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CN110261384B - Detection device and detection method for silicon carbide chip - Google Patents

Detection device and detection method for silicon carbide chip Download PDF

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Publication number
CN110261384B
CN110261384B CN201910673371.9A CN201910673371A CN110261384B CN 110261384 B CN110261384 B CN 110261384B CN 201910673371 A CN201910673371 A CN 201910673371A CN 110261384 B CN110261384 B CN 110261384B
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pin
voltage
sheet
pcb
basket
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CN110261384A (en
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景苏鹏
刘卫平
朱里嘉
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Suzhou Huakai Microelectronics Co ltd
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Suzhou Huakai Microelectronics Co ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00Prospecting or detecting by optical means
    • G01V8/10Detecting, e.g. by using light barriers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N2021/8411Application to online plant, process monitoring

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

The invention discloses a detection device for a silicon carbide chip, which comprises a lifting seat slidably mounted on a frame, wherein the lifting seat is driven by a lifting power device, a mounting plate is arranged on the lifting seat, a plurality of equally-spaced and parallel sheet PCB boards are arranged on the mounting plate, a basket PCB board is arranged on the outer side of the sheet PCB board, gaps between adjacent sheet PCB boards facilitate the insertion of the silicon carbide chip, the sheet PCB board and the basket PCB board have the same structure, and a reflective photoelectric sensor, a cell machine and a voltage stabilizer which are connected are arranged on the sheet PCB board and the basket PCB board. In addition, the invention also discloses a method for using the detection device, wherein the sheet is inserted into the gap through lifting action, and then whether the sheet and the type of the sheet exist or not is judged by utilizing the reflected light rays received by the reflective photoelectric sensor, so that the defect that the old equipment cannot identify the silicon carbide chip is overcome.

Description

Detection device and detection method for silicon carbide chip
Technical Field
The invention relates to a silicon carbide detection device and a detection method using the detection device.
Background
In the semiconductor industry, wafers are all required to be carried in a flower basket in different technological processes, and the wafers need a high-cleanliness environment, so that the positions and the arrangement directions of the wafers in the flower basket need to be automatically detected mechanically. In general, in various semiconductor process equipment, a laser correlation or total reflection angle type detection mode is adopted for wafers in a flower basket. With the development of semiconductor materials, wafers with SiC (silicon carbide) as a substrate are produced, and the most important physical properties of such wafers are in a "semitransparent" state. The novel transparent sheet is a main problem for the detection of the wafer for the old equipment, the old equipment can only detect the opaque wafer of the common germanium-silicon material due to the early manufacturing time, and the technological process corresponding to the novel material sheet can only manually detect and input the equipment parameters by workers, so that the working efficiency and the working reliability are not affected little.
Disclosure of Invention
The first technical problem to be solved by the invention is as follows: the detecting device enables the sheet to be inserted into the gap through lifting action, then judges whether the sheet exists or not and the type of the sheet by utilizing reflected light received by the reflective photoelectric sensor, and solves the defect that old equipment cannot identify the silicon carbide sheet.
The second technical problem to be solved by the invention is as follows: the detection method is used for judging whether the sheet materials exist in the flower basket or not and the type of the sheet materials through the difference of the reflection intensity of the sheet materials with different types to light, and the defect that old equipment cannot identify the silicon carbide sheet materials is overcome.
In order to solve the first technical problem, the technical scheme of the invention is as follows: the utility model provides a detection device of carborundum piece, including slidable mounting in the frame, this lifting seat is driven by lifting power device, be provided with the mounting panel on this lifting seat, be provided with a plurality of each equidistant and parallel arrangement's sheet PCB boards on this mounting panel, be located the outside of sheet PCB board and be provided with basket PCB board, the clearance between the adjacent sheet PCB board makes things convenient for the insertion of carborundum piece, the sheet PCB board is the same with the structure of basket PCB board, all be provided with the reflective photoelectric sensor who links to each other on sheet PCB board and the basket PCB board, cell machine and stabiliser, the singlechip includes digital power supply pin, analog power supply pin, voltage output pin, start command input pin, restart pin, voltage feedback pin, signal output pin and threshold reference detection pin, digital power supply pin and analog power supply pin all are connected with power supply through stabiliser, voltage output pin is connected with the anodal of reflective photoelectric sensor's emitting diode, reflective photoelectric sensor's receiver tube's collecting electrode is connected with voltage feedback pin, this receiving tube's projecting pole and emitting diode's negative pole ground connection; the collecting electrode of the receiving tube is also connected with a digital power supply pin through a pull-up resistor, the starting instruction input pin is connected with external equipment to receive an external detection starting instruction, the restarting pin of the singlechip on the sheet PCB is connected with the signal output pin of the singlechip on the basket PCB in a wired and logic mode, the analog power supply pin is connected with a variable resistor, and the threshold reference detection pin is connected with the adjusting end of the variable resistor.
