in the non-photosensitive region 1032, surrounding or partially surrounding the outside of the photosensitive chip 103. Moreover, in the non-photosensitive region 1032 where the welding pad 1033 is disposed, the contact surface of the annular support 102 and the photosensitive chip 103 is located between the welding pad 1033 and the photosensitive region 1031 . The lower surface of the photosensitive chip 103 is in contact with and fixed on the circuit board 104 . The welding pad 1033 is electrically connected to the circuit board 104 through the gold wire 105 . The gold wire 105 is used to realize the electrical connection between the photosensitive chip 103 and the circuit board 104 . It should be noted that in other embodiments, the gold wires 105 can also be replaced by other metal wires. The "gold wire" process (English name is Wire Bonding) can also be replaced by other methods that can conduct the circuit board and the photosensitive chip, such as the flip chip process (FlipChip). The electronic element 107 may be a capacitive element and/or a resistive element or the like.

In another embodiment, the photosensitive chip 103 may not have the welding pad 1033 . For example, a solder ball array may be provided on the back of the photosensitive chip 103 (ie, the side opposite to the photosensitive surface), and electrically connected to the circuit board 104 through the solder ball array.

The above embodiment can make the color filter 101 closer to the surface of the photosensitive chip 103, and can effectively reduce the height dimension (dimension along the direction of the optical axis) and/or the length and width dimension (dimension perpendicular to the direction of the optical axis) of the module. To meet the needs of full-screen and thinner mobile phones and other electronic devices.

Further, referring to FIG. 1 , in one embodiment, the contact area between the support body and the photosensitive chip 103 is smaller than the contact area between the support body and the color filter 101 . On a section passing through the axis of the photosensitive chip 103 , the support body is in the shape of an inverted trapezoid. On the one hand, the inverted trapezoidal design in this embodiment can effectively avoid or reduce the damage of the shape of the support during the forming process, and can reduce the contamination of the photosensitive chip 103 by the tiny particles formed during the forming process, thereby improving the product yield. On the other hand, the inverted trapezoidal design in this embodiment also helps to reduce the lower surface of the support body, making it easier to accurately align the tiny area between the solder pad 1033 and the photosensitive area 1031, thereby avoiding or reducing the The defective product caused by inaccurate alignment between the color filter 101 and the photosensitive chip 103 also adapts to the current development trend that the non-photosensitive area 1032 of the photosensitive chip 103 is gradually shrinking. Further, the support body can be made of black plastic material, which can reduce the stray light reflected to the surface of the photosensitive chip 103, and at the same time combine the above-mentioned inverted trapezoidal design to further reduce the stray light, thereby improving the imaging quality.

Further, FIG. 3 shows a schematic cross-sectional view of a photosensitive assembly 1000 according to another embodiment of the present invention. On the basis of the embodiment shown in FIG. 2 , the photosensitive assembly 1000 of this embodiment further includes an integrally formed molding part. The molded portion is formed on the surface of the circuit board by a molding process, surrounds the photosensitive chip 103 , extends toward the photosensitive chip 103 and contacts the photosensitive chip 103 . In this embodiment, the molding part 106 covers the metal wire 105 and the electronic component 107 . Moreover, the molded part 106 covers at least a part of the edge region of the color filter 101 and contacts the outer surface of the annular support 102 . The molding part 106 also has a flat top surface of the molding part 106 formed by mold pressing, and the top surface of the molding part 106 is higher than the upper surface of the color filter 101 . In this embodiment, since the color filter 101 is attached to the surface of the photosensitive chip 103, the problem of warpage caused by the integrated molding of the molded part 106 of the chip on the circuit board 104 can be overcome, and the flatness of the chip can be improved, thereby reducing Field curvature of a small optical lens or corresponding camera module.

