CN110233145A - A kind of power module - Google Patents

Abstract

The present invention provides a power module, comprising: an insulating substrate, a first bridge arm conductive layer arranged on the insulating substrate, a plurality of first bridge arm power chips arranged on the first bridge arm conductive layer, and a plurality of first bridge arm power chips arranged on the insulating substrate The second bridge arm conductive layer, a plurality of second bridge arm power chips arranged on the second bridge arm conductive layer, the first bridge arm electrode conductive layer arranged on the insulating substrate, the first bridge arm electrode conductive layer arranged The first electrode conductive strip on the top, the second electrode conductive strip arranged on the second bridge arm conductive layer, the output electrode conductive layer arranged on the insulating substrate, the output electrode conductive layer arranged on the output electrode conductive layer; multiple The power chip of the first bridge arm is electrically connected to the conductive layer of the electrode of the first bridge arm respectively, the conductive layer of the first bridge arm is electrically connected to the conductive layer of the output electrode, and the power chips of the second bridge arm are respectively electrically connected to the conductive layer of the output electrode .

Description

a power module

technical field

The invention relates to the technical field of electronic power, in particular to a power module.

Background technique

The power module is a power switch module packaged by power electronic power devices such as metal oxide semiconductor (power MOS tube), insulated gate field effect transistor (IGBT), and fast recovery diode (FRD) according to certain functions. It is mainly used for Power conversion in various occasions such as electric vehicles, wind power generation, and industrial frequency conversion.

The motor drive circuit of an electric vehicle usually includes three groups of power modules, which provide three-phase AC power for the motor. During the working process of the motor, since the motor is an inductive load, the parasitic inductance of the existing power module generates waveform oscillation during the switching process of the power module, which affects the precise operation performance of the motor.

Contents of the invention

The purpose of the present invention is to solve the above problems and provide a power module, which changes the wiring arrangement of the power module and effectively reduces the parasitic inductance of the power module.

The present invention provides a power module, comprising: an insulating substrate, a first bridge arm conductive layer arranged on the insulating substrate, a plurality of first bridge arm power chips arranged on the first bridge arm conductive layer, and a plurality of first bridge arm power chips arranged on the insulating substrate The second bridge arm conductive layer on the second bridge arm conductive layer, a plurality of second bridge arm power chips arranged on the second bridge arm conductive layer, the first bridge arm electrode conductive layer arranged on the insulating substrate, the first bridge arm electrode conductive layer arranged on the first bridge arm electrode The first electrode conductive strip on the layer, the second electrode conductive strip arranged on the second bridge arm conductive layer, the output electrode conductive layer arranged on the insulating substrate, and the output electrode conductive strip arranged on the output electrode conductive layer; A first bridge arm power chip is electrically connected to the first bridge arm electrode conductive layer, the first bridge arm conductive layer is electrically connected to the output electrode conductive layer, and multiple second bridge arm power chips are respectively electrically connected to the output electrode conductive layer connection; wherein, the first electrode conductive strip is arranged adjacent to a plurality of first bridge arm power chips, and extends along the arrangement path of the plurality of first bridge arm power chips, and the second electrode conductive strip is connected to a plurality of second bridge arm power chips The chips are arranged adjacent to each other and extend along the arrangement path of the multiple second bridge arm power chips.

Further, the plurality of power chips of the second bridge arm are electrically connected to the conductive layer of the first bridge arm, and then electrically connected to the conductive layer of the output electrode.

Further, the first electrode conductive strip and the second electrode conductive strip are symmetrically arranged frame-shaped copper strips of the same height, the opening of the first electrode conductive strip faces the power chip of the first bridge arm, and the second electrode The opening of the conductive strip faces the power chip of the second bridge arm.

Further, the conductive strips for the first electrode and the conductive strip for the second electrode are symmetrically arranged straight copper strips of the same height.

