CN110246952A - A kind of LED wafer color-changing device - Google Patents

Abstract

The invention discloses an LED chip discoloration device, which comprises a transparent temperature-resistant layer and a phosphor layer formed by sintering on the outer surface of the transparent temperature-resistant layer. gaps between. Compared with the prior art, when the present invention needs to be applied on a higher-power LED chip, the heat generated by the high luminous flux will not have any impact on the formed LED product, thus ensuring that the produced LED product can continuous work.

Description

A LED chip discoloration device

technical field

The invention relates to the field of LEDs, in particular to an LED chip discoloration device.

Background technique

Based on reasons such as cost and attenuation resistance, blue light chips are the most widely used chips in the LED field on the market. An encapsulation layer is formed in front of the chip. The encapsulation layer is a mixture of silica gel and fluorescent powder. The phosphor powder is designed for matching according to the color required by the current product. In this way, after the blue light emitted by the blue chip passes through the encapsulation layer, The light of the actual required color can be formed, so as to meet the conventional lighting requirements of various colors.

However, because the encapsulation layer formed by the mixture of silica gel and phosphor powder needs to allow the light generated by the blue light chip to pass through, combined with the poor heat resistance of the silica gel itself, for a blue light chip with a higher power, the larger luminous flux formed will directly cause The encapsulation layer is heated and destroyed, so that the encapsulation method of conventional silica gel and phosphor powder cannot be applied to higher power LED chips, which brings troubles to the actual product design. This case arises.

Contents of the invention

The main purpose of the present invention is to provide an LED chip discoloration device to solve the problem in the prior art that the blue light chip is used as the light-emitting chip, and the silicone encapsulation layer is easily damaged due to the large luminous flux during the discoloration process.

In order to achieve the above object, the solution of the present invention is:

An LED chip discoloration device, which includes a transparent temperature-resistant layer and a phosphor layer formed on the outer surface of the transparent temperature-resistant layer by sintering, and one side of the inner surface of the transparent temperature-resistant layer corresponds to a blue chip and is in between A gap is formed.

Further, the phosphor in the phosphor layer is red phosphor or green phosphor.

Further, the discoloration device also includes a support seat located on the side edge of the LED chip, the transparent temperature-resistant layer is installed on the support seat and a gap is formed between the lower surface of the transparent temperature-resistant layer and the blue light chip.

Further, the transparent heat-resistant layer is sapphire glass.

After adopting the above structure, the present invention relates to an LED chip discoloration device. Since it uses a transparent temperature-resistant layer as the base material, it has the characteristics of good light transmission and good temperature resistance. When applied on the wafer, the heat generated by the high luminous flux will not have any impact on the product, so as to ensure that the manufactured LED products can continue to work.

Description of drawings

FIG. 1 is a schematic structural view of an LED chip discoloration device according to the present invention.

Fig. 2 is a schematic diagram of cooperation between the color changing device and the LED chip involved in the present invention.

In the picture:

Transparent temperature-resistant layer-1; Phosphor powder layer-2; Blu-ray chip-3;

Support seat-4; substrate-6.

Detailed ways

In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific examples.

As shown in Figure 1, an LED chip discoloration device related to the present invention includes a transparent temperature-resistant layer 1 and a phosphor layer 2 formed on the outer surface of the transparent temperature-resistant layer 1 by sintering, and the inner surface of the transparent temperature-resistant layer 1 is One side of the surface corresponds to the blue light chip 3 and forms a gap H with the blue light chip 3 . It should be noted that the outer surface of the transparent heat-resistant layer 1 refers to the side facing away from the blue light chip 3 , and the inner surface refers to the side facing the blue light chip 3 .

In this embodiment, the fluorescent powder in the fluorescent powder layer 2 is red fluorescent powder or green fluorescent powder; of course, it can also be fluorescent powder of other colors, which are not limited here and are selected according to actual needs.

As shown in Figure 2, as a specific embodiment, the discoloration device also includes a support base 4 located on the side edge of the LED chip, and the transparent heat-resistant layer 1 is installed on the support base 4 and allows the transparent heat-resistant layer 1 to be lowered. A gap H is formed between the surface and the blue light chip 3 . The support base 4 can only play a role of support, or it can also play a role of heat dissipation at the same time, for example, by using a copper substrate; the LED chip in the figure is a blue light chip, and a substrate 6 is arranged below it.

As a specific option of the present invention, the transparent heat-resistant layer 1 is sapphire glass, which has two characteristics of transparency and temperature resistance.

Since the above-mentioned structure of the present invention does not solve the problem of sealing, please refer to FIG. 2, it is solved by adding a glass lens outside, and the color changing device is not solved for the time being.

To sum up, the present invention relates to an LED chip discoloration device. Since it uses the transparent heat-resistant layer 1 as the base material, it has the characteristics of good light transmission and good temperature resistance. When it is applied on the screen, the heat generated by the high luminous flux will not have any impact on the product, so as to ensure that the manufactured LED products can continue to work.

The above-mentioned embodiments and drawings do not limit the form and style of the product of the present invention, and any appropriate changes or modifications made by those skilled in the art should be considered as not departing from the patent scope of the present invention.

Claims (4)

1. A kind of LED chip discoloration device, it is characterized in that, comprise transparent temperature-resistant layer and sintering and be formed on the fluorescent powder layer on the transparent temperature-resistant layer outer surface, the inner surface side of described transparent temperature-resistant layer is corresponding blue chip and with A gap is formed between the Blu-ray chips. 2 . The LED chip discoloration device according to claim 1 , wherein the phosphor in the phosphor layer is red phosphor or green phosphor. 3 . 3. A kind of LED chip discoloration device as claimed in claim 1, is characterized in that, described discoloration device also comprises the support seat that is positioned at LED chip side edge, and described transparent temperature-resistant layer is installed on the support seat and makes transparent and resistant A gap is formed between the lower surface of the temperature layer and the blue light chip. 4. A LED chip discoloration device as claimed in claim 1, wherein the transparent temperature-resistant layer is sapphire glass.