CN110216051A - Coating process - Google Patents
Coating process Download PDFInfo
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- CN110216051A CN110216051A CN201910536744.8A CN201910536744A CN110216051A CN 110216051 A CN110216051 A CN 110216051A CN 201910536744 A CN201910536744 A CN 201910536744A CN 110216051 A CN110216051 A CN 110216051A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
- B05D1/38—Successively applying liquids or other fluent materials, e.g. without intermediate treatment with intermediate treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
- B05D3/0413—Heating with air
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/50—Multilayers
- B05D7/56—Three layers or more
- B05D7/57—Three layers or more the last layer being a clear coat
- B05D7/576—Three layers or more the last layer being a clear coat each layer being cured, at least partially, separately
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The present invention provides a kind of coating process.Coating process is the following steps are included: provide a substrate, and pre-process to substrate；Determine the preset thickness of the coating of required coating on substrate；Coating is divided into multiple sub- coatings, sub- coating with a thickness of sub- thickness, and the sum of multiple sub- thickness are equal with preset thickness；Substrate is successively coated according to sub- thickness and solidifies and sequentially forms each sub- coating, repeatedly forms the coating of preset thickness after coating on substrate.Coating process of the invention molding coating thickness is uniform, surface is smooth, and it is high by product yield prepared by the coating process, saved material, improved production efficiency.
Description
Technical field
The present invention relates to wiring board processing technique field, in particular to a kind of coating process.
Background technique
Coating ink at least twice is needed in printed wiring board manufacturing, substrate, is once as preventing etching lines
When barrier layer, etching when protection circuit；Another time is the protective layer after route is formed as route.
In the processing procedure of currently manufactured printed wiring board, ink slurry is usually coated on base with about 30~35 μm of thickness
On plate, then dry again to get to the ink taken shape on substrate.But use above-mentioned technique molding ink thickness not
Uniformly, rough, and then influence the quality of printed circuit board.
Summary of the invention
The purpose of the present invention is to provide a kind of coating process, the thickness of the ink of coating is uniform, surface is smooth, to solve
The problems of the prior art.
In order to solve the above technical problems, the present invention provides a kind of coating process, comprising the following steps: a substrate is provided, and
The substrate is pre-processed；Determine the preset thickness of the coating of required coating on the substrate；The coating is divided into more
A sub- coating, the sub- coating with a thickness of sub- thickness, and the sum of multiple described sub- thickness are equal with the preset thickness；According to
The sub- thickness is successively coated the substrate and solidifies and sequentially form each sub- coating, repeatedly described after coating
The coating of the preset thickness is formed on substrate.
It is described that the coating is divided into multiple sub- coatings in a wherein embodiment, the sub- coating with a thickness of son
Thickness, and the sum of multiple described sub- thickness step equal with the preset thickness includes: that the coating is divided into the first son to apply
Layer, the second sub- coating and the sub- coating of third；The first sub- coating is coated on the substrate, the thickness of the first sub- coating
For the first sub- thickness, the second sub- coating is coated in the first coating, the second sub- coating with a thickness of second son
Thickness, the sub- coating of third are coated on the described second sub- coating, the sub- coating of third with a thickness of the sub- thickness of third.
In a wherein embodiment, first son is with a thickness of the 10%~30% of the preset thickness, described second
Son is with a thickness of the 20%~40% of the preset thickness, and third is with a thickness of the 20%~50% of the preset thickness.
In a wherein embodiment, it is described the substrate is successively coated according to the sub- thickness and solidify and according to
Secondary to form each sub- coating, the step of repeatedly forming the coating of the preset thickness after coating includes: respectively according to described the
One sub- thickness modulates the first slurry, and the second sub- thickness modulates the second slurry, and the sub- thickness of third modulates third slurry；It will
First slurry is coated on the substrate according to the described first sub- thickness, and curing molding obtains the described first sub- coating；
Second slurry is coated on the described first sub- coating according to the described second sub- thickness, and curing molding obtains described second
Sub- coating；The third slurry is coated on the described second sub- coating according to the sub- thickness of the third, and curing molding obtains
The sub- coating of third.
