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CN110205043B - Cutting adhesive tape for processing semiconductor material and preparation method thereof - Google Patents

Cutting adhesive tape for processing semiconductor material and preparation method thereof Download PDF

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Publication number
CN110205043B
CN110205043B CN201910547608.9A CN201910547608A CN110205043B CN 110205043 B CN110205043 B CN 110205043B CN 201910547608 A CN201910547608 A CN 201910547608A CN 110205043 B CN110205043 B CN 110205043B
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component
acid
parts
substance
initiator
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CN110205043A (en
Inventor
柯跃虎
曾庆明
诸葛锋
宋亦健
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Guangdong Shuocheng Technology Co.,Ltd.
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Guangdong Shuocheng Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention relates to the field of adhesive tapes, in particular to a cutting adhesive tape for processing a semiconductor material and a preparation method thereof. The invention provides a cutting adhesive tape for processing a semiconductor material, which comprises a base material layer and an adhesive layer, wherein the preparation raw materials of the adhesive layer comprise 80-100 parts of olefine acid substances and 0.1-10 parts of a cross-linking agent; 0.05-0.1 part of initiator, 30-50 parts of polyisocyanate, 80-120 parts of solvent and 5-15 parts of expanded microspheres.

Description

Cutting adhesive tape for processing semiconductor material and preparation method thereof
Technical Field
The invention relates to the field of adhesive tapes, in particular to a cutting adhesive tape for processing a semiconductor material and a preparation method thereof.
Background
In recent years, semiconductor components and electronic components have become smaller and smaller during the assembly of circuit boards, various smart phones and tablet computers, and devices have become very fragile, so that the processing and transportation of ultra-thin and fragile parts (such as chips, etc.) have become more and more difficult. How to temporarily fix and protect the fragile tiny devices so that the fragile tiny devices are not polluted and damaged in the processing and transporting processes and can be easily removed after the processing is finished becomes one of important subjects with industrial application values. Emulsion-type PSA (pressure sensitive adhesive) has the advantages of safe use, low cost, environmental protection, etc., and thus relatively many research reports have been reported on the preparation of protective tapes using the same. Most of common protective tapes (such as protective tapes for surfaces of aluminum windows, stainless steel, plastic shells and the like) on the market are prepared by emulsion type PSA; however, emulsion PSA has the disadvantages of poor high temperature resistance, poor water resistance, and high energy consumption, and such products have a residual adhesive phenomenon after being peeled off by heat, so solvent PSA is still preferred for protective tapes for some special fields (such as flexible circuit boards, lithium batteries, and chip protection).
In the practical application process, the initial adhesion and the peeling strength are low, and the falling is easy to occur; when the temperature rises or the ultraviolet radiation curing process is carried out, the pressure sensitive agent is difficult to fall off easily, and the adhered substance cannot be polluted; meanwhile, the adhesive has certain viscosity with the pressure sensitive agent, and the problems of object cracking and splashing caused by loosening and falling of the adhesive are avoided.
Disclosure of Invention
In order to solve the technical problems, the invention provides a dicing tape for processing a semiconductor material, which comprises a substrate layer and an adhesive layer, wherein the adhesive layer is prepared from 80-100 parts of olefinic acid substances and 0.1-10 parts of a cross-linking agent; 0.05-0.1 part of initiator, 30-50 parts of polyisocyanate, 80-120 parts of solvent and 5-15 parts of expanded microspheres.
In a preferred embodiment of the present invention, the first component of the olefinic acid is selected from any one or more of ethyl 3-ethoxyacrylate, 4-methyl-4-pentenoic acid, and ethyl 2-hydroxymethylacrylate.
As a preferable technical scheme of the invention, the second component of the olefinic acid substance is selected from any one or a combination of more of 2-butyl octyl methacrylate, isooctyl acrylate and tert-butyl 3-hydroxy-4-pentenoate.
In a preferred embodiment of the present invention, the third component of the olefinic acid is selected from any one or more of acrylic acid, itaconic acid, hydroxyethyl acrylate, methacrylic acid, hydroxyethyl methacrylate, maleic acid, and N-methylol acrylamide.
As a preferable technical scheme of the invention, the weight ratio of the first component, the second component and the third component is (2-5): 1: (1-3).
