CN110339962A - Polysilicon chip conductive glue device - Google Patents
Polysilicon chip conductive glue device Download PDFInfo
- Publication number
- CN110339962A CN110339962A CN201910760329.0A CN201910760329A CN110339962A CN 110339962 A CN110339962 A CN 110339962A CN 201910760329 A CN201910760329 A CN 201910760329A CN 110339962 A CN110339962 A CN 110339962A
- Authority
- CN
- China
- Prior art keywords
- grading
- polysilicon chip
- conducting resinl
- storehouse
- blanking bin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 56
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 52
- 229920005591 polysilicon Polymers 0.000 title claims abstract description 52
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000005507 spraying Methods 0.000 claims abstract description 23
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 239000007921 spray Substances 0.000 claims description 18
- 238000011084 recovery Methods 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 23
- 238000000576 coating method Methods 0.000 abstract description 23
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
- B05B13/025—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the objects or work being present in bulk
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
- B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
- B05B9/0403—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
- B05B9/0406—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material with several pumps
Landscapes
- Spray Control Apparatus (AREA)
Abstract
The invention discloses polysilicon chip conductive glue devices, including pedestal, the side of pedestal is equipped with the first locating rack, the top two sides of first locating rack are equipped with the first positioning tube, driven roller is installed between first positioning tube, the other side of pedestal is equipped with the second locating rack, the top two sides of second locating rack are equipped with the second positioning tube, driving idler wheel is equipped between second positioning tube, the outside left of second positioning tube has installed stepper motor, the front of stepper motor is equipped with drive shaft, drive shaft is mounted on the axial position of driving idler wheel, conveyor belt is wound between driving idler wheel and driven roller；The top of pedestal is equipped with the grading cutting agency of polysilicon chip and conducting resinl spraying mechanism, and pedestal is equipped with side frame, and the grading cutting agency of polysilicon chip includes grading blanking bin, and the inside of grading blanking bin is equipped with grading blanking chamber.The present invention substantially increases the efficiency that coating processing is carried out to polysilicon chip.
Description
Technical field
The present invention relates to coating units, in particular to polysilicon chip conductive glue device.
Background technique
Coating machine is the automated machine equipment for specially carrying out control to fluid and fluid being coated on to product surface.According to
The continuous development of coating equipment industry technology, the painting that can have carried out selectivity to the product that needs coat cover, therefore, selectivity
Automatic coating machine has become the mainstream equipment of coating；According to the demand of practical application, coating machine is guaranteeing effective coated area
Volume needs to reduce volume simultaneously, to meet different site conditions, improves the quantum of output of assembly line.Whole plate coating machine provides one
A cleaning, efficient full-automatic three proofings spraying process.The spraying valve accurately controlled can ensure that the three proofings coating of 0.05mm thickness
Uniform in effect is consistent, has revolutionary improvement compared with modes such as hand spray, immersion, brushings, greatly improves production efficiency and production
Quality.It selects coating machine to provide a cleaning, efficient full-automatic selective positioning three proofings spraying process, avoids spraying to selected
Outside the region selected, to remove overlay film, striping and repair process from.The spraying valve accurately controlled can ensure that the three of 0.02mm thickness
Anti- coating uniform in effect is consistent.The surface coating machine technology of coating machine is exactly to coat a kind of skill of new material on the surface of product
Art, the effect of product surface spray coating, which is mainly manifested in, can play a waterproof, dust-proof, antistatic etc..Surface coating is in base
A kind of film layer is formed on matter surface, for improving the technology on protection surface.After new material is sprayed to product surface, coat
Chemical component, institutional framework can drink that host material is entirely different, it is to meet surface property, coat and host material
It is criterion that bond strength, which adapts to working condition requirement, good economy performance, the feature of environmental protection well,.The coating thickness of surface coating is several microns, very
To less.Existing coating machine inconvenience carries out grading blanking to polysilicon chip, and it is low to carry out gluing treatment effeciency to polysilicon chip.
