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CN110213955A - SMT machine mends the disc type carrier of electronic component in bulk - Google Patents

SMT machine mends the disc type carrier of electronic component in bulk Download PDF

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Publication number
CN110213955A
CN110213955A CN201910366673.1A CN201910366673A CN110213955A CN 110213955 A CN110213955 A CN 110213955A CN 201910366673 A CN201910366673 A CN 201910366673A CN 110213955 A CN110213955 A CN 110213955A
Authority
CN
China
Prior art keywords
disc type
type carrier
matrix
ptfe
polytetrafluoroethylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910366673.1A
Other languages
Chinese (zh)
Inventor
王祖政
石军访
孙培霖
张震
王登亚
张宝维
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TIANJIN SUNSHINE LASER TECHNOLOGY Ltd
Original Assignee
TIANJIN SUNSHINE LASER TECHNOLOGY Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TIANJIN SUNSHINE LASER TECHNOLOGY Ltd filed Critical TIANJIN SUNSHINE LASER TECHNOLOGY Ltd
Priority to CN201910366673.1A priority Critical patent/CN110213955A/en
Publication of CN110213955A publication Critical patent/CN110213955A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The present invention is the disc type carrier that SMT machine mends electronic component in bulk, matrix is constituted by compound stone, part slot array arrangement is stored up in body upper surface, store up the interval that 0.1-0.12mm is equipped between part slot length and width and groove depth and institute's memory device outer rim maximum length and width and thickness, matrix surface and storage part rooved face are equipped with antistatic backing, the outer dimension of each dedicated carrier matrix is identical, the quadrangle same position of each matrix is equipped with the identical support column of height of shoulder, and the bottom surface quadrangle of dedicated carrier matrix is equipped with identical blind hole corresponding with support column.This carrier carries out storage part slot design according to the device in bulk of different packing forms, can for the getting of various Mount Devices, store, check, transmit, mount and device goes gold to ward off tin, can be avoided device collide with, pin modification, the damage that electrostatic causes device especially can be effectively prevented.The present invention can simplify and check approval procedure, ensures that subsidy device is accurate and adapt to the outstanding advantages that the full-automatic placement equipment high quality of SMT and high efficiency need.

