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CN110196343B - Probe assembly and its probe structure - Google Patents

Probe assembly and its probe structure Download PDF

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Publication number
CN110196343B
CN110196343B CN201810159408.1A CN201810159408A CN110196343B CN 110196343 B CN110196343 B CN 110196343B CN 201810159408 A CN201810159408 A CN 201810159408A CN 110196343 B CN110196343 B CN 110196343B
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section
contact
connection
probe
probe structure
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CN110196343A (en
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谢开杰
邓元玱
李建伟
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Chunghwa Precision Test Technology Co Ltd
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Chunghwa Precision Test Technology Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects

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Abstract

本发明公开一种探针组件及其探针结构。探针结构包括一第一基部、一第二基部、一连接部以及一接触部。第一基部包括一第一接触段以及一连接于第一接触段的第一连接段。第一接触段具有一第一抵靠部以及一连接于第一抵靠部的第一侧端。第二基部包括一第二接触段、一第二连接段以及一电性连接于第二接触段与第二连接段之间的被动元件。第二接触段具有一第二抵靠部以及一连接于第二抵靠部的第二侧端。第一基部的第一连接段以及第二基部的第二连接段连接于连接部。接触部连接于连接部。借此,本发明能通过被动元件的设置,而改善电源完整性。

Figure 201810159408

The invention discloses a probe assembly and a probe structure thereof. The probe structure includes a first base portion, a second base portion, a connecting portion and a contact portion. The first base includes a first contact segment and a first connection segment connected to the first contact segment. The first contact segment has a first abutting portion and a first side end connected to the first abutting portion. The second base includes a second contact segment, a second connection segment, and a passive element electrically connected between the second contact segment and the second connection segment. The second contact segment has a second abutting portion and a second side end connected to the second abutting portion. The first connecting section of the first base and the second connecting section of the second base are connected to the connecting section. The contact portion is connected to the connection portion. Thereby, the present invention can improve power integrity through the arrangement of passive components.

Figure 201810159408

Description

Probe assembly and probe structure thereof
Technical Field
The present invention relates to a probe assembly and a probe structure thereof, and more particularly, to a probe assembly applied to a wafer probe card and a probe structure thereof.
Background
First, the cantilever-type probe card of the prior art mainly manually solders the probes one by one on the printed circuit board, and at the same time, fixes the probes by an adhesive (e.g., epoxy resin). For example, the TW I447397 discloses a probe card, in which the probe 33 is fixed on the circuit board 34 by a holding part 36 containing epoxy resin.
However, in the above-mentioned prior art, when the epoxy resin is hardened, the cantilever type probe card becomes difficult to maintain. In other words, when one of the probes is damaged, the related art cantilever type probe card cannot replace the damaged probe alone, and the entire set of the cantilever type probe card must be replaced.
Furthermore, the wire bonding method of the cantilever probe card in the prior art requires dense wires for Fan-out (Fan-out) process, and the transmission path is long because manual wire bonding requires a wider space. Therefore, the signal transmission quality is poor. Further, the prior art cantilever type probe card has a wide probe wire diameter, so that it is necessary to perform vertical stacking in addition to lateral arrangement on the wiring. However, when the number of needles is large or the pitch is small, the difficulty of arranging the probes is increased.
Further, in the conventional cantilever probe card structure, the transmission path is too long, the impedance cannot be controlled, and the transmission quality is poor. Meanwhile, the power signal will have too long transmission path and too narrow cross-sectional area of the probe, and its inductance characteristic will make the power impedance increase with the frequency, resulting in voltage drop and poor yield.
Disclosure of Invention
The present invention is directed to a probe assembly and a probe structure thereof, which can effectively improve the characteristic of a cantilever-type probe that is not easily repaired, and at the same time, improve the transmission quality and reduce the maintenance cost. Meanwhile, the influence of inductance in a transmission path of the probe structure can be reduced.