As a preferable technical scheme of the invention, the particle size of the expanded microsphere is 10-40 μm.
As a preferred technical scheme of the invention, the particle size of the expanded microsphere comprises 10-20 μm and 30-40 μm.
As a preferable technical scheme of the invention, the weight ratio of the expanded microspheres with the particle size of 10-20 microns to the expanded microspheres with the particle size of 30-40 microns is (3-6): 1.
as a preferable technical scheme of the invention, the thickness of the base material is 60-80 μm, and the thickness of the adhesive layer is 20-40 μm.
The second aspect of the present invention provides a method for preparing the dicing tape for processing semiconductor materials, comprising the steps of:
(1) stirring a first component, a second component, a solvent and an A component of an initiator in the olefinic acid substances according to weight parts to obtain a substance I;
(2) vacuumizing the polyisocyanate, the third component in the olefine acid substances and the catalyst until no bubbles exist; then placing the mixture in a reactor at 75-85 ℃ for reaction for 5-10 h; to obtain a substance II;
(3) mixing the substance I, the substance II, the cross-linking agent, the thermal expansion microspheres and the initiator B, and uniformly stirring to obtain an adhesive composition;
(4) coating the adhesive composition on the surface of a base material, and drying for 2-8 min at 70-120 ℃.
Compared with the prior art, the cutting adhesive tape provided by the invention has better initial adhesion, is easy to realize the falling of a processing device in the heating or ultraviolet curing process, and simultaneously can not lead the object to be bonded to be loosened and fall off to cause the object to crack and splash, and can not cause pollution to the object to be bonded.
Detailed Description
The technical features of the technical solutions provided by the present invention will be further clearly and completely described below with reference to the specific embodiments, and it should be apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one element or action from another element or action without necessarily requiring or implying any actual such relationship or order between such elements or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, or composition that comprises a list of elements does not include those elements but may include other elements not expressly listed or inherent to such process, method, or composition.
The words "preferred", "preferably", "more preferred", and the like, in the present invention, refer to embodiments of the invention that may provide certain benefits, under certain circumstances. However, other embodiments may be preferred, under the same or other circumstances. Furthermore, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.
It should be understood that other than in any operating examples, or where otherwise indicated, all numbers expressing, for example, quantities of ingredients used in the specification and claims are to be understood as being modified in all instances by the term "about".
In order to solve the technical problems, the invention provides a dicing tape for processing a semiconductor material, which comprises a substrate layer and an adhesive layer, wherein the adhesive layer is prepared from 80-100 parts of olefinic acid substances and 0.1-10 parts of a cross-linking agent; 0.05-0.1 part of initiator, 30-50 parts of polyisocyanate, 80-120 parts of solvent and 5-15 parts of expanded microspheres; preferably, the raw materials for preparing the adhesive layer comprise 90 parts of olefine acid substances and 4.5 parts of cross-linking agents; 0.055 part of initiator, 40 parts of polyisocyanate, 100 parts of solvent and 10 parts of expanded microspheres.
In one embodiment, the olefinic acid species includes a first component, a second component, a third component; preferably, the weight ratio of the first component to the second component to the third component is (2-5): 1: (1-3); more preferably, the weight ratio of the first component, the second component and the third component is 3.5: 1: 2.
in one embodiment, the first component of the olefinic acid species is selected from any one or combination of ethyl 3-ethoxyacrylate, 4-methyl-4-pentenoic acid, ethyl 2-hydroxymethylacrylate; preferably, the first component of the olefinic acid species is 3-ethoxyethyl acrylate and 4-methyl-4-pentenoic acid; further preferably, the weight ratio of the 3-ethoxy ethyl acrylate to the 4-methyl-4-pentenoic acid is (0.5-1.5): 1; more preferably, the weight ratio of ethyl 3-ethoxyacrylate to 4-methyl-4-pentenoic acid is 1: 1.
in one embodiment, the second component of the olefinic acid species is selected from the group consisting of any one or more of 2-butyloctyl methacrylate, isooctyl acrylate, tert-butyl 3-hydroxy-4-pentenoate; preferably, the second component of the olefinic acid is tert-butyl 3-hydroxy-4-pentenoate.
