CN110319915A - Vibration and sound wave integration sensing system and method - Google Patents
Vibration and sound wave integration sensing system and method Download PDFInfo
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- CN110319915A CN110319915A CN201910227621.6A CN201910227621A CN110319915A CN 110319915 A CN110319915 A CN 110319915A CN 201910227621 A CN201910227621 A CN 201910227621A CN 110319915 A CN110319915 A CN 110319915A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/02—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by magnetic means, e.g. reluctance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M13/00—Testing of machine parts
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M17/00—Testing of vehicles
- G01M17/007—Wheeled or endless-tracked vehicles
- G01M17/0078—Shock-testing of vehicles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M3/00—Investigating fluid-tightness of structures
- G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
- G01M3/04—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point
- G01M3/24—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using infrasonic, sonic, or ultrasonic vibrations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M3/00—Investigating fluid-tightness of structures
- G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
- G01M3/04—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point
- G01M3/24—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using infrasonic, sonic, or ultrasonic vibrations
- G01M3/243—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using infrasonic, sonic, or ultrasonic vibrations for pipes
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- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C23/00—Non-electrical signal transmission systems, e.g. optical systems
- G08C23/02—Non-electrical signal transmission systems, e.g. optical systems using infrasonic, sonic or ultrasonic waves
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- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Abstract
本发明提供一种振动与声波整合感测系统及方法，包括至少一振动感测模块，安装定位在一标的物的至少一选定位置，至少一振动感测模块包括一振膜组件，用以感测一标的物的至少一振动能量并据以产生至少一振动信号、以及感测标的物的至少一声波能量和/或环境声波能量并据以产生至少一声波信号。振膜组件包括有一膜片。一信号处理电路，包括一振动信号回路，连接于至少一振膜组件，用以接收及传送至少一振动信号；一声波信号回路，连接于至少一振膜组件，用以接收及传送至少一声波信号。
The present invention provides a vibration and sound wave integrated sensing system and method, which includes at least one vibration sensing module installed and positioned at at least a selected position of a subject. The at least one vibration sensing module includes a diaphragm component to Sensing at least one vibration energy of a target object and generating at least one vibration signal accordingly, and sensing at least sound wave energy and/or environmental sound wave energy of the target object and generating at least a sound wave signal accordingly. The diaphragm assembly includes a diaphragm. A signal processing circuit, including a vibration signal circuit, connected to at least one diaphragm component, for receiving and transmitting at least one vibration signal; an acoustic wave signal circuit, connected to at least one diaphragm component, for receiving and transmitting at least one sound wave Signal.
Description
技术领域technical field
本发明有关于一种信号感测技术，尤指一种用于感测振动与声波的整合感测系统及方法。The present invention relates to a signal sensing technology, in particular to an integrated sensing system and method for sensing vibration and sound waves.
背景技术Background technique
为了因应各种产业领域需求，业者开发出各种不同的机器设计。由于各项产业技术不断进展，业者都希望都能达到精密、完善、简易的要求。因此，如何设计出能对机器设备或机件进行精确检测的技术，即成为业者很重要的课题。In order to meet the needs of various industrial fields, the industry has developed various machine designs. Due to the continuous development of various industrial technologies, the industry hopes to meet the requirements of precision, perfection and simplicity. Therefore, how to design a technology that can accurately detect the machine equipment or parts has become a very important issue for the industry.
以目前各种产业所使用的机械手臂为例，当利用机械手臂对标的物品进行加工过程中，有可能会因为机械本身的异常或环境周遭的条件改变而导致整个加工产生问题，进而使物品成为不良品。又例如车辆在行进中，若车辆本身机件异常、不慎撞及物体或受到他车碰撞等各种状况。Taking the robotic arms currently used in various industries as an example, when the robotic arm is used to process the target item, there may be problems in the entire processing due to the abnormality of the machine itself or changes in the surrounding environment, which will cause the item to become a defective products. Another example is that when the vehicle is moving, if the vehicle itself is abnormal, hits an object accidentally, or is hit by another vehicle, etc.