Further, in other embodiments of the present invention, a corresponding camera module 2000 is also provided, and the camera module 2000 may include the photosensitive component 1000 of any of the foregoing embodiments. FIG. 4 shows a schematic cross-sectional view of a camera module 2000 according to an embodiment of the present invention. The camera module 2000 includes a lens assembly 3000 and a photosensitive assembly 1000 . Wherein, the structure of the photosensitive component 1000 is consistent with the embodiment shown in FIG. 2 , and will not be repeated here. The lens assembly 3000 includes an optical lens 301 and a mirror base 302 . The mirror base 302 is cylindrical, and the optical lens 301 is installed inside the mirror base 302 . The bottom surface of the mirror base 302 is mounted on the circuit board 104 (for example, in the manner of HA or AA). In this embodiment, since the color filter 101 is adhered to the surface of the photosensitive chip 103, the optical lens 301 can be closer to the photosensitive chip 103 under the premise of leaving the same avoidance distance, so the height of the camera module 2000 can be reduced. Moreover, the mirror base 302 can omit the inner boss 6 as shown in FIG. 1 , thereby reducing the height of the mirror base. In another embodiment, the lens assembly 3000 may further include a motor (not shown in FIG. 4 ), and the optical lens 301 is installed inside the carrier of the motor. The motor base is installed (for example, in the manner of HA or AA) on the circuit board 104 . It should be noted that in other embodiments, the motor can also be replaced by other types of optical actuators.

Further, FIG. 5 shows a schematic cross-sectional view of a camera module 2000 according to another embodiment of the present invention. In this embodiment, the camera module 2000 includes a lens assembly 3000 and a photosensitive assembly 1000 , wherein the photosensitive assembly 1000 includes the molding part 106 shown in FIG. 3 . The bottom surface of the lens assembly 3000 bears against the top surface of the molding part 106. In one example, the lens assembly 3000 may include an optical lens 301 and a cylindrical lens support 303 , the bottom surface of the lens support 303 rests against the top surface of the molding part 106 . The molding part 106 is formed on the surface of the circuit board 104 by a molding process, surrounds the photosensitive chip 103 , extends toward the photosensitive chip 103 and contacts the photosensitive chip 103 . In this embodiment, the molding part 106 covers the metal wire 105 . Moreover, the molded part 106 covers at least a part of the edge region of the color filter 101 and contacts the outer surface of the annular support 102 . The molding part 106 also has a flat top surface of the molding part 106 formed by mold pressing, and the top surface of the molding part 106 is higher than the upper surface of the color filter 101 . Further, the photosensitive component 1000 may also include electronic components 107, such as capacitors or resistors. In this embodiment, the molding part 106 also covers the top surface of the electronic component. Under the current production process, the height of the capacitor or resistor is not less than 400um, which is usually greater than the sum of the thicknesses of the photosensitive chip 103 and the color filter 101. Therefore, the minimum height of the top surface of the molding part 106 is mainly affected by the height of the capacitor or resistor. limits. In this embodiment, since the color filter 101 is attached to the surface of the photosensitive chip 103, when the molding part 106 is integrally molded, the pressure head will be pressed against the upper surface of the color filter 101, Therefore, the direct contact between the indenter and the photosensitive chip 103 is avoided. Therefore, this embodiment can overcome the warping problem caused by the integrated molding of the molded part 106 of the chip on the circuit board 104 , improve the flatness of the chip, and reduce the curvature of field. Moreover, since the color filter 101 is adhered to the surface of the photosensitive chip 103 , the lens assembly 3000 can be closer to the photosensitive chip 103 while maintaining the same avoidance distance, so the height of the camera module 2000 can be reduced. In another example, the lens assembly 3000 may include a motor and an optical lens 301 mounted on a carrier of the motor, and the base of the motor is supported on the top surface of the molding part 106 . It should be noted that in other examples, the motor can also be omitted or replaced by other types of optical actuators.