In a wherein embodiment, the concentration of first slurry is 150P~180P, the concentration of second slurry
180P~200P, the concentration of the third slurry are 200P~220P；
In a wherein embodiment, the temperature of first slurry is 15~20 DEG C, and the temperature of second slurry is
18~20 DEG C, the temperature of the third slurry is 20~25 degrees Celsius.
In a wherein embodiment, the first sub- curing of coatings form the step of include: with 1m2/ s~3m2/ s speed
It is blown into 1~3min of air-flow that temperature is 65~85 DEG C；The step of second sub- curing of coatings forms includes: with 2m2/ s~4m2/
The speed of s is blown into 1~3min of air-flow that temperature is 65~85 DEG C；The step of third sub- curing of coatings molding include: with
2m2/ s~5m2/ s speed is blown into 1~3min of air-flow that temperature is 65~85 DEG C.
In a wherein embodiment, the step of the first coating curing molding described in temperature be 65 DEG C, described the
Temperature described in the step of temperature described in the step of two curing of coatings form is 70 DEG C, and the third curing of coatings forms is 80
℃。
In a wherein embodiment, the pretreatment of the substrate includes washing and drying.
In a wherein embodiment, the coating is dope layer, ink layer or glue-line.
As shown from the above technical solution, the advantages and positive effects of the present invention are:
Coating is divided into multiple sub- coatings by the coating process in the present invention, by being repeatedly coated with, i.e., by the default thickness of coating
Degree is divided into multiple sub- thickness, carries out substep coating according to sub- thickness, each sub- coating ultimately forms the coating with a thickness of preset thickness.
Therefore, the mobility before the lesser sub- uncured molding of coating of sub- thickness is smaller, and keeps the thickness of the sub- coating on substrate
Unanimously, i.e., thickness is uniform.Mobility is few compared with the flowing that small therefore surface generates, and makes surface smooth.Therefore painting of the invention
Cloth technique molding coating thickness is uniform, surface is smooth, and it is high by product yield prepared by the coating process, save
Material improves production efficiency.
Detailed description of the invention
Fig. 1 is the flow chart of a coating process of the present invention wherein embodiment.
Fig. 2 is the structural schematic diagram of apparatus for coating of the present invention.
Wherein, the reference numerals are as follows: 1, coating apparatus；11, upper coating wheel；12, lower coating wheel；2, slurry supply is set
It is standby；21, slurry tank；22, kinetic pump；23, brushing part；3, transmission equipment；4, apparatus for drying；41, upper aerofoil；42, leeboard；
43, upper air uniform plate；44, lower air uniform plate；5, dredging device.
Specific embodiment
The exemplary embodiment for embodying feature of present invention and advantage will describe in detail in the following description.It should be understood that
The present invention can have various variations in different embodiments, neither depart from the scope of the present invention, and theory therein
Bright and diagram inherently is illustrated as being used, rather than to limit the present invention.
Principle and structure in order to further illustrate the present invention carry out the preferred embodiment of the present invention now in conjunction with attached drawing detailed
It describes in detail bright.
The present invention provides a kind of coating process, suitable for being coated with ink on substrate during print circuit plates making, leads to
It crosses the coating process and obtains taking shape in ink on substrate.The coating process can be applicable in other manufacturing process to substrate
It is coated glue or coating, substrate can also be lithium battery pole slice etc..
The coating process can be used for carrying out one side coating to substrate, it can also be used to carry out double spread to substrate.
The coating process is introduced for being coated with ink on substrate during print circuit plates making below.
The step of coating process, is as follows:
S1, a substrate is provided, and substrate is pre-processed；
S2, the preset thickness for determining the coating of required coating on substrate；
S3, coating is divided into multiple sub- coatings, sub- coating with a thickness of sub- thickness, and the sum of multiple sub- thickness and default thickness
It spends equal；
S4, substrate is successively coated according to sub- thickness and solidifies and sequentially forms each sub- coating, repeatedly coating after
The coating of preset thickness is formed on substrate.
