CN110189950B

CN110189950B - Key structure

Info

Publication number: CN110189950B
Application number: CN201910432836.1A
Authority: CN
Inventors: 张立德; 陈志宏
Original assignee: Darfon Electronics Suzhou Co Ltd
Current assignee: Darfon Electronics Suzhou Co Ltd
Priority date: 2019-05-23
Filing date: 2019-05-23
Publication date: 2021-06-08
Anticipated expiration: 2039-05-23
Also published as: CN110189950A

Abstract

The invention discloses a key structure which comprises a keycap, a circuit board, a lifting mechanism and a conductive frame. The circuit board comprises a first connecting pad and a second connecting pad. The lifting mechanism is arranged between the circuit board and the keycap, and the keycap moves up and down relative to the circuit board through the lifting mechanism. The conductive frame is arranged on the lifting mechanism and moves up and down along with the lifting mechanism, and the conductive frame comprises a first conductive part and a second conductive part which are respectively positioned above the first connecting pad and the second connecting pad. The motion path of the first conductive part and the motion path of the second conductive part respectively reach the first connecting pad and the second connecting pad. When the first conductive part and the second conductive part respectively contact the first pad and the second pad, the first conductive part, the second conductive part and the second pad form a cross current path.

Description

Key structure

Technical Field

The present invention relates to a key structure, and more particularly, to a key structure with a conductive structure.

Background

Most of the traditional key structures use an elastic body to extrude the membrane switch layer, so that the upper electrode and the lower electrode which are originally separated in the membrane switch layer are contacted to generate a trigger signal. The membrane switch layer is of a soft structure, so that the upper electrode and the lower electrode of the membrane switch layer can be contacted closely only by overcoming the resistance of the material of the membrane switch layer. However, the conventional key structure has poor triggering reliability due to the problems of the resistance of the material of the membrane switch layer and the fatigue of the material of the membrane switch layer.

Disclosure of Invention

The present invention relates to a key structure, which can improve the conventional problems.

In order to achieve the above object, the present invention provides a key structure, including: keycap, circuit board, elevating system and electrically conductive frame. The circuit board comprises a first connecting pad and a second connecting pad; the lifting mechanism is arranged between the circuit board and the keycap, and the keycap moves up and down relative to the circuit board through the lifting mechanism; the conductive frame is arranged on the lifting mechanism and moves up and down along with the lifting mechanism, the conductive frame comprises a first conductive part and a second conductive part which are respectively positioned above the first connecting pad and the second connecting pad, and the motion path of the first conductive part and the motion path of the second conductive part respectively reach the first connecting pad and the second connecting pad; when the first conductive part and the second conductive part respectively contact the first pad and the second pad, the first conductive part, the second conductive part and the second pad form a first cross current path.

As an optional technical solution, the key structure further includes: the bottom plate is arranged between the circuit board and the keycap; the lifting mechanism is pivoted to the bottom plate and comprises a first lifting piece and a second lifting piece, the first lifting piece and the bottom plate are pivoted to a first pivoting point, the second lifting piece and the bottom plate are pivoted to a second pivoting point, and the first conductive part is located between the first pivoting point and the second pivoting point; or the first pivot point is positioned between the first conductive part and the second pivot point.

As an optional technical solution, the circuit board further includes a third pad and a fourth pad, the conductive frame is disposed on the first lifting member, and the key structure further includes: the magnetic element is provided with electric conductivity, is configured on the second lifting element and moves up and down along with the second lifting element, and comprises a third conductive part and a fourth conductive part which are respectively positioned above the third connecting pad and the fourth connecting pad, and the motion path of the third conductive part and the motion path of the fourth conductive part respectively reach the third connecting pad and the fourth connecting pad; when the third conductive part and the fourth conductive part respectively contact the third pad and the fourth pad, the third pad, the fourth conductive part, the third conductive part and the fourth pad form a second cross current path.

As an optional technical solution, the conductive frame further includes a transverse conductive portion, the transverse conductive portion is disposed above the lifting mechanism, the first conductive portion and the second conductive portion are connected to the transverse conductive portion, and the first conductive portion and the second conductive portion extend from the transverse conductive portion to the circuit board.

As an optional technical solution, the first conductive portion includes a flexible portion and a contact portion connected to each other, the flexible portion connects the lateral conductive portion and the contact portion, and an obtuse angle is formed between the contact portion and the flexible portion.

In addition, the present invention further provides a key structure, including: keycap, circuit board, elevating system and electrically conductive frame. The circuit board comprises a first connecting pad and a second connecting pad, and the first connecting pad and the second connecting pad are spaced by a preset distance; the lifting mechanism is arranged between the circuit board and the keycap, and the keycap moves up and down between a release position and a pressing position relative to the circuit board through the lifting mechanism; the conductive frame is arranged on the lifting mechanism and moves up and down along with the lifting mechanism, the conductive frame comprises a first conductive part, a second conductive part and a transverse conductive part, the first conductive part and the second conductive part are respectively positioned above the first connecting pad and the second connecting pad, the transverse conductive part is positioned between the first conductive part and the second conductive part, and the extension length of the transverse conductive part exceeds the preset interval; when the keycap is located at the release position, the first conductive part and the second conductive part are respectively far away from the first connecting pad and the second connecting pad, so that the first connecting pad and the second connecting pad are kept electrically isolated; when the keycap is pressed to be located at the pressing position, the first conductive part and the second conductive part respectively contact the first connecting pad and the second connecting pad, and electric energy of the first connecting pad sequentially flows through the first conductive part, the transverse conductive part and the second conductive part to reach the second connecting pad.

As an optional technical solution, the key structure further includes: a controller to: detecting a voltage change of the first cross current path; determining a transition point at which the voltage change changes from a high level to a low level; after delaying the transition point, the voltage change is reversed.

As an optional technical solution, the key structure further includes an upward restoring force element, the default spacing is greater than the upward restoring force element, so that the upward restoring force element can be disposed between the first pad and the second pad, and the predetermined spacing is greater than 1/4 of the width of the keycap.

As an optional technical solution, the conductive frame further includes a plurality of combining elastic pieces, the lifting mechanism further includes a plurality of combining holes, and the combining elastic pieces are respectively embedded into the combining holes, so that the conductive frame is combined on the lifting mechanism.

