CN110223928B - 叠瓦互联失效检测设备、系统及方法 - Google Patents
叠瓦互联失效检测设备、系统及方法 Download PDFInfo
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- CN110223928B CN110223928B CN201910363741.9A CN201910363741A CN110223928B CN 110223928 B CN110223928 B CN 110223928B CN 201910363741 A CN201910363741 A CN 201910363741A CN 110223928 B CN110223928 B CN 110223928B
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- shingled
- failure detection
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- interconnect failure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Protection Of Static Devices (AREA)
Abstract
Description
Claims (28)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910363741.9A CN110223928B (zh) | 2019-04-30 | 2019-04-30 | 叠瓦互联失效检测设备、系统及方法 |
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CN201910363741.9A CN110223928B (zh) | 2019-04-30 | 2019-04-30 | 叠瓦互联失效检测设备、系统及方法 |
Publications (2)
Publication Number | Publication Date |
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CN110223928A CN110223928A (zh) | 2019-09-10 |
CN110223928B true CN110223928B (zh) | 2025-03-21 |
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CN201910363741.9A Active CN110223928B (zh) | 2019-04-30 | 2019-04-30 | 叠瓦互联失效检测设备、系统及方法 |
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CN (1) | CN110223928B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111416572B (zh) * | 2020-03-18 | 2021-06-04 | 上海空间电源研究所 | 一种太阳电池组件电性能的判别方法 |
CN111244209A (zh) * | 2020-03-19 | 2020-06-05 | 成都晔凡科技有限公司 | 叠瓦组件及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101958262A (zh) * | 2009-07-16 | 2011-01-26 | 中芯国际集成电路制造(上海)有限公司 | 失效检测方法以及失效检测装置 |
CN210129484U (zh) * | 2019-04-30 | 2020-03-06 | 成都晔凡科技有限公司 | 叠瓦互联失效检测设备及系统 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4500489B2 (ja) * | 2002-12-27 | 2010-07-14 | 株式会社日立製作所 | 溶接方法及び溶接装置 |
JP5898971B2 (ja) * | 2012-01-23 | 2016-04-06 | 新電元工業株式会社 | 半導体試験装置、半導体試験方法及び半導体デバイス |
CN102621437B (zh) * | 2012-03-14 | 2015-05-20 | 上海华力微电子有限公司 | 一种制备主动电压对比度分析样品的方法 |
KR102254026B1 (ko) * | 2014-08-18 | 2021-05-20 | 삼성전자주식회사 | 반도체 패키지의 제조 방법 |
JP6711238B2 (ja) * | 2016-11-01 | 2020-06-17 | トヨタ自動車株式会社 | 電池パックの断線検知システム |
CN109580475B (zh) * | 2017-09-28 | 2021-08-17 | 阿特斯阳光电力集团股份有限公司 | 导电胶粘结力的测试方法 |
CN108335992A (zh) * | 2018-04-11 | 2018-07-27 | 成都晔凡科技有限公司 | 叠瓦电池粘接拉力测试样片及其制备方法和测试方法 |
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2019
- 2019-04-30 CN CN201910363741.9A patent/CN110223928B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101958262A (zh) * | 2009-07-16 | 2011-01-26 | 中芯国际集成电路制造(上海)有限公司 | 失效检测方法以及失效检测装置 |
CN210129484U (zh) * | 2019-04-30 | 2020-03-06 | 成都晔凡科技有限公司 | 叠瓦互联失效检测设备及系统 |
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Application publication date: 20190910 Assignee: TONGWEI SOLAR ENERGY (HEFEI) Co.,Ltd. Assignor: CHENGDU YEFAN SCIENCE AND TECHNOLOGY Co.,Ltd. Contract record no.: X2023990000264 Denomination of invention: Failure detection equipment, system and method for laminated tile interconnection License type: Common License Record date: 20230221 |
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Effective date of registration: 20231206 Address after: 230000 No.888 Changning Avenue, hi tech Zone, Hefei City, Anhui Province Applicant after: TONGWEI SOLAR ENERGY (HEFEI) Co.,Ltd. Address before: No. 505, building 6, Zone D, Tianfu Software Park, No. 599, shijicheng South Road, high tech Zone, Chengdu, Sichuan 610041 Applicant before: CHENGDU YEFAN SCIENCE AND TECHNOLOGY Co.,Ltd. |
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