CN110268334A - Exposure sources - Google Patents

Abstract

An exposure apparatus is provided that includes a first substrate holder, a second substrate holder, a sensor holder, a projection system, a measurement device, and a further measurement device. The first substrate holder is configured to hold a substrate. The second substrate holder is configured to hold the substrate. The sensor holder is configured to hold a sensor. A projection system is configured to expose the substrate with an exposure beam. The measurement device is configured to provide measurement information of the substrate. The further measurement device is configured to provide further measurement information of the substrate. The sensor is configured to measure properties of the exposure beam and/or the projection system. The projection system is configured to expose the sensor with an exposure beam.

Description

Exposure equipment

CROSS-REFERENCE TO RELATED APPLICATIONS

This application requires document 1, which is the priority of EP application 17154551.0 with an application date of February 3, 2017, and requires document 2, which is the priority of EP application 17169025.8 with an application date of May 2, 2017, and requires document 3, which is the filing date. For the priority of EP application 17193990.3 filed on September 29, 2017, the priority of Document 4, ie, EP application 17201092.8 with a filing date of November 10, 2017, is hereby incorporated by reference in its entirety.

technical field

The present invention relates to exposure equipment.

Background technique

A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually to a target portion of the substrate. Lithographic apparatuses can be used, for example, in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate circuit patterns to be formed on a single layer of the IC. Such a pattern can be transferred onto a target portion (eg, including a portion of a die, one or several dies) on a substrate (eg, a silicon wafer). Transfer of the pattern is typically performed via imaging the pattern onto a layer of radiation-sensitive material (resist) disposed on the substrate. Typically, a single substrate will include a network of successively patterned adjacent target portions. Known lithographic apparatuses include so-called steppers and so-called scanners; in steppers, each target portion is irradiated by exposing the entire pattern onto the target portion at once; in scanners, the Each target portion is irradiated by scanning the pattern in a fixed direction ("scanning" direction) while simultaneously scanning the substrate in a direction parallel or antiparallel to that direction. A lithographic apparatus that applies a desired pattern to a substrate by irradiating a beam of radiation is also referred to as an exposure apparatus. The exposure equipment can be a stepper or a scanner. The pattern can also be transferred from the patterning device to the substrate by imprinting the pattern onto the substrate. A lithographic apparatus that applies a desired pattern to a substrate by imprinting a pattern onto the substrate may be referred to as an imprint-type lithographic apparatus. An imprint-type lithographic apparatus that imprints an entire pattern at a time onto a target portion of a substrate may be referred to as an imprint-type stepper.

There is a trend to reduce the production cost per IC. In order to reduce the production cost per IC, known lithographic apparatuses have been designed to perform the exposure process, ie to expose the pattern on the substrate, as quickly and frequently as possible. In order to perform the exposure process as frequently as possible, the lithographic apparatus may have multiple substrate tables, as disclosed in US Pat. No. 5,677,758. While a substrate on one substrate table is being exposed, a second substrate is loaded, unloaded or aligned on a second substrate table. When one substrate has been fully exposed, the exposure process is only briefly interrupted to remove one substrate table from the projection system and move the other substrate table below the projection system. In this way, only during brief interruptions, the lithographic apparatus does not perform the exposure process.

SUMMARY OF THE INVENTION

Although the exposure process is only briefly interrupted, it is still desirable to expose substrates to produce ICs at a further reduced cost per IC production. Generally, when throughput and/or uptime are improved, the overall productivity of the lithographic apparatus is improved. Good imaging quality of the pattern transferred onto the substrate is generally required for the manufacture of ICs. Measuring the substrate more accurately enables better imaging quality; however, if a more accurate measurement of the substrate is achieved by making the measurement time longer, the longer measurement time will degrade the overall productivity. In other words, in known lithographic apparatuses, there is a trade-off between overall productivity and imaging quality.

This tradeoff is observed, for example, during wafer alignment operations performed by the exposure apparatus described in PCT Application Publication No. WO2007/097466A1. The exposure apparatus described in this PCT publication includes a single wafer stage and a single wafer alignment system that includes five linearly aligned arrays along a first direction (eg, along the x-axis or step direction). alignment sensor. When the wafer alignment operation is performed as described in this PCT publication, 16 alignment marks can be measured by a single (multi-sensor) wafer alignment system while moving the wafer stage only in the second direction, the first The second direction is the direction perpendicular to the first direction (eg, along the y-axis or scan direction). However, when wafer alignment operations are performed differently in this configuration, longer measurement times may be required, such as in the following situations: 1) A larger number of alignment marks located on the substrate need to be measured for achieving Good imaging quality, and/or 2) at least one alignment mark (eg, one of 16 alignment marks) on the substrate to be measured is not located within the detection area of any of the five alignment sensors (i.e. , outside the detection area of the five alignment sensors); as a result, the wafer stage needs to be moved not only along the second direction but also along the first direction (ie, not only along the y-axis but also along the x-axis).

Typically, in exposure apparatuses including a single wafer stage, the time spent in wafer alignment operations (before exposure) is pure overhead time or extra time, and directly degrades the productivity/throughput performance of the exposure apparatus. Even in an exposure apparatus including two wafer stages and a single wafer alignment system, yield performance will deteriorate if the wafer alignment operation takes longer than exposure. Generally, the overall productivity of an exposure facility is proportional to the output performance of a certain uptime performance. Thus, a trade-off between overall productivity and imaging quality is observed in exposure equipment that includes a single wafer stage and a single wafer alignment system. In addition, in exposure equipment including two wafer stages and a single wafer alignment system, where a large number of alignment marks on a substrate need to be measured in order to qualify for certain high imaging quality requirements, the overall productivity and imaging quality There is a compromise between them.

Thus, for example, it is desirable to provide a lithographic apparatus in which better imaging quality can be achieved without degrading overall productivity. In other words, for example, it would be desirable to provide an advantageous lithographic apparatus in which better overall productivity can be achieved while qualifying for sufficient imaging quality required to manufacture ICs.

Additionally or alternatively, for example, it would be desirable to provide a lithographic apparatus that is flexible and efficiently compatible with different substrate sizes, since the desired or available substrate sizes may vary depending on the type of IC to be fabricated. Additionally or alternatively, for example, it would be desirable to provide a lithographic apparatus that is flexible and efficiently compatible with different types of substrates made of different materials, since the type of substrate desired or available may depend on the IC to be fabricated different types.

Additionally or alternatively, for example, it would be desirable to provide a device that is less expensive (ie, at a lower tool price) while at the same time qualifying for adequate overall productivity and adequate imaging quality required for the manufacture of a particular type of IC. Lithography equipment. In other words, there is a trade-off between the overall productivity of the exposure apparatus and the tool price of the exposure apparatus. Thus, for example, it would be desirable to provide a lithographic apparatus that improves the CoO (cost of ownership), while at the same time qualifying it with sufficient overall throughput and sufficient imaging quality required for the manufacture of a particular type of IC. The contribution of a lithographic apparatus to CoO can be estimated, for example, as disclosed in Proc. of SPIE Vol. 5751, pp. 964-975 (2005) or Proc. of SPIE Vol. 7271 72710Y (2009). These disclosures can also be identified as examples of CoO calculations for different imaging quality requirements (eg, for the 90nm node and the 22nm node, respectively).

Additionally or alternatively, in practice, multiple exposure equipment and some other type of equipment is often necessary to manufacture ICs. Therefore, it is desirable to improve the TCO (total cost of ownership) of multiple exposure equipment and/or the TCO of all types of equipment and processes required to manufacture ICs.

In other words, there may be a trilemma between overall productivity of the exposure apparatus, imaging quality, and economics (eg, identifiable in terms of footprint, tool price, CoO and/or TCO). In this context, in addition to the various trade-offs described above, there may be a trade-off between the overall productivity of the exposure apparatus and the footprint (and/or tool price) of the exposure apparatus. For example, the exposure apparatus described in PCT Application Publication No. WO2007/055237A1 includes two illumination systems, two mask tables, two projection systems and two substrate tables. The tool price and footprint of such an exposure apparatus would be similar to two units of a conventional exposure apparatus including a single illumination system, a single mask table, a single projection system, and a single substrate table; furthermore, with optical components such as illumination systems and projection systems), the problems of these optical components that can degrade imaging quality will also double. In other words, in such an exposure apparatus, a trade-off between overall productivity and imaging quality will still be observed, which is equivalent or similar to the cascaded/connected multiple units of conventional exposure apparatuses. Therefore, such an exposure apparatus would not be economical, and would not be a solution to the trilemma between overall productivity, imaging quality, and economics of the exposure apparatus.

According to an aspect of the present invention, there is provided an exposure apparatus including a substrate holder, a sensor holder and a moving member. The substrate holder is used to hold the substrate. The sensor holder is used to hold the sensor. The moving member is arranged for moving the substrate holder. The moving piece is arranged to couple with the sensor holder in a first situation for moving the sensor holder. The moving piece is arranged to be decoupled from the sensor holder in a second situation to move without moving the sensor holder.

According to another aspect of the present invention, there is provided an exposure apparatus comprising a substrate holder for holding a substrate, a sensor holder for holding a sensor, a moving member arranged to move the substrate holder, and a A projection system is arranged to provide a beam of radiation onto the substrate. During exposure, the projection system provides a beam of radiation onto the substrate when the sensor holder is decoupled from the moving member. The moving member is coupled to the sensor holder when the sensor measures properties of the projection system or radiation beam.

According to another aspect of the present invention, there is provided an exposure apparatus including a first substrate holder for holding a first substrate, a second substrate holder for holding a second substrate, for using an exposure beam A projection system for exposing the first substrate, a measurement device arranged to provide measurement information for the second substrate, and a further measurement device arranged to provide measurement information for the first substrate. The further measurement device is closer to the projection system than the measurement device.

According to yet another aspect of the present invention, there is provided an exposure apparatus including: a first substrate holder configured to hold a substrate; a second substrate holder configured to hold a substrate; and a sensor holder configured to hold a substrate a projection system configured to expose the substrate with an exposure beam; a measurement device configured to provide measurement information of the substrate; and a measurement device configured to provide further measurement information of the substrate . The sensor is configured to measure properties of the exposure beam and/or the projection system.

Description of drawings

Embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings, in which corresponding reference numerals indicate corresponding parts, and in which:

Figure 1 depicts an embodiment according to the invention;

FIG. 2 depicts another embodiment in accordance with the present invention in a first view (eg, a top view);

FIG. 3 depicts another embodiment in accordance with the present invention in a second view (eg, a side view);

Figure 4 depicts the exposure apparatus according to the invention in a first situation;

Figure 5 depicts the exposure apparatus according to the invention in the second situation;

Figure 6 depicts the exposure apparatus according to the invention in a third situation;

Figure 7 depicts yet another embodiment according to the present invention;

Figure 8 depicts another embodiment according to the present invention.

Figure 9 depicts a further embodiment according to the invention in side view.

10A-10I depict, in top view, the manner in which the embodiment of FIG. 9 is operated.

Detailed ways

Figure 1 schematically shows a lithographic apparatus according to an embodiment of the present invention. The lithographic apparatus comprises an illumination system IL, a support structure MT, a substrate table WT and a projection system PS. The illumination system IL is configured to condition the radiation beam B. The support structure MT is configured to support the patterning device MA and is connected to a first positioning device PM configured to precisely position the patterning device MA according to certain parameters. The substrate table WT is configured to hold a substrate W, eg, a resist-covered wafer, and is connected to a second positioner PW configured to precisely position the substrate W according to certain parameters. Projection system PS is configured to project the pattern imparted to radiation beam B by patterning device MA onto target portion C of substrate W (eg, including one or more dies).

The illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic, or other types of optical components, or any combination thereof, for directing, shaping, or controlling radiation.

The illumination system IL receives the radiation beam B from the radiation source SO. The radiation source SO and the lithographic apparatus may be separate entities, eg when the radiation source SO is an excimer laser. In this case, the radiation source SO is not considered to form part of the lithographic apparatus and the radiation beam B is passed from the radiation source SO to the illumination by means of a beam delivery system BD comprising eg suitable guiding mirrors and/or beam expanders System IL. In other cases, the radiation source SO may be an integral part of the lithographic apparatus, for example when the radiation source SO is a mercury lamp. The radiation source SO and the illumination system IL, together with the beam delivery system BD, may be referred to as a radiation system, if desired.

The illumination system IL may comprise an adjuster AD for adjusting the angular intensity distribution of the radiation beam. Generally, at least the outer and/or inner radial extent (commonly referred to as σouter and σinner, respectively) of the intensity distribution in the pupil plane of the illumination system IL can be adjusted. Furthermore, illumination system IL may include various other components, such as integrator IN and concentrator CO. The illumination system IL can be used to adjust the radiation beam B to have the desired uniformity and intensity distribution across its cross-section.

The term "radiation beam" as used herein includes all types of electromagnetic radiation, including ultraviolet (UV) radiation (eg, having a wavelength of about 365, 355, 248, 193, 157, or 126 nm) and extreme ultraviolet (EUV) radiation (eg, having a wavelength of about 365, 355, 248, 193, 157 or 126 nm) wavelengths in the range of 5-20 nm, or having wavelengths of about 13.5 nm or 6.7 nm), and particle beams, such as ion beams or electron beams. The radiation beam may include visible light, such as the spectral lines provided by mercury lamps: g-line (having a wavelength at or about 436 nm) and/or h-line (having a wavelength at or about 405 nm). Visible light can be provided by a single LED (Light Emitting Diode) or a combination of multiple LEDs. A single LED or a combination of LEDs can provide UV radiation, visible light and/or infrared radiation.

The support structure MT supports the patterning device MA, ie bears the weight of the patterning device MA. The support structure MT holds the patterning device MA in a manner that depends on the orientation of the patterning device MA, the design of the lithographic apparatus, and other conditions such as whether the patterning device MA is held in a vacuum environment. Support structure MT may use mechanical, vacuum, electrostatic or other clamping techniques to hold patterning device MA. The support structure MT can be a frame or a table, for example, it can be fixed or movable as required. The support structure MT may ensure that the patterning device MA is, for example, in the desired position relative to the projection system PS. Additionally, the support structure MT may include a patterning device holder, mechanism and/or stage capable of actively flexing the patterning device MA. By actively bending the patterning device MA, the curvature of the patterning device MA can be controlled. Such support structures MT are disclosed in US Patent Application Publication Nos. US2013/0250271A1 and US2016/0011525A1, which are hereby incorporated by reference.

