CN110290630B - Power module assembling structure - Google Patents
Power module assembling structure Download PDFInfo
- Publication number
- CN110290630B CN110290630B CN201810225277.2A CN201810225277A CN110290630B CN 110290630 B CN110290630 B CN 110290630B CN 201810225277 A CN201810225277 A CN 201810225277A CN 110290630 B CN110290630 B CN 110290630B
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- layer
- external pin
- power module
- conductive
- assembly structure
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 2
- 239000007769 metal material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract description 3
- 230000002787 reinforcement Effects 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 8
- 239000004519 grease Substances 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a power module assembly structure. The structure comprises an element layer, a flexible board layer and an external pin layer; the element layer is arranged on a first side of the flexible board layer, and at least one element of the element layer is electrically connected with a first side of at least one conductive area of the flexible board layer; the flexible board layer is arranged on the external pin layer, and at least one external pin of the external pin layer is electrically connected with a second side of at least one conductive area; the heat energy generated by at least one element is directly transmitted to the outside of the power element device through at least one conductive area and at least one external pin to dissipate heat and achieve the purpose of electrical connection. According to the invention, through the change of the assembly structure, the heat energy generated by the element is made of metal material with extremely low thermal resistance in the conduction process, so that the heat dissipation efficiency can be effectively improved; in addition, the heat dissipation design of the power module assembly structure is regulated and controlled through the reinforcement or reduction of the conductive path; the cost is reduced because no heat sink and no heat dissipation paste are used.
Description
Technical Field
The present invention relates to a power module assembly structure, and more particularly, to a power module assembly structure with high heat dissipation efficiency.
Background
In a conventional power module assembly structure, a ceramic substrate is used as a substrate for circuit wiring, various components of the power module are disposed on the ceramic substrate, and external pins (wire bonding) are soldered to the edge of the ceramic substrate to electrically connect to a circuit outside the power module. In the conventional power module assembly structure, the heat energy of the element is mainly conducted to the ceramic substrate, and the heat sink is arranged below the ceramic substrate as a main heat dissipation means.
In addition, the conventional power module has a structure in which a heat sink is disposed under a ceramic substrate, and a Thermal Grease (Thermal Grease) is added therebetween, and the Thermal Grease generally has a low Thermal conductivity even though the Thermal conductivities of the ceramic substrate and the heat sink are relatively high. Therefore, the heat generated by the element is conducted to the ceramic substrate, passes through the heat dissipation paste and then is conducted to the heat dissipation plate, the heat resistance of the heat flow path is quite large, and the heat dissipation efficiency cannot be improved. In addition, the conventional power module needs to be provided with a heat sink, which is not effective in cost reduction.
Therefore, it is an important issue in the industry to provide a power module assembly structure with high heat dissipation efficiency and low cost.
Disclosure of Invention
In view of the above, the present invention provides a power module assembly structure, which includes a device layer including at least one device, wherein the at least one device includes a plurality of device electrical pins and other control circuit devices; a flexible printed circuit board (FPC) layer including at least one insulation region and at least one conductive region, wherein the at least one conductive region is disposed corresponding to the at least one device, one of a plurality of device electrical pins of the at least one device is electrically connected to the at least one conductive region, and the device layer is disposed on a first side of the FPC layer; the external pin layer is arranged on a second side of the flexible board layer, the first side and the second side of the flexible board layer are opposite, the external pin layer comprises at least one external pin, and the at least one external pin is electrically connected with the at least one conductive area of the flexible board layer; wherein a heat energy generated by the at least one component is directly conducted to the outside of the power module package structure through the at least one conductive region and the at least one external pin.
Preferably, the external pin layer includes a pin layer substrate, and the at least one external pin is disposed in the pin layer substrate corresponding to the at least one wire region.
Preferably, the at least one conductive region is a conductive region with two open sides. Preferably, the at least one device electrical pin of the at least one device is electrically connected to the at least one conductive region through a first connecting material layer, and the at least one conductive region is electrically connected to the at least one external pin of the external pin layer through a second connecting material layer.
Preferably, the first connecting material layer and the second connecting material layer include a lead-free solder, a solder paste or a conductive silver paste.