In order to solve the above technical problems, one of the technical solutions of the present invention is to provide a probe structure, which includes a first base portion, a second base portion, a connecting portion and a contact portion. The first base comprises a first contact section and a first connecting section connected with the first contact section, wherein the first contact section is provided with a first abutting part and a first side end connected with the first abutting part. The second base comprises a second contact section, a second connection section and a passive element electrically connected between the second contact section and the second connection section, wherein the second contact section is provided with a second abutting part and a second side end connected to the second abutting part. The first connection section of the first base and the second connection section of the second base are connected to the connection portion. The contact portion is connected to the connection portion.
Still further, a cross section of the first connection section is perpendicular to an extending direction of the first connection section, a cross section of the second connection section is perpendicular to an extending direction of the second connection section, and a cross section of the connection portion is perpendicular to an extending direction of the connection portion, wherein a shape of the cross section of the first connection section and a shape of the cross section of the connection portion are different from each other, and a shape of the cross section of the second connection section and a shape of the cross section of the connection portion are different from each other.
Still further, the area of the cross section of the first connection section is larger than the area of the cross section of the connection portion, and the area of the cross section of the second connection section is larger than the area of the cross section of the connection portion.
Furthermore, the probe structure is a cantilever probe structure.
Furthermore, the extending direction of the first contact section is different from the extending direction of the connecting part, and the extending direction of the second contact section is different from the extending direction of the connecting part.
Furthermore, the first abutting portion and the second abutting portion can abut against an abutting portion of a first board body respectively.
Furthermore, the first connecting section and the second connecting section are respectively a columnar structure, the connecting portion is a sheet-shaped structure, and the columnar structure and the sheet-shaped structure are different in shape.
Furthermore, the first contact section, the first connection section, the second contact section and the second connection section extend in a first direction, the connection section extends in a second direction, and the first direction and the second direction are different from each other.
Furthermore, the passive element is a capacitor.
Another technical solution adopted by the present invention is to provide a probe assembly, which includes a substrate, a first board and a probe structure. The substrate has a plurality of conductive structures. The first plate body is provided with a plurality of first through holes and a plurality of abutting parts, each abutting part is adjacent to the corresponding first through hole, and each first through hole is provided with a first aperture. The probe structure comprises a first base part, a second base part, a connecting part and a contact part, wherein the first base part comprises a first contact section and a first connecting section connected with the first contact section, the first contact section is provided with a first abutting part and a first side end connected with the first abutting part, the second base part comprises a second contact section, a second connecting section and a passive element electrically connected between the second contact section and the second connecting section, the second contact section is provided with a second abutting part and a second side end connected with the second abutting part, the first connecting section of the first base part and the second connecting section of the second base part are connected with the connecting part, and the contact part is connected with the connecting part. Wherein a maximum outer diameter of the first contact section is smaller than the first aperture of the first through hole, and a maximum outer diameter of the second contact section is smaller than the first aperture of the first through hole, so that the first contact section and the second contact section can pass through the first through hole. The first contact section is electrically connected to one of the plurality of conductive structures, and the second contact section is electrically connected to another one of the plurality of conductive structures. The first abutting portion and the second abutting portion abut against the two corresponding abutting portions respectively.
Furthermore, the probe assembly further comprises a second plate body, wherein the second plate body is provided with a plurality of second through holes, the second plate body is generally parallel to the first plate body, the positions of the second through holes respectively correspond to the positions of the first through holes, and each second through hole is provided with a second aperture.
Furthermore, the probe assembly further includes a fixing member disposed on the substrate, the first board and the second board, so that the first abutting portion and the second abutting portion of the probe structure abut against the two corresponding abutting portions respectively.
One of the advantages of the probe assembly and the probe structure thereof provided by the embodiment of the invention is that the technical scheme that the second base portion comprises a second contact section, a second connection section and a passive element electrically connected between the second contact section and the second connection section can be utilized to reduce the influence of inductance in the transmission path of the probe structure.
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
Fig. 1 is a schematic perspective view of a probe structure according to a first embodiment of the invention.
Fig. 2 is another perspective view of the probe structure according to the first embodiment of the invention.
FIG. 3 is a schematic side view of a probe structure according to a first embodiment of the present invention.
Fig. 4 is a schematic top view of a probe structure according to a first embodiment of the present invention.
FIG. 5 is a schematic side cross-sectional view of the cross-section line V-V of FIG. 1.
