CN110196021A - Coating layer thickness and its application are measured based on Optical coherence tomography technology - Google Patents
Coating layer thickness and its application are measured based on Optical coherence tomography technology Download PDFInfo
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- 238000012014 optical coherence tomography Methods 0.000 title claims abstract description 55
- 238000005516 engineering process Methods 0.000 title claims abstract description 17
- 239000011247 coating layer Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 claims abstract description 70
- 238000000034 method Methods 0.000 claims abstract description 58
- 239000011248 coating agent Substances 0.000 claims abstract description 53
- 238000003384 imaging method Methods 0.000 claims abstract description 23
- 238000012360 testing method Methods 0.000 claims abstract description 9
- 238000009501 film coating Methods 0.000 claims abstract description 6
- 239000000919 ceramic Substances 0.000 claims abstract description 4
- 239000002131 composite material Substances 0.000 claims abstract description 3
- 229920000642 polymer Polymers 0.000 claims abstract description 3
- 229910052573 porcelain Inorganic materials 0.000 claims abstract description 3
- 239000011253 protective coating Substances 0.000 claims abstract description 3
- 230000009467 reduction Effects 0.000 claims abstract description 3
- 239000002966 varnish Substances 0.000 claims abstract description 3
- 238000001228 spectrum Methods 0.000 claims description 24
- 239000003973 paint Substances 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 8
- 239000007888 film coating Substances 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- 238000002310 reflectometry Methods 0.000 claims description 4
- 230000003595 spectral effect Effects 0.000 claims description 4
- 239000013598 vector Substances 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000012417 linear regression Methods 0.000 claims description 3
- 230000009466 transformation Effects 0.000 claims description 2
- 238000003709 image segmentation Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 19
- 230000001066 destructive effect Effects 0.000 abstract description 11
- 238000001514 detection method Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract description 2
- 238000009675 coating thickness measurement Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- 239000000523 sample Substances 0.000 abstract 1
- 230000006872 improvement Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000691 measurement method Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009659 non-destructive testing Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000003278 egg shell Anatomy 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- -1 moisture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
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Abstract
本发明公开了一种基于光学相干断层扫描成像技术测量涂层厚度及其应用,所述的方法包括以下步骤:搭建光学相干断层扫描成像(OCT)测试系统;使用OCT系统对样品材料进行深度方向和表面的二维横截面进行扫描,并最终获得被测对象的三维扫描图;将所获得的三维扫描图进行降噪处理后,转换成二进制图像,之后采用边缘跟踪法分割涂层的上下边界,计算涂层的厚度。所述的方法不仅能够实现对涂层的无损自动检测,而且该方法能够实现快速、准确、大范围的测量涂层的厚度。可应用于测量薄膜涂层的厚度包括印刷电路板表面的三防漆、着色聚合物涂料、瓷器保护涂层、等离子喷涂陶瓷、生物可降解复合涂层、清漆涂层、透明或半透明药片薄膜涂层。
The invention discloses a coating thickness measurement based on optical coherence tomography imaging technology and its application. The method includes the following steps: building an optical coherence tomography (OCT) test system; using the OCT system to measure the depth direction of the sample material Scan the two-dimensional cross-section of the surface, and finally obtain the three-dimensional scanning image of the measured object; after the obtained three-dimensional scanning image is subjected to noise reduction processing, it is converted into a binary image, and then the upper and lower boundaries of the coating are segmented by edge tracking method , to calculate the coating thickness. The method can not only realize the non-destructive automatic detection of the coating, but also can realize the fast, accurate and large-scale measurement of the thickness of the coating. It can be applied to measure the thickness of thin film coatings, including conformal coatings on the surface of printed circuit boards, pigmented polymer coatings, protective coatings on porcelain, plasma sprayed ceramics, biodegradable composite coatings, varnish coatings, transparent or translucent tablet films coating.
Description
技术领域technical field
本发明属于基于图像分析的检测领域,具体涉及一种基于光学相干断层扫描成像技术测量涂层厚度及其应用。The invention belongs to the detection field based on image analysis, and in particular relates to an optical coherence tomography-based imaging technique for measuring coating thickness and its application.