The term "patterning device" as used herein should be construed broadly to refer to any device that can be used to impart a radiation beam with a pattern in its cross-section so as to produce a pattern on a target portion C of the substrate W. It should be noted that the pattern imparted to the radiation beam B may not correspond exactly to the desired pattern in the target portion C of the substrate W, eg if the pattern comprises phase-shifting features or so-called assist features. Typically, the pattern imparted to radiation beam B will correspond to a particular functional layer in a device formed in target portion C, such as an integrated circuit.

The patterning device MA may be transmissive or reflective. Examples of patterning devices include masks, programmable mirror arrays, and programmable LCD panels. The patterning device MA may be referred to as a mask or reticle. The optical properties of the aerial image (ie, the aerial image of the pattern projected onto the substrate W) can be controlled by actively bending the transmissive mask, transmissive reticle, or reflective mask. Masks are well known in lithography and include mask types such as binary, alternating phase shift, and decay phase shift, as well as various hybrid mask types. One example of a programmable mirror array employs a matrix arrangement of small mirrors, each of which can be individually tilted to reflect incoming radiation beams in different directions. The tilted mirrors impart a pattern in the radiation beam B reflected by the mirror matrix.

The term "projection system" as used herein should be construed broadly to include any type of projection system, including refractive, reflective, catadioptric, magnetic, electromagnetic and electrostatic optical systems, or any combination thereof, as used exposure radiation or other factors such as the use of immersion liquids or the use of vacuum.

As described herein, the lithographic apparatus is transmissive (eg, using a transmissive mask). Alternatively, the lithographic apparatus may be of the reflective type (eg, employing a programmable mirror array of the type described above, or employing a reflective mask).

The lithographic apparatus may be of the type having two (dual stage) or more substrate tables (and/or two or more mask tables). In such a "multiple" machine, additional tables may be used in parallel, or the preliminary steps may be performed on one or more tables while one or more other tables are used for exposure. Instead of holding the substrate W, an additional stage may be arranged to hold the at least one sensor. The at least one sensor may be a sensor that measures a property of the projection system PS, or a sensor that measures a property of the exposure radiation, or a sensor that detects the position of the marking on the patterning device MA relative to the sensor, or may be any other types of sensors. The additional stage may comprise cleaning means, eg for cleaning part of the projection system PS or any other part of the lithographic apparatus.

The lithographic apparatus may also be of the type in which at least a portion of the substrate W may be covered with a liquid having a relatively high refractive index, such as water, in order to fill the space between the projection system PS and the substrate W. The immersion liquid may also be applied to other spaces in the lithographic apparatus, eg, between the patterning device MA and the projection system PS. Immersion techniques are well known in the art for increasing the numerical aperture of projection systems. The term "immersion" as used herein does not mean that a structure such as the substrate W must be immersed in liquid, but only means that the liquid is located between the projection system PS and the substrate W during exposure.

The radiation beam B is incident on the patterning device MA held on the support structure MT and is patterned by the patterning device MA. After having passed through the support structure MT, the radiation beam B passes through the projection system PS, which focuses the radiation beam onto the target portion C of the substrate W. The radiation beam B used to expose the substrate W may also be referred to as an exposure beam. By means of the second positioning device PW and the position sensor IF (eg interferometer device, linear encoder or capacitive sensor), the substrate table WT can be moved precisely, eg in order to position the different target parts C in the path of the radiation beam B middle. Similarly, a first positioning device PM and another position sensor (not explicitly shown in FIG. 1 ) can be used to precisely position the radiation beam B with respect to the path, eg after mechanical removal from the mask library, or during scanning. Position the patterning device MA. Generally, the movement of the support structure MT can be achieved by means of a long-stroke module and a short-stroke module, which form part of the first positioning means PM. The long stroke modules provide limited precision movement of the support structure MT over a large range (coarse positioning), while the short stroke modules provide high precision movement of the support structure MT over a small range (fine positioning) relative to the long stroke modules. Similarly, movement of the substrate table WT may be accomplished using a long-stroke module and a short-stroke module that form part of the second positioner PW. In the case of a stepper (as opposed to a scanner), the support structure MT may be connected only to the short-stroke actuator, or it may be fixed.

Patterning device MA and substrate W may be aligned using mask alignment marks Ml, M2 and substrate alignment marks Pl, P2. Although the substrate alignment marks P1, P2 are shown occupying dedicated target portions, they may be located in the spaces between target portions C. FIG. When the substrate alignment marks P1, P2 are located in the space between the target portions C, they are called scribe line alignment marks. Similarly, where more than one die is provided on the patterning device MA, the mask alignment marks Ml, M2 may be located between the dies.

The described device can be used in at least one of the following modes:

In the first mode (stepping mode), the support structure MT and the substrate table WT remain substantially stationary, while the entire pattern imparted to the radiation beam B is projected onto the target portion C at one time (ie, a single static exposure). Then, the substrate table WT is moved in the X and/or Y direction so that different target portions C can be exposed. In step mode, the maximum size of the exposure field limits the size of the target portion C imaged in a single static exposure.

In the second mode (scanning mode), the support structure MT and the substrate table WT are scanned synchronously (ie, a single dynamic exposure) while the pattern imparted to the radiation beam B is projected onto the target portion C. The speed and orientation of the substrate table WT relative to the support structure MT can be determined by the (de-)magnification and image inversion properties of the projection system PS. In scanning mode, the maximum size of the exposure field limits the width of the target portion C (in the non-scanning direction) in a single dynamic exposure, while the length of the scanning motion determines the height of the target portion C (in the scanning direction).

In a third mode, the support structure MT holding the programmable patterning device MA remains substantially stationary and the substrate table WT is moved or scanned while the pattern imparted to the radiation beam B is projected onto the target portion C. In this mode, a pulsed radiation source is typically employed and the programmable patterning device MA is updated as needed after each movement of the substrate table WT or between successive radiation pulses during a scan. This mode of operation can be readily applied to maskless lithography utilizing programmable patterning devices, such as the programmable mirror array type mentioned above. This mode of operation can also be easily applied to e-beam (electron beam) lithography.

The lithographic apparatus also includes a control unit that controls the actuators and sensors. The control unit also includes signal processing and data processing capabilities to perform required calculations related to the operation of the lithographic apparatus. In practice, the control unit will be implemented as a system of many subunits. Each subunit may handle real-time data acquisition, processing and/or control of components within the lithographic apparatus. For example, one subunit may be dedicated to servo control of the second positioner PW. Separate subunits can handle short and long stroke modules, or different axes. Another subunit can be dedicated to the readout of the position sensor IF. The overall control of the lithographic apparatus may be controlled by a central processing unit in communication with the subunits, with the operator, and with other equipment involved in the lithographic manufacturing process.

Combinations and/or variations of the above-described usage patterns, or entirely different usage patterns, may also be employed.

The substrate W may be any of the following substrates: a silicon (Si) wafer, a silicon carbide (SiC) wafer, a sapphire wafer, a gallium nitride (GaN) wafer, a GaN-on-Si wafer (which is silicon with a GaN layer) wafer), gallium phosphide (GaP) wafer, gallium antimonide (GaSb) wafer, germanium (GE) wafer, lithium tantalate (LiTa) wafer, lithium niobate (LiN) wafer, indium arsenide (InAs) wafer, phosphorus Indium Pide (InP) wafers or glass substrates. The substrate W can be made of any other material, such as gallium oxide and gallium arsenide. Substrates made from one of these materials may be more suitable for producing certain types of ICs than others. The substrate W may have any size suitable for producing ICs, eg, a diameter of 12.5 mm or 50 mm or 100 mm or 150 mm or 200 mm or 300 mm or 450 mm. The substrate W may have any suitable shape; for example, the substrate W may be circular, square, or rectangular. Substrate W may be of any suitable size for making masks, stencils, reticles, test reticles, or dummy reticles, such as 6 inches square (6 inches x 6 inches). Substrate W may be of any suitable size for fabricating a flat panel display (FPD), such as G4, G6 (eg, about 1.5m x 1.8m in size), G8 (eg, about 2.2m x 2.5m in size) or G10 etc. Multiple substrates can be contained in a FOUP (Front Opening Unification Box); for example, 25 silicon wafers can be contained in a FOUP. These wafers may be referred to as a batch of wafers. The substrates contained in the first FOUP may be referred to as the substrates in the first batch.

The lithographic apparatus of FIG. 1 is an example of an exposure apparatus. The exposure apparatus is an apparatus that provides an exposure device to expose the substrate W with an exposure beam (ie, a radiation beam B). By exposing the substrate W, a pattern is created on the substrate W. In the case where the exposure apparatus is an optical lithography apparatus, the exposure apparatus is often referred to as a projection system PS. In one embodiment, the projection system PS includes a lens barrel and a plurality of optical elements (eg, lenses, prisms and/or mirrors). In one embodiment, the projection system PS also includes a lens holder for holding each optical element and for controlling the position (eg, position in the vertical direction, ie, along the z-axis) and orientation ( For example, tilt in the Rx and Ry directions) of an actuator such as a piezoelectric element. Examples of projection systems PS that can be used in the context of the present invention are disclosed in PCT Application Publication Nos. WO2005/001543A1, WO2005/064382A1 and WO2007/091463A1, which are hereby incorporated by reference.

Another example of exposure equipment is electron beam equipment. Unlike the optical lithography apparatus, the electron beam apparatus has an exposure device that supplies an e-beam (electron beam) to the substrate W to generate a pattern on the substrate W. FIG. Such exposure devices may be referred to as modulation devices. The electron beam may include a beam of electrons. The electron beam apparatus may be arranged to provide multiple electron beams simultaneously by having multiple exposure devices, or by having a single exposure device arranged to provide multiple electron beams simultaneously. An example of a modulation device that can be used in the context of the present embodiment is disclosed in Japanese Patent Application Laid-Open No. JP 2011-258842 A, which is incorporated herein by reference.

Figure 2 depicts a first embodiment of the invention in a first view (eg a top view). Figure 3 depicts the first embodiment of the invention in a second view (eg side view). FIGS. 2 and 3 show a portion of an exposure apparatus 200 including a substrate holder 202 , a sensor holder 206 and a moving member 204 . The substrate holder 202 is arranged to hold the substrate W. The sensor holder 206 is arranged to hold the sensor. A moving member 204 is arranged to move the substrate holder 202 . The substrate holder 202 may alternatively be referred to as a "substrate chuck" or "wafer chuck."

The moving member 204 is arranged to move the substrate holder 202 relative to the projection system PS so that all target portions C can be exposed by the exposure beam projected from the projection system PS. The moving member 204 can move in the x-direction, the y-direction and the z-direction. The moving member 204 and/or the substrate holder 202 may be provided with an actuator system for moving the substrate holder 202 relative to the moving member 204 while the moving member 204 supports the substrate holder 202 . The mover 204 can be thought of as a long stroke module for imprecise movement over a wide range. The substrate holder 202 can be thought of as a short stroke module for precise movement over a small area. The substrate holder 202 may support the substrate table WT, or may be integrated with the substrate table WT. The moving part 204 may be provided with planar electrodes to move relative to the exposure device (eg the projection system PS). The moving member 204 may be arranged to move relative to the projection system PS in a scanning direction (eg in the y-direction indicated in Figure 2). The moving member 204 may be arranged to move relative to the projection system PS in a direction perpendicular to the scanning direction (eg, the x-direction as indicated in Figure 2). The direction perpendicular to the scanning direction may be referred to as the stepping direction. The moving member 204 can move in the scanning direction while the substrate W is exposed by the projection system PS. The moving member 204 can be moved in the stepping direction while the substrate W is not exposed by the projection system PS. The moving member 204 may be arranged to move at a higher acceleration and/or velocity in one of the scan direction and the step direction than in the other of the scan direction and the step direction. The planar motor may have magnets on the moving member 204 and coils on the base that supports the moving member 204 . Such a planar motor may be referred to as a "moving magnet type planar motor". Alternatively, a planar motor has coils on the mover 204 and magnets on a base that supports the mover 204 . Such a planar motor may be referred to as a "moving coil planar motor". Alternatively, the moving member 204 may comprise a linear motor or multiple linear motors. Additionally or alternatively, the moving member 204 may be arranged in an H-drive arrangement; in other words, the moving member 204 may include at least one X-linear motor (ie, a linear motor configured to move primarily in the X direction) and at least one Y-linear motor Linear motors (ie, linear motors configured to move primarily in the Y direction). For example, the moving parts 204 arranged in an H-drive arrangement may include a pair of Y linear motors and an X linear motor with the stator of the X linear motors attached to the moving parts of the pair of Y linear motors.

The sensor holder 206 holds at least one sensor. For example, the sensor holder 206 has one sensor, or the sensor holder 206 has multiple sensors. The sensor may be a sensor to measure properties of the exposure beam, such as dose or aberration or uniformity. The sensor holder 206 may include an additional stage to hold the sensor, or may be integrated with the additional stage. The sensor holder 206 may comprise cleaning means, eg for cleaning part of the projection system PS or any other part of the lithographic apparatus. The sensor may comprise an aerial image measurement device configured to measure an aerial image of the pattern projected by the projection system PS.

In one embodiment, the sensor holder 206 is provided with at least one of a sensor and a cleaning device. The sensor may be referred to as a measurement member. In one embodiment, the sensor holder 206 is provided with an illumination irregularity sensor. The illuminance irregularity sensor is configured to detect irregularities in the illuminance of the radiation beam B received at the pinhole-shaped light receiving portion of the illuminance irregularity sensor. In one embodiment, the sensor holder 206 is provided with a sensor, such as an aerial image measurement device. The aerial image measuring device is configured to measure an aerial image of the pattern projected by the projection system PS. In one embodiment, the sensor holder 206 is provided with a sensor, such as a wavefront aberration measurement device. A wavefront aberration measuring device is described in Japanese Patent Application Laid-Open No. JP2003-100613A, which is incorporated herein by reference. The wavefront aberration measuring device is configured to measure the aberration of the wavefront using, for example, the Shack-Hartmann method. Such a wavefront aberration measuring device may also be referred to as an aberration sensor. In one embodiment, the sensor holder 206 is provided with a sensor, such as an illuminance monitor. The illuminance monitor is configured to receive the radiation beam B on the image plane of the projection system PS and measure at least one property of the radiation beam B provided by the projection system PS. In one embodiment, a wavefront aberration measurement device and/or illuminance monitor is located on the top surface of the sensor holder 206 .