As a preferable scheme, the sheet PCB and the flower basket PCB are respectively provided with an LED indicator lamp, and the LED indicator lamps are connected with the indicator lamp output pins of the singlechip.
As a preferable scheme, the lifting seat comprises at least two guide rods, a guide sleeve matched with the guide rods is arranged on the frame, the guide rods are inserted into the guide sleeve, a connecting rod is arranged between the guide rods, and a lifting power device is arranged between the connecting rod and the base.
As a preferable scheme, the lifting power device is a cylinder, and the cylinder is vertically arranged.
As a preferable scheme, the reflective photoelectric sensor is arranged at the upper parts of the sheet PCB and the flower basket PCB.
As a preferable scheme, the distance between the reflective photoelectric sensor and the opposite sheet material PCB is H, and the insertion position of the silicon carbide chip is H/2.
After the technical scheme is adopted, the invention has the following effects: because the detection device adopts a plurality of sheet PCBs and a flower basket PCB to form a plurality of gaps, the lifting seat is driven by the lifting power device to rise so that the sheets are inserted into the gaps, then the light emitted by the light emitting diode of the reflective photoelectric sensor can be blocked and reflected by the sheets, the intensity of the reflected light is judged by detecting the voltage change of the voltage feedback pin of the singlechip, and finally, whether the sheets exist or not and whether the sheets are opaque sheets or transparent sheets are judged, so that the detection of the silicon carbide sheets is realized, and the detection device can be used in the reconstruction of old equipment, thereby improving and reducing the cost.
And as the LED indicator lamps are arranged on the sheet PCB and the flower basket PCB, the LED indicator lamps are connected with the output pins of the indicator lamps of the singlechip, and therefore, the detection result can be displayed through the LED indicator lamps.
The reflective photoelectric sensor is arranged on the upper parts of the sheet material PCB and the flower basket PCB, the distance between the reflective photoelectric sensor and the opposite sheet material PCB is H, and the insertion position of the silicon carbide chip is H/2, so that the receiving of the reflected light of the sheet material is more reasonable and better controlled.
In order to solve the second technical problem, the technical scheme of the invention is as follows: the detection method of the silicon carbide chip uses the detection device, and comprises the following steps:
s1, signal acquisition is carried out in a working environment on the premise of no sheet, the output voltage of a voltage output pin of a singlechip rises from 0 to VDD, light rays emitted by a light emitting diode of a reflective photoelectric sensor are received by a receiving tube after being reflected by a sheet PCB and a flower basket PCB, the voltage of a voltage feedback pin is monitored, and the voltage of the voltage feedback pin is monitored by adjusting the output voltage of the voltage output pin Simultaneously, the variable resistor is adjusted to enable the voltage V Threshold value = 0.1VDD of the threshold reference detection pin
S2, the detection device rises to enable the sheet to be detected to be inserted into a gap between adjacent PCBs and detect the voltage of the voltage feedback pin at the moment;
S21, if the voltage V 1 of the voltage feedback pin is reduced and the voltage I V 1-V0|>V Threshold value is reduced, judging that the sheet is an opaque sheet, enabling the starting instruction input pin to receive a starting detection instruction synchronous signal, and enabling the signal output pin of the singlechip to output a high level;
S22, if the voltage V 1 of the voltage feedback pin is increased and the voltage V 1-V0|>V Threshold value is increased, judging that the sheet is a transparent sheet, enabling the starting instruction input pin to receive a starting detection instruction synchronous signal, and enabling the signal output pin of the singlechip to output a high level;
s23, if the voltage V 1 of the voltage feedback pin is unchanged or V 1 is changed but |V 1-V0|<V Threshold value is changed, judging that no sheet exists in the gap, and outputting a low level by a signal output pin of the singlechip.