背景技术Background technique
光学相干断层扫描成像(Optical Coherence Tomography,OCT)是一种低相干光学干涉成像技术。该技术通过干涉的方法测量材料内不同深度散射/反射回来的光信号,从而实现对材料内部进行三维成像。根据其成像机理,该技术非常适合对多层结构进行成像和厚度测量。这种成像技术具有非破坏性,快速和高灵敏度的优点。OCT最初是为医学应用而发明的,目前已成功发展成为眼科疾病的常规检查和诊断方法。同时,OCT在其它临床领域,如皮肤病学,心脏病学,肠胃病学等领域展现出巨大潜力。近些年,OCT在工业无损检测中的应用也得到了长足的发展,特别是各种工业材料和产品的厚度测量,如汽车涂料,蛋壳和多层箔片。另外,OCT也被用于检测玉石,硅集成电路,工业陶瓷等。我们的近期研究发现OCT能够通过印刷电路板表面三防漆涂层进行三维成像,从而实现对涂层厚度的测量。Optical coherence tomography (OCT) is a low-coherence optical interference imaging technique. This technology measures the light signals scattered/reflected at different depths in the material by means of interference, thereby realizing three-dimensional imaging of the interior of the material. Based on its imaging mechanism, this technique is well suited for imaging and thickness measurement of multilayer structures. This imaging technique has the advantages of being non-destructive, fast and highly sensitive. OCT was originally invented for medical applications, and has successfully developed into a routine examination and diagnosis method for ophthalmic diseases. At the same time, OCT has shown great potential in other clinical fields, such as dermatology, cardiology, and gastroenterology. In recent years, the application of OCT in industrial non-destructive testing has also been greatly developed, especially the thickness measurement of various industrial materials and products, such as automotive coatings, egg shells and multi-layer foils. In addition, OCT is also used to detect jade, silicon integrated circuits, industrial ceramics, etc. Our recent research has found that OCT can perform three-dimensional imaging through the conformal paint coating on the surface of the printed circuit board, thereby realizing the measurement of the coating thickness.
例如:印刷电路板(Printed Circuit Board,PCB)在汽车、消费电子、工业和通讯等领域都有广泛的应用,这就要求印刷电路板能够在各种环境中正常工作,包括高温、高湿和腐蚀性等恶劣环境。在实际使用中,一般通过对印刷电路板表面涂一层三防漆来确保印刷电路板能够在上述恶劣条件能够正常工作或者延长其使用寿命。三防漆涂层一般是一种厚度为几十到几百微米的薄层,通常由合成树脂或塑料制成。三防漆涂层可以保护PCB使其免受电气,机械和化学等恶劣环境的影响,如湿气,灰尘,机械应力,热应力,腐蚀,溶剂,化学蒸气等。因此,三防漆已被广泛用于提高PCB的可靠性和寿命,特别是在汽车,航空电子和军用电子产品中。为了确保有效的保护,需要对三防漆涂层的质量进行严格控制,其中三防漆厚度是三防漆涂层质量好坏的一个重要指标。涂层厚度的不均匀性会导致其保护能力的下降,同时,涂层厚度需要在标准范围之内,但是涂层在喷涂后并不能确定其厚度,需要固化后进行检测。因此对于三防漆厚度测量是非常必要的。目前三防漆厚度测量方法包括非破坏性和破坏性。一种简单的非破坏性方法是使用千分尺直接测量,但需要在未涂覆的PCB上进行测量作为基准。近红外光谱仪,拉曼光谱仪,β反向散射法也非破坏测量方法,但测量方式不直接,同时无法测量涂层分布的均匀性。超声技术和声波显微镜也是无损检测方法,但是需要将被测物体浸泡在液体中,同时分辨率低。至于破坏性测量,常见的方法是切割PCB,然后在显微镜下观察其横截面从而实现厚度的测量。这种方法由于其破坏性只能在抽样检查的基础上进行;而且这种方法也很耗时,并且会受到人为操作的误差影响。除了上述缺点之外,上述非破坏性测量和破坏性测量方法仅适用于点测量而非区域性的测量。然而,在工业实践中,需要区域扫描来评估保形涂层的覆盖度和均匀性,这是决定保护效果的另外两个关键因素。For example, printed circuit boards (Printed Circuit Board, PCB) are widely used in automotive, consumer electronics, industrial and communication fields, which requires that printed circuit boards can work normally in various environments, including high temperature, high humidity and Corrosive and other harsh environments. In actual use, a layer of conformal paint is generally applied to the surface of the printed circuit board to ensure that the printed circuit board can work normally under the above harsh conditions or to prolong its service life. The three anti-paint coating is generally a thin layer with a thickness of tens to hundreds of microns, usually made of synthetic resin or plastic. Conformal paint coating can protect PCB from harsh environments such as electrical, mechanical and chemical, such as moisture, dust, mechanical stress, thermal stress, corrosion, solvents, chemical vapors, etc. Therefore, conformal coatings have been widely used to improve the reliability and lifespan of PCBs, especially in automotive, avionics, and military electronics. In order to ensure effective protection, the quality of the three anti-paint coatings needs to