In addition, the present invention further provides a key structure, including: keycap, circuit board, lifting mechanism and flexible conductive piece. The circuit board comprises a connecting pad, wherein the connecting pad comprises an anode and a cathode which are adjacent; the lifting mechanism is arranged between the circuit board and the keycap, and the keycap moves up and down relative to the circuit board through the lifting mechanism; the flexible conductive piece is arranged at the bottom of the lifting mechanism or the bottom of the keycap and moves along with the lifting mechanism, and the movement path of the bottom area of the flexible conductive piece reaches the anode and the cathode; when the bottom area of the flexible conductive member contacts the positive electrode and the negative electrode, the positive electrode and the negative electrode are conducted.

As an optional technical solution, the key structure further includes: the conducting frame and the bottom plate. The conductive frame is arranged on the lifting mechanism and moves up and down along with the lifting mechanism, and the conductive frame is provided with the flexible conductive piece; the bottom plate is arranged between the circuit board and the keycap; the lifting mechanism is pivoted to the bottom plate and comprises a first lifting piece and a second lifting piece, the first lifting piece and the bottom plate are pivoted to a first pivot point, the second lifting piece and the bottom plate are pivoted to a second pivot point, and the first pivot point is located between the flexible conductive piece and the second pivot point.

As an optional technical solution, the key structure further includes: the bottom plate is arranged between the circuit board and the keycap; the lifting mechanism is pivoted to the bottom plate and comprises a first lifting piece and a second lifting piece, the first lifting piece comprises a pivoting end, a free end and a pivoting part, the first lifting piece is pivoted with the second lifting piece in a crossed mode through the pivoting part, the pivoting end of the first lifting piece is pivoted to the bottom plate, and the flexible conductive piece is arranged at the bottom of the free end.

As an optional technical solution, the flexible conductive member is disposed at the bottom of the keycap; this button structure includes: the elastic piece is connected to the bottom of the keycap and surrounds the flexible conductive piece.

In addition, the present invention further provides a key structure, including: keycap, circuit board, lifting mechanism and flexible conductive piece. The circuit board comprises a first connecting pad and a second connecting pad, and the first connecting pad and the second connecting pad are separated by a spacing area; the lifting mechanism is arranged between the circuit board and the keycap, and the keycap moves up and down between a release position and a pressing position relative to the circuit board through the lifting mechanism; the flexible conductive piece comprises an upper section combining part, a middle section elastic part and a lower section conductive part, the flexible conductive piece is combined at the bottom of the lifting mechanism or the bottom surface of the keycap by the upper section combining part so as to move along with the lifting mechanism, and the size of the lower section conductive part is larger than the interval area; when the keycap is located at the release position, the lower section of the conductive part is far away from the first connecting pad and the second connecting pad, so that the first connecting pad and the second connecting pad are kept electrically isolated; when the keycap is pressed to be located at the pressing position, the middle-section elastic part is matched with the keycap to move up and down to deform, so that the lower-section conductive part keeps surface contact and covers the spacing area, part of the first connecting pad and part of the second connecting pad, and electric energy of the first connecting pad flows through the lower-section conductive part to reach the second connecting pad.

The key structure of the present invention uses the circuit board to replace the conventional flexible thin film switch layer. Because the circuit board is a hard board, as long as the conductive part contacts the connecting pad on the circuit board, a cross current path is formed, and the compressibility of the material does not need to be overcome. Therefore, compared with the conventional membrane switch layer, the triggering reliability of the key structure of the embodiment of the invention is higher.

The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.

Drawings

Fig. 1A is an exploded view of a key structure according to a first embodiment of the invention.

FIG. 1B is a schematic diagram of an assembly of the key structure of FIG. 1A (in an un-pressed state).

FIG. 1C is a schematic diagram of the key structure of FIG. 1B with the keycap omitted.

FIG. 1D is a top view of the key structure of FIG. 1C.

FIG. 1E shows a cross-sectional view of the key structure of FIG. 1D along direction 1E-1E'.

FIG. 1F shows a cross-sectional view of the key structure of FIG. 1D along the direction 1F-1F'.

Fig. 2A is a perspective view illustrating the key structure of fig. 1A in a pressed state.

FIG. 2B is a top view of the key structure of FIG. 2A.

FIG. 2C illustrates a cross-sectional view of the key structure of FIG. 2B along direction 2C-2C'.

FIG. 3 is a signal diagram illustrating a process of changing the key structure of FIG. 1B from an un-pressed state to a pressed state.

FIG. 4A is an exploded view of a key structure according to a second embodiment of the present invention in an un-pressed state.

FIG. 4B is a schematic diagram of the key structure of FIG. 4A.

FIG. 4C is a top view of the key structure of FIG. 4B (omitting the key cap).

FIG. 4D is a cross-sectional view of the key structure of FIG. 4C taken along direction 4D-4D'.

FIG. 4E shows a cross-sectional view of the key structure of FIG. 4C taken along direction 4E-4E'.

Fig. 5A is a schematic combination diagram (omitting the key cap) of the key structure of fig. 4B in a pressed state.

FIG. 5B is a top view of the key structure of FIG. 5A.

FIG. 5C illustrates a cross-sectional view of the key structure of FIG. 5B along the direction 5C-5C'.

FIG. 5D shows a cross-sectional view of the key structure of FIG. 5B along the direction 5D-5D'.

FIG. 6 is a signal diagram illustrating the process of changing the key structure of FIG. 4B from an un-depressed state to a depressed state.

FIG. 7A is an exploded view of a key structure according to a third embodiment of the present invention in an un-pressed state.

FIG. 7B is a schematic diagram of the key structure of FIG. 7A.

FIG. 7C is a schematic diagram of the key structure of FIG. 7B with the keycap omitted.

FIG. 7D shows a cross-sectional view of the key structure of FIG. 7C taken along direction 7D-7D'.

Fig. 7E is a top view of the pad of fig. 7C.

FIG. 8 is a cross-sectional view of the key structure of FIG. 7D in a depressed state.

FIG. 9 is a cross-sectional view of a key structure according to a fourth embodiment of the invention in an un-pressed state.

Fig. 10A is a schematic perspective view illustrating a key structure according to a fifth embodiment of the invention in an un-pressed state.

FIG. 10B is a top view of the key structure of FIG. 10A.

FIG. 10C illustrates a cross-sectional view of the key structure of FIG. 10B taken along direction 10C-10C'.

Fig. 11 is a schematic view illustrating a flexible conductive member according to another embodiment of the invention.