Preferably, the detection method further includes a reset step: resetting is carried out when the singlechip is powered for the first time or when the output level of the voltage output pins of the singlechips on the basket PCB is low, resetting the singlechips on all the sheet PCBs;
If a flower basket exists, and the flower basket PCB board rises in the process, light rays emitted by the light emitting diode of the reflective photoelectric sensor are reflected by the edge of the flower basket and then received by the receiving tube, at the moment, the voltage V '1 of the voltage feedback pin of the singlechip on the flower basket PCB board is reduced, and the voltage V' 1-V0|>V Threshold value is reduced, and then the signal output pin of the singlechip on the flower basket PCB board outputs a high level;
If no basket exists, the light emitted by the light emitting diode of the reflective photoelectric sensor is not reflected in the rising process of the PCB, at the moment, the voltage V ' 1 of the voltage feedback pin of the singlechip on the basket PCB is unchanged, or V ' 1 is changed but |V ' 1-V0|<V Threshold value , and then the signal output pin of the singlechip on the basket PCB outputs a low level.
Preferably, the detection method further comprises a lighting prompt, wherein the single chip microcomputer respectively lights up the indicator lamps with different colors in the step S21 and the step S22, and the indicator lamps are all turned off in the step S23.
After the technical scheme is adopted, the invention has the following effects: according to the detection method, the detection device is used, the reflection quantity of the sheet material to the light-emitting diode is different, so that the resistance of the receiving tube is changed, the voltage change on the voltage feedback pin is different, and the voltage change quantity is compared with the threshold voltage, so that the accuracy of the detection result can be improved due to the change of external light rays.
Because the detection method further comprises a resetting step, the resetting step is controlled by voltage output on the flower basket PCB, when a receiving tube of the reflective photoelectric sensor on the flower basket PCB receives light reflected by the flower basket side plate, the voltage V '1 of the voltage feedback pin is reduced, and I V' 1-V0|>V Threshold value , the signal output pin of the singlechip on the flower basket PCB outputs high level, and other sheet PCBs only detect work, if the light reflected by the flower basket side plate is not detected, the signal output pin of the singlechip on the flower basket PCB outputs low level, and the sheet PCBs are reset all the time and do not work, so that false triggering or artificial abnormal signals are avoided.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic diagram of a detection device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a detection device according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a detection device according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a device on a sheet PCB board;
Fig. 5 is a circuit diagram of a PCB board;
In the accompanying drawings: 1. flower basket; 2. a sheet; 3. a mounting plate; 4. a sheet PCB; 5. flower basket PCB board; 6. a frame; 7. a cylinder; 8. a guide rod; 9. guide sleeve; 10. a lifting seat; 11. a reflective photosensor; 111. a receiving tube; 112. a light emitting diode; 113. a collector electrode; 114. an emitter; 12. a single chip microcomputer; 121. a digital power supply pin; 122. a signal output pin; 123. a voltage output pin; 124. a voltage feedback pin; 125. a threshold reference detection pin; 126. simulating a power supply pin; 127. starting an instruction input pin; 128. restarting the pin; 129. a red light indicates a pin; 1210. green light indicates the pin; 13. a voltage stabilizer; led indicator light; 141. a red indicator light; 142. a green indicator light; 15. a pull-up resistor; 16. a variable resistor.
Detailed Description
The present invention will be described in further detail with reference to the following examples.
As shown in fig. 1 to 5, a detection device for silicon carbide chips comprises a lifting seat 10 slidably mounted on a frame 6, the lifting seat 10 is driven by a lifting power device, a mounting plate 3 is arranged on the lifting seat 10, a plurality of equidistant and parallel sheet PCB boards 4 are arranged on the mounting plate 3, a basket PCB board 5 is arranged on the outer side of the sheet PCB boards 4, gaps between adjacent sheet PCB boards 4 are convenient for inserting the silicon carbide chips, the structures of the sheet PCB boards 4 and the basket PCB boards 5 are identical, the sheet PCB boards 4 and the basket PCB boards 5 are respectively provided with a connected reflective photoelectric sensor 11, a cell machine and a voltage stabilizer 13, the single chip 12 comprises a digital power supply pin 121, an analog power supply pin 126, a voltage output pin 123, a start command input pin 127, a restarting pin 128, a voltage feedback pin 124, a signal output pin 122 and a threshold reference detection pin 125, the digital power supply pin 121 and the analog power supply pin 126 are respectively stabilized to 3.3V after passing through the voltage stabilizer 13, and the power supply of 5V is respectively stabilized to the digital power supply pin 121 and the analog power supply pin 126, as shown in fig. 3.3V and 5 a is shown in the embodiment of fig. 3.
