CN110335835B - Device and method for cleaning silicon wafer by using two-section type quartz nozzle - Google Patents
Device and method for cleaning silicon wafer by using two-section type quartz nozzle Download PDFInfo
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- CN110335835B CN110335835B CN201910490436.6A CN201910490436A CN110335835B CN 110335835 B CN110335835 B CN 110335835B CN 201910490436 A CN201910490436 A CN 201910490436A CN 110335835 B CN110335835 B CN 110335835B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/007—Heating the liquid
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a device and a method for cleaning silicon wafers by using two-stage quartz nozzles, wherein different water flows are respectively used for cleaning the central part and the peripheral part of the surface of the silicon wafer, 4 rows of nozzles are used, 2 rows of cleaning nozzles at the central part of the silicon wafer intensively clean the central part area of the silicon wafer, 2 rows of cleaning nozzles at the peripheral part of the silicon wafer mainly intensively clean the edge part of the silicon wafer, and certain time difference is set to set flushing points aiming at different positions of each silicon wafer at the same flow speed. The two nozzles alternately spray to ensure that each nozzle can supply the liquid medicine according to the same flow, prevent the unbalanced flow of the gap between the silicon wafers in the groove or the uneven water flow distribution in the surface of a single silicon wafer caused by insufficient flow, and control the influence at the position to be minimized. Different water flow combinations are used, so that the whole surface of the silicon wafer can be fully cleaned, and the number of particles is reduced.
Description
Technical Field
The invention relates to the field of semiconductor cleaning, in particular to a device and a method for cleaning a silicon wafer by using a two-section quartz nozzle.
Background
The semiconductor silicon wafer is currently used as an indispensable semiconductor material for automobiles, mobile phones, PCs (personal computers) and the like, and with the lightness and concentration development of semiconductor devices, the semiconductor silicon wafer also has higher requirements on the silicon wafer of a base material, and particularly has higher standards and requirements in the aspect of cleanliness.
Therefore, it is imperative to improve the cleaning process capability in the silicon wafer manufacturing process.
However, the silicon wafer is subjected to a process such as polishing or grinding in the production process, and a polishing liquid containing aluminum and silicon dust is used in the process, which causes minute polishing dust and polishing particles to remain on the surface of the silicon wafer, and the polishing dust and the polishing particles are difficult to remove during cleaning and remain on the surface of the silicon wafer.
As an improvement, SC-1 (a solution of NH4OH and H2O 2) and SC-2 (H) may be used in the washing2O2And HCl solution), surfactants, etc., it is difficult to uniformly clean all the silicon wafers when a single batch process is performed due to non-uniform control force of the chemical solution. So that some local defects may occur,the silicon wafer has the problems of strip-shaped liquid medicine residue or spot-shaped foreign matter residue, plaque erosion and the like.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a device and a method for cleaning silicon wafers by using two-stage quartz nozzles, wherein different water flows are respectively used for cleaning the central part and the peripheral part of the surface of the silicon wafer, 4 rows of nozzles are used, 2 rows of cleaning nozzles at the central part of the silicon wafer intensively clean the central part area of the silicon wafer, 2 rows of cleaning nozzles at the peripheral part of the silicon wafer mainly intensively clean the edge part of the silicon wafer, and certain time difference is set to set flushing points aiming at different positions of each silicon wafer at the same flow rate. The two nozzles alternately spray to ensure that each nozzle can supply the liquid medicine according to the same flow, prevent the unbalanced flow of the gap between the silicon wafers in the groove or the uneven water flow distribution in the surface of a single silicon wafer caused by insufficient flow, and control the influence at the position to be minimized. Different water flow combinations are used, so that the whole surface of the silicon wafer can be fully cleaned, and the number of particles is reduced.
The technical scheme of the invention is as follows: utilize two-section type quartz nozzle to wash device of silicon chip, including a plurality of liquid medicine groove, place the support base that a plurality of can fix the silicon chip side by side in the liquid medicine groove, support base below is provided with 2 rows of silicon chip central part cleaning nozzle and 2 rows of silicon chip periphery cleaning nozzle.