FIG. 6 is a schematic cross-sectional side view of the cross-section line VI-VI of FIG. 1.
FIG. 7 is a schematic side sectional view of section VII-VII of FIG. 1.
FIG. 8 is a schematic side view of another embodiment of a probe structure according to the first embodiment of the present invention.
Fig. 9 is a schematic side view of another embodiment of the probe structure according to the first embodiment of the present invention.
FIG. 10 is a schematic side view of a probe assembly according to a second embodiment of the present invention.
FIG. 11 is another side view of a probe assembly according to a second embodiment of the present invention.
FIG. 12 is another side view of the probe assembly according to the second embodiment of the present invention.
Fig. 13 is a schematic perspective view of another embodiment of a probe structure according to an embodiment of the present invention.
FIG. 14 is a schematic diagram of a usage status of the probe structure according to the embodiment of the present invention.
Detailed Description
The following is a description of the embodiments of the present disclosure relating to the probe assembly and the probe structure thereof, and those skilled in the art will understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the spirit and scope of the present invention. The drawings of the present invention are for illustrative purposes only and are not drawn to scale. The following embodiments will further explain the technical contents related to the present invention in detail, but the disclosure is not intended to limit the technical scope of the present invention.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals, etc., these elements or signals should not be limited by these terms. These terms are used to distinguish one element from another element, or from one signal to another signal. In addition, as used herein, the term "or" may include all combinations of any one or more of the associated listed items as appropriate.
First embodiment
First, referring to fig. 1 to 4 and fig. 12, fig. 1 and 2 are schematic perspective views of a probe structure according to a first embodiment of the present invention, respectively, fig. 3 is a schematic side view of the probe structure according to the first embodiment of the present invention, fig. 4 is a schematic top view of the probe structure according to the first embodiment of the present invention, and fig. 12 is a schematic side view of a probe assembly according to a second embodiment of the present invention. The present invention provides a probe assembly M and a probe structure 1 thereof, wherein the first embodiment first describes the main technical features of the probe structure 1 of the present invention, and the second embodiment then describes the probe assembly M.
As mentioned above, with reference to fig. 1 to 4, the probe structure 1 may include a first base portion 11, a second base portion 12, a connecting portion 13 and a contact portion 14. The first base 11 may include a first contact section 111 and a first connection section 112 connected to the first contact section 111. The second base 12 may include a second contact section 121, a second connection section 122, and a passive component C electrically connected between the second contact section 121 and the second connection section 122. The first connection section 112 of the first base 11 and the second connection section 122 of the second base 12 may be connected to the connection portion 13. Further, the contact portion 14 may be connected to the connection portion 13. Preferably, the distance between the second base 12 and the contact portion 14 is closer than the distance between the first base 11 and the contact portion 14. Further, in the embodiment of the present invention, the probe structure 1 is a cantilever probe structure 1.
As mentioned above, with continued reference to fig. 1 and fig. 2, the first contact section 111 may have a first abutting portion 1111 and a first side end 1112 connected to the first abutting portion 1111. The second contact section 121 may have a second abutting portion 1211 and a second side end 1212 connected to the second abutting portion 1211, and the contact portion 14 may have a contact side end 141. For the embodiment of the present invention, the first contact section 111 and the second contact section 121 may be pin tails of the probe structure 1 for connecting with contact terminals (e.g. the conductive structure 21 of fig. 12) of a interposer (e.g. the substrate 2 of fig. 12). In addition, the contact side 141 of the contact portion 14 of the probe structure 1 may be in a sharp needle shape to cut the oxide layer on the surface of the solder ball of the object to be tested, however, in other embodiments, the contact side 141 of the probe structure 1 may also be a plane, which is not limited in the present invention.
