CN110205657A - A kind of electrolytic copper foil plate electroplating experiments device - Google Patents
A kind of electrolytic copper foil plate electroplating experiments device Download PDFInfo
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- CN110205657A CN110205657A CN201910554501.7A CN201910554501A CN110205657A CN 110205657 A CN110205657 A CN 110205657A CN 201910554501 A CN201910554501 A CN 201910554501A CN 110205657 A CN110205657 A CN 110205657A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 239000011889 copper foil Substances 0.000 title claims abstract description 28
- 238000009713 electroplating Methods 0.000 title claims abstract description 22
- 238000002474 experimental method Methods 0.000 title claims description 13
- 239000003792 electrolyte Substances 0.000 claims abstract description 44
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 238000003860 storage Methods 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000011148 porous material Substances 0.000 claims description 5
- 238000005868 electrolysis reaction Methods 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract 1
- 239000010936 titanium Substances 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 239000011888 foil Substances 0.000 description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 210000001331 nose Anatomy 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
本发明公开了一种电解铜箔平板电镀实验装置，其包括电解槽，储液槽、电解液循环系统、温度控制系统和电源；在电解槽内置有阴极钛板和阳极板；电源是一个低电压高电流的整流器；电解液循环系统由储液槽与电解槽之间连接的磁力泵，阀门，流量计和管路、电解槽的两侧内的溢流板、溢流板和位于电解槽底板的溢流孔等组成；温度控制系统是由温度控制器和与其连接的放置在储液槽下端的加热棒组成；所述阳极板和阴极板平行并可调节距离。通过此平板电镀装置，可以很好的模拟电解铜箔生产线的情况，而且各工艺参数方便调节，易于分析每个参数对铜箔性能的影响。
The invention discloses an electrolytic copper foil plate electroplating experimental device, which comprises an electrolytic tank, a liquid storage tank, an electrolyte circulation system, a temperature control system and a power supply; a cathode titanium plate and an anode plate are built in the electrolytic tank; the power supply is a low Rectifier with high voltage and high current; the electrolyte circulation system consists of a magnetic pump connected between the liquid storage tank and the electrolytic tank, valves, flow meters and pipelines, overflow plates on both sides of the electrolytic tank, overflow plates and located in the electrolytic tank The bottom plate is composed of an overflow hole and the like; the temperature control system is composed of a temperature controller and a heating rod connected to it and placed at the lower end of the liquid storage tank; the anode plate and the cathode plate are parallel and the distance can be adjusted. Through this flat plate electroplating device, the situation of the electrolytic copper foil production line can be well simulated, and each process parameter is convenient to adjust, and it is easy to analyze the influence of each parameter on the performance of copper foil.
Description
技术领域technical field
本发明涉及一种电镀装置，尤其涉及一种电解铜箔的平板电镀实验装置。The invention relates to an electroplating device, in particular to a flat plate electroplating experimental device for electrolytic copper foil.
背景技术Background technique
目前世界上大多数国家生产电解铜箔采用辊式连续电解方法，该方法是以硫酸铜溶液为电解液，在以不溶性材料为阳极、恒速旋转的阴极辊为阴极的电解槽中进行电解，溶液中的铜沉积到阴极辊筒的表面形成铜箔，再连续地从阴极辊上剥离，经水洗、干燥、卷取，制成原箔，然后根据使用要求对原箔表面进行处理。而其中生箔制造的工艺流程包括溶铜造液、过滤净化，调整温度等，而后电解液加入添加剂进入生箔机，通过生箔机电沉积生箔，电解液中铜浓度降低，酸浓度升高，贫铜高酸电解液重新回到溶铜槽，进行溶铜造液。如果采用工厂的设备进行一些工艺参数的探究性实验，如电流密度，铜离子浓度，添加剂等，会造成资源的很大浪费。At present, most countries in the world use the roll-type continuous electrolysis method to produce electrolytic copper foil. This method uses copper sulfate solution as the electrolyte, and performs electrolysis in an electrolytic cell with an insoluble material as the anode and a cathode roller that rotates at a constant speed as the cathode. The copper in the solution is deposited on the surface of the cathode roller to form a copper foil, and then it is continuously peeled off from the cathode roller, washed, dried, and coiled to make the original foil, and then the surface of the original foil is treated according to the use requirements. Among them, the raw foil manufacturing process includes dissolving copper to make liquid, filtering and purifying, adjusting temperature, etc., then adding additives to the electrolyte and entering the raw foil machine, and electromechanically depositing raw foil through raw foil, the copper concentration in the electrolyte is reduced, and the acid concentration is increased. , and the copper-poor high-acid electrolyte returns to the copper-dissolving tank for copper-dissolving to make liquid. If the factory equipment is used to conduct exploratory experiments on some process parameters, such as current density, copper ion concentration, additives, etc., it will cause a great waste of resources.