be strictly controlled, and the thickness of the three anti-paint coatings is an important indicator of the quality of the three anti-paint coatings. The unevenness of the coating thickness will lead to the decline of its protective ability. At the same time, the coating thickness needs to be within the standard range, but the thickness of the coating cannot be determined after spraying, and it needs to be tested after curing. Therefore, it is very necessary to measure the thickness of the three anti-paint. The current three anti-paint thickness measurement methods include non-destructive and destructive. A simple non-destructive method is direct measurement with a micrometer, but requires measurements on an uncoated PCB as a reference. Near-infrared spectrometer, Raman spectrometer, and β backscattering method are also non-destructive measurement methods, but the measurement method is not direct, and the uniformity of coating distribution cannot be measured. Ultrasonic technology and acoustic microscope are also non-destructive testing methods, but they need to immerse the object under test in liquid and have low resolution. As for destructive measurement, a common method is to cut the PCB and then observe its cross-section under a microscope to measure the thickness. This method can only be performed on a spot check basis due to its destructive nature; it is also time-consuming and subject to human error. In addition to the above-mentioned disadvantages, the above-mentioned non-destructive measurement and destructive measurement methods are only suitable for point measurements rather than regional measurements. However, in industrial practice, area scanning is required to assess conformal coating coverage and uniformity, two other key factors that determine protection effectiveness.
发明内容Contents of the invention
针对上述问题,本发明提出一种基于光学相干断层扫描成像技术测量漆涂层厚度及其应用。In view of the above problems, the present invention proposes a measurement of paint coating thickness based on optical coherence tomography imaging technology and its application.
实现上述技术目的,达到上述技术效果,本发明通过以下技术方案实现:Realize above-mentioned technical purpose, reach above-mentioned technical effect, the present invention realizes through the following technical solutions:
一种基于光学相干断层扫描成像技术测量涂层厚度的方法,包括以下步骤:A method for measuring coating thickness based on optical coherence tomography imaging technology, comprising the following steps:
搭建光学相干断层扫描成像(OCT)测试系统,通过从OCT测试系统的光源端所发出激光被分成两束,分别照射至参考臂和样品臂,从参考臂和样品臂反射回来的光束发生干涉,获取干涉光谱信号;An optical coherence tomography (OCT) test system is built. The laser light emitted from the light source end of the OCT test system is divided into two beams, which are irradiated to the reference arm and the sample arm respectively, and the beams reflected from the reference arm and the sample arm interfere. Obtain the interference spectrum signal;
使用OCT系统中的光谱仪对干涉光谱信号进行测量,包括对干涉光谱信号进行逆傅里叶变化获得所测量的位置沿深度方向的反射率轮廓,和采用光束对被测对象表面进行扫描并获得二维横截面图并结合所获得的沿深度方向的反射率轮廓获得被测对象的三维扫描图;Use the spectrometer in the OCT system to measure the interference spectrum signal, including performing inverse Fourier transformation on the interference spectrum signal to obtain the reflectivity profile of the measured position along the depth direction, and using the beam to scan the surface of the measured object and obtain two Combined with the obtained reflectivity profile along the depth direction to obtain a three-dimensional scanning image of the measured object;
将所获得的三维扫描图进行降噪处理后,转换成二进制图像,之后采用边缘跟踪法分割涂层的上下边界,计算涂层的厚度。After denoising the obtained 3D scanning image, it is converted into a binary image, and then the upper and lower boundaries of the coating are segmented by the edge tracking method to calculate the thickness of the coating.