现有技术中，若要检测前述的各种状况，一般是由人工定期检查、保养来达成，虽然业界亦有利用例如温度计、电流计、相位计、超音波、红外线或其它检知器来检测异常状况，但仍无法因应实际的需求。尤其是针对某些微量变化、声频范围的感测方面，目前更是缺乏。In the prior art, to detect the above-mentioned various conditions, it is generally achieved by manual regular inspection and maintenance, although the industry also uses thermometers, ammeters, phase meters, ultrasonic waves, infrared rays or other detectors to detect Abnormal conditions, but still unable to meet actual needs. Especially for the sensing of certain micro changes and audio frequency ranges, it is even more lacking at present.
故，有必要提供一种可用来感测振动与声波的感测系统及方法，以解决现有技术中所存在的问题。Therefore, it is necessary to provide a sensing system and method for sensing vibration and sound waves to solve the problems in the prior art.
发明内容Contents of the invention
本发明的一目的即是提供一种振动与声波整合感测系统，以期当本发明安装结合于标的物时，能对该标的物的本身运作状态及周遭环境进行检测。An object of the present invention is to provide a vibration and sound wave integrated sensing system, so that when the present invention is installed and combined with a target, it can detect the operating state of the target and the surrounding environment.
本发明提供一种振动与声波整合感测系统，包括至少一振动感测模块，安装定位在一标的物，该至少一振动感测模块包括一振膜组件，用以感测一标的物的至少一振动能量并据以产生至少一振动信号、以及感测该标的物的至少一声波能量和/或环境声波能量并据以产生至少一声波信号。该振膜组件包括有一膜片。一信号处理电路，包括一振动信号回路，连接于该至少一振膜组件，用以接收及传送该至少一振动信号；一声波信号回路，连接于该至少一振膜组件，用以接收及传送该至少一声波信号。The present invention provides a vibration and sound wave integrated sensing system, which includes at least one vibration sensing module installed and positioned on a target object, and the at least one vibration sensing module includes a diaphragm component for sensing at least one target object A vibration energy to generate at least one vibration signal, and at least acoustic energy and/or ambient acoustic energy of the object to be sensed to generate at least an acoustic signal. The diaphragm assembly includes a diaphragm. A signal processing circuit, including a vibration signal circuit, connected to the at least one diaphragm component, for receiving and transmitting the at least one vibration signal; an acoustic wave signal circuit, connected to the at least one diaphragm component, for receiving and transmitting The at least acoustic signal.
本发明藉由一个或多个振动感测模块感测标的物的不同选定位置的不同振动能量和声波能量和/或环境声波能量，以精确检测出该标的物的运作状态或异常状态，也可以检测出标的物周遭环境的状态，以供执行后续的处置程序。本发明可应用在各种不同应用领域，例如机械手臂、工具机、切割机、钻孔机、锯台、可移动装置、车辆、家用产品等各种不同标的物。The present invention uses one or more vibration sensing modules to sense different vibration energies, sound wave energies and/or ambient sound wave energies at different selected positions of the target, so as to accurately detect the operating state or abnormal state of the target, and also The state of the surrounding environment of the target can be detected for subsequent disposal procedures. The present invention can be applied in various application fields, such as mechanical arms, machine tools, cutting machines, drilling machines, sawing tables, movable devices, vehicles, household products and other different objects.
本发明应用在例如冰箱门未正常关闭时的压缩机工作状态、马桶水箱或水管持续的漏水，所造成长时间异于平常的震动或声音，只要简单贴附的操作即可达到检测的目的。The present invention is applied to the working state of the compressor when the refrigerator door is not closed normally, the continuous water leakage of the toilet tank or the water pipe, which causes long-term vibration or sound that is different from the usual, and the purpose of detection can be achieved by simply attaching the operation.
附图说明Description of drawings
图1是本发明第一实施例的电路方块图；Fig. 1 is the circuit block diagram of the first embodiment of the present invention;
图2显示图1中振动感测组件的一实施例型式的示意图；Figure 2 shows a schematic diagram of an embodiment of the vibration sensing assembly in Figure 1;
图3显示图1中振动感测组件的另一实施例型式的示意图；Figure 3 shows a schematic diagram of another embodiment of the vibration sensing assembly in Figure 1;
图4是本发明第二实施例的电路方块图；Fig. 4 is the circuit block diagram of the second embodiment of the present invention;
图5显示本发明的应用例一；Fig. 5 shows application example 1 of the present invention;
图6显示本发明的应用例二；Fig. 6 shows application example 2 of the present invention;
图7显示本发明的流程图。Figure 7 shows a flowchart of the present invention.