In view of the above, the present invention provides a power module assembly structure, including: an element layer comprising a plurality of elements; the device layer is arranged on a first side of the flexible board layer, and the elements are electrically connected with a first side of each of the conductive areas of the flexible board layer; the flexible printed circuit board comprises a plurality of conductive areas, a flexible printed circuit board layer, an external pin layer and a circuit board, wherein the flexible printed circuit board layer is arranged on the external pin layer, the external pin layer comprises at least one external pin, and the at least one external pin is electrically connected with the second sides of the conductive areas; wherein, a heat energy generated by at least one element is directly transmitted to the outside of the power element device through at least one conductive area and at least one external pin for heat dissipation.
Preferably, the external pin layer includes a pin layer substrate, and the at least one external pin is disposed in the pin layer substrate and corresponds to the at least one conductive region.
Preferably, at least one of the components is electrically connected to at least one of the conductive regions through a first connecting material layer, and at least one of the conductive regions is electrically connected to at least one of the external pins of the external pin layer through a second connecting material layer.
Preferably, the first connecting material layer and the second connecting material layer include a lead-free solder, a solder paste or a conductive silver paste.
In summary, the assembly structure of the power module of the present invention is changed so that the heat generated by the components is made of a metal material with extremely low thermal resistance in the conduction process, and thus the heat dissipation efficiency of the power module can be effectively improved. In addition, because the heat energy conduction path generated by the element is the same as the conduction path in the invention, when the power module is designed, the heat dissipation design of the power module assembly structure can be regulated and controlled by strengthening or reducing the conduction path. In addition, because the power module assembly structure does not use a heat sink and heat dissipation paste, the cost can be further reduced.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic diagram of a cross section of a power module assembly structure of an embodiment of the present invention.
Fig. 2 is an exploded schematic view of a power module assembly structure according to an embodiment of the present invention.
Fig. 3 is a partial schematic view of the power module assembly structure of fig. 1.
Detailed Description
Various exemplary embodiments will be described more fully hereinafter with reference to the accompanying drawings, in which some exemplary embodiments are shown. The inventive concept may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like numbers refer to like elements throughout.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be termed a second element without departing from the inventive concept. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The power module assembly structure will be described with reference to the drawings by at least one embodiment, which is not intended to limit the scope of the invention.
[ embodiment of Power Module Assembly Structure of the invention ]
Referring to fig. 1 and 2, fig. 1 is a schematic cross-sectional view of a power module assembly structure according to an embodiment of the invention. Fig. 2 is an exploded view of the power module assembly structure according to the embodiment of the present invention.
In the embodiment of the present invention, the power module assembly structure 1 is a module or a device that provides a dc voltage or an ac voltage through various power devices or power switches, in which the power module assembly structure 1 is not limited to a specific type of power device or power switch, and the type of power device is not limited in the present invention.
The power module assembly structure 1 includes a device layer 11, a flexible printed circuit board 12 and an external lead layer 13. The device layer 11 is disposed on a first side (not shown) of the flexible printed circuit board 12, and the external lead layer 13 is disposed on a second side of the flexible printed circuit board 12. Wherein the first side and the second side of the flexible printed circuit board 12 are opposite sides of the flexible printed circuit board 12, i.e. the component layer 11 and the external pin layer 13 are disposed on two sides of the flexible printed circuit board 12. In the present embodiment, the device layer 11 includes a plurality of power devices and other control devices, passive devices, etc., and the plurality of devices form a control circuit through a conductive layer (e.g., copper foil) of the flexible board layer 12.
In the present embodiment, the device layer 11 includes a first device 111, a second device 112, and a third device 113. That is, the element layer 11 includes at least one element. In addition, the number of elements included in the element layer 11 may be adjusted and designed according to actual requirements, and is not limited in the present invention.
In this embodiment, the power device on the device layer 11 is a heat source, and when the power module is powered, each device enters the operating mode, and the heat generated by each device is conducted to the flexible printed circuit board layer 12.