作为本发明的进一步改进,所述的光谱仪采集的是像素或波长空间的干涉光谱,通过校准将输出的干涉光谱转换成波数空间的干涉光谱。As a further improvement of the present invention, the spectrometer collects interference spectra in pixel or wavelength space, and converts the output interference spectra into interference spectra in wavenumber space through calibration.
作为本发明的进一步改进,所述的校准方法包括:将空间的干涉光谱通过希尔伯特变换提取重映射向量,之后通过线性差值获得波数空间的干涉光谱;或者,通过采用线性回归进行色散补偿获得波数空间的干涉光谱。As a further improvement of the present invention, the calibration method includes: extracting the remapping vector from the interference spectrum of the space through Hilbert transform, and then obtaining the interference spectrum of the wavenumber space through linear difference; or, performing dispersion by using linear regression Compensate to obtain an interference spectrum in wavenumber space.
作为本发明的进一步改进,所述的降噪方法包括均值滤波法和高斯滤波法。As a further improvement of the present invention, the noise reduction method includes a mean filtering method and a Gaussian filtering method.
作为本发明的进一步改进,采用边缘跟踪法对二进制图像分割涂层的上下边界的过程包括:As a further improvement of the present invention, the process of using the edge tracking method to segment the upper and lower boundaries of the coating on the binary image includes:
以第一个像素作为起始点标记强度1,按纵向或横向两个方向逐个比较邻域中像素的强度,并将邻域中包含强度为0的像素点选取成跟踪点,最终所获得的所有的跟踪点连接起来,确认上下边界。Take the first pixel as the starting point to mark the intensity 1, compare the intensity of the pixels in the neighborhood one by one in the vertical or horizontal direction, and select the pixel points with the intensity of 0 in the neighborhood as tracking points, and finally obtain all Connect the trace points of , and confirm the upper and lower boundaries.
作为本发明的进一步改进,所搭建的OCT系统中的激光源所发射的光谱范围为770-950nm。As a further improvement of the present invention, the spectral range emitted by the laser source in the constructed OCT system is 770-950nm.
应用以上所述的基于光学相干断层扫描成像技术测量涂层厚度的方法,应用于测量薄膜涂层的厚度包括印刷电路板表面的三防漆、着色聚合物涂料、瓷器保护涂层、等离子喷涂陶瓷、生物可降解复合涂层、清漆涂层、透明或半透明药片薄膜涂层,所测量的薄膜涂层厚度为微米级到毫米级。Apply the above-mentioned method of measuring coating thickness based on optical coherence tomography imaging technology, which is used to measure the thickness of thin film coatings, including conformal coatings on the surface of printed circuit boards, colored polymer coatings, porcelain protective coatings, plasma sprayed ceramics , biodegradable composite coatings, varnish coatings, transparent or translucent tablet film coatings, and the measured film coating thickness is from micron to millimeter.
本发明的有益效果:本发明通过超高分辨率光学相干断层扫描成像技术不仅能够实现对涂层的无损自动检测,而且该方法能够实现快速、准确、大范围的测量涂层的厚度。Beneficial effects of the present invention: the present invention not only realizes the non-destructive automatic detection of the coating through the ultra-high resolution optical coherence tomography imaging technology, but also realizes the rapid, accurate and large-scale measurement of the thickness of the coating.