Detailed Description

Referring to fig. 1A to 2C, fig. 1A is an exploded view of a key structure 100 according to a first embodiment of the invention, fig. 1B is an assembled view (in an un-pressed state) of the key structure 100 according to fig. 1A, fig. 1C is a schematic view of the key structure 100 of fig. 1B with a keycap omitted, fig. 1D is a top view of the key structure 100 of fig. 1C, fig. 1E is a cross-sectional view of the key structure 100 of fig. 1D along a direction 1E-1E ', fig. 1F is a cross-sectional view of the key structure 100 of fig. 1D along a direction 1F-1F', fig. 2A is a perspective view of the key structure 100 of fig. 1A in a pressed state, fig. 2B is a top view of the key structure 100 of fig. 2A, and fig. 2C is a cross-sectional view of the key structure 100 of fig. 2B along a direction 2C-2.

As shown in fig. 1A to 1C, the key structure 100 includes a key cap 110, a circuit board 120, a lifting mechanism 130, a conductive frame 140, a controller 150, a bottom plate 160, a magnetic member 170, and a magnetic portion 180. The key cap 110, the lifting mechanism 130, the conductive frame 140, the magnetic member 170 and the magnetic portion 180 may form a set of keys. The key structure 100 of the embodiment of the invention is illustrated by taking a group of keys as an example, but the key structure 100 can also be applied to a plurality of groups of keys included in a keyboard.

The circuit board 120 includes a first pad 121 and a second pad 122. The elevating mechanism 130 is disposed between the circuit board 120 and the key cap 110. The key cap 110 moves up and down relative to the circuit board 120 via the elevating mechanism 130. The conductive frame 140 is disposed on the elevating mechanism 130 to move up and down with the elevating mechanism 130. The conductive frame 140 includes a first conductive portion 141 and a second conductive portion 142 respectively located above the first pad 121 and the second pad 122. The movement path M1 (shown in fig. 1E and fig. 2C) of the first conductive portion 141 and the movement path of the second conductive portion 142 can respectively reach the first pad 121 and the second pad 122, so that the first conductive portion 141 and the second conductive portion 142 can contact the first pad 121 and the second pad 122 during the movement process. When the first conductive portion 141 and the second conductive portion 142 respectively contact the first pad 121 and the second pad 122, the first pad 121, the first conductive portion 141, the second conductive portion 142 and the second pad 122 form a first cross current path L1.

As shown in fig. 1D, the first pads 121 and the second pads 122 are separated by a predetermined distance S1. The lifting mechanism 130 moves up and down between a higher position PH (or release position, hereinafter, shown in fig. 1E) and a lower position PL (or press position, hereinafter, shown in fig. 2C) relative to the circuit board 120. The conductive frame 140 is disposed on the lifting mechanism 130 to move up and down along with the lifting mechanism 130, the conductive frame 140 includes a first conductive portion 141, a second conductive portion 142 and a transverse conductive portion 143, the first conductive portion 141 and the second conductive portion 142 are respectively located above the first pad 121 and the second pad 122, the transverse conductive portion 143 is located between the first conductive portion 141 and the second conductive portion 142, and an extension length S2 (shown in fig. 1D) of the transverse conductive portion 143 exceeds a predetermined distance S1 (shown in fig. 1D). When the key cap 110 is located at the higher position PH (the key cap 110 is in the non-pressed state as shown in fig. 1E), the first conductive part 141 and the second conductive part 142 respectively contact the first pad 121 and the second pad 122, so that the electric energy of the first pad 121 sequentially flows through the first conductive part 141, the transverse conductive part 143, and the second conductive part 142 to reach the second pad 122, and the current transmission path is shown in fig. 1C. When the keycap 110 is pressed to be located at the lower position PL (as shown in fig. 2C), the first conductive part 141 and the second conductive part 142 are respectively away from the first pad 121 and the second pad 122, so that the first pad 121 and the second pad 122 are electrically isolated.

The key structure 100 of the embodiment of the invention uses the circuit board 120 to replace the conventional flexible Membrane switch layer (Membrane Switches layer). Since the circuit board 120 is a hard board, the compressibility of the material itself does not need to be overcome as long as the two conductive portions of the conductive frame 140 contact the pads on the circuit board 120, i.e., the first cross current path L1 is formed. Therefore, the triggering reliability of the key structure 100 according to the embodiment of the invention is higher than that of the conventional membrane switch layer.

Structurally, the circuit board 120 includes a substrate, which may be a single layer or a multi-layer structure. When the substrate is a single layer board, the substrate is a dielectric, such as polyimide (polyimide), etc. When the substrate is a multilayer board, the substrate may be a core (core) substrate, for example, composed of a ceramic material, an organic material, a Fiber-reinforced organic material (Fiber-reinforced) or a Particle-reinforced organic material (Particle-reinforced), and the like, and the specific materials are as follows: epoxy resin (Epoxy resin), poly (acetamide), bis (succinimide)/tris (nitrogen trap) resin (BT), cyanoester (Cyanate ester), etc., or a core substrate having a surface coated with a dielectric layer and having a completed core circuit layout.

As shown in fig. 1C to 1E, the lifting mechanism 130 is pivotally connected to the base plate 160 and the lifting mechanism 130 includes a first lifting member 131 and a second lifting member 132. The base plate 160 is disposed between the circuit board 120 and the key cap 110. The first lifting member 131 and the bottom plate 160 are pivotally connected to the first pivot point P1, and the second lifting member 132 and the bottom plate 160 are pivotally connected to the second pivot point P2. When the lifting mechanism 130 performs a lifting motion, the first lifting member 131 rotates relative to the first pivot point P1, and the second lifting member 132 rotates relative to the second pivot point P2.

As shown in fig. 1A, the lifting mechanism 130 according to the embodiment of the present invention is exemplified by a butterfly scissor-foot mechanism. Fig. 1D is a top view, but if the side view of fig. 1D (as viewed from the + Y direction), the first conductive part 141 (or the second conductive part 142) is located between the first pivot point P1 and the second pivot point P2. Thus, when the key structure 100 is in the non-pressed state (as shown in fig. 1E), the first conductive portion 141 contacts the first pad 121, and the second conductive portion 142 (not shown in fig. 1E) contacts the second pad 122 (not shown in fig. 1E); when the key structure 100 is in a pressed state (as shown in fig. 2C), the first conductive portion 141 is separated from the first pad 121, and the second conductive portion 142 (not shown in fig. 2C) is separated from the second pad 122 (not shown in fig. 2C).

As shown in fig. 1D and fig. 1F, the conductive frame 140 further includes a plurality of connection elastic pieces 144, wherein the first conductive portion 141, the second conductive portion 142 and the connection elastic pieces 144 are connected to the transverse conductive portion 143. In the embodiment, the first conductive portion 141, the second conductive portion 142, the bonding spring 144 and the lateral conductive portion 143 are, for example, integrally formed structures. For example, the conductive frame 140 is a plate member formed by a sheet metal working method. In terms of material, the material of the conductive frame 140 is, for example, copper, aluminum or other materials with excellent conductivity.

