CN110265535B - LED bracket packaging structure and packaging process - Google Patents

Abstract

The present invention discloses an LED bracket packaging structure and a packaging process, and relates to the field of LED packaging. The LED bracket packaging structure includes an LED bracket and a light-emitting chip. The present invention sets the first side of the LED bracket as the positive terminal of the LED bracket, sets the third side of the LED bracket as the negative terminal of the LED bracket, and sets the third light-emitting chip at a position close to the third side and connected to the negative terminal. Compared with the prior art, the distance between the third light-emitting chip and the negative terminal of the LED bracket is shortened, thereby shortening the length of the welding wire, solving the problem in the prior art that the conductive metal wire is too long, causing the conductive metal wire to shake greatly under the change of thermal expansion and contraction of the translucent colloid, thereby causing the conductive metal wire to break, which not only saves costs, but also increases the stability of the conductive metal wire, and improves the quality of LED products.

Description

LED bracket packaging structure and packaging process

Technical Field

The invention relates to the field of LED packaging, and in particular to an LED bracket packaging structure and a packaging process.

Background technique

The existing LED bracket packaging is to complete the circuit connection by using a die-bonding wire on the circuit board in the bracket bowl. As shown in Figure 1, the manufacturing method is as follows: (1) first fix the chip 2 on the electrode of the circuit board in the LED bracket 1; (2) connect the chip electrode (called the first welding point) to the LED bracket 1 (called the second welding point) through the conductive metal wire 3 welding wire, and connect the chip electrode to the LED bracket 1 pin to form a power circuit; (3) seal the light-transmitting colloid 4 on the LED bracket 1 to form a light source.

1 , the existing method of bonding crystals is to place wafer 21, wafer 22 and wafer 23 in a straight line for fixing. When welding the conductive metal wire 3, the middle wafer 22 is far away from the LED bracket 1, resulting in the conductive metal wire 3 being too long. The translucent colloid 4 expands and contracts due to the change of the ambient temperature, and the conductive metal wire 3 shakes greatly. The conductive metal wire 3 may break, causing the LED to not light up, and other undesirable phenomena, resulting in poor product reliability.

Summary of the invention

The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, one object of the present invention is to provide an LED bracket packaging structure and packaging process, which is conducive to shortening the welding wire, increasing the stability of the welding wire and reducing the cost.

The technical solution adopted by the present invention is:

In a first aspect, the present invention provides an LED bracket packaging structure, comprising:

An LED bracket, the LED bracket comprising a first side surface, a second side surface, a third side surface and a fourth side surface, the first side surface is set as the positive terminal of the LED bracket, and the third side surface is set as the negative terminal of the LED bracket;

The light emitting chip comprises a first light emitting chip, a second light emitting chip and a third light emitting chip. The third light emitting chip is arranged at a position close to the third side surface and connected to the negative terminal.

Furthermore, the first light-emitting chip is arranged at a position close to the second side surface and connected to the LED bracket, the second light-emitting chip is arranged at a position close to the fourth side surface and connected to the LED bracket, and the connection points between the first light-emitting chip, the second light-emitting chip and the LED bracket are all bracket electrodes of the LED bracket.

Furthermore, the third light-emitting chip is connected to the negative terminal via a conductive metal wire, and the length of the conductive metal wire is less than 1.4 mm.

Furthermore, the length of the conductive metal wire is between 0.6 and 1.0 mm.

Furthermore, the LED bracket packaging structure also includes a light-transmitting packaging colloid, which is used to encapsulate the LED bracket and the light-emitting chip.

In a second aspect, the present invention provides an LED bracket packaging process, wherein the LED bracket comprises a first side surface, a second side surface, a third side surface and a fourth side surface, wherein the first side surface is set as the positive terminal of the LED bracket, and the third side surface is set as the negative terminal of the LED bracket, and the LED bracket packaging process comprises the following steps:

Bonding: the light-emitting chip includes a first light-emitting chip, a second light-emitting chip and a third light-emitting chip, and the third light-emitting chip is fixed at a position close to the third side surface;

Bonding wire: connecting the third light emitting chip to the negative terminal.