In one embodiment, the third component of the olefinic acid is selected from the group consisting of any one or more of acrylic acid, itaconic acid, hydroxyethyl acrylate, methacrylic acid, hydroxyethyl methacrylate, maleic acid, N-methylol acrylamide; preferably, the third component of the olefinic acid is hydroxyethyl acrylate and hydroxyethyl methacrylate; further preferably, the weight ratio of hydroxyethyl acrylate to hydroxyethyl methacrylate is 1: (0.5 to 1.5); more preferably, the weight ratio of hydroxyethyl acrylate to hydroxyethyl methacrylate is 1: 1.
experiments show that by adopting a specific olefine acid raw material, better pickup of a device can be realized under the conditions of heating condition and ultraviolet irradiation, and the problems of falling, loosening and pollution of the device are avoided, and probably because a straight-chain and branched-chain combined olefine acid adhesive system is adopted, a claw-shaped structure is contained at the tail end of the 3-hydroxy-4-tert-butyl pentenoate with a branched-chain structure while the glue system is spread on the surface of the device and has the functions of molecular level in the process of adhering the glue system and a semiconductor device, a certain space resistance is formed, the movement of molecules without dead points is avoided, and the cracking in the cutting process is avoided; in addition, due to proper molecular level resistance, the cross-linking and the tightness of molecules are limited to a certain extent in the heating and ultraviolet curing processes, so that the problems of looseness and falling off are avoided while the good pickup performance of the device is realized.
In one embodiment, the cross-linking agent is selected from any one or combination of more of isocyanate-based curing agents, amine-based curing agents, amino resin curing agents, aziridine-based curing agents; preferably, the cross-linking agent is an isocyanate curing agent; further preferably, the crosslinking agent is selected from any one or a combination of more of 1, 3-phenylene diisocyanate, 4,4' -diphenyl diisocyanate, 1, 4-phenylene diisocyanate, 4,4' -diphenylmethane diisocyanate, 2, 4-toluene diisocyanate, 2, 6-toluene diisocyanate, 4,4' -toluidine diisocyanate, 2,4, 6-triisocyanate toluene, 1,3, 5-triisocyanate benzene, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1, 2-propylene diisocyanate, 2, 3-butylene diisocyanate, 1, 3-butylene diisocyanate, dodecamethylene diisocyanate, and 2,4, 4-trimethylhexamethylene diisocyanate; more preferably, the crosslinking agent is 1, 4-benzenediisocyanate.
In one embodiment, the initiator comprises a component a and a component B, preferably in a weight ratio of 1: (2-4); more preferably, the weight ratio of the component a to the component B is 1: 3.
in one embodiment, the a-component initiator is benzoyl peroxide.
In one embodiment, the B-component initiator is selected from the group consisting of benzophenone, benzoylbenzoic acid, 3 ' -dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, α -hydroxycyclohexylphenylketone, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α -hydroxy- α, α ' -dimethylacetophenone, methoxyacetophenone, 2-dimethoxy-2-phenylacetophenone, 2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl ] -2-morpholinoacetone-1, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2-ethylthioxanthone, benzoylbenzoic acid, 3 ' -dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, methoxyacetophenone, 2-dimethoxy-2-phenylacetophenone, 2-diethoxyacetophenone, 2, 2-isopropylthioxanthone, 2-dodecylthioxanthone, 2, 4-dichlorothioxanthone, 2, 4-dimethylthioxanthone; preferably, the initiator of the B component is benzoylbenzoic acid.
In one embodiment, the polyisocyanate is selected from any one or combination of 2, 4-toluene diisocyanate, 2, 6-toluene diisocyanate, 1, 3-xylene diisocyanate, 1, 4-xylene diisocyanate, diphenylmethane 4, 4-diisocyanate, trimethylhexamethylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate; preferably, the polyisocyanate is 2, 4-toluene diisocyanate with 2, 6-toluene diisocyanate; further preferably, the weight ratio of 2, 4-toluene diisocyanate to 2, 6-toluene diisocyanate is 1: (0.8 to 1.2); more preferably, the weight ratio of 2, 4-toluene diisocyanate to 2, 6-toluene diisocyanate is 1: 1.
in one embodiment, the solvent is selected from any one or a combination of acetone, cyclohexanone, ethyl acetate, butyl acetate, butanone, methanol, ethanol, propanol, isopropanol, isobutanol, n-butanol, methyl isobutyl ketone, isophorone, toluene, xylene, propylene glycol methyl ether, dipropylene glycol methyl ether; preferably ethyl acetate.