Summary of the invention
Technical problem to be solved by the invention is to provide being fed forward by conveyor belt to polysilicon chip, pass through
Glue conveying box, pump pump and glue spraying pump the conducting resinl in conducting resinl storehouse is transported into glue storehouse, into Jiao Cang by spray nozzle general
Conducting resinl sprays to the surface of polysilicon chip, carries out coating conductive adhesive layer to the surface of polysilicon chip so as to convenient, significantly
Improve the polysilicon chip conductive glue device that the efficiency of coating processing is carried out to polysilicon chip.
The present invention is achieved through the following technical solutions:
Polysilicon chip conductive glue device, including pedestal, the side of pedestal are equipped with the first locating rack, the first locating rack it is upper
Portion two sides are equipped with the first positioning tube, and driven roller is equipped between the first positioning tube, and the other side of pedestal is equipped with the second positioning
Frame, the top two sides of the second locating rack are equipped with the second positioning tube, driving idler wheel, the second positioning tube are equipped between the second positioning tube
Outside left installed stepper motor, the front of stepper motor is equipped with drive shaft, and drive shaft is mounted on the axial direction of driving idler wheel
Position drives and is wound with conveyor belt between idler wheel and driven roller；The top of pedestal is equipped with the grading cutting agency of polysilicon chip
With conducting resinl spraying mechanism, pedestal is equipped with side frame, and the grading cutting agency of polysilicon chip includes grading blanking bin, grading blanking bin
Inside be equipped with grading blanking chamber, the inner peripheral surface of grading blanking chamber is equipped with several internal projecting rings, is limited between two neighboring internal projecting ring
Position chamber, the top of grading blanking bin are equipped with hydraulic cylinder, and the lower part of hydraulic cylinder is equipped with piston rod, and the lower end of piston rod is equipped with grading push away
Plug, grading plunger are mounted on that grading blanking is intracavitary, and grading plunger is mounted in limit chamber；The lower part of hydraulic cylinder and grading blanking bin
Top between be feed inlet；Conducting resinl spraying mechanism includes conducting resinl storehouse with into Jiao Cang, and conducting resinl storehouse is mounted on side frame, grade
It is mounted on the outside portion in conducting resinl storehouse into blanking bin, the outside portion of grading blanking bin is mounted on into Jiao Cang, into Jiao Cang and conducting resinl
Storehouse is connected by glue conveying box, and one end of glue conveying box, which is equipped with, pumps pump, pumps the interior bottom that pump is mounted on conducting resinl storehouse, glue conveying box
The other end is pumped equipped with glue spraying, and glue spraying pump is mounted on the top into Jiao Cang, is equipped with several spray nozzles, spray nozzle peace into the bottom surface of Jiao Cang
Mounted in the top of conveyor belt, grading blanking bin is mounted on the top of conveyor belt.
Further, the top of the side frame is equipped with footstock, and the bottom surface of footstock is equipped with limit cavity, the top of grading blanking bin
Portion lateral wall position is equipped with the second fixed block, is connected between the second fixed block and the outside portion position of footstock by furred ceiling frame；Grade
It is mounted in limit cavity into plunger.
Further, the top surface of the footstock is equipped with limit plate and limited block, and hydraulic cylinder is mounted on footstock, limit plate
It is mounted on the side of hydraulic cylinder, limited block is mounted on the other side of hydraulic cylinder.
Further, the internal of the side frame is equipped with the first limit plate and the second limit plate, the first limit towards face position
Plate is mounted on the top in conducting resinl storehouse, and the second limit plate is mounted on the lower section in conducting resinl storehouse, sets on the outside of the upper end of grading blanking bin
There is the first fixed block, the first fixed block is mounted on the first limit plate, and the lower end outside of grading blanking bin is equipped with third fixed block,
Third fixed block is mounted on the second limit plate.
Further, the conducting resinl storehouse is mounted on lock frame, and lock frame is mounted on side frame.
Further, the spray nozzle is in matrix arrangements in the bottom surface into Jiao Cang.
Further, the pedestal is equipped with recovery bin, and the outside portion position of the second locating rack is equipped with support chip, support
The top of piece is equipped with guide piece, and guide piece is mounted between conveyor belt and the top of recovery bin.
Further, the guide piece is arc shape.
Further, the side into Jiao Cang is equipped with the first fixed frame, and the first fixed frame is mounted on grading blanking bin
Outside portion position.