附图标记说明Explanation of reference signs
1 振动感测模块；1 vibration sensing module;
11 基体；11 substrate;
111 开口；111 opening;
12 振膜组件；12 Diaphragm components;
13 膜片；13 diaphragm;
14 感应线圈；14 induction coil;
15 磁性体；15 magnetic bodies;
16 背板；16 backplane;
2 信号处理电路；2 signal processing circuit;
21 振动信号回路；21 Vibration signal circuit;
211 振动信号放大电路；211 Vibration signal amplification circuit;
212 振动信号滤波电路；212 Vibration signal filter circuit;
213 模拟至数字转换器；213 analog to digital converter;
22 声波信号回路；22 sound wave signal circuit;
221 声波信号放大电路；221 Acoustic signal amplification circuit;
222 声波信号滤波电路；222 Acoustic signal filter circuit;
223 模拟至数字转换器；223 analog to digital converter;
23 处理单元；23 processing units;
24 加速度感测器；24 acceleration sensors;
25 角加速度感测器；25 angular acceleration sensors;
3 电能单元；3 power unit;
31 开关器件；31 switching devices;
4 无线发射器；4 wireless transmitters;
5 标的物；5 subject matter;
S1 振动信号；S1 vibration signal;
S2 声波信号；S2 acoustic signal;
S3 加速度信号；S3 acceleration signal;
S4 角加速度信号；S4 angular acceleration signal;
U1 声波能量；U1 acoustic energy;
U2 环境声波能量；U2 ambient sound wave energy;
V 振动能量。V Vibration energy.
具体实施方式Detailed ways
参阅图1所示，其显示本发明第一实施例振动与声波整合感测系统的电路方块图。本发明的振动与声波整合感测系统是由一个或多个振动感测模块1所组成。每一个振动感测模块1具有一基体11，适于安装定位在一标的物的一选定位置。Referring to FIG. 1 , it shows a circuit block diagram of a vibration and sound wave integrated sensing system according to a first embodiment of the present invention. The vibration and sound wave integrated sensing system of the present invention is composed of one or more vibration sensing modules 1 . Each vibration sensing module 1 has a base body 11 suitable for being installed and positioned at a selected position of an object.
一振膜组件12设置在该基体11中且位在对应于该基体11所开设的一开口111位置处。振膜组件12包括一膜片13，用以感测标的物的振动能量V并据以产生一振动信号S1、以及感测该标的物本身所产生的声波能量U1和/或该标的物所在位置周遭的环境声波能量U2并据以产生至少一声波信号S2。A diaphragm assembly 12 is disposed in the base body 11 at a position corresponding to an opening 111 opened in the base body 11 . The diaphragm assembly 12 includes a diaphragm 13, which is used to sense the vibration energy V of the object and generate a vibration signal S1 accordingly, and sense the acoustic wave energy U1 generated by the object itself and/or the position of the object. The ambient sound wave energy U2 is used to generate at least the sound wave signal S2.
一信号处理电路2连接于该振膜组件12。信号处理电路2中包括一振动信号回路21，用以接收及传送该振动信号S1。振动信号回路21包括一振动信号放大电路211，连接于该振膜组件12，用以接收该振膜组件12感测到的该标的物的振动信号S1；一振动信号滤波电路212，连接于该振动信号放大电路211，用以对该至少一振动信号S1进行滤波；一模拟至数字转换器213，连接于该振动信号滤波电路212，用以将该滤波后的该振动信号S1转换成数字型式的数字振动信号。A signal processing circuit 2 is connected to the diaphragm assembly 12 . The signal processing circuit 2 includes a vibration signal circuit 21 for receiving and transmitting the vibration signal S1. The vibration signal loop 21 includes a vibration signal amplification circuit 211 connected to the diaphragm assembly 12 for receiving the vibration signal S1 of the object sensed by the diaphragm assembly 12; a vibration signal filter circuit 212 connected to the diaphragm assembly 12. Vibration signal amplifying circuit 211 for filtering at least one vibration signal S1; an analog-to-digital converter 213 connected to the vibration signal filtering circuit 212 for converting the filtered vibration signal S1 into digital form digital vibration signal.
