CN110265387A - A kind of LED encapsulation structure, backlight module and display equipment - Google Patents

Abstract

The invention discloses a kind of LED encapsulation structure, backlight module and display equipment, are related to showing equipment technical field.The LED encapsulation structure includes bracket, chipset and reflecting layer, and encapsulation slot is provided on the bracket；The chipset is set in the encapsulation slot, and the chipset includes the first chip positioned at the encapsulation groove center, and first chip is provided with the second chip and third chip；The reflecting layer is set to the top of first chip.In the LED encapsulation structure, there are three types of chips for setting, wherein the first chip can be sending blue light, wherein the second chip and third chip can issue feux rouges and green light respectively, second chip and third chip distribution are in the periphery of the first chip, the blue light that first chip issues is spread around under the action of reflecting layer, and is mixed to form white light with feux rouges and green light, is conducive to the uniformity for improving three coloured light mixing, colour cast problem is avoided, display effect is improved.

Description

LED package structure, backlight module and display device

technical field

The invention relates to the technical field of display devices, in particular to an LED packaging structure, a backlight module and a display device.

Background technique

At present, in the field of flat panel display, LCD TVs have become the mainstream, and the proportion of LCD TVs including LED backlight sources is increasing. LED backlight has many advantages, such as no toxic substance mercury, green environmental protection, excellent color gamut display, good mechanical vibration stability, etc. With the improvement of living standards, people pay more and more attention to the performance of TV color, and color regression becomes the main task of display. Therefore, wide color gamut TV has entered people's sight.

At present, liquid crystal display technologies that can achieve 100% NTSC color gamut coverage include quantum dot solutions, RGB three-color chip LED solutions, and KSF phosphors with color film thickened panels. Quantum dot technology is subject to the stability of materials and The yield rate leads to high cost and poor product reliability; KSF phosphor technology can only be matched with individual color film panel products to achieve 100% NTSC display effect, which has great limitations. In the early years, due to the low production yield and low luminous efficiency of red and green chips, RGB three-color chip technology has not been widely used in backlight modules. Declining, the technology of RGB three-color chip LED is reapplied in the backlight module.

As shown in Figures 1 and 2, a packaging groove 11' is provided on the bracket 1', and a three-color chip 2' is arranged in the packaging groove 11', and the three chips 2' are all welded to the electrode connection area 3' so as to be connected to the bracket 1. 'The internal circuit is turned on. In order to meet the brightness requirements of white light and light emission from LEDs, the sizes of the packaged RGB three-chips are different. Since the diameter of the cup opening of the packaging bracket 1' is 2.6mm, and the diameter of the bottom is 2.1mm, the three chips 2' must meet a certain size ratio when they are in the packaging groove 11', and at the same time, it is necessary to ensure that the size is as large as possible, so as to meet the requirements of the LED chip. brightness requirements. However, the RGB three-color chip LED currently used in the backlight module will have the phenomenon that one side is reddish and the other is blue, especially after adding the secondary lens, the light spot will still appear one side is reddish and the other is blue, which is serious. It affects the display effect of the backlight module.

Contents of the invention

An object of the present invention is to provide an LED packaging structure that can emit uniform white light to eliminate the problem of color cast.

For reaching this purpose, the present invention adopts following technical scheme:

An LED packaging structure, comprising:

A bracket, the bracket is provided with a packaging groove;

a chipset, the chipset is arranged in the packaging groove, the chipset includes a first chip located in the center of the packaging groove, a second chip and a third chip arranged around the first chip; and

A reflective layer, the reflective layer is disposed above the first chip.

Wherein, at least two of the third chips and the second chips are provided, and the third chips and the second chips are arranged alternately.

Wherein, three conductive pathways are provided in the bracket, and the first chip, the second chip and the third chip are respectively connected to the corresponding conductive pathways.

Wherein, the LED packaging structure also includes:

a lens, the lens is buckled on the bracket; and

a diffusion layer, the diffusion layer is located between the lens and the bracket.