Further, the outside left into Jiao Cang has installed the first side frame and the second side frame, the first side frame and second
Hot bellows are equipped between the lower part of side frame, if being equipped with hot dry wind pump in hot bellows, hot bellows are mounted on the top of conveyor belt.
The beneficial effects of the present invention are: stepper motor, which controls driving idler wheel by drive shaft, realizes rotation, idler wheel is driven
Rotation drives conveyor belt to realize and rotates with driven roller；Hydraulic cylinder controls grading plunger by piston rod and ramps up；It again will be more
The grading blanking that crystal silicon chip is packed into grading blanking bin is intracavitary, is limited by internal projecting ring the polysilicon chip in grading blanking bin
Position, internal projecting ring carry out limit filling to polysilicon chip by limit chamber；Hydraulic cylinder controls grading plunger to decline by piston rod,
The polysilicon chip in grading blanking bin is pushed downwards by grading plunger and is transported in conveyor belt, conveyor belt pair is passed through
Polysilicon chip is fed forward, by glue conveying box, pump pump and glue spraying pump by the conducting resinl in conducting resinl storehouse be transported into
In glue storehouse, conducting resinl is sprayed to the surface of polysilicon chip into Jiao Cang by spray nozzle, so as to convenient to polysilicon chip
Surface carries out coating conductive adhesive layer, substantially increases the efficiency that coating processing is carried out to polysilicon chip.
Detailed description of the invention
The present invention is described in detail by following specific embodiments and drawings for ease of explanation,.
Fig. 1 is the structural schematic diagram of polysilicon chip conductive glue device of the present invention.
Fig. 2 is the structural schematic diagram of the grading cutting agency of polysilicon chip of the present invention.
Fig. 3 is the structural schematic diagram of conducting resinl spraying mechanism of the present invention.
Specific embodiment
The preferred embodiment of the present invention is described in detail with reference to the accompanying drawing, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
As shown in Figure 1 to Figure 3, the side of polysilicon chip conductive glue device, including pedestal 1, pedestal 1 is equipped with first
Locating rack 2, the top two sides of the first locating rack 2 are equipped with the first positioning tube 3, are equipped with driven roller between the first positioning tube 3
4, the other side of pedestal 1 is equipped with the second locating rack 5, and the top two sides of the second locating rack 5 are equipped with the second positioning tube 6, and second is fixed
Driving idler wheel 9 is equipped between the cylinder 6 of position, the outside left of the second positioning tube 6 has installed stepper motor 7, and the front of stepper motor 7 is set
There is drive shaft 8, drive shaft 8 is mounted on the axial position of driving idler wheel 9, drives and is wound with conveying between idler wheel 9 and driven roller 4
Belt 10；The top of pedestal 1 is equipped with the grading cutting agency 15 of polysilicon chip and conducting resinl spraying mechanism 16, and pedestal 1 is equipped with side
Frame 14, the grading cutting agency 15 of polysilicon chip include grading blanking bin 30, and the inside of grading blanking bin 30 is equipped with grading blanking chamber
31, it is limit chamber 33 between two neighboring internal projecting ring 32, under grading that the inner peripheral surface of grading blanking chamber 31, which is equipped with several internal projecting rings 32,
The top of feed bin 30 is equipped with hydraulic cylinder 34, and the lower part of hydraulic cylinder 34 is equipped with piston rod 35, and the lower end of piston rod 35 is equipped with grading push away
Plug 36, grading plunger 36 is mounted in grading blanking chamber 31, and grading plunger 36 is mounted in limit chamber 33；The lower part of hydraulic cylinder 34
It is feed inlet between the top of grading blanking bin 30；Conducting resinl spraying mechanism 16 includes conducting resinl storehouse 40 with into glue storehouse 42, is led
Electric glue storehouse 40 is mounted on side frame 14, and grading blanking bin 30 is mounted on the outside portion in conducting resinl storehouse 40, is mounted on grade into glue storehouse 42
Into the outside portion of blanking bin 30, it is connect into glue storehouse 42 with conducting resinl storehouse 40 by glue conveying box 45, one end of glue conveying box 45, which is equipped with, takes out
Pump 46 is sent, the interior bottom that pump 46 is mounted on conducting resinl storehouse 40 is pumped, the other end of glue conveying box 45 is equipped with glue spraying pump 47, glue spraying pump 47
It is mounted on the top into glue storehouse 42, is equipped with several spray nozzles 43 into the bottom surface in glue storehouse 42, spray nozzle 43 is mounted on conveyor belt 10
Top, grading blanking bin 30 is mounted on the top of conveyor belt 10.