Furthermore, the die bonding step further includes: disposing the first light emitting chip at a position close to the second side surface, and disposing the second light emitting chip at a position close to the fourth side surface;

The wire bonding step further includes: connecting the first light emitting chip to the LED bracket, and connecting the second light emitting chip to the LED bracket;

The connection points between the first light-emitting chip, the second light-emitting chip and the LED bracket are all bracket electrodes of the LED bracket.

Furthermore, the third light-emitting chip is connected to the negative terminal via a conductive metal wire, and the length of the conductive metal wire is less than 1.4 mm.

Furthermore, the length of the conductive metal wire is between 0.6 and 1.0 mm.

Furthermore, the LED bracket packaging process also includes:

Packaging: The LED bracket and the light-emitting chip are packaged using a light-transmitting packaging colloid.

The beneficial effects of the present invention are:

The present invention sets the first side surface of the LED bracket as the positive terminal of the LED bracket, sets the third side surface of the LED bracket as the negative terminal of the LED bracket, and sets the third light-emitting chip at a position close to the third side surface and connected to the negative terminal. Compared with the prior art, the distance between the third light-emitting chip and the negative terminal of the LED bracket is shortened, thereby shortening the length of the welding wire, solving the problem in the prior art that the conductive metal wire is too long, causing the conductive metal wire to shake greatly under the change of thermal expansion and contraction of the light-transmitting colloid, thereby causing the conductive metal wire to break, not only saving costs, but also increasing the stability of the conductive metal wire and improving the quality of LED products.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of a process flow of an LED bracket packaging process in the prior art;

FIG2 is a schematic structural diagram of an embodiment of an LED bracket packaging structure of the present invention;

FIG. 3 is a schematic flow chart of an embodiment of an LED bracket packaging process of the present invention.

Detailed ways

It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

Embodiment 1

This embodiment provides an LED bracket packaging structure, as shown in FIG2 , the packaging structure includes:

LED bracket 6, LED bracket 6 includes a first side surface 61, a second side surface 62, a third side surface 63 and a fourth side surface 64. The first side surface 61 is set as the positive terminal of the LED bracket 6, and the third side surface 63 is set as the negative terminal of the LED bracket 6;

The light emitting chip 7 includes a first light emitting chip 71 , a second light emitting chip 72 and a third light emitting chip 73 . The third light emitting chip 73 is arranged near the third side surface 63 and connected to the negative terminal of the LED bracket 6 .

Furthermore, the first light emitting chip 71 is arranged near the second side surface 62 and connected to the LED bracket, and the second light emitting chip 72 is arranged near the fourth side surface 64 and connected to the LED bracket. The connection points between the first light emitting chip 71, the second light emitting chip 72 and the LED bracket 6 are all bracket electrodes of the LED bracket 6.

In this embodiment, the third light-emitting chip 73 is connected to the negative terminal of the LED bracket 6 through a conductive metal wire 8, and the length of the conductive metal wire 8 is less than 1.4 mm. Preferably, the length of the conductive metal wire 8 is between 0.6 and 1.0 mm. In the existing LED bracket packaging structure, the length of the welding wire between the third light-emitting chip 73 and the negative terminal of the LED bracket 6 is generally between 1.4 and 1.9 mm. If the welding wire is too long, it is easy to be pulled off due to the deformation of the packaging colloid, which affects the reliability of the LED product. In this embodiment, the fixed position of the third light-emitting chip 73 is changed, thereby shortening the welding wire to less than 1.4 mm, thereby reducing costs and increasing the reliability of the LED product. Preferably, it is between 0.6 and 1.0 mm. The conductive metal wire 8 between 0.6 and 1.0 mm can not only ensure that the welding wire becomes shorter to reduce costs, but also ensure that the third light-emitting chip 73 and the LED bracket 6 will not contact, thereby avoiding damage to the chip electrode.

In this embodiment, the LED bracket packaging structure also includes a translucent packaging colloid (not shown in the figure) for packaging the LED bracket 6 and the light-emitting chip 7. Since the packaging structure is used to package light-emitting diodes, and the light-emitting chip 7 is an RGB light-emitting chip, the translucent packaging colloid should be a colloid with good light transmittance, such as resin glue or silicone, to ensure light transmittance.