一般实验室采用的实验装置是把阴极板和阳极板调整好间距后放入电解液，选择较小的工作面积，控制一定的电流开始镀铜。实验易操作，但是缺少电解液的循环，无法控制电解液的流速，不能很好的模拟实际铜箔生产线的情况；而且制备的铜箔面积小，无法根据国标制备拉伸试样。The experimental device used in the general laboratory is to adjust the distance between the cathode plate and the anode plate and put them into the electrolyte, select a smaller working area, and control a certain current to start copper plating. The experiment is easy to operate, but lacks the circulation of the electrolyte, cannot control the flow rate of the electrolyte, and cannot simulate the situation of the actual copper foil production line well; moreover, the area of the prepared copper foil is small, and it is impossible to prepare tensile samples according to the national standard.
发明内容Contents of the invention
本发明的目的，在于设计一种电解铜箔的平板电镀实验装置，克服现有实验装置无法模拟实际电解铜箔生产线的问题，较为方便的进行一些探究性实验。The purpose of the present invention is to design a flat plate electroplating experimental device for electrolytic copper foil, to overcome the problem that the existing experimental device cannot simulate the actual electrolytic copper foil production line, and to conduct some exploratory experiments more conveniently.
为实现上述发明目的，本发明的技术方案如下：For realizing the above-mentioned purpose of the invention, the technical scheme of the present invention is as follows:
一种电解铜箔平板电镀实验装置，其包括电解槽，储液槽、电解液循环系统、温度控制系统和电源；在电解槽内置有平行放置的阴极板和阳极板，阴极板和阳极板间的距离能够调节；电源优选为低电压高电流的整流器；电解液循环系统包括储液槽与电解槽之间连接的磁力泵、阀门、流量计和管路；温度控制系统包括温度控制器和与其连接的放置在储液槽底板的加热棒、以及与温度控制器相连置于电解槽中的温度传感器。An electrolytic copper foil flat plate electroplating experimental device, which includes an electrolytic tank, a liquid storage tank, an electrolyte circulation system, a temperature control system and a power supply; The distance can be adjusted; the power supply is preferably a rectifier with low voltage and high current; the electrolyte circulation system includes a magnetic pump, valves, flow meters and pipelines connected between the liquid storage tank and the electrolytic tank; the temperature control system includes a temperature controller and its The connected heating rod placed on the bottom plate of the liquid storage tank, and the temperature sensor connected with the temperature controller placed in the electrolytic cell.
电解槽的两侧内，还设置有溢流板，且溢流板的高度低于电解槽的深度，且溢流板和与其平行的电解槽侧板之间留有空隙。在电解槽的底板、位于溢流板与电解槽侧板之间空隙处，设置有溢流孔，且溢流孔为电解槽底板上的通孔，溢出的电解液经过该溢流孔直接流入到位于电解槽底板正下方的储液槽内；同时，位于两溢流板之间的电解槽底板上设置了若干细孔，且细孔与电解液循环系统中管路联通。On both sides of the electrolytic cell, overflow plates are also arranged, and the height of the overflow plate is lower than the depth of the electrolytic cell, and there is a gap between the overflow plate and the side plates of the electrolytic cell parallel to it. On the bottom plate of the electrolytic cell, in the gap between the overflow plate and the side plate of the electrolytic cell, an overflow hole is provided, and the overflow hole is a through hole on the bottom plate of the electrolytic cell, and the overflowing electrolyte flows directly through the overflow hole. into the liquid storage tank located directly below the bottom plate of the electrolytic cell; at the same time, a number of fine holes are set on the bottom plate of the electrolytic cell between the two overflow plates, and the fine holes communicate with the pipeline in the electrolyte circulation system.