In one embodiment, one of the sensors held by the sensor holder 206 is arranged to measure the aberration of the projection system PS, the pupil of the projection system PS, and/or the polarization of the illumination system IL. Measurement data obtained by one of the sensors held by the sensor holder 206 may be used to adjust or control the properties of the projection system PS, patterning device MA, illumination system IL and/or radiation source SO in order to improve the imaging quality of the exposure apparatus . When the sensors are arranged to measure the aberrations of the projection system PS, a simulation model can be used to predict the distortion of the image on the substrate W, ie the aerial image of the pattern projected onto the substrate W. Additionally or alternatively, a simulation model may be used to predict changes in aberrations of the projection system PS and/or may be used to predict the distribution of the illumination pupil of the illumination system IL. Additionally or alternatively, wavefront aberration measurement devices and/or aerial image measurement devices may be used to calibrate, update and/or improve the simulation model. The use of the simulation model is not limited to when the sensors are arranged to measure the aberrations of the projection system PS. In an alternative embodiment, a uniformity sensor (in place of the aberration sensor) is used to calibrate, update or improve the simulation model. The uniformity sensor may be supported by the sensor holder 206 . In the Japanese Patent Application Publication No. JP2013-165134A and Japanese Patent Application Publication No. JP2014-165291A and PCT Application Publication No. WO2011/102109A1, PCT Application Publication No. WO2014/042044A1 and PCT Application Publication No. WO2015/182788A1 Examples of simulation models used in the context (or algorithms used in simulation models) are hereby incorporated by reference. Examples of the mentioned sensors are shown schematically in the figure as squares, circles and triangles on the sensor holder 206 . In one embodiment, the shape of the sensor may differ from that shown.

In one embodiment, the aerial image measurement device configured to measure the aerial image of the pattern projected by the projection system PS comprises a detector, a fiducial plate and/or an optical element. The fiducial plate includes fiducial marks and/or a pair of aerial image measurement slit patterns. The aerial image measurement device may include a plurality of reference plates. In one embodiment, all components of the aerial image measurement device are provided on the sensor holder 206 . Alternatively, only a part of the aerial image measurement device, eg only the detector, may be provided on the sensor holder 206 . Alternatively or additionally, a part of the aerial image measurement device, such as a reference plate, may be provided on the substrate holder 202 . Alternatively, the aerial image measurement device may be provided on a dummy wafer as disclosed in Japanese Patent Application Laid-Open No. JP2007-189180A, which is hereby incorporated by reference. Such dummy wafers may be loaded in place on the substrate holder 202 in place of the substrate W.

The exposure apparatus 200 may include an exchange mechanism 208 for providing the sensor holder 206 to the moving member 204, for removing the sensor holder 206 from the moving member 204, for supporting the sensor holder 206 and/or using for moving the sensor holder 206 .

FIG. 4 depicts the exposure apparatus 200 in the first case. The moving piece 204 is arranged to couple with the sensor holder 206 in the first case in order to move said sensor holder 206 . When the moving member 204 and the sensor holder 206 are coupled to each other, movement of the moving member 204 may cause movement of the sensor holder 206 . The mover 204 can move the sensor holder 206 relative to the projection system PS so that different parts of the sensor holder 206 can be below the projection system PS. For example, the mover 204 may move the sensor holder 206 relative to the projection system PS so that a plurality of sensors on the sensor holder 206 may be exposed with the exposure beam from the projection system PS (in other words, the properties of the exposure beam may be determined by the sensor each of these sensors on holder 206).

As shown in FIG. 4 , both the substrate holder 202 and the sensor holder 206 are supported by the moving member 204 . In the first case, the substrate holder 202 and the sensor holder 206 may be arranged to move in unison relative to the moving member 204 . In the case where immersion techniques are applied to exposure apparatus 200, during the unison movement (ie, substrate holder 202 and sensor holder 206 moving in unison), the immersion liquid may escape from one of substrate holder 202 and sensor holder 206 is transferred to the other of the substrate holder 202 and the sensor holder 206 . During the unison movement, the substrate holder 202 and the sensor holder 206 may be in contact with each other or separated from each other by a gap. The gap may be sufficiently small to limit or prevent leakage of immersion liquid between the substrate holder 202 and the sensor holder 206 during uniform movement. Where immersion techniques are practiced, the lithographic apparatus may include a liquid handling system configured to supply and confine immersion liquid to the projection system PS and substrate holder 202, substrate W, and sensor space between at least one of the retainers 206 .

FIG. 5 depicts the exposure apparatus 200 in the second case. The moving piece 204 is arranged to be decoupled from the sensor holder 206 in the second case to move without the sensor holder 206 . In the second case, the mover 204 can move without the sensor holder 206 . In the second case, the moving member 204 supports the substrate holder 202 but not the sensor holder 206 . The sensor holder 206 is supported and/or moved by the exchange mechanism 208 . The sensors on the sensor holder 206 may perform measurements when the sensor holder 206 is positioned near or at the projection system PS by the exchange mechanism 208 . The exchange mechanism 208 can move the sensor holder 206 relative to the projection system PS so that different parts of the sensor holder 206 can be located below the projection system PS. When the moving member 204 moves in the second case, the moving member 204 does not move the mass of the sensor holder 206 . In the second case, the moving member 204 can move the substrate holder 202 relative to the projection system PS in order to expose the target portion C. The second situation can be during exposure. Since the moving part 204 does not need to move the mass of the sensor holder 206 in the second case, the moving part 204 can move faster. Alternatively, the moving member 204 may utilize smaller actuators to achieve the desired acceleration. In the case where the moving part 204 moves faster, more target parts C can be exposed per unit time, which reduces the cost of each target part C. The lithographic apparatus can be less expensive (ie, at a lower tool price) with the use of smaller actuators for the moving part 204 . A lithographic apparatus can be less expensive because less expensive actuators, less expensive cooling systems, less expensive amplifiers, etc. may be required.

FIG. 6 depicts the exposure apparatus 200 in the third case. The moving member 204 supports the sensor holder 206 . The exchange mechanism 208 supports the substrate holder 202 . The exchange mechanism 208 can move the substrate holder 202 to the substrate unloading position. The substrate handler can remove the substrate W from the substrate holder 202 when the substrate holder 202 is in the substrate unload position. Additionally, a new substrate W may be placed (or loaded) on the substrate holder 202 at the substrate unloading position. A new substrate W may be loaded onto the substrate holder 202 at another location, such as at a substrate loading location. In the third case, the sensor holder 206 may be located near or at the exposure device (eg projection system PS). The sensors on the sensor holder 206 can perform measurements when the sensor holder 206 is located near or at the exposure apparatus. The mover 204 can move the sensor holder 206 relative to the projection system PS so that different parts of the sensor holder 206 can be located below the projection system PS.

The sensor holder 206 may be provided with an actuator to move relative to the moving member 204 . For example, the actuator may be arranged to move the sensor holder 206 relative to the mover 204 in the x-direction or the y-direction. The actuator system may include an array of coils and an array of magnets. One of the coil array and the magnet array may be provided on the sensor holder 206 . The other of the coil array and the magnet array may be provided on the moving member 204 . The array of coils and the array of magnets can interact with each other to provide a driving force to move the sensor holder 206 relative to the moving member 204 . Alternatively, the actuator may be provided with a single magnet or a single coil. Additionally, a sensor system may be provided to determine the position of the sensor holder 206 relative to the moving member 204 . A controller may be provided which controls the actuator system based on signals from the sensor system.

Figure 7 depicts another embodiment of the present invention. The left part of FIG. 7 shows a side view of the moving member 204 supporting the substrate holder 202 . The substrate holder 202 supports a substrate W of a certain diameter. The diameter may be, for example, one of 12.5mm or 50mm or 100mm or 150mm or 200mm or 300mm or 450mm. It may be beneficial if the exposure apparatus 200 is arranged to hold another substrate W2 having a different diameter than the substrate W, as shown in the right part of FIG. 7 . The right part of FIG. 7 shows the moving member 204 supporting a further substrate holder 702 . A further substrate holder 702 is arranged to hold another substrate W2. The diameter of the other substrate W2 is larger than the diameter of the substrate W. As shown in FIG. The diameter of the further substrate W2 may be, for example, one of 12.5 mm or 50 mm or 100 mm or 150 mm or 200 mm or 300 mm or 450 mm. Also a substrate holder 702 is larger than the substrate holder 202 . Alternatively, the further substrate holder 702 may be smaller than the substrate holder 202 . To accommodate the further substrate holder 702, the moving member 204 may have two parts; a left portion 706 and a right portion 704. The left portion 706 and the right portion 704 are arranged together to support the substrate holder 202 and the further substrate holder 702 . When supporting the substrate holder 202, the left portion 706 and the right portion 704 are a distance 710 from each other. When supporting the further substrate holder 702, the left portion 706 and the right portion 704 are a distance 720 from each other. Where the further substrate holder 702 is larger than the substrate holder 202, the distance 720 is greater than the distance 710, so there is more space between the left portion 706 and the right portion 704 to support the further substrate holder 702 (ie, in this case, the left portion 706 and the right portion 704 are further apart from each other). Left 706 and right 704 can be manually adjusted to set distances 710 and 720 , or mover 204 can be provided with actuators to set (or adjust) distances 710 and 720 . The actuators may include lead screws or piezoelectric actuators or any other suitable actuators to move the left and right portions 706 and 704 relative to each other. Moving member 204 may include sensors to provide signals representative of distances 710 and 720 . This signal can be used as a control signal for the actuator to set (or adjust) distances 710 and 720 .

The embodiment of FIG. 7 may provide the benefit of having a single lithographic apparatus capable of processing substrates of different sizes. IC manufacturers do not have to purchase dedicated lithography equipment for each size of substrate; instead, a single lithography equipment handles substrates with different sizes, which results in efficient use of the lithography equipment. The lithographic apparatus may be provided with a substrate holder handler. The lithographic apparatus may be provided with multiple substrate holder handlers. The substrate holder handler is arranged to couple with the substrate holder 202 and remove the substrate holder 202 from the lithographic apparatus. The substrate holder handler is arranged to add the substrate holder 202 to the lithographic apparatus, eg by placing the substrate holder 202 on the mover 204 . Similarly, the substrate holder handler may be arranged to add another substrate holder 212 and/or a further substrate holder 702 to the lithographic apparatus, and to remove another substrate holder 212 from the lithographic apparatus and/or also a substrate holder 702 . For example, the exchange mechanism 208 may form a substrate holder handler. The exchange mechanism 208 may include multiple substrate holder handlers, and each substrate holder handler may be independently controlled. When an IC manufacturer wants to expose a different size or type of substrate W, the substrate holder handler can remove the current substrate holder (ie, the currently used substrate holder) from the lithographic apparatus, and It is replaced with another type of substrate holder suitable for a different size or type of substrate W. In this embodiment, the further substrate holder 212 may be of the same size as the substrate holder 202 , and the further substrate holder 702 may be of a different size than the substrate holder 202 . In this embodiment, there may be another substrate holder with the same dimensions as the further substrate holder 702 . In this embodiment, when an IC manufacturer wants to expose substrates W of different sizes, a further substrate holder 702 and another substrate holder of the same size as the further substrate holder 702 can be used to Instead of the substrate holder 202 and another substrate holder 212 . The substrate holder handler may be very similar to a wafer handler, and may include, for example, a robotic arm and/or a gripper to engage with the substrate holder.

Left portion 706 and right portion 704 may each have coil arrays 740 . The coil array 740 may extend in the y-direction. The substrate holder 202 and the further substrate holder 702 may be arranged with an array of magnets 730 . The magnet array 730 may extend in the y-direction. Alternatively, the left portion 706 and the right portion 704 are each provided with an array of magnets 730 , and the substrate holder 202 and the further substrate holder 702 are each provided with an array of coils 740 . The magnet array 730 and coil array 740 together form an actuator system to move the substrate holder 202 and the further substrate holder 702 in the y-direction relative to the mover 204 . The actuator system may be arranged to move the substrate holder 202 and the further substrate holder 702 a distance over one or several target portions C relative to the moving member 204 . This distance may be less than 100mm or less than 50mm or less than 20mm or less than 10mm or less than 5mm or less than 2mm. The actuator system may alternatively or additionally be arranged to move the substrate holder 202 relative to the mover 204 in the x-direction. The range of movement in the x-direction can be significantly smaller than the range of movement in the y-direction. For example, the actuator system may move the substrate holder 202 in the x-direction relative to the moving member 204 within a range of less than 5 mm, eg, less than 2 mm, eg, less than 1 mm. The left portion 706 and the right portion 704 may each form a U-shape. The U-shape may form a space into which the position measurement system may extend. For example, the encoder system extends through the U-shape. The mover 204 may be arranged such that the substrate holder 202 may be coupled to and decoupled from the mover 204 by moving in the direction of the magnet array 730 (ie, the y-direction of FIG. 7 ). One of the magnet array 730 and the coil array 740 may form part of an actuator to move the sensor holder 206 relative to the mover 204 .

The mover 204 may support the guidance system. The guiding system may be arranged to guide the movement of the left portion 706 and the right portion 704 relative to each other in the x-direction. For example, the guide system includes rails to allow the left portion 706 to move relative to the right portion 704 in the x-direction.

The rail guiding the left portion 706 may be provided with two end stops. An end stop may be located at one side of the rail. The left portion 706 may be configured to support the substrate holder 202 when the left portion 706 is located at an end stop. Another end stop may be located at the other side of the rail. The left portion 706 may be arranged (adjusted) to support the further substrate holder 702 when the left portion 706 is located at the other end stop. Similarly, the rail guiding the right portion 704 may be provided with two end stops. The right portion 704 may be configured to support the substrate holder 202 when the right portion 704 is located at an end stop. Another end stop may be located at the other side of the rail. The right portion 704 may be configured to support the further substrate holder 702 when the right portion 704 is located at the other end stop.