As shown in fig. 1A and 1C, the lateral conductive portion 143 is disposed above the elevating mechanism 130, and the first conductive portion 141 and the second conductive portion 142 are connected to the lateral conductive portion 143 and extend from the lateral conductive portion 143 toward the circuit board 120. Thus, when the key structure 100 is changed from the pressed state (as shown in fig. 2C) to the non-pressed state (as shown in fig. 1E), the conductive portions (the first conductive portion 141 and the second conductive portion 142) are close to the pads (the first pad 121 and the second pad 122). In addition, as shown in fig. 1E, the first conductive portion 141 includes a flexible portion 1411 and a contact portion 1412 connected to each other, the flexible portion 1411 connects the lateral conductive portion 143 and the contact portion 1412, and an obtuse angle a1 is formed between the contact portion 1412 and the flexible portion 1411, so as to provide good flexibility to the first conductive portion 141. In one embodiment, the flexible portion 1411 and the contact portion 1412 are integrally formed.

As shown in fig. 1F, the conductive frame 140 is engaged with the first lifting member 131. For example, the first lifter 131 has a plurality of coupling holes 131 a. When the conductive frame 140 is combined with the first lifting member 131, each of the combining elastic pieces 144 passes through the corresponding combining hole 131a and extends into the interior or the lower portion of the first lifting member 131 to be engaged with the first lifting member 131. In addition, as shown in fig. 1D, the magnetic element 170 includes at least one engaging elastic piece 171, which passes through the engaging hole 132a of the second lifting element 132 and extends into the interior or the lower portion of the second lifting element 132 to be engaged with the second lifting element 132. The structure of the connection elastic piece 171 is similar to the connection elastic piece 144, and is not described herein again.

Referring to fig. 3, a signal variation diagram of a process of changing the key structure 100 of fig. 1B from the un-pressed state to the pressed state is shown. As shown, the curve C11 represents the relationship between the pressing stroke and the pressing force F1 (the pressing force F1 is illustrated in fig. 2C), wherein the lowest point C11a of the curve C11 represents the stroke point when the hand feels that the key lifting mechanism 130 hits the bottom plate 160 or the circuit board 120. Curve C12 represents the relationship between the compression stroke and the voltage detected by the controller 150, while curve C13 represents the delayed and inverted signal curve for curve C12. As shown, the high H1 area of the curve C12 represents the signal detected by the controller 150 when the key structure 100 is in the un-pressed state, and the low H2 area of the curve C12 represents the signal detected by the controller 150 when the key structure 100 is in the pressed state. As shown in the curve C12, since the first cross current path L1 forms a closed loop when the key structure 100 is in the non-pressed state, the controller 150 detects the electrical signal (high level H1) of the first cross current path L1. Since the first cross current path L1 forms an open loop (open) when the key structure 100 is in the pressed state, no current flows through the controller 150, and the controller 150 indicates the detection state at a low level.

The controller 150 is configured to: (1) detecting a voltage change of the first cross current path L1, as shown by curve C12; (2) a transition point Pa at which the voltage variation of the curve C12 changes from the high level H1 to the low level H2 is determined, wherein the transition point Pa represents a travel point at which the first cross current path L1 transitions from a closed loop (the key structure 100 is in an un-pressed state) to an open loop (the key structure 100 is in a pressed state); (3) after delaying the transformation point Pa by a stroke Δ P, the voltage change is reversed to obtain the curve C13. The controller 150 delays the transition point Pa by a stroke Δ P such that the transition point Pb of the curve C13 (after inversion) corresponds to or slightly lags the lowest point C11a of the curve C11 (which provides positive feedback to the user as the lift mechanism 130 is touched by hand upon impact with the base plate 160 or circuit board 120, thus informing the user of the point of stroke at which the switch is activated).

The controller 150 sends a trigger signal when detecting the transition point Pb. Specifically, the controller 150 does not send the trigger signal when detecting the transition point Pa, but sends the trigger signal after delaying the transition point Pa by a stroke Δ P. The delayed transition point Pb roughly corresponds to or slightly lags the lowest point C11a of the curve C11 (the point of travel where the force feedback is felt by the hand to indicate switch activation). Thus, the user does not feel the touch of the key structure 100 being triggered, and the controller 150 sends out the trigger signal. In addition, the trigger signal can be sent to a processor (processor) of an electronic device (not shown), and the processor can execute a function corresponding to the trigger signal. In one embodiment, the delay time (e.g., the stroke Δ P) of the electrical signal triggering can be arbitrarily adjusted by the firmware/application program, so that the finger of the user can sense that the triggering time of the key structure 100 is close to the triggering time of the controller 150.

In addition, the key structure 100 of the embodiment of the invention is, for example, a magnetic key structure. In detail, as shown in fig. 1A and 1D, the magnetic part 180 may be disposed on the base plate 160, and the magnetic member 170 may be disposed on the second elevating member 132 to move up and down with the second elevating member 132. An attractive force can be generated between the magnetic element 170 and the magnetic part 180, so that the magnetic element 170 and the magnetic part 180 tend to approach each other, wherein the magnetic element 170 and the magnetic part 180 are disposed opposite to each other, but the embodiment of the invention is not limited thereto. In principle, the magnetic part and the magnetic part are arranged only to make the attraction force meet the product requirement. In addition, when the key structure 100 is in the non-pressed state, the magnetic member 170 is partially in contact with or close to the magnetic part 180. When the key structure 100 is in the pressed state, the magnetic member 170 and the magnetic part 180 are completely separated or away from each other.

The magnetic member 170 may serve as an upward restoring force component. For example, when the key structure 100 is released from the pressed state, the magnetic member 170 and the magnetic portion 180 generate an attractive force to approach each other, so that the key cap 110 returns to the non-pressed state. In addition, as shown in fig. 1A and 1D, the default spacing S1 is greater than the length W1 of the magnetic element 170 (upward restoring force element), so that the magnetic element 170 can be disposed between the first pad 121 and the second pad 122. In one embodiment, the predetermined spacing S1 may be greater than 1/4 of the width W2 of the keycap 110, so as to accommodate the larger-sized magnetic member 170.