Further, according to an embodiment of the present invention, there is also provided a method for manufacturing a photosensitive assembly 1000, comprising the following steps 100 to 400:

Step 100, forming an annular support 102 (refer to FIG. 7 d ) on the surface of the color filter 101 by a die bonding film forming material through a screen printing process, wherein the area surrounded by the annular support 102 is the same as that of the photosensitive chip 103 The photosensitive area 1031 is matched. Figure 7a-d shows the flow of step 100 in one embodiment of the present invention, referring to Figure 7a-d, step 100 includes sub-steps 110 to 140 as follows:

Step 110 , covering the surface of the color filter 101 with the screen printing plate 8000 . FIG. 7 a shows a schematic diagram of covering the surface of the color filter substrate 1020 with a screen printing plate 8000 . In this embodiment, the color filter substrate 1020 can be cut to obtain the color filter 101 . The screen printing plate 8000 has a hollow pattern 8011 corresponding to the shape of the ring support. Fig. 6a shows a schematic cross-sectional view of a screen printing plate 8000 in one embodiment of the present invention. Wherein, the section is a section perpendicular to the surface of the screen printing plate 8000 . Referring to FIG. 6 a , the screen printing plate 8000 includes a pattern layer 801 and a screen surface layer 802 . Wherein, the pattern layer 801 is in contact with the color filter 101 (the color filter 101 can be obtained after cutting the color filter substrate 1020 in this embodiment), and the screen surface layer 802 is located opposite to the color filter substrate 1020 On one side, the hollow pattern 8011 is located on the pattern layer. In one embodiment, the screen printing plate 8000 may be a stencil printing plate. Fig. 6b shows a top view of the pattern layer 801 shown in Fig. 6a. It can be seen that the hollow pattern 8011 in the pattern layer 801 forms a ring corresponding to the ring support 102 . The screen surface layer 802 has a mesh structure, so the hollow pattern 8011 in the pattern layer 801 will not be covered. For clarity of illustration, the wire mesh surface layer 802 is not shown in Figures 7a-c.

Step 120 , coating the paste-like die bonding film forming material 1030 on the screen printing plate 8000 and the color filter substrate 1020 to fill the hollow pattern 8011 . FIG. 7 b shows a schematic diagram of coating a paste-like die bonding film forming material 1030 on the screen printing plate 8000 and the color filter of the color filter substrate 1020 . In this step, the paste-like die bonding film forming material 1030 can be coated on the screen printing plate 8000 and the color filter substrate 1020 , and then the surface layer of the screen is scraped with a scraper. The scraping operation can remove excess paste-like die-bonding film forming material 1030 , and also helps make the paste-like die-bonding film forming material 1030 fully fill the hollow pattern of the pattern layer.

Step 130 , separating the screen printing plate 8000 from the color filter substrate 1020 and the annular support 102 . FIG. 7 c shows a schematic diagram of separating the screen printing plate 8000 from the color filter substrate 1020 and the annular support 102 . Still referring to FIG. 6 a , in one embodiment, the hollow pattern 8011 is trapezoidal in a cross-sectional view perpendicular to the screen printing plate 8000 , and the hollow pattern 8011 is located on the side of the screen surface layer 8000 The opening area is smaller than the opening area on the other side facing away from the screen surface layer 8000 . In this way, when the screen printing plate 8000 is separated from the color filter substrate 1020 (or color filter 101) and the annular support body 102, due to the draft slope 8010, the separation operation will not damage the pasty chip bonding. The shape of the conjunctiva forming material 1030 also avoids or reduces tiny particles that may contaminate the photosensitive chip 103 during the separation operation, thereby improving product yield.

Step 140 , pre-curing the die bonding film forming material 1030 to form a solid annular support 102 . The pre-curing includes: heating or exposing the pasty die-bonding film molding material 1030 to increase its hardness to become a rigid dam and reduce its viscosity to a threshold.

Further, in one embodiment, the assembly obtained in step 140 is cut to obtain an assembly composed of the color filter 101 and the annular support 102 corresponding to a single photosensitive chip. FIG. 8 shows a schematic diagram of cutting the assembly obtained in step 140 . As shown in FIG. 8 , the color filter substrate 1020 is cut from the back side along the dotted line with a cutter 1090 to obtain an assembly composed of the color filter 101 and the annular support 102 corresponding to a single photosensitive chip.

In another embodiment of the present invention, the sequence of steps 130 and 140 can be replaced with each other, that is, step 140 is performed first, and the die attach film forming material 1030 is pre-cured to form it into a solid state. The ring support body 102. Then in step 130 , the screen printing plate 8000 is separated from the color filter 101 and the annular support 102 . In this embodiment, a layer of isolation film can also be formed by plating, coating or spraying on the surface of the screen printing plate 8000 in contact with the die bonding film forming material 1030, so as to prevent the die bonding from occurring during step 140. The film forming material 1030 sticks to the printing plate, making it inconvenient to perform the step 130 .