信号处理电路2中尚包括一声波信号回路22，用以接收及传送该声波信号S2。该声波信号回路22包括一声波信号放大电路221，连接于该振膜组件12，用以接收该振膜组件12感测到的周遭环境的至少一声波信号S2；一声波信号滤波电路222，连接于该声波信号放大电路221，用以对该至少一声波信号S2进行指定频率范围滤波；一模拟至数字转换器223，连接于该声波信号滤波电路222，用以将该滤波后的该声波信号S2转换成数字型式的数字声波信号。The signal processing circuit 2 further includes a sound wave signal circuit 22 for receiving and transmitting the sound wave signal S2. The sound wave signal circuit 22 includes a sound wave signal amplification circuit 221, connected to the diaphragm assembly 12, for receiving at least the sound wave signal S2 of the surrounding environment sensed by the diaphragm assembly 12; an sound wave signal filter circuit 222, connected to The sound wave signal amplifying circuit 221 is used for filtering the specified frequency range of the at least sound wave signal S2; an analog-to-digital converter 223 is connected to the sound wave signal filtering circuit 222 for filtering the sound wave signal S2 converts the digital sound wave signal into digital form.
该信号处理电路2中还包括一处理单元23，该处理单元23连接于该振动信号回路21和该声波信号回路22，用以接收该振动信号S1和该声波信号S2。The signal processing circuit 2 further includes a processing unit 23 connected to the vibration signal loop 21 and the sound wave signal loop 22 for receiving the vibration signal S1 and the sound wave signal S2.
振动与声波整合感测系统中可包括一电能单元3，用以供应工作电能予振膜组件12、处理单元23及其它电路组件。依应用的型式或使用者的需求，电能单元3亦可改由一外界电能经由连接至振动感测模块1的电力导线以供应该工作电能。The vibration and sound wave integrated sensing system may include a power unit 3 for supplying working power to the diaphragm component 12 , the processing unit 23 and other circuit components. According to the type of application or user's requirement, the power unit 3 can also be supplied with the working power by an external power through the power wire connected to the vibration sensing module 1 .
振膜组件12是一个可以经由膜片13感测到外界振动能量及声音能量的组件。例如，图2显示振膜组件12可包括一感应线圈14及一对应的磁性体15，当膜片13感测到外界振动能量及声音能量时可由感应线圈14产生一感应电压送至信号处理电路2。The diaphragm component 12 is a component that can sense external vibration energy and sound energy through the diaphragm 13 . For example, FIG. 2 shows that the diaphragm assembly 12 can include an induction coil 14 and a corresponding magnetic body 15. When the diaphragm 13 senses external vibration energy and sound energy, an induced voltage can be generated by the induction coil 14 and sent to the signal processing circuit. 2.
图3显示另一型式的振膜组件12可包括一个与膜片13平行间隔配置的背板16，当膜片13感测到外界振动能量及声音能量时，膜片13与背板16间产生微量的电容变化而产生一感应电压送至信号处理电路2。Figure 3 shows that another type of diaphragm assembly 12 may include a back plate 16 arranged in parallel with the diaphragm 13 at intervals. A slight capacitance change generates an induced voltage and sends it to the signal processing circuit 2 .
参阅图4所示，其显示本发明第二实施例振动与声波整合感测系统的电路方块图。本实施例的电路组成构件与第一实施例大致相同，故相同器件标示相同的器件编号，以此对应。在本实施例中，信号处理电路2更包括一加速度感测器24，其电连接于该处理单元23，该加速度感测器24感测到标的物的一加速度信号S3时，产生一启动信号至该处理单元23，再由处理单元23控制一开关器件31，用以启动该振膜组件12和信号处理电路2，如此可以达到省电的目的。Referring to FIG. 4 , it shows a circuit block diagram of a vibration and sound wave integrated sensing system according to a second embodiment of the present invention. The components of the circuit in this embodiment are substantially the same as those in the first embodiment, so the same components are marked with the same component numbers to correspond accordingly. In this embodiment, the signal processing circuit 2 further includes an acceleration sensor 24, which is electrically connected to the processing unit 23. When the acceleration sensor 24 senses an acceleration signal S3 of the target object, it generates a start signal. to the processing unit 23, and then the processing unit 23 controls a switching device 31 to activate the diaphragm assembly 12 and the signal processing circuit 2, so as to achieve the purpose of power saving.
