CN110176553B - Preparation method of display substrate and display substrate - Google Patents
Preparation method of display substrate and display substrate Download PDFInfo
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- CN110176553B CN110176553B CN201910462902.XA CN201910462902A CN110176553B CN 110176553 B CN110176553 B CN 110176553B CN 201910462902 A CN201910462902 A CN 201910462902A CN 110176553 B CN110176553 B CN 110176553B
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- 239000000758 substrate Substances 0.000 title claims abstract description 60
- 238000002360 preparation method Methods 0.000 title abstract description 19
- 238000005520 cutting process Methods 0.000 claims abstract description 203
- 230000001681 protective effect Effects 0.000 claims abstract description 88
- 238000005452 bending Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 51
- 239000000853 adhesive Substances 0.000 claims description 45
- 230000001070 adhesive effect Effects 0.000 claims description 45
- 239000003292 glue Substances 0.000 claims description 24
- 239000012528 membrane Substances 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 67
- 238000004519 manufacturing process Methods 0.000 description 21
- 230000002093 peripheral effect Effects 0.000 description 13
- 238000005245 sintering Methods 0.000 description 11
- 238000003698 laser cutting Methods 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- 238000000149 argon plasma sintering Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 238000004806 packaging method and process Methods 0.000 description 1
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- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The application discloses a display substrate and a preparation method thereof, which are used for improving the film tearing yield while reducing the film tearing difficulty. The preparation method of the display substrate provided by the embodiment of the application comprises the following steps: arranging a first protective film on the whole back surface of the display panel; wherein, the display panel has: the bending device comprises a to-be-bent area and a first cutting area, wherein the to-be-bent area is connected with the to-be-bent area in the extending direction of at least one to-be-bent area; the first protection film is provided with a second cutting area and a film area to be torn, and the film area to be torn is disconnected with other areas except the film area to be torn; the region to be torn comprises: the film tearing device comprises a first film to be torn area and a second film to be torn area, wherein the first film to be torn area is overlapped with a to-be-bent area, and an area formed by the second film to be torn area and a second cutting area is overlapped with a first cutting area; cutting off the first cutting area and the second cutting area; and taking the first protection film of the second to-be-torn film area as a tearing start end, and tearing off the first protection film of the to-be-torn film area.
Description
Technical Field
The application relates to the technical field of display, in particular to a display substrate and a preparation method thereof.
Background
In the manufacture of the conventional full-screen Organic Light-Emitting Diode (OLED) display product, after an OLED panel attached with a back film is obtained, a terminal bending process is required, and the back film of a bending region is required to be removed in the terminal bending process. In the prior art, the back membrane removal is adopted, namely, a large amount of intensive vertical laser dot matrixes are adopted to 'ablate' grooves in a target area in a laser dot input mode, so that the back membrane in a bending area is removed. However, due to the mutual thermal influence among laser spots, the depth of the laser-removed back film is not easy to control, and is often accompanied with the sintering residue of the back film and Pressure Sensitive Adhesive (PSA), the bottom flatness of the back film-removed area is poor, and there is a risk of foreign matters, and the thermal operation area adopting laser sintering is large, and the sintering edge often has a gap caused by thermal deformation of materials, which affects the form of the sintering edge and further affects the stress distribution.
In summary, in the prior art, the removal of the back film is difficult, sintering residues are likely to occur in the process of removing the back film, and a gap is generated at a sintering edge, which affects the yield of removing the back film and the quality of a display product.
Disclosure of Invention
The embodiment of the application provides a preparation method of a display substrate and the display substrate, which are used for reducing the film tearing difficulty and improving the film tearing yield.
The preparation method of the display substrate provided by the embodiment of the application comprises the following steps:
arranging a first protective film on the whole back surface of the display panel; wherein the display panel has: the bending device comprises a to-be-bent area and a first cutting area, wherein the to-be-bent area is connected with the to-be-bent area in the extending direction of at least one to-be-bent area; the first protection film is provided with a second cutting area and a film area to be torn, and the film area to be torn is disconnected with other areas except the film area to be torn; the region to be torn comprises: the film tearing device comprises a first film to be torn area and a second film to be torn area, wherein the first film to be torn area is overlapped with the area to be bent, and the second film to be torn area and the second cutting area are overlapped with the first cutting area;
cutting off the first cutting area and the second cutting area;
and tearing off the first protection film of the to-be-torn film region by taking the first protection film of the second to-be-torn film region as a tearing start end.