In one embodiment, the pre-curing of the die bonding film molding material 1030 is a physical change, and its properties are changed as follows: hardness increases, viscosity decreases, and the higher the hardness, the better to prevent it from collapsing and deforming, and the lower the viscosity, the better To prevent the support body (ie, the dam) from sticking to dust (if the support body sticks to dust, it may contaminate the photosensitive area 1031 of the photosensitive chip 103 in the subsequent process, resulting in defective products). Since the above-mentioned property changes belong to the category of physical changes, they are reversible, that is, under certain conditions (such as high-temperature hot-pressing conditions), the support body can partially melt and recover its viscosity.

After step 140 is completed, step 200 may be performed.

Step 200, align the color filter 101 with the photosensitive chip 103, so that the surface of the annular support 102 corresponds to the non-photosensitive area 1032 of the photosensitive chip 103, wherein the non-photosensitive area 1032 surrounds Around the photosensitive area 1031 . Fig. 9a shows a schematic diagram of aligning the color filter 101 and the photosensitive chip 103 in one embodiment of the present invention. Wherein the color filter 101 is captured and moved by the capturing mechanism 1010 . In one embodiment, multiple photosensitive chips 103 can be arranged on one working substrate 1040 , and multiple groups of color filters 101 can be aligned with the photosensitive chips 103 at the same time, so as to improve production efficiency.

Step 300 , making the surface of the annular support 102 approach and contact the surface of the photosensitive chip 103 . Fig. 9a shows a schematic diagram of making the surface of the annular support 102 approach and contact the surface of the photosensitive chip 103 in one embodiment of the present invention.

Step 400 , bonding the annular support 102 to the photosensitive chip 103 . In one embodiment, step 400 includes sub-steps 410 and 420 .

In step 410 , the die bonding film molding material 1030 located between the color filter 101 and the photosensitive chip 103 is melted and viscous is recovered by high temperature heat pressing treatment. Fig. 9b shows a schematic diagram of high temperature autoclaving in one embodiment of the present invention. Wherein the intake mechanism 1010 can apply pressure downwards to achieve the pressure condition of high temperature autoclaving.

Step 420 , permanently curing the die bonding film molding material located between the color filter 101 and the photosensitive chip 103 , so that the annular support 102 is bonded to the photosensitive chip 103 . Fig. 9c shows a schematic diagram of baking the combination of the photosensitive chip 103, the annular support 102 and the color filter 101 in one embodiment of the present invention. In one embodiment, the sub-step of permanent curing may include: baking the combination of the photosensitive chip 103, the annular support 102 and the color filter 101, so that The die bonding film molding material 1030 on the contact surface between the photosensitive chip 102 and the photosensitive chip 103 is permanently cured. In one embodiment, the permanent curing in this step may be: the die bonding film forming material 1030 undergoes an irreversible reaction under baking for a certain period of time, so that the annular support 102 is permanently hardened and loses its viscosity.

Further, in one embodiment, the manufacturing method of the photosensitive component 1000 further includes:

Step 500, after step 400 is executed, the combination of the photosensitive chip 103, the annular support body 102 and the color filter 101 is installed on the circuit board 104, wherein the photosensitive chip 103 is attached to the circuit board 104 surfaces.

Step 600 , connecting gold wires 105 between the bonding pads 1033 of the photosensitive chip 103 and the circuit board 104 (that is, "gold wire bonding", the English name of this process is Wire Bonding).

Step 607, forming a molding part 106 on the surface of the circuit board 104 through a molding process that surrounds the photosensitive chip 103 and extends toward the photosensitive chip 103 and contacts the photosensitive chip 103. The molding part 106 covers the photosensitive chip 103. The metal wire 105 covers at least a part of the edge region of the color filter 101 and contacts the outer surface of the annular support 102 . In one embodiment, the step of forming the molded part 106 through a molding process may further include: forming a flat top surface of the molded part 106 by mold pressing, and the top surface of the molded part 106 is higher than the The upper surface of the color filter 101.