In the present embodiment, the flexible printed circuit board 12 is a flexible printed circuit board, and includes an insulating region 120, a first conductive region 121, a second conductive region 122, and a third conductive region 123. The first conductive region 121, the second conductive region 122, and the third conductive region 123 of the sheet layer 12 are correspondingly disposed according to the disposition positions of the first element 111, the second element 112, and the third element 113 of the element layer 11. That is, the first element 111 is electrically connected to the first conductive region 121, the second element 112 is electrically connected to the second conductive region 122, and the third element 113 is electrically connected to the third conductive region 123. In the present embodiment, the flexible printed circuit 12 is a double-sided windowed solder-exposed flexible printed circuit, and the flexible printed circuit 12 is provided with a conductive layer electrically connected to other circuits.
Further, the first element 111, the second element 112 and the third element 113 respectively include a plurality of element electrical pins (not shown). One of the device electrical pins (not shown) of the first device 111 is electrically connected to the first conductive region 121. One of the plurality of device electrical pins (not shown) of the second device 112 is electrically connected to the second conductive region 122. One of the device electrical pins (not shown) of the third device 113 is electrically connected to the third conductive region 123.
In the present embodiment, the flexible printed circuit board 12 further includes a fourth conductive region 124, a fifth conductive region 125 and a sixth conductive region 126. One of the device electrical pins (not shown) of the first device 111 is electrically connected to the fourth conductive region 124. One of the plurality of device electrical pins (not shown) of the second device 112 is electrically connected to the fifth conductive region 125. One of the plurality of device electrical pins (not shown) of the third device 113 is electrically connected to the sixth conductive region 126.
In this embodiment, the number of the conductive areas of the flexible printed circuit board 12 can be adjusted according to actual requirements, and is not limited in the present invention. Further, the number of the conductive areas of the flexible printed circuit board 12 can be adjusted according to the heat generation condition of the first element 111, the second element 112, and the third element 113 of the element layer 11, that is, the user can correspondingly set the conductive areas on the flexible printed circuit board 12 according to the input pins or the output pins of the voltage and the current of each element. In the present embodiment, the first conductive region 121, the second conductive region 122, the third conductive region 123, the fourth conductive region 124, the fifth conductive region 125, and the sixth conductive region 126 are conductive regions with openings on both sides of the flexible board layer 12, that is, copper foil or other conductive material is laid on the flexible board layer 12, and openings are formed on both sides of the flexible board layer 12 to serve as regions for electrically connecting the device layer 11 and the external lead layer 13.
The external pin layer 13 includes a pin layer substrate, wherein the external pin layer includes a pin layer body 130, a first external pin 131, a second external pin 132, and a third external pin 133. In the present embodiment, the first external pin 131, the second external pin 132, and the third external pin 133 are disposed in the pin layer substrate 130. The first external pin 131, the second external pin 132, and the third external pin 133 are electrically connected to the second side of the first conductive region 121, the second side of the second conductive region 122, and the second side of the third conductive region 123, respectively.
In the present embodiment, the outer lead layer 13 further includes a fourth outer lead 134. The fourth outer leg 134 is electrically connected to the fourth conductive region 124, the fifth conductive region 125 and the sixth conductive region 126. In practical pin designs, the fourth external pin 134 may be a power pin or a ground pin.
In the present embodiment, the material of the pin layer substrate 130 is plastic, however, a user can adjust the design according to actual requirements, and the invention is not limited thereto.
Further, the heat generated by the first element 111 can be directly conducted to the outside of the power module assembly structure 1 through the first conductive region 121 and the first external pin 131. The heat generated by the second element 112 can be directly conducted to the outside of the power module assembly structure 1 through the second conductive region 122 and the second external pin 132. The heat generated by the third component 113 can be directly conducted to the outside of the power module assembly structure 1 through the third conductive region 123 and the third external pin 133. In addition, the heat generated by the first, second and third components 111, 112 and 113 can be directly conducted to the outside of the power module assembly structure 1 through the fourth, fifth, sixth and fourth conductive regions 124, 125, 126 and the fourth external pin 134.
In the present embodiment, the first external pin 131, the second external pin 132, the third external pin 133, and the fourth external pin 134 are each a flat conductive metal plate. That is, the thickness and width of the first external pin 131, the second external pin 132, the third external pin 133, and the fourth external pin 134 may be designed and adjusted according to the magnitude of the output voltage and current or the magnitude of the input voltage and current, which is not limited in the present invention. In other embodiments, the thickness of the first external pin 131, the second external pin 132, the third external pin 133, and the fourth external pin 134 is between 0.1mm and 5mm, and a user can adjust the thickness according to the magnitude of the flowing current, which is not limited in the present invention.