In one embodiment, the substrate holder 202 is arranged to hold the substrate W and another substrate W2. For example, the substrate holder 202 may be provided with clamping means to clamp the substrate W and another substrate W2. When clamping the substrate W, the clamping device may provide a clamping force, such as vacuum force or electrostatic force, on the first region. The clamping device can provide a clamping force on the second area when clamping another substrate W2. The second area may be larger than the first area. The second region may have a larger diameter than the first region.

Figure 8 depicts an embodiment according to the invention. In the left part of FIG. 8 , the moving member 204 supports the substrate holder 202 and the sensor holder 206 . The sensor holder 206 has a width 800 and a length 802 . The length 802 is substantially equal to the dimensions of the substrate holder 202 . For example, the size of the substrate holder 202 is approximately the diameter of the substrate W. The length 802 is approximately the diameter of the substrate W. The length 802 can be substantially equal to the dimensions of the substrate holder 202 and can be long enough to accommodate the marker array 810 . Mark array 810 may provide (or include) alignment marks along a distance approximately equal to the diameter of substrate W; in other words, a plurality of alignment marks are arranged along mark array 810 . Additionally, sensor holder 206 holds sensors 850 , 852 and 854 . At least one of the sensors 850, 852, and 854 may include an illuminance irregularity sensor, a wavefront aberration measurement device, or a uniformity sensor as described above. For example, sensor 850 may include an illumination irregularity sensor, sensor 852 may include a wavefront aberration measurement device, and sensor 854 may include a uniformity sensor. At least one of the sensors 850, 852, and 854 may not be a sensor, but may instead be a cleaning device. At least one of sensors 850, 852, and 854 may be another type of sensor.

As shown in the right part of FIG. 8, the moving member 204 supports the further substrate holder 702, which is larger than the substrate holder 202 to support another substrate W2. Because the other substrate W2 is larger than the substrate W, the marker array 810 may not be large enough (or long enough) to provide enough alignment marks and/or to properly arrange the alignment marks. To address this problem, the sensor holder 206 is provided with another marker array 820 . The further marker array 820 is larger than the marker array 810 . In order to support the further marker array 820, the width 800 is substantially equal to the size of the further substrate holder 702, which means that in the case where the further substrate holder 702 is larger than the substrate holder 202, the width 800 is smaller than the size of the further substrate holder 702. Length 802 is longer.

As shown in FIG. 8, the sensor holder 206 has a first orientation in the left portion of FIG. 8, and is

There is a second orientation in the right part of FIG. 8 . In the first orientation, the sensor holder 206 has a first angle along an axis perpendicular to the horizontal. In the first orientation, the width 800 is aligned along the y-axis and the length 802 is aligned along the x-axis. The first orientation can be defined as an angle of 0° along the z-axis. In the second orientation, the sensor holder 206 has a second angle along an axis perpendicular to the horizontal, wherein the first angle is different from the second angle. In the second orientation, the length 802 is aligned along the y-axis and the width 800 is aligned along the x-axis. The second orientation can be defined as a 90° angle along the z-axis. In one embodiment, the difference between the angle of the first orientation and the angle of the second orientation may be a value other than 90°, such as 30° or 45°, or 120° or 180°. The shape of the sensor holder 206 may differ from a rectangular shape, such as a triangle or a T-shape.

In one embodiment, the sensor holder 206 has a length 802 and a width 800 that are suitably large for both the substrate holder 202 and the further substrate holder 702 only in the first orientation. Alternatively, two sensor holders 206 are provided, with one sensor holder being larger than the other sensor holder.

In one embodiment, the sensor holder 206 is arranged to receive the radiation beam (or exposure beam) from the substrate holder 202 . For example, the projection system PS propagates the exposure beam to the substrate holder 202 . Via substrate holder 202 , at least part of the exposure beam is directed to sensor holder 206 . In one embodiment, substrate holder 202 includes indicia 830 . The projection system PS exposes the indicia 830 with an exposure beam to project an image on the indicia 830 . The exposure beam includes information about the image projected on indicia 830 . As the exposure beam propagates through the marker 830 and reaches the sensor holder 206, information about the image is propagated to the sensor holder 206. The sensor holder 206 may be provided with a detector 840 to receive the exposure beam and provide (or generate) a signal representing information about the image projected on the indicia 830 . For example, the information may be the position of the image on the marker 830, the interference pattern between the image and the marker 830, the distortion of the image projected onto the marker 830, or the intensity of the exposure beam. In addition to detector 840, sensor holder 206 may be provided with at least one additional detector. One of the at least one additional detector may be arranged on a different side of the sensor holder 206 than the side of the sensor holder 206 on which the detector 840 is arranged. For example, the detectors 840 are arranged on the side of the length 802 and the additional detectors are arranged on the side of the width 800 . The additional detector may face the substrate holder 202 or a further substrate holder 702 when the sensor holder 206 is in the second orientation.

In one embodiment, marker 830 and detector 840 may be components of an aerial image measurement device configured to measure an aerial image of the pattern projected by projection system PS. In this context, marker 830 may include a fiducial plate or may include multiple fiducial plates. When both the substrate holder 202 and the sensor holder 206 are supported by the moving member 204, the detector 840 may provide information (or generate a signal representing the information) about the aerial image (in other words, the aerial image measurement device measures the aerial image). When the substrate holder 202 and the sensor holder 206 perform movement in unison, the detector 840 may provide information about the aerial image (or generate a signal representing the information).

In one embodiment, the detector is not arranged on the sensor holder 206, but is arranged elsewhere so that the sensor holder 206 can move relative to the detector. For example, the detector 840 may be arranged on the moving member 204, or the detector 840 may be arranged on a stationary frame. In this embodiment, the sensor holder 206 may be provided with optics to direct the exposure beam to the detector 840 .

As further depicted in FIGS. 2 and 9 , the exposure apparatus 200 may include an exposure apparatus, such as a projection system PS, and a measurement apparatus 220 . The exposure device is arranged to expose the substrate W with an exposure beam. The measurement device 220 is arranged to provide measurement information of the substrate W (ie arranged to measure the substrate W). The exposure apparatus and the measuring device 220 are remote from each other. A moving member 204 is arranged to support the substrate holder 202 in the vicinity of the exposure device.

The measurement device 220 may be any suitable device arranged to provide measurement information of the substrate W (ie arranged to measure the substrate W). For example, the measurement device 220 may provide information about the height profile of the substrate W, eg, information about the flatness of the substrate W. Information about the height profile can be used to position the substrate W to a particular z-position during exposure of a particular target portion C to produce an in-focus image on the target portion C. FIG. Additionally or alternatively, the measurement device 220 may be arranged to provide information on the in-plane deformation of the substrate W. For example, the measurement device 220 may provide information about the position of the substrate alignment marks P1, P2 on the substrate W. Information about the positions of the substrate alignment marks P1, P2 can be used to determine the position of the substrate alignment marks P1, P2 relative to each other or to compare this information to reference information. The information about the in-plane deformation can be used to position the substrate W to a specific x and y position during exposure of a specific target portion C to create an image at the correct x and y position on the substrate W.

The measurement device 220 may include a plurality of alignment sensors, as disclosed in US Patent Application US2009-0233234A1, which is hereby incorporated by reference. In other words, the measurement device 220 may include an alignment system that includes a plurality of such alignment sensors. Alternatively, the alignment system may include a single alignment sensor. During an alignment operation, the substrate W may be moved relative to the single alignment sensor such that the substrate alignment marks P1 , P2 then face the single alignment sensor. During the alignment operation, the alignment sensor may generate position information based on the position of the substrate alignment marks P1, P2, which is a kind of measurement information; in other words, the alignment sensor may measure the position of the substrate alignment marks P1, P2 Location. Additionally or alternatively, the alignment sensor may generate position information based on the position of the overlapping marks that may be located in the target portion C during the alignment operation. Additionally or alternatively, during an alignment operation, the alignment sensor may generate position information based on the positions of the substrate alignment marks P1, P2 and the overlapping marks; in other words, the alignment sensor may measure the substrate alignment marks P1, P2 and the position of the overlapping marker.

The exposure device and the measurement device 220 are remote from each other, so when the substrate W is at the exposure device, the substrate W is not at the measurement device 220 and vice versa. The substrate W may be moved from a position where the measurement device 220 performs measurements to provide measurement information to another position where the exposure device exposes the substrate W. In one embodiment, the exposure device and the measurement device 220 may be adjacent to each other. For example, when one edge of the substrate W is at the measurement device 220, the other edge of the substrate W is at the exposure device.

In one embodiment, referring to Fig. 2, the moving member 204 is arranged to support the substrate holder 202 while the substrate holder 202 is approaching the exposure apparatus. A stationary support 210 is provided to support the other substrate holder 212 while the other substrate holder 212 is close to the measurement device 220 . The other substrate holder 212 may be the same as or similar to one of the substrate holder 202 and the further substrate holder 702 . The stationary support 210 may have an actuator system to move the other substrate holder 212 relative to the stationary support 210 . The actuator system may be part of a moving device 230 arranged to move the further substrate holder 212 while being supported by the stationary support 210 . For example, the moving device 230 includes a robotic arm arranged to move the other substrate holder 212 in the x and y directions. The mobile device 230 may include multiple robotic arms. The robotic arm may be arranged to rotate the other substrate holder 212 along the z-axis. In other words, during operation of the measurement device 220 (eg, during an alignment operation), the moving device 230 can move the other substrate holder 212 in a horizontal direction relative to the stationary support 210 . In one embodiment, the other substrate holder 212 is provided with one of a magnet array 730 and a coil array 740 . The actuator system may be formed in part by one of the magnet array 730 and the coil array 740 . Another part of the actuator system may be arranged on the top surface of the stationary support 210 . For example, the top surface is provided with an array of magnets or coils. The magnet array or coil array may be arranged in a 2D array extending in the x-direction and the y-direction. Briefly, during operation of the measurement device 220, the other substrate holder 212 may be supported relative to the stationary by an actuator system (or part of an actuator system) provided on the other substrate holder 212 itself member 210 is moved (eg, in a horizontal direction).

In one embodiment, the exchange mechanism 208 may be arranged to transfer another substrate holder 212 from the stationary support 210 to the moving member 204 . Additionally or alternatively, the exchange mechanism 208 may be arranged to transfer the substrate holder 202 from the moving member 204 to the stationary support 210 . During operation of the measurement device 220 , the exchange mechanism 208 can move the other substrate holder 212 while the other substrate holder 212 is supported by the stationary support 210 . Mobile device 230 and switching mechanism 208 may be similarly arranged and operated. The moving device 230 and the exchange mechanism 208 can operate at different positions in the exposure device 200 at the same time. For example, as shown in FIGS. 2 and 3 , moving device 230 may hold (and/or move) another substrate holder 212 while the exchange mechanism 208 may hold (and/or move) sensor holder 206 .

The top surface of the stationary support 210 may be provided with a gas outlet to provide a thin film of gas between the top surface and another substrate holder 212 . The gas film can act as a gas bearing supporting the other substrate holder 212 without physical/physical contact between the other substrate holder 212 and the top surface. Each gas outlet may be provided with a valve. The valve may be arranged to open when the other substrate holder 212 is near or above the gas outlet, and may be arranged to close when the other substrate holder 212 is farther from the gas outlet. The gas provided by the gas outlet may include air, nitrogen or any other suitable gas.

In the embodiment shown in FIG. 9 , the exposure device 200 may be provided with a first encoder head 910 and a first scale 915 . The stationary support 210 includes a groove for holding the first encoder head 910 . The first scale 915 is provided at the bottom surface of the other substrate holder 212 . The first encoder head 910 faces the first scale 915 while the other substrate holder 212 is near or at the measuring device 220 and is arranged to provide (or generate) a first representation of the position information of the other substrate holder 212 Signal. For example, the first encoder head 910 may provide (or generate) representations of the position of the other substrate holder 212 along the x-axis, and/or along the y-axis, and/or along the z-axis, and/or the rotation about the x-axis , and/or rotation around the y-axis, and/or rotation around the z-axis. The first encoder head 910 may be an encoder head system that includes multiple encoder heads and/or includes other position sensors (eg, capacitive sensors or interferometric sensors) in addition to the encoder heads. Such an encoder head system may also be referred to as a position measuring device or a position measuring system.

The first encoder head 910 may be coupled to the stationary support 210 via a dynamic isolator. Dynamic isolators may include mechanical springs or dampers. Mechanical springs can be coil springs or leaf springs. The dampers may include viscous dampers or viscoelastic dampers. Kinetic isolators may include actuators, sensors, and controllers. Sensors may be arranged to detect vibrations of the stationary support 210 . Based on the input from the sensor, the controller may control the actuator to actuate so as to prevent vibration of the stationary support 210 from vibrating the first encoder head 910 . For example, the actuators are piezoelectric actuators or magnetoresistive actuators or Lorentz actuators. Alternatively, the sensor, controller and actuator may be arranged to maintain the desired position of the first encoder head 910 relative to the reference, regardless of the vibration of the stationary support 210 . The reference may be the measuring device 220 or the exposure device.

As shown in FIG. 9 , an exposure apparatus, such as a projection system PS, is supported by a frame 940 . In one embodiment, the exposure device is movable relative to the frame 940 . When the exposure device can move relative to the frame 940, the exposure device can change the path of the exposure beam. For example, when the exposure device can move in the x-direction, then the exposure device can displace the path of the exposure beam in the x-direction. By shifting the path of the exposure beam, a larger portion of the substrate W can be exposed by the exposure beam without moving the substrate holder 202 . Alternatively or additionally, by shifting the path of the exposure beam in the direction of movement of the substrate holder 202, a particular portion of the substrate W can be exposed for a longer period of time. The exposure device can be moved relative to the frame 940 along the x-axis, the y-axis, or both. The exposure device can be moved by an actuator such as a piezoelectric actuator or a Lorentz actuator. The exposure device may be guided by the guide device. The guiding means may comprise flexible elements, such as leaf springs. The guide means may comprise gas bearings. Alternatively or additionally, the projection system PS may be supported by the frame 940 via an AVIS (Active Vibration Isolation System). Such AVIS may include dampers, springs, position sensors and/or actuators (eg, voice coil motors). In one embodiment, the exposure device is movable relative to the frame 940 in a vertical direction (ie, along the z-axis). The AVIS can attenuate vibrations that can propagate between the frame 940 and the projection system PS. An example of an AVIS that can be used in the context of the present invention is disclosed in Japanese Patent Application Laid-Open No. JP2016-194599A, which is incorporated herein by reference. Since vibration is a typical type of undesired disturbance that degrades the imaging quality of a lithographic apparatus, AVIS can improve the imaging quality of a lithographic apparatus without degrading overall productivity.