In another embodiment, the upward restoring force component is, for example, a Rubber elastomer (Rubber Dome), which may be disposed in an area between the first and

second lifters

131 and 132 and between the key cap 110 and the base plate 160; when the key structure 100 is released from the pressed state (the rubber elastic body is pressed to store the elastic potential energy), the rubber elastic body releases the elastic potential energy and tends to return the key cap 110 upward to the non-pressed state. In another embodiment, the upward restoring force component is, for example, a spring, which can horizontally connect the first lifter 131 and the second lifter 132; when the key structure 100 is released from the pressed state (the spring is deformed to store the elastic potential energy), the spring releases the elastic potential energy to tend to move the first lifting member 131 and the second lifting member 132 to return the key cap 110 to the non-pressed state. In other embodiments, a spring may vertically connect the keycap 110 with the base plate 160; similarly, when the key structure 100 is released from the pressed state (the spring deforms to store the elastic potential energy), the spring releases the elastic potential energy and tends to return the key cap 110 upward to the non-pressed state.

Referring to fig. 4A to 5D, fig. 4A is an exploded view illustrating a key structure 200 according to a second embodiment of the invention in an un-pressed state, fig. 4B is an assembly diagram of the key structure 200 of fig. 4A, fig. 4C is a top view of the key structure 200 of fig. 4B (omitting the key cap 110), figure 4D illustrates a cross-sectional view of the key structure 200 of figure 4C taken along direction 4D-4D', while figure 4E shows a cross-sectional view of the key structure 200 of figure 4C taken along direction 4E-4E', figure 5A shows a schematic combination diagram of the key structure 200 of figure 4B in a pressed state (omitting the key cap 110), FIG. 5B illustrates a top view of the key structure 200 of FIG. 5A, FIG. 5C illustrates a cross-sectional view of the key structure 200 of FIG. 5B along the direction 5C-5C', and FIG. 5D shows a cross-sectional view of the key structure 200 of FIG. 5B along the direction 5D-5D'.

As shown in fig. 4A to 4E, the key structure 200 includes a key cap 110, a circuit board 120, a lifting mechanism 130, a conductive frame 240, a controller 150 (not shown), a bottom plate 160, a magnetic member 270, and a magnetic portion 180. The circuit board 120 includes a first pad 121 and a second pad 122. The elevating mechanism 130 is disposed between the circuit board 120 and the key cap 110. The key cap 110 moves up and down relative to the circuit board 120 via the elevating mechanism 130. The conductive frame 240 is disposed on the lifting mechanism 130 to move up and down along with the lifting mechanism 130, and the conductive frame 240 includes a first conductive portion 241 and a second conductive portion 242 respectively located above the first pad 121 and the second pad 122. A movement path M1 (shown in fig. 4E) of the first conductive portion 241 and a movement path of the second conductive portion 242 may respectively reach the first pad 121 and the second pad 122, so that the first conductive portion 241 and the second conductive portion 242 may contact the first pad 121 and the second pad 122 during the movement process. When the first conductive portion 241 and the second conductive portion 242 contact the first pad 121 and the second pad 122, respectively, the first pad 121, the first conductive portion 241, the second conductive portion 242 and the second pad 122 form a first cross current path L1.

In addition, the positions of the conductive portions (e.g., the first conductive portion 241 and the second conductive portion 242) of the key structure 200 are different from the positions of the conductive portions (e.g., the first conductive portion 141 and the second conductive portion 142) of the key structure 100. For example, fig. 4C is a top view, but if the side view of fig. 4C (as viewed from the + Y direction), the first pivot point P1 is located between the first conductive part 241 and the second pivot point P2. Thus, when the key structure 100 is in the non-pressed state (as shown in fig. 4E), the first conductive portion 241 does not contact the first pad 121, and the second conductive portion 242 (not shown in fig. 4E) does not contact the second pad 122 (not shown in fig. 4E); when the key structure 100 is in a pressed state (as shown in fig. 5D), the first conductive portion 241 contacts the first pad 121, and the second conductive portion 242 (not shown in fig. 5D) contacts the second pad 122 (not shown in fig. 5D), so as to form a first cross current path L1.

The magnetic member 270 may also have a conductive portion structure like the conductive frame 240. For example, as shown in fig. 4C and 4D, the circuit board 120 further includes a third pad 123 and a fourth pad 124. The magnetic member 270 has conductivity, and is disposed on the second lifting member 132 to move up and down with the second lifting member 132. The magnetic element 270 includes a third conductive portion 271 and a fourth conductive portion 272, which are respectively located above the third pad 123 and the fourth pad 124. The movement path M2 (shown in fig. 4D) of the third conductive portion 271 and the movement path of the fourth conductive portion 272 can respectively reach the third pad 123 and the fourth pad 124, so that the third conductive portion 271 and the fourth conductive portion 272 can respectively contact the third pad 123 and the fourth pad 124 during the movement process. As shown in fig. 5A, (1) when the first conductive part 241 and the second conductive part 242 contact the first pad 121 and the second pad 122, respectively, a first cross current path L1 is formed between the first pad 121, the first conductive part 241, the second conductive part 242, and the second pad 122; (2) when the third conductive portion 271 and the fourth conductive portion 272 contact the third pad 123 and the fourth pad 124, respectively, a second cross current path L2 is formed between the third pad 123, the third conductive portion 271, the fourth conductive portion 272 and the fourth pad 124.

Referring to fig. 6, a signal variation diagram of a process of changing the key structure 200 of fig. 4B from the un-pressed state to the pressed state is shown. The signal variation diagrams of the key structures 300-500 of the embodiments are also similar to fig. 6, and are not repeated herein. As shown, the curve C21 represents the pressing stroke versus the pressing force, the curve C22 represents the pressing stroke versus the voltage detected by the controller 150, and the curve C23 represents the delayed signal curve of the curve C22. The low H2 region of the curve C22 represents the signal detected by the controller 150 when the key structure 100 is in the non-pressed state (the first cross current path L1 is open loop), and the high H1 region of the curve C22 represents the signal detected by the controller 150 when the key structure 100 is in the pressed state (the first cross current path L1 is closed loop). The lowest point C21a represents a travel point at which the hand senses that the key lift mechanism 130 is in impact contact with the base plate 160 or the circuit board 120, as shown by the curve C21, to generate a positive feedback. As shown in the curve C22, since the first cross current path L1 forms an open loop when the key structure 100 is in the non-pressed state, no current flows through the controller 150, and the controller 150 indicates the detection state at a low level. Since the first cross current path L1 forms a closed loop when the key structure 100 is in the pressed state, the controller 150 detects the electrical signal (high level H1) of the first cross current path L1.

