CN110351946A - A kind of processing technology of the radiating circuit module of power supply adaptor component - Google Patents
A kind of processing technology of the radiating circuit module of power supply adaptor component Download PDFInfo
- Publication number
- CN110351946A CN110351946A CN201910696764.1A CN201910696764A CN110351946A CN 110351946 A CN110351946 A CN 110351946A CN 201910696764 A CN201910696764 A CN 201910696764A CN 110351946 A CN110351946 A CN 110351946A
- Authority
- CN
- China
- Prior art keywords
- aluminum substrate
- circuit module
- processing technology
- radiating circuit
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005516 engineering process Methods 0.000 title claims abstract description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 76
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 72
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000011889 copper foil Substances 0.000 claims abstract description 15
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 238000005476 soldering Methods 0.000 claims abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910000976 Electrical steel Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of processing technology of the radiating circuit module of power supply adaptor component, processing technology erode the copper foil for specifying region on aluminum substrate, obtain the aluminum substrate with copper foil wired circuit the following steps are included: a, take raw material aluminum substrate；B, the aluminum substrate with copper foil wired circuit is painted into ink layer, PCB and specified silk-screen picture and text, it is then tin plating to the pad on aluminum substrate；C, aluminum substrate mechanical stamping is gone out into necessary plate hole and cuts board slot；D, component is mounted on the aluminum substrate processed with the mode of SMT, the aluminum substrate for posting component is then crossed into Reflow Soldering；E, the aluminum substrate that component is welded is cut into several pieces of platelets by rule, obtains finished product radiating circuit module.The processing technology of radiating circuit module of the invention has the advantage that the mode of 1, batch-automated processing improves the efficiency of processing, saves plenty of time cost, 2, save cost of labor, directly enhance production efficiency and economic benefit.
Description
Technical field
The present invention relates to a kind of power supply adaptor, in particular to a kind of radiating circuit module of power supply adaptor component
Processing technology.
Background technique
When the heater elements such as the transistor of power supply adaptor currently on the market and heat dissipation device combination are processed, need to carry out by
The auxiliary materials such as the effective screw of crystal, nut lock the elements such as transistor on a heat sink, need by " to elements such as transistors and dissipating
Thermal grease is smeared between hot device ", processes such as " screwing, on a heat sink by the elements such as transistor lock ", in order to solve screw worked itself loose
The drawbacks such as dynamic will also add " point screw glue is fixed " etc. and reinforce process, these process the time it takes are long, and need
A large amount of worker goes to participate in.
Summary of the invention
The purpose of the present invention is intended to provide a kind of high production efficiency, saves cost, practical power supply adaptor member device
The processing technology of the radiating circuit module of part, to overcome shortcoming in the prior art.
By a kind of processing technology of the radiating circuit module of power supply adaptor component of this purpose design, the heat dissipation electricity
Road module includes fixed aluminum substrate on circuit boards；It is characterized by: processing technology the following steps are included:
A, raw material aluminum substrate is taken, the copper foil for specifying region on aluminum substrate is eroded, obtains with copper foil wired circuit
Aluminum substrate；
B, the aluminum substrate with copper foil wired circuit is painted into ink layer, PCB and specified silk-screen picture and text, then gives aluminium
Pad on substrate is tin plating；
C, aluminum substrate mechanical stamping is gone out into necessary plate hole and cuts board slot；
D, component is mounted on the aluminum substrate processed with the mode of SMT, then will posts the aluminum substrate of component
Cross Reflow Soldering；
E, the aluminum substrate that component is welded is cut into several pieces of platelets by rule, obtains finished product radiating circuit module.
The aluminum substrate includes ink layer, circuit layer, insulating layer and metal layer, and ink layer is located at the surface, simultaneously of aluminum substrate
Circuit layer is covered, metal layer is located at the bottom surface of aluminum substrate, and insulating layer is between circuit layer and metal layer.
The material of the circuit layer is copper foil, and the material of metal layer is aluminium, stainless steel, copper or silicon steel.