In this embodiment, the power module assembly structure further includes an encapsulation material layer 10 disposed on the upper side of the component layer 11 and the flexible board layer 12.
Referring to fig. 2, the power module assembly structure 1 in the present embodiment further includes a first connection material layer 14 and a second connection material layer 15. One of the component electrical pins of the first component 111, the second component 112, and the third component 113 is electrically connected to the first conductive region 121, the second conductive region 122, and the third conductive region 123 through the first connection material layer 14. In addition, one of the component electrical pins of the first component 111, the second component 112, and the third component 113 is electrically connected to the fourth conductive region 124, the fifth conductive region 125, and the sixth conductive region 126 through the first connection material layer 14.
The first conductive region 121, the second conductive region 122, and the third conductive region 123 are electrically connected to the first external pin 131, the second external pin 132, and the third external pin 133, respectively, through a second connection material layer 15. The fourth conductive region 124, the fifth conductive region 125, and the sixth conductive region 126 are electrically connected to the fourth external pin 134 through a second connecting material layer 15, respectively.
In the present embodiment, the first connecting material layer 14 and the second connecting material layer 15 include a lead-free solder, a solder paste or a conductive silver paste, which can be adjusted and designed according to actual requirements, and the invention is not limited thereto.
Referring to fig. 3, fig. 3 is a partial schematic view of the power module assembly structure in fig. 1.
In the power module assembly structure 1, a partially assembled structure is extracted as a reference for explaining a heat conduction manner.
The heat energy generated by the first element 111 is conducted through the first connection material layer 14, the first conductive region 121, and the second connection material layer 15 to the first external pin 131. In the present embodiment, the first external pins 131 are flat pins, and have higher thermal conduction efficiency than the thin wires, so that the thermal conduction can be effectively conducted to the outside of the power module assembly structure 1.
Further, in the present embodiment, the thermal energy conducting direction H of the thermal energy generated by the first component 111 is conducted through the conducting path, that is, one of the component electrical pins of the first component 111 is electrically connected to the first side of the first conductive region 121 through the first connecting material layer 14, and the second side of the first conductive region 121 is electrically connected to the first external pin 131 through the second connecting material layer 15. In the embodiment, a user selects the electrical pin of the component with a particularly large output current or input current of the first component 111 as the setting selection of the conductive area, so that the heat energy generated by the first component 111 flowing through a large current can be quickly conducted to the outside of the power module assembly structure through the conductive path. In this embodiment, the heat conduction manner of the other conductive regions and the external pins is also the same as the heat conduction manner described above, and is not described herein again.
[ possible effects of the embodiment ]
In summary, the assembly structure of the power module of the present invention is changed so that the heat generated by the components is made of a metal material with extremely low thermal resistance in the conduction process, and thus the heat dissipation efficiency of the power module can be effectively improved. In addition, because the heat energy conduction path generated by the element is the same as the conduction path in the invention, when the power module is designed, the heat dissipation design of the power module assembly structure can be regulated and controlled by strengthening or reducing the conduction path. In addition, because the power module assembly structure does not use a heat sink and heat dissipation paste, the cost can be further reduced.
The above description is only an example of the present invention, and is not intended to limit the scope of the present invention.
Claims (9)
1. A power module assembly structure, characterized by comprising:
the device layer comprises at least one device, and the at least one device comprises a plurality of device electrical pins;
a flexible board layer, including at least an insulation area and at least a conductive area, the at least a conductive area and the at least one device are disposed correspondingly, one of the plurality of device electrical pins of the at least one device is electrically connected to the at least a conductive area, the device layer is disposed on a first side of the flexible board layer; and
the external pin layer is arranged on a second side of the flexible board layer, the first side and the second side of the flexible board layer are opposite, the external pin layer comprises at least one external pin, and the at least one external pin is electrically connected with the at least one conductive area of the flexible board layer;
wherein a heat energy generated by the at least one component is directly conducted to the outside of the power module assembly structure through the at least one conductive region and the at least one external pin;
wherein the flexible board layer is flat, and the at least one conductive area is a copper foil;
wherein, the at least one external pin is flat;
wherein one of the plurality of component electrical pins of the at least one component, the at least one conductive area and the at least one external pin are electrically connected in a flat manner.
