CN110266193B - Structure suitable for high-power boost LLC resonant converter - Google Patents
Structure suitable for high-power boost LLC resonant converter Download PDFInfo
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- CN110266193B CN110266193B CN201910577600.7A CN201910577600A CN110266193B CN 110266193 B CN110266193 B CN 110266193B CN 201910577600 A CN201910577600 A CN 201910577600A CN 110266193 B CN110266193 B CN 110266193B
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/22—Conversion of DC power input into DC power output with intermediate conversion into AC
- H02M3/24—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters
- H02M3/28—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC
- H02M3/325—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal
- H02M3/335—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/33569—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
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- Physics & Mathematics (AREA)
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- Thermal Sciences (AREA)
- Dc-Dc Converters (AREA)
Abstract
本发明公开了一种适用于大功率升压型LLC谐振变换器的结构，包括逆变侧、整流侧、变压器和散热器，逆变侧和整流侧与变压器相连，并共同设在散热器上方；在逆变侧顶部插有驱动板，驱动板上插有最小系统板；逆变侧上分别设有两个半桥模块、两个谐振电感和逆变侧PCB板，逆变侧PCB板上方分别设正、负母线铜片和一对谐振电容组；通过利兹线接两个谐振电感连接到变压器的逆变侧接线端上；整流侧包括四个二极管模块，四个二极管模块上方连接一块整流侧PCB板，整流侧PCB板上设有由五个电容并联的滤波电容组，四个二极管模块和滤波电容组通过整流侧PCB板与变压器相连。在保证散热和电磁兼容性的前提下，实现较高的功率密度。
The invention discloses a structure suitable for high-power step-up LLC resonant converter. ;A driver board is inserted on the top of the inverter side, and the minimum system board is inserted on the driver board; two half-bridge modules, two resonant inductors and an inverter side PCB board are respectively arranged on the inverter side, and the upper part of the inverter side PCB board The positive and negative busbar copper sheets and a pair of resonant capacitor banks are respectively set; two resonant inductors are connected to the inverter side terminals of the transformer through Litz wires; the rectifier side includes four diode modules, and a rectifier is connected above the four diode modules. The side PCB board, the rectifier side PCB board is provided with a filter capacitor group connected by five capacitors in parallel, and the four diode modules and the filter capacitor group are connected to the transformer through the rectifier side PCB board. On the premise of ensuring heat dissipation and electromagnetic compatibility, high power density is achieved.
Description
Technical Field
The invention belongs to the field of structural design of power electronic converters, and particularly relates to a structure suitable for a high-power boost LLC resonant converter.
Background
The rapid development of power electronics technology places higher demands on the power density and efficiency of the converter. The LLC resonant converter can realize zero-voltage switching-on of a primary side switching tube and zero-current switching-off of a secondary side rectifying tube, and the excellent soft switching characteristic can greatly reduce the switching loss and improve the efficiency; the high-frequency design of the switch can be realized, so that the power density is improved; meanwhile, the LLC resonant converter has the advantages of wide input voltage range and small switching stress, and the LLC resonant converter becomes a topology commonly used at present.
A high power boost LLC converter is a practical application class of LLC converters. In the structural design process of this type of converter, the following problems mainly exist: firstly, generally, high power means that the sizes of active devices (switching tubes and diodes) and passive devices (inductors, capacitors and transformers) of the converter are increased correspondingly, and the arrangement of the devices is difficult, so that the power density of the converter is influenced; secondly, the resonant current of the high-power boost LLC converter is large, and heat dissipation of heating elements in the converter, such as a switching device, a resonant inductor and a transformer, is more difficult; thirdly, the high-power main circuit containing the high-speed action switching tube is easy to cause electromagnetic interference to the control loop, influence the stability of control and simultaneously cause electromagnetic pollution to the outside.
Therefore, in order to realize a high-power boost LLC resonant converter with high power density, a reasonable structural design is needed in many aspects such as comprehensive device model selection, heat dissipation, electromagnetic compatibility, and the like.