Wherein, the bottom of the lens is provided with a groove, and the diffusion layer is located in the groove.

Wherein, the central axis of the diffusion layer, the central axis of the light-incident surface of the lens, and the central axis of the light-exit surface of the lens coincide.

Wherein, the diffusion layer completely covers the irradiation surface formed on the lens by the light emitted by the chipset.

Wherein, the thickness of the diffusion layer is 0.5-1mm.

Another object of the present invention is to provide a backlight module to eliminate the problem of color cast.

For reaching this purpose, the present invention adopts following technical scheme:

A backlight module includes the above-mentioned LED packaging structure.

Another object of the present invention is to provide a display device, which can eliminate the problem of color cast and improve the display effect.

For reaching this purpose, the present invention adopts following technical scheme:

A display device, comprising the above-mentioned backlight module.

Beneficial effects of the present invention:

The invention provides an LED packaging structure, a backlight module and a display device. In the LED package structure, there are three kinds of chips, and three kinds of chips are arranged, wherein the first chip can emit blue light, and the center, the second chip and the third chip can emit red light and green light respectively, and the second chip and the third chip can emit blue light respectively. The chips are distributed on the periphery of the first chip, and the blue light emitted by the first chip diffuses to the surroundings under the action of the reflective layer, and mixes with red light and green light to form white light, which is conducive to improving the uniformity of the three-color light mixing and avoiding the problem of color cast , to improve the display effect.

Description of drawings

FIG. 1 is a top view of an LED packaging structure in the prior art;

2 is a cross-sectional view of an LED package structure in the prior art;

Fig. 3 is a top view of the LED packaging structure provided by the present invention;

Fig. 4 is a structural schematic diagram of the LED packaging structure provided by the present invention;

5 is a cross-sectional view of the LED package structure provided by the present invention;

Fig. 6 is a structural schematic diagram of a refracting lens provided by the present invention;

Fig. 7 is a cross-sectional view of the assembly of the refractive lens and the diffusion layer provided by the present invention;

Fig. 8 is a schematic structural view of a reflective lens provided by the present invention;

Fig. 9 is a cross-sectional view of the assembled reflective lens and diffusion layer provided by the present invention;

Fig. 10 is a schematic diagram of light propagation in the LED packaging structure provided by the present invention.

in:

1', bracket; 11', package groove; 2', chip; 3', electrode connection area;

1. Bracket; 11. Packaging groove; 21. First chip; 22. Second chip; 23. Third chip; 31. First conductive connection area; 32. Second conductive connection area; 33. Third conductive connection area ; 4. Reflective layer; 5. Lens; 51. Light-incoming surface; 52. Light-emitting surface; 6. Diffusion layer; 7. Substrate.

Detailed ways

Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, therefore, should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance. Wherein, the terms "first position" and "second position" are two different positions.

Unless otherwise clearly specified and limited, the terms "mounted", "connected", "connected" and "fixed" should be interpreted in a broad sense, for example, it may be a fixed connection or a detachable connection; it may be a mechanical connection, or It can be an electrical connection; it can be a direct connection, or an indirect connection through an intermediary, and it can be an internal communication between two elements or an interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

Unless otherwise expressly specified and limited, a first feature being "on" or "under" a second feature may include that the first feature is in direct contact with the second feature, and may also include that the first feature and the second feature are not in direct contact. Rather, through additional characteristic contacts between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "under" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

This embodiment provides a display device, and the display device may be a device with an image display function such as a television, a monitor, and an advertising machine. The display device includes a display panel and a backlight module. The backlight module provides a uniform surface light source for the display panel for display purposes.

The backlight module includes a backplane, a light source and optical components. The backplane serves as a supporting structure of the backlight module and is used to fix the light source and optical components. After the light emitted by the light source passes through the optical components, it forms a surface light source on the display panel.