Further, 2 rows of silicon wafer central part cleaning nozzles, 1 row is located the left below of support base, and 1 row is located the right below of support base, and corresponds a set of nozzle between every two adjacent support bases: and the left lower nozzle and the right lower nozzle are arranged, the outlets of the two nozzles are opposite to the gap between two adjacent silicon chips, and water flow sprayed from the outlets of the nozzles is towards the central positions of the two adjacent silicon chips.
Further, the cleaning nozzles at the periphery of the 2 rows of silicon wafers are respectively positioned at the outer sides of the cleaning nozzles at the central part of the 2 rows of silicon wafers, and the bottom of each bracket base corresponds to a group of nozzles: the left side bottom part is provided with a nozzle, the right side bottom part is provided with a nozzle, and water flows sprayed from the outlets of the two nozzles respectively impact the left side periphery part and the right side periphery part of the silicon wafer.
Furthermore, the liquid inlets of the cleaning nozzles at the central part of the 2 rows of silicon wafers and the cleaning nozzles at the peripheral part of the 2 rows of silicon wafers are provided with switch valves.
The invention also provides a method for cleaning a silicon wafer by using the two-section type quartz nozzle, which is realized by using the device for cleaning the silicon wafer by using the two-section type quartz nozzle, and comprises the following specific steps:
firstly, placing a silicon wafer in a liquid medicine groove;
closing the cleaning nozzles at the periphery of the silicon wafer and opening the cleaning nozzles at the central part of the silicon wafer, wherein the cleaning nozzles at the central part of the silicon wafer intensively spray liquid medicine to the central part of the silicon wafer, upward flow can be formed in the upper part direction of a liquid medicine groove at the moment, foreign matters in the surface of the silicon wafer are driven to be stripped off, rise to the surface along with water flow and then overflow and wash away, the liquid medicine and the foreign matters flowing out of the upper part of the liquid medicine groove flow into an outer groove at the edge of the liquid medicine groove, then sequentially enter a pipeline, a circulating pump, a filter and a heater, and then the liquid returns to the cleaning;
step three, closing a cleaning nozzle at the central part of the silicon wafer and opening a cleaning nozzle at the peripheral part of the silicon wafer, wherein the cleaning nozzle at the peripheral part of the silicon wafer intensively sprays liquid medicine to the peripheral parts at two sides of the silicon wafer, upward flow is formed at the upper part of a liquid medicine groove at the moment, foreign matters at the edge of the silicon wafer are driven to be stripped off, rise to the surface along with water flow and then overflow and wash away, the liquid medicine and the foreign matters flowing out from the upper part of the liquid medicine groove flow into an outer layer outer groove at the edge of the liquid medicine groove, then sequentially enter a pipeline, a circulating pump, a filter and a heater, and;
step four, alternately carrying out the step two and the step three for a plurality of times;
and step five, closing the cleaning nozzles at the periphery of the silicon wafer and the cleaning nozzles at the center of the silicon wafer at the same time, and taking out the silicon wafer.
Further, in the second step and the third step, the flow rates of the silicon wafer outer peripheral portion cleaning nozzle and the silicon wafer central portion cleaning nozzle are the same.
Further, in the second step and the third step, the flow rates of the silicon wafer outer peripheral portion cleaning nozzle and the silicon wafer central portion cleaning nozzle are set to 5mm/sec to 20 mm/sec.
Further, the rinsing time per cycle of the wafer outer peripheral portion cleaning nozzle in the second step is 6sec to 25sec, and the rinsing time per cycle of the wafer central portion cleaning nozzle in the third step is 6sec to 25 sec.
The invention has the beneficial effects that:
1. in a silicon wafer cleaning machine, the number of chemical solution nozzle holes in a chemical solution tank such as SC-1 is increased from 2 to 4, and the main feature is that different water flows are used for cleaning the central part and the peripheral part of the silicon wafer surface.