Disclosure of Invention
In order to solve the above-mentioned defects in the prior art, an object of the present invention is to provide a high-power boost LLC resonant converter structure, which can achieve a higher power density on the premise of ensuring heat dissipation and electromagnetic compatibility.
The invention is realized by the following technical scheme.
A structure suitable for a high-power boost LLC resonant converter comprises an inversion side, a rectification side, a transformer and a radiator, wherein the inversion side and the rectification side are connected with the transformer and are arranged above the radiator; a driving plate is inserted into the top of the inversion side, and a minimum system plate is inserted into the driving plate;
the inverter side is provided with two half-bridge modules and two resonant inductors respectively, and further comprises an inverter side PCB on the two half-bridge modules and the two resonant inductors, wherein a positive bus copper sheet, a negative bus copper sheet and a pair of resonant capacitor groups, which are connected with the positive electrodes and the negative electrodes of the two half-bridge modules, are arranged above the inverter side PCB respectively; a pair of input filter capacitor sets is connected between the positive bus copper sheet and the negative bus copper sheet, and litz wires are arranged below the PCB on the inversion side; the two resonant inductors are connected to a first inversion side wiring terminal of the transformer through litz wires;
the rectifying side comprises four diode modules, a rectifying side PCB is connected above the four diode modules, a filter capacitor group formed by connecting five capacitors in parallel is arranged on the rectifying side PCB, and the four diode modules and the filter capacitor group are connected with a transformer through the rectifying side PCB.
With respect to the above technical solutions, the present invention has a further preferable solution:
further, two half-bridge modules are distributed on the left side of the inversion side in parallel, two resonance inductors are distributed on the right side of the inversion side in the front and back direction, and the two half-bridge modules and the two resonance inductors are fastened on the radiator through screws.
Furthermore, the positive pole of the first half-bridge module and the positive pole of the second half-bridge module on the two half-bridge modules are connected through a positive bus copper sheet, and the negative pole of the first half-bridge module and the negative pole of the second half-bridge module are connected through a negative bus copper sheet.
Furthermore, the first half-bridge module is connected with the resonance capacitor bank on the PCB at the inversion side through the middle point of the first half-bridge module and then connected to the second inversion side wiring end of the transformer.
Furthermore, the second half-bridge module is connected with a connecting terminal of a litz wire through the midpoint of the second half-bridge module, is connected with two series resonance inductors through the litz wire and is then connected to a first inversion side connecting terminal of the transformer.
Furthermore, the litz wire is attached to the PCB on the inversion side.
Further, the driving board is arranged right above the half-bridge module and connected to the half-bridge module through a contact pin.
Further, the minimum system board is connected to the driving board through pins and is staggered with a space formed vertically upward by the half-bridge module.
Due to the adoption of the technical scheme, the invention has the following beneficial effects:
1) the invention adopts a reasonable device model selection method and a compact layout mode to integrate the high-power boost LLC resonant converter in a cuboid structure, thereby realizing high power density and being beneficial to modular combination;
2) the primary half-bridge module, the secondary rectifier diode module, the transformer and the inductor in the converter are tightly attached to a radiator, so that the radiating requirement of the converter under the heavy-current working condition is met;
3) by reducing the areas of the driving loop and the main power loop to the maximum extent, staggering the vertical space of the DSP minimum system board and the half-bridge module and the like, the electromagnetic interference of the main power loop of the circuit to the control loop is reduced, the parasitic parameters in the loop are reduced, the good operation of the control loop is ensured, and the electromagnetic sensitivity of the two loops is reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention:
fig. 1 is a high power boost LLC resonant converter topology in accordance with the present invention;
FIG. 2 is a top plan view of the overall structure of the present invention;
FIG. 3(a) is a front view of the inversion side;
FIG. 3(b) is a cross-sectional view A-A of the inversion side;
FIG. 4(a) is a front view of the rectifying side;
fig. 4(b) is a plan view of the rectifying side.