In this embodiment, the light source may be an LED package structure. As shown in FIG. 3 , the LED package structure includes a bracket 1 , a chip and a package layer (not shown in the figure). The bracket 1 is provided with a packaging groove 11, and the inside of the bracket 1 can form a conductive path by pre-embedding a metal sheet, and a part of the metal sheet extends into the package to form a conductive connection area electrically connected to the chip, and the chip is in contact with the conductive connection area. In order to connect the chip with the conductive path. The encapsulation layer is arranged above the chip for sealing and protecting the chip so as to fix the chip in the encapsulation groove 11 .

Due to the working requirements of the backlight module, the light source inside needs to emit white light. In the prior art, three chips are placed in the packaging groove 11, and the three-color lights emitted by the three chips are mixed to form white light. Due to the brightness requirements of the light source, the sizes of the three chips need to have a certain ratio, so that the three-color lights with different brightnesses can be mixed to form white light that meets the needs. This structure leads to the problem of color cast in the LED packaging structure. Even if the secondary lens is used to mix light, there is still a serious color cast problem, which seriously affects the display effect of the backlight module.

In order to solve the above problems, as shown in FIGS. 3-5 , the LED packaging structure includes a chip group with multiple chips, the chip group includes a first chip 21 located in the package groove 11, and a second chip arranged around the first chip 21 22 and the third chip 23, the reflective layer 4 is arranged above the first chip 21. Optionally, the first chip 21 may be a chip that emits blue light, and the second chip 22 and the third chip 23 may be chips that emit red light and green light. When the LED packaging structure works, the blue light emitted by the first chip 21 diffuses around under the action of the reflective layer 4, and mixes with the red light emitted by the second chip 22 and the green light emitted by the third chip 23 to form white light, which is beneficial to improve The uniformity of the three-color light mixing avoids the direct emission of monochromatic light, thereby solving the problem of color cast and improving the display effect.

Optionally, the first chip 21 may be a blue LED chip, the second chip 22 may be a red LED chip, and the third chip 23 may be a green LED chip. The first chip 21 , the second chip 22 and the third chip 23 can also be other structures capable of emitting blue light, red light and green light.

Optionally, the first chip 21 , the second chip 22 and the third chip 23 can be light-emitting diodes with a front-mount, flip-chip or vertical structure, and the bottom of the light-emitting diodes is fixed in the packaging groove 11 by die-bonding glue or solder.

In order to make the outgoing light of the LED packaging structure uniform white light, more than two second chips 22 and third chips 23 can be arranged, and the third chips 23 and the second chips 22 are alternately arranged on the outer periphery of the first chip 21. All directions of the first chip 21 are distributed by three colors of light, so that the three colors of light can be better mixed.

In this embodiment, there are two second chips 22 and two third chips 23 . By arranging two second chips 22 and two third chips 23, the size of the second chip 22 and the third chip 23 can be increased as much as possible under the condition that the package groove 11 has a certain size, so that the LED package structure has sufficient brightness.

Optionally, the reflective layer 4 may cover the top surface of the first chip 21 , which may be a white film layer made of silicon dioxide, which is beneficial to improve the reflectivity of the reflective layer 4 .

Optionally, each of the first chip 21 , the second chip 22 and the third chip 23 may be a rectangular parallelepiped structure that emits light from five sides. A reflective layer 4 is arranged above the first chip 21 , so that the light emitted from the top surface of the first chip 21 can be reflected to the surroundings of the first chip 21 through the reflective layer 4 so as to mix with the red light and green light around the first chip 21 . The light emitted from the other four sides of the first chip 21 is directly mixed with the red light and the green light. By arranging the first chip 21 , the second chip 22 and the third chip 23 in a cuboid structure with five light-emitting surfaces, it is beneficial to improve the light brightness of the LED packaging structure.

Optionally, the top surface of the sealing layer is not higher than 90% of the depth of the packaging groove 11, which can ensure the packaging effect of the chip without affecting the outgoing light.

In the prior art, a better light mixing effect is obtained by controlling the size ratio of the three-color chips. However, the size ratio of the chip is limited by the brightness requirement and the space in the packaging groove 11, so it is impossible to guarantee the light mixing effect on the basis of ensuring the brightness.