Further, in one embodiment, the annular support body 102 can be formed on the color filter 101 in batches. In this embodiment, step 100 can be realized by forming an array of annular support bodies 102 on the color filter substrate 1020 and then cutting the color filter substrate 1020 . After the color filter substrate 1020 is cut, a combination of the color filter 101 and the annular support 102 corresponding to a single photosensitive chip 103 can be obtained. For the specific process of forming the ring-shaped support body 102 array on the color filter substrate 1020 , reference may be made to steps 110 to 140 above. In this embodiment, a plurality of hollow patterns corresponding to the plurality of annular support bodies 102 are formed on the screen printing plate 8000 .

In the above embodiments, the combination of the photosensitive chip 103 , the color filter 101 and the annular support 102 can be produced in batches. Wherein, a plurality of photosensitive chips 103 are arranged on the substrate to form an array of photosensitive chips 103 . Aligning the plurality of annular supports 102 formed on the color filter 101 with the photosensitive chip 101 array, so that the surface of each annular support 102 corresponds to one photosensitive chip 103 The non-photosensitive region 1032 of . Then, make the surface of the annular support 102 close to and contact the surface of the corresponding photosensitive chip 103 . Then each of the annular support bodies 102 is bonded to the corresponding photosensitive chip 103 . Finally the substrate is removed.

It should be noted that in other embodiments, the annular support body 102 can also be formed on the color filter 101 one by one. In these embodiments, the color filter substrate 1020 in FIGS. 7a-c can be replaced by the color filter 101.

Further, in one embodiment, there is also provided a method for manufacturing the camera module 2000, which may include: using the photosensitive assembly 1000 manufacturing method in any one of the above embodiments to manufacture the photosensitive assembly 1000; and then combining the lens assembly 3000 and The photosensitive components are assembled together 1000 to obtain a camera module 2000 .

In one embodiment, on a section passing through the axis of the photosensitive chip 103, the height of the support 102 may be about 5-400um. When the section of the support is an inverted trapezoid, the average height of the inverted trapezoid section is The width can be about 50-600um, and this width is slightly smaller than the distance (about 400-1000um) between the bonding pad of the photosensitive chip 103 and the photosensitive area 1031 commonly used in the mobile phone camera module 2000 in the market. However, the current screen printing process can achieve the process precision of making lines with a width of about 100um. Therefore, this embodiment is suitable for mass production of the photosensitive module 1000 and the corresponding camera module 2000 .

Further, in one embodiment, the composition of the die bonding film forming material 1030 includes: an epoxy resin, a curing agent, and a polymer compound that is incompatible with the epoxy resin. Among them, the epoxy resin is, for example, bifunctional epoxy resins such as bisphenol A epoxy resins or bisphenol F epoxy resins, varnish epoxy resins such as novolac epoxy resins, or cresol novolak epoxy resins. Wait. In addition, commonly used resins such as polyfunctional epoxy resins and heterocyclic ring-containing epoxy resins can also be used. The role of the epoxy resin is to exhibit a bonding effect after being cured, and its material selection is not limited to the above materials.

The curing agent can be, for example, polyfunctional phenols, amines, imidazole compounds, acid anhydrides, organic phosphorous compounds and halides of these compounds, polyamides, polysulfides, boron trifluoride, and the like. In the present invention, the function of the curing agent is to cure the epoxy resin, and its material selection is not limited to the above materials.

Examples of incompatible polymer compounds include rubbers such as acrylic copolymers and acrylic rubbers, silicone resins, silicon-modified resins such as silicon-modified polyamide-(acyl)-imides, and the like. In the present invention, the role of the non-miscible polymer compound is to control the colloidal elasticity and fluidity at high temperature, and it is incompatible with the epoxy resin. The selection of its material is not limited to the above-mentioned materials.

In the above embodiments, the color filter can be directly attached to the surface of the chip through the support formed by the die-bonding film forming material, and there is no need for additional bonding means between the support and the color filter and between the support and the photosensitive chip.