In one embodiment, the expanded microspheres have a particle size of 10 to 40 μm; preferably, the particle size of the expanded microsphere comprises 10-20 μm and 30-40 μm; further preferably, the weight ratio of the expanded microspheres with the particle size of 10-20 microns to the expanded microspheres with the particle size of 30-40 microns is (3-6): 1; more preferably, the weight ratio of the expanded microspheres with the particle size of 10-20 microns to the expanded microspheres with the particle size of 30-40 microns is 4.5: 1.
in one embodiment, the weight ratio of expanded microspheres to olefinic acid species is 1: (0.08-0.2).
Experiments show that the initial adhesion can be improved by adopting the expanded microspheres, the expanded powder is formed by wrapping liquid hydrocarbon by an airtight polymer shell, after the expanded powder is added, the adhesive surface has a buffering effect due to the microspheres in the colloid, and the adhesion of the adhesive and the surface of a device is firmer under the promotion action of the polymer of the shell, so the initial adhesion of the product is slightly improved; when the content of the expanded microspheres is too much, the initial adhesion of the system is reduced, the content is possibly large, the contact area of the adhesive and the surface of a device is reduced, and the adhesive force is reduced;
the problem of looseness and falling of devices can be further avoided by adopting two specific specifications, a compact microsphere surface is formed in the expansion process of microspheres with inconsistent particle sizes, the variation range of cohesive force is effectively reduced, and the contact area of the adhesive and the surface of the device is relatively increased by the microspheres with small specifications, so that looseness and falling caused by too small bonding force in the heating process are avoided.
In one embodiment, the thickness of the base material is 60 to 80 μm, and the thickness of the adhesive layer is 20 to 40 μm; preferably, the thickness of the base material is 70-75 μm, and the thickness of the adhesive layer is 25-30 μm.
In one embodiment, the substrate is selected from the group consisting of polyvinyl chloride, polyethylene terephthalate, acetic acid-vinyl acetate copolymers, ethylene-acrylic acid-acrylate films, ethylene-ethyl acrylate copolymers, polyethylene, polypropylene, propylene-based copolymers, ethylene-acrylic acid copolymers, and combinations of any one or more of ethylene- (meth) acrylic acid copolymers, ethylene- (meth) acrylic acid- (meth) acrylate copolymers; preferably polyvinyl chloride.
The second aspect of the present invention provides a method for preparing the dicing tape for processing a semiconductor material, comprising the steps of:
(1) stirring a first component, a second component, a solvent and an A component of an initiator in the olefinic acid substances according to parts by weight to obtain a substance I;
(2) vacuumizing the polyisocyanate, the third component in the olefine acid substances and the catalyst until no bubbles exist; then placing the mixture in a reactor at 75-85 ℃ for reaction for 5-10 h; to obtain a substance II;
(3) mixing the substance I, the substance II, the cross-linking agent, the thermal expansion microspheres and the initiator B, and uniformly stirring to obtain an adhesive composition;
(4) coating the adhesive composition on the surface of a base material, and drying for 2-8 min at 70-120 ℃.
Preferably, the preparation method of the dicing tape for processing semiconductor materials comprises the following steps:
(1) stirring a first component, a second component, a solvent and an A component of an initiator in the olefinic acid substances according to parts by weight to obtain a substance I;
(2) vacuumizing the polyisocyanate, the third component in the olefine acid substances and the catalyst until no bubbles exist; then placing the mixture in a reactor at 80 ℃ for reaction for 8 h; to obtain a substance II;
(3) mixing the substance I, the substance II, the cross-linking agent, the thermal expansion microspheres and the initiator B, and uniformly stirring to obtain an adhesive composition;
(4) coating the adhesive composition on the surface of a base material, and drying for 5min at 80 ℃.