2. In the prior art, the flow speed is controlled by the aperture change of a nozzle in water during cleaning, so that the liquid flow in the tank achieves the homogenization effect; this patent does not change the shape of aperture and nozzle, but uses 4 rows of nozzles, and 2 rows of silicon chip central part cleaning nozzle concentrate the central part region of wasing the silicon chip, and 2 rows of silicon chip periphery parts cleaning nozzle mainly concentrate the edge part of wasing the silicon chip, set up certain time difference and set up the washing point to the different positions of every piece of silicon chip according to same velocity of flow. The two nozzles alternately spray to ensure that each nozzle can supply the liquid medicine according to the same flow rate, thereby preventing the uneven flow rate of the gaps among 25(50) silicon wafers in the tank or the uneven water flow distribution in the surface of each silicon wafer due to insufficient flow rate and controlling the influence of the positions to be minimized.
3. Different water flow combinations are used, so that the whole surface of the silicon wafer can be fully cleaned, and the number of particles is reduced.
4. When the silicon wafer is cleaned in the liquid medicine groove, particles are easy to remain at the contact position of the support base at the bottom and the silicon wafer, and the particles at the edge of the silicon wafer at the contact position are effectively reduced through the arrangement of the two nozzle pipes.
Drawings
FIG. 1 is a schematic view of water sprayed from a silicon wafer center cleaning nozzle of an apparatus for cleaning a silicon wafer using a two-stage quartz nozzle;
FIG. 2 is a schematic view showing water jets from a wafer outer peripheral cleaning nozzle of an apparatus for cleaning a silicon wafer by using a two-stage quartz nozzle.
In the figure: the chemical solution tank 1, the silicon wafer central part cleaning nozzle 2, the support base 3, the silicon wafer 4, the silicon wafer central part cleaning nozzle 5, the silicon wafer peripheral part cleaning nozzle 6 and the silicon wafer peripheral part cleaning nozzle 7 are arranged in sequence.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Utilize two-section type quartz nozzle to wash device of silicon chip, including a plurality of liquid medicine groove 1, place a plurality of support base 3 that can fix silicon chip 4 in liquid medicine groove 1 side by side, be provided with 2 rows of silicon chip central part cleaning nozzle 2 and 2 rows of silicon chip periphery part cleaning nozzle 6 below support base 3.
2 arrange silicon chip central part cleaning nozzle 2, 1 row is located support base 3's left side below, and 1 row is located support base 3's right side below, and corresponds a set of nozzle between every two adjacent support bases 3: and the left lower nozzle and the right lower nozzle are arranged, the outlets of the two nozzles are opposite to the gap between two adjacent silicon chips, and water flow sprayed from the outlets of the nozzles is towards the central positions of the two adjacent silicon chips.
The cleaning nozzles 6 at the periphery of the 2 rows of silicon wafers are respectively positioned at the outer sides of the cleaning nozzles 2 at the central part of the 2 rows of silicon wafers, and the bottom of each bracket base 3 corresponds to a group of nozzles: the left side bottom part is provided with a nozzle, the right side bottom part is provided with a nozzle, and water flows sprayed from the outlets of the two nozzles respectively impact the left side periphery part and the right side periphery part of the silicon wafer.
The liquid inlet of the cleaning nozzles 2 at the central part of the row 2 of silicon wafers and the liquid inlet of the cleaning nozzles 6 at the peripheral part of the row 2 of silicon wafers are both provided with switch valves.
The method for cleaning the silicon wafer by using the two-section quartz nozzle comprises the following specific steps:
step one, placing a silicon wafer in a liquid medicine groove.
And step two, closing the cleaning nozzles at the periphery of the silicon wafer and opening the cleaning nozzles at the central part of the silicon wafer, and intensively spraying the liquid medicine to the central part of the silicon wafer by the cleaning nozzles at the central part of the silicon wafer as shown in fig. 1.
At the moment, upward flow is formed in the upper part direction of the liquid medicine tank, foreign matters in the surface of the silicon wafer are driven to be stripped off, rise to the surface along with water flow and then overflow and wash away, liquid medicine and foreign matters flowing out of the upper part of the liquid medicine tank flow into an outer tank of the outer layer at the edge of the liquid medicine tank, then sequentially enter a pipeline, a circulating pump, a filter and a heater, and then the liquid returns to a cleaning nozzle at the central part of the silicon wafer to form circulation; when the flow rate of the nozzle is 20mm/sec, the rinsing time of the cleaning nozzle at the central part of the silicon wafer in each cycle is 6 sec; when the nozzle flow rate was 5mm/sec, the rinsing time of the silicon wafer center cleaning nozzle per cycle was 25 sec. Water is sprayed on the periphery and the central part alternately.