Polysilicon chip conductive glue device of the present invention, stepper motor 7 is realized by the control driving idler wheel 9 of drive shaft 8 to be turned
It is dynamic, it drives the rotation of idler wheel 9 and driven roller 4 that conveyor belt 10 is driven to realize and rotates；Hydraulic cylinder 34 is controlled by piston rod 35
Grading plunger 36 ramps up；Polysilicon chip is packed into the grading blanking chamber 31 of grading blanking bin 30 again, it is right by internal projecting ring 32
Polysilicon chip in grading blanking bin 30 is limited, and internal projecting ring 32 carries out limit filling to polysilicon chip by limit chamber 33；
Hydraulic cylinder 34 controls grading plunger 36 to decline by piston rod 35, by grading plunger 36 by the polycrystalline in grading blanking bin 30
Silicon wafer is pushed downwards and is transported in conveyor belt 10, is fed forward by conveyor belt 10 to polysilicon chip, by defeated
Sebific duct 45 pumps pump 46 and the conducting resinl in conducting resinl storehouse 40 47 is transported into glue storehouse 42 by glue spraying pump, logical into glue storehouse 42
The surface that conducting resinl is sprayed to polysilicon chip by spray nozzle 43 is crossed, is led so as to conveniently carry out coating to the surface of polysilicon chip
Electric glue-line substantially increases the efficiency that coating processing is carried out to polysilicon chip.
Preferably, the top of side frame 14 is equipped with footstock 19, and the bottom surface of footstock 19 is equipped with limit cavity 20, grading blanking bin 30
Top outer wall position be equipped with the second fixed block 38, pass through furred ceiling between the second fixed block 38 and the outside portion position of footstock 19
Frame 21 connects；Grading plunger 36 is mounted in limit cavity 20；Hydraulic cylinder 34 controls grading plunger 36 upwards by piston rod 35
It rises；Make to rise into plunger 36 in limit cavity 20, be protected by limiting cavity 20 into plunger 36.
Preferably, the top surface of footstock 19 is equipped with limit plate 22 and limited block 23, and hydraulic cylinder 34 is mounted on footstock 19, limits
Position plate 22 is mounted on the side of hydraulic cylinder 34, and limited block 23 is mounted on the other side of hydraulic cylinder 34；Pass through limit plate 22 and limit
Block 23 carries out limit protection to the two sides of hydraulic cylinder 34.
Preferably, the internal of side frame 14 is equipped with the first limit plate 24 and the second limit plate 25, the first limit towards face position
Plate 24 is mounted on the top in conducting resinl storehouse 40, and the second limit plate 25 is mounted on the lower section in conducting resinl storehouse 40, grading blanking bin 30
The first fixed block 37 is equipped on the outside of upper end, the first fixed block 37 is mounted on the first limit plate 24, the lower end of grading blanking bin 30
Outside is equipped with third fixed block 39, and third fixed block 39 is mounted on the second limit plate 25；It is convenient that conducting resinl storehouse 40 is limited
Position installation, is more firmly mounted conducting resinl storehouse 40.
Preferably, conducting resinl storehouse 40 is mounted on lock frame 41, and lock frame 41 is mounted on side frame 14；By locking 41 pairs of conductions of frame
Glue storehouse 40 carries out interlocking.
Preferably, spray nozzle 43 is in matrix arrangements in the bottom surface into glue storehouse 42；Pass through convenient pair of spray nozzle 43 into glue storehouse 42
The surface of polysilicon chip carries out spray treatment.
Preferably, pedestal 1 is equipped with recovery bin 11, and the outside portion position of the second locating rack 5 is equipped with support chip 12, support
The top of piece 12 is equipped with guide piece 13, and guide piece 13 is mounted between conveyor belt 10 and the top of recovery bin 11；Guide piece 13
For arc shape；It can be convenient the polysilicon chip to come to the conveying of conveyor belt 10 by guide piece 13 and be transported to recovery bin 11
It is interior.