附图说明Description of drawings
图1为本发明中所搭建的OCT系统的结构图;Fig. 1 is the structural diagram of the OCT system built among the present invention;
图2(a)和图2(b)为本发明的一种实施例中将三防漆涂覆在两种具有不同结构的印刷电路板的结构示意图;Fig. 2 (a) and Fig. 2 (b) are in an embodiment of the present invention, conformal paint is coated on the structural representation of two kinds of printed circuit boards with different structures;
图3(a)和图3(b)为与图2(a)和图2(b)相对应的获得的OCT横截面图像;Fig. 3 (a) and Fig. 3 (b) are the OCT cross-sectional images obtained corresponding to Fig. 2 (a) and Fig. 2 (b);
图4为对图像的处理过程图:(a)原始OCT横截面图像,(b)降噪处理的图像,(c) 二进制图像,(d)通过边缘追踪产生的三防漆涂层上边界的封闭包络线,(e)通过边缘追踪产生的三防漆下边界和下层区域的包络线,(f)检测到的顶部三防漆涂层和底部边界;Figure 4 is a diagram of the image processing process: (a) the original OCT cross-sectional image, (b) the noise-reduced image, (c) the binary image, (d) the boundary of the conformal coating produced by edge tracking Enclosed envelope, (e) the envelope of the lower boundary of the conformal paint and the lower region generated by edge tracking, (f) the detected top conformal coating and the bottom boundary;
图5(a)为本专利的实施例中所采用的PCB照片,图5(b)为图5(a)所显示的矩形框区域内的正面俯视图;Fig. 5 (a) is the PCB photo adopted in the embodiment of this patent, and Fig. 5 (b) is the front plan view in the rectangular frame area shown in Fig. 5 (a);
图6为采用两种不同的方法测试涂层的厚度,图6(a)采用的是OCT技术,图6(b) 采用的是显微镜技术;Figure 6 shows that two different methods are used to test the thickness of the coating, Figure 6(a) uses OCT technology, and Figure 6(b) uses microscope technology;
图7为采用两种不同方法获得的涂层厚度分布图和涂层厚度差别图;Figure 7 is a coating thickness distribution diagram and a coating thickness difference diagram obtained by two different methods;
图8为图7(b)中厚度差的分布直方图和拟合的高斯曲线图;Fig. 8 is a distribution histogram and a fitted Gaussian curve diagram of the thickness difference in Fig. 7(b);
图9为采用本发明的OCT技术生成的涂层厚度图。Fig. 9 is a graph of coating thickness generated by the OCT technique of the present invention.
具体实施方式Detailed ways
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
下面结合附图对本发明的应用原理作详细的描述。The application principle of the present invention will be described in detail below in conjunction with the accompanying drawings.
本发明中以测量印刷电路板(Printed Circuit Board,PCB)上的三防漆涂层的厚度为例进行具体说明。如图5所示,本实施例中选取的印刷电路板上喷涂了Peters公司生产的三防漆层,选取图5(a)中的矩形方框区域进行扫描,得到对应的图5(b)的投影图,并对图5(b)进行图像。In the present invention, the thickness measurement of the conformal paint coating on the printed circuit board (Printed Circuit Board, PCB) is taken as an example for specific description. As shown in Figure 5, the printed circuit board selected in this embodiment is sprayed with the three anti-paint layer produced by Peters Company, and the rectangular frame area in Figure 5 (a) is selected for scanning to obtain the corresponding Figure 5 (b) , and imaged for Figure 5(b).
所使用的测试方法主要包括3个步骤:超高分辨率OCT系统设计和开发、数据采集与处理、图像边缘提取及厚度计算。具体描述如下:The test method used mainly includes three steps: ultra-high resolution OCT system design and development, data acquisition and processing, image edge extraction and thickness calculation. The specific description is as follows:
(1)搭建超高分辨率OCT的测试系统,获得干涉光谱信号(1) Build an ultra-high resolution OCT test system to obtain interference spectrum signals
如图1所示本发明所设计的超高分辨率OCT测试系统主要由超连续激光光源,样品臂,参考臂,数据采集卡,光谱仪(Spectrometer)组成。激光光源的中心波长是810nm,半峰值带宽180nm,输出功率15.6mW。从光源出来的光经过分光镜分为两部分,一部分进入参考臂,一部分进入样品臂。所述的参考臂中通过依次设置的L2、L3和L4组成的透镜组件照射到参考镜(RM)上,所述的样品臂通过依次设置的L5、L6和L7组成的透镜组件照射到样品(Sample)上。从参考臂和样品臂返回的光被重新组合到相同的单模光纤 (SMF),互相发生干涉,最终耦合到光谱仪。参考臂和样品臂采用了同样的光学透镜组 (L2和L5,L3和L6,L4和L7),目的在于最小化色散。在样品臂上还设置了X-Y扫描振镜(GS)实现光束扫描,光束扫描的轨迹由数据采集卡产生模拟电压信号(AO)来控制。As shown in Figure 1, the ultra-high resolution OCT test system designed by the present invention is mainly composed of a supercontinuum laser light source, a sample arm, a reference arm, a data acquisition card, and a spectrometer (Spectrometer). The central wavelength of the laser light source is 810nm, the half-peak bandwidth is 180nm, and the output power is 15.6mW. The light from the light source is divided into two parts by the beam splitter, one part enters the reference arm and the other enters the sample arm. In the reference arm, the lens assembly composed of L2, L3 and L4 arranged in sequence is irradiated onto the reference mirror (RM), and the sample arm is irradiated to the sample through the lens assembly composed of L5, L6 and L7 arranged in sequence ( Sample). Light returning from the reference and sample arms is recombined into the same single-mode fiber (SMF), interferes with each other, and is finally coupled to the spectrometer. The reference and sample arms use the same optical lens set (L2 and L5, L3 and L6, L4 and L7) to minimize chromatic aberration. An X-Y scanning galvanometer (GS) is also set on the sample arm to realize beam scanning, and the track of beam scanning is controlled by an analog voltage signal (AO) generated by a data acquisition card.