Description

SMT machine mends the disc type carrier of electronic component in bulk
Technical field
The invention belongs to SMT tools, and the disc type carrier of electronic component in bulk is mended more particularly to a kind of SMT machine.
Background technique
It is almost essential step that machine, which mends electronic component in bulk, in SMT attachment, and reason, which is removed in attachment, falls part It outside further include new device or special-shaped packaging, but the new device such as gull wing lead QFP device and SON, QFN, A kind of dosage of the packagings such as BCC, LGA on PCB is seldom.
In the prior art, it carries out machine benefit for falling part and the seldom electronic component of dosage and must all be mended in strict accordance with SMT For the operation of bulk cargo work flow to avoid mistake material, the benefit bulk cargo work flow includes following basic content: recycling part shape in time At bulk cargo, cleaning, drying, identification, polarity confirmation, mark and store classifiedly in antistatic bag, made according to sorting device Serial number, position list are subsidized, position of the device on placement equipment is searched according to Feedlist and is carried out by work flow Repeated examinations, machine added time also need programmer to modify attachment program.The new device or special-shaped packaging are removed and be not required to It recycles, clean, drying, identifying that outer other operating processes are identical as part is recycled.
Above-mentioned machine mends the prior art of electronic component in bulk, and there are devices getting, transmit and during equipment mounts It easily causes and collides with, pin modification and is not suitable with the defect that the full-automatic placement equipment high efficiency production of SMT needs.
A kind of utility model " small parts pallet applied to SMT attachment line " of notification number CN208572581U is open Following technical scheme: it includes substrate, and tray plate is fixedly installed on substrate, substrate is rectangular substrate, and tray plate is rectangle Tray plate offers multiple locating slots on tray plate, and multiple locating slots are arranged in array on tray plate, and locating slot is rectangle Locating slot, the positioning chamber of matching product is provided in locating slot, and the opposite sides of locating slot is respectively arranged with two limiting sections Part.There is in above-mentioned locating slot opposite the first cell wall and the second cell wall, be provided with groove body on the first cell wall, on the second cell wall It is provided with backing plate.Above-mentioned groove body is cone tank.Above-mentioned backing plate is arc backing plate.Above-mentioned limiting component is limiting slot.
Above-mentioned utility model can effectively improve the production efficiency and accuracy of small parts compared with prior art, but Pallet, which is respectively arranged with two limiting components for the opposite sides of three-decker and locating slot, keeps its structure more complex, simultaneously also There are the insufficient defects of anti-static precautions.
Summary of the invention
The purpose of the present invention is to solve the existing prior arts and aforementioned utility model for mending electronic component in bulk Existing above-mentioned technical problem, and propose a kind of SMT machine and mend the disc type carrier of electronic component in bulk.
The present invention takes following technical scheme to achieve the above object: a kind of SMT machine mends the dedicated of electronic component in bulk Disc type carrier, the storage part slot including array arrangement, is characterized in, the disc type carrier is made of matrix compound stone, stores up part slot Array arrangement is stored up and is equipped between part slot length and width and groove depth and institute's memory device outer rim maximum length and width and thickness in body upper surface The gap of 0.1-0.12mm, matrix surface and storage part rooved face are equipped with polytetrafluoroethylene (PTFE) antistatic backing, each disc type carrier base The outer dimension of body is identical, and the quadrangle symmetric position of each disc type carrier body upper surface is equipped with the identical branch of height of shoulder The bottom surface quadrangle of dagger, each disc type carrier matrix is equipped with blind hole corresponding with support column position, a disc type carrier Each support column respectively corresponds grafting with each blind hole of another disc type carrier and engages, the shoulder of each support column and blind hole periphery Disc type carrier bottom surface engage.
The present invention can also take following technical measures:
The matrix surface edge with polytetrafluoroethylene (PTFE) antistatic backing is equipped with the row, column volume for respectively corresponding storage part slot Number.
The matrix surface with polytetrafluoroethylene (PTFE) antistatic backing is polar equipped with device in each storage part slot is respectively corresponded Mark.
Matrix one end rim surface with polytetrafluoroethylene (PTFE) antistatic backing is equipped with type of device label.
Matrix one end rim surface with polytetrafluoroethylene (PTFE) antistatic backing is equipped with ownership and uses organization mark Board.
Matrix one end rim surface with polytetrafluoroethylene (PTFE) antistatic backing is equipped with bar code or microcode labeling.