Example 1
The embodiment 1 of the invention provides a cutting adhesive tape for processing a semiconductor material, which comprises a substrate layer and an adhesive layer, wherein the preparation raw materials of the adhesive layer comprise 90 parts of olefinic acid substances and 4.5 parts of a cross-linking agent; 0.055 part of initiator, 40 parts of polyisocyanate, 100 parts of solvent and 10 parts of expanded microspheres;
the olefine acid substance comprises a first component, a second component and a third component, wherein the weight ratio of the first component to the second component to the third component is 3.5: 1: 2;
the first component is 3-ethoxy ethyl acrylate and 4-methyl-4-pentenoic acid, and the weight ratio of the 3-ethoxy ethyl acrylate to the 4-methyl-4-pentenoic acid is 1: 1;
the second component is 3-hydroxy-4-pentenoic acid tert-butyl ester;
the third component of the olefine acid substance is hydroxyethyl acrylate and hydroxyethyl methacrylate, and the weight ratio of the hydroxyethyl acrylate to the hydroxyethyl methacrylate is 1: 1;
the cross-linking agent is 1, 4-benzene diisocyanate;
the initiator comprises a component A and a component B, wherein the weight ratio of the component A to the component B is 1: 3;
the initiator of the component A is benzoyl peroxide, and the initiator of the component B is benzoyl benzoic acid;
the polyisocyanate is 2, 4-toluene diisocyanate and 2, 6-toluene diisocyanate, and the weight ratio of the 2, 4-toluene diisocyanate to the 2, 6-toluene diisocyanate is 1: 1;
the solvent is ethyl acetate;
the particle size of the expanded microspheres is 10-20 microns to 30-40 microns, and the weight ratio of the expanded microspheres of 10-20 microns to 30-40 microns is 4.5: 1;
the thickness of the base material is 70-75 μm, and the thickness of the adhesive layer is 25-30 μm;
the base material is polyvinyl chloride;
the preparation method of the dicing tape for processing the semiconductor material comprises the following steps:
(1) stirring a first component, a second component, a solvent and an A component of an initiator in the olefinic acid substances according to parts by weight to obtain a substance I;
(2) vacuumizing the polyisocyanate, the third component in the olefine acid substances and the catalyst until no bubbles exist; then placing the mixture in a reactor at 80 ℃ for reaction for 8 h; to obtain a substance II;
(3) mixing the substance I, the substance II, the cross-linking agent, the thermal expansion microspheres and the initiator B, and uniformly stirring to obtain an adhesive composition;
(4) coating the adhesive composition on the surface of a base material, and drying for 5min at 80 ℃.
Example 2
The embodiment 2 of the invention provides a cutting adhesive tape for processing a semiconductor material, which comprises a substrate layer and an adhesive layer, wherein the preparation raw materials of the adhesive layer comprise 100 parts of olefinic acid substances and 10 parts of a cross-linking agent; 0.1 part of initiator, 50 parts of polyisocyanate, 120 parts of solvent and 15 parts of expanded microspheres;
the olefine acid substance comprises a first component, a second component and a third component, wherein the weight ratio of the first component to the second component to the third component is 5: 1: 3;
the first component is 3-ethoxy ethyl acrylate and 4-methyl-4-pentenoic acid, and the weight ratio of the 3-ethoxy ethyl acrylate to the 4-methyl-4-pentenoic acid is 1.5: 1;
the second component is 3-hydroxy-4-pentenoic acid tert-butyl ester;
the third component of the olefine acid substance is hydroxyethyl acrylate and hydroxyethyl methacrylate, and the weight ratio of the hydroxyethyl acrylate to the hydroxyethyl methacrylate is 1.5: 1;
the cross-linking agent is 1, 4-benzene diisocyanate;
the initiator comprises a component A and a component B, wherein the weight ratio of the component A to the component B is 1: 4;
the initiator of the component A is benzoyl peroxide, and the initiator of the component B is benzoyl benzoic acid;
the polyisocyanate is 2, 4-toluene diisocyanate and 2, 6-toluene diisocyanate, and the weight ratio of the 2, 4-toluene diisocyanate to the 2, 6-toluene diisocyanate is 1: 1.2;
the solvent is ethyl acetate;
the particle size of the expanded microspheres comprises 10-20 microns and 30-40 microns, and the weight ratio of the expanded microspheres of 10-20 microns to 30-40 microns is 6: 1;
the thickness of the base material is 70-75 μm, and the thickness of the adhesive layer is 25-30 μm;
the base material is polyvinyl chloride;
the preparation method of the dicing tape for processing the semiconductor material comprises the following steps:
(1) stirring a first component, a second component, a solvent and an A component of an initiator in the olefinic acid substances according to parts by weight to obtain a substance I;
(2) vacuumizing the polyisocyanate, the third component in the olefine acid substances and the catalyst until no bubbles exist; then placing the mixture in a reactor at 80 ℃ for reaction for 8 h; to obtain a substance II;
(3) mixing the substance I, the substance II, the cross-linking agent, the thermal expansion microspheres and the initiator B, and uniformly stirring to obtain an adhesive composition;
(4) coating the adhesive composition on the surface of a base material, and drying for 5min at 80 ℃.