The component includes transistor, rectifier diode and patch contact pin, transistor, rectifier diode and patch contact pin
On the pad for being welded on aluminum substrate by way of SMT and Reflow Soldering.
The aluminum substrate is fixed on circuit boards by patch contact pin.
Aluminum substrate in step e is longitudinally cutting at several block-shaped platelets for rectangle by straight line transverse direction, straight line.
The processing technology of radiating circuit module of the invention and traditional power supply adaptor transistor heat sinks processing technology
Compare, have the advantage that and only need the good aluminum substrate of batch machining, then SMT patch and cross Reflow Soldering, finally by rule cutting
Platelet, finished product radiating circuit module that you can get it, the mode of batch-automated processing substantially increase the efficiency of processing, save big
Time cost is measured, while saving cost of labor, directly enhances production efficiency and economic benefit.This radiating circuit module due to
After excessive erosion is processed, there is the heat sinking function of the circuit connection function, radiator that are equal to common pcb board, and there is heat dissipation system
The high feature of number.Patch contact pin on aluminum substrate plays radiating circuit module fixed piece on earpiece, convenient with this other addition
The mode of the patch pin of welding adds radiating module circuit module pin, and processing the raw material of aluminum substrate can be achieved straight line cross
To, longitudinally cutting rectangular shape, the difficulty of processing of aluminum substrate raw material is reduced, and not extra scrap material
It generates, has saved the cost of raw material.
Detailed description of the invention
Fig. 1 is the overall structure diagram of radiating circuit module in one embodiment of the invention.
Fig. 2 is the level schematic diagram of aluminum substrate in one embodiment of the invention.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and embodiments.
Referring to Fig. 1-Fig. 2, the processing technology of the radiating circuit module of this power supply adaptor component, the radiating circuit mould
Block includes fixed aluminum substrate 2 on the circuit card 1；It is characterized by: processing technology the following steps are included:
A, raw material aluminum substrate 2 is taken, according to the documentation requirements of PCB circuit layout card, erodes and specifies region on aluminum substrate 2
Copper foil, obtain the aluminum substrate 2 with copper foil wired circuit；
B, according to the needs of PCB associated documents, by the aluminum substrate 2 with copper foil wired circuit paint ink layer, PCB and
Specified silk-screen picture and text, it is then tin plating to the pad on aluminum substrate 2；
C, the mechanical stamping of aluminum substrate 2 is gone out into necessary plate hole (or mold molding plate hole) and cuts board slot (so as to subsequent
It is processed into the finished product aluminum substrate of minimum unit)；
D, component is mounted on the aluminum substrate 2 processed with the mode of SMT, then will posts the aluminum substrate of component
2 cross Reflow Soldering；
E, the aluminum substrate 2 that component is welded is cut into several pieces of platelets by rule, obtains finished product radiating circuit module,
Then radiating circuit module is fixed on the circuit card 1 by patch contact pin 5.
Furtherly, aluminum substrate 2 includes ink layer 2.1, circuit layer 2.2, insulating layer 2.3 and metal layer 2.4, ink layer
2.1 are located at the surface of aluminum substrate 2 and cover circuit layer 2.2, and metal layer 2.4 is located at the bottom surface of aluminum substrate 2, and insulating layer 2.3
Between circuit layer 2.2 and metal layer 2.4.
Furtherly, the material of circuit layer 2.2 is copper foil, and the material of metal layer 2.4 is aluminium, stainless steel, copper or silicon steel, excellent
Select aluminum material.
Furtherly, component includes the elements such as transistor 3, rectifier diode 4 and patch contact pin 5, wherein transistor 3
It is heater element with rectifier diode 4, transistor 3, rectifier diode 4 and patch contact pin 5 pass through SMT and the side of Reflow Soldering
Formula is welded on the pad of aluminum substrate 2, and transistor 3 is iron tube sealing, convenient for being welded on aluminum substrate 2.