Next, as shown in fig. 1 to fig. 3, for example, the passive element C may be a capacitor, for example, a multilayer ceramic capacitor or a thin film flat plate capacitor, but the invention is not limited thereto. In addition, the passive component C can be embedded between the second contact section 121 and the second connection section 122 of the second base 12 by using Micro Electro Mechanical Systems (MEMS) technology. Further, the first base portion 11 and the second base portion 12 can be used for receiving different signals respectively to be fed into the object to be tested through the contact portion 14. Therefore, the resonance point of the passive element C can be used for adjusting the power supply impedance with different frequencies, and the voltage drop of the power supply signal is avoided. For example, when the transmission path from the object to be tested is shorter, the inductance in the path is smaller, so that a capacitor with a smaller capacitance value can be used, and the corresponding resonance point is at the position of a higher frequency band, so that the power impedance of the higher frequency band can be suppressed, and finally the method can be applied to a test scheme of the higher frequency band to meet future requirements. Meanwhile, through the arrangement of the passive element C, the power supply required by the object to be tested can be provided nearby, the interference of the inductor in the path is avoided, and the Power Integration (PI) is improved.
As described above, with reference to fig. 1 to fig. 3, the extending direction (Z direction) of the first contact segment 111 is different from the extending direction (negative Z direction) of the contact portion 14, and the extending direction (Z direction) of the second contact segment 121 is different from the extending direction (negative Z direction) of the contact portion 14. In addition, for example, as shown in fig. 3, the extending direction of the first contact section 111 is substantially opposite to and parallel to the extending direction of the contact portion 14, and the extending direction of the second contact section 121 is substantially opposite to and parallel to the extending direction of the contact portion 14. That is, the first contact section 111, the first connection section 112, the second contact section 121 and the second connection section 122 may extend toward a first direction (Z direction), the connection portion 13 may extend toward a second direction (X direction), the first direction and the second direction are different from each other, and for the embodiment of the invention, the first direction may be substantially perpendicular to the second direction. In addition, the contact portion 14 may extend toward a third direction (negative Z direction), which may be different from the second direction and may be substantially perpendicular to the second direction in the embodiment of the present invention.
Next, referring to fig. 5 to 7 together, fig. 5 is a cross-sectional side view of the cross-sectional line V-V of fig. 1, fig. 6 is a cross-sectional side view of the cross-sectional line VI-VI of fig. 1, and fig. 7 is a cross-sectional side view of the cross-sectional line VII-VII of fig. 1. In the embodiment of the present invention, the cross section of the first connecting section 112 is perpendicular to the extending direction of the first connecting section 112, the cross section of the second connecting section 122 is perpendicular to the extending direction of the second connecting section 122, and the cross section of the connecting portion 13 is perpendicular to the extending direction of the connecting portion 13. Further, the shape of the cross section of the first connection section 112 and the shape of the cross section of the connection portion 13 are different from each other, and the shape of the cross section of the second connection section 122 and the shape of the cross section of the connection portion 13 are different from each other. Preferably, the area of the cross section of the first connection section 112 may be greater than the area of the cross section of the connection part 13, and the area of the cross section of the second connection section 122 may be greater than the area of the cross section of the connection part 13.
Further, as shown in fig. 5 to fig. 7, preferably, the cross-sectional shapes of the first connecting section 112 and the second connecting section 122 may be rectangular shapes (for example, the first connecting section 112 and the second connecting section 122 are respectively a column structure), and the cross-sectional shape of the connecting portion 13 and/or the contact portion 14 may be a sheet shape (a sheet-shaped rectangular shape, for example, the connecting portion 13 is a sheet-shaped structure), and the column structure and the sheet-shaped structure have different shapes. Furthermore, for the embodiment of the present invention, the probe structure 1 is preferably a probe manufactured by Micro Electro Mechanical Systems (MEMS) technology. In other words, the rectangular probe structure 1 of the present embodiment has a different manufacturing process than the circular probe.
