CN110299313B - Cleaning device and cleaning method - Google Patents
Cleaning device and cleaning method Download PDFInfo
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- CN110299313B CN110299313B CN201910599771.XA CN201910599771A CN110299313B CN 110299313 B CN110299313 B CN 110299313B CN 201910599771 A CN201910599771 A CN 201910599771A CN 110299313 B CN110299313 B CN 110299313B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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Abstract
The invention discloses a cleaning device and a cleaning method. The cleaning device comprises at least one first upper and lower material level and at least one second upper and lower material level; the first upper and lower material loading positions comprise a plurality of first sub upper and lower material loading positions which are arranged in a stacked mode, the plurality of first sub upper and lower material loading positions can be lifted, and the first sub upper and lower material loading positions are used for bearing empty wafer boxes; each second upper material loading and unloading position is of a single-layer structure and is used for bearing a wafer box for placing the wafers before cleaning or placing the wafer box for placing the cleaned wafers. The scheme of the invention can reduce the waiting time of the wafer transmission box before the start of the machine process, and effectively improve the continuity of the previous process and the next process.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a cleaning device and a cleaning method.
Background
Semiconductor devices are classified into single-wafer and batch (multi-wafer) cleaning devices, i.e., one process chamber cleans one wafer at a time and a plurality of wafers (e.g., 25 or 50) at a time. In a semiconductor manufacturing process, batch cleaning is generally used in a front cleaning process, and in a batch cleaning apparatus, a cassette (also called a wafer basket) is mostly used for carrying wafers, and the cassette with the wafers is grabbed by a robot and placed in a corresponding position in the apparatus for wafer transfer or processing. Except for the determined process time, how to utilize each part in the equipment to the maximum extent to maximize the number of wafer boxes of the process in the equipment can greatly improve the utilization rate of the equipment, the capacity of the equipment under full load is an important target for a semiconductor factory to examine the capacity of the equipment, and the larger the capacity of the equipment is, the higher the economic benefit is brought.
Cleaning equipment belongs to auxiliary equipment in a semiconductor manufacturing process, generally, after each process, cleaning is needed to be equipped, so that the residence time of a wafer in a cleaning machine table in a Front Opening Unified Pod (FOUP) can be effectively reduced, the continuity of the previous process and the next process is improved, and certain benefits are provided for the whole wafer manufacturing.
However, if the number of the process tanks is far more than the number of the upper and lower material positions, and the process time is long, the number of the hollow wafer boxes of the equipment limits the capacity of the equipment, and the wafer to be cleaned can enter the equipment to start the process only when the initial wafer box is empty, so that the utilization rate of each process tank is remarkably reduced, and the waiting time of the wafer to be cleaned outside the equipment is greatly increased.
Disclosure of Invention
The invention aims to solve at least one technical problem in the prior art, and provides a cleaning device, a cleaning method and semiconductor processing equipment.
In order to achieve the above object, a first aspect of the present invention provides a cleaning device, comprising at least one first loading and unloading position and at least one second loading and unloading position; wherein,
the first upper and lower material level comprises a plurality of first sub upper and lower material levels which are arranged in a stacked mode, the plurality of first sub upper and lower material levels can be lifted, and the first sub upper and lower material levels are used for bearing empty film boxes;
the second upper and lower material level is of a single-layer structure and is used for bearing a wafer box for placing wafers before cleaning or placing a wafer box for placing cleaned wafers.
Optionally, the cleaning device further comprises a sheet conveying system, a drying tank, a first conveying mechanism, a second conveying mechanism and a plurality of process tanks; wherein,
the first conveying mechanism is used for conveying the wafer box provided with the wafer before cleaning or the wafer box provided with the wafer after cleaning among the wafer conveying system, the drying tank and the first loading and unloading position;
the second conveying mechanism is used for conveying the wafer box placed with the wafers before cleaning or the wafer box placed with the wafers after cleaning between each process tank and the second upper and lower material positions;
the wafer conveying system is used for conveying the wafers before being cleaned in the wafer conveying box into the vacant wafer box and conveying the cleaned wafers back into the wafer conveying box.
Optionally, the first conveying mechanism and the second conveying mechanism are both manipulator structures.
Optionally, the cleaning device further comprises a driving mechanism, and the driving mechanism is connected with each of the first sub-upper and lower material levels to drive each of the first sub-upper and lower material levels to ascend and descend.