The voltage output pin 123 is connected with the positive electrode of the light emitting diode 112 of the reflective photosensor 11, the collector 113 of the receiving tube 111 of the reflective photosensor 11 is connected with the voltage feedback pin 124, and the emitter 114 of the receiving tube 111 and the negative electrode of the light emitting diode 112 are grounded; the collector 113 of the receiving tube 111 is further connected to a digital power supply pin 121 through a pull-up resistor 15, the start command input pin 127 is connected to an external device for receiving an external detection start command, the restart pin 128 of the singlechip 12 on the sheet PCB 4 is connected to the signal output pin 122 of the singlechip 12 on the basket PCB 5 in a wired and logic manner, the analog power supply pin 126 is connected to the variable resistor 16, and the threshold reference detection pin 125 is connected to an adjusting end of the variable resistor 16.
LED indicator lamps 14 are arranged on the sheet PCB 4 and the basket PCB 5, and the LED indicator lamps 14 are connected with the indicator lamp output pins of the singlechip 12. In this embodiment, the LED indicator 14 includes a red indicator 141 and a green indicator 142, the indicator output pins include a green indicator 1210 and a red indicator 129, and the red indicator 141 is connected to the red indicator 129, and the green indicator 142 is connected to the green indicator 1210.
The lifting seat 10 comprises at least two guide rods 8, a guide sleeve 9 matched with the guide rods 8 is arranged on the frame 6, the guide rods 8 are inserted into the guide sleeve 9, a connecting rod is arranged between the guide rods 8, and a lifting power device is arranged between the connecting rod and the base. The lifting power device is an air cylinder 7 which is vertically arranged.
In this embodiment, the reflective photoelectric sensor 11 is disposed on the upper parts of the sheet PCB 4 and the basket PCB 5. Preferably, the distance between the reflective photoelectric sensor 11 and the opposite sheet material PCB 4 is H, and the insertion position of the silicon carbide chip is H/2.
In addition, the embodiment also discloses a detection method of the silicon carbide chip, which uses the detection device and comprises the following steps:
S1, signal acquisition is carried out in a working environment without a sheet 2, the output voltage of a voltage output PIN 123 (PIN 10-PIN 13) of a singlechip 12 rises from 0 to VDD, light rays emitted by a light emitting diode 112 of a reflective photoelectric sensor 11 are received by a receiving tube 111 after being reflected by a sheet 2PCB and a basket PCB 5, the voltage of a voltage feedback PIN 124 is monitored, and the voltage of the voltage feedback PIN 124 is monitored by adjusting the output voltage of the voltage output PIN 123 Simultaneously adjusting the variable resistor 16 to cause the voltage V Threshold value = 0.1VDD at the threshold reference detect pin 125; this step ensures that the light is emitted and that the laser is free of foreign bodies or discs on the back of the next sheet 2PCB, the purpose of this step being to detect the signal acquisition of the environment, the result of which remains as a detected reference parameter value.