As shown in fig. 1 and fig. 2, the first connecting section 112 of the first base 11 is connected to the connecting portion 13, and the second connecting section 122 of the second base 12 is connected to the connecting portion 13, so that the first connecting section 112 can form a first exposed surface 1121 with respect to the connecting portion 13, and the second connecting section 122 can form a second exposed surface 1221 with respect to the connecting portion 13. That is, since the cross-sectional shape of the first connecting section 112 and the cross-sectional shape of the second connecting section 122 can have different dimensional characteristics from the cross-sectional shape of the connecting portion 13, the first connecting section 112 and the second connecting section 122 can form a first exposed surface 1121 and a second exposed surface 1221 relative to the connecting portion 13, respectively. Therefore, a step difference may be formed between the first connection section 112 and the connection portion 13, and a step difference may be formed between the second connection section 122 and the connection portion 13, so that the first connection section 112 and the second connection section 122 are disposed discontinuously with respect to the connection portion 13 in the overall structure. More specifically, the connection portion between the first connection section 112 and the connection portion 13 is a turning portion, and the turning portion may have a first exposed surface 1121. In addition, the connection between the second connection section 122 and the connection portion 13 is a turning point, and the turning point may have a second exposed surface 1221.
As shown in fig. 7, in any cross section of the connecting portion 13, the connecting portion 13 may have a first side (not shown) and a second side (not shown), the first side may have a first width F1, the second side may have a second width F2, and the first width F1 may be smaller than the second width F2. That is, the sheet-like structure may have a first width F1 and a second width F2, and the size of the first width F1 is smaller than that of the second width F2. Preferably, the ratio of the first width F1 to the second width F2 may be between 0.2 and 0.5, for example, the first width F1 may be 0.1 mm (micrometer), and the second width F2 may be between 2 mm and 5 mm, but the invention is not limited thereto. Further, since the direction of the force applied to the contact portion 14 is the Z direction, the length direction (extending direction) of the second side is toward the third direction (negative Z direction), and the connecting portion 13 is in contact with the first connecting section 112 and the second connecting section 122 by the first side with a smaller size, the contact side 141 of the contact portion 14 can maintain the force of the contact side against the object to be tested even though the size of the first width F1 is smaller than the size of the second width F2.
Next, please refer to fig. 1 and fig. 2, wherein the first abutting portion 1111 of the first contact section 111 and the second abutting portion 1211 of the second contact section 121 are illustrated as having an inverted hook shape, but in other embodiments, the first abutting portion 1111 and the second abutting portion 1211 may have a concave shape, and the invention is not limited thereto. In other embodiments, the probe structure 1 may also have a plurality of first abutting portions 1111 and/or second abutting portions 1211, which is not limited in the invention.
Next, referring to fig. 8 and 9, fig. 8 and 9 are schematic side views of other embodiments of the probe structure according to the first embodiment of the invention, respectively. In detail, in other embodiments, the shape of the probe structure 1 may be adjusted, for example, in the embodiments of fig. 8 and 9, the shapes of the connection portion 13 and the contact portion 14 of the probe structure 1 may be adjusted to be suitable for different objects to be tested, and it should be noted that the invention is not limited to the shapes of the connection portion 13 and the contact portion 14.
Second embodiment
First, referring to fig. 10 to 12, fig. 10 to 12 are schematic side views illustrating an assembly process of a probe assembly M according to a second embodiment of the invention. It should be noted that, in order to facilitate understanding of the present embodiment, the drawings only show a partial configuration of the probe assembly M, so as to clearly show the configuration and connection relationship of the various elements of the probe assembly M. The construction of each element of the probe assembly M and its connection relationship will be described separately below. In other words, to facilitate the understanding of the drawings, only one probe structure 1 is presented in fig. 10 to 12. In addition, the probe structure 1 provided in the second embodiment is similar to the structure in the previous embodiments, and is not described herein again. Therefore, please refer to fig. 1 to 2 again when referring to the contents shown in fig. 10 to 12.
In view of the above, with continued reference to fig. 10, a probe assembly M according to a second embodiment of the present invention includes a substrate 2, a first board 3 and a probe structure 1. The substrate 2 may have a plurality of conductive structures 21, for example, the substrate 2 may be a Space Transformer (ST) or a patch panel for wafer test. In addition, in other embodiments, the substrate 2 may also be a printed circuit board, that is, since the probe structure 1 may be manufactured by mems technology and has a small size, the probe structure 1 may be directly disposed on the printed circuit board without disposing a space transformer, and thus, the probe structure 1 may be electrically connected to the conductive structure 21 of the printed circuit board.