Ink is divided into multiple sub- coatings, is repeatedly coated with, i.e., the preset thickness of ink is divided into multiple sub- thickness, root
Substep coating is carried out according to sub- thickness, each sub- coating ultimately forms the ink with a thickness of preset thickness.It is coated with a sub- thickness first
Ink, drying, obtains sub- coating；It is successively coated with next sub- thickness again, dries, obtains another sub- coating；Continue to repeat previous step
Suddenly, until reaching preset thickness, that is, the coating of ink is completed.
Because ink is divided into multistep coating, therefore the i.e. sub- thickness of the thickness for the ink being coated with every time is smaller, therefore ink is not
Mobility before curing molding is smaller, and is consistent the thickness of the ink on substrate, i.e., thickness is uniform；Mobility is smaller,
Therefore the flowing that surface generates is few, and makes surface smooth.The ink that thickness is uniform, surface is smooth improves printed circuit board
Quality.
Using above-mentioned substep rubbing method, the phenomenon that consent due to mobility is larger can also be reduced.
Further, the coating of next sub- coating is carried out after the coating of sub- coating again after air-drying, therefore each sub- coating
Surfacing, conducive to next sub- coating thickness it is uniform, be successively coated with, therefore the thickness of each sub- coating is all uniform, surface is equal
It is smooth, and then ensure that the thickness of final ink is uniform and surface is smooth.
And it can also be avoided because the speed of air-flow blows out the unformed ink got lodged in hole in hole by air-drying
Consent on substrate.
Present inventor realizes substrate and strictly designing the process conditions of each step in the coating process and oils
The thickness of ink is uniform, surface is smooth, introduces the coating process below by way of each embodiment.
Embodiment 1
For being coated with 30 μm of ink, the method is as follows:
S11, prepare a substrate, which is first pre-processed.
Specifically, it is dried after which being washed.
In other embodiments, substrate is also needed through overpickling or alkali cleaning, using drying after washing.
S12, determine coating ink on the substrate with a thickness of 30 μm.
S13, ink is divided into three sub- coatings, the respectively first sub- coating, the second sub- coating and the sub- coating of third.
Wherein, the first sub- coating with a thickness of 5 μm, the second sub- coating with a thickness of 10 μm, the sub- coating of third with a thickness of
15μm。
S131, the slurry for modulating the first sub- coating make its concentration 150P, and temperature is 20 DEG C, and is coated on substrate
On；
Then with speed 1m2/ s is blown into air-flow 1 minute that temperature is 70 DEG C, forms the first sub- coating；
S132, the slurry for modulating the second sub- coating make its concentration 180P, and temperature is 18 DEG C, and is coated on first
On sub- coating；
Then with speed 2m2/ s is blown into air-flow 3 minutes that temperature is 70 DEG C, forms the second sub- coating；
S133, the slurry for modulating the sub- coating of third make its concentration 200P, and temperature is 25 DEG C, and is coated on second
On sub- coating；
Then with speed 5m2/ s is blown into air-flow 3 minutes that temperature is 80 DEG C, forms the sub- coating of third, that is, completes ink
Coating.
Embodiment 2
For being coated with 30 μm of ink, the method is as follows:
S21, prepare a substrate, which is first pre-processed.
Specifically, it is dried after which being washed.
In other embodiments, substrate is also needed through overpickling or alkali cleaning, using drying after washing.
S22, determine coating ink on the substrate with a thickness of 30 μm.
S23, ink is divided into three sub- coatings, the respectively first sub- coating, the second sub- coating and the sub- coating of third.
Wherein, the first sub- coating with a thickness of 3 μm, the second sub- coating with a thickness of 12 μm, the sub- coating of third with a thickness of
15μm。
S231, the slurry for modulating the first sub- coating make its concentration 180P, and temperature is 15 DEG C, and is coated on substrate
On；
Then with speed 3m2/ s is blown into air-flow 3 minutes that temperature is 65 DEG C, forms the first sub- coating；
S232, the slurry for modulating the second sub- coating make its concentration 200P, and temperature is 20 DEG C, and is coated on first
On sub- coating；
Then with speed 4m2/ s is blown into air-flow 1 minute that temperature is 75 DEG C, forms the second sub- coating；
S233, the slurry for modulating the sub- coating of third make its concentration 220P, and temperature is 25 DEG C, and is coated on second
On sub- coating；
Then with speed 5m2/ s is blown into air-flow 1 minute that temperature is 85 DEG C, forms the sub- coating of third, that is, completes ink
Coating.