Preferably, it is equipped with the first fixed frame 17 into the side in glue storehouse 42, the first fixed frame 17 is mounted on grading blanking bin 30
Outside portion position；It is convenient that installation is fixed into glue storehouse 42.
Preferably, the outside left into glue storehouse 42 has installed the first side frame 28 and the second side frame 29, the first side frame 28 and
Hot bellows 26 are equipped between the lower part of two side frames 29, if being equipped with hot dry wind pump 27 in hot bellows 26, hot bellows 26 are mounted on defeated
Send the top of belt 10；Convenient that installation is fixed to hot bellows 26, hot bellows 26 are defeated by hot wind 27 pairs of conveyor belts 10 of pump
The polysilicon chip sent carries out hot drying and processing.
Preferably, it is equipped with the second fixed frame 18 into the side in glue storehouse 42, the outside left of the second fixed frame 18 has installed anti-
The lower part of shield 44, shield 44 is hatch frame, and spray nozzle 43 is mounted in shield 44；By shield 44 to spray nozzle
43 are protected.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
The change or replacement expected without creative work, should be covered by the protection scope of the present invention.Therefore, of the invention
Protection scope should be determined by the scope of protection defined in the claims.
Claims (10)
1. the side of polysilicon chip conductive glue device, including pedestal, pedestal is equipped with the first locating rack, the first locating rack
Top two sides are equipped with the first positioning tube, driven roller are equipped between the first positioning tube, it is fixed that the other side of pedestal is equipped with second
Position frame, the top two sides of the second locating rack are equipped with the second positioning tube, and driving idler wheel, the second positioning are equipped between the second positioning tube
The outside left of cylinder has installed stepper motor, and the front of stepper motor is equipped with drive shaft, and drive shaft is mounted on the axis of driving idler wheel
To position, drives and be wound with conveyor belt between idler wheel and driven roller；
It is characterized by: the top of pedestal is equipped with the grading cutting agency of polysilicon chip and conducting resinl spraying mechanism, pedestal is equipped with
Side frame, the grading cutting agency of polysilicon chip include grading blanking bin, and the inside of grading blanking bin is equipped with grading blanking chamber, under grading
Expect that the inner peripheral surface of chamber is equipped with several internal projecting rings, be limit chamber between two neighboring internal projecting ring, the top of grading blanking bin is equipped with liquid
Cylinder pressure, the lower part of hydraulic cylinder are equipped with piston rod, and the lower end of piston rod is equipped with grading plunger, and grading plunger is mounted on grading blanking chamber
Interior, grading plunger is mounted in limit chamber；It is feed inlet between the lower part of hydraulic cylinder and the top of grading blanking bin；
Conducting resinl spraying mechanism includes conducting resinl storehouse with into Jiao Cang, and conducting resinl storehouse is mounted on side frame, and grading blanking bin is mounted on
The outside portion in conducting resinl storehouse is mounted on the outside portion of grading blanking bin into Jiao Cang, is connected into Jiao Cang and conducting resinl storehouse by glue conveying box
It connects, one end of glue conveying box, which is equipped with, pumps pump, pumps the interior bottom that pump is mounted on conducting resinl storehouse, and the other end of glue conveying box is equipped with glue spraying
Pump, glue spraying pump are mounted on the top into Jiao Cang, are equipped with several spray nozzles into the bottom surface of Jiao Cang, spray nozzle is mounted on conveyor belt
Top, grading blanking bin are mounted on the top of conveyor belt.
2. polysilicon chip conductive glue device according to claim 1, it is characterised in that: the top of side frame is equipped with top
Seat, the bottom surface of footstock are equipped with limit cavity, and the top outer wall position of grading blanking bin is equipped with the second fixed block, the second fixed block
It is connect between the outside portion position of footstock by furred ceiling frame；Grading plunger is mounted in limit cavity.
3. polysilicon chip conductive glue device according to claim 2, it is characterised in that: the top surface of footstock is equipped with limit
Position plate and limited block, hydraulic cylinder are mounted on footstock, and limit plate is mounted on the side of hydraulic cylinder, and limited block is mounted on hydraulic cylinder
The other side.