Embodiment 2

This embodiment provides an LED bracket packaging process, the LED bracket includes a first side 61, a second side 62, a third side 63 and a fourth side 64. The first side 61 is set as the positive terminal of the LED bracket 6, and the third side 63 is set as the negative terminal of the LED bracket 6. As shown in FIG. 3, the LED bracket packaging process includes the following steps:

S1. Solid crystal: the light emitting chip 7 includes a first light emitting chip 71, a second light emitting chip 72 and a third light emitting chip 73, the third light emitting chip 73 is fixed at a position close to the third side 63, the first light emitting chip 71 is fixed at a position close to the second side 62, and the second light emitting chip 72 is fixed at a position close to the fourth side 64;

S2. Wire bonding: connect the third light emitting chip 73 to the negative terminal of the LED bracket 6 , connect the first light emitting chip 71 to the LED bracket 6 , and connect the second light emitting chip 72 to the LED bracket 6 .

The connection points between the first light-emitting chip 71 , the second light-emitting chip 72 , the third light-emitting chip 73 and the LED bracket 6 are all bracket electrodes of the LED bracket 6 .

In conjunction with FIG. 2 to FIG. 3 , specifically,

S1. Crystal bonding step: determine the crystal bonding position in the LED bracket 6, and the crystal bonding position must be close to the side of the LED bracket 6, so that the chip electrode of the light-emitting chip 7 can be welded to the LED bracket 6 with a shorter welding wire; drip colloid at the crystal bonding position; use tweezers to clamp or use a suction nozzle to suck the light-emitting chips 71~73 respectively and place them at the crystal bonding position; heat and bake to solidify the colloid, so as to fix the light-emitting chips 71~73 in the LED bracket 6. Specifically, with reference to Figures 2 and 3, the third light-emitting chip 73 is fixed at a position close to the third side 63, the first light-emitting chip 71 is fixed at a position close to the second side 62, and the second light-emitting chip 72 is fixed at a position close to the fourth side 64. It is worth explaining here that the light-emitting chip 7 is divided into a single-electrode chip and a double-electrode chip. The single-electrode chip needs to be bonded with conductive glue, and the double-electrode chip needs to be bonded with insulating glue.

S2. Wire bonding step: respectively set welding points on the chip electrodes of the light-emitting chips 71-73, set welding points on the bracket electrodes of the LED bracket 6, and use the LED wire bonding machine to weld the chip electrodes of the light-emitting chips 71-73 and the bracket electrodes of the LED bracket 6 through the conductive metal wire 8 to form a conductive loop. Specifically, referring to Figures 2 and 3, the third light-emitting chip 73 is welded to the bracket electrode on the third side 63 (i.e., the negative terminal) of the LED bracket 6 through the conductive metal wire 8, the first light-emitting chip 71 is welded to the bracket electrode on the second side 62 of the LED bracket 6 through the conductive metal wire, and the second light-emitting chip 72 is welded to the bracket electrode on the fourth side 64 of the LED bracket 6 through the conductive metal wire.

In this embodiment, the length of the conductive metal wire 8 between the third light-emitting chip 73 and the negative terminal of the LED bracket 6 is less than 1.4 mm, preferably, between 0.6 and 1.0 mm. In the existing LED bracket packaging structure, the length of the welding wire between the third light-emitting chip 73 and the negative terminal of the LED bracket 6 is generally between 1.4 and 1.9 mm. If the welding wire is too long, it is easy to be pulled off due to the deformation of the packaging colloid, affecting the reliability of the LED product. In this embodiment, the fixed position of the third light-emitting chip 73 is changed, thereby shortening the welding wire to less than 1.4 mm, thereby reducing costs and increasing the reliability of the LED product. Preferably, it is between 0.6 and 1.0 mm. The conductive metal wire 8 between 0.6 and 1.0 mm can not only ensure that the welding wire becomes shorter to reduce costs, but also ensure that the third light-emitting chip 73 and the LED bracket 6 will not contact, thereby avoiding damage to the chip electrode.