OCT形成的干涉光谱信号是由一个自主设计的光谱仪来探测。光谱仪是由一个准直透镜(L9),一个衍射光栅(Grating),一个成像镜头(CL),和一个线阵相机(LSC)组成。线阵相机探测到的信号通过12位图像采集卡(IMAQ)转换为数字信号并存储到电脑中。The interference spectrum signal formed by OCT is detected by a self-designed spectrometer. The spectrometer is composed of a collimator lens (L9), a diffraction grating (Grating), an imaging lens (CL), and a line scan camera (LSC). The signal detected by the line scan camera is converted into a digital signal by a 12-bit image acquisition card (IMAQ) and stored in a computer.
(2)OCT信号处理和图像重建(2) OCT signal processing and image reconstruction
在基于光谱仪的OCT中,干涉光谱在探测器像素空间(n-空间(n-space)均匀分布,其中n是探测器像素的指数)被采样,而不是在波数空间(k-空间)等间隔均匀分布。所以,测量得到的干涉光谱需要在进行逆傅里叶变换之前重新采样,从而使其在波数空间等间隔均匀分布。本专利中,我们采用的像素空间到波数空间转换的校准方法是:当使用单个反射镜作为样品时,OCT应当在k-空间生成完美的正弦干涉图,因此可以找到映射矢量来重新映射n-空间原先不完美的干涉图。具体来说,校准方法包括两个主要步骤:首先,在不同光程长度上记录两个干涉图,随后通过希尔伯特变换提取重映射向量,然后通过线性插值获得k-空间干涉光谱;其次,采用线性回归来实现色散补偿过程,以获得期望的k- 空间干涉光谱。In spectrometer-based OCT, the interference spectra are sampled in detector pixel space (n-space (n-space), where n is the index of the detector pixel), rather than equally spaced in wavenumber space (k-space) Evenly distributed. Therefore, the measured interference spectrum needs to be resampled before performing the inverse Fourier transform, so that it is evenly spaced in the wavenumber space. In this patent, the calibration method we adopt for pixel space to wavenumber space conversion is: when using a single mirror as a sample, OCT should generate a perfect sinusoidal interferogram in k-space, so the mapping vector can be found to remap n- A previously imperfect interferogram of space. Specifically, the calibration method consists of two main steps: first, two interferograms are recorded at different optical path lengths, subsequently the remapping vectors are extracted by Hilbert transform, and then the k-space interferometric spectra are obtained by linear interpolation; secondly , using linear regression to implement the dispersion compensation process to obtain the desired k-space interference spectrum.
完成光谱信号从波数空间到k-空间转换后,就可以对干涉光谱信号进行逆傅里叶变化来获得横截面图像(B-扫描)。将多个横截面图像组合在一起就可以产生三维(3D)图像。After the spectral signal is converted from wavenumber space to k-space, the inverse Fourier transform of the interference spectral signal can be performed to obtain a cross-sectional image (B-scan). Combining multiple cross-sectional images together produces a three-dimensional (3D) image.
(3)图像边缘提取及厚度计算(3) Image edge extraction and thickness calculation
如图2(a)所示,PCB通常是多层结构,在三防漆的下边通常有一层阻焊层,在有些区域阻焊层下边还有一层铜箔线路(如图2(b))。由于OCT成像深度较浅,通常对上面所述的这两层或者三层的结构成像。三防漆与相邻涂层之间的折射率的不连续性会导致三防漆在OCT成像时通常会显示出两个不同的边界,如图3所示。我们利用这两个边界并通过以下的算法对三防漆的厚度进行计算测量,具体的过程如下。As shown in Figure 2(a), PCB is usually a multi-layer structure. There is usually a layer of solder mask under the conformal paint, and there is a layer of copper foil circuit under the solder mask in some areas (as shown in Figure 2(b)) . Due to the shallow depth of OCT imaging, the above-mentioned two-layer or three-layer structure is usually imaged. The discontinuity of the refractive index between the conformal coating and the adjacent coating will cause the conformal coating to usually show two different boundaries when OCT imaging, as shown in Figure 3. We use these two boundaries and use the following algorithm to calculate and measure the thickness of the three-proof paint. The specific process is as follows.