Further, an outer frame is fixedly arranged on the periphery of the insulating substrate, and a side through hole is opened on the side of the outer frame where the first electrode conductive strip and the second electrode conductive strip are located, and the side through hole The hole corresponds to the shape of the first electrode conductive strip and the second electrode conductive strip, the size of the side through holes is larger than the size of the first and second electrode conductive strips, and the first and second electrode conductive strips are respectively set In the side through hole, the tops of the first and second electrode conductive strips are higher than the upper surface of the outer frame.

Further, the power module further includes a gate lead-out plate, the gate lead-out plate is arranged between the first and second bridge arm power chips and the conductive layer of the output electrode, the conductive layer of the output electrode is in the shape of a frame, so The gate lead-out plate is located in the frame-shaped opening of the conductive layer of the output electrode.

Further, the output electrode conductive strip is frame-shaped and matches the shape of the output electrode conductive layer, and a front through hole is opened at the front end of the outer frame at the position of the output electrode conductive strip, and the front through hole is connected to the The shape of the output electrode conductive strip is corresponding, the size of the front through hole is larger than the size of the output electrode conductive strip, the output electrode conductive strip is arranged in the front through hole, and its top is higher than the upper surface of the outer frame .

Further, the output electrode conductive strip includes two straight strip-shaped conductive strips, the two straight strip-shaped conductive strips are respectively arranged on the two frame-shaped arms of the output electrode conductive layer, and the front end of the outer frame is located at Two front side through holes are opened on the position of the output electrode conductive strip. The front side through hole is straight and its size is larger than the size of the output electrode conductive strip. The output electrode conductive strip is arranged on the front side. In the through hole, and the top of the output electrode conductive strip is higher than the upper surface of the outer frame.

Further, the output electrode conductive strips include two circular cylindrical conductive strips, the two circular cylindrical conductive strips are arranged on both sides of the frame shape of the output electrode conductive layer, and the front end of the outer frame is located at the output electrode conductive strip. Two circular through holes are opened at the position of the strip, the size of the circular through hole is larger than the size of the output electrode conductive strip, the output electrode conductive strip is set in the circular through hole, and its top is higher than top surface of the frame.

Further, the upper ends of the first electrode conductive strip, the second electrode conductive strip and the output electrode conductive strip are of the same height.

Further, the conductive strips of the first electrodes and/or the conductive strips of the second electrodes are continuously extended.

Further, there is at least one partition in the middle of the first electrode conductive strip and/or the second electrode conductive strip.

Further, the middle of the conductive strip of the output electrode includes at least one partition.

The power module of the present invention uses metal copper strips as module electrodes to lead out, or welded or crimped, which is convenient for installation, and the module area of the conductive strip is small, which can effectively reduce the parasitic inductance of the module.

Description of drawings

Fig. 1 is a schematic front view of Embodiment 1 of a power module provided by the present invention.

Fig. 2 is a schematic perspective view of Embodiment 1 of a power module provided by the present invention.

Fig. 3 is a three-dimensional schematic diagram of an embodiment of a power module provided by the present invention after an outer frame is installed.

Fig. 4 is an exploded view of the power module in Fig. 3 .

Fig. 5 is a schematic perspective view of Embodiment 2 of a power module provided by the present invention.

Fig. 6 is a schematic perspective view of Embodiment 2 of a power module provided by the present invention after an outer frame is installed.

Fig. 7 is an exploded view of the power module in Fig. 6 .

Fig. 8 is a schematic front view of Embodiment 3 of a power module provided by the present invention.

FIG. 9 is a perspective view of the power module in FIG. 8 .

Fig. 10 is a schematic perspective view of Embodiment 4 of a power module provided by the present invention.

Fig. 11 is a schematic front view of Embodiment 5 of a power module provided by the present invention.

FIG. 12 is a perspective view of the power module in FIG. 11 .

Fig. 13 is a perspective view of Embodiment 6 of a power module provided by the present invention.

Fig. 14 is an exploded schematic diagram of a power module composed of several power modules.

FIG. 15 is a schematic structural diagram of a capacitor plate of the power module in FIG. 14 .

