CN110293339A - A kind of aqueous solder resist and preparation method thereof - Google Patents
A kind of aqueous solder resist and preparation method thereof Download PDFInfo
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- CN110293339A CN110293339A CN201910607071.0A CN201910607071A CN110293339A CN 110293339 A CN110293339 A CN 110293339A CN 201910607071 A CN201910607071 A CN 201910607071A CN 110293339 A CN110293339 A CN 110293339A
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- solder resist
- water
- preparation
- aqueous
- aqueous solder
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 52
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000003756 stirring Methods 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000839 emulsion Substances 0.000 claims abstract description 11
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 11
- 239000010935 stainless steel Substances 0.000 claims abstract description 10
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 10
- 239000000375 suspending agent Substances 0.000 claims abstract description 9
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 claims abstract description 8
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 claims abstract description 8
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 claims abstract description 8
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000012452 mother liquor Substances 0.000 claims abstract description 8
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 5
- 239000004615 ingredient Substances 0.000 claims abstract description 5
- 239000010959 steel Substances 0.000 claims abstract description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 6
- 239000003755 preservative agent Substances 0.000 claims description 6
- 230000002335 preservative effect Effects 0.000 claims description 6
- 239000002518 antifoaming agent Substances 0.000 claims description 5
- 239000002270 dispersing agent Substances 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 5
- 239000000395 magnesium oxide Substances 0.000 claims description 5
- JMXROTHPANUTOJ-UHFFFAOYSA-H naphthol green b Chemical compound [Na+].[Na+].[Na+].[Fe+3].C1=C(S([O-])(=O)=O)C=CC2=C(N=O)C([O-])=CC=C21.C1=C(S([O-])(=O)=O)C=CC2=C(N=O)C([O-])=CC=C21.C1=C(S([O-])(=O)=O)C=CC2=C(N=O)C([O-])=CC=C21 JMXROTHPANUTOJ-UHFFFAOYSA-H 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical class CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 claims description 4
- 239000006210 lotion Substances 0.000 claims description 3
- 229920000609 methyl cellulose Polymers 0.000 claims description 3
- 239000001923 methylcellulose Substances 0.000 claims description 3
- 235000010981 methylcellulose Nutrition 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000003995 emulsifying agent Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000002562 thickening agent Substances 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 239000000080 wetting agent Substances 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 14
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 10
- 238000003466 welding Methods 0.000 abstract description 9
- 238000001035 drying Methods 0.000 abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 231100000252 nontoxic Toxicity 0.000 abstract description 2
- 230000003000 nontoxic effect Effects 0.000 abstract description 2
- 239000003973 paint Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 9
- 238000005219 brazing Methods 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- QYYMDNHUJFIDDQ-UHFFFAOYSA-N 5-chloro-2-methyl-1,2-thiazol-3-one;2-methyl-1,2-thiazol-3-one Chemical compound CN1SC=CC1=O.CN1SC(Cl)=CC1=O QYYMDNHUJFIDDQ-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- -1 hydroxypropyl Chemical group 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Paints Or Removers (AREA)
Abstract
The present invention provides a kind of aqueous solder resist and preparation method thereof, solder resist of the invention is that water paint is non-toxic, and non-ignitable, wherein nanometer titanium dioxide plays main welding resistance, and the titanium dioxide activity of Nano grade is good, and cementability is good；Acrylic emulsion is film forming agent, acts as bonding effect, and hydroxypropyl methyl cellulose is suspending agent.The preparation method of aqueous solder resist includes: S1, with mother liquor: taking titanium dioxide, water, uniformly mixes in stainless steel stirring container, acrylic emulsion is added, continues to stir；S2, match suspending agent: taking hydroxypropyl methyl cellulose, water, stirred in rustless steel container；S3, suspending agent is added in mother liquor, continues to stir, adds remaining ingredient respectively, be kept stirring until the uniformity is qualified.Solder resist of the invention avoids silicon atom corrosion aluminium alloy risk, and mobility, drying effect, cohesive force meet requirements of the national standard and performance meets professional standard and engineering requirement.