Example 3
The embodiment 3 of the invention provides a cutting adhesive tape for processing a semiconductor material, which comprises a substrate layer and an adhesive layer, wherein the preparation raw materials of the adhesive layer comprise 80 parts of olefinic acid substances and 0.1 part of a cross-linking agent; 0.05 part of initiator, 30 parts of polyisocyanate, 80 parts of solvent and 7 parts of expanded microspheres;
the olefine acid substance comprises a first component, a second component and a third component, wherein the weight ratio of the first component to the second component to the third component is 2: 1: 1;
the first component is 3-ethoxy ethyl acrylate and 4-methyl-4-pentenoic acid, and the weight ratio of the 3-ethoxy ethyl acrylate to the 4-methyl-4-pentenoic acid is 0.5: 1;
the second component is 3-hydroxy-4-pentenoic acid tert-butyl ester;
the third component of the olefine acid substance is hydroxyethyl acrylate and hydroxyethyl methacrylate, and the weight ratio of the hydroxyethyl acrylate to the hydroxyethyl methacrylate is 0.5: 1;
the cross-linking agent is 1, 4-benzene diisocyanate;
the initiator comprises a component A and a component B, wherein the weight ratio of the component A to the component B is 1: 2;
the initiator of the component A is benzoyl peroxide, and the initiator of the component B is benzoyl benzoic acid;
the polyisocyanate is 2, 4-toluene diisocyanate and 2, 6-toluene diisocyanate, and the weight ratio of the 2, 4-toluene diisocyanate to the 2, 6-toluene diisocyanate is 1: 0.8;
the solvent is ethyl acetate;
the particle size of the expanded microspheres comprises 10-20 microns and 30-40 microns, and the weight ratio of the 10-20 microns to the 30-40 microns of the expanded microspheres is 3: 1;
the thickness of the base material is 70-75 μm, and the thickness of the adhesive layer is 25-30 μm;
the base material is polyvinyl chloride;
the preparation method of the dicing tape for processing the semiconductor material comprises the following steps:
(1) stirring a first component, a second component, a solvent and an A component of an initiator in the olefinic acid substances according to parts by weight to obtain a substance I;
(2) vacuumizing the polyisocyanate, the third component in the olefine acid substances and the catalyst until no bubbles exist; then placing the mixture in a reactor at 80 ℃ for reaction for 8 h; to obtain a substance II;
(3) mixing the substance I, the substance II, the cross-linking agent, the thermal expansion microspheres and the initiator B, and uniformly stirring to obtain an adhesive composition;
(4) coating the adhesive composition on the surface of a base material, and drying for 5min at 80 ℃.
Example 4
Example 4 of the present invention provides a dicing tape for semiconductor material processing, which is similar to example 1 in specific embodiment except that the second component content of the olefinic acid-based substance is 0.
Example 5
Example 5 of the present invention provides a dicing tape for semiconductor material processing, which is similar to example 1 in specific embodiment except that the content of the first component of the olefinic acid-based substance is 0.
Example 6
Example 6 of the present invention provides a dicing tape for semiconductor material processing, which is similar to example 1 in specific embodiment except that the content of the third component of the olefinic acid-based substance is 0.
Example 7
Embodiment 7 of the present invention provides a dicing tape for processing a semiconductor material, which is the same as embodiment 1 except that the content of expanded microspheres having a particle size of 10 to 20 μm is 0.
Example 8
Embodiment 8 of the present invention provides a dicing tape for processing a semiconductor material, which is the same as embodiment 1 in specific embodiment except that the content of 30 to 40 μm expanded microspheres is 0.