所述电解槽通过与其底板螺纹孔相匹配的宝塔接头与电解液循环系统中的流量计出口管路相连；所述储液槽通过设置于侧板的螺纹孔及与该螺纹孔相匹配的宝塔接头与电解液循环系统的阀门出口管路相连。The electrolytic cell is connected to the outlet pipeline of the flow meter in the electrolyte circulation system through a pagoda joint matching the threaded hole on the bottom plate; The joint is connected with the valve outlet pipeline of the electrolyte circulation system.
优选的，电解槽内平行设置有若干槽位，用于平行放置阴极板和阳极板，所设置的槽位多于两个，通过将阴极板和阳极板放置在不同的槽位，调节阴极板和阳极板之间的距离，相邻的两个槽位距离为10mm。Preferably, several slot positions are arranged in parallel in the electrolytic cell for placing the cathode plate and the anode plate in parallel, and there are more than two slot positions, and the cathode plate and the anode plate are adjusted by placing the cathode plate and the anode plate in different slot positions. The distance between the anode plate and the anode plate, the distance between two adjacent slots is 10mm.
优选的，通过在电解槽上部设置丝杆调节阴极板和阳极板的距离。Preferably, the distance between the cathode plate and the anode plate is adjusted by setting a screw rod on the upper part of the electrolytic cell.
所述的电解槽的为上端开口的扁长方体容器，阴极板工作尺寸满足铜箔测试要求。The electrolytic cell is a flat cuboid container with an open upper end, and the working size of the cathode plate meets the copper foil test requirements.
所述的电源，正极和负极输出端通过铜鼻与相应的阳极板和阴极板相连。The positive and negative output terminals of the power supply are connected to the corresponding anode plate and cathode plate through copper noses.
所述的电解槽和储液槽采用亚克力板粘接而成，所述循环系统的管路采用硅橡胶软管，阀门，磁力泵和流量计均采用耐腐蚀材质。The electrolytic tank and the liquid storage tank are bonded by acrylic plates, the pipelines of the circulation system are made of silicon rubber hoses, and the valves, magnetic pumps and flowmeters are all made of corrosion-resistant materials.
采用以上技术方案，本发明可达到以下效果：1.储液槽和电解槽的电解液实现循环，可通过阀门和流量计调节流速，促进铜离子的扩散，减少浓差极化。2.阴极板和阳极板平行布置并可调节距离，实验时两个极板固定不动，电解液通过底板的一排细孔进入电解槽，在电解槽中平行、高速、单向流动，溢流板保证了电解槽里的电解液液面稳定，可以模拟电解铜箔生产线的情况。3.温度控制系统可以保证电解液的温度保持在一定范围内，防止硫酸铜结晶。4.通过此装置制备的铜箔面积相对较大，可以进行各种测试。By adopting the above technical scheme, the present invention can achieve the following effects: 1. The electrolyte in the liquid storage tank and the electrolytic tank can be circulated, and the flow rate can be adjusted through valves and flowmeters to promote the diffusion of copper ions and reduce concentration polarization. 2. The cathode plate and the anode plate are arranged in parallel and the distance can be adjusted. During the experiment, the two plates are fixed, and the electrolyte enters the electrolytic cell through a row of fine holes in the bottom plate, and flows in parallel, high-speed, and one-way in the electrolytic cell. The flow plate ensures the stability of the electrolyte liquid level in the electrolytic cell, which can simulate the situation of the electrolytic copper foil production line. 3. The temperature control system can ensure that the temperature of the electrolyte is kept within a certain range to prevent the crystallization of copper sulfate. 4. The area of copper foil prepared by this device is relatively large, and various tests can be carried out.
附图说明Description of drawings
图1为本发明电解铜箔平板电镀装置的整体结构示意图。Fig. 1 is a schematic diagram of the overall structure of the electrolytic copper foil flat plate electroplating device of the present invention.
图2为本发明电解铜箔平板电镀装置的电解槽示意图。Fig. 2 is a schematic diagram of the electrolytic tank of the electrolytic copper foil plate electroplating device of the present invention.