Description
Technical field
The present invention relates generally to welding technique field, more particularly to a kind of aqueous solder resist and preparation method thereof.
Background technique
In aluminium alloy gas brazing, solder resist is mainly used for the following aspects: 1, in continuous brazing furnace brazing process,
Protection does not need the part of soldering, and solder is avoided to flow to the position for not needing welding；2 and Process of Vacuum Brazing in protect not
The position for needing to be brazed；3, high-temperature heat treatment, the high temperature bonding of guard block, the heat treatment etc. of electronics industry.
Currently, current solder resist is mostly external import, and contains talcum powder in the solder resist of most of types, exist
Silicon atom generates the potential risk of corrosion aluminium alloy.Therefore urgent need develops one kind and is suitble to the country to use, avoids silicon atom corrosion aluminium
Alloy risk increases mobility and drying effect and enhances bonding force and increase the solder resist of cost performance.
Summary of the invention
It is an object of the invention to overcome the defect of the existing solder resist in the U.S., a kind of aqueous solder resist and its preparation side are provided
Method, the solder resist avoid silicon atom corrosion aluminium alloy risk, and mobility, drying effect, cohesive force meet national standard and want
It asks and performance meets professional standard and engineering requirement.
The technical scheme is that a kind of aqueous solder resist, it includes following component:
Film-forming resin lotion: acrylic emulsion；
Filler: titanic oxide nano；
Thickener: hydroxypropyl methyl cellulose；
Solder resist of the invention is water paint, non-toxic, non-ignitable.Nanometer titanium dioxide therein is filler, plays main resistance
Weldering effect, the titanium dioxide activity of Nano grade is good, and cementability is good；Acrylic emulsion is film forming agent, acts as bonding effect, hydroxypropyl
Ylmethyl cellulose is suspending agent.
Further, aqueous solder resist of the invention further includes following components:
Magnesia；
Pigment: acid green 1；
Wetting agent: propylene glycol；
Emulsifier: ethoxylated dodecyl alcohol；
And dispersing agent, preservative, defoaming agent and deionized water.
In said components, magnesia is high temperature resistant filler, obstructs the flowing welding of welding material, reaches welding resistance function；Acid
Green 1 pigment of property, AS 19381-50-1；Preservative be avoid in transit storage period long organic matter it is rotten, it is recommended to use
Kathon CG；Other dispersing agents, preservative and defoaming agent use auxiliary agent commonly used in the art.Brush can be used in solder resist of the invention
It is coated in workpiece or injection system and is needing position, protection welding or heat treatment procedure are not required to the part of welding.
Further, the content range of above-mentioned each component is as follows:
Acrylic emulsion: 48%；
Titanium dioxide: 35；
Magnesia: 5；
Acid green 1:0.5；
Ethoxylated dodecyl alcohol: 0.2；
Hydroxypropyl methyl cellulose: 0.05；
Dispersing agent: 0.02；
Preservative: 0.02；
Defoaming agent: 0.02；
Deionized water: 40-48.
It is also further, it is above-mentioned
The present invention also provides the preparation method of above-mentioned aqueous solder resist, it the following steps are included:
S1, match mother liquor: taking titanium dioxide, water, uniformly mixed in stainless steel stirring container, acrylic emulsion is added, continue
Stirring；
S2, match suspending agent: taking hydroxypropyl methyl cellulose, water, stirred in rustless steel container；
S3, suspending agent is added in mother liquor, continues to stir, adds remaining ingredient respectively, be kept stirring until the uniformity is closed
Lattice.
Further, the mixed proportion of titanium oxide and water is by weight in above-mentioned steps S1 are as follows: 35-45.
Further, uniformly mixing is carried out by agitating mode in above-mentioned steps S1, mixing speed 30RPM, mixing time
30 minutes.
Further, the time for continuing stirring in above-mentioned steps S1 after addition acrylic emulsion is 30 minutes.
Further, the mixed proportion of the water that the water in above-mentioned steps S2 is 100 degrees Celsius, methylcellulose and water is by weight
Amount part is calculated as: 6-94；Mixing speed is 30RPM；Mixing time is 10 minutes.