Example 9
Embodiment 9 of the present invention provides a dicing tape for processing a semiconductor material, which is similar to embodiment 1 in specific implementation, and is different in that the raw materials for preparing the adhesive layer include 90 parts of olefinic acid substances and 4.5 parts of a cross-linking agent; 0.055 part of initiator, 40 parts of polyisocyanate, 100 parts of solvent and 30 parts of expanded microspheres.
Performance testing
1. Initial adhesion: according to the GB/T4852-2002 standard, a slope rolling ball method is adopted for measurement;
2. pick-up and spalling: the obtained adhesive tape was attached to a silicon wafer having a diameter of 8 inches × a thickness of 0.15mm, on which a dummy circuit pattern was formed, and an annular frame; after 15min of bonding, heating for 5min at 85 ℃, and then performing cutting and picking up each process, wherein the conditions of the cutting process refer to the following steps: DAD341 manufactured by DISCO; cutting blade NBC-ZH 205O-27 HEEE manufactured by DISCO; the shape of the cutting blade is 55.56mm of outer diameter, 35 μm of edge width and 19.05mm of inner diameter; the rotating speed of the cutting blade is 40000 rpm; the feeding speed of the cutting blade is 100 mm/s; cutting to a size of 1.0mm square; the cutting amount in the cutting adhesive tape is 30 mu m; the temperature of cutting water is 25 ℃; cutting water amount is 1.0 liter/minute;
a. pickup property: the pick-up property was evaluated according to the following criteria, based on the proportion of semiconductor chips that could be picked up in the pick-up process.
Excellent (excellent) the success rate of picking up the chip is more than 95 percent;
good, the chip pick-up success rate is 80% or more and less than 95%;
x (not): the chip pick-up success rate is less than 80%.
b. And (3) cracking: for chipping, 50 picked chips were randomly selected, and 4 sides of the back surface of the chip were observed and observed with a microscope at 500 magnifications, and the size of the maximum defect toward the center was evaluated according to the following criteria:
excellent that the size of the defect is less than 25 μm;
good, defect size is 25 μm or more and less than 50 μm;
(not acceptable) the size of the defect is 50 μm or more.
c. Pollution property: attaching the protective film to the mirror surface of the silicon wafer, irradiating with a high-pressure mercury lamp for 20 minutes at a rate of 300mJ/cm2After the UV light, the dicing tape was peeled off. The number of particles having a particle diameter of 0.28 μm or more remaining on the mirror surface (adhesion surface) of the silicon wafer was measured by a particle counter.
Excellent that the number of the particles is 500 or less;
good: 501 or more and less than 2000 particles;
(not): 2000 or more particles.
d. Loosening the chip: the chip looseness was evaluated based on the following criteria, based on the proportion of the semiconductor chips adjacent to the semiconductor chip to be picked up in the picking-up process, which were loosened by the impact of the pin lifting.
Excellent that the chip looseness is less than 1%;
good, chip loosening of 1% or more and less than 3%;
(not less) chip loosening of 3% or more.
The initial adhesion, pick-up, looseness and contamination were measured according to the above methods for examples 1 to 3 and examples 7 to 9, and the results are shown in table 1.
TABLE 1
Initial adhesion (ball) Pick-up property Polluting property Looseness
Example 1 15 ◎ ◎ ◎
Example 2 14 ◎ ◎ ◎
Example 3 14 ◎ ◎ ◎
Example 7 11 × ○ ○
Example 8 9 ○ ○ ×
Example 9 8 ○ ○ ×
3. The bar of the test method 2 is replaced by the bar which is heated to 85 ℃ and is irradiated by a high-pressure mercury lamp at 300mJ/cm2The ultraviolet ray "of (1) to (6) was measured for chipping property, pick-up property, looseness and contamination property, and the test results are shown in Table 2.
TABLE 2
Chipping property Pick-up property Polluting property Looseness
Example 1 ◎ ◎ ◎ ◎
Example 2 ◎ ◎ ◎ ◎
Example 3 ◎ ◎ ◎ ◎
Example 4 × ○ ○ ○
Example 5 ○ × ○ ×
Example 6 ○ × ○ ○
The experimental result shows that the cutting adhesive tape provided by the invention has better initial adhesion, is easy to realize the falling of a processing device in the heating or ultraviolet curing process, and simultaneously can not lead the bonded object to loosen and fall off to cause object cracking and splashing, and can not cause pollution to the bonded object.