In this embodiment, the controller 150 is configured to: (1) detecting a voltage change of the first cross current path L1, as shown by curve C22; (2) determining a transition point Pa at which the voltage variation of the curve C22 changes from the low level H2 to the high level H1, wherein the transition point Pa represents a stroke point at which the first cross current path L1 transitions from an open loop (the key structure 100 is in an un-pressed state) to a closed loop (the key structure 100 is in a pressed state); (3) after delaying the transformation point Pa by a stroke Δ P, curve C23 is obtained. The controller 150 delays the transition point Pa by a stroke Δ P such that the transition point Pb of the curve C23 corresponds to or slightly lags the lowest point C21a of the curve C21 (the point of the stroke where the elevator mechanism 130 is sensed by hand to impact the base plate 160 or the circuit board 120 to generate a forced feedback).

The controller 150 sends a trigger signal when detecting the transition point Pb. Specifically, the controller 150 does not send the trigger signal when detecting the transition point Pa, but sends the trigger signal after delaying the transition point Pa by a stroke Δ P. The delayed transition point Pb roughly corresponds to or slightly lags the lowest point C21a of the curve C21 (the point of travel at which the hand feels forced feedback). Thus, the user does not feel the touch of the key structure 200 being triggered, and the controller 150 sends out the trigger signal. In addition, the trigger signal can be sent to a processor of an electronic device (not shown), and the processor can execute a function corresponding to the trigger signal accordingly. In one embodiment, the delay time (e.g., the stroke Δ P) of the electrical signal triggering can be arbitrarily adjusted by the firmware/application program, so that the finger of the user can sense that the triggering time of the key structure 100 is close to the triggering time of the controller 150.

Referring to fig. 7A to 7D and fig. 8, fig. 7A is an exploded view illustrating a key structure 300 in an un-pressed state according to a third embodiment of the invention, fig. 7B is an assembled view illustrating the key structure 300 of fig. 7A, fig. 7C is a schematic view illustrating the key structure 300 of fig. 7B without the key cap 110, fig. 7D is a cross-sectional view illustrating the key structure 300 of fig. 7C along a direction 7D-7D', fig. 7E is a top view illustrating the pad 321 of fig. 7C, and fig. 8 is a cross-sectional view illustrating the key structure 300 of fig. 7D in a pressed state.

As shown in fig. 7A to 7E, the key structure 300 includes a key cap 310, a circuit board 320, a lifting mechanism 330, a flexible conductive member 340, a controller 350, a bottom plate 360 and an elastic member 370. As shown in fig. 7C and 7E, the circuit board 320 includes at least one contact pad 321, and the contact pad 321 includes an anode 321A and a cathode 321B adjacent to each other. The elevating mechanism 330 is disposed between the circuit board 320 and the key cap 310, and the key cap 310 moves up and down with respect to the circuit board 320 via the elevating mechanism 330. In the embodiment of the invention, the flexible conductive element 340 is disposed at the bottom of the lifting mechanism 330, so that the moving path of the bottom region 340R of the flexible conductive element 340 can reach the positive electrode 321A and the negative electrode 321B along with the movement of the lifting mechanism 330. When the bottom region 340R of the flexible conductive member 340 contacts the positive electrode 321A and the negative electrode 321B, the positive electrode 321A and the negative electrode 321B are conducted.

As shown in fig. 7E, the positive electrode 321A (e.g., the first pad) and the negative electrode 321B (e.g., the second pad) of the circuit board 320 are separated by a space SP 1. As shown in fig. 7D, the lifting mechanism 330 is disposed between the circuit board 320 and the key cap 310, and the key cap 310 moves up and down between a higher position PH (or release position, hereinafter, shown in fig. 7D) and a lower position PL (or press position, hereinafter, shown in fig. 8) relative to the circuit board 320 via the lifting mechanism 330. The flexible conductive element 340 includes an upper bonding portion 341, a middle elastic portion 342, and a lower conductive portion 343, wherein the middle elastic portion 342 connects the upper bonding portion 341 and the lower conductive portion 343. The middle elastic portion 342 and the lower conductive portion 343 are deformable relative to the upper bonding portion 341, which provides flexibility to the flexible conductive member 340. The flexible conductive member 340 is coupled to the bottom of the lifting mechanism 330 by the upper-stage coupling portion 341 to move along with the lifting mechanism 330, and the size of the lower-stage conductive portion 343 is larger than the spacer SP1 (the spacer SP1 is shown in fig. 7E). As shown in fig. 7D and 7E, when the key cap 310 is located at the higher position PH, the lower conductive part 343 is away from the positive electrode 321A and the negative electrode 321B, so that the positive electrode 321A and the negative electrode 321B are electrically isolated. As shown in fig. 8, when the key cap 310 is pressed to be located at the lower position PL, the lower conductive portion 343 covers the spacer SP1 and is in surface contact with a portion of the positive electrode 321A (e.g., a portion of the first pad) and a portion of the negative electrode 321B (e.g., a portion of the second pad), so that the power of the positive electrode 321A flows through the lower conductive portion 343 to reach the negative electrode 321B. When the flexible conductive member 340 triggers the pad 321 (receives a pressing force F1), the lower conductive part 343 is in surface contact with the positive electrode 321A and the negative electrode 321B, and the middle elastic part 342 is deformed by slightly moving up and down in accordance with the force of the user pressing the key cap 310.

A dashed box R1 shown in fig. 7E indicates a region where the bottom region 340R of the flexible conductive member 340 contacts the positive electrode 321A and the negative electrode 321B. When the bottom region 340R of the flexible conductive member 340 contacts the positive electrode 321A and the negative electrode 321B, the positive electrode 321A and the negative electrode 321B are conducted. The controller 350 is electrically connected to the anode 321A and the cathode 321B of each pad 321. When the controller 350 detects that the anode 321A and the cathode 321B are turned on, the corresponding function is executed.

As shown in fig. 7C, in the present embodiment, the lifting mechanism 330 is, for example, a cross-type scissor-foot mechanism. Base 360 is disposed between circuit board 320 and keycap 310. The lifting mechanism 330 is pivotally connected to the base plate 360, and the lifting mechanism 330 includes a first lifting member 331 and a second lifting member 332, and the first lifting member 331 includes a pivotally connecting end 331A, a free end 331B and a pivotally connecting portion 331C. The first lifter 331 is pivotally connected to the second lifter 332 through a pivotal portion 331C. The pivoting end 331A of the first lifting member 331 is pivoted to the base plate 360. The second lifting member 332 has a structure similar to that of the first lifting member 331, and thus, the description thereof is omitted. The flexible conductive member 340 is disposed at the bottom of the free end 331B of the first lifting member 331 and/or at the bottom of the free end (not labeled) of the second lifting member 332.