首先,将所获得的原始的OCT横截面图像(如图4(a))使用均值滤波法和高斯滤波法对图像进行降噪处理得到降噪后的图像(如图4(b));然后,将每张图像都转换成二进制图像(如图4(c));最后采用边缘跟踪法分割涂层的上下边界。First, the obtained original OCT cross-sectional image (as shown in Figure 4(a)) is denoised using the mean filter method and Gaussian filter method to obtain a denoised image (as shown in Figure 4(b)); then , each image is converted into a binary image (as shown in Figure 4(c)); finally, the edge tracking method is used to segment the upper and lower boundaries of the coating.
以图4(c)为例采用边缘跟踪法分割涂层的上下边界的过程为:按从上到下遍历左侧第一列中的每个像素,将选区强度为1的第一个像素用作起始点,然后采用如下策略进行边缘跟踪。具体的为(1)从左侧第一列中选区强度为1的第一个像素用作起始点,依次在邻域中找到强度为1的像素点;(2)在上述强度为1的像素点中选取下一个跟踪点,选择的条件是其该像素点的邻域中包含强度为0的像素点;(3)重复上述过程。该跟踪过程最终产生如图4(d)所示的封闭包络。将包络的中间设定为三防漆涂层的上边界(图4 (e)),在检测到涂层的上边界之后,算法选择新的跟踪起始点继续边缘跟踪,通过在从上边界到底部的二进制图像的第一列中搜索强度为1的第一个像素点作为新的跟踪起点,边缘跟踪产生另一个封闭的包络。如图4(f)所示,最后,可以通过测量检测到的上边界和下边界之间的垂直距离来获得涂层的厚度。Taking Figure 4(c) as an example, the process of dividing the upper and lower boundaries of the coating with the edge tracking method is as follows: traverse each pixel in the first column on the left from top to bottom, and use the first pixel with the selection intensity of 1 as As a starting point, the following strategy is used for edge tracking. Specifically, (1) use the first pixel with intensity of 1 in the first column on the left as the starting point, and find pixels with intensity of 1 in the neighborhood in turn; (2) select pixels with intensity of 1 above Select the next tracking point among the points, and the selection condition is that the neighborhood of the pixel point contains a pixel point with an intensity of 0; (3) Repeat the above process. This tracking process finally produces a closed envelope as shown in Fig. 4(d). Set the middle of the envelope as the upper boundary of the conformal paint coating (Fig. 4 (e)). After detecting the upper boundary of the coating, the algorithm selects a new tracking starting point to continue edge tracking. Search for the first pixel with an intensity of 1 in the first column of the binary image at the bottom as a new tracking starting point, and edge tracking produces another closed envelope. As shown in Fig. 4(f), finally, the coating thickness can be obtained by measuring the vertical distance between the detected upper and lower boundaries.
实验结果:Experimental results:
由图6(a)显示的结果可知,OCT横截面图像中存在明显的上下两条边界,并以这两条边界为基础进行涂层厚度测量。另该图所显示的结果包含了两层和三层的结构,两层的区域较短,三层的区域较长。From the results shown in Figure 6(a), it can be seen that there are two obvious upper and lower boundaries in the OCT cross-sectional image, and the coating thickness is measured based on these two boundaries. In addition, the results shown in this figure include two-layer and three-layer structures, the two-layer area is shorter, and the three-layer area is longer.