In one embodiment, the exposure apparatus 200 is provided with further measurement means 950 arranged to provide further measurement information of the substrate W (ie arranged to perform further measurements of the substrate W). A further measuring device 950 is located closer to the exposure device (eg, the projection system PS) than the measuring device 220 . The measuring device 220 is further away from the exposure device (eg the projection system PS) than the other measuring device 950 . The further measurement device 950 may be similar to the measurement device 220 and may provide similar information about the substrate W. For example, the further measurement device 950 may be the same type of sensor system as the measurement device 220, but the measurement device 220 may provide information about the substrate W with better accuracy than the further measurement device 950 by taking a longer measurement time In other words, the measurement device 950 can complete the measurement of the substrate W in less measurement time. While the substrate holder 202 is supported by the moving member 204, a measurement device 950 can also perform measurement of the substrate W.

The information provided by the further measurement device 950 can be used to determine the z-position of the surface of the substrate W relative to the image plane of the exposure device. A further measurement device 950 may include a leveling sensor system that provides information about the height profile of the substrate W (eg, the flatness of the substrate W). The leveling sensor system may also be referred to as an autofocus system. The control unit may use the information about the height profile of the substrate W and the information provided by the aerial image measurement system to determine the positional relationship between the substrate W and the patterning device MA. The control unit may process multiple signals obtained by the leveling sensor system and the aerial image measurement system to determine the positional relationship between the substrate W and the patterning device MA. The control unit may process multiple signals and/or execute algorithms as disclosed in PCT Application Publication No. WO2005/096354A1, which is incorporated herein by reference.

The leveling sensor system may include a light source that provides the radiation beam. A beam of radiation (eg, light) may be directed to the top surface of the substrate W. The radiation beam is reflected by the top surface back to the leveling sensor system. Based on reflections (ie, based on reflected light), the leveling sensor system may generate a signal representing the height profile. The light source may provide a radiation beam having multiple wavelengths and/or having a continuous spectrum. The radiation beam may include infrared light, visible light and/or UV light. The light source may comprise an LED (Light Emitting Diode) or may comprise a plurality of LEDs. The light source may have LEDs with different colors, such as orange, red, green, cyan, blue, and violet (eg, with peak wavelengths of about 630, 605, 560, 505, 470, or 405 nm, respectively). The leveling sensor system can provide the radiation beam at an oblique angle to the substrate W. The leveling sensor system may provide the radiation beam such that the radiation beam is incident on a substantial portion of the substrate W (eg, along a line across the substrate W).

Information from yet another measurement device 950 can be used to determine the x and y positions of the substrate W relative to the image of the reference marks (eg, mask alignment marks Ml, M2) of the patterning device MA. Additionally or alternatively, a further measurement device 950 may provide information about the positions of the substrate alignment marks P1, P2 on the substrate W; in other words, a further measurement device 950 may measure the substrate alignment on the substrate W Mark the positions of P1 and P2. Information about the positions of the substrate alignment marks P1, P2 can be used to determine the position of the substrate alignment marks P1, P2 relative to each other or to compare this information to reference information. Still another measurement device 950 may include a wafer alignment sensor system that provides information about the in-plane deformation of the substrate W. The further measurement device 950 may include a plurality of alignment sensors, as disclosed in US Patent Application US2009-0233234A1, which is incorporated herein by reference. In other words, the wafer alignment sensor system may include such a plurality of alignment sensors. Alternatively, the wafer alignment sensor system may include a single alignment sensor. The information about the in-plane deformation can be used to position the substrate W to a specific x and y position during exposure of a specific target portion C to create an image at the correct x and y position on the substrate W. The control unit may use the information about the in-plane deformation of the substrate W and the information provided by the aerial image measurement system to determine the positional relationship between the substrate W and the patterning device MA. The control unit may process multiple signals obtained by the wafer alignment sensor system and the aerial image measurement system to determine the positional relationship between the substrate W and the patterning device MA. The control unit may process multiple signals and/or execute algorithms as disclosed in PCT Application Publication No. WO2007/097379A1, which is incorporated herein by reference.

In one embodiment, the exposure apparatus 200 includes a second encoder head 920 and a second scale 925 . The second scale 925 is arranged at the bottom surface of the substrate holder 202 . The second encoder head 920 is arranged to face the second scale 925 in order to provide (or generate) a second signal representing position information of the substrate holder 202 . The second encoder head 920 faces the second scale 925 while the substrate holder 202 is near or at the exposure apparatus (eg projection system PS) and is arranged to provide (or generate) a representation of the substrate holder 202 A second signal of location information. For example, the second encoder head 920 may provide (or generate) representations of the position of the substrate holder 202 along the x-axis, and/or along the y-axis, and/or along the z-axis, and/or around the x-axis A second signal of rotation, and/or rotation about the y-axis, and/or rotation about the z-axis. The second encoder head 920 may be an encoder head system that includes multiple encoder heads and/or includes other position sensors (eg, capacitive sensors or interferometric sensors) in addition to the encoder heads. Such an encoder head system may also be referred to as a position measuring device or a position measuring system. The second encoder head 920 may be mounted on the measurement arm. A measurement arm can be attached to the frame 940 and can extend below the substrate holder 202 . The second encoder head 920 may be positioned along the optical axis of the exposure apparatus.

The substrate holder 202 and the other substrate holder 702 may exchange positions such that the first encoder head 910 faces the second scale 925 and the second encoder head 920 faces the first scale 915 . In this case, the first encoder head 910 may provide (or generate) a first signal representing position information of the substrate holder 202 . In this case, the second encoder head 920 may provide (or generate) a second signal indicative of the position information of the further substrate holder 702 .

In one embodiment, the exposure apparatus 200 includes a third encoder head 930 and a third scale 935 . The third scale 935 is arranged at the bottom surface of the sensor holder 206 . The third encoder head 930 is arranged to face the third scale 935 in order to provide (or generate) a third signal representing position information of the sensor holder 206 . The third encoder head 930 faces the third scale 935 while the sensor holder 206 is supported by the exchange mechanism 208 and is arranged to provide a third signal representing position information of the sensor holder 206 . For example, the third encoder head 930 may provide a representation of the position of the sensor holder 206 along the x-axis, and/or along the y-axis, and/or along the z-axis, and/or rotation about the x-axis, and/or about the y-axis , and/or a third signal of rotation about the z-axis. The third encoder head 930 may be an encoder head system that includes multiple encoder heads and/or includes other position sensors (eg, capacitive sensors or interferometric sensors) in addition to the encoder heads. Such an encoder head system may also be referred to as a position measuring device or a position measuring system. The third encoder head 930 may be mounted on another measurement arm. The other measurement arm can be attached to the frame 940 and can extend below the sensor holder 206 .

In one embodiment, the further substrate holder 702 may be the same size as the substrate holder 202, or may be a different size. For example, in the embodiments of Figures 3 and 9, in a lithographic apparatus that is only compatible with a single size of substrate, the further substrate holder 212 and/or the further substrate holder 702 may be compatible with the substrate holder 202 is the same. Alternatively or additionally, in a lithographic apparatus that is only compatible with a single size substrate made of a different material, the further substrate holder 702 may have the same dimensions as the substrate holder 202, but also a The substrate holder 702 may be made of a different material than the substrate holder 202 . Alternatively, in the embodiments of Figures 7 and 8, in a lithographic apparatus that is compatible with multiple sizes of substrates, the further substrate holder 702 may have a different size than the substrate holder 202, and also a The substrate holder 702 can be replaced with another substrate holder 212 having the same dimensions as the substrate holder 202 . Additionally or alternatively, the further substrate holder 702 may hold a different type of substrate W than the substrate on the substrate holder 202; for example, at some point during operation of the lithographic apparatus, when the substrate W is When loaded onto the further substrate holder 702 , a dummy wafer can be loaded onto the substrate holder 202 . In one embodiment, exposure apparatus 200 includes two substrate holders 202 and two further substrate holders 702 . The two substrate holders 202 may have the same size. The two further substrate holders 702 may be the same size or may be larger than the two substrate holders 202 . In the first mode of operation, the exposure apparatus uses two substrate holders 202 to hold the substrates W, while two further substrate holders 702 are stored, for example, at a storage location in the exposure apparatus 200 . The two further substrate holders 702 may remain idle (ie, remain unused) during the first mode of operation. In the second mode of operation, the exposure apparatus uses two further substrate holders 702 to hold the substrates W, while the two substrate holders 202 are stored, for example, at storage locations in the exposure apparatus 200 . During the second mode of operation, the two substrate holders 202 may remain idle (ie, remain unused).

The sensor holder 206 may be located in the position of the substrate holder 202 such that the second encoder head 920 faces the third scale 935 . In this case, the second encoder head 920 may provide (or generate) a second signal representing position information of the sensor holder 206 .

In one embodiment, an exposure apparatus is provided that includes a substrate holder 202, a sensor holder 206, a moving member 204, and a projection system PS. The substrate holder 202 is used to hold the substrate W. The sensor holder 206 is used to hold the sensor. A moving member 204 is arranged for moving the substrate holder 202 . The projection system PS is arranged to provide the radiation beam onto the substrate W. During exposure, the projection system PS provides a beam of radiation onto the substrate W when the sensor holder 206 is decoupled from the mover 204 . The moving member 204 may be coupled with the sensor holder 206 when the sensor measures properties of the projection system PS or the radiation beam.

The exposure apparatus may include an exchange mechanism 208 for providing the sensor holder 206 to the moving piece 204 and for removing the sensor holder 206 from the moving piece 204 .

The moving member 204 may be arranged to move a further substrate holder 702 for supporting another substrate W2. Also, the size of the substrate W2 may be different from the size of the substrate W. As shown in FIG. By configuring the exposure apparatus in this way, the exposure apparatus can be flexibly and efficiently compatible with substrates of different sizes. A single exposure apparatus capable of exposing substrates of different sizes may improve CoO (cost of ownership) and/or TCO (total cost of ownership) compared to a situation where each of multiple exposure apparatuses is dedicated to exposing substrates of a particular size .

The sensor holder 206 has a length and a width. The length may be substantially equal to the dimensions of the substrate holder 202 . The width may be substantially equal to the size of the further substrate holder 702 . The length and width can be different from each other.

The mover 204 may be arranged to support the sensor holder 206 in the first orientation and the second orientation. In the first orientation, the sensor holder 206 has a first angle along an axis perpendicular to the horizontal. In the second orientation, the sensor holder 206 has a second angle along an axis perpendicular to the horizontal. The first angle is different from the second angle.

The mover may be arranged to be decoupled from the substrate holder so as to move without moving the substrate holder.

The sensor holder 206 may be arranged to receive the radiation beam from the substrate holder 202 . The substrate holder 202 may include indicia (eg, indicia 830). The radiation beam may include information about the image projected on the marker. The sensor holder 206 may be arranged to propagate the radiation beam to a detector (eg, detector 840). The sensor holder 206 is movable relative to the detector.

The exposure apparatus may include an exposure device and a measurement device. The exposure device is arranged to expose the substrate with an exposure beam. The measurement device is arranged to provide measurement information of the substrate W. The exposure device and the measuring device are remote from each other. The moving member 204 is arranged to support the substrate holder 202 while approaching the exposure apparatus.

The exposure apparatus may comprise a stationary support 210 arranged to support the substrate holder 202 while being close to the measuring device.

The exposure apparatus may include a first encoder head 910 and a first scale 915 . The stationary support 210 may include grooves for holding the first encoder head 910 . The first scale is arranged at the bottom surface of the substrate holder 202 . The first encoder head 910 faces the first scale 915 while the substrate holder 202 is close to the measurement device 220 and is arranged to provide a signal representing positional information of the substrate holder 202 . The first encoder head 910 may be coupled to the stationary support 210 via a dynamic isolator. The exposure apparatus may comprise moving means arranged to move the substrate holder while being supported by a stationary support. The exposure apparatus may include a frame 940 for supporting the exposure device. The exposure device is movable relative to the frame. The exposure apparatus may comprise further measuring means 950 arranged to provide further measuring information of the substrate W. A further measuring device 950 may be closer to the exposure device than the measuring device.

The exposure apparatus may include a second encoder head 920 . The second encoder head 920 is arranged to face the first scale 915 in order to provide a second signal representing position information of the substrate holder 202 .

The exposure apparatus may include a third encoder head 930 and a third scale 935 . The third scale 935 is arranged at the bottom side of the sensor holder 206 . The third encoder head 930 is arranged to face the third scale 935 in order to provide a third signal representing position information of the sensor holder 206 .

Embodiments of the lithographic apparatus of Figure 9 may operate in the following manner. 10A-10I illustrate the following manner in schematic top view.

The first substrate in the first batch W1L1 is loaded onto yet another substrate holder 702; see FIG. 10A. In this embodiment, the first substrate in the first batch W1L1 is also referred to as the first substrate W1L1. A substrate holder 702 also moves the first substrate W1L1 to the measurement device 220 . The measurement device 220 provides measurement information of the first substrate W1L1. The measurement information is wafer alignment information, which is information about the shape and position of the first substrate W1L1. The measurement device 220 provides fine wafer alignment information based on a number of measurements, eg, based on measuring the positions of a number of substrate alignment marks relative to each other or comparing this information to reference information. In this embodiment, all of the substrate alignment marks on the wafer, eg, 96 substrate alignment marks on the wafer, can be measured by the measurement device 220 . The substrate alignment marks on the wafer may also be referred to as wafer alignment marks. In addition, the measuring device 220 can also measure the overlapping marks on the first substrate W1L1. The fine wafer alignment information provides precise information about most of the surface (or the entire surface) of the first substrate W1L1. At this point, the sensor holder 206 may be located below the projection system PS, and the sensors on the sensor holder 206 may measure the properties of the projection system PS, the properties of the aerial image, and/or the properties of the exposure beam.