Its height of shoulder of the support column is 5-6mm.
Advantages and advantages of the invention are: in bulk device of this disc type carrier according to different packing forms Storage part slot design is carried out, for the getting of various Mount Devices, stores, check, transmit, mount and device goes gold to ward off tin to use, Can be avoided device collide with, pin modification, the damage that electrostatic causes device especially can be effectively prevented, it is more to embody a disk The characteristics of using.Support column and corresponding identical blind hole may be implemented polydisc and stack placement, is conducive to polydisc transmitting transhipment, saves Area occupied.This disc type carrier can mend the attachment of electronic component in bulk with single-deck or polydisc tiling combination for machine.Device Part type, ownership can be corresponded to device in bulk and be carried out quickly selecting carrier using the setting of organization, column row number etc., and And it can accurately check the quantity of device.Part trough rim is stored up along the device polarity mark of setting, it is ensured that device attachment is accurate, Avoid failure caused by device incorrect polarity.The information of device in process of production is convenient in the setting of bar code or microcode mark Change management, so that attachment production information has trackability.This disc type carrier can be used for hand and mend electronics member device in bulk Part.The present invention can simplify and check approval procedure, ensures that subsidy device is accurate and it is high-quality to adapt to the full-automatic placement equipment of SMT The outstanding advantages that amount, high efficiency production need.
Detailed description of the invention
Attached drawing 1 is disc type carrier structure schematic diagram.
Attached drawing 2 is polydisc stacking diagram.
Marked in the figure: 1 matrix, 2 antistatic backings, 3 storage part slots, 4 ownership use organization label, 5 bar code labelings, 6 Support column, 6-1 shoulder, 7 type of device labels, 8 polarity marks, 9 row numbers, 10 column numbers.
Specific embodiment
The present invention is further illustrated below with reference to embodiment and its attached drawing.
As shown in Figure 1, disc type carrier is made of matrix 1 compound stone, 3 array arrangement of part slot is stored up in table on matrix 1 The gap that 0.1-0.12mm is equipped between part slot length and width and groove depth and institute's memory device outer rim maximum length and width and thickness, figure are stored up in face The circular trough that 3 four jiaos of part slot are respectively stored up in 1 is that milling machine processes the grinding undercut for storing up part slot.1 surface of matrix and storage 3 surface of part slot are all provided with There is polytetrafluoroethylene (PTFE) antistatic backing 2.
As shown in Figure 1, 2, the outer dimension of each dedicated carrier matrix 1 of the invention is identical, each dedicated carrier matrix 1 Quadrangle symmetric position is equipped with the identical support column 6 of shoulder 6-1 height, and the bottom surface quadrangle of each dedicated carrier matrix 1 is equipped with and support The corresponding blind hole (not shown) in column position.
The grafting engagement corresponding with each blind hole of another disc type carrier of each support column of one disc type carrier, each The shoulder 6-1 of dagger is engaged with the disc type carrier bottom surface on blind hole periphery.Support column 6 and corresponding identical blind hole 6-1 can To realize that polydisc stacks placement.Height of shoulder 5-6mm.
As shown in Figure 1,1 Surface Edge of the matrix edge with polytetrafluoroethylene (PTFE) antistatic backing 2 of embodiment is equipped with and respectively corresponds Store up the row number 9 and column number 10 of part slot.
As shown in Figure 1,1 surface of matrix with polytetrafluoroethylene (PTFE) antistatic backing 2 of embodiment, which is equipped with, respectively corresponds each storage The polarity mark of the polar polarity mark 8 of device in part slot 3, embodiment uses dot, can also use other labeling form examples Such as number 1.
As shown in Figure 1, the 1 upper end rim surface of matrix with polytetrafluoroethylene (PTFE) antistatic backing 2 of embodiment is equipped with device Type label 7.
As shown in Figure 1, the 1 right end rim surface of matrix with polytetrafluoroethylene (PTFE) antistatic backing 2 of embodiment is equipped with ownership Use organization label 4.
As shown in Figure 1, the 1 right end rim surface of matrix with polytetrafluoroethylene (PTFE) antistatic backing 2 of embodiment is equipped with bar shaped Code labeling 5, which is also possible to microcode labeling.
Metal-oxide-semiconductor class identical with above embodiments structure, crystal oscillator class disc type carrier, can be used the storage of the carrier Part slot 3 carries out gold in device gold-plated surface and wards off tin processing, can be to avoid device surface layer not by tin pollution.Gold is gone to ward off tin processing In the once purged storage part slot 3 for being put back into the carrier again of device afterwards.
It is mended to need the disc type carrier of different type device can tile according to machine and be placed on placement equipment material platform Using.