Embodiment 3
For being coated with 30 μm of ink, the method is as follows:
S31, prepare a substrate, which is first pre-processed.
Specifically, it is dried after which being washed.
In other embodiments, substrate is also needed through overpickling or alkali cleaning, using drying after washing.
S32, determine coating ink on the substrate with a thickness of 30 μm.
S33, ink is divided into two sub- coatings, the respectively first sub- coating and the second sub- coating.
Wherein, the first sub- coating with a thickness of 15 μm, the second sub- coating with a thickness of 15 μm.
S331, the slurry for modulating the first sub- coating make its concentration 200P, and temperature is 20 DEG C, and is coated on substrate
On；
Then with speed 2m2/ s is blown into air-flow 2 minutes that temperature is 70 DEG C, forms the first sub- coating；
S332, the slurry for modulating the second sub- coating make its concentration 200P, and temperature is 20 DEG C, and is coated on first
On sub- coating；
Then with speed 2m2/ s is blown into air-flow 2 minutes that temperature is 70 DEG C, forms the second sub- coating, that is, completes ink
Coating.
Embodiment 4
For being coated with 30 μm of ink, the method is as follows:
S41, prepare a substrate, which is first pre-processed.
Specifically, it is dried after which being washed.
In other embodiments, substrate is also needed through overpickling or alkali cleaning, using drying after washing.
S42, determine coating ink on the substrate with a thickness of 30 μm.
S43, ink is divided into three sub- coatings, the respectively first sub- coating, the second sub- coating and the sub- coating of third and
Four sub- coatings.
Wherein, the first sub- coating with a thickness of 3 μm, the second sub- coating with a thickness of 6 μm, the sub- coating of third with a thickness of 9 μ
M, the 4th sub- coating with a thickness of 12 μm.
S431, the slurry for modulating the first sub- coating make its concentration 160P, and temperature is 15 DEG C, and is coated on substrate
On；
Then with 3m2/ s speed is blown into air-flow 2 minutes that temperature is 85 DEG C, forms the first sub- coating；
S432, the slurry for modulating the second sub- coating make its concentration 190P, and temperature is 19 DEG C, and is coated on first
On sub- coating；
Then with speed 3m2/ s is blown into air-flow 3 minutes that temperature is 65 DEG C, forms the second sub- coating；
S433, the slurry for modulating the sub- coating of third make its concentration 220P, and temperature is 22 DEG C, and is coated on second
On sub- coating；
Then with speed 2m2/ s is blown into air-flow 2 minutes that temperature is 65 DEG C, forms the sub- coating of third；
S434, the slurry for modulating the 4th sub- coating make its concentration 220P, and temperature is 24 DEG C, and is coated on the 4th
On sub- coating；
Then with speed 4m2/ s is blown into air-flow 2 minutes that temperature is 75 DEG C, forms the 4th sub- coating, that is, completes ink
Coating.
Embodiment 5
For being coated with 35 μm of ink, the method is as follows:
S51, prepare a substrate, which is first pre-processed.
Specifically, it is dried after which being washed.
In other embodiments, substrate is also needed through overpickling or alkali cleaning, using drying after washing.
S52, determine coating ink on the substrate with a thickness of 30 μm.
S53, ink is divided into three sub- coatings, the respectively first sub- coating, the second sub- coating, the sub- coating of third and the 4th
Sub- coating.
Wherein, the first sub- coating with a thickness of 3 μm, the second sub- coating with a thickness of 6 μm, the sub- coating of third with a thickness of 9 μ
M, the 4th sub- coating with a thickness of 12 μm.
