CN110346414B - A humidity sensor based on substrate-integrated waveguide re-entrant resonant cavity - Google Patents
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Abstract
A humidity sensor based on a substrate integrated waveguide reentrant resonant cavity comprises the substrate integrated waveguide reentrant resonant cavity and a coplanar waveguide feeder line. The reentrant resonant cavity is formed by longitudinally superposing four dielectric substrates, and a plurality of metalized through holes are etched in the middle dielectric layer of each dielectric substrate and are uniformly distributed on the periphery of the resonant cavity and two sides of the feeder line. A fan-shaped groove is etched in the middle medium layer of the second medium substrate and the middle medium layer of the third medium substrate, and meanwhile an L-shaped strip groove is etched in the bottom metal layer of the second medium substrate and the top metal layer of the third medium substrate. The invention applies the folding technology to the substrate integrated waveguide reentrant resonant cavity, greatly reduces the relative size of the resonant cavity while ensuring the high quality factor of the resonant cavity, and simultaneously introduces the sensing area at the strong induced electric field of the resonant cavity to excite the strong interaction between the induced electric field in the resonant cavity and the humid air medium, thereby having compact structure and easy processing and integration.
Description
Technical Field
The invention belongs to the field of sensors, and particularly relates to a microwave passive sensor suitable for detecting air relative humidity.
Background
Humidity is an important index in environmental quality monitoring, and monitoring and controlling humidity are very important in many application scenarios, for example, the relative humidity of air in a greenhouse will directly affect the growth and health of crops. It is desirable to control the ambient relative humidity at an appropriate level to retard spoilage of food when stored. Other fields such as material handling, machine manufacturing, large equipment operation, etc. all have high requirements on environmental humidity. Therefore, the research and development of the high-performance humidity sensor have high practical value in many fields.
Traditional humidity sensors such as resistive sensors, capacitive sensors and piezoelectric sensors all work at lower frequencies and cannot be directly applied to modern radio frequency sensing detection systems. In order to solve the problem, scientific research personnel have recently proposed the design scheme of the microwave passive humidity sensor. Microwave passive humidity sensors are favored for their low cost, high design flexibility, ease of integration with rf sensing detection systems, and other advantages. However, the microwave passive humidity sensing and monitoring devices reported at present still have the problems of large relative size, low sensing sensitivity, low quality factor and the like, and the practical application range of the devices is severely limited.
Disclosure of Invention
The invention provides a humidity sensor based on a substrate integrated waveguide reentrant resonant cavity, aiming at applying a folding technology to the substrate integrated waveguide reentrant resonant cavity, ensuring high quality factor and greatly reducing the relative volume of the resonant cavity so as to solve the defects of large volume, low quality factor and the like of the traditional microwave passive sensor. On the other hand, a sensing area is introduced at the position of a strong induction electric field in the resonant cavity to excite the high-strength interaction between the induction electric field of the resonant cavity and a wet air medium, so that the high-sensitivity and high-resolution detection of the relative humidity of air is realized, and the urgent requirements of various subject fields on high-performance air humidity sensors are met.
The technical scheme of the invention is as follows:
a humidity sensor based on a substrate integrated waveguide reentrant resonant cavity comprises a quarter-circular reentrant resonant cavity and a section of conical coplanar waveguide feed line with characteristic impedance of 50 omega.
The resonant cavity comprises a first dielectric substrate, a second dielectric substrate, a third dielectric substrate and a fourth dielectric substrate which are longitudinally overlapped. The first dielectric substrate, the second dielectric substrate, the third dielectric substrate and the fourth dielectric substrate all comprise a three-layer structure of a top metal layer, a middle dielectric layer and a bottom metal layer.
And fan-shaped grooves with the same area are etched in the bottom metal layer of the first dielectric substrate, the top metal layer of the second dielectric substrate, the bottom metal layer of the third dielectric substrate and the top metal layer of the fourth dielectric substrate.
And a fan-shaped metal is left on the bottom metal layer of the first dielectric substrate and the top metal layer of the fourth dielectric substrate in the fan-shaped groove area and is not etched, the radius of the fan-shaped metal is smaller than that of the fan-shaped groove, and the angles of the fan-shaped metal are the same. The middle dielectric layer of the first dielectric substrate and the middle dielectric layer of the fourth dielectric substrate are etched with a plurality of metalized through holes which are periodically arranged at positions corresponding to the fan-shaped metal area, and the fan-shaped metal and the metalized through holes jointly form a capacitor column structure of the resonant cavity.
And fan-shaped grooves are etched in the middle medium layers of the second medium substrate and the third medium substrate and are communicated with the fan-shaped grooves on the respective metal layers, so that a sensing area is formed, and the strong interaction between the resonant cavity induced electric field and the humid air medium is realized.