Fig. 16 is a schematic structural diagram of the installed power module in Fig. 14 .

Detailed ways

The embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, and are not intended to limit the present invention.

1 and 2, the first preferred embodiment of a power module 100 according to the present invention includes an insulating substrate 1, a first bridge arm conductive layer 2 disposed on the insulating substrate 1, a first bridge arm conductive layer 2 disposed on the first bridge arm A plurality of first bridge arm power chips 3 on the conductive layer 2 (only 5 first bridge arm power chips are shown in Figures 1 and 2), a second bridge arm conductive layer 4 arranged on the insulating substrate 1, and a set A plurality of second bridge arm power chips 5 on the second bridge arm conductive layer 4 (only 5 second bridge arm power chips are shown in Fig. 1 and Fig. 2 ), the first bridge arm disposed on the insulating substrate 1 The electrode conductive layer 6, the first electrode conductive strip 7 arranged on the first bridge arm electrode conductive layer 6, the second electrode conductive strip 70 arranged on the second bridge arm conductive layer 4, the output electrode arranged on the insulating substrate 1 The electrode conductive layer 8 and the output electrode conductive strip 9 arranged on the output electrode conductive layer 8 . Wherein, the plurality of first bridge arm power chips 3 are respectively electrically connected to the first bridge arm electrode conductive layer 6, and the first bridge arm conductive layer 2 is electrically connected to the output electrode conductive layer 8 (in this embodiment, the The first bridge arm conductive layer 2 and the output electrode conductive layer 8 can be integrated, of course, the first bridge arm conductive layer 2 and the output electrode conductive layer 8 in other embodiments can also be made separately), multiple second The bridge arm power chips 5 are electrically connected to the output electrode conductive layer 8 respectively; wherein, the first electrode conductive strip 7 is arranged adjacent to a plurality of first bridge arm power chips 3, and is arranged along the arrangement of the plurality of first bridge arm power chips 3 The path extends, and the second electrode conductive strip 70 is arranged adjacent to the plurality of second bridge arm power chips 5 and extends along the arrangement path of the plurality of second bridge arm power chips 5 .

During operation, the driving current flows from the second electrode conductive strip 70 to the second bridge arm conductive layer 4, then flows to the drain and source of the second bridge arm power chip 5, and is transmitted to the first bridge arm conductive layer 2, Then flow to the output electrode conductive layer 8, and then output through the output electrode conductive strip 9. The freewheeling current is input from the first electrode conductive strip 7, flows through the first bridge arm electrode conductive layer 6 to the source and drain of the first bridge arm power chip 3, and then flows to the first bridge arm conductive layer 2 and The output electrode conductive layer 8 is finally output through the output electrode conductive strip 9 .

In this embodiment, the plurality of second bridge arm power chips 5 are electrically connected to the first bridge arm conductive layer 2 , and then electrically connected to the output electrode conductive layer 8 .

Please continue to refer to Figures 3 and 4, the first electrode conductive strip 7 and the second electrode conductive strip 70 are symmetrically arranged equal-height frame-shaped copper strips, and the opening of the first electrode conductive strip 7 faces the second electrode conductive strip. The first bridge arm power chip 3 , the opening of the second electrode conductive strip 70 faces the second bridge arm power chip 5 . The outer periphery of the insulating substrate 1 is fixedly provided with an outer frame 10, and a side through hole 11 is opened on the side of the outer frame 10 where the first electrode conductive strip 7 and the second electrode conductive strip 70 are located. The side through hole 11 is corresponding to the shape of the first electrode conductive strip 7 and the second electrode conductive strip 70. The size of the side through hole 11 is greater than the size of the first and second electrode conductive strip. The second electrode conductive strips are respectively disposed in the side through holes 11 , and the top ends of the first and second electrode conductive strips are higher than the upper surface of the outer frame 10 .