S531, the slurry for modulating the first sub- coating make its concentration 160P, and temperature is 16 DEG C, and is coated on substrate
On；
Then with speed 1.5m2/ s is blown into air-flow 1 minute that temperature is 70 DEG C, forms the first sub- coating；
S532, the slurry for modulating the second sub- coating make its concentration 185P, and temperature is 18 DEG C, and is coated on first
On sub- coating；
Then with speed 2.5m2/ s is blown into air-flow 3 minutes that temperature is 85 DEG C, forms the second sub- coating；
S533, the slurry for modulating the sub- coating of third make its concentration 200P, and temperature is 20 DEG C, and is coated on second
On sub- coating；
Then with speed 3m2/ s is blown into air-flow 1 minute that temperature is 75 DEG C, forms the sub- coating of third；
S534, the slurry for modulating the 4th sub- coating make its concentration 220P, and temperature is 22 DEG C, and is coated on third
On sub- coating；
Then with speed 3m2/ s is blown into air-flow 3 minutes that temperature is 85 DEG C, forms the 4th sub- coating, that is, completes ink
Coating.
Comparative example 1
S61, prepare a substrate, which is first pre-processed.
Specifically, it is dried after which being washed.
In other embodiments, substrate is also needed through overpickling or alkali cleaning, using drying after washing.
S62, determine coating ink on the substrate with a thickness of 30 μm.
S63, the ink for being directly coated with 30 μm on the substrate.
Ink, test result such as table 1 are coated by the coating process of embodiment 1-5 and the coating process of comparative example 1
It is shown.
Table 1
| Thickness is uniform | Surface is smooth | |
| Embodiment 1 | Uniformly | It is smooth |
| Embodiment 2 | Uniformly | It is smooth |
| Embodiment 3 | Uniformly | It is smooth |
| Embodiment 4 | Uniformly | It is smooth |
| Embodiment 5 | Uniformly | It is smooth |
| Comparative example 1 | Unevenly | It is rough |
As can be seen from the above table, the ink thickness being coated with using coating process of the invention is uniform, surface is smooth, thus
It ensure that the quality of printed circuit board.
The present invention also provides a kind of apparatus for coating, above-mentioned coating process are realized using the apparatus for coating, still to print electricity
It is coated with for ink in the plate of road.
Referring to Fig.2, the apparatus for coating includes the coating apparatus 11 being set side by side, 2 and of slurry supply equipment being set side by side
The transmission equipment 3 being set between adjacent two coating apparatus 1.
Coating apparatus 1 includes the upper coating wheel 11 and lower coating wheel 12 being arranged in pairs, upper coating wheel 11 and lower coating wheel 12
Short transverse is opposite and is arranged in an axially parallel mode, i.e., the axis of upper coating wheel 11 and the axis of lower coating wheel 12 are positioned at same vertical flat
In face.
There is spacing between upper coating wheel 11 and lower coating wheel 12 and substrate can be accommodated.Upper coating wheel 11 and lower coating wheel
12 can rotate around the axis of its own, and the rotation direction of the two is on the contrary, and can be by the substrate of promotion between the two.This reality
It applies in example, upper coating wheel 11 is rotated clockwise, and lower coating wheel 12 rotates counterclockwise.
Further, the spacing between upper coating wheel 11 and lower coating wheel 12 is adjustable, and can be adapted to the base of different height
Plate.Specifically, the spacing between the upper coating wheel 11 and lower coating wheel 12 in multiple coating apparatus 1 is by the successive suitable of coating process
Sequence is incremented by successively from front to back, to be adapted to the increasing coating of thickness in coating process.
Slurry supply equipment 2 is arranged in a one-to-one correspondence with coating apparatus 1.Slurry supply equipment 2 simultaneously with upper coating wheel 11 and
The lower connection of coating wheel 12 simultaneously provides slurry to the two.Specifically, slurry supply equipment 2 includes slurry tank 21, two brushing parts, 23 and
Kinetic pump 22.Slurry tank 21 is that top has open container, for loading slurry.Kinetic pump 22 connect with slurry tank 21 and is incited somebody to action
Slurry in slurry tank 21 is delivered to brushing part 23.Two brushing parts 23 are connect with slurry tank 21, wherein a brushing part 23 with it is upper
The periphery of coating wheel 11 connects, and slurry is painted on to the periphery of upper coating wheel 11, another brushing part 23 and lower coating wheel 12
Periphery connects, and slurry is painted on to the periphery of lower coating wheel 12.The rotation that upper coating wheel 11 and lower coating wheel 12 pass through itself
And the slurry for being located at periphery is coated on substrate.