Furtherly, aluminum substrate 2 is fixed on the circuit card 1 by patch contact pin 5.
Furtherly, the aluminum substrate 2 in step e is lateral by straight line, straight line is longitudinally cutting at several block-shaped for rectangle
Platelet.
Furtherly, compared with traditional radiator processing technology, the radiating circuit module of this power supply adaptor component
Processing technology have the advantage that
1, the module produced using this novel processing technology is used as carrier by simple rectangular shape aluminum substrate 2,
After aluminum substrate 2 is processed according to the corrosion of circuit design condition, by the elements such as transistor 3 and the SMT add-back fluid welding of patch contact pin 5
Mode is soldered to 2 pad corresponding position of aluminum substrate, becomes the radiating circuit module that can be used.This circuit module is due to by rotten
After erosion processing, there is the heat sinking function of the circuit connection function, radiator that are equal to common pcb board, and have coefficient of heat transfer high
Feature；
2, compared with traditional power supply adaptor transistor heat sinks processing technology, this processing technology, which also has, facilitates production
The advantages of Shi Jinhang is processed: it when the heater elements such as traditional transistor 3 and heat dissipation device combination are processed, carries out with screw, spiral shell
The auxiliary materials such as mother on a heat sink, need the equal elements lock of transistor 3 by " smearing between the elements such as transistor 3 and radiator
The processes such as thermal grease ", " screwing, on a heat sink by the equal elements lock of transistor 3 ", in order to solve the drawbacks such as loosened screw, also
It adds " point screw glue is fixed " etc. and reinforces process, and this novel process only needs the good aluminum substrate 2 of batch machining, then SMT patch
Piece substantially increases the effect of processing with Reflow Soldering, finished product radiating circuit module that you can get it, the mode of batch-automated processing is crossed
Rate saves plenty of time cost, while saving cost of labor, directly enhances production efficiency and economic benefit；
3, the design of patch contact pin 5: it is one of key Design point of transistor radiating circuit module processing technology, is welded on
On 2 pad of aluminum substrate, for fixing radiating circuit module in circuit board 1, these patch contact pins 5 are also 2 circuit mould of aluminum substrate
The input/output interface of the electrical connection of block.The effect and advantage of this design point: playing radiating circuit module fixed piece on earpiece,
Radiating module circuit module pin is added in such a way that this other addition facilitates the patch pin 5 of welding, makes the original of aluminum substrate 2
Material, which is processed, can be achieved straight line transverse direction, longitudinally cutting rectangular shape, reduce the difficulty of processing of aluminum substrate raw material, and
There is no the generation of extra scrap material, has saved the cost of raw material.
Above-mentioned is preferred embodiment of the invention, and basic principles and main features and the present invention of the invention have been shown and described
The advantages of.Those skilled in the art should be recognized that the present invention is not limited to the above embodiments, above embodiments and description
Described in merely illustrate the principles of the invention, without departing from the spirit and scope of the present invention the present invention also have it is various
Changes and improvements, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by institute
Attached the spirit and scope of the invention define.
Claims (6)
1. a kind of processing technology of the radiating circuit module of power supply adaptor component, the radiating circuit module includes being fixed on
Aluminum substrate (2) on circuit board (1)；It is characterized by: processing technology the following steps are included:
A, raw material aluminum substrate (2) are taken, the copper foil for specifying region on aluminum substrate (2) is eroded, obtains with copper foil wired circuit
Aluminum substrate (2)；
B, the aluminum substrate (2) with copper foil wired circuit is painted into ink layer, PCB and specified silk-screen picture and text, then gives aluminium
Pad on substrate (2) is tin plating；
C, aluminum substrate (2) mechanical stamping is gone out into necessary plate hole and cuts board slot；
D, component is mounted on the mode of SMT on the aluminum substrate (2) processed, then will posts the aluminum substrate of component
(2) Reflow Soldering is crossed；
E, the aluminum substrate (2) that component is welded is cut into several pieces of platelets by rule, obtains finished product radiating circuit module.