Further, continue in above-mentioned steps S3 stirring speed be 40RPM, add remaining ingredient after continue stirring when
Between for not less than 2 hours.
There is no silicon atoms to corrode aluminium alloy risk for solder resist of the invention, and mobility and drying effect are good, and bonding force
Cost performance is good with increasing.
Detailed description of the invention
Fig. 1 is the solder resist and the scratch resistant experiment effect comparison chart of existing solder flux that the embodiment of the present invention obtains；
Wherein (a) is the surface picture scratched after the coating of existing solder resist is 4.5 hours dry；(b) embodiment of the present invention hinders
The scratch surface picture of dry 2.5 hours of coating of solder flux；
Fig. 2 is that the solder resist that the embodiment of the present invention obtains is compared with the wear-resisting experiment effect of existing solder resist, and (a) is existing resistance
The surface picture to rub after solder flux coating is 4.5 hours dry；(b) it the coating of solder resist of the embodiment of the present invention dry 2.5 hours rubs
The surface picture of wiping.
Fig. 3 is the position that automobile radiators soldering is contacted using fixture with aluminium alloy heat-dissipating pipe, and solder resist is coated in stainless steel
Point well laid on fixture, fixture is waited during the brazing process will not be bonded heat-dissipating pipe, and surface is intact.
Fig. 4 is that solder resist brazing material in stainless steel fixture polar distribution of field poor distribution, soldering flows on fixture, leads to fixture and aluminium
Compo pipe bonding, when separating clamp, cause heat-dissipating pipe damaged, radiator loss function, scrap of the product.
Specific embodiment
In order to make those skilled in the art more fully understand the present invention, With reference to embodiment to the present invention make into
One step is described in detail.
Embodiment 1
A kind of preparation method of aqueous solder resist, comprising the following steps:
With mother liquor: 38 parts of titanium dioxide is taken, 46 parts of water uniformly mixes, speed 30RPM in stainless steel stirring container,
Stirring 30 minutes is added 13 parts of acrylic emulsion, continues stirring 30 minutes；
With suspending agent: taking 6 parts of methylcellulose (viscosity 50,000), 94 parts of 100 degrees Celsius of water is stirred in rustless steel container
It mixes, speed 30RPM, stirs ten minutes.
Suspension is added in mother liquor, continues to stir, speed 40RPM adds surplus material respectively, it is kept stirring 2 hours,
Obtain aqueous solder resist.
Embodiment 2
Experiment effect compares:
Experimental material: solder resist of the present invention and existing solder resist
The coated material of experiment is the nickel alloy strip and diameter 20mm304 stainless steel tube of 0.07 millimeters thick, quilt respectively
Coating surface is bright and clean.
Test method and result: two kinds of solder resist materials are coated on nickel alloy strip surface respectively using hairbrush；Respectively not
Steel tube surface of becoming rusty coats two kinds of solder resist materials, and the nickel alloy strip of 0.07 millimeters thick represents electronics industry winding band, diameter
(fixture effect: the tooling of welding front clamp product makes vapour to be welded to the aluminium alloy fixture of 20mm304 stainless steel tube automobile industry
There is contact between vehicle part aluminum alloy part, create and be brazed the necessary condition that solder journey offer contact is formed).Diameter is used in experiment
1.0mm iron wire touches coating, judges actual job method: being still that iron wire is stained in the meeting of dampness if drying effect is inadequate.Through
It examines, the drying time of existing solder resist is 4.5 hours, and the drying time of the present embodiment is 2.5 hours, finally by diameter
The iron wire difference scratch coating of 1mm can be seen as shown in Fig. 1 and simulation artificial hand friction coatings Fig. 2 of real work place recruitment
The solder resist drying time of the embodiment of the present invention is short out, and scratch resistance and frictional behaviour are better than existing solder resist.