It is additionally provided with rabbling mechanism in slurry tank 21, is uniformly mixed slurry.
The slurry tank 21 of the slurry supply equipment 2 is because having opening that can receive from upper coating wheel 11 and lower coating wheel 12
The slurry flowed down, to avoid the waste of slurry.Specifically, the opening is tapered to bottom direction bore by top, can receive
The slurry that top is wandered, moreover it is possible to the slurry in slurry tank 21 be avoided to be open in air.
Transmission equipment 3 is set between two adjacent coating apparatus 1, substrate to be delivered to by a wherein coating apparatus 1
Coating apparatus 1 positioned at 1 downstream of coating apparatus.Specifically, transmission equipment 3 includes the chain of two spaced and parallel settings.Chain
In the ring-type of closure, and two chains move in the same direction.The two sides of substrate and chain contact, and moved with the movement of chain.
Apparatus for coating further includes apparatus for drying 4.The apparatus for drying 4 include the upper aerofoil 41 for being set to the top of transmission equipment 3,
It is set to the leeboard 42 and wind sector of 3 lower section of transmission equipment.Air outlet is offered on upper aerofoil 41 and leeboard 42.Air feed
Mechanism connect with upper aerofoil 41 and leeboard 42 and provides gas source to the two, makes gas source by the outlet air of upper aerofoil 41 and leeboard 42
Mouth sprays to substrate, and carries out to the coating on substrate air-dried.
In the present embodiment, gas source provided by wind sector is air, and is exported after air is heated, and to spray to base
The air of plate has temperature, and then accelerates the drying of coating, and can accelerate the circulation of air.
Further, apparatus for drying 4 further includes upper air uniform plate 43 and lower air uniform plate 44, and upper air uniform plate 43 is set to aerofoil
At 41 air outlet, lower air uniform plate 44 is set at the air outlet of leeboard 42.Upper air uniform plate 43 and lower air uniform plate 44 are equipped with
Multiple through-holes, so that the air-flow of upper aerofoil 41 and leeboard 42 passes through the multiple through-holes and lower air uniform plate 44 of air uniform plate 43 respectively
Multiple through-holes after equably brush on substrate, to make ink on substrate, equably to brush lower thickness more equal for air-flow
It is even, and moisture in ink can be accelerated and evaporated, and then promote ink curing molding on substrate.
Apparatus for coating further includes dredging device 5.Dredging device 5 is arranged in a one-to-one correspondence with coating apparatus 1.Specifically, it dredges
Equipment 5 is set to the downstream of coating apparatus 1, for dredging the through-hole for passing through coating apparatus 1 and being coated on metacoxal plate.The present embodiment
In, dredging device 5 is air knife, is set to the top of substrate conveying direction.
In the present embodiment, the periphery of upper coating wheel and lower coating wheel is coated with ink, i.e., applies to the two-sided of substrate
Cloth.In other embodiments, the list of substrate can also be realized only in upper coating wheel or only in the periphery coating printing ink of lower coating wheel
Face coating.
In other embodiments, the quantity of the coating apparatus 1 of the conveying device can design, example according to the step of coating process
Such as: when coating process is divided into four steps, the quantity of coating apparatus 1 is four, and the quantity of transmission equipment 3 is three, apparatus for drying 4
Quantity is four, and the quantity of dredging device 5 is four.
As shown from the above technical solution, the advantages and positive effects of the present invention are:
Coating is divided into multiple sub- coatings by the coating process in the present invention, by being repeatedly coated with, i.e., by the default thickness of coating
Degree is divided into multiple sub- thickness, carries out substep coating according to sub- thickness, each sub- coating ultimately forms the coating with a thickness of preset thickness.
Therefore, the mobility before the lesser sub- uncured molding of coating of sub- thickness is smaller, and keeps the thickness of the sub- coating on substrate
Unanimously, i.e., thickness is uniform.Mobility is few compared with the flowing that small therefore surface generates, and makes surface smooth.Therefore painting of the invention
Cloth technique molding coating thickness is uniform, surface is smooth, and it is high by product yield prepared by the coating process, save
Material improves production efficiency.