The middle dielectric layer of the first dielectric substrate and the fourth dielectric substrate is etched with a plurality of non-metallized air through holes which are uniformly distributed on two sides of the fan-shaped metal and communicated with the cavity of the resonant cavity, and the purpose is to enable wet air in the external environment to enter the resonant cavity.
The bottom metal layer of the second dielectric substrate and the top metal layer of the third dielectric substrate are etched with a strip groove at two sides corresponding to the fan-shaped groove, and the purpose is to allow electromagnetic waves to be transmitted from the first dielectric substrate to the fourth dielectric substrate, so that a folding electric field distribution mode is realized.
The four dielectric substrates are longitudinally overlapped, the fan-shaped grooves of the first dielectric substrate and the second dielectric substrate are aligned up and down, and the fan-shaped grooves of the third dielectric substrate and the fourth dielectric substrate are aligned up and down to form a fan-shaped resonant cavity.
The coplanar waveguide feeder is located on the top metal layer of the first dielectric substrate and is fed from the middle position of the sector arc length of the cavity of the resonant cavity, and the coplanar waveguide feeder is used for exciting the resonant cavity.
The middle medium layers of the first medium substrate, the second medium substrate, the third medium substrate and the fourth medium substrate are etched with a plurality of metallized through holes which are uniformly distributed on the periphery of the cavity of the resonant cavity and on two sides of the coplanar waveguide feeder line, and the metallized through holes are used for equivalent metal boundaries of the resonant cavity.
The beneficial effects of the invention are as follows:
1. the invention applies the folding technology to the substrate integrated waveguide reentrant resonant cavity, namely the resonant cavity is designed to be formed by a circular reentrant resonant cavity along a half mould of a diameter folding structure, the longitudinal superposition alignment precision is ensured within the structural processing precision range, the structural device characteristics are basically consistent with the non-folding original device characteristics (resonance frequency point and Q value), thus greatly reducing the relative size of the resonant cavity, solving the defect of large volume of the existing microwave passive sensing resonant structure, meeting the development requirements of miniaturization and high integration of a modern radio frequency sensing detection system and having wider application range.
2. The invention utilizes the advantage of high concentration of the resonant cavity induced electric field, introduces the sector sensing area in the resonant cavity, and introduces the humid air in the environment into the sensing area in the resonant cavity through the air through hole, thereby realizing the high-strength interaction between the humid air medium and the resonant cavity induced electric field, and obviously improving the sensing sensitivity of the sensor.
3. The folding substrate integrated waveguide reentry type resonant cavity humidity sensor provided by the invention is of a closed structure, electromagnetic energy is well limited in the resonant cavity and cannot be radiated to a free space, so that the characteristic of high quality factor of the resonant cavity is ensured, and the sensing detection resolution of the sensor is improved.
4. The folded substrate integrated waveguide reentrant resonant cavity structure provided by the invention has resonant frequency points with adjustable height, can realize flexible adjustment of working frequency points by simply adjusting and optimizing key structure parameters in the resonant cavity under the condition of not changing the overall size of the resonant cavity, and has wider application range.
Drawings
FIG. 1 is a schematic cross-sectional view of a humidity sensor in accordance with the present invention;
FIG. 2 is a schematic perspective exploded view of a humidity sensor in accordance with the present invention;
FIG. 3(a) is a schematic front view of a first dielectric substrate of the humidity sensor of the present invention;
FIG. 3(b) is a schematic backside view of a first dielectric substrate of the humidity sensor of the present invention;
FIG. 4(a) is a schematic front view of a second dielectric substrate of the humidity sensor of the present invention;
FIG. 4(b) is a schematic backside view of a second dielectric substrate of the humidity sensor of the present invention;
FIG. 5(a) is a schematic front view of a third dielectric substrate of the humidity sensor of the present invention;
FIG. 5(b) is a schematic backside view of a third dielectric substrate of the humidity sensor of the present invention;
FIG. 6(a) is a schematic front view of a fourth dielectric substrate of the humidity sensor of the present invention;
FIG. 6(b) is a schematic backside view of a fourth dielectric substrate of the humidity sensor of the present invention;
FIG. 7 is a graph of the transmission response of the humidity sensor of the present invention under different relative air humidity conditions;
Detailed Description
For better illustration of the design process and purposes, the present invention is further described below with reference to the following examples and the accompanying drawings:
as shown in fig. 1 to fig. 6(a) and fig. 6(b), the sensor based on the substrate integrated waveguide re-entrant resonant cavity proposed by the present invention comprises a substrate integrated waveguide re-entrant resonant cavity (1) and a coplanar waveguide feed line (2) with a characteristic impedance of 50 Ω.