As depicted in FIG. 10B , after the measurement device 220 has collected the measurement information, the movement device 230 transfers the first substrate W1L1 from the further substrate holder 702 to the substrate holder 202 . The moving device 230 is arranged to pick up the first substrate W1L1 from the further substrate holder 702 and place the first substrate W1L1 onto the substrate holder 202 . In other words, the moving device 230 is configured to unload the first substrate W1L1 from the further substrate holder 702 and then load the first substrate W1L1 onto the substrate holder 202 . At this time, the moving device 230 may load the second substrate in the first batch of W2L1 onto the further substrate holder 702 . The second substrate in the first batch W2L1 is also referred to as the second substrate W2L1. In one embodiment, the mobile device 230 may include multiple robotic arms and/or multiple Bernoulli chucks to enable simultaneous handling of the first substrate W1L1 and the second substrate W2L1. In other words, in this embodiment, the moving device 230 is configured not only to unload substrates from the further substrate holder 702 , but also to load substrates onto the further substrate holder 702 .

As depicted in FIG. 10C , the substrate holder 202 positions the first substrate W1L1 at (or below) a further measurement device 950 . A further measurement device 950 provides further measurement information of the first substrate W1L1. The further measurement information is additional wafer alignment information, which is information related to the shape and position of the first substrate W1L1. The further measurement device 950 provides rough wafer alignment information based on a small number of measurements, such as on the position of a small number of substrate alignment marks relative to each other, or with reference information Compare. In this embodiment, the small number of substrate alignment marks may be, for example, between 3 and 16 substrate alignment marks. Typically, less measurement time is required for measuring a smaller number of substrate alignment marks; in other words, less time is required to operate a measurement device than the time required to obtain fine wafer alignment information by the measurement device 220 950 for obtaining rough wafer alignment information. The sensor holder 206 is located below the projection system PS while the measurement device 950 is collecting additional measurement information. The sensor holder 206 may be supported and/or moved, for example, by the exchange mechanism 208 depicted in FIG. 5 . While the further measurement device 950 is collecting further measurement information, the sensors on the sensor holder 206 are measuring the properties of the projection system PS, the properties of the aerial image, and/or the properties of the exposure beam. When the further measurement device 950 is collecting the further measurement information, the measurement device 220 is collecting from the second substrate W2L1 that has been loaded on the further substrate holder 702 and held by the further substrate holder 702 measurement information.

After the further measurement device 950 has collected the further measurement information, ie, once the rough wafer alignment information has been obtained by the further measurement device 950, the mover 204 moves the substrate holder 202, wherein the first substrate W1L1 is located below the projection system PS; see Figure 10D. The sensor holder 206 is moved away from below the projection system PS. The sensor holder 206 may be supported and/or moved by the exchange mechanism 208 depicted in FIG. 9 . When the first substrate W1L1 is under the projection system PS, the first substrate W1L1 is exposed with an exposure beam to project a pattern on the first substrate W1L1. This configuration is beneficial in improving the throughput performance of the lithographic apparatus due to the relatively short time required to operate the further measurement device 950 located closer to the projection system than the measurement device 220. The throughput performance of the lithographic apparatus will deteriorate if further measurement device 950 is positioned away from projection system PS, and/or if another object interferes with the smooth movement of substrate holder 202 and sensor holder 206 .

10E and 9, during exposure of the first substrate W1L1 on the substrate holder 202 (ie, during the stepping and/or scanning motion of the substrate holder 202 below the projection system PS), The measurement device 220 continues to measure (collect measurement information from the second substrate W2L1 ) and the second substrate W2L1 on the substrate holder 702 . During exposure of the first substrate W1L1 on the substrate holder 202, the sensor holder 206 is located (or parked) at a position within the exposure apparatus 200 where the sensor holder 206 does not interfere with the substrate holder 202 Stepping and/or scanning motion and measurement of the second substrate W2L1 on the further substrate holder 702 .

When all target portions C on the first substrate W1L1 have been exposed, the substrate holder 202 is decoupled from the moving member 204, and the sensor holder 206 is coupled to the moving member 204; in other words, as shown in FIGS. 10F and 10F and As depicted in FIG. 4 , the substrate holder 202 and the sensor holder 206 move in unison relative to the mover 204 . The exchange mechanism 208 moves the substrate holder 202 with the first substrate W1L1 to the substrate unload position, as identified in Figure 1OG. When the exchange mechanism 208 moves the substrate holder 202 away from under the projection system PS, as depicted in FIG. 6, the mover 204 moves the sensor holder 206 under the projection system PS, which allows the sensors on the sensor holder 206 to start The properties of the projection system PS or the exposure beam were measured as depicted in Figure 10H. Meanwhile, the measurement device 220 continues to collect measurement information from the second substrate W2L1 on the further substrate holder 702 .

At the substrate unloading position, also depicted in FIG. 10H, the first substrate W1L1 is unloaded from the substrate holder 202, for example, by a moving device 230; The processor 702 operates in a manner that unloads the first substrate W1L1, as described in FIG. 10B. After the first substrate W1L1 has been unloaded from the substrate holder 202, the first substrate W1L1 leaves the lithographic apparatus (or is transported to the outside of the lithographic apparatus); eg, the first substrate W1L1 is contained in a FOUP.

After the first substrate W1L1 is unloaded from the substrate holder 202, the substrate holder 202 is coupled to the mover 204 as depicted in FIG. 10I; in other words, as depicted in FIG. 4, the substrate holder 202 and the sensor holder 206 moves in unison relative to the mover 204 . When the substrate holder 202 is coupled to the mover 204 , the sensor holder 206 may be supported and/or moved by the exchange mechanism 208 depicted in FIG. 5 . Alternatively, as depicted in FIG. 4 , the sensor holder 206 may continue to remain supported by the mover 204 . When the sensor holder 206 is located below the projection system PS, the sensors on the sensor holder 206 can measure the projection, for example, by the exchange mechanism 208, by the mover 204, and/or by an actuator provided on the sensor holder 206 itself Properties of the system PS, properties of the aerial image, and/or properties of the exposure beam. The moving device 230 transfers the second substrate W2L1 from the further substrate holder 702 to the substrate holder 202, similar to how the moving device 230 has held the first substrate W1L1 from the further substrate as described in FIG. 10B The manner in which the holder 702 is transferred to the substrate holder 202. The steps described above for the first substrate W1L1 are now repeated for the second substrate W2L1. When the above steps are completed for all substrates in the first batch, the same or similar operations can be repeated for the substrates in the second batch.

10A depicts the exposure apparatus being arranged to hold the first substrate W1L1 on a further substrate holder 702 while the measurement device 220 is acquiring measurement information from the first substrate W1L1. At this time, the sensor holder 206 may be located below the projection system PS, and the sensors on the sensor holder 206 may perform measurements. 10C depicts the exposure apparatus being arranged to hold the first substrate W1L1 on the substrate holder 202 while the further measurement device 950 is acquiring further measurement information from the substrate W1L1. At this point, the measurement device 220 can already start measuring (acquiring measurement information from the second substrate W2L1 ) the second substrate W2L1 on the further substrate holder 702 . FIGS. 9 and 10E depict that the measurement device 220 continues to measure the second substrate W2L1 on the further substrate holder 702 while the first substrate W1L1 on the substrate holder 202 is being exposed. 10G depicts the measurement device 220 continuing to measure the second substrate W2L1 on the further substrate holder 702 while the substrate holder 202 is moved away from the projection system PS towards the substrate unloading position. 10H depicts the measurement device 220 continuing to measure the second substrate W2L1 on the further substrate holder 702 while the first substrate W1L1 is unloaded from the substrate holder 202 . At this time, the sensor holder 206 may be located below the projection system PS, and the sensors on the sensor holder 206 may perform measurements.

By configuring and operating the lithographic apparatus in this manner, the measurement device 220 has a maximum amount of time to collect measurement information without limiting the throughput performance of the lithographic apparatus since it is not subject to the measurements required by the measurement device 220 time limit. Therefore, better imaging quality can be achieved without deteriorating overall productivity. In other words, better overall productivity can be achieved while qualifying for a certain adequate imaging quality. In contrast, if the measurement device 950 takes longer measurement times (eg, if the measurement device 950 obtains fine wafer alignment information), the lithographic apparatus will suffer from a trade-off between throughput performance and imaging quality . This tradeoff is also commonly observed in lithographic apparatuses that include a single wafer stage and a single wafer alignment system. Additionally, the sensors on the sensor holder 206 are capable of measuring the properties of the projection system PS, the properties of the aerial image, and/or the properties of the exposure beam without interfering with the exposure of the substrate; thus, better imaging quality (and/or better imaging quality can be achieved) or better uptime performance, such as where sensor holder 206 includes a cleaning device) without degrading throughput performance. In addition, the measurement device 220 and the further measurement device 950 do not increase the footprint of the lithographic apparatus (also referred to as exposure equipment) because the measurement device 220 and the further measurement device 950 are larger than the substrate holder 202, the further substrate holder 702 or substrate W is smaller (especially in the horizontal direction, ie in the xy plane). Thus, the configuration of the exposure apparatus 200 is a solution to the trilemma between overall productivity of the exposure apparatus, imaging quality, and economy.

The control unit may drive the substrate holder 202 (or control the position of the substrate holder 202) based on the measurement information and/or further measurement information. For example, based on the measurement information and/or further measurement information, the control unit may determine the nominal position of the target portion C not on the substrate W (ie, the position of the target portion C on the substrate W when the substrate W is undeformed) place. Additionally or alternatively, based on the measurement information and/or further measurement information, the control unit can derive the position on the (deformed) substrate W onto which the aerial image of the pattern should be projected. The control unit can drive the substrate holder 202 and correct the position of the substrate holder 202 so that the target portion C is in the correct position under the projection system PS during exposure. An example of such a control unit, which can be used in the context of the present invention, is disclosed in Japanese Patent Application Laid-Open No. JP2002-353121A, which is hereby incorporated by reference.

Additionally or alternatively, based on the measurement information and/or further measurement information, the control unit may control the optical properties of the aerial image, the optical properties of the projection system PS, or both. For example, the control unit may compensate for distortions of the image to be projected onto the substrate W, aberrations of the projection system PS, and/or in-plane deformations of the substrate W by controlling one or both of these optical properties. These optical properties controlled by the control unit may be magnification-X (ie magnification along the x-axis or in the step direction), magnification-Y (ie magnification along the y-axis or in the scan direction), distortion/ Distortion, coma, field curvature, spherical aberration and/or astigmatism. One or some of these optical properties can be controlled by actuating the position and/or orientation of optical elements (in projection system PS) during exposure, during scanning and/or during stepping. An example of such a control unit, which can be used in the context of the present invention, is disclosed in Japanese Patent Application Publication No. JP2007-012673A, which is incorporated herein by reference.

The control unit may use the fine wafer alignment information as provided by the measurement device 220 to determine precise alignment corrections (or distortion maps). The precise alignment correction (or distortion map) may have a linear component (or a low-order component) and a high-order component to define the actual shape of the substrate W compared to the nominal shape. These components of the distortion map can be expressed mathematically in terms of the coefficients of a polynomial. For example, the fine wafer alignment information is based on alignment marks at each target portion C, or based on multiple alignment marks at each target portion C (eg, substrate alignment marks P1, P2). The deformation or distortion of the substrate W within the target portion C (ie, within the exposure field or within the die) may be referred to as intra-field distortion. Overlap errors caused at least in part by intrafield distortion may be referred to as intrafield overlap errors. Deformation or twisting of the substrate W between dies or exposure fields may be referred to as inter-field distortion. Overlap errors caused at least in part by interfield distortion may be referred to as interfield overlap errors. In one embodiment, the number of these alignment marks is less than the number of exposure fields (or the number of dies). Alternatively, the number of these alignment marks is equal to the number of exposure fields (or number of dies). Deformation of the substrate W, such as bending or warping or stretching, results in displacement of the alignment marks relative to each other. Based on the fine alignment information, the control unit can precisely determine the actual shape of the substrate W. Measurement device 220 may provide fine wafer alignment information based on overlapping marks that may be located in target portions C and/or based on substrate alignment marks P1 , P2 that may be located between target portions C. In one embodiment, the fine wafer alignment information, which includes deformation information for the substrate W, is based on measurements of both overlay marks and substrate alignment marks. In one embodiment, the sum of the number of overlapping marks and/or substrate alignment marks on substrate W measured by measurement device 220 is greater than or equal to the number of exposure fields (or number of dies); for example, If there are 96 exposure fields (or dies) on substrate W, the sum of the number of overlapping marks and/or substrate alignment marks on substrate W measured by measurement device 220 may be greater than or equal to 96. Typically, wafer alignment information based on measurements of a large number of marks (eg, substrate alignment marks and/or overlapping marks on substrate W) can more accurately determine the actual shape of substrate W. Accordingly, the imaging quality of the lithographic apparatus may be enhanced (or may be improved) when the measurement device 220 measures a large number of marks on the substrate W.

When the moving device 230 transfers the first substrate W1L1 from the further substrate holder 702 to the substrate holder 202, the actual shape of the substrate W may be changed to a new actual shape. However, the difference between the actual shape and the new actual shape usually only has low spatial frequencies. Another measurement device 950 can provide coarse alignment information based on a small number of measurements of the substrate alignment marks. This small number can be in the range of 3 to 20, for example 16. Based on the coarse alignment information and the fine alignment information, the control unit may determine a new shape of the substrate W. Because the control unit can determine the new shape of the substrate W in this way, the imaging quality of the lithographic apparatus can be enhanced (or can be improved), and/or a better overall productivity can be achieved while qualifying for Sufficient imaging quality required to manufacture ICs.