Fig. 3 is the position that automobile radiators soldering is contacted using fixture with aluminium alloy heat-dissipating pipe, and solder resist is coated in stainless steel
Point well laid on fixture, fixture is waited during the brazing process will not be bonded heat-dissipating pipe, and surface is intact.
Fig. 4 is that solder resist brazing material in stainless steel fixture polar distribution of field poor distribution, soldering flows on fixture, leads to fixture and aluminium
Compo pipe bonding, when separating clamp, cause heat-dissipating pipe damaged, radiator loss function, scrap of the product.
Various embodiments of the present invention are described above, above description is exemplary, and non-exclusive, and
It is not limited to disclosed each embodiment.Without departing from the scope and spirit of illustrated each embodiment, for this skill
Many modifications and changes are obvious for the those of ordinary skill in art field.Therefore, protection scope of the present invention is answered
This is subject to the protection scope in claims.
Claims (9)
1. a kind of aqueous solder resist, which is characterized in that it includes following component:
Film-forming resin lotion: acrylic emulsion；
Filler: titanium dioxide；
Thickener: hydroxypropyl methyl cellulose.
2. aqueous solder resist as described in claim 1, which is characterized in that further include following components:
High temperature filler: magnesia；
Pigment: acid green 1；
Wetting agent: propylene glycol；
Emulsifier: ethoxylated dodecyl alcohol；
Dispersing agent, preservative, defoaming agent and deionized water.
3. aqueous solder resist as claimed in claim 2, which is characterized in that the mass percentage content range of each component is such as
Under:
Acrylic emulsion: 48%；
Titanium dioxide: 35；
Magnesia: 5；
Acid green 1:0.5；
Ethoxylated dodecyl alcohol: 0.2；
Hydroxypropyl methyl cellulose: 0.05；
Dispersing agent: 0.02；
Preservative: 0.02；
Defoaming agent: 0.02；
Deionized water: 40-48.
4. the preparation method of the aqueous solder resist as described in any claim in claim 1-3, which is characterized in that it includes
Following steps:
S1, match mother liquor: taking titanium dioxide, water, uniformly mixed in stainless steel stirring container, acrylic emulsion is added, continues to stir；
S2, match suspending agent: taking hydroxypropyl methyl cellulose, water, stirred in rustless steel container；
S3, suspending agent is added in mother liquor, continues to stir, adds remaining ingredient respectively, be kept stirring until the uniformity is qualified.
5. the preparation method of aqueous solder resist as claimed in claim 4, which is characterized in that titanium oxide and water in the step S1
Mixed proportion by weight are as follows: 35-45.
6. the preparation method of aqueous solder resist as claimed in claim 4, which is characterized in that uniformly mixing is logical in the step S1
It crosses agitating mode to carry out, mixing speed 30RPM, mixing time 30 minutes.
7. the preparation method of aqueous solder resist as claimed in claim 4, which is characterized in that acrylic acid is added in the step S1
The time for continuing stirring after lotion is 30 minutes.
8. the preparation method of aqueous solder resist as claimed in claim 4, which is characterized in that the water in the step S2 is 100
Degree Celsius water, the mixed proportion of methylcellulose and water is by weight are as follows: 6-94；Mixing speed is 30RPM；Mixing time
It is 10 minutes.
9. the preparation method of aqueous solder resist as claimed in claim 4, which is characterized in that continue stirring in the step S3
Speed is 40RPM, continues the time of stirring after adding remaining ingredient as not less than 2 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910607071.0A CN110293339A (en) | 2019-07-06 | 2019-07-06 | A kind of aqueous solder resist and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910607071.0A CN110293339A (en) | 2019-07-06 | 2019-07-06 | A kind of aqueous solder resist and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110293339A true CN110293339A (en) | 2019-10-01 |
Family
ID=68030630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910607071.0A Pending CN110293339A (en) | 2019-07-06 | 2019-07-06 | A kind of aqueous solder resist and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110293339A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111995905A (en) * | 2020-08-24 | 2020-11-27 | 桂林智熠感光材料科技有限公司 | Water-based thermosetting PCB (printed Circuit Board) circuit insulation solder resist ink and preparation method and use method thereof |
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