The resonant cavity (1) comprises a first dielectric substrate (1-1), a second dielectric substrate (1-2), a third dielectric substrate (1-3) and a fourth dielectric substrate (1-4), the four substrates are longitudinally overlapped, a resonant cavity body is formed in the middle, and the shape of the resonant cavity body is a quarter circle. The first dielectric substrate (1-1), the second dielectric substrate (1-2), the third dielectric substrate (1-3) and the fourth dielectric substrate (1-4) respectively comprise a top metal layer, a middle dielectric layer and a bottom metal layer.
The materials of the intermediate medium layers of the first medium substrate (1-1), the second medium substrate (1-2), the third medium substrate (1-3) and the fourth medium substrate (1-4) are the same, in the embodiment, the material is F4B-2, the relative dielectric constant is 2.65, the relative magnetic permeability is 1, and the loss tangent angle is 0.001.
The overall length and width of the first dielectric substrate (1-1), the second dielectric substrate (1-2), the third dielectric substrate (1-3) and the fourth dielectric substrate (1-4) are all the same, and preferably, the length and width are both 45 mm.
Each layer of the first dielectric substrate (1-1) and the fourth dielectric substrate (1-4) has the same thickness, and preferably, the total thickness thereof is 2 mm. Each layer of the second dielectric substrate (1-2) and the third dielectric substrate (1-3) has the same thickness, and preferably, the total thickness is 0.5 mm.
The coplanar waveguide feeder (2) is positioned on the top metal layer of the first dielectric substrate (1-1) and is fed from the middle position of the sector arc length of the cavity of the resonant cavity (1) for realizing the excitation of the resonant cavity. In order to meet the requirement of input port impedance matching and achieve good excitation effect, the feeder adopts a conical gradual change structure, and preferably, the total length of the feeder is 18.5mm, the width of the outer side of the feeder is 2.77mm, and the width of the inner side of the feeder is 2 mm.
A plurality of metalized through holes (1-5) are etched in the middle medium layers of the first medium substrate (1-1), the second medium substrate (1-2), the third medium substrate (1-3) and the fourth medium substrate (1-4) and are uniformly distributed on the periphery of a cavity of the resonant cavity and two sides of the feeder line so as to be equivalent to the metal boundary of the resonant cavity, preferably, the diameter of each metalized through hole (1-5) is 1mm, and the distance between every two adjacent through holes is 1.4 mm.
In order to form a resonant cavity, fan-shaped grooves (1-6) with the same area are etched in the bottom metal layer of the first dielectric substrate (1-1), the top metal layer of the second dielectric substrate (1-2), the bottom metal layer of the third dielectric substrate (1-3) and the top metal layer of the fourth dielectric substrate (1-4), the fan-shaped grooves (1-6) are in the shape of a quarter circle, preferably, the area of the fan-shaped grooves is 141.61 pi mm2. The fan-shaped grooves (1-6) of the first dielectric substrate (1-1) and the second dielectric substrate (1-2) are aligned up and down, and the third dielectric substrate (1-3) and the second dielectric substrate (1-2) are aligned up and downThe fan-shaped grooves (1-6) of the fourth dielectric substrate (1-4) are aligned up and down to form a fan-shaped cavity of the resonant cavity (1). The cavity of the whole resonant cavity (1) is formed by a circular reentrant resonant cavity along a half mode of a diameter folding structure.
Fan-shaped grooves (1-6) are etched on the top metal layer of the second dielectric substrate (1-2) and the bottom metal layer of the third dielectric substrate (1-3), the top metal layer and the bottom metal layer are etched through, a fan-shaped metal (1-1-1) is left on the bottom metal layer of the first dielectric substrate (1-1) and the top metal layer of the fourth dielectric substrate (1-4) in the area of the fan-shaped grooves (1-6) and is not etched, the radius of the fan-shaped metal (1-1-1) is smaller than that of the fan-shaped grooves (1-6), and the angles are the same. A plurality of metalized through holes (1-1-2) which are arranged periodically are etched in the middle dielectric layer of the first dielectric substrate (1-1) and the fourth dielectric substrate (1-4) at the position corresponding to the sector metal (1-1-) area, and the sector metal (1-1-1) and the metalized through holes (1-1-2) jointly form a capacitor column structure of a resonant cavity. Preferably, the diameter of the metalized through holes (1-1-2) is 1.6mm, and the distance between two adjacent through holes is 3.31 mm.