此外，信号处理电路2亦可包括一角加速度感测器25，其电连接于该处理单元23，该角加速度感测器25感测到标的物的一角加速度信号S4时，产生一启动信号至该处理单元23，再由处理单元23控制一开关器件31，用以启动该振膜组件12和信号处理电路2。In addition, the signal processing circuit 2 may also include an angular acceleration sensor 25, which is electrically connected to the processing unit 23. When the angular acceleration sensor 25 senses an angular acceleration signal S4 of the target, it generates a start signal to the The processing unit 23 , and the processing unit 23 controls a switching device 31 to activate the diaphragm assembly 12 and the signal processing circuit 2 .
本发明依应用的型式或使用者的需求，加速度感测器24和角加速度感测器25可以内建在振动与声波整合感测系统中，也可以配置在振动与声波整合感测系统的外部。In the present invention, according to the type of application or the needs of users, the acceleration sensor 24 and the angular acceleration sensor 25 can be built in the vibration and sound wave integrated sensing system, and can also be arranged outside the vibration and sound wave integrated sensing system .
处理单元23在接收振动信号S1和声波信号S2后，可以现有的资料储存装置予以储存或以有线/无线方式予以输出至一外界装置(例如中央控制台、电脑、手持装置、远程服务器、网络储存器等)。例如，处理单元23可连接一无线发射器4，即可将该振动信号S1和声波信号S2以无线传送的方式传送出。After the processing unit 23 receives the vibration signal S1 and the sound wave signal S2, it can be stored in an existing data storage device or output to an external device (such as a central console, a computer, a handheld device, a remote server, a network, etc.) in a wired/wireless manner. storage, etc.). For example, the processing unit 23 can be connected with a wireless transmitter 4, so that the vibration signal S1 and the sound wave signal S2 can be transmitted wirelessly.
前述两个实施例中，是以分开的振动信号回路21和声波信号回路22分别接收及传送振动信号及声波信号，在实际制作时，亦可以整个该振动信号回路21和声波信号回路22成为一单一回路以接收及传送振动信号及声波信号，然后再于处理单元23将接收的振动信号及声波信号以软件编程技术予以区分及处理。In the aforementioned two embodiments, the separate vibration signal circuit 21 and the sound wave signal circuit 22 respectively receive and transmit the vibration signal and the sound wave signal. In actual production, the entire vibration signal circuit 21 and the sound wave signal circuit 22 can also be formed into one A single circuit is used to receive and transmit vibration signals and sound wave signals, and then the processing unit 23 distinguishes and processes the received vibration signals and sound wave signals by software programming technology.
图5显示本发明的应用例一。在此应用例中，标的物5是一机器手臂，在标的物5的一个或多个选定位置处，分别安装设置一振动感测模块1，以组成本发明的振动与声波整合感测系统。藉由各个振动感测模块1感测标的物5的不同选定位置的不同振动能量V和声波能量U1和/或环境声波能量U2，可检测出该标的物5的运作状态或异常状态(例如机件故障)，也可以检测出标的物5周遭环境的状态，以供执行后续的处置程序。图5所示的实施例中，在标的物5的三个不同位置分别安装一个振动感测模块1，而该三个振动感测模块1的安装角度使三个振动感测模块1中的膜片13分别指向X、Y、Z轴三个方向，如此可分别感测该标的物5在X、Y、Z三个轴向的振动状况及指向声波。Fig. 5 shows application example 1 of the present invention. In this application example, the target object 5 is a robot arm, and a vibration sensing module 1 is respectively installed at one or more selected positions of the target object 5 to form the vibration and sound wave integrated sensing system of the present invention . By sensing different vibration energies V and acoustic wave energy U1 and/or ambient acoustic wave energy U2 of different selected positions of the target object 5 by each vibration sensing module 1, the operating state or abnormal state of the target object 5 (such as machine failure), and the state of the surrounding environment of the target object 5 can also be detected for subsequent disposal procedures. In the embodiment shown in Fig. 5, a vibration sensing module 1 is respectively installed at three different positions of the target object 5, and the installation angles of the three vibration sensing modules 1 make the membranes in the three vibration sensing modules 1 The sheet 13 points to the three directions of X, Y, and Z axes respectively, so that the vibration conditions and directional sound waves of the object 5 in the three axes of X, Y, and Z can be sensed respectively.