图3为本发明电解铜箔平板电镀装置的电解槽底板示意图。Fig. 3 is a schematic diagram of the bottom plate of the electrolytic tank of the electrolytic copper foil plate electroplating device of the present invention.
图4为本发明电解铜箔平板电镀装置的储液槽底板示意图。Fig. 4 is a schematic diagram of the bottom plate of the liquid storage tank of the electrolytic copper foil flat plate electroplating device of the present invention.
其中各附图中1为丝杆；2为电解槽；3为流量计；4为阀门；5为磁力泵；6为温度控制器；7为加热棒；8为储液槽；9为溢流板；10为阴极槽；11为阳极槽；12为电解槽侧板；13为溢流孔；14为细孔；15为螺纹孔；16为加热棒孔; 17为温度传感器。Among them, 1 is the screw rod; 2 is the electrolytic tank; 3 is the flow meter; 4 is the valve; 5 is the magnetic pump; 6 is the temperature controller; 7 is the heating rod; 8 is the liquid storage tank; 10 is the cathode tank; 11 is the anode tank; 12 is the side plate of the electrolytic tank; 13 is the overflow hole; 14 is the fine hole; 15 is the threaded hole; 16 is the heating rod hole; 17 is the temperature sensor.
具体实施方式Detailed ways
下面将结合附图对本发明作进一步详述。The present invention will be described in further detail below in conjunction with the accompanying drawings.
如附图1为本发明提供的电解铜箔平板电镀实验装置的整体结构示意图，该平板电镀实验装置包括电解槽2，储液槽8、电解液循环系统、温度控制系统和电源。其中，电解槽2中平行放置阴极板和阳极板，阴极板和阳极板间的距离可调节；电解液循环系统包括储液槽与电解槽之间连接的流量计3、阀门4、磁力泵5和管路；温度控制系统包括温度控制器6和与其连接的放置在储液槽底板的加热棒7，置于电解槽2并与温度控制器6连接的温度传感器17,，温度控制系统用以监控电解槽2中电解液的温度，再根据该温度的反馈通过温度控制器6控制加热棒7对储液槽8中电解液进行加热；电源优选为低电压高电流的整流器，电源的正极和负极输出端通过铜鼻与电解槽中的阳极板和阴极板相连，打开电源即可进行平板电镀。Figure 1 is a schematic diagram of the overall structure of the electrolytic copper foil flat plate electroplating experimental device provided by the present invention. The flat plate electroplating experimental device includes an electrolytic tank 2, a liquid storage tank 8, an electrolyte circulation system, a temperature control system and a power supply. Among them, the cathode plate and the anode plate are placed in parallel in the electrolytic cell 2, and the distance between the negative plate and the anode plate can be adjusted; the electrolyte circulation system includes a flow meter 3 connected between the liquid storage tank and the electrolytic cell, a valve 4, and a magnetic pump 5 and pipeline; the temperature control system includes a temperature controller 6 and a heating rod 7 connected to it placed on the bottom plate of the liquid storage tank, a temperature sensor 17 placed in the electrolytic cell 2 and connected with the temperature controller 6, the temperature control system is used for Monitor the temperature of the electrolyte in the electrolytic tank 2, and then control the heating rod 7 through the temperature controller 6 to heat the electrolyte in the liquid storage tank 8 according to the feedback of the temperature; the power supply is preferably a rectifier with low voltage and high current, the positive pole of the power supply and The negative output terminal is connected to the anode plate and the cathode plate in the electrolytic cell through the copper nose, and the flat plate electroplating can be carried out when the power is turned on.