The above description is only a preferred embodiment of the present application and an illustration of the applied technical principles. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to the technical solution formed by the specific combination of the above-mentioned technical features, but should also cover the technical solutions made by the above-mentioned technical features without departing from the inventive concept. Other technical solutions formed by any combination of or equivalent features thereof. For example, a technical solution formed by replacing the above-mentioned features with (but not limited to) technical features with similar functions disclosed in this application.

Claims (29)

1. A photosensitive assembly, characterized in that, comprising: a photosensitive chip having a photosensitive area and a non-photosensitive area surrounding the photosensitive area; a color filter located above the photosensitive chip; and an annular support formed of a die bonding film molding material and located between the photosensitive chip and the color filter; the lower surface of the annular support is in contact with and bonded to the corresponding upper surface of the photosensitive chip at the position of the non-photosensitive area, and the upper surface of the annular support is in contact with and adhered to the lower surface of the color filter. 2. The photosensitive assembly according to claim 1, wherein the contact area between the support body and the photosensitive chip is smaller than the contact area between the support body and the color filter. 3 . The photosensitive assembly according to claim 2 , wherein, on a section passing through the axis of the photosensitive chip, the support body is in the shape of an inverted trapezoid. 4 . 4. The photosensitive component according to claim 1, wherein the photosensitive chip further comprises solder pads located in the non-photosensitive region, surrounding or partially surrounding the outside of the photosensitive chip; In the non-photosensitive area of the welding pad, the contact surface of the annular support body and the photosensitive chip is located between the welding pad and the photosensitive area. 5 . The photosensitive assembly according to claim 4 , further comprising a circuit board, and the lower surface of the photosensitive chip is in contact with and fixed on the circuit board. 6. The photosensitive component according to claim 5, wherein the welding pad is electrically connected to the circuit board through a metal wire. 7. The photosensitive assembly according to claim 6, wherein the photosensitive assembly further comprises: The molding part is formed on the surface of the circuit board through a molding process, surrounds the photosensitive chip, extends toward the photosensitive chip, and contacts the photosensitive chip. 8 . The photosensitive assembly according to claim 7 , wherein the photosensitive assembly further comprises electronic components formed on the surface of the circuit board, and the molding part covers the metal wires and the electronic components. 9. The photosensitive assembly according to claim 8, wherein the molding part covers at least a part of the edge region of the color filter and contacts the outer surface of the annular support. 10. The photosensitive assembly according to claim 9, wherein the molded part has a flat top surface of the molded part formed by mold pressing, and the top surface of the molded part is higher than the filter. the top surface of the color chip. 11. A camera module, comprising the photosensitive component according to any one of claims 1-10. 12 . A camera module, characterized by comprising a lens assembly and the photosensitive assembly according to claim 10 , the bottom surface of the lens assembly bears against the top surface of the molded part. 13 . 13. A method for manufacturing a photosensitive component, comprising: Through a screen printing process, an annular support is formed on the surface of the color filter by die bonding film molding material, wherein the area surrounded by the annular support matches the photosensitive area of the photosensitive chip; Aligning the color filter with the photosensitive chip so that the surface of the annular support corresponds to the non-photosensitive area of the photosensitive chip, wherein the non-photosensitive area surrounds the photosensitive area; bringing the surface of the annular support close to and in contact with the surface of the photosensitive chip; and The annular support is bonded to the photosensitive chip. 14. The photosensitive assembly manufacturing method according to claim 13, characterized in that, the step of forming the annular support comprises: Covering the surface of the color filter with a screen printing plate, the screen printing plate has a hollow pattern corresponding to the shape of the annular support; Coating a paste-like die-bonding film forming material on the screen printing plate and the color filter and filling the hollow pattern; separating the screen printing plate from the color filter and the annular support; and The die-bonding film forming material is pre-cured to form a solid annular support body. 15. The method for manufacturing a photosensitive assembly according to claim 14, wherein, in the step of forming an annular support, the screen printing plate includes a pattern layer and a screen surface layer; and In the sub-step of covering the surface of the color filter with a screen printing plate, the pattern layer is in contact with the color filter, the screen surface layer is located on the side facing away from the color filter, and the hollow A pattern is located on the pattern layer. 