In order to solve the above problems, in this embodiment, three conductive pathways are arranged in the bracket 1, and the first chip 21, the second chip 22 and the third chip 23 are respectively connected to the corresponding conductive pathways, so that the first chip 21, the second chip 22 and the third chip 23 are independently controlled, so that by controlling the working current of the first chip 21, the second chip 22 and the third chip 23, the intensity of the blue light, red light and green light can be controlled, so as to achieve an ideal light mixing effect . Compared with the prior art, the light brightness of different intensities is obtained through the size ratio of the chips. In this embodiment, by adjusting the currents of the three chips, the proportions of blue light, red light and green light can be adjusted to achieve mixed white light. The size is not limited, and the adjustment is more convenient and flexible.

Specifically, referring to FIG. 3 , three independent metal sheets can be pre-embedded in the bracket 1 , and one end of the metal sheet protrudes out of the bracket 1 to serve as conductive pins of the LED packaging structure. Each metal sheet is connected with a conductive connection area exposed on the bottom surface of the package groove 11 , and the conductive connection area may be the metal sheet itself or other conductive structures electrically connected to the metal sheet. The three conductive connection areas are respectively the first conductive connection area 31 connected to the first chip 21 through gold wire or solder, the second conductive connection area 32 connected to the second chip 22, and the third conductive connection area connected to the third chip 23. Connection zone 33 .

Optionally, the metal sheet can be made of copper, aluminum or silver, and the surface of the metal sheet can be plated with a silver layer or a nickel layer. The bracket 1 can be made of electromagnetic compatibility (Electro Magnetic Compatibility, EMC), sheet molding compound (SheetMolding Compound, SMC), polyphosphoric acid (Polyphosphoric Acid, PPA), poly 1,4-cyclohexanedimethylene terephthalate (PCT) and other white materials with high reflectivity or ceramics, which is beneficial for the light to exit the bracket 1 .

In order to facilitate the connection of a plurality of second chips 22 and a plurality of third chips 23 with corresponding conductive connection areas, the second conductive connection area 32 and the third conductive connection area 33 all include an arc segment with the first chip 21 as the center of the circle, The second chip 22 and the third chip 23 distributed on the periphery of the first chip 21 are at least partly disposed in the corresponding conductive connection area to facilitate electrical connection.

The LED packaging structure also includes a lens 5, which is covered on the bracket 1, and the light emitted by the chip is emitted through the lens 5, which is beneficial to improve the mixing effect of the light and the uniformity of diffusion.

Optionally, the lens 5 may be a refracting lens 5 as shown in FIGS. 6 and 7 , or may be a reflective lens 5 as shown in FIGS. 8 and 9 . After the light exits through the refracting lens 5 or the reflective lens 5, a circular or elliptical light spot is formed. The light spot has a certain diffusion angle, and a uniform surface light source can be formed through multiple light spots.

The bottom of the lens 5 is provided with a concave area, the inner wall of the concave area forms a light incident surface 51, and the top surface of the lens 5 forms a light exit surface 52, and the light enters the lens 5 by the light incident surface 51, and is refracted or reflected by the lens 5. The light emitting surface 52 is emitted to form a light spot with uniform brightness.

Optionally, the lens 5 may be made of optical grade organic glass (Polymethyl Methacrylate, PMMA), polycarbonate (Polycarbonate, PC), polystyrene (Polystyrene, PS) or glass.

In order to further improve the light diffusion effect, a diffusion layer 6 is arranged between the lens 5 and the bracket 1. After the light is further mixed and diffused through the diffusion layer 6, it enters the lens 5 for secondary diffusion, which is conducive to improving the uniformity and Mixing effect of three-color light.

Optionally, the diffusion layer 6 can be made of transparent optical grade organic glass (Polymethyl Methacrylate, PMMA), polycarbonate (Polycarbonate, PC), polystyrene (Polystyrene, PS) or glass doped with organic or inorganic diffusion particles. to make. The diffusion layer 6 can be, but not limited to, circular, as long as the light emitted by the chip can diffuse through the diffusion layer 6 and then enter the lens 5 .