And step three, closing the cleaning nozzles at the central part of the silicon wafer and opening the cleaning nozzles at the peripheral part of the silicon wafer, and intensively spraying the liquid medicine to the peripheral parts at two sides of the silicon wafer by the cleaning nozzles at the peripheral part of the silicon wafer as shown in FIG. 2.
At the moment, upward flow is formed in the upper part direction of the liquid medicine tank, foreign matters at the edge of the silicon wafer are driven to be stripped off, rise to the surface along with water flow and then overflow and wash away, liquid medicine and foreign matters flowing out of the upper part of the liquid medicine tank flow into an outer tank of the outer layer at the edge of the liquid medicine tank, then sequentially enter a pipeline, a circulating pump, a filter and a heater, and then the liquid returns to a cleaning nozzle at the periphery of the silicon wafer to form circulation; when the nozzle flow rate is 20mm/sec, the rinsing time of the silicon wafer peripheral part cleaning nozzle per cycle is 6 sec; when the nozzle flow rate was 5mm/sec, the silicon wafer outer peripheral portion cleaning nozzle rinsing time per cycle was 25 sec. Water is sprayed on the periphery and the central part alternately.
Step four, alternately carrying out the step two and the step three for a plurality of times;
and step five, closing the cleaning nozzles at the periphery of the silicon wafer and the cleaning nozzles at the center of the silicon wafer at the same time, and taking out the silicon wafer.
By adopting the device and the method for cleaning the silicon wafers by using the two-section quartz nozzle, different water flows are respectively used for cleaning the central part and the peripheral part of the silicon wafer surface, 4 rows of nozzles are used, 2 rows of cleaning nozzles at the central part of the silicon wafer intensively clean the central area of the silicon wafer, 2 rows of cleaning nozzles at the peripheral part of the silicon wafer mainly intensively clean the edge part of the silicon wafer, and certain time difference is set to set flushing points aiming at different positions of each silicon wafer at the same flow speed. The two nozzles alternately spray to ensure that each nozzle can supply the liquid medicine according to the same flow, prevent the unbalanced flow of the gap between the silicon wafers in the groove or the uneven water flow distribution in the surface of a single silicon wafer caused by insufficient flow, and control the influence at the position to be minimized. Different water flow combinations are used, so that the whole surface of the silicon wafer can be fully cleaned, and the number of particles is reduced.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (5)
1. Utilize two-stage type quartz nozzle to wash device of silicon chip, its characterized in that: the silicon wafer cleaning device comprises a plurality of liquid medicine tanks (1), wherein a plurality of support bases (3) capable of fixing silicon wafers (4) are arranged in the liquid medicine tanks (1) side by side, and 2 rows of silicon wafer central part cleaning nozzles (2) and 2 rows of silicon wafer peripheral part cleaning nozzles (6) are arranged below the support bases (3);
2 silicon chip central part washing nozzle (2) of arranging, 1 row is located the left side below of support base (3), and 1 row is located the right side below of support base (3), and corresponds a set of nozzle between every two adjacent support bases (3): a nozzle at the lower left and a nozzle at the lower right, wherein the outlets of the two nozzles are opposite to the gap between two adjacent silicon chips, and water flow sprayed from the outlets of the nozzles is towards the central positions of the two adjacent silicon chips;
the 2 rows of silicon wafer peripheral part cleaning nozzles (6) are respectively positioned at the outer sides of the 2 rows of silicon wafer central part cleaning nozzles (2), and the bottom of each bracket base (3) corresponds to one group of nozzles: the left side bottom part is provided with a nozzle, the right side bottom part is provided with a nozzle, and water flows sprayed out of outlets of the two nozzles respectively impact the left side periphery part and the right side periphery part of the silicon wafer;
and the liquid inlets of the cleaning nozzles (2) at the central part of the 2 rows of silicon wafers and the cleaning nozzles (6) at the peripheral part of the 2 rows of silicon wafers are respectively provided with a switch valve.