In the figure: 101. an inverter side, 102, a rectifier side, 103, a transformer, 104, a heat sink, 105, a drive board, 106, a minimum system board, 1, a first half-bridge module, 2, a second half-bridge module, 3, a gasket, 4, a negative bus copper sheet, 5, a screw, 6, a pin, 7, a first resonant capacitor bank, 8, a second resonant capacitor bank, 9, a first resonant inductor, 10, a second resonant inductor, 11, an inverter side PCB board, 12, a first inverter side terminal, 13, a second inverter side terminal, 14, a positive bus copper sheet, 15, a first input filter capacitor bank, 16, a second input filter capacitor bank, 17, a positive electrode of the first half-bridge module, 18, a negative electrode of the first half-bridge module, 19, a midpoint of the first half-bridge module, 20, a positive electrode of the second half-bridge module, 21, a negative electrode of the second half-bridge module, 22, a midpoint of the second half-bridge module, 23. litz wire, 24 litz wire connection terminals, 25, first diode module, 26, second diode module, 27, third diode module, 28, fourth diode module, 29, filter capacitor bank, 30, rectifying side PCB board, 31, first rectifying side connection terminals, 32, second rectifying side connection terminals, 33, first output connection terminals, 34, second output connection terminals.
Detailed Description
The present invention will now be described in detail with reference to the drawings and specific embodiments, wherein the exemplary embodiments and descriptions of the present invention are provided to explain the present invention without limiting the invention thereto.
Fig. 1 is a high power boost LLC resonant converter topology to which the present invention relates. And the inversion side and the rectification side of the LLC resonant converter are connected through a transformer. The inverter side is provided with an input filter capacitor CiSwitching tubes S1-S4 and resonant inductor LrResonant capacitor CrThe rectification side comprises rectifier diodes D1-D4 and an output filter capacitor CoAnd (4) forming. The switching tubes S1-S4 actually adopt two half- bridge modules 1 and 2, and the rectifier diodes D1-D4 actually adopt four diode modules 25-28.
Fig. 2 shows a top view of the whole structure of the present invention, in which three main parts of the LLC resonant converter can be seen: an inverter side 101, a rectifier side 102 and a transformer 103. Considering the application of high power, the inversion side 101 and the rectification side 102 are designed into two separate parts which are arranged in parallel in the width direction, a transformer 103 is arranged on one side of the inversion side 101 and one side of the rectification side 102, the inversion side 101 and the rectification side 102 are connected with the transformer 103, and the sum of the widths of the inversion side 101 and the rectification side 102 corresponds to the length of the transformer 103. The overall layout of the inverter side 101, the rectifier side 102 and the transformer 103 is rectangular in plan view, and the heights of the three are the same. The inverter side 101 and the rectifier side 102 are connected to the transformer 103 and integrally disposed above the heat sink 104, as shown in fig. 3(a), and the length and width are determined according to the overall length and width of the inverter side 101, the rectifier side 102, and the transformer 103. The whole resonant converter is a cuboid module. A drive board 105 is inserted on the top of the inverter side 101, and a minimum system board 106 is provided on the top of the inverter side 101 and the rectifier side 102. A minimal system board 106 is inserted on the drive board 105.