The output electrode conductive strip 9 is frame-shaped, and matches the shape of the output electrode conductive layer 8, and a front through hole 13 is opened at the front end of the outer frame 10 at the position of the output electrode conductive strip 9, and the front through hole 13 is opened. The hole 13 corresponds to the shape of the output electrode conductive strip 9, the size of the front through hole 13 is greater than the size of the output electrode conductive strip 9, the output electrode conductive strip 9 is arranged in the front through hole 13, and its top higher than the upper surface of the outer frame 10 .

The power module 100 also includes a gate lead-out plate 12, the gate lead-out plate 12 is arranged between the first and second bridge arm power chips and the output electrode conductive layer 8, and the output electrode conductive layer 8 is in the shape of a frame , the gate lead-out plate 12 is located in the frame-shaped opening of the conductive layer 8 of the output electrode.

Please continue to refer to FIG. 5-FIG. 7, which are schematic diagrams of a second preferred embodiment of a power module 100 according to the present invention, which is different from the first embodiment in that the first electrode conductive strip 7 and the second electrode conductive strip 70 are symmetrically arranged straight copper strips of the same height, and the output electrode conductive layer 8 is also a straight copper strip. At this time, the two straight strip-shaped conductive strips are respectively arranged on the two frame-shaped arms of the output electrode conductive layer 8, and two front ends are opened at the position where the front end of the outer frame 10 is located at the position of the output electrode conductive strip 9. Side through hole 14, the front side through hole 14 is a straight strip shape, and its size is larger than the size of the output electrode conductive strip 9, the output electrode conductive strip 9 is arranged in the front side through hole 14, and the The top of the output electrode conductive strip 9 is higher than the upper surface of the outer frame 10 .

Please continue to refer to FIG. 8 and FIG. 9, which are schematic diagrams of the third preferred embodiment of the power module of the present invention. The difference between it and the second preferred embodiment is that the output electrode conductive strip 9 includes Two ring-shaped conductive strips, the two ring-shaped conductive strips are arranged on both sides of the frame shape of the output electrode conductive layer 8, two A circular through hole, the size of the circular through hole is larger than the size of the output electrode conductive strip 9, the output electrode conductive strip 9 is arranged in the circular through hole, and its top is higher than the top of the outer frame 10 surface.

In the present invention, the upper ends of the first electrode conductive strip 7 , the second electrode conductive strip 70 and the output electrode conductive strip 9 are of the same height. In addition, the positive electrode conductive strips 6 , negative electrode conductive strips 7 and output electrode conductive strips 9 can also adopt other similar shapes, mainly straight or columnar structures, to reduce the generation of inductance. Of course, the structure of the outer frame 10 also needs to be changed according to the shape of the conductive strips.

The output electrode conductive strip 9 can also be replaced by a lug, which is directly drawn out from the output electrode conductive layer 8 . The connection between the first electrode conductive strip 7 , the second electrode conductive strip 70 and the output electrode conductive strip 9 and the conductive layer is mainly by crimping, or through conductive glue, or through welding to achieve good conduction performance. The outer frame 10 and the insulating substrate 1 are fixed by gluing or tenon joint.

Please continue to refer to FIG. 10, in the fourth preferred implementation manner of the power module of the present invention, the power chip of the first bridge arm and the power chip of the second bridge arm are both single-tube packaged chips, that is, the first bridge arm power chip Both the power chip of the first bridge arm and the power chip of the second bridge arm are wrapped with a layer of resin, and then lead out pins for electrical connection with external circuits. Figure 10 shows a power module packaged with a single-tube packaged chip. After the packaging is completed, the bridge arm power chip forms a gate 20 , a source 22 and a heat dissipation drain 23 to be electrically connected to other circuits.

Please continue to refer to Figure 11 and Figure 12, in the fifth preferred embodiment of the power module of the present invention, the first electrode conductive strip 7 and the second electrode conductive strip 70 are divided into two sections (other embodiment It can also be divided into multiple sections), so that the thermal stress between the electrode and the insulating substrate can be reduced without affecting the conductivity, and the thermal deformation of the insulating substrate can be reduced. This structure is especially suitable for modules that weld strip electrodes. favorable. In other implementation manners, the first electrode conductive strip 7 and the second electrode conductive strip 70 may extend continuously, and include at least one partition in between.