Although describing the present invention with reference to several exemplary embodiments, it is to be understood that, term used be explanation and
Term exemplary, and not restrictive.Due to the present invention can be embodied in a variety of forms without departing from invention spirit or
Essence, it should therefore be appreciated that above embodiment is not limited to any of the foregoing details, and should be defined by the appended claims
The whole change and modification widely explained, therefore fallen into claim or its equivalent scope in spirit and scope all should be with
Attached claim is covered.
Claims (10)
1. a kind of coating process, which comprises the following steps:
One substrate is provided, and the substrate is pre-processed；
Determine the preset thickness of the coating of required coating on the substrate；
The coating is divided into multiple sub- coatings, the sub- coating with a thickness of sub- thickness, and the sum of multiple described sub- thickness with
The preset thickness is equal；
The substrate is successively coated according to the sub- thickness and solidifies and sequentially forms each sub- coating, is repeatedly coated with
Form the coating of the preset thickness on the substrate afterwards.
2. coating process according to claim 1, which is characterized in that described that the coating is divided into multiple sub- coatings, institute
State sub- coating with a thickness of sub- thickness, and the sum of multiple described sub- thickness step equal with the preset thickness includes:
The coating is divided into the first sub- coating, the second sub- coating and the sub- coating of third；The first sub- coating is coated on described
On substrate, the first sub- coating with a thickness of the first sub- thickness, the second sub- coating is coated in the first coating, institute
State the second sub- coating with a thickness of the second sub- thickness, the sub- coating of third is coated on the described second sub- coating, the third
Sub- coating with a thickness of the sub- thickness of third.
3. coating process according to claim 2, which is characterized in that first son is with a thickness of the preset thickness
10%~30%, second son is with a thickness of the 20%~40% of the preset thickness, and third is with a thickness of described default
The 20%~50% of thickness.
4. coating process according to claim 3, which is characterized in that it is described according to the sub- thickness to the substrate successively
The step of being coated and solidify and sequentially form each sub- coating, repeatedly forming the coating of the preset thickness after coating packet
It includes:
The first slurry is modulated according to the described first sub- thickness respectively, the second sub- thickness modulates the second slurry, third
Thickness modulates third slurry；
First slurry is coated on the substrate according to the described first sub- thickness, and curing molding obtains first son
Coating；
Second slurry is coated on the described first sub- coating according to the described second sub- thickness, and curing molding obtain it is described
Second sub- coating；
The third slurry is coated on the described second sub- coating according to the sub- thickness of the third, and curing molding obtain it is described
The sub- coating of third.
5. coating process according to claim 4, which is characterized in that the concentration of first slurry is 150P~180P,
Concentration 180P~200P of second slurry, the concentration of the third slurry are 200P~220P.
6. coating process according to claim 4, which is characterized in that the temperature of first slurry is 15~20 DEG C, institute
The temperature for stating the second slurry is 18~20 DEG C, and the temperature of the third slurry is 20~25 degrees Celsius.
7. coating process according to claim 4, which is characterized in that the step of first sub- curing of coatings forms is wrapped
It includes: with 1m2/ s~3m2/ s speed is blown into 1~3min of air-flow that temperature is 65~85 DEG C；
The step of second sub- curing of coatings forms includes: with 2m2/ s~4m2It is 65~85 DEG C that the speed of/s, which is blown into temperature,
1~3min of air-flow；
The step of sub- curing of coatings of third forms includes: with 2m2/ s~5m2/ s speed is blown into the gas that temperature is 65~85 DEG C
Flow 1~3min.
8. coating process according to claim 7, which is characterized in that described in the step of the first coating curing molding
Temperature described in the step of temperature is 65 DEG C, the second coating curing molding is 70 DEG C, and the third curing of coatings is molding
Temperature described in step is 80 DEG C.
9. coating process according to claim 1, which is characterized in that the pretreatment of the substrate includes washing and drying.
10. coating process according to claim 1, which is characterized in that the coating is dope layer, ink layer or glue-line.
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Cited By (1)
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| TWI728570B (en) * | 2019-11-25 | 2021-05-21 | 易華電子股份有限公司 | Method to reduce the overflow of the ink of a flexible printed circuit board |
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