As shown in fig. 3(a) and 3(b), a front view and a sectional view a-a of the inverter side 101 are shown. Two half-bridge modules, first, second half- bridge module 1, 2 distribute in contravariant side 101 left side by side promptly, two resonance inductances, first, second resonance inductance 9, 10 distribute in contravariant side 101 right side around promptly, first, second half- bridge module 1, 2 and first, second resonance inductance 9, 10 pass through the screw fastening on radiator 104, guarantee its heat dissipation. The top parts of the first half-bridge module 1 and the second half-bridge module 2 and the first resonant inductor 9 and the second resonant inductor 10 are provided with an inversion side PCB board 11, a negative bus copper sheet 4 and a positive bus copper sheet 14 are respectively arranged above the inversion side PCB board 11, and the negative bus copper sheet 4 and the positive bus copper sheet 14 are connected with the positive electrode and the negative electrode of the first half-bridge module 1 and the second half-bridge module 2. A pair of resonance capacitor groups, namely a first resonance capacitor group 7 and a second resonance capacitor group 8, are arranged above the inversion side PCB 11, and the first resonance capacitor group 7 and the second resonance capacitor group 8 are symmetrically distributed along the middle part of the inversion side PCB 11; litz wires 23 are provided under the inverter-side PCB 11.
As shown in fig. 3(b), the positive electrode 17 of the first half-bridge module and the positive electrode 20 of the second half-bridge module on the two half- bridge modules 1 and 2 are connected through the positive bus copper sheet 14, the negative electrode 18 of the first half-bridge module and the negative electrode 21 of the second half-bridge module are connected through the negative bus copper sheet 4, and the first input filter capacitor bank 15 and the second input filter capacitor bank 16 are welded between the positive bus copper sheet 14 and the negative bus copper sheet 4 for reducing the switching high-frequency oscillation of the half-bridge modules. The positive electrode 17 of the first half-bridge module and the negative electrode 18 of the first half-bridge module are padded with gaskets for being staggered with the PCB 11 on the inversion side in the vertical direction, the negative bus copper sheet 4 and the positive bus copper sheet 14 are connected with the first half-bridge module 1 and the second half-bridge module 2 through screws 5, and the driving plate 105 is connected with the first half-bridge module 1 and the second half-bridge module 2 through a contact pin 6.
The first half-bridge module 1 is connected to the first and second resonant capacitor banks 7 and 8 on the inverter-side PCB 11 through the midpoint 19 of the first half-bridge module, and then connected to the second inverter-side terminal 13 of the transformer 103. The second half-bridge module 2 is connected with a litz wire connecting terminal 24 through a midpoint 22 of the second half-bridge module, connected with two first and second resonance inductors 9 and 10 connected in series through a litz wire 23, and then connected to an inverting side terminal 12 of the first transformer. The litz wire 23 is attached to the inverter side PCB 11 to reduce the power loop area and improve the electromagnetic compatibility.
The spacer 3 is used for vertically shifting the copper sheets 14 and 4 of the positive and negative bus bars and the reverse side PCB 11. The driving board 105 is disposed right above the first and second half- bridge modules 1 and 2, and connected to the first and second half- bridge modules 1 and 2 through the pin 6 to provide driving signals thereto, so as to reduce the area of the driving circuit, reduce parasitic parameters of the driving circuit, avoid gate oscillation, and reduce electromagnetic sensitivity.
The minimum system board 106 is connected to the driver board via pin 6, and is offset from the space formed vertically above the first and second half- bridge modules 1 and 2 to reduce electromagnetic interference of the main power loop with the minimum system board 106.
As shown in fig. 4(a) and 4(b), the rectification side 102 is a front view and a plan view. The four diode modules, i.e., the first, second, third, and fourth diode modules 25, 26, 27, and 28 are screwed to the heat sink 104 and screwed to the rectification side PCB board 30. The filter capacitor bank 29 with five capacitors connected in parallel is arranged on the left side of the four diode modules, the height of the filter capacitor bank needs to be noted in the capacitor model selection stage, and the position of a minimum system board 106 is reserved in the layout process. The first and second rectifying- side connection terminals 31 and 32 are connected to the rectifying-side PCB board 30 by screws. The ac power output from the transformer 103 to the first and second rectifying- side terminals 31 and 32 is rectified by the four diode modules 25, 26, 27 and 28, filtered by the output filter capacitor bank 29, converted into dc power, and finally connected to the load through the first and second output terminals 33 and 34.