Claims (7)

1.SMT machine mends the disc type carrier of electronic component in bulk, the storage part slot including array arrangement, it is characterised in that: institute State disc type carrier and be made of matrix compound stone, storage part slot array arrangement in body upper surface, store up part slot length and width and groove depth with The gap of 0.1-0.12mm is equipped between institute's memory device outer rim maximum length and width and thickness, matrix surface and storage part rooved face are equipped with The outer dimension of polytetrafluoroethylene (PTFE) antistatic backing, each disc type carrier matrix is identical, each disc type carrier body upper surface Quadrangle symmetric position be equipped with the identical support column of height of shoulder, the bottom surface quadrangle of each disc type carrier matrix is equipped with and support The corresponding blind hole in column position, the grafting corresponding with each blind hole of another disc type carrier of each support column of a disc type carrier connect It closes, the shoulder of each support column is engaged with the disc type carrier bottom surface on blind hole periphery respectively.
2. disc type carrier according to claim 1, it is characterised in that: described with polytetrafluoroethylene (PTFE) antistatic backing Matrix surface edge is equipped with the row, column number for respectively corresponding storage part slot.
3. disc type carrier according to claim 1, it is characterised in that: described with polytetrafluoroethylene (PTFE) antistatic backing Equipped with respectively corresponding the polar mark of device in each storage part slot.
4. disc type carrier according to claim 1, it is characterised in that: described with polytetrafluoroethylene (PTFE) antistatic backing Matrix one end rim surface is equipped with type of device label.
5. disc type carrier according to claim 1, it is characterised in that: described with polytetrafluoroethylene (PTFE) antistatic backing Matrix one end rim surface is equipped with ownership and uses organization label.
6. disc type carrier according to claim 1, it is characterised in that: described with polytetrafluoroethylene (PTFE) antistatic backing Matrix one end rim surface is equipped with bar code or microcode labeling.
7. disc type carrier according to claim 1, it is characterised in that: its height of shoulder of the support column is 5-6mm.
CN201910366673.1A 2019-05-05 2019-05-05 SMT machine mends the disc type carrier of electronic component in bulk Pending CN110213955A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910366673.1A CN110213955A (en) 2019-05-05 2019-05-05 SMT machine mends the disc type carrier of electronic component in bulk

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910366673.1A CN110213955A (en) 2019-05-05 2019-05-05 SMT machine mends the disc type carrier of electronic component in bulk

Publications (1)

Publication Number Publication Date
CN110213955A true CN110213955A (en) 2019-09-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910366673.1A Pending CN110213955A (en) 2019-05-05 2019-05-05 SMT machine mends the disc type carrier of electronic component in bulk

Country Status (1)

Country Link
CN (1) CN110213955A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521993A (en) * 1991-07-17 1993-01-29 Matsushita Electric Ind Co Ltd Tray-part feeding apparatus
CN1767759A (en) * 2004-08-13 2006-05-03 Accu-装配公司 Gathering data relating to electrical components picked from stacked trays
CN202713800U (en) * 2012-06-20 2013-01-30 北京卫星制造厂 Bulk material automatic chip-mounting tool used for spacecraft electronic products
CN203618234U (en) * 2013-07-19 2014-05-28 中国航天科工集团第三研究院第八三五七研究所 Scattered-material feeding device for SMT production process
CN204681694U (en) * 2015-04-07 2015-09-30 刘建文 A kind of paster tray for circuit board
CN109516228A (en) * 2018-12-27 2019-03-26 江西佳时特精密机械有限责任公司 Scroll plate flexible processing unit automatic stacking mechanism
CN211090482U (en) * 2019-05-05 2020-07-24 天津光韵达光电科技有限公司 Special disc type carrier for supplementing bulk electronic components by SMT machine

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521993A (en) * 1991-07-17 1993-01-29 Matsushita Electric Ind Co Ltd Tray-part feeding apparatus
CN1767759A (en) * 2004-08-13 2006-05-03 Accu-装配公司 Gathering data relating to electrical components picked from stacked trays
CN202713800U (en) * 2012-06-20 2013-01-30 北京卫星制造厂 Bulk material automatic chip-mounting tool used for spacecraft electronic products
CN203618234U (en) * 2013-07-19 2014-05-28 中国航天科工集团第三研究院第八三五七研究所 Scattered-material feeding device for SMT production process
CN204681694U (en) * 2015-04-07 2015-09-30 刘建文 A kind of paster tray for circuit board
CN109516228A (en) * 2018-12-27 2019-03-26 江西佳时特精密机械有限责任公司 Scroll plate flexible processing unit automatic stacking mechanism
CN211090482U (en) * 2019-05-05 2020-07-24 天津光韵达光电科技有限公司 Special disc type carrier for supplementing bulk electronic components by SMT machine

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