Optionally, the driving mechanism is a rack and pinion mechanism, a gear in the rack and pinion mechanism is connected with an output shaft of the driving motor, and a rack is engaged with the gear and connected with each of the first sub-upper and lower material levels.
In a second aspect of the present invention, there is provided a cleaning method applied to the cleaning apparatus described above, including:
s110, the first conveying mechanism conveys the empty film boxes in the first sub-feeding and discharging positions on the top layer to a film conveying system;
s120, the wafer conveying system takes out the wafer before cleaning in the wafer conveying box and conveys the wafer to the vacant wafer box;
s130, the first conveying mechanism conveys the wafer box placed with the wafer before cleaning to the second loading and unloading position;
s140, the wafer box placed with the wafer before cleaning is conveyed among the process tanks by the second conveying mechanism so as to clean the wafer in each process tank;
s150, the first conveying mechanism takes out the wafer box with the cleaned wafer from the drying tank and conveys the wafer box to the wafer conveying system;
and S160, the wafer conveying system takes out the cleaned wafer from the wafer box and conveys the cleaned wafer back to the wafer conveying box.
Optionally, in step S110, after the first conveying mechanism conveys the empty film cassette located in the first sub-feeding and discharging position of the top layer to the film conveying system, the driving mechanism drives the first sub-feeding and discharging position located in the lower layer to move to the top layer.
Optionally, before step S110, the method further includes:
s101, the wafer transfer box is taken out from the loading box by the wafer transfer system and placed at a transfer opening door;
s102, judging whether the wafer in the wafer conveying box needs to start the process or not, if so, opening the conveying opening door and executing the step S110, otherwise, closing the conveying opening door and executing the step S103;
s103, the wafer transfer box is placed in a temporary storage area by the wafer transfer system, and when the wafer transfer box needs to start the process, the wafer transfer box is placed at the transfer opening door, and the step S110 is executed.
Optionally, after step S160, the method further includes:
and S170, the wafer transmission box carrying the cleaned wafer is placed back into the loading box by the wafer transmission system.
Optionally, step S150 includes:
s151, judging whether the film transfer system is idle, if so, executing a step S152, otherwise, executing a step S153;
s152, the first conveying mechanism takes out the wafer box with the cleaned wafer from the drying tank and conveys the wafer box to the wafer conveying system, and step S160 is executed;
and S153, taking the wafer box with the cleaned wafer out of the drying tank by the first conveying mechanism, conveying the wafer box to the second loading and unloading position for transferring, conveying the wafer box to the wafer conveying system when the wafer conveying system is idle, and executing the step S160.
Optionally, after step S170, the method further includes:
s181, judging whether a wafer before cleaning exists in the wafer transfer box, if so, executing a step S120, otherwise, executing a step S182;
s182, judging whether an empty wafer box exists in the first sub upper and lower material level at the top layer, if so, executing a step S183, otherwise, executing a step S184;
s183, the driving mechanism drives the currently vacant first sub-upper and lower material level to move to the top layer, and the step S184 is executed;
s184, the second conveying mechanism conveys the empty wafer boxes to a first sub-loading and unloading position on the top layer.
According to the cleaning device and the cleaning method, the first upper and lower material positions comprise a plurality of first sub upper and lower material positions which are arranged in a stacked mode, and each first sub upper and lower material position is used for bearing an empty wafer box, so that the waiting time of the wafer conveying box before the start of a machine table process can be shortened, and the continuity of the previous process and the next process is effectively improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of a cleaning apparatus according to a first embodiment of the present invention;
FIG. 2 is a schematic view of a cleaning apparatus according to a second embodiment of the present invention;
FIG. 3 is a schematic structural view of a cleaning apparatus according to a third embodiment of the present invention;
FIG. 4 is a flowchart illustrating a cleaning method according to a fourth embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As shown in fig. 1 and 2, a first aspect of the present invention relates to a cleaning device 100, the cleaning device 100 comprising at least one first loading and unloading level 110 and at least one second loading and unloading level 120. Wherein, material level 111 about first lower material level 110 is including the first son of a plurality of range upon range of setting, and material level 111 can go up and down about this first son of a plurality of to, this first son of a plurality of material level 111 is used for bearing vacant film box 200 about being used for. The second loading/unloading level 120 has a single-layer structure, and the second loading/unloading level 120 is used for carrying the cassette 200 on which the wafer before cleaning is placed or the cassette 200 on which the wafer after cleaning is placed.