S2, the detection device rises to enable the sheet 2 to be detected to be inserted into a gap between adjacent PCBs and detect the voltage of the voltage feedback pin 124 at the moment;
S21, if the voltage V 1 of the voltage feedback pin 124 is reduced and |V 1-V0|>V Threshold value is reduced, the sheet 2 is judged to be an opaque sheet, the start instruction input pin 127 receives a start detection instruction synchronous signal, and the signal output pin 122 of the singlechip 12 outputs a high level; the specific principle is as follows: the opaque wafer is inserted into the gap, and as most of the emitted light rays are reflected, the current of the receiving tube 111 is increased, the voltage feedback PIN 124 (PIN 14) of the singlechip 12 is pulled down to be close to 0V, the opaque wafer is determined at the moment, meanwhile, the red lamp indication PIN 129 (PIN 3) is set down, the red lamp indication 141 is on, and meanwhile, the signal is temporarily stored; when receiving the synchronous signal of the start detection instruction, namely, the start instruction input PINs 127 (PIN 6/PIN 7) of the singlechip 12 are all high and low, the signal output PINs 122 (PIN 17/PIN 18) of the singlechip 12 simultaneously output high level to finish one-time detection;
s22, if the voltage V 1 of the voltage feedback pin 124 is increased and the voltage I V 1-V0|>V Threshold value is increased, the sheet 2 is judged to be a transparent sheet, the start instruction input pin 127 receives a start detection instruction synchronous signal, and the signal output pin 122 of the singlechip 12 outputs a high level; the principle is as follows: when the transparent wafer is inserted into the gap, the light is refracted and reflected at the interface between the air and the wafer, and the energy of refraction is far greater than the energy of reflection, so that the light received by the receiving tube 111 is weakened, at the moment, the voltage of the voltage feedback PIN 124 (PIN 14) is pulled up, and the change of the voltage pulling up is greater than V Threshold value , so that the translucent silicon carbide wafer is judged, and meanwhile, the green lamp indicating PIN 1210 (PIN 2) is placed down, the green indicating lamp 142 is bright, and meanwhile, the signal is temporarily stored. When receiving the synchronous signal of the start detection instruction, namely, the start instruction input PINs 127 (PIN 6/PIN 7) of the singlechip 12 are all high and low, the signal output PINs 122 (PIN 17/PIN 18) of the singlechip 12 simultaneously output high level to finish one-time detection;
S23, if the voltage V 1 of the voltage feedback pin 124 is unchanged or V 1 is changed but |V 1-V0|<V Threshold value is changed, it is determined that the sheet 2 is not present in the gap, the signal output pin 122 of the singlechip 12 outputs a low level, and at this time, the green indicator lamp 142 and the red indicator lamp 141 are not on.
Preferably, the detection method further includes a reset step: resetting is carried out when the singlechip 12 is powered on for the first time or when the output level of the voltage output pins 123 of the singlechip 12 on the basket PCB 5 is low, resetting the singlechips 12 on all the sheet PCBs 4;
If the flower basket 1 exists, and the flower basket PCB 5 is in the ascending process, the light emitted by the light emitting diode 112 of the reflective photoelectric sensor 11 is reflected by the edge of the flower basket 1 and then received by the receiving tube 111, at this time, the voltage V '1 of the voltage feedback pin 124 of the singlechip 12 on the flower basket PCB 5 is reduced, and |v' 1-V0|>V Threshold value , then the signal output pin 122 of the singlechip 12 on the flower basket PCB 5 outputs a high level;
If there is no basket 1, the light emitted by the light emitting diode 112 of the reflective photoelectric sensor 11 is not reflected in the rising process of the PCB board, and at this time, the voltage V ' 1 of the voltage feedback pin 124 of the singlechip 12 on the basket PCB board 5 is unchanged, or V ' 1 is changed but |v ' 1-V0|<V Threshold value , and then the signal output pin 122 of the singlechip 12 on the basket PCB board 5 outputs a low level. In the lifting process of the detection device, the reflective photoelectric sensor 11 on the flower basket PCB 5 can preferentially detect the side plate of the flower basket 1, so that the sheet PCB 4 is detected after the flower basket PCB 5 detects the flower basket 1, and misoperation and false detection are reduced.
The above examples are merely illustrative of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and adaptations of the technical solution of the present invention should and are intended to fall within the scope of the present invention as defined in the claims.