The fine wafer alignment information provided by the measurement device 220 may be implemented as a fine distortion profile, ie a map of the surface of the substrate W indicating the amount of distortion in a great deal of detail. The coarse wafer alignment information provided by the further measurement device 950 may be implemented as a coarse distortion profile, ie a map of the surface of the substrate W indicating the amount of distortion with less detail. The control unit may combine (or synthesize) the fine and coarse distortion profiles to create a combined distortion map, which may also be referred to as a composite distortion map or an integrated distortion map. Based on the combined distortion map, the control unit can control the position of the substrate holder 202 . Additionally or alternatively, the control unit may create a combined distortion map for each substrate in a batch (or for some substrates in a batch). For example, the control unit may create a first combined distortion profile of the first substrate W1L1 by combining (or synthesizing) the first fine distortion profile and the first coarse distortion profile, the first fine distortion profile and the first The coarse distortion profile is a map of the surface of the first substrate W1L1. Similarly, the control unit may create a second combined distortion profile of the second substrate W2L1 by combining (or synthesizing) the second fine distortion profile and the second coarse distortion profile, the second fine distortion profile and the first The second coarse distortion profile is a mapping of the surface of the second substrate W2L1. Alternatively, the control unit may create a second combined distortion profile for any of the other substrates in the batch based on the fine and coarse distortion profiles for the substrates. Additionally or alternatively, the control unit may create a third combination for one of the other substrates in the second batch based on the fine and coarse distortion profiles of the substrates in the second batch Distortion distribution map.

Additionally or alternatively, based on the fine distortion profile and/or the combined distortion profile, the control unit may control the optical properties of the aerial image, the optical properties of the projection system PS, or both. Based on the fine distortion profile, and/or based on the combined distortion profile, and/or based on measurement data of one of the sensors held by the sensor holder 206, and/or based on a simulation model, the control unit may compensate for the projection to the substrate W distortion of the image, aberrations of the projection system PS, and/or in-plane distortion of the substrate W. The measurement data obtained by one of the sensors held by the sensor holder 206 may include properties of the projection system PS, properties of the aerial image, and/or properties of the exposure beam. The control unit may control one or some of the following optical properties of the aerial image and/or projection system PS: magnification-X, magnification-Y, distortion/distortion, coma, field curvature, spherical aberration, astigmatism or any other types of aberrations.

During exposure, during scanning and/or during stepping, the position and/or orientation of the actuating optical element (relative to the lens barrel, relative to the path of the radiation beam B, or relative to the light of the projection system PS axis) to control one or some of these optical properties of the aerial image and/or projection system PS. One or more of these optical elements in projection system PS may be supported by a lens holder, and/or may be actively actuated (or controlled) by piezoelectric actuators during exposure and/or during scanning.

One or some of these optical properties of the aerial image and/or projection system PS may be actively controlled by deformable mirrors in projection system PS. An example of such a deformable mirror, which can be used in the context of the present invention, is disclosed in Japanese Patent Application Publication No. JP2013-161992A, which is hereby incorporated by reference.

At least one optical property of the aerial image can be controlled by bending the patterning device MA and/or by controlling the position of the substrate holder 202 . In one embodiment, field curvature is at least partially compensated by bending the patterning device MA. Additionally or alternatively, by controlling the position of the substrate holder 202 during exposure, inter-field overlap errors, and/or lower order components of intra-field overlap errors are at least partially compensated. With these compensations, better imaging quality will be achieved; in other words, better overall productivity will be achieved while qualifying for adequate imaging quality required to manufacture ICs.

In one embodiment, the control unit creates a combined distortion profile by combining (or synthesizing) a fine distortion profile and a coarse distortion profile, both of which contain information about the in-plane deformation of the substrate W information. Additionally or alternatively, based on the fine distortion profile and/or the combined distortion profile, the control unit compensates by controlling the position of the substrate holder 202, the optical properties of the aerial image, and/or the optical properties of the projection system PS In-plane deformation of the substrate W. By operating the lithographic apparatus in this manner, specific imaging quality requirements (eg, overlap requirements), eg, for specific nodes, can be met. In contrast, when compensating for the in-plane deformation of the substrate W based only on the coarse distortion profile, the same specific imaging quality requirements may not be met.

In one embodiment, the refined distortion profiles and/or combined distortion profiles may be used to calibrate, update and/or improve simulation models that predict the spatial images and/or patterns created on the substrate. Additionally or alternatively, multiple fine distortion profiles and/or multiple combined distortion profiles may be used to calibrate, update and/or improve the simulation model. For example, a first fine distortion profile (and/or a first combined distortion profile) providing information on the in-plane deformation of the first substrate W1L1, and a first fine distortion profile providing information on the in-plane deformation of the second substrate W2L1 The two fine distortion profiles (and/or the second combined distortion profile) may be used as a collection of measurement data obtained at different points in time during operation of the exposure apparatus for exposing a batch of wafers. The collection of measurement data can be used to calibrate, update and/or improve simulation models that predict the spatial images and/or patterns created on the substrate as a function of time. For example, such a simulation model can predict how the aerial image (and/or the pattern created on the substrate) is affected by temperature changes in the patterning device MA, the optical elements in the projection system PS, and/or the substrate holder 202 ( effect over time). Comparing the set of measurement data obtained at different points in time with the set of simulations can improve the accuracy of the simulation model. In addition to these multiple fine distortion profiles (and/or multiple combined distortion profiles), other types of measurement data such as temperature of purge gas, patterning device MA, optical elements in projection system PS, and/or substrate holder 202) to calibrate, update and/or improve the simulation model. If the simulation model can be calibrated, updated, and/or improved based on measurement data obtained during IC production (ie, during uptime of the exposure equipment), then the Compared with methods of calibrating, updating and/or improving simulation models during downtime of exposure equipment), better overall productivity can be achieved.

Aberrations can be described by Zernike polynomials. Aberrations can be described in terms of a set of trigonometric functions. For example, based on the properties of Zernike polynomials and/or sets of trigonometric functions, the types of aberrations can be classified into odd-order components and even-order components. For example, a Zernike term described by a sine function may be called an odd-order component. The Zernike terms described by the cosine function can be called even-order components. Aberrations caused by temperature changes (eg, heating or cooling) of optical elements in projection system PS may be referred to as thermal aberrations.

In one embodiment, at least one of the even-order components of the aberration is controlled by a deformable mirror in the projection system PS. Additionally or alternatively, at least one of the odd-order components of the aberration is controlled by a deformable mirror in the projection system PS. Additionally or alternatively, thermal aberrations are at least partially compensated by deformable mirrors in the projection system PS. Additionally or alternatively, by actuating the optical element during exposure, during scanning and/or during stepping (relative to the lens barrel, relative to the path of the radiation beam B, or relative to the optical axis of the projection system PS) The position and/or orientation to control at least one of the odd-order components of the aberration. By operating the lithographic apparatus in this manner, better imaging quality can be achieved.

The moving device 230 may be arranged to transfer the substrate W from the further substrate holder 702 to the substrate holder 202 . The mobile device 230 may include a robotic arm and/or a wafer handler. The moving device 230 may include a gripper that contacts the bottom side of the substrate W. The moving device 230 may include a Bernoulli chuck to hold the substrate W at its top surface. A thin film of gas between the top surface of the substrate W and the Bernoulli chuck prevents physical contact between the substrate W and the Bernoulli chuck. Bernoulli chucks are described in PCT Application Publication No. WO2013/100203A2, which is incorporated herein by reference. A portion of the moving device 230 may be implemented as a lift pin to lift the substrate W from the substrate holder 202 . The lift pins can lift the substrate W from the substrate holder 202 far enough to provide a space between the substrate W and the substrate holder 202 so that the moving device 230 can provide a gripper below the substrate W to The substrate W is lifted from the lift pins.

In one embodiment, the lithographic apparatus may include a liquid handling system configured to supply and confine immersion liquid to one of projection system PS and at least one of substrate holder 202 , substrate W, and sensor holder 206 limited space. A lithographic apparatus that includes a liquid handling system may be referred to as an immersion lithography apparatus, immersion exposure apparatus, or immersion scanner. When sensor holder 206 is located below projection system PS, as depicted in FIG. 10C , the liquid handling system may supply and confine immersion liquid to the space defined between projection system PS and sensor holder 206 . At various points during operation of the immersion exposure apparatus, such as during exposure, when the substrate holder 202 is positioned below the projection system PS, as depicted in Figures 9 and 10D, the liquid handling system may supply and confine the immersion liquid to The space defined between the projection system PS and the substrate W (and/or the space defined between the projection system PS and the substrate holder 202).

In one embodiment, the liquid handling system includes a supply port capable of supplying immersion liquid to that defined between projection system PS and substrate W (or defined between projection system PS and substrate holder 202, or ) space defined between the projection system PS and the sensor holder 206 . The liquid handling system also includes a recovery port capable of recovering liquid from the space. A porous member having a plurality of holes (ie, openings or holes) may be provided in the recovery port. The porous member may be, for example, a mesh plate in which a number of small holes are formed in the mesh. An example of such a liquid handling system is disclosed in PCT Application Publication No. WO2010/018825A1, the entire contents of which are incorporated herein by reference.

Additionally or alternatively, the liquid handling system includes an actuatable flow plate configured for independent position control relative to the projection system PS and/or relative to the substrate holder 202 . Typically, there may be a compromise between higher velocity/acceleration (of the stepping and/or scanning motion of the substrate holder 202) and the stability of the meniscus of the confined immersion liquid. In other words, the higher speed/acceleration of the stepping and/or scanning motion of the substrate holder 202 improves the throughput performance of the immersion exposure apparatus, but it also means that the liquid handling system and substrate W (and and/or the relative velocity/acceleration between the substrate holders 202) is high. Higher relative velocities/accelerations can make the meniscus more unstable; furthermore, an unstable meniscus can cause defect problems such as leakage of immersion liquid and retention in substrate holder 202, substrate W and/or sensor Droplets are produced on the surface of the device 206 . These defect issues can degrade the uptime performance of immersion exposure equipment. These defects are prevented by reducing the speed/acceleration of the step and/or scan motion of the substrate holder 202 (ie, by exposing the substrate W at lower scan speed, scan acceleration, and step acceleration). In the case of a problem, the throughput performance of the immersion exposure apparatus will be degraded. Therefore, this trade-off can also be identified as a trade-off between throughput performance and uptime performance, which degrades the overall productivity of the immersion exposure apparatus. To prevent these potential defect problems, the control unit may drive the substrate holder 202 and/or the actuatable flow plate (or control the position of the substrate holder 202 and/or the actuatable flow plate) to reduce The relative velocity and acceleration between the flow plate and the substrate W (and/or substrate holder 202) can be actuated. By controlling the substrate holder 202 and/or the actuatable flow plate in this manner (ie, by reducing the relative velocity/acceleration between the actuatable flow plate and the substrate W, without reducing scanning speed, scanning acceleration and/or stepping acceleration), leakage of the immersion liquid during exposure (during the stepping and/or scanning motion of the substrate holder 202) may be prevented, and/or the immersion may be ensured Liquid remains confined in the space defined between projection system PS and substrate W (and/or in the space defined between projection system PS and substrate holder 202). Therefore, better overall productivity can be achieved. An example of a liquid handling system that can be used in the context of this embodiment is disclosed in Japanese Patent Application Publication No. JP 2014-120693 A, the entire contents of which are incorporated herein by reference.

In one embodiment, substrate holder 202 and sensor holder 206 may be arranged to move in unison in order to transfer immersion liquid from substrate holder 202 (and/or substrate W) to sensor holder 206 (and vice versa). also). During the unison movement, the substrate holder 202 and the sensor holder 206 may be in contact with each other or be separated from each other by a sufficiently small gap to prevent leakage of the immersion liquid.

In one embodiment, the substrate holder 202 and the sensor holder 206 each have its own mover 204 . The substrate holder 202 has a moving part to move the substrate holder 202 relative to the projection system PS. The sensor holder 206 has another moving piece to move the sensor holder 206 relative to the projection system PS. The moving member and/or the further moving member may comprise planar motors to move in both the x-direction and the y-direction. The planar motor may be a moving magnet type planar motor having magnets and electrical coils. The magnets may be arranged on the substrate holder 202 and/or the sensor holder 206, while the electrical coils are fixed. Additionally or alternatively, the further moving member may comprise two stacked linear motors and may be arranged in an H-drive arrangement. In one embodiment, the substrate holder 202 and the other substrate holder 212 are each moved by a planar motor, while the sensor holder 206 is moved by two stacked linear motors, and may be arranged in an H-drive arrangement. In one embodiment, the substrate holder 202, the other substrate holder 212, and the sensor holder 206 are each moved by a linear motor in an H-drive arrangement.

Although specific reference is made herein to the use of a lithographic apparatus in IC manufacturing, it should be understood that the lithographic apparatus described herein may have other applications, such as integrated optical systems, guidance and detection patterns for magnetic domain memory, flat panel displays , Liquid crystal display (LCD), thin film magnetic head, etc. In the context of these alternative applications, any use of the terms "wafer" or "die" herein may be considered synonymous with the more general terms "substrate" or "target portion," respectively, even though those skilled in the art will appreciate it. righteous. Substrates referred to herein may be processed, eg, before or after exposure, in rails (tools that typically apply a resist layer to the substrate and develop the exposed resist), metrology tools, and/or inspection tools W. Where applicable, the disclosures herein can be applied to such and other substrate processing tools. Additionally, the substrate W may be processed more than once, eg, to create a multi-layer IC, so that the term substrate W as used herein may also refer to a substrate that already contains multiple processed layers.

Although specific reference has been made above to the use of embodiments of the invention in the context of optical lithography, it should be understood that the invention may be used in other applications, such as imprint lithography and electron beam lithography, and where the context allows Next, not limited to optical lithography. In imprint lithography, the topography in the patterning device MA defines the pattern created on the substrate. The topography of the patterning device can be pressed into a layer of resist provided to a substrate on which the resist is cured by applying electromagnetic radiation, heat, pressure, or a combination thereof. After the resist is cured, the patterning device MA is removed from the resist, leaving a pattern therein.

While specific embodiments of the present invention have been described above, it should be understood that the invention may be practiced otherwise than as described. For example, the present invention may take the form of a computer program containing one or more sequences of machine-readable instructions describing the methods as disclosed above, or a data storage medium (eg, semiconductor memory) having such computer program stored therein , disk or CD-ROM).