As mentioned above, with reference to fig. 10, the first plate 3 may have a plurality of first through holes 31 and a plurality of abutting portions 32, each abutting portion 32 may be adjacent to the corresponding first through hole 31, and each first through hole 31 has a first aperture H1. In addition, preferably, in the embodiment of the present invention, the probe assembly M may further include a second board 4, and the second board 4 may have a plurality of second through holes 41. For example, the second board 4 may be disposed substantially parallel to the first board 3, the positions of the second through holes 41 respectively correspond to the positions of the first through holes 31, and each of the second through holes 41 has a second aperture H2.
As shown in fig. 10, and also shown in fig. 1 and 2, the probe structure 1 may include a first base portion 11, a second base portion 12, a connecting portion 13, and a contact portion 14. The first base 11 may include a first contact section 111 and a first connection section 112 connected to the first contact section 111. The second base 12 may include a second contact section 121, a second connection section 122, and a passive component C electrically connected between the second contact section 121 and the second connection section 122. The first connection section 112 of the first base 11 and the second connection section 122 of the second base 12 may be connected to the connection portion 13. The contact portion 14 may be connected to the connection portion 13. In addition, the first contact section 111 may have a first abutting portion 1111 and a first side end 1112 connected to the first abutting portion 1111. The second contact section 121 may have a second abutting portion 1211 and a second side end 1212 connected to the second abutting portion 1211, and the contact portion 14 may have a contact side end 141. It should be noted that the probe structure 1 provided in the second embodiment is similar to the structure in the previous embodiments, and is not described herein again.
Next, as shown in fig. 10, a maximum outer diameter W1 ″ of the first contact section 111 may be smaller than the size of the first aperture H1 of the first through hole 31, and a maximum outer diameter W2 of the second contact section 121 may be smaller than the size of the first aperture H1 of the first through hole 31, so that the first contact section 111 and the second contact section 121 can pass through the first through hole 31. In addition, a maximum outer diameter W1 of the first contact section 111 may be smaller than the size of the second aperture H2 of the second through hole 41, and a maximum outer diameter W2 of the second contact section 121 may be smaller than the size of the second aperture H2 of the second through hole 41, so that the first contact section 111 and the second contact section 121 can pass through the second through hole 41. Furthermore, the first contact section 111 may be electrically connected to one of the plurality of conductive structures 21, and the second contact section 121 may be electrically connected to another one of the plurality of conductive structures 21.
Next, referring to fig. 11, a user can shift the first board 3 and the second board 4 by moving the relative positions of the first board 3 and the second board 4. That is, the first plate 3 may be moved in the X direction, and the second plate 4 may be moved in the negative X direction. Therefore, the first abutting portion 1111 and the second abutting portion 1211 of the probe structure 1 can abut against the corresponding abutting portions 32, respectively, so as to achieve the effect of positioning the probe structure 1.
Next, referring to fig. 12, the probe assembly M may further include a fixing member 5 (for example, the fixing member 5 may be, but is not limited to, a screw), and the fixing member 5 may be disposed on the substrate 2, the first board 3 and the second board 4, so that the first abutting portion 1111 and the second abutting portion 1211 of the probe structure 1 abut against the corresponding abutting portions 32, respectively. In other words, the fixing member 5 may be used to position the probe structure 1 relative to the substrate 2, the first board body 3, and the second board body 4. It should be noted that, the probe structure 1 is abutted against the corresponding abutting portion 32 through the first abutting portion 1111 and the second abutting portion 1211 respectively, so that the probe structure 1 is positioned. Therefore, when one probe structure 1 is damaged and fails, the failed probe structure 1 can be replaced by moving the first plate body 3 and the second plate body 4.
It should be noted that, the cross-sectional shapes of the first connecting section 112 and the second connecting section 122 may be rectangular shapes, and the cross-sectional shape of the connecting portion 13 may be a sheet-shaped (sheet-shaped rectangular shape) shape. Therefore, after the second board 4 is disposed, after the first contact section 111, the first connection section 112 (a part of the first connection section 112 or the whole first connection section 112), the second contact section 121, and the second connection section 122 (a part of the second connection section 122 or the whole second connection section 122) are all embedded between the second board 4 and the substrate 2, interference between the first base 11 and the second base 12 respectively provided in the two probe structures 1 can be avoided.