The bottom of the middle medium layer of the second medium substrate (1-2) and the top of the middle medium layer of the third medium substrate (1-3) are etched with a fan-shaped groove (1-2-1) which is respectively communicated with the fan-shaped grooves (1-6) etched by respective metal layers, and the areas of the fan-shaped grooves are as large as one another, so that a sensing area is formed, strong interaction between a humid air medium and a resonant cavity induction electric field is realized, high sensitivity sensing on air relative humidity is further realized, the working frequency point and the sensing sensitivity of the resonant cavity can be flexibly adjusted by adjusting the depth of the fan-shaped groove, and in the embodiment, the depth is 0.3 mm. The etching depth of the fan-shaped groove cannot exceed the thickness of the middle dielectric layer.
The middle medium layer of the first medium substrate (1-1) and the fourth medium substrate (1-4) is etched with a plurality of non-metalized air through holes (1-1-3) which are uniformly distributed on two sides of the fan-shaped metal (1-1-1), and the purpose is to ensure that wet air in the external environment can enter a sensing area (1-2-1) of the resonant cavity, preferably, the diameter of the non-metalized air through holes (1-1-3) is 0.5mm, and the distance between two adjacent through holes is 1.25 mm.
The bottom metal layer of the second dielectric substrate (1-2) and the top metal layer of the third dielectric substrate (1-3) are etched with a strip groove (1-2-2) corresponding to the two sides of the fan-shaped groove (1-6), and the strip grooves on the two sides are connected into an L shape, so that electromagnetic waves are allowed to be transmitted from the first dielectric substrate (1-1) to the fourth dielectric substrate (1-4), and further an electric field distribution mode in a folding form is realized. After the four layers of substrates are overlapped, the L-shaped long grooves (1-2-2) of the second dielectric substrate (1-2) and the L-shaped long grooves (1-2-2) of the third dielectric substrate (1-3) are aligned up and down, and the four substrates are aligned in the longitudinal direction. The resonant cavity can obtain the same resonance performance as an unfolded reentrant resonant cavity by properly selecting the size parameters of the strip grooves (1-2-2), and preferably, the length of the strip grooves (1-2-2) is 23.8mm, and the width of the strip grooves is 0.9 mm.
The working principle of the substrate integrated waveguide reentrant resonant cavity humidity sensor provided by the invention is a cavity perturbation method. When the sensor is exposed in a humidity environment, a humid air medium enters the resonant cavity through a non-metalized air through hole (1-1-3) etched in a medium layer between the first medium substrate (1-1) and the fourth medium substrate (1-4) and is gathered in a preset sensing area (1-2-1), and because the area is a highly concentrated area of an induced electric field of the resonant cavity, the humid air medium and the induced electric field excited by the resonant cavity have strong interaction, so that the resonant frequency point of the resonant cavity is shifted, and the offset is determined by the relative humidity of air.
Fig. 7 shows the transmission response curves of the substrate integrated waveguide reentrant resonant cavity humidity sensor provided by the invention under different relative humidity conditions. It can be seen that when the air humidity of the external environment is increased from 30% to 80%, the resonant frequency point of the resonant cavity is monotonically decreased from 2.16279GHz to 2.15601 GHz. Therefore, the relative air humidity in the environment can be reversely deduced by measuring the resonance frequency point of the resonant cavity.
The invention applies the folding technology to the substrate integrated waveguide reentrant resonant cavity, greatly reduces the relative size of the resonant cavity while ensuring the high quality factor of the resonant cavity, and simultaneously introduces the sensing area at the strong induced electric field of the resonant cavity to excite the strong interaction between the induced electric field and the humid air medium in the resonant cavity, thereby obtaining the high-sensitivity high-resolution humidity sensor with compact structure and easy processing and integration.
The present invention is not limited to the above-described embodiments, and various modifications and variations of the invention are intended to be included within the scope of the claims and the equivalent technology of the present invention if they do not depart from the spirit and scope of the present invention.
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| CN112684259B (en) * | 2020-12-04 | 2022-04-22 | 西南大学 | Reentrant cavity sensor for measuring dielectric constant and magnetic conductivity of magnetic medium material |
| CN112798870B (en) * | 2020-12-09 | 2022-04-19 | 西南大学 | Microwave differential sensor based on substrate-integrated waveguide reentrant cavity and microfluidic technology |
| CN113091941A (en) * | 2021-04-30 | 2021-07-09 | 杭州电子科技大学 | Microfluidic temperature sensing module and temperature characterization method thereof |
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| CN113670994B (en) * | 2021-08-26 | 2024-12-03 | 南京高华科技股份有限公司 | MEMS humidity sensor based on phase detection principle and preparation method |
| CN114441558B (en) * | 2022-01-30 | 2024-03-15 | 西南大学 | High-resolution radio frequency tag sensor based on microwave negative resistance circuit compensation technology |
| CN114497960B (en) * | 2022-02-22 | 2023-01-31 | 西南大学 | Double-frequency point radio frequency tag sensor based on substrate integrated waveguide folding technology |
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