图6显示本发明的应用例二。在此应用例中，标的物5是一可移动的车辆，在标的物5的一个或多个选定位置处，分别安装设置一振动感测模块1，以组成本发明的振动与声波整合感测系统。藉由各个振动感测模块1感测标的物5的不同选定位置的不同振动能量V及声波能量U1和/或环境声波能量U2，可检测出该标的物5的运作状态或异常状态(例如是否受到碰撞)，也可以检测出标的物5周遭环境的状态，以供执行后续的处置程序。Fig. 6 shows the second application example of the present invention. In this application example, the target object 5 is a movable vehicle, and at one or more selected positions of the target object 5, a vibration sensing module 1 is respectively installed to form the vibration and sound wave integration sensor of the present invention. measurement system. By sensing different vibration energies V and acoustic wave energy U1 and/or ambient acoustic wave energy U2 of different selected positions of the target object 5 by each vibration sensing module 1, the operating state or abnormal state of the target object 5 (such as whether it has been collided), and the state of the surrounding environment of the target object 5 can also be detected for subsequent processing procedures.
图7显示本发明的流程图。本发明在执行振动与声波的感测时，其步骤包括：Figure 7 shows a flowchart of the present invention. When the present invention performs the sensing of vibration and sound waves, its steps include:
步骤101：制备至少一振动感测模块，至少一振动感测模块包括一具有膜片的振膜组件及具有一振动信号回路及一声波信号回路的信号处理电路；Step 101: Prepare at least one vibration sensing module, at least one vibration sensing module includes a diaphragm assembly with a diaphragm and a signal processing circuit with a vibration signal loop and an acoustic wave signal loop;
步骤102：将至少一振动感测模块安装定位于标的物的至少一选定位置；Step 102: installing and positioning at least one vibration sensing module on at least one selected position of the object;
步骤103：由振膜组件感测标的物的振动能量，并据以产生一振动信号；Step 103: Sensing the vibration energy of the target object by the diaphragm assembly, and generating a vibration signal accordingly;
步骤104：由振膜组件感测标的物的声波能量和/或该标的物所在位置周遭的环境声波能量，并据以产生至少一声波信号；Step 104: Sensing the sound wave energy of the target and/or the ambient sound wave energy around the position of the target by the diaphragm assembly, and generating at least sound wave signals accordingly;
步骤105：将振动信号通过振动信号回路传送、以及将该至少一声波信号通过声波信号回路传送。Step 105: Transmit the vibration signal through the vibration signal loop, and transmit the at least sound wave signal through the sound wave signal loop.
步骤106：接收该振动信号和该声波信号，并以有线或无线方式输出至一外界接收装置(例如中央控制台、电脑、手持装置、远程服务器、网络储存器等)。Step 106: Receive the vibration signal and the sound wave signal, and output them to an external receiving device (such as a central console, computer, handheld device, remote server, network storage, etc.) in a wired or wireless manner.
以上实施例仅为例示性说明本发明的结构设计，而非用于限制本发明。任何熟于此项技艺的人士均可在本发明的结构设计及精神下，对上述实施例进行修改及变化，这些改变仍属本发明的权利要求保护范围中。The above embodiments are only illustrative to illustrate the structural design of the present invention, and are not intended to limit the present invention. Anyone skilled in the art can modify and change the above-mentioned embodiments under the structural design and spirit of the present invention, and these changes still fall within the protection scope of the claims of the present invention.
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