Next, referring to fig. 13 and 14, fig. 13 is a schematic perspective view of another embodiment of a probe structure according to an embodiment of the invention, and fig. 14 is a schematic usage state diagram of the probe structure according to the embodiment of the invention. As can be seen from a comparison between fig. 13 and fig. 1, the largest difference between the probe structure 1' of fig. 13 and the probe structure 1 of fig. 1 is: the probe structure 1 of fig. 1 is primarily useful for providing power, whereas the probe structure 1' of fig. 13 is intended to be useful for providing signals. Therefore, the probe structure 1' of fig. 13 does not have the second base portion 12. It should be noted that the probe structure 1' in fig. 13 is similar to the probe structure 1 in fig. 1 except for the second base portion 12, and the details are not repeated herein.
With reference to fig. 13 and 14, fig. 14 is a top view of a plurality of probe structures (1, 1'). As can be appreciated from the embodiment shown in fig. 14, the probe structures (1, 1 ') may be arranged according to a design of a measurement array of a probe card, and furthermore, the plurality of probe structures (1, 1 ') may have different configurations from each other (for example, at least two of the plurality of probe structures (1, 1 ') have different lengths). That is, the arrangement angle of each probe structure (1, 1') can be adjusted as required. In addition, the contact side 141 of the probe structure (1, 1') can be electrically connected to the dut contact N.
Advantageous effects of the embodiments
One of the advantages of the probe assembly M and the probe structure 1 thereof provided by the embodiment of the invention is that the technical solution that the second base 12 includes a second contact section 121, a second connection section 122 and a passive element C electrically connected between the second contact section 121 and the second connection section 122 can be utilized to reduce the influence of inductance in the transmission path of the probe structure, so as to improve the integrity of the power supply.
In addition, the embodiment of the invention can also make the probe structure 1 be separately replaceable by the technical solutions that the "first contact section 111 has a first abutting portion 1111" and the "second contact section 121 has a second abutting portion 1211", so as to form a replaceable probe structure 1, thereby reducing the maintenance cost. Meanwhile, compared with the existing cantilever type probe structure, the impedance discontinuous transmission path of the existing cantilever type probe can be shortened, and the Signal Integrity (SI) of the transmission quality is improved.
Furthermore, since the probe structure 1 provided by the embodiment of the invention is a cantilever probe structure 1, the tip of the probe structure is guided outward, so that the probe structure 1 can be fixed on the substrate 2 by using a plurality of different sets of the first board 3, the second board 4 and the fixing member 5. Further, the fine pitch (fine pitch) processing difficulty can be reduced by using probe structures 1 of different lengths. In addition, since the cross-sectional shape of the connecting portion 13 and/or the contact portion 14 can be a sheet (a sheet-like rectangular shape) (the first connecting section 112 and the second connecting section 122 are a columnar structure, the connecting portion 13 is a sheet-like structure, and the columnar structure and the sheet-like structure have different shapes), not only can the requirement of fine pitch be met, but also the required strength of supporting force can be provided.
Further, the first abutting portion 1111 and the second abutting portion 1211 of the probe structure 1 can abut against the corresponding abutting portion 32 of the first board 3, respectively, so that the probe structure 1 can be positioned on the substrate 2, and the first contact section 111 and the second contact section 121 of the probe structure 1 are electrically connected to the conductive structure 21 on the substrate 2.
The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.