4. polysilicon chip conductive glue device according to claim 1, it is characterised in that: side frame it is internal towards face position
The first limit plate and the second limit plate are installed, the first limit plate is mounted on the top in conducting resinl storehouse, and the second limit plate is mounted on
The upper end outside of the lower section in conducting resinl storehouse, grading blanking bin is equipped with the first fixed block, and the first fixed block is mounted on the first limit plate
On, the lower end outside of grading blanking bin is equipped with third fixed block, and third fixed block is mounted on the second limit plate.
5. polysilicon chip conductive glue device according to claim 1, it is characterised in that: conducting resinl storehouse is mounted on lock frame
On, lock frame is mounted on side frame.
6. polysilicon chip conductive glue device according to claim 1, it is characterised in that: spray nozzle exists in matrix arrangements
Into the bottom surface of Jiao Cang.
7. polysilicon chip conductive glue device according to claim 1, it is characterised in that: pedestal is equipped with recovery bin,
The outside portion position of second locating rack is equipped with support chip, and the top of support chip is equipped with guide piece, and guide piece is mounted on conveying skin
Between band and the top of recovery bin.
8. polysilicon chip conductive glue device according to claim 7, it is characterised in that: guide piece is arc shape.
9. polysilicon chip conductive glue device according to claim 1, it is characterised in that: be equipped with the into the side of Jiao Cang
One fixed frame, the first fixed frame are mounted on the outside portion position of grading blanking bin.
10. polysilicon chip conductive glue device according to claim 1, it is characterised in that: into the outside left of Jiao Cang
The first side frame and the second side frame have been installed, hot bellows, installation in hot bellows are equipped between the first side frame and the lower part of the second side frame
If there is hot dry wind pump, hot bellows are mounted on the top of conveyor belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910760329.0A CN110339962A (en) | 2019-08-16 | 2019-08-16 | Polysilicon chip conductive glue device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910760329.0A CN110339962A (en) | 2019-08-16 | 2019-08-16 | Polysilicon chip conductive glue device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110339962A true CN110339962A (en) | 2019-10-18 |
Family
ID=68185337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910760329.0A Pending CN110339962A (en) | 2019-08-16 | 2019-08-16 | Polysilicon chip conductive glue device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110339962A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112246527A (en) * | 2020-10-23 | 2021-01-22 | 深圳泰得思科技有限公司 | Become light from type membrane of type force after UV illumination and coating unit thereof |
| CN112827762A (en) * | 2020-06-17 | 2021-05-25 | 新昌县高纤纺织有限公司 | Coating device |
| CN113769978A (en) * | 2021-09-15 | 2021-12-10 | 杭州中芯微科技有限公司 | Be used for RFID read write line machine board conducting resin coating equipment |
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| CN208991070U (en) * | 2018-09-25 | 2019-06-18 | 海盐浦兴金属制品有限公司 | A kind of spray-painting plant of automatic charging |
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| CN208894464U (en) * | 2018-09-06 | 2019-05-24 | 遂川鑫诚睿佳电子有限公司 | A kind of spray equipment of flex circuit application |
| CN208991070U (en) * | 2018-09-25 | 2019-06-18 | 海盐浦兴金属制品有限公司 | A kind of spray-painting plant of automatic charging |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112827762A (en) * | 2020-06-17 | 2021-05-25 | 新昌县高纤纺织有限公司 | Coating device |
| CN112827762B (en) * | 2020-06-17 | 2022-01-28 | 江苏立霸实业股份有限公司 | Coating device |
| CN112246527A (en) * | 2020-10-23 | 2021-01-22 | 深圳泰得思科技有限公司 | Become light from type membrane of type force after UV illumination and coating unit thereof |
| CN112246527B (en) * | 2020-10-23 | 2021-11-26 | 深圳泰得思科技有限公司 | Become light from type membrane of type force after UV illumination and coating unit thereof |
| CN113769978A (en) * | 2021-09-15 | 2021-12-10 | 杭州中芯微科技有限公司 | Be used for RFID read write line machine board conducting resin coating equipment |
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Application publication date: 20191018 |