2. the processing technology of the radiating circuit module of power supply adaptor component according to claim 1, it is characterised in that: institute
Stating aluminum substrate (2) includes ink layer (2.1), circuit layer (2.2), insulating layer (2.3) and metal layer (2.4), ink layer (2.1) position
In aluminum substrate (2) surface and circuit layer (2.2) are covered, metal layer (2.4) is located at the bottom surface of aluminum substrate (2), insulating layer
(2.3) between circuit layer (2.2) and metal layer (2.4).
3. the processing technology of the radiating circuit module of power supply adaptor component according to claim 2, it is characterised in that: institute
The material for stating the circuit layer (2.2) is copper foil, and the material of metal layer (2.4) is aluminium, stainless steel, copper or silicon steel.
4. the processing technology of the radiating circuit module of power supply adaptor component according to claim 1, it is characterised in that: institute
Stating component includes transistor (3), rectifier diode (4) and patch contact pin (5), transistor (3), rectifier diode (4) and patch
Piece contact pin (5) is welded on the pad of aluminum substrate (2) by way of SMT and Reflow Soldering.
5. the processing technology of the radiating circuit module of power supply adaptor component according to claim 4, it is characterised in that: institute
Aluminum substrate (2) are stated to be fixed on circuit board (1) by patch contact pin (5).
6. the processing technology of the radiating circuit module of power supply adaptor component according to claim 1, it is characterised in that: step
Suddenly the aluminum substrate (2) in e is lateral by straight line, straight line is longitudinally cutting at several block-shaped platelets for rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910696764.1A CN110351946A (en) | 2019-07-30 | 2019-07-30 | A kind of processing technology of the radiating circuit module of power supply adaptor component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910696764.1A CN110351946A (en) | 2019-07-30 | 2019-07-30 | A kind of processing technology of the radiating circuit module of power supply adaptor component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110351946A true CN110351946A (en) | 2019-10-18 |
Family
ID=68179125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910696764.1A Pending CN110351946A (en) | 2019-07-30 | 2019-07-30 | A kind of processing technology of the radiating circuit module of power supply adaptor component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110351946A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1226129A (en) * | 1997-12-24 | 1999-08-18 | 株式会社电装 | Electronic circuit apparatus and method for assembling the same |
| CN201854538U (en) * | 2010-10-20 | 2011-06-01 | 重庆迈能汽车零部件有限公司 | Heat dissipation device for direct plug-in type welding large power element |
| CN106659038A (en) * | 2016-11-13 | 2017-05-10 | 刘军 | Power controller based on die-casting mould structure |
| CN107072048A (en) * | 2017-03-24 | 2017-08-18 | 安徽林驰电子有限公司 | A kind of production technology optimization method of single-sided aluminum-base plate |
| CN107278060A (en) * | 2017-05-24 | 2017-10-20 | 惠州市金百泽电路科技有限公司 | A kind of preparation method for the aluminum-based circuit board protected with aluminium base face |
-
2019
- 2019-07-30 CN CN201910696764.1A patent/CN110351946A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1226129A (en) * | 1997-12-24 | 1999-08-18 | 株式会社电装 | Electronic circuit apparatus and method for assembling the same |
| CN201854538U (en) * | 2010-10-20 | 2011-06-01 | 重庆迈能汽车零部件有限公司 | Heat dissipation device for direct plug-in type welding large power element |
| CN106659038A (en) * | 2016-11-13 | 2017-05-10 | 刘军 | Power controller based on die-casting mould structure |
| CN107072048A (en) * | 2017-03-24 | 2017-08-18 | 安徽林驰电子有限公司 | A kind of production technology optimization method of single-sided aluminum-base plate |
| CN107278060A (en) * | 2017-05-24 | 2017-10-20 | 惠州市金百泽电路科技有限公司 | A kind of preparation method for the aluminum-based circuit board protected with aluminium base face |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191018 |
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| RJ01 | Rejection of invention patent application after publication |