Claims (10)

1. A probe structure, comprising:
the first base comprises a first contact section and a first connecting section connected with the first contact section, wherein the first contact section is provided with a first abutting part and a first side end connected with the first abutting part;
a second base, including a second contact section, a second connection section and a passive element electrically connected between the second contact section and the second connection section, wherein the second contact section has a second abutting portion and a second side end connected to the second abutting portion;
a connecting portion to which the first connecting section of the first base and the second connecting section of the second base are connected; and
a contact portion connected to the connection portion;
wherein a cross section of the first connection section is perpendicular to an extending direction of the first connection section, a cross section of the second connection section is perpendicular to an extending direction of the second connection section, and a cross section of the connection section is perpendicular to an extending direction of the connection section, wherein a shape of the cross section of the first connection section and a shape of the cross section of the connection section are different from each other, and a shape of the cross section of the second connection section and a shape of the cross section of the connection section are different from each other;
the first connecting section forms a first exposed surface relative to the connecting part, and the connecting part between the first connecting section and the connecting part is a turning part with the first exposed surface; the second connecting section forms a second exposed surface relative to the connecting part, and the joint between the second connecting section and the connecting part is a turning part with the second exposed surface;
wherein an area of the cross section of the first connection section is greater than an area of the cross section of the connection portion, and an area of the cross section of the second connection section is greater than an area of the cross section of the connection portion.
2. The probe structure of claim 1, wherein the probe structure is a cantilever probe structure.
3. The probe structure according to claim 1, wherein the extending direction of the first contact section and the extending direction of the connection portion are different from each other, and the extending direction of the second contact section and the extending direction of the connection portion are different from each other.
4. The probe structure of claim 1, wherein the first abutting portion and the second abutting portion can abut against an abutting portion of a first board respectively.
5. The probe structure according to claim 1, wherein the first connecting section and the second connecting section are respectively a pillar structure, the connecting portion is a sheet structure, and the pillar structure and the sheet structure have different shapes.
6. The probe structure according to claim 1, wherein the first contact section, the first connection section, the second contact section, and the second connection section extend toward a first direction, the connection section extends toward a second direction, and the first direction and the second direction are different from each other.
7. The probe structure of claim 1, wherein the passive element is a capacitor.
8. A probe assembly, comprising:
a substrate having a plurality of conductive structures;
the first plate body is provided with a plurality of first through holes and a plurality of abutting parts, each abutting part is adjacent to the corresponding first through hole, and each first through hole is provided with a first aperture; and
a probe structure, the probe structure comprising a first base, a second base, a connecting portion and a contact portion, wherein the first base comprises a first contact section and a first connecting section connected to the first contact section, the first contact section has a first abutting portion and a first side end connected to the first abutting portion, wherein the second base comprises a second contact section, a second connecting section and a passive element electrically connected between the second contact section and the second connecting section, the second contact section has a second abutting portion and a second side end connected to the second abutting portion, wherein the first connecting section of the first base and the second connecting section of the second base are connected to the connecting portion, and wherein the contact portion is connected to the connecting portion;
wherein a maximum outer diameter of the first contact section is smaller than the first aperture of the first through hole, and a maximum outer diameter of the second contact section is smaller than the first aperture of the first through hole, so that the first contact section and the second contact section can pass through the first through hole;
wherein the first contact section is electrically connected to one of the plurality of conductive structures, and the second contact section is electrically connected to another one of the plurality of conductive structures;
the first abutting portion and the second abutting portion abut against the two corresponding abutting portions respectively.
9. The probe assembly of claim 8, further comprising a second board body having a plurality of second through holes, the second board body being substantially parallel to the first board body, the plurality of second through holes being located at positions corresponding to the plurality of first through holes, respectively, and each of the second through holes having a second aperture.
10. The probe assembly according to claim 8, further comprising a fixing member disposed on the substrate, the first board body and the second board body, so that the first abutting portion and the second abutting portion of the probe structure abut against the two corresponding abutting portions respectively.
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CN113376413B (en) * 2020-03-10 2023-12-19 台湾中华精测科技股份有限公司 Vertical probe head and its two-arm probe

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JPH08285888A (en) * 1995-04-17 1996-11-01 Hioki Ee Corp Line probe provided to z-axis unit of x-y type in-circuit tester
CN1591812A (en) * 2003-08-27 2005-03-09 日本电子材料株式会社 Measuring head for measuring plug-in unit
WO2007129686A1 (en) * 2006-05-08 2007-11-15 Tokyo Electron Limited Probe
KR20090124028A (en) * 2008-05-29 2009-12-03 (주)티에스이 Probe with extension and probe coupling structure using same
CN102103150A (en) * 2009-12-22 2011-06-22 沋博普利斯金股份有限公司 Support needle and probe provided with support needle
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