Specifically, as shown in fig. 1 and 2, the cleaning device 100 may include a first upper and lower level 110 and a second upper and lower level 120, and of course, a greater number of the first upper and lower levels 110 and the second upper and lower levels 120 may be provided according to actual needs by those skilled in the art. Also, as shown in fig. 2, the first upper and lower material levels 110 may include five first sub upper and lower material levels 111, of course, the number of layers of the first sub upper and lower material levels 111 is not limited to five, and a person skilled in the art may design a greater or lesser number of first sub upper and lower material levels 111, for example, two layers, three layers, six layers, seven layers, etc., according to the actual needs.
In the cleaning apparatus 100 of this embodiment, the first loading/unloading position 110 includes a plurality of first sub loading/unloading positions 111 arranged in a stacked manner, and each first sub loading/unloading position 111 is used for bearing an empty wafer cassette, so that the waiting time of the wafer transport cassette before the start of the platform process can be reduced, the continuity between the previous process and the next process can be effectively improved, in addition, the utilization rate of the equipment process tank can be improved, the continuous process of the equipment can be maximized when the equipment is fully loaded, the running times of the empty wafer cassette can be effectively reduced, and the service life of the wafer cassette can be prolonged.
It should be noted that, how to drive the first sub loading and unloading positions 111 to ascend and descend is not specifically limited, for example, a crank slider mechanism may be used, the crank may be connected to the driving motor, and the slider may be connected to the first sub loading and unloading positions 111, so as to drive the first sub loading and unloading positions 111 to ascend and descend. Alternatively, a rack and pinion mechanism or the like may be used.
Specifically, the cleaning device 100 further includes a driving mechanism (not shown in the figure), the driving mechanism is connected to each first sub loading and unloading level 111 to drive each first sub loading and unloading level 111 to move up and down, the driving mechanism can be a rack and pinion mechanism, a gear in the rack and pinion mechanism is connected to an output shaft of a driving motor, and a rack is engaged with the gear and is connected to each first sub loading and unloading level 111.
As shown in fig. 2, the second upper and lower level 120 is flush with the first sub upper and lower level 111 at the top layer, so that a sheet taking mechanism (e.g., a manipulator) can take out the sheet cassettes located in the second upper and lower level 120 and the first upper and lower level 111 at the top layer, thereby further improving the cleaning efficiency of the cleaning device 100.
As shown in fig. 1, the cleaning apparatus 100 further includes a sheet conveying system 130, a drying tank 140, a first conveying mechanism 150, a second conveying mechanism 160, and a plurality of process tanks 170. The first conveying mechanism 150 is used for conveying the cassette 200 containing the wafer before cleaning or the cassette 200 containing the wafer after cleaning among the wafer conveying system 130, the drying tank 140 and the first loading/unloading position 110. The second transfer mechanism 160 is used to transfer the cassette 200 on which the wafer before cleaning is placed or the cassette 200 on which the wafer after cleaning is placed between each process tank 170 and the second loading/unloading level 120. The wafer transfer system 130 is used for transferring the pre-cleaned wafer in the wafer transfer cassette to the empty cassette 200 and transferring the cleaned wafer back to the wafer transfer cassette. The operation traces of the first and second transfer mechanisms 150 and 160 will be specifically described below in conjunction with a cleaning method.
It should be noted that specific structures of the first transfer mechanism 150 and the second transfer mechanism 160 are not limited, for example, the first transfer mechanism 150 may be a first robot, and the second transfer mechanism 160 may be a second robot. Of course, other driving mechanisms may be used for the first and second transfer mechanisms 150 and 160.
In a second aspect of the present invention, as shown in fig. 3 and fig. 4, a cleaning method S100 is provided, the cleaning method S100 can be performed by using the cleaning apparatus 100 described above, and the detailed structure of the cleaning apparatus 100 can refer to the related description, which is not repeated herein. As shown in fig. 4, the cleaning method S100 includes:
s101, the wafer transfer box is taken out from the loading box by the wafer transfer system and placed at a transfer opening door.
Specifically, as shown in fig. 2, 3 and 4, a FOUP Transfer Robot (FTR) 131 in the wafer Transfer system 130 takes out a FOUP 133 from a Load Port (LP) 132 and places the FOUP 133 at a Port Door Opener (PDO) 134.
S102, judging whether the wafer needs to start the process before cleaning in the wafer conveying box, if so, opening the conveying opening door and executing the step S110, and if not, closing the conveying opening door and executing the step S103.