2. The power module assembly structure of claim 1, wherein the external pin layer comprises a pin layer substrate, the at least one external pin being disposed within the pin layer substrate in correspondence with the at least one conductive area.
3. The power module assembly structure of claim 1, wherein the at least one conductive area is an open-sided conductive area.
4. The power module assembly structure of claim 1, wherein the at least one device electrical pin of the at least one device is electrically connected to the at least one conductive area through a first connecting material layer, and the at least one conductive area is electrically connected to the at least one external pin of the external pin layer through a second connecting material layer.
5. The power module assembly structure of claim 4, wherein the first connection material layer and the second connection material layer comprise a lead-free solder, a solder paste, or a conductive silver paste.
6. A power module assembly structure, characterized by comprising:
an element layer, the element layer comprising a plurality of elements;
the device layer is arranged on a first side of the flexible board layer, and the plurality of devices are electrically connected with the first side of each of the plurality of conductive areas of the flexible board layer; and
the flexible printed circuit board comprises a plurality of conductive areas, an external pin layer, a flexible printed circuit board layer and a circuit board, wherein the flexible printed circuit board layer is arranged on the external pin layer, the external pin layer comprises at least one external pin, and the at least one external pin is electrically connected with the second sides of the plurality of conductive areas;
wherein, a heat energy generated by the plurality of elements is directly transmitted to the outside of the power module assembly structure through the plurality of conductive areas and the at least one external pin for heat dissipation;
wherein the flexible board layer is flat, and the plurality of conductive areas are copper foils;
wherein, the at least one external pin is flat;
wherein one of the plurality of component electrical pins of one of the plurality of components, one of the plurality of conductive areas and the at least one external pin are electrically connected in a flat manner.
7. The power module assembly structure of claim 6, wherein said external pin layer comprises a pin layer substrate, said at least one external pin being disposed within said pin layer substrate in correspondence with at least one of said conductive areas.
8. The power module assembly structure of claim 6, wherein at least one of said components is electrically connected to at least one of said conductive regions by a first layer of connecting material, and at least one of said conductive regions is electrically connected to at least one of said external pins of said external pin layer by a second layer of connecting material.
9. The power module assembly structure of claim 8, wherein the first connection material layer and the second connection material layer comprise a lead-free solder, a solder paste, or a conductive silver paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810225277.2A CN110290630B (en) | 2018-03-19 | 2018-03-19 | Power module assembling structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810225277.2A CN110290630B (en) | 2018-03-19 | 2018-03-19 | Power module assembling structure |
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| Publication Number | Publication Date |
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| CN110290630A CN110290630A (en) | 2019-09-27 |
| CN110290630B true CN110290630B (en) | 2021-07-27 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0969588A (en) * | 1995-06-20 | 1997-03-11 | Shinko Electric Ind Co Ltd | Semiconductor device |
| EP0840372A2 (en) * | 1996-10-29 | 1998-05-06 | Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. | Thermal dissipation system in 800 micrometer printed circuit |
| CN104752373A (en) * | 2015-03-23 | 2015-07-01 | 广东美的制冷设备有限公司 | Intelligent power module and manufacture method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7361979B2 (en) * | 2004-12-29 | 2008-04-22 | Tessera, Inc. | Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates |
| KR101489325B1 (en) * | 2007-03-12 | 2015-02-06 | 페어차일드코리아반도체 주식회사 | Flip-chip type stacked power module and method of manufacturing the power module |
-
2018
- 2018-03-19 CN CN201810225277.2A patent/CN110290630B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0969588A (en) * | 1995-06-20 | 1997-03-11 | Shinko Electric Ind Co Ltd | Semiconductor device |
| EP0840372A2 (en) * | 1996-10-29 | 1998-05-06 | Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. | Thermal dissipation system in 800 micrometer printed circuit |
| CN104752373A (en) * | 2015-03-23 | 2015-07-01 | 广东美的制冷设备有限公司 | Intelligent power module and manufacture method thereof |
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