2. The method for cleaning a silicon wafer using a two-stage quartz nozzle, which is implemented by the apparatus for cleaning a silicon wafer using a two-stage quartz nozzle as claimed in claim 1, wherein: the method comprises the following specific steps:
firstly, placing a silicon wafer in a liquid medicine groove;
closing the cleaning nozzles at the periphery of the silicon wafer and opening the cleaning nozzles at the central part of the silicon wafer, wherein the cleaning nozzles at the central part of the silicon wafer intensively spray liquid medicine to the central part of the silicon wafer, upward flow can be formed in the upper part direction of a liquid medicine groove at the moment, foreign matters in the surface of the silicon wafer are driven to be stripped off, rise to the surface along with water flow and then overflow and wash away, the liquid medicine and the foreign matters flowing out of the upper part of the liquid medicine groove flow into an outer groove at the edge of the liquid medicine groove, then sequentially enter a pipeline, a circulating pump, a filter and a heater, and then the liquid returns to the cleaning;
step three, closing a cleaning nozzle at the central part of the silicon wafer and opening a cleaning nozzle at the peripheral part of the silicon wafer, wherein the cleaning nozzle at the peripheral part of the silicon wafer intensively sprays liquid medicine to the peripheral parts at two sides of the silicon wafer, upward flow is formed at the upper part of a liquid medicine groove at the moment, foreign matters at the edge of the silicon wafer are driven to be stripped off, rise to the surface along with water flow and then overflow and wash away, the liquid medicine and the foreign matters flowing out from the upper part of the liquid medicine groove flow into an outer layer outer groove at the edge of the liquid medicine groove, then sequentially enter a pipeline, a circulating pump, a filter and a heater, and;
step four, alternately carrying out the step two and the step three for a plurality of times;
and step five, closing the cleaning nozzles at the periphery of the silicon wafer and the cleaning nozzles at the center of the silicon wafer at the same time, and taking out the silicon wafer.
3. The method of cleaning a silicon wafer using a two-stage quartz nozzle as claimed in claim 2, wherein: in the second step and the third step, the flow rates of the cleaning nozzles at the periphery of the silicon wafer and the cleaning nozzles at the center of the silicon wafer are the same.
4. The method of cleaning a silicon wafer using a two-stage quartz nozzle as claimed in claim 2, wherein: the flow rates of the silicon wafer outer peripheral portion cleaning nozzle and the silicon wafer central portion cleaning nozzle in the second step and the third step are 5mm/sec to 20 mm/sec.
5. The method of cleaning a silicon wafer using a two-stage quartz nozzle as claimed in claim 2, wherein: the rinsing time per cycle of the wafer outer peripheral portion cleaning nozzle in the second step is 6sec to 25sec, and the rinsing time per cycle of the wafer central portion cleaning nozzle in the third step is 6sec to 25 sec.
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| CN110335835B true CN110335835B (en) | 2021-07-16 |
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| TW201126583A (en) * | 2010-01-28 | 2011-08-01 | United Microelectronics Corp | Method of wafer cleaning and apparatus of wafer cleaning |
| JP6250924B2 (en) * | 2012-10-02 | 2017-12-20 | 株式会社荏原製作所 | Substrate cleaning apparatus and polishing apparatus |
| US9733568B2 (en) * | 2014-02-25 | 2017-08-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Tool and method of developing |
| JP6341035B2 (en) * | 2014-09-25 | 2018-06-13 | 東京エレクトロン株式会社 | Substrate liquid processing method, substrate liquid processing apparatus, and storage medium |
| KR102389613B1 (en) * | 2015-05-06 | 2022-04-22 | 삼성전자주식회사 | Substrate cleaning apparatus |
| CN205488060U (en) * | 2016-03-04 | 2016-08-17 | 和舰科技(苏州)有限公司 | Wafer cleaning device |
| JP6710129B2 (en) * | 2016-09-02 | 2020-06-17 | 株式会社荏原製作所 | Substrate cleaning apparatus and substrate cleaning method |
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