The foregoing examples are merely illustrative and serve to explain some of the features of the method of the present invention. The appended claims are intended to claim as broad a scope as is contemplated, and the examples presented herein are merely illustrative of selected implementations in accordance with all possible combinations of examples. Accordingly, it is applicants' intention that the appended claims are not to be limited by the choice of examples illustrating features of the invention. Also, where numerical ranges are used in the claims, subranges therein are included, and variations in these ranges are also to be construed as possible being covered by the appended claims.

Claims (6)

1. A cutting adhesive tape for processing a semiconductor material is characterized by comprising a base material layer and an adhesive layer, wherein the preparation raw materials of the adhesive layer comprise 80-100 parts of olefine acid substances and 0.1-10 parts of a cross-linking agent; 0.05-0.1 part of initiator, 30-50 parts of polyisocyanate, 80-120 parts of solvent and 5-15 parts of expanded microspheres;
the olefinic acid substance comprises a first component, a second component and a third component;
wherein the first component is selected from any one or more of 3-ethoxy ethyl acrylate, 4-methyl-4-pentenoic acid and 2-hydroxymethyl ethyl acrylate;
the second component of the olefinic acid substance is selected from any one or combination of more of 2-butyl octyl methacrylate, isooctyl acrylate and tert-butyl 3-hydroxy-4-pentenoate;
the third component of the olefinic acid substance is selected from any one or combination of acrylic acid, itaconic acid, hydroxyethyl acrylate, methacrylic acid, hydroxyethyl methacrylate, maleic acid and N-hydroxymethyl acrylamide; the weight ratio of the first component to the second component to the third component is (2-5): 1: (1-3);
the initiator comprises a component A and a component B, wherein the weight ratio of the component A to the component B is 1: (2-4); the initiator of the component A is benzoyl peroxide; the B component initiator is selected from benzophenone, benzoylbenzoic acid, 3 '-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, alpha-hydroxycyclohexylphenylketone, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, alpha-hydroxy-alpha, alpha' -dimethylacetophenone, methoxyacetophenone, 2-dimethoxy-2-phenylacetophenone, 2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl ] -2-morpholinoacetone-1, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, and mixtures thereof, 2-dodecyl thioxanthone, 2, 4-dichlorothioxanthone, 2, 4-dimethylthioxanthone.
2. The dicing tape for processing a semiconductor material according to claim 1, wherein the expanded microspheres have a particle size of 10 to 40 μm.
3. The dicing tape for processing semiconductor material according to claim 2, wherein the expanded beads have a particle size of 10 to 20 μm and 30 to 40 μm.
4. The dicing tape for processing a semiconductor material according to claim 3, wherein the expanded beads of 10 to 20 μm and 30 to 40 μm are in a weight ratio of (3 to 6): 1.
5. the dicing tape for semiconductor material processing according to claim 1, wherein the base material has a thickness of 60 to 80 μm, and the adhesive layer has a thickness of 20 to 40 μm.
6. The method for preparing the dicing tape for semiconductor material processing according to any one of claims 1 to 5, characterized by comprising the steps of:
(1) stirring a first component, a second component, a solvent and an A component of an initiator in the olefinic acid substances according to parts by weight to obtain a substance I;
(2) vacuumizing the polyisocyanate, the third component in the olefine acid substances and the catalyst until no bubbles exist; then placing the mixture in a reactor at 75-85 ℃ for reaction for 5-10 h; to obtain a substance II;
(3) mixing the substance I, the substance II, the cross-linking agent, the thermal expansion microspheres and the initiator B, and uniformly stirring to obtain an adhesive composition;
(4) coating the adhesive composition on the surface of a base material, and drying for 2-8 min at 70-120 ℃.
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CN104130723A (en) * 2013-07-19 2014-11-05 日东电工株式会社 Thermal-release adhesive tape and cutting method of electronic component
CN104130726A (en) * 2013-07-19 2014-11-05 日东电工株式会社 Re-peeling adhesive composition, adhesive sheet, and processing method for cutting electronic component
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