In order to improve the position accuracy of the light spot formed by the light emitted by the chip through the lens 5 , the central axis of the light incident surface 51 , the central axis of the light exit surface 52 and the central axis of the diffusion layer 6 coincide.

In order to ensure that all light can pass through the diffusion layer 6, the diffusion layer 6 completely blocks the light incident surface 51 of the lens 5, and the diffusion layer 6 completely covers the irradiation surface formed by the light emitted by the chipset on the lens 5 to avoid missing light.

Optionally, the thickness of the diffusion layer 6 may be 0.5-1mm, within this range, the effect of light diffusion can be ensured, and the loss of light can also be reduced, which is beneficial to improve the brightness of the LED packaging structure.

Optionally, the bottom of the lens 5 may also be provided with a groove, and the diffusion layer 6 is accommodated in the groove, which is beneficial to improve the fixing effect of the diffusion layer 6, reduce the size of the LED package structure, and make the structure more compact.

Optionally, the diffusion layer 6 can be formed by injection molding or extrusion molding, which is easy to process and low in cost.

As shown in FIG. 10 , the LED packaging structure further includes a substrate 7 , on which one or more brackets 1 may be arranged, and each bracket 1 is provided with a chipset and a lens 5 . When the LED package structure works, the blue light (dotted line shown in Figure 10) produced by the first chip 21 diffuses to its surroundings, and mixes with the red light and green light emitted by the second chip 22 and the third chip 23 around it, and the mixed light After the light passes through the diffusion layer 6, it enters the lens 5 for secondary diffusion to form a light spot with uniform brightness.

In other embodiments, the first chip 21 , the second chip 22 and the third chip 23 may also adopt other color combinations, so as to obtain the required light mixing effect.

The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. limits.

Claims (10)

1. a kind of LED encapsulation structure characterized by comprising

Bracket (1) is provided with encapsulation slot (11) on the bracket (1)；

Chipset, the chipset are set in the encapsulation slot (11), and the chipset includes being located at the encapsulation slot (11) First chip (21) at center, the second chip (22) and third chip (23) being arranged around first chip (21)；And

Reflecting layer (4), the reflecting layer (4) are set to the top of first chip (21).

2. LED encapsulation structure as described in claim 1, which is characterized in that the third chip (23) and second chip (22) at least two are provided with, and the third chip (23) and second chip (22) are staggered.

3. LED encapsulation structure as described in claim 1, which is characterized in that there are three conductive logical for setting in the bracket (1) Road, first chip (21), second chip (22) and the third chip (23) are logical with the corresponding conduction respectively Road connection.

4. LED encapsulation structure as claimed in any one of claims 1-3, which is characterized in that the LED encapsulation structure is also wrapped It includes:

Lens (5), the lens (5) are buckled on the bracket (1)；And

Diffusion layer (6), the diffusion layer (6) is between the lens (5) and the bracket (1).

5. LED encapsulation structure as claimed in claim 4, which is characterized in that fluted, institute is arranged in the bottom of the lens (5) Diffusion layer (6) are stated to be located in the groove.

6. LED encapsulation structure as claimed in claim 4, which is characterized in that central axis, the lens of the diffusion layer (6) (5) the center overlapping of axles of the light-emitting surface (52) of the central axis and lens (5) of incidence surface (51).

7. LED encapsulation structure as claimed in claim 4, which is characterized in that the chipset is completely covered in the diffusion layer (6) The shadow surface that the light of sending is formed on the lens (5).

8. LED encapsulation structure as claimed in claim 4, which is characterized in that the diffusion layer (6) with a thickness of 0.5-1mm.

9. a kind of backlight module, which is characterized in that including LED encapsulation structure such as of any of claims 1-8.

10. a kind of display equipment, which is characterized in that including backlight module as claimed in claim 9.