As shown in fig. 7C, elastic member 370 is disposed between keycap 310 and base plate 360. When the key structure 300 is in the pressed state, as shown in fig. 8, the elastic element 370 is compressed to store an elastic potential energy. When the pressing force is released, the elastic potential of the elastic member 370 is also released to push the key cap 310 upward, so that the key structure 300 returns to the non-pressed state. In the present embodiment, the elastic member 370 is, for example, an elastic rubber body.

In addition, in another embodiment, the key structure 300 includes a plurality of flexible conductive members 340, one or some of which may be disposed on the bottom of the lifting mechanism 330, and another or some of which may be disposed on the bottom surface of the key cap 310. In other embodiments, all of the flexible conductive member 340 of the key structure 300 may be disposed at the bottom of the lifting mechanism 330, or all of the flexible conductive member 340 may be disposed at the bottom of the key cap 310.

Referring to fig. 9, a cross-sectional view of a key structure 400 according to a fourth embodiment of the invention in an un-pressed state is shown. The key structure 400 includes a key cap 310, a circuit board 320, a lifting mechanism 330, at least one flexible conductive member 340, a controller 350 (not shown), a bottom plate 360 and an elastic member 470.

The key structure 400 of the embodiment of the invention has a structure similar to the structure of the key structure 300, except that one flexible conductive member 340 'can be disposed on the bottom surface 310b of the key cap 310, for example, at the middle position of the bottom surface 310b, and the elastic member 470 of the key structure 400 is a spring surrounding the flexible conductive member 340'. In design, when the key structure 400 is in the release state, each flexible conductive element 340 is separated from the corresponding pad 321. When the key structure 400 is in the pressed state, each flexible conductive element 340 substantially contacts the corresponding pad 321. When the key structure 400 is in a pressed state, the controller 350 (not shown) performs a corresponding function as long as one of the flexible conductive elements 340 contacts the pad 321. In other words, since the number of the flexible conductive elements 340 is plural, the triggering reliability of the key structure 400 can be increased.

Referring to fig. 10A to 10C, fig. 10A is a schematic perspective view illustrating a key structure 500 according to a fifth embodiment of the invention in an un-pressed state, fig. 10B is a top view of the key structure 500 of fig. 10A, and fig. 10C is a cross-sectional view of the key structure 500 of fig. 10B along a direction 10C-10C'.

The key structure 500 includes a key cap 110, a circuit board 320, a lifting mechanism 130, a conductive frame 540 (or referred to as a metal member 540), at least one flexible conductive member 340, a controller 150, a bottom plate 160 and a magnetic member 170. In this embodiment, the key structure 500 of the embodiment of the invention has a structure similar to the key structure 100, except that the conductive frame 540 may not have a conductive portion (such as the first conductive portion 141 and the second conductive portion 142), and the flexible conductive member 340 is disposed at the bottom of the lifting mechanism 130 (the butterfly scissor-leg mechanism). In addition, in the embodiment, the manner in which the flexible conductive element 340 is disposed on the lifting mechanism 130 is similar to or the same as the manner in which the flexible conductive element 340 is disposed on the lifting mechanism 330, and thus, the description thereof is omitted.

As shown in fig. 10A and 10C, the flexible conductive member 340 may also be disposed on the bottom surface of the key cap 110. The flexible conductive member 340 may be disposed at the edge and/or the middle of the bottom surface of the key cap 110.

Referring to fig. 11, a schematic diagram of a flexible conductive element 640 according to another embodiment of the invention is shown. Similar to the configuration of the flexible conductive element 340, the flexible conductive element 640 may be embedded in the lifting mechanism. The flexible conductive device 640 includes an upper bonding portion 641, a middle connecting portion 642 and a lower conductive portion 643, wherein the middle connecting portion 642 connects the upper bonding portion 641 and the lower conductive portion 643. The upper section combining portion 641 and the middle section connecting portion 642 may be embedded in the lifting mechanism according to any embodiment of the present invention. Since the outer diameter of the upper-stage coupling portion 641 is greater than that of the middle-stage connecting portion 642, the upper-stage coupling portion 641 embedded in the elevating mechanism is not easily separated from the elevating mechanism. When the upper section combining portion 641 and the middle section connecting portion 642 are embedded in the elevating mechanism, the lower conductive portion 643 is exposed from the elevating mechanism to contact the pad of the circuit board. The lower conductive part 643 includes a protrusion 643A and a groove 643B, the protrusion 643A protrudes from the circumferential annular groove 643B, so that the protrusion 643A is deformable relative to the circumference, which provides flexibility to the flexible conductive part 640. In terms of manufacturing process, the flexible conductive member 640 is a sheet metal member manufactured by a sheet metal working method, so that the flexibility of the flexible conductive member 640 can be further increased. In addition, in an embodiment, the upper connecting portion 641, the middle connecting portion 642 and the lower conductive portion 643 are integrally formed.

The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims. The scope of the invention is therefore to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.

Claims

1. A key structure, comprising:

a keycap;

the circuit board comprises a first connecting pad and a second connecting pad;

the lifting mechanism is arranged between the circuit board and the keycap and comprises a first lifting piece and a second lifting piece, and the keycap moves up and down relative to the circuit board through the first lifting piece and the second lifting piece of the lifting mechanism; and

the conductive frame is arranged on the first lifting element of the lifting mechanism and moves up and down along with the lifting mechanism, the conductive frame comprises a first conductive part and a second conductive part which are respectively positioned above the first connecting pad and the second connecting pad, and the motion path of the first conductive part and the motion path of the second conductive part respectively reach the first connecting pad and the second connecting pad;

the upward restoring force component restores the keycap to an unpressed state when the key structure is released from a pressed state;

when the first conductive part and the second conductive part respectively contact the first pad and the second pad, the first conductive part, the second conductive part and the second pad form a first cross current path.

2. The key structure of claim 1, further comprising:

the bottom plate is arranged between the circuit board and the keycap;

wherein the lifting mechanism is pivoted on the bottom plate, the first lifting piece and the bottom plate are pivoted on a first pivoting point, the second lifting piece and the bottom plate are pivoted on a second pivoting point,

the first conductive part is positioned between the first pivot point and the second pivot point; or

The first pivot point is located between the first conductive part and the second pivot point.