Specifically, as shown in fig. 2, 3 and 4, it is determined whether the foup 133 of step S101 needs to start the process, where the determination may be made actively by a user or automatically by program setting. If the foup 133 requires the start of the process, the transfer open door 134 is opened and step S110 is performed, whereas if the foup 133 does not require the start of the process at the present time, the transfer open door 134 is closed and step S103 is performed.
S103, the wafer transfer box is placed in the temporary storage area by the wafer transfer system, and when the wafer transfer box needs to start the process, the wafer transfer box is placed at the opening position of the transfer door, and the step S110 is executed.
Specifically, as shown in fig. 3 and 4, the foup robot 131 in the sheet conveying system 130 places the foup 133 in the buffer area and so on until the process is started, and step S110 is executed.
S110, the first conveying mechanism conveys the empty film boxes in the first sub-feeding and discharging positions on the top layer to the film conveying system.
Specifically, as shown in fig. 2 and 3, the first transfer mechanism 150 (first robot) transfers the sheet cassette 200 empty in the first sub upper and lower level 111 of the top layer to the sheet conveying system 130.
After the first conveying mechanism 150 conveys the empty cassettes 200 in the first sub loading and unloading level 111 at the top layer to the cassette conveying system 130, the driving mechanism drives the first sub loading and unloading level 111 at the lower layer to move to the top layer.
And S120, taking out the wafer before cleaning in the wafer transfer box by the wafer transfer system and transferring the wafer to an empty wafer box.
Specifically, as shown in fig. 3 and 4, a Wafer Robot (WTR) 135 in the Wafer Transfer system 130 takes out the Wafer before cleaning in the Wafer Transfer cassette 133 and transfers it to the empty cassette 200 through the Wafer Transfer system 130.
S130, the first conveying mechanism conveys the wafer box placed with the wafer before cleaning to a second loading and unloading position.
Specifically, as shown in fig. 3 and 4, the first conveying mechanism 150 conveys the cassette 200 (i.e., the cassette in step S120) on which the wafer before cleaning is placed into the second loading and unloading level 120.
S140, the second conveying mechanism conveys the wafer box provided with the wafer before cleaning among the process tanks so as to clean the wafer in each process tank.
Specifically, as shown in fig. 3 and 4, the second transfer mechanism 160 (second robot) moves the cassette 200 located in the second loading and unloading position 120 between the process baths 170 so that the wafers in the cassette 200 may sequentially pass through the cleaning process of the process baths 170.
S150, the first conveying mechanism takes out the wafer box with the cleaned wafer from the drying tank and conveys the wafer box to a wafer conveying system. Specifically, step S150 specifically includes:
and S151, judging whether the film transmission system is idle, if so, executing step S152, and if not, executing step S153.
S152, the first conveying mechanism takes out the wafer box with the cleaned wafer from the drying tank and conveys the wafer box to a wafer conveying system, and step S160 is executed.
Specifically, as shown in fig. 3 and 4, the first conveying mechanism 150 takes out the wafer cassette 200 with the cleaned wafer placed therein from the drying tank 140 and conveys the wafer cassette 200 to the wafer conveying system 130, that is, the wafer cassette 200 with the cleaned wafer is sequentially cleaned by the process tanks 170, and finally enters the drying tank 140 for the drying process, and after the wafer is dried, the cleaning process is completed.
S153, the first conveying mechanism takes out the wafer box with the cleaned wafer from the drying tank and conveys the wafer box to a second upper and lower material position for transfer, the wafer box is conveyed to the wafer conveying system when the wafer conveying system is idle, and step S160 is executed.
Specifically, as shown in fig. 3 and 4, the first conveying mechanism 150 takes out the wafer cassette 200 with the cleaned wafer from the drying tank 140 and conveys the wafer cassette to the second loading/unloading position 120 for transferring, and conveys the wafer to the wafer conveying system 130 when the wafer conveying system 130 is idle, and performs step S160.
And S160, the wafer conveying system takes out the cleaned wafer from the wafer box and conveys the cleaned wafer back to the wafer conveying box.
Specifically, as shown in fig. 3 and 4, the wafer robot 135 in the wafer conveying system 130 conveys the wafer in the wafer cassette 200, on which the cleaned wafer is placed, back to the foup 133, and it can be understood that the foup 133 should be an empty foup 133.