Claims (6)

1. A detection device of a silicon carbide chip is characterized in that: the solar cell module comprises a lifting seat which is slidably arranged on a rack, wherein the lifting seat is driven by a lifting power device, a mounting plate is arranged on the lifting seat, a plurality of equidistant sheet PCB boards which are arranged in parallel are arranged on the mounting plate, a basket PCB board is arranged on the outer side of the sheet PCB board, gaps between adjacent sheet PCB boards are convenient for inserting silicon carbide chips, the sheet PCB boards and the basket PCB boards are identical in structure, a reflective photoelectric sensor, a singlechip and a voltage stabilizer are connected on the sheet PCB boards and the basket PCB boards, the singlechip comprises a digital power supply pin, an analog power supply pin, a voltage output pin, a starting instruction input pin, a restarting pin, a voltage feedback pin, a signal output pin and a threshold reference detection pin, the digital power supply pin and the analog power supply pin are connected with a power supply through a voltage stabilizer, the voltage output pin is connected with the positive electrode of a light emitting diode of the reflective photoelectric sensor, the collector of a receiving tube of the reflective photoelectric sensor is connected with the voltage feedback pin, and the emitting electrode of the receiving tube of the light emitting diode is grounded; the collecting electrode of the receiving tube is further connected with a digital power supply pin through a pull-up resistor, a starting instruction input pin is connected with external equipment to receive an external detection starting instruction, a restarting pin of a singlechip on a sheet PCB is connected with a signal output pin of the singlechip on a flower basket PCB in a line and logic mode, an analog power supply pin is connected with a variable resistor, a threshold reference detection pin is connected with an adjusting end of the variable resistor, LED indicator lamps are arranged on the sheet PCB and the flower basket PCB and are connected with the indicator lamp output pin of the singlechip, a reflective photoelectric sensor is arranged on the upper parts of the sheet PCB and the flower basket PCB, the distance between the reflective photoelectric sensor and the opposite sheet PCB is H, and the inserting position of the silicon carbide chip is H/2.
2. A silicon carbide wafer inspection apparatus according to claim 1, wherein: the lifting seat comprises at least two guide rods, guide sleeves matched with the guide rods are arranged on the frame, the guide rods are inserted into the guide sleeves, a connecting rod is arranged between the guide rods, and a lifting power device is arranged between the connecting rod and the base.
3. A silicon carbide wafer inspection apparatus according to claim 2, wherein: the lifting power device is an air cylinder which is vertically arranged.
4. A detection method of a silicon carbide chip is characterized in that: the detection method uses the detection device of claim 1, which comprises the following steps:
S1, signal acquisition is carried out in a working environment on the premise of no sheet, the output voltage of a voltage output pin of a singlechip rises from 0to VDD, light rays emitted by a light emitting diode of a reflective photoelectric sensor are received by a receiving tube after being reflected by a sheet PCB and a flower basket PCB, the voltage of a voltage feedback pin is monitored, and the voltage of the voltage feedback pin is monitored by adjusting the output voltage of the voltage output pin Simultaneously, the variable resistor is adjusted to enable the voltage of the threshold reference detection pin to/>
S2, the detection device rises to enable the sheet to be detected to be inserted into a gap between adjacent PCBs and detect the voltage of the voltage feedback pin at the moment;
S21, if the voltage of the voltage feedback pin Reduced, and/>Judging the sheet material to be an opaque sheet, enabling the starting instruction input pin to receive a starting detection instruction synchronous signal, and enabling the signal output pin of the singlechip to output a high level;
S22, if the voltage of the voltage feedback pin Elevated, and/>Judging the sheet material to be transparent, enabling the starting instruction input pin to receive a starting detection instruction synchronous signal, and enabling the signal output pin of the singlechip to output high level;
s23, if the voltage of the voltage feedback pin Unchanged or/>Changes but/>And judging that no sheet exists in the gap, and outputting a low level by a signal output pin of the singlechip.
5. The method for detecting a silicon carbide wafer according to claim 4, wherein: the detection method further comprises a reset step: resetting is carried out when the singlechip is powered for the first time or when the output level of the voltage output pins of the singlechips on the basket PCB is low, resetting the singlechips on all the sheet PCBs;
If there is a basket, and the basket PCB board rises in-process, the light that the emitting diode of reflective photoelectric sensor sent is received by the receiver tube after being reflected by the edge of basket, the voltage of the voltage feedback pin of singlechip on the basket PCB board this moment Reduced, and/>Outputting a high level by a signal output pin of the singlechip on the flower basket PCB;
If no basket exists, the light emitted by the light emitting diode of the reflective photoelectric sensor is not reflected in the rising process of the PCB, and at the moment, the voltage of the voltage feedback pin of the singlechip on the basket PCB is equal to the voltage of the voltage feedback pin No change, or/>Changes but is changedAnd outputting a low level by a signal output pin of the singlechip on the flower basket PCB.
6. The method for detecting a silicon carbide wafer according to claim 5, wherein: the detection method further comprises a lighting prompt, the single chip microcomputer respectively lights the indicator lamps with different colors in the step S21 and the step S22, and the indicator lamps are all turned off in the step S23.
CN201910673371.9A 2019-07-24 2019-07-24 Detection device and detection method for silicon carbide chip Active CN110261384B (en)

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