16. The photosensitive assembly manufacturing method according to claim 15, wherein the coating sub-step comprises: Apply paste-like die attach film molding material on screen printing plates and color filters; and Scrape the surface layer of the screen with a scraper. 17. The method for manufacturing a photosensitive assembly according to claim 15, characterized in that, in the step of forming the annular support, the hollow pattern is trapezoidal in a cross-sectional view perpendicular to the screen printing plate, and The opening area of the hollow pattern on one side of the screen surface layer is smaller than the opening area of the other side facing away from the screen surface layer. 18. The photosensitive assembly manufacturing method according to claim 14, wherein the pre-curing comprises: The paste-like die-bonding film forming material is heated or exposed to increase its hardness to become a rigid dam and decrease its viscosity to a threshold value. 19. The method for manufacturing a photosensitive assembly according to claim 18, wherein the step of bonding the annular support to the photosensitive chip comprises: melting and recovering the viscosity of the die bonding film forming material located on the contact surface of the annular support body and the photosensitive chip through high-temperature hot-pressing treatment; and permanently curing the die bonding film forming material on the contact surface of the annular support and the photosensitive chip, so that the annular support is bonded to the photosensitive chip. 20. The method for manufacturing a photosensitive component according to claim 19, wherein the step of permanent curing comprises: baking the combination of the photosensitive chip, the annular support and the color filter, permanently curing the die bonding film forming material on the contact surface of the annular support body and the photosensitive chip. 21. The photosensitive assembly manufacturing method according to claim 13, further comprising: After the step of bonding the annular support to the photosensitive chip, the combination of the photosensitive chip, the annular support and the color filter is mounted on a circuit board, wherein the photosensitive chip is mounted on the surface of the circuit board. 22. The photosensitive assembly manufacturing method according to claim 21, further comprising: Metal wires are connected between the pads of the photosensitive chip and the circuit board, and electronic components are installed on the surface of the circuit board. 23. The photosensitive assembly manufacturing method according to claim 22, further comprising: A molded part surrounding the photosensitive chip and extending toward the photosensitive chip and contacting the photosensitive chip is formed on the surface of the circuit board through a molding process, the molded part covers the metal wire and the electronic components, Covering at least a part of the edge region of the color filter and contacting the outer surface of the annular support. 24. The photosensitive assembly manufacturing method according to claim 23, characterized in that, the step of forming the molded part through a molding process further comprises: forming a flat top surface of the molded part by mold pressing, and the mold The top surface of the plastic part is higher than the upper surface of the color filter. 25. The method for manufacturing a photosensitive assembly according to any one of claims 13-24, wherein the step of forming the annular support comprises: forming an annular support array on the color filter substrate; and The color filter substrate is cut to obtain a combination of a color filter corresponding to a single photosensitive chip and an annular support. 26. The photosensitive assembly manufacturing method according to any one of claims 13-24, further comprising: Arranging a plurality of said photosensitive chips on a substrate to form a photosensitive chip array; Aligning the plurality of annular supports formed on the color filter with the photosensitive chip array, so that the surface of each annular support corresponds to the non-photosensitive area of one photosensitive chip ; making the surface of the annular support close to and in contact with the surface of the corresponding photosensitive chip; bonding each of the annular supports to the corresponding photosensitive chip; and The substrate is removed. 27. The photosensitive assembly manufacturing method according to claim 14, characterized in that, in the step of forming the annular support, the screen printing plate is first separated from the color filter and the annular support, Then, the die-bonding film molding material is pre-cured to form a solid annular support body. 28. The photosensitive assembly manufacturing method according to claim 15, characterized in that, in the step of forming the annular support body, the screen printing plate has an isolation film formed between the screen printing plate and the The surface contacted by the die-bonding film forming material; and, the die-bonding film forming material is pre-cured to form a solid annular support, and then the screen printing plate is removed from the filter The color chips are separated from the annular support body. 29. A method for manufacturing a camera module, comprising: using the method for manufacturing a photosensitive component according to any one of claims 13-28 to make a photosensitive component; and Assemble the lens assembly and the photosensitive assembly to obtain a camera module.