And S170, the wafer transmission box carrying the cleaned wafer is placed back into the loading box by the wafer transmission system.
Specifically, as shown in fig. 3 and 4, the foup robot 131 of the wafer transfer system 130 returns the foup 133 carrying the cleaned wafer into the loading box 132.
The cleaning method S100 in the embodiment can effectively reduce the waiting time of each wafer conveying box before the machine process starts, effectively improve the continuity of the previous process and the next process, improve the utilization rate of a process groove of equipment, maximize the continuous process of the equipment when the equipment is fully loaded, reduce the running times of an empty wafer box and the motion frequency of a second manipulator, and improve the service life of the wafer box and the motion reliability of the manipulator, so that the cleaning method S100 in the embodiment can greatly improve the throughput of the machine, namely the output rate of the machine in unit time when the equipment is fully loaded and delivered. In addition, in the cleaning method S100 of the present embodiment, the first conveying mechanism and the second conveying mechanism may move independently without interfering with each other.
The steps S101 to S103 and S151 to S155 are not essential, and those skilled in the art may make a choice according to actual needs.
In order to further increase the throughput of the tool, as shown in fig. 4, the cleaning method S100 further includes, after the step S170:
s181, judging whether a wafer before cleaning exists in the wafer transfer box, if so, executing a step S120, otherwise, executing a step S182;
s182, judging whether an empty wafer box exists in the first sub upper and lower material level at the top layer, if so, executing a step S183, otherwise, executing a step S184;
s183, driving the currently vacant first sub-upper and lower material level to move to the top layer by the driving mechanism, and executing the step S184;
s184, the second conveying mechanism conveys the empty wafer boxes to a first sub-loading and unloading position on the top layer.
According to the cleaning method, when it is judged that no wafer before cleaning exists in the wafer conveying box, it is indicated that no wafer needing cleaning currently exists, at this time, in order to improve production efficiency, a wafer box placed at the first sub upper and lower material positions needs to be prepared in advance, that is, when it is judged that an empty wafer box exists in the first sub upper and lower material positions currently located at the top layer, the driving mechanism drives the first sub upper and lower material positions currently located at the empty position to move to the top layer, and if the empty wafer box does not exist, the second conveying mechanism conveys the empty wafer box to the first sub upper and lower material positions located at the top layer, so that preparation work can be made in advance for cleaning of the next batch of wafers, the preparation time for cleaning the wafers is shortened, and the yield of a machine is improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (9)
1. A cleaning device is characterized by comprising a sheet conveying system, a drying tank, a first conveying mechanism, a second conveying mechanism, a plurality of process tanks, at least one first material loading and unloading position and at least one second material loading and unloading position; wherein,
the first upper and lower material level comprises a plurality of first sub upper and lower material levels which are arranged in a stacked mode, the plurality of first sub upper and lower material levels can be lifted, and the first sub upper and lower material levels are only used for bearing empty film boxes;
the second upper and lower material level is of a single-layer structure and is used for bearing a wafer box for placing wafers before cleaning and a wafer box for placing cleaned wafers, and the second upper and lower material level is flush with the first upper and lower material level on the top layer;
the first conveying mechanism is used for conveying the empty film boxes in the first sub-feeding and discharging positions on the top layer to the film conveying system; conveying the wafer box placed with the wafer before cleaning to the second loading and unloading position; taking out the wafer box with the cleaned wafer from the drying tank and conveying the wafer box with the cleaned wafer to the wafer conveying system;
the second conveying mechanism is used for conveying the wafer boxes provided with the wafers before cleaning among the process tanks, and conveying the wafer boxes provided with the wafers before cleaning or the wafer boxes provided with the wafers after cleaning among the process tanks and the second upper and lower material positions; the second conveying mechanism conveys the vacant wafer boxes to a first sub-loading and unloading position on the top layer;
the wafer conveying system is used for conveying the wafers before being cleaned in the wafer conveying box into the vacant wafer box and conveying the cleaned wafers back into the wafer conveying box.
2. The cleaning device of claim 1, wherein the first transfer mechanism and the second transfer mechanism are each a robot structure.
3. The cleaning device according to claim 1 or 2, further comprising a driving mechanism connected to each of the first sub upper and lower material levels for driving each of the first sub upper and lower material levels to ascend and descend.
4. The cleaning device as claimed in claim 3, wherein the driving mechanism is a rack and pinion mechanism, a gear of the rack and pinion mechanism is connected to an output shaft of the driving motor, and a rack is engaged with the gear and connected to each of the first sub-upper and lower material positions.