The above description is intended to be illustrative, not restrictive. Accordingly, it will be apparent to those skilled in the art that modifications of the invention described can be made without departing from the scope of the claims set forth below. Other aspects of the invention are set forth in the following numbered items:

1. An exposure apparatus, comprising;

a substrate holder for holding the substrate;

a sensor holder for holding the sensor; and

a moving member arranged to move the substrate holder,

wherein the moving member is arranged to couple with the sensor holder in a first situation for moving the sensor holder,

Wherein the moving member is arranged to be decoupled from the sensor holder in the second situation so as to move without moving the sensor holder.

2. The exposure apparatus according to item 1, comprising an exchange mechanism for applying the sensor holder to the moving member and for removing the sensor holder from the moving member.

3. The exposure apparatus according to item 1 or 2, wherein the moving member is arranged to move a further substrate holder for holding a further substrate, wherein the size of the further substrate is different from 3. the size of the substrate.

4. The exposure apparatus of item 3, wherein the sensor holder has a length and a width, wherein the length is substantially equal to the dimensions of the substrate holder, wherein the width is substantially equal to the further substrate The dimensions of the retainer, wherein the length and the width are different from each other.

5. The exposure apparatus of item 3 or 4, wherein the moving member is arranged to support the sensor holder in a first orientation and a second orientation,

wherein, in the first orientation, the sensor holder has a first angle along an axis perpendicular to the horizontal,

wherein, in the second orientation, the sensor holder has a second angle along an axis perpendicular to the horizontal,

wherein the first angle is different from the second angle.

6. Exposure apparatus according to one of the preceding items, wherein the substrate holder and the sensor holder are arranged to move in unison relative to the moving member in the first situation.

7. The exposure apparatus of item 6, comprising a nozzle for supplying a liquid to one of a top surface of the substrate holder and a top surface of the sensor holder, wherein the exposure The apparatus is arranged to remove the liquid from the top surface of the substrate holder and the sensor holder while the substrate holder and the sensor holder move in unison relative to the moving member. The one of the top surfaces is transferred to the other of the top surface of the substrate holder and the top surface of the sensor holder.

8. Exposure apparatus according to one of items 1 to 5, wherein the moving member is arranged to be decoupled from the substrate holder in the first situation so as to not move the substrate Move without the bottom retainer.

9. Exposure apparatus according to one of the preceding items, wherein the sensor holder is arranged to receive a radiation beam from the substrate holder.

10. The exposure apparatus of item 9, wherein the substrate holder includes a marker, wherein the radiation beam includes information about an image projected on the marker.

11. Exposure apparatus according to item 9 or 10, wherein the sensor holder is arranged to propagate the radiation beam to a detector, wherein the sensor holder is movable relative to the detector.

12. Exposure apparatus according to one of the preceding items, comprising an exposure apparatus and a measurement apparatus, wherein the exposure apparatus is arranged to expose the substrate with an exposure beam, wherein the measurement apparatus is arranged to provide measurement information of the substrate, wherein the exposure device and the measuring device are remote from each other, wherein the moving member is arranged to support the substrate holder while approaching the exposure device.

13. The exposure apparatus of item 12, comprising a stationary support arranged to support the substrate holder when in the vicinity of the measurement device.

14. The exposure apparatus of item 13, comprising a first encoder head and a first scale, wherein the stationary support includes a recess for holding the first encoder head, wherein the first scale arranged at the bottom surface of the substrate holder, wherein the first encoder head faces the first scale while the substrate holder is adjacent to the measurement device and arranged to provide a representation of the substrate Signal for the position information of the bottom holder.

15. The exposure apparatus of item 14, wherein the first encoder head is coupled to the stationary support via a dynamic isolator.

16. Exposure apparatus according to one of items 12-15, comprising moving means arranged to move the substrate holder while being supported by the stationary support.

17. Exposure apparatus according to one of items 12 to 16, comprising a frame for supporting an exposure device, wherein the exposure device is movable relative to the frame.

18. Exposure apparatus according to one of items 12 to 17, comprising a further measurement device arranged to provide further measurement information of the substrate, wherein the further measurement device is closer to the measurement device than the measurement device. the exposure device.

19. Exposure apparatus according to one of the preceding items, comprising a second encoder head, wherein the second encoder head is arranged to face the first scale so as to provide a representation of the substrate holder. A second signal of location information.

20. Exposure apparatus according to one of the preceding items, comprising a third encoder head and a third scale, wherein the third scale is arranged at the bottom side of the sensor holder, wherein the third encoder head is arranged such that A third scale is faced to provide a third signal representing position information of the sensor holder.

21. An exposure apparatus comprising;

a substrate holder for holding the substrate;

sensor holder for holding the sensor;

a moving member arranged to move the substrate holder; and

a projection system arranged to provide a beam of radiation onto the substrate,

wherein, during exposure, when the sensor holder is decoupled from the moving part, the projection system provides a beam of radiation onto the substrate,

Therein, the moving part is coupled to the sensor holder when the sensor measures properties of the projection system or the radiation beam.

22. The exposure apparatus according to item 21, comprising an exchange mechanism for providing and removing the sensor holder from the moving piece.

23. Exposure apparatus according to item 21 or 22, wherein the moving member is arranged to move a further substrate holder for holding a further substrate, wherein the size of the further substrate is different from 23. the size of the substrate.

24. The exposure apparatus of item 23, wherein the sensor holder has a length and a width, wherein the length is substantially equal to a dimension of the substrate holder, wherein the width is substantially equal to the further The dimensions of the substrate holder, wherein the length and the width are different from each other.

25. The exposure apparatus of item 23 or 24, wherein the moving member is arranged to support the sensor holder in a first orientation and a second orientation,

wherein, in the first orientation, the sensor holder has a first angle along an axis perpendicular to the horizontal,

wherein, in the second orientation, the sensor holder has a second angle along an axis perpendicular to the horizontal,

wherein the first angle is different from the second angle.

26. Exposure apparatus according to one of items 21 to 25, wherein the moving member is arranged to be decoupled from the substrate holder so as not to move the substrate holder move.

27. Exposure apparatus according to one of items 21 to 26, wherein the sensor holder is arranged to receive the radiation beam from the substrate holder.

28. The exposure apparatus of item 27, wherein the substrate holder includes a marker, wherein the radiation beam includes information about an image projected on the marker.

29. Exposure apparatus according to item 27 or 28, wherein the sensor holder is arranged to propagate the radiation beam to a detector, wherein the sensor holder is movable relative to the detector.

30. Exposure apparatus according to one of items 21 to 29, comprising an exposure device and a measurement device, wherein the exposure device is arranged to expose the substrate with an exposure beam, wherein the measurement device is arranged to provide the substrate of measurement information, wherein the exposure device and the measurement device are remote from each other, wherein the moving member is arranged to support the substrate holder while approaching the exposure device.

31. The exposure apparatus of item 30, comprising a stationary support arranged to support the substrate holder when in the vicinity of the measurement device.

32. The exposure apparatus of item 31, comprising a first encoder head and a first scale, wherein the stationary support includes a recess for holding the first encoder head, wherein the first scale arranged at the bottom surface of the substrate holder, wherein the first encoder head faces the first scale while the substrate holder is adjacent to the measurement device and arranged to provide a representation of the substrate Signal for the position information of the bottom holder.

33. The exposure apparatus of item 32, wherein the first encoder head is coupled to the stationary support via a dynamic isolator.

34. Exposure apparatus according to one of items 31-33, comprising moving means arranged to move the substrate holder while being supported by the stationary support.

35. Exposure apparatus according to one of items 31 to 34, comprising a frame for supporting the exposure apparatus, wherein the exposure apparatus is movable relative to the frame.

36. Exposure apparatus according to one of items 31 to 35, comprising a further measurement device arranged to provide further measurement information of the substrate, wherein the further measurement device is closer than the measurement device the exposure equipment.

37. Exposure apparatus according to one of items 31 to 36, comprising a second encoder head, wherein the second encoder head is arranged to face the first scale so as to provide a representation of the The second signal of the position information of the bottom holder.

38. Exposure apparatus according to one of items 31 to 37, comprising a third encoder head and a third scale, wherein the third scale is arranged at the bottom side of the sensor holder, wherein the The third encoder head is arranged to face the third scale so as to provide a third signal representing position information of the sensor holder.

39. An exposure apparatus comprising:

a first substrate holder for holding the first substrate;

a second substrate holder for holding the second substrate;

a projection system for exposing the first substrate with an exposure beam;

a measurement device arranged to provide measurement information of the second substrate;

also a measurement device arranged to provide measurement information of the first substrate,

wherein the further measurement device is closer to the projection system than the measurement device.

40. The exposure apparatus of item 39, wherein the further measurement information of the first substrate includes a height profile and/or in-plane deformation of the first substrate.

41. The exposure apparatus of items 39 to 40, wherein the measurement device is configured to provide information about the position of the substrate alignment marks on the second substrate.

42. Exposure apparatus according to one of items 39-41, comprising a sensor holder for holding the sensor, and

a moving member for moving the substrate holder relative to the projection system,

Wherein the sensors are arranged to measure properties of the exposure beam or projection system.

43. Exposure apparatus according to item 42, wherein the further measuring device is arranged to acquire the measurement information of the first substrate while the sensor is measuring the property of the exposure beam .

44. Exposure apparatus according to items 39-43, the lithographic apparatus being arranged to transfer the first substrate from the first substrate holder to the second substrate holder, wherein the measuring device is arranged to provide the first substrate bottom measurement information.

45. Exposure apparatus according to one of items 39 to 44, wherein the measuring device is arranged to acquire the second substrate holder when the second substrate holder is in the first position. measurement information, wherein the further measurement device is arranged to acquire measurement information of the second substrate when the second substrate holder is in the second position.

46. Exposure apparatus according to one of items 39 to 45, wherein the further measurement device is arranged to propagate a plurality of measurement beams simultaneously on the first substrate.

47. Exposure apparatus according to one of items 39 to 46, comprising a control unit arranged to drive the first substrate holding based on the measurement information of the first substrate and the measurement information of the second substrate and a second substrate holder.

48. Exposure apparatus according to one of items 39 to 47, wherein the first substrate is provided with a first alignment mark, wherein the further measuring device is arranged to be based on the second alignment The locations of the marks provide the measurement information for the first substrate.

49. Exposure apparatus according to one of items 39 to 48, wherein the second substrate is provided with a second alignment mark, wherein the measuring device is arranged to be based on the second alignment mark The position provides the measurement information for the second substrate.

Claims (15)

1. a kind of exposure sources, comprising:

First substrate holder is configured to keep substrate；

Second substrate holder is configured to keep the substrate；

Sensor holder is configured to keep sensor；

Optical projection system is configured to expose the substrate using exposing beam；

Measuring device is configured to provide the metrical information of the substrate；

An also measuring device is configured to provide an also metrical information for substrate,

Wherein the sensor is configured to measure the property of exposing beam and/or optical projection system,

Wherein the optical projection system is configured to expose the sensor using exposing beam.

2. exposure sources according to claim 1, wherein the exposure sources are arranged in the measuring device and obtain The substrate is maintained on first substrate holder while metrical information of the substrate, and wherein described Exposure sources are arranged in will be described while an also measuring device acquires an also metrical information for the substrate Substrate is maintained on second substrate holder.

3. exposure sources according to claim 1 or 2, wherein in the measuring device and an also measuring device At least one is configured to provide the information of the deformation about the substrate.

4. exposure sources according to any one of the preceding claims, wherein a measuring device ratio also measuring device is far from throwing Shadow system.

5. exposure sources according to any one of the preceding claims, wherein an also measuring device includes that leveling passes Sensor system, the leveling sensor system are configured to offer and the substrate into the radiation beam of inclined angle, and by It is configured to provide the information of the flatness about the substrate.

6. exposure sources according to any one of the preceding claims, wherein in measuring device and an also measuring device extremely Few one includes alignment sensor, and the alignment sensor is configured to measure the position of the substrate alignment mark on substrate.

7. exposure sources according to claim 6, wherein the measuring device is configured to based on the substrate to fiducial mark The measurement of note provides fine alignment information,

Wherein an also measuring device is configured to the measurement based on substrate alignment mark to provide coarse alignment information,

Wherein, the exposure sources include control unit, and described control unit is configured to based on the fine alignment information creating Essence distortion distribution map is slightly distorted distribution map based on the coarse alignment information creating, and by combining the essence distortion distribution map Combination distortion distribution map is created with the thick distortion distribution map.

8. exposure sources according to claim 7, including simulation model, the simulation model is configured to predict by exposing The pattern that beam is created on substrate, wherein control unit is configured to based on essence distortion distribution map and/or combination distortion distribution Simulation model is calibrated or updated to figure.

9. exposure sources according to claim 7 or 8, wherein described control unit is configured to based on the essence distortion Distribution map and/or the combination distortion distribution map control the optical property of the optical projection system.

10. exposure sources according to any one of the preceding claims, wherein the exposure sources include:

Support construction, the support construction is configured to holding pattern and forms device, wherein the patterning device is configured The exposing beam is assigned so that pattern to be imaged on the substrate at by pattern,

Wherein the support construction is configured to initiatively be bent the patterning device.

11. exposure sources according to any one of the preceding claims, wherein optical projection system includes:

Lens barrel；

Optical element；With

Lens holder is configured to keep optical element,

Wherein lens holder includes actuator, and the actuator is to control position of the optical element relative to lens barrel And/or orientation.

12. exposure sources according to any one of the preceding claims, including liquid processing system, the liquid handling system System is configured to supply and be restricted to be limited to the first substrate holder, the second substrate holder, substrate and biography immersion liquid Space of at least one of the sensor retainer between optical projection system.

13. exposure sources according to claim 12, wherein the liquid processing system includes recovery port, to from the sky Between recycle the immersion liquid, wherein porous member is set in the recovery port.

14. exposure sources according to any one of the preceding claims, wherein optical projection system includes deformable mirror.

15. exposure sources according to any one of the preceding claims, wherein the property of exposing beam is dosage, aberration and At least one of even property.