As an improvement of the technical solution, the LED bracket packaging process also includes:

S3. Packaging step: using a light-transmitting packaging colloid 9 to package the LED bracket 6 and the light-emitting chip 7 to form a light source.

In this embodiment, since the packaging process is used to package light-emitting diodes, the light-emitting chip 7 is an RGB light-emitting chip, so the light-transmitting packaging colloid 9 should use a colloid with good light transmittance, such as resin glue or silicone glue, to ensure light transmittance.

In the existing LED bracket packaging process, the crystal fixing method is to place the chip in a straight line and fix it in the LED bracket. When welding the conductive metal wire, the middle chip is far away from the LED bracket, resulting in a too long length of the conductive metal wire. The present invention fixes the chip at the side close to the LED bracket and uses the conductive metal wire to connect the chip electrode with the bracket electrode of the LED bracket. Compared with the prior art, the length of the conductive metal wire between the middle chip and the LED bracket is shortened, and the problem of the conductive metal wire being too long in the prior art causing the transparent colloid to shake greatly under the changes of thermal expansion and contraction, thereby causing the conductive metal wire to break. This not only saves costs, but also increases the stability of the conductive metal wire and improves the quality of LED products.

The above is a specific description of the preferred implementation of the present invention, but the invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims (8)

1. An LED bracket packaging structure, characterized by comprising: An LED bracket, the LED bracket comprising a first side surface, a second side surface, a third side surface and a fourth side surface, the first side surface is set as the positive terminal of the LED bracket, and the third side surface is set as the negative terminal of the LED bracket; A light-emitting chip, wherein the light-emitting chip comprises a first light-emitting chip, a second light-emitting chip and a third light-emitting chip, wherein the third light-emitting chip is arranged at a position close to the third side surface and connected to the negative terminal; the third light-emitting chip is connected to the negative terminal through a conductive metal wire, and the length of the conductive metal wire is less than 1.4 mm; Among them, the first light-emitting chip is arranged at a position close to the second side surface and connected to the LED bracket, the second light-emitting chip is arranged at a position close to the fourth side surface and connected to the LED bracket, and the connection points between the first light-emitting chip, the second light-emitting chip and the LED bracket are all bracket electrodes of the LED bracket. 2. An LED bracket packaging structure according to claim 1, characterized in that the length of the conductive metal wire is between 0.6 and 1.0 mm. 3. An LED bracket packaging structure according to any one of claims 1 to 2, characterized in that the LED bracket packaging structure also includes a translucent packaging colloid for packaging the LED bracket and the light-emitting chip. 4. An LED bracket packaging process, characterized in that, according to an LED bracket packaging structure according to any one of claims 1 to 3, the LED bracket comprises a first side surface, a second side surface, a third side surface and a fourth side surface, the first side surface is set as the positive terminal of the LED bracket, the third side surface is set as the negative terminal of the LED bracket, and the LED bracket packaging process comprises the following steps: Bonding: the light-emitting chip includes a first light-emitting chip, a second light-emitting chip and a third light-emitting chip, and the third light-emitting chip is fixed at a position close to the third side surface; Bonding wire: connecting the third light emitting chip to the negative terminal. 5. The LED bracket packaging process according to claim 4, characterized in that: The die bonding step further includes: disposing the first light emitting chip at a position close to the second side surface, and disposing the second light emitting chip at a position close to the fourth side surface; The wire bonding step further includes: connecting the first light emitting chip to the LED bracket, and connecting the second light emitting chip to the LED bracket; The connection points between the first light-emitting chip, the second light-emitting chip and the LED bracket are all bracket electrodes of the LED bracket. 6. An LED bracket packaging process according to claim 4, characterized in that the third light-emitting chip is connected to the negative terminal through a conductive metal wire, and the length of the conductive metal wire is less than 1.4 mm. 7. The LED bracket packaging process according to claim 6, characterized in that the length of the conductive metal wire is between 0.6 and 1.0 mm. 8. The LED bracket packaging process according to any one of claims 4 to 7, characterized in that the LED bracket packaging process further comprises: Packaging: The LED bracket and the light-emitting chip are packaged using a light-transmitting packaging colloid.