图6(b)所显示的通过显微镜技术获得的涂层的图像是为了进一步评估本发明所提出的厚度测量方法的准确性。PCB在用超高分辨率OCT成像后将同一片样品送到第三方做金相切片来测量厚度。该方法是将PCB切开,然后打磨光滑,在显微镜下成像来测量其厚度。这种方法会使PCB永久性的被破化。因此,如图6(b)所示,在显微镜下仅拍摄了 PCB的一个横截面。同时,可以看出显微镜图像和超高分辨率OCT生成的截面图非常一致。两幅图中的铜层部分都显现出了较强的反射。显微图像上的厚度测量是通过手动分割涂层来实现的。The image of the coating obtained by microscopy technique shown in Fig. 6(b) is to further evaluate the accuracy of the thickness measurement method proposed in the present invention. After the PCB is imaged with ultra-high resolution OCT, the same sample is sent to a third party for metallographic sectioning to measure the thickness. The method is to cut the PCB, then polish it smooth, and image it under a microscope to measure its thickness. This method will permanently damage the PCB. Therefore, only one cross-section of the PCB was photographed under the microscope, as shown in Fig. 6(b). At the same time, it can be seen that the microscope images and the cross-sectional images generated by super-resolution OCT are in good agreement. Parts of the copper layer in both images show strong reflections. Thickness measurements on microscopic images were achieved by manually segmenting the coating.
图7(a)描述了通过上述两种不同方法测量的涂层厚度的比较。总体而言,这两种方法的测量结果在约5mm的范围内显示出良好的一致性。如图7(b)所示,通过计算两个测量之间的差异来评估不一致性。差值全部分布在正负五微米范围内,主要分布在三微米范围内,平均差异为0.37μm,标准差为1.38μm。图8是图7(b)中厚度差的分布直方图,后面的曲线是厚度差直方图上的高斯拟合,半高宽为3.01um。这种差异一部分归因于超高分辨率OCT的轴向分辨率(1.72μm),这决定了测量精度。同样,另一部分归因于传统方法的测量误差。上述结果表明超高分辨率OCT可以为PCB上的三防漆涂层提供精确的厚度测量Figure 7(a) depicts the comparison of the coating thicknesses measured by the two different methods described above. Overall, the measurements from the two methods show good agreement over a range of about 5 mm. As shown in Figure 7(b), inconsistency is assessed by computing the difference between two measurements. The differences are all distributed within the range of plus or minus five microns, mainly within the range of three microns, with an average difference of 0.37 μm and a standard deviation of 1.38 μm. Fig. 8 is the distribution histogram of the thickness difference in Fig. 7(b), and the following curve is a Gaussian fit on the thickness difference histogram, with a full width at half maximum of 3.01um. This difference is partly attributed to the axial resolution (1.72 μm) of ultra-high resolution OCT, which determines the measurement accuracy. Again, another part is attributable to measurement errors in traditional methods. The above results demonstrate that ultra-high resolution OCT can provide accurate thickness measurements for conformal paint coatings on PCBs
此外,可以利用OCT的三维成像能力生成厚度图,如图9所示,通过厚度的颜色编码,很容易掌握厚度变化。这为快速检测PCB涂层厚度铺平了道路。In addition, the three-dimensional imaging capability of OCT can be used to generate a thickness map, as shown in Figure 9, through the color coding of the thickness, it is easy to grasp the thickness change. This paves the way for rapid detection of PCB coating thickness.
最后,我们还在计算效率方面评估了我们提出的算法。该算法在Matlab平台上实现,并在具有Intel(R)Xeon(R)CPU E5-1650v2@3.5GHz和24GB RAM的电脑上进行测试,其中仅使用单核。处理了350张连续图像,算法的运行时间约为36秒。为了比较,金相切片方法花费大约两个小时,包括切割PCB,抛光和测量。从这些数据来看,我们的方法可以用在流水线的在线检测。Finally, we also evaluate our proposed algorithm in terms of computational efficiency. The algorithm is implemented on the Matlab platform and tested on a computer with Intel(R) Xeon(R) CPU E5-1650v2@3.5GHz and 24GB RAM, where only a single core is used. 350 consecutive images were processed and the running time of the algorithm was about 36 seconds. For comparison, the metallographic sectioning method takes about two hours, including cutting the PCB, polishing and measuring. From these data, our method can be used for online detection in pipelines.
以上显示和描述了本发明的基本原理和主要特征和本发明的优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是说明本发明的原理,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above. Those skilled in the industry should understand that the present invention is not limited by the above-mentioned embodiments. What are described in the above-mentioned embodiments and the description only illustrate the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will also have Variations and improvements are possible, which fall within the scope of the claimed invention. The protection scope of the present invention is defined by the appended claims and their equivalents.
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