5. A cleaning method applied to the cleaning apparatus according to any one of claims 1 to 4, comprising:
s110, the first conveying mechanism conveys a vacant film box in the first sub-feeding and discharging position on the top layer to a film conveying system;
s120, the wafer conveying system takes out the wafer before cleaning in the wafer conveying box and conveys the wafer to the vacant wafer box;
s130, the first conveying mechanism conveys the wafer box placed with the wafer before cleaning to the second loading and unloading position;
s140, the wafer box placed with the wafer before cleaning is conveyed among the process tanks by the second conveying mechanism so as to clean the wafer in each process tank;
s150, the first conveying mechanism takes out the wafer box with the cleaned wafer from the drying tank and conveys the wafer box to the wafer conveying system;
and S160, the wafer conveying system takes out the cleaned wafer from the wafer box and conveys the cleaned wafer back to the wafer conveying box.
6. The cleaning method according to claim 5, wherein in step S110, after the first conveying mechanism conveys the empty cassette in the first sub loading and unloading position of the top layer to the cassette conveying system, the driving mechanism drives the first sub loading and unloading position of the lower layer to move to the top layer.
7. The cleaning method according to claim 5, further comprising, before step S110:
s101, the wafer transfer box is taken out from the loading box by the wafer transfer system and placed at a transfer opening door;
s102, judging whether the wafer in the wafer conveying box needs to start the process or not, if so, opening the conveying opening door and executing the step S110, otherwise, closing the conveying opening door and executing the step S103;
s103, the wafer transfer box is placed in a temporary storage area by the wafer transfer system, and when the wafer transfer box needs to start the process, the wafer transfer box is placed at the transfer opening door, and the step S110 is executed;
further included after step S160 is:
and S170, the wafer transmission box carrying the cleaned wafer is placed back into the loading box by the wafer transmission system.
8. The cleaning method according to claim 7, wherein the step S150 includes:
s151, judging whether the film transfer system is idle, if so, executing a step S152, otherwise, executing a step S153;
s152, the first conveying mechanism takes out the wafer box with the cleaned wafer from the drying tank and conveys the wafer box to the wafer conveying system, and step S160 is executed;
and S153, taking out the wafer box with the cleaned wafer from the drying tank by the first conveying mechanism, conveying the wafer box to the second upper and lower material positions for transfer, conveying the wafer box to the wafer conveying system when the wafer conveying system is idle, and executing the step S160.
9. The cleaning method according to claim 7, when applied to the cleaning apparatus according to claim 3 or 4, further comprising, after step S170:
s181, judging whether a wafer before cleaning exists in the wafer transfer box, if so, executing a step S120, otherwise, executing a step S182;
s182, judging whether an empty magazine exists in the first sub loading and unloading position of the top layer, if so, executing a step S183, otherwise, executing a step S184;
s183, the driving mechanism drives the currently vacant first sub-upper and lower material level to move to the top layer, and the step S184 is executed;
s184, the second conveying mechanism conveys the empty wafer boxes to a first sub-loading and unloading position on the top layer.
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| CN201910599771.XA CN110299313B (en) | 2019-07-04 | 2019-07-04 | Cleaning device and cleaning method |
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| CN201910599771.XA CN110299313B (en) | 2019-07-04 | 2019-07-04 | Cleaning device and cleaning method |
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| US11964343B2 (en) * | 2020-03-09 | 2024-04-23 | Applied Materials, Inc. | Laser dicing system for filamenting and singulating optical devices |
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| JP2544056Y2 (en) * | 1987-11-19 | 1997-08-13 | 大日本スクリ−ン製造 株式会社 | Wafer surface treatment equipment |
| US7108752B2 (en) * | 2000-06-05 | 2006-09-19 | Tokyo Electron Limited | Liquid processing apparatus and liquid processing method |
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| CN105140162B (en) * | 2015-09-09 | 2017-11-10 | 张家港市超声电气有限公司 | Full-automatic silicon wafer inserted sheet and purging system |
| CN105329619B (en) * | 2015-09-25 | 2017-09-26 | 浙江超威创元实业有限公司 | A kind of full-automatic Non-intermittent feed mechanism and its charging method |
| CN108597987A (en) * | 2018-05-08 | 2018-09-28 | 广西桂芯半导体科技有限公司 | The cleaning method of semiconductor crystal wafer |
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