The invention divides the whole structure into four parts: the structure is different from that of most LLC converters, wherein the inversion side, the rectification side and the transformer are designed on the same PCB. In the invention, the inverter side and the rectifier side are designed into two discrete parts which are arranged in parallel in the width direction in consideration of the application occasion of high power. The sum of the widths of the inversion side and the rectification side is close to the length of the transformer, the top view of the overall layout is rectangular, and the heights of the inversion side and the rectification side are close to each other. The radiator is placed at the bottom, and the length and the width are determined according to the integral layout of the first three. The whole resonant converter is a cuboid module.
Furthermore, the inversion side is composed of two half-bridge modules and a driving board thereof, a DSP minimum system board, an input filter capacitor, a resonance inductor and a resonance capacitor. The half-bridge module and the resonant inductor need to be tightly attached to a radiator for heat dissipation, and therefore are arranged below the PCB on the inversion side. The positive end and the negative end of two half-bridge modules are connected through the copper sheet, and the input filter capacitor welds between two copper sheets for reduce the switch high frequency oscillation of half-bridge module. The driving board of the half-bridge module is connected with the two half-bridge modules through pins and arranged right above the half-bridge modules, so that the area of a driving loop is reduced, parasitic parameters of the driving loop are reduced, grid oscillation is avoided, and electromagnetic sensitivity is reduced. The DSP minimum system board is externally connected above the driving board through a contact pin, but is staggered with a space formed vertically upwards by the half-bridge module, and electromagnetic interference of the main power loop on the DSP minimum system board is reduced. The high-power boost LLC resonant converter has large resonant current, so that the capacitor size meeting the current requirement is large, and the capacitor cannot be well integrated in a circuit, therefore, small capacitors with proper height are selected to be connected in parallel, the total volume of the capacitors is reduced, and the capacitors are arranged above a PCB. The height of the resonant inductor magnetic core is selected to be not higher than the distance between the PCB and the radiator, and under the principle, if the maximum inductance value cannot reach the designed resonant inductance value, the mode of connecting a plurality of inductors in series is changed. The resonant inductor is connected with a litz wire and is tightly attached to the PCB, so that the area of the main power loop is minimum.
Furthermore, the rectifying side is composed of four diode modules and an output filter capacitor. The diode module needs to be tightly attached to the radiator for heat dissipation and arranged below the PCB. The output filter capacitor consists of highly suitable capacitors connected in parallel, and care is taken to leave the minimum system board position.
By adopting the structural arrangement mode, the invention can realize higher power density on the premise of ensuring heat dissipation and electromagnetic compatibility.
The present invention is not limited to the above-mentioned embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some substitutions and modifications to some technical features without creative efforts according to the disclosed technical contents, and these substitutions and modifications are all within the protection scope of the present invention.
Claims (8)
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| CN201910577600.7A CN110266193B (en) | 2019-06-28 | 2019-06-28 | Structure suitable for high-power boost LLC resonant converter |
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| CN201910577600.7A CN110266193B (en) | 2019-06-28 | 2019-06-28 | Structure suitable for high-power boost LLC resonant converter |
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| CN110266193B true CN110266193B (en) | 2020-05-22 |
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| US11140767B2 (en) | 2020-03-05 | 2021-10-05 | Hamilton Sundstrand Corporation | Conductive thermal management architecture for electronic modules in a two-card assembly |
| US11259445B2 (en) | 2020-03-05 | 2022-02-22 | Hamilton Sundstrand Corporation | Cooling mechanism for electrionic component mounted on a printed wiring board |
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| CN102611177B (en) * | 2012-03-20 | 2014-09-03 | 江苏凯灵汽车电器有限公司 | Electric automobile charger |
| CN206364688U (en) * | 2016-12-23 | 2017-07-28 | 芜湖国睿兆伏电子有限公司 | A kind of high-power high-frequency charge power supply |
| CN207053408U (en) * | 2017-08-29 | 2018-02-27 | 四川英杰电气股份有限公司 | One kind programming dc source |
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