3. The key structure according to claim 2, wherein: the circuit board further includes a third pad and a fourth pad, and the upward restoring force element further includes:

the magnetic element is provided with electric conductivity, is configured on the second lifting element and moves up and down along with the second lifting element, and comprises a third conductive part and a fourth conductive part which are respectively positioned above the third connecting pad and the fourth connecting pad, and the motion path of the third conductive part and the motion path of the fourth conductive part respectively reach the third connecting pad and the fourth connecting pad;

when the third conductive part and the fourth conductive part respectively contact the third pad and the fourth pad, the third pad, the fourth conductive part, the third conductive part and the fourth pad form a second cross current path.

4. A key structure, comprising:

a keycap;

the circuit board comprises a first connecting pad and a second connecting pad;

the lifting mechanism is arranged between the circuit board and the keycap, and the keycap moves up and down relative to the circuit board through the lifting mechanism; and

the conductive frame is arranged on the lifting mechanism and moves up and down along with the lifting mechanism, the conductive frame comprises a first conductive part and a second conductive part which are respectively positioned above the first connecting pad and the second connecting pad, and the motion path of the first conductive part and the motion path of the second conductive part respectively reach the first connecting pad and the second connecting pad;

when the first conductive part and the second conductive part respectively contact the first pad and the second pad, the first conductive part, the second conductive part and the second pad form a first cross current path;

the conductive frame further comprises a transverse conductive part, the transverse conductive part is arranged above the lifting mechanism, the first conductive part and the second conductive part are connected with the transverse conductive part, and the first conductive part and the second conductive part extend from the transverse conductive part to the direction of the circuit board.

5. The key structure according to claim 4, wherein: the first conductive portion includes a flexible portion and a contact portion connected to each other, the flexible portion connects the lateral conductive portion and the contact portion, and an obtuse angle is formed between the contact portion and the flexible portion.

6. A key structure, comprising:

a keycap;

the circuit board comprises a first connecting pad and a second connecting pad, wherein the first connecting pad and the second connecting pad are spaced by a preset distance;

the lifting mechanism is arranged between the circuit board and the keycap, and the keycap moves up and down between a release position and a pressing position relative to the circuit board through the lifting mechanism; and

the conductive frame is arranged on the lifting mechanism and moves up and down along with the lifting mechanism, the conductive frame comprises a first conductive part, a second conductive part and a transverse conductive part, the first conductive part and the second conductive part are respectively positioned above the first pad and the second pad, the transverse conductive part is positioned between the first conductive part and the second conductive part, and the extension length of the transverse conductive part exceeds the preset interval;

when the keycap is located at the release position, the first conductive part and the second conductive part are respectively far away from the first connecting pad and the second connecting pad, so that the first connecting pad and the second connecting pad are kept electrically isolated;

when the keycap is pressed to be located at the pressing position, the first conductive part and the second conductive part respectively contact the first connecting pad and the second connecting pad, and electric energy of the first connecting pad sequentially flows through the first conductive part, the transverse conductive part and the second conductive part to reach the second connecting pad.

7. The key structure of claim 6, further comprising:

a controller to:

detecting a voltage change across the first current path;

determining a transition point at which the voltage change changes from a high level to a low level; and

after delaying the transition point, the voltage change is reversed.

8. The key structure of claim 6, further comprising an upward restoring force element, the predetermined spacing being greater than the upward restoring force element such that the upward restoring force element is disposed between the first pad and the second pad, the predetermined spacing being greater than 1/4 of the width of the keycap.

9. The key structure according to claim 6, wherein: the conductive frame further comprises a plurality of combining elastic sheets, the lifting mechanism further comprises a plurality of combining holes, and the combining elastic sheets are respectively embedded into the combining holes, so that the conductive frame is combined on the lifting mechanism.

10. A key structure, comprising:

a keycap;

a circuit board comprising a pad comprising an anode and a cathode adjacent to each other;

the flexible conductive piece comprises an upper section combining part, a middle section elastic part and a lower section conductive part, and is configured at the bottom of the lifting mechanism or the bottom of the keycap by the upper section combining part so as to move along with the lifting mechanism, and the movement path of the bottom area of the flexible conductive piece reaches the anode and the cathode;

when the bottom area of the flexible conductive member contacts the positive electrode and the negative electrode, the positive electrode and the negative electrode are conducted.

11. The key structure of claim 10, wherein the key structure further comprises:

a conductive frame disposed on the lifting mechanism to move up and down along with the lifting mechanism, the conductive frame having the flexible conductive member; and

the bottom plate is arranged between the circuit board and the keycap;

the lifting mechanism is pivoted to the bottom plate and comprises a first lifting piece and a second lifting piece, the first lifting piece and the bottom plate are pivoted to a first pivot point, the second lifting piece and the bottom plate are pivoted to a second pivot point, and the first pivot point is located between the flexible conductive piece and the second pivot point.

12. The key structure of claim 10, wherein the key structure further comprises:

the bottom plate is arranged between the circuit board and the keycap;

the lifting mechanism is pivoted to the bottom plate and comprises a first lifting piece and a second lifting piece, the first lifting piece comprises a pivoting end, a free end and a pivoting part, the first lifting piece is pivoted with the second lifting piece in a crossed mode through the pivoting part, the pivoting end of the first lifting piece is pivoted to the bottom plate, and the flexible conductive piece is arranged at the bottom of the free end.

13. The key structure according to claim 10, wherein: the flexible conductive member is arranged at the bottom of the keycap; this button structure includes:

the elastic piece is connected to the bottom of the keycap and surrounds the flexible conductive piece.

14. A key structure, comprising:

a keycap;

the circuit board comprises a first connecting pad and a second connecting pad, and the first connecting pad and the second connecting pad are separated by a spacing area;

the flexible conductive piece comprises an upper section combining part, a middle section elastic part and a lower section conductive part, the flexible conductive piece is combined at the bottom of the lifting mechanism or the bottom surface of the keycap by the upper section combining part so as to move along with the lifting mechanism, and the size of the lower section conductive part is larger than the interval area;

when the keycap is located at the release position, the lower section of the conductive part is far away from the first connecting pad and the second connecting pad, so that the first connecting pad and the second connecting pad are kept electrically isolated;

when the keycap is pressed to be located at the pressing position, the middle-section elastic part is matched with the keycap to move up and down to deform, so that the lower-section conductive part keeps surface contact and covers the spacing area, part of the first connecting pad and part of the second connecting pad, and electric energy of the first connecting pad flows through the lower-section conductive part to reach the second connecting pad.