Please continue to refer to FIG. 13, in the sixth preferred embodiment of the power module of the present invention, the output electrode conductive strip 9 is divided into two sections (in other implementations, it can also be divided into multiple sections), so that Without affecting the conductivity, the thermal stress between the electrode and the insulating substrate is reduced, and the thermal deformation of the insulating substrate is reduced. This structure is especially beneficial to the module of welding strip electrodes. In other embodiments, the output electrode conductive strip 9 may extend continuously, and at least include one partition in the middle.

Please continue to refer to Figures 14 and 15, the power module 200 composed of several power modules 100 includes several power modules 100 (for the motor, the three-phase AC power needs to pass through three power modules to form a three-phase bridge power module group, so only three power modules are shown in Figures 14 and 15), the first capacitor electrode conductive layer 15, the second capacitor electrode conductive layer 16, the filter capacitor 17, the absorption capacitor 18, the radiator 14, the capacitor plate 18, Platen 19. Wherein, the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16 are laminated, and the filter capacitor 17 is electrically connected between the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16, so The absorption capacitor 18 is electrically connected between the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16, the first capacitor electrode conductive layer 15 is electrically connected with the first electrode conductive strip 7, and the second capacitor electrode The conductive layer 16 is electrically connected to the second electrode conductive strip 70 , and the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16 are both disposed on the capacitor plate 18 .

The plurality of power modules 100 are arranged side by side on the radiator 14, and the capacitor plate 18 is fixed to the radiator 14 through a plurality of pressing plates 19, so that the conductive layer 15 of the first capacitor electrode conducts electricity with the first electrode on the power module. The strip 7 is electrically connected, and the second capacitor electrode conductive layer 16 is electrically connected to the second electrode conductive strip 70 on the power module. The number of the first capacitor electrode conductive layer 15 and the second capacitor electrode conductive layer 16 corresponds to the position and the number of positions of the first electrode conductive strip 7 and the second electrode conductive strip 70 on the power module.

Specifically, the pressing plate 19 is fastened through the screw holes on the capacitor plate 18 and the radiator 14 through several screws, and the three power modules of the three-phase power module are firmly fastened through four pressing plates 19 .

Please continue to refer to FIG. 16 , which shows the installed power module 200 . It can be seen that the installed power module 200 has a compact structure and can minimize parasitic inductance.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the description of the present invention and the contents of the accompanying drawings, or directly or indirectly used in other related All technical fields are equally included in the scope of patent protection of the present invention.

Claims (14)