如附图2，为电解槽的结构示意图。如图所示，一种优选方案：电解槽内设置有阴极槽10和阳极槽11，用于平行放置阴极板和阳极板，所设置的阴极槽和阳极槽分别不少于两个，通过将阴极板和阳极板放置在不同的槽位，调节阴极板和阳极板之间的距离；另一种优选方案，如附图1中：通过在电解槽上部设置丝杆1调节阴极板和阳极板的距离。如附图2所示，电解槽的两侧内，还设置有溢流板9，且溢流板的高度低于电解槽的深度，且溢流板9与电解槽的侧板12之间留有空隙。如附图3，在电解槽的底板、位于溢流板9与电解槽的侧板12之间空隙处，设置有溢流孔13，且溢流孔13为电解槽底板上的通孔；同时，位于两溢流板9之间的电解槽的底板上设置了若干细孔14，且细孔14与电解液循环系统中管路联通；在电解槽的底板，还设置有用以连接电解槽和电解液循环系统中管路的螺纹孔15。如附图4为储液槽底板示意图，储液槽底板设置有用以放置加热棒7的加热棒孔16。As shown in accompanying drawing 2, it is a structural schematic diagram of an electrolyzer. As shown in the figure, a preferred solution: a cathode tank 10 and an anode tank 11 are arranged in the electrolytic cell for placing the cathode plate and the anode plate in parallel, and there are no less than two cathode tanks and anode tanks respectively. The cathode plate and the anode plate are placed in different slots to adjust the distance between the cathode plate and the anode plate; another preferred solution, as in accompanying drawing 1: adjust the cathode plate and the anode plate by setting the screw rod 1 on the top of the electrolytic cell the distance. As shown in accompanying drawing 2, in the both sides of electrolyzer, also be provided with overflow plate 9, and the height of overflow plate is lower than the depth of electrolyzer, and leave between overflow plate 9 and the side plate 12 of electrolyzer There are gaps. As accompanying drawing 3, on the bottom plate of electrolyzer, be positioned at the gap between overflow plate 9 and the side plate 12 of electrolyzer, be provided with overflow hole 13, and overflow hole 13 is the through hole on the bottom plate of electrolyzer; Simultaneously , the bottom plate of the electrolytic cell between the two overflow plates 9 is provided with some fine holes 14, and the fine holes 14 are communicated with the pipeline in the electrolyte circulation system; The threaded hole 15 of the pipeline in the electrolyte circulation system. Figure 4 is a schematic diagram of the bottom plate of the liquid storage tank, the bottom plate of the liquid storage tank is provided with a heating rod hole 16 for placing the heating rod 7 .
工作时，当阴极板和阳极板放置好后，在储液槽8里加入电解液，打开温度控制器6开关，加热棒7开始对储液槽内的电解液加热。打开磁力泵5，电解液从储液槽8通过阀门4，磁力泵5和流量计3、管路，再通过电解槽底板的细孔14进入到电解槽2，保证电解液在电解槽中平行、高速、单向流动；温度控制器6通过置于电解槽的温度传感器17，监测电解槽2中电解液的温度，以此控制加热棒7的开关，保证电解液的温度在一个合适的范围内。电解槽内的电解液液面到达一定高度后，电解液溢出溢流板9，进入侧板12与溢流板9之间的空隙，再通过电解槽底板的溢流孔13直接流入到位于电解槽底板正下方的储液槽8中，实现电解液的循环。During work, when the cathode plate and the anode plate are placed, electrolyte is added in the liquid storage tank 8, the switch of the temperature controller 6 is turned on, and the heating rod 7 starts to heat the electrolyte in the liquid storage tank. Turn on the magnetic pump 5, the electrolyte passes through the valve 4 from the liquid storage tank 8, the magnetic pump 5 and the flow meter 3, the pipeline, and then enters the electrolytic cell 2 through the pores 14 on the bottom plate of the electrolytic cell to ensure that the electrolyte is parallel in the electrolytic cell , high-speed, one-way flow; the temperature controller 6 monitors the temperature of the electrolyte in the electrolytic tank 2 through the temperature sensor 17 placed in the electrolytic tank, so as to control the switch of the heating rod 7 to ensure that the temperature of the electrolyte is in a suitable range Inside. After the liquid level of the electrolyte in the electrolytic tank reaches a certain height, the electrolyte overflows the overflow plate 9, enters the gap between the side plate 12 and the overflow plate 9, and then directly flows into the electrolytic tank through the overflow hole 13 on the bottom plate of the electrolytic tank. In the liquid storage tank 8 directly below the bottom plate of the tank, the circulation of the electrolyte is realized.
Claims (7)
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Application publication date: 20190906 |