1. A power module, characterized in that it comprises: an insulating substrate, a first bridge arm conductive layer disposed on the insulating substrate, a plurality of first bridge arm power chips disposed on the first bridge arm conductive layer, disposed on The second bridge arm conductive layer on the insulating substrate, a plurality of second bridge arm power chips arranged on the second bridge arm conductive layer, the first bridge arm electrode conductive layer arranged on the insulating substrate, the first bridge arm electrode conductive layer arranged on the first bridge arm The first electrode conductive strip on the electrode conductive layer, the second electrode conductive strip arranged on the second bridge arm conductive layer, the output electrode conductive layer arranged on the insulating substrate, the output electrode conductive strip arranged on the output electrode conductive layer A plurality of first bridge arm power chips are electrically connected to the first bridge arm electrode conductive layer, the first bridge arm conductive layer is electrically connected to the output electrode conductive layer, and a plurality of second bridge arm power chips are respectively electrically conductive to the output electrode Layer electrical connection; wherein, the first electrode conductive strip is adjacent to the multiple first bridge arm power chips and extends along the arrangement path of the multiple first bridge arm power chips, and the second electrode conductive strip is connected to the multiple second bridge arm power chips The arm power chips are arranged adjacent to each other and extend along the arrangement path of the plurality of second bridge arm power chips. 2 . The power module according to claim 1 , wherein the plurality of power chips of the second bridge arm are electrically connected to the conductive layer of the first bridge arm, and are further electrically connected to the conductive layer of the output electrode. 3 . 3. The power module according to claim 1, characterized in that: the first electrode conductive strip and the second electrode conductive strip are frame-shaped copper strips symmetrically arranged at the same height, and the opening of the first electrode conductive strip Facing the power chip of the first bridge arm, the opening of the conductive strip of the second electrode faces the power chip of the second bridge arm. 4. The power module according to any one of claims 1 to 3, wherein an outer frame is fixedly arranged on the periphery of the insulating substrate, and the first electrode conductive strip and the second electrode are located on the side of the outer frame. The position of the second electrode conductive strip is provided with a side through hole, and the shape of the side through hole corresponds to the shape of the first electrode conductive strip and the second electrode conductive strip, and the size of the side through hole is larger than that of the first and second electrode conductive strips. The size of the two electrode conductive strips, the first and second electrode conductive strips are respectively arranged in the side through holes, and the top ends of the first and second electrode conductive strips are higher than the upper surface of the outer frame. 5. The power module according to claim 4, characterized in that: the power module further comprises a gate lead-out plate, and the gate lead-out plate is arranged between the first and second bridge arm power chips and the conductive layer of the output electrode In between, the conductive layer of the output electrode is in the shape of a frame, and the gate lead-out plate is located in the frame-shaped opening of the conductive layer of the output electrode. 6. The power module according to claim 5, wherein the conductive strip of the output electrode is frame-shaped and matches the shape of the conductive layer of the output electrode, and the front end of the outer frame is located at the position of the conductive strip of the output electrode A front through hole is opened on the top, the shape of the front through hole corresponds to the shape of the output electrode conductive strip, the size of the front through hole is larger than the size of the output electrode conductive strip, and the output electrode conductive strip is arranged in the front through hole Inside, and its top is higher than the upper surface of the outer frame. 7 . The power module according to claim 1 , wherein the first electrode conductive strip and the second electrode conductive strip are symmetrically arranged straight copper strips of equal height. 8. The power module according to claim 7, characterized in that: the output electrode conductive strips include two straight strip-shaped conductive strips, and the two straight strip-shaped conductive strips are respectively arranged on the frame-shaped On the two arms, two front-side through holes are opened at the position where the front end of the outer frame is located at the position of the output electrode conductive strip, and the front-side through-holes are straight strip-shaped, and their size is larger than that of the output electrode conductive strip , the output electrode conductive strip is disposed in the front through hole, and the top end of the output electrode conductive strip is higher than the upper surface of the outer frame. 9. The power module according to claim 7, characterized in that: the output electrode conductive strips include two circular cylindrical conductive strips, and the two circular cylindrical conductive strips are arranged on two sides of the frame-shaped conductive layer of the output electrode. On the front side of the outer frame, two circular through holes are opened at the position where the output electrode conductive strip is located. The size of the circular through holes is larger than the size of the output electrode conductive strip, and the output electrode conductive strip is arranged on the In the circular through hole, and its top is higher than the upper surface of the outer frame. 10. The power module according to claim 1, wherein the upper ends of the first electrode conductive strip, the second electrode conductive strip and the output electrode conductive strip are of the same height. 11. The power module according to claim 1, characterized in that: the first bridge arm power chip and the second bridge arm power chip are both single-tube packaged chips, and the first and second bridge arm power chips are both A gate, a source and a heat dissipation drain are formed. 12 . The power module according to claim 1 , wherein the conductive strips of the first electrodes and/or the conductive strips of the second electrodes are continuously extended. 13 . 13. The power module according to claim 12, wherein there is at least one partition in the middle of the first electrode conductive strip and/or the second electrode conductive strip. 14. The power module according to claim 12, characterized in that: the middle of the output electrode conductive strip includes at least one partition.