According to the preparation method of the display substrate, the first cutting area and the second cutting area are cut and removed, namely the first cutting area is separated from the display panel along the cutting line, and the second cutting area is separated from the first protection film along the cutting line, so that the first protection film of the second to-be-torn area can be directly torn by taking the first protection film of the second to-be-torn area as a tearing start end when the first protection film of the to-be-torn area is torn, and the tearing difficulty is reduced. And, because the first cutting region is separated from the display panel along the cutting line, the second cutting region is separated from the first protection film along the cutting line, and the region to be torn is disconnected from other regions except the region to be torn, the film layer in the peripheral region of the region to be torn cannot be taken up in the process of tearing the first protection film in the region to be torn, the form of the film layer in the peripheral region of the region to be torn cannot be influenced, and the stress distribution of the film layer in the peripheral region cannot be influenced. The first protection film of the film tearing region is directly torn, the problems that sintering residues, flatness is poor, the shape of a sintering edge is affected and the like caused by the fact that the first protection film is removed through laser sintering can be avoided, and the display panel can be prevented from being scratched. The preparation method of the display substrate provided by the embodiment of the application can ensure the film tearing yield while tearing off the first protection film of the region to be subjected to film tearing, and further ensure the preparation yield of the display substrate.
Optionally, the first cutting area includes two chamfered areas of the display panel, and the cutting removes the first cutting area and the second cutting area, specifically including:
cutting off the first cutting area and the second cutting area in each chamfer area;
or, in one chamfering area, the first cutting area and the second cutting area are cut and removed, and in the other chamfering area, the first cutting area, the second cutting area and the area to be torn which is overlapped with the orthographic projection of the first cutting area are cut and removed.
Optionally, the disposing a first protection film on the entire back surface of the display panel specifically includes:
attaching the first protective film to the back surface of the display panel through a first adhesive whole surface;
cutting off the first cutting area and the second cutting area, specifically including:
cutting each film layer of the display panel penetrating the first laminating glue from one side away from the first protective film along the boundary of the first cutting area;
and cutting the first bonding glue and the first protective film along the boundary of the second cutting area.
Optionally, before or after the first protective film is disposed on the entire back surface of the display panel, the method further includes: attaching a second protective film to the front surface of the display panel through a second adhesive;
cutting each film layer of the display panel penetrating the first bonding glue along the boundary of the first cutting area, and specifically comprises:
and cutting the second protective film, the second bonding glue and the display panel along the boundary of the first cutting area.
Optionally, before tearing the first protection film of the region to be torn, with the first protection film of the region to be torn overlapping with the orthographic projection of the first cutting region as a tearing start end, the method further includes:
and arranging a fixing part on the first protective film outside the region to be torn.
Thereby can further prevent to tear the peripheral rete of taking up and prevent that peripheral rete from splitting in the in-process of treating the dyestripping district, can also avoid treating the damage of each rete of bending district display panel and tearing or dragging the deformation, further improve the dyestripping yield.
Optionally, a fixing component is disposed on the first protection film outside the region to be torn, and specifically includes:
and strip-shaped fixing parts are respectively arranged on the first protection films on two sides of the film tearing and folding area, and the orthographic projection of each strip-shaped fixing part is adjacent to the orthographic projection of the to-be-torn area in the plane direction perpendicular to the display panel.
Like this, at the in-process of tearing the first protection film of treating the dyestripping district, with the first protection film that treats that the dyestripping district is adjacent can not taken up, also can not take place and treat the fracture of the first protection film that the dyestripping district is adjacent, further improve dyestripping yield and display substrate yield.
Optionally, the fixing component includes a buffer layer and a metal layer located on the buffer layer, and a fixing component is disposed on the first protection film outside the region to be torn, specifically including:
outside the region to be bent, a buffer layer controlling the fixing part is in contact with the first protection film.
According to the method for manufacturing the display substrate, the buffer layer in the fixing component is in contact with the first protection film, so that static electricity between the buffer layer and the first protection film can be prevented from being released.
Optionally, after the second protective film is attached to the front surface of the display panel through a second adhesive, the method further includes: disposing a cover plate over the second protective film; the orthographic projection of the cover plate is not overlapped with the orthographic projection of the region to be bent and the orthographic projection of the first cutting region;
after the first protection film of the region to be torn is torn by taking the first protection film of the region to be torn overlapped with the orthographic projection of the first cutting region as a tearing start end, the method further comprises the following steps:
and placing the first cutting area and the area to be bent of the display panel on a supporting carrier, wherein the first protective film deviates from the supporting carrier.
Optionally, with the first protection film of the second to-be-torn region as a tearing start end, tearing off the first protection film of the to-be-torn region, specifically including:
utilize anchor clamps centre gripping with the rete that first cutting zone overlaps, control anchor clamps drive with the rete that first cutting zone overlaps to waiting to tear the rete rotation of membrane district, and follow the line of cut of first protection film removes, tears the first protection film of waiting to tear the membrane district.
Utilize anchor clamps centre gripping with the rete that first cutting region overlaps to thereby control contained angle rotation and removal tear the first protection film in treating the dyestripping district more easily. In addition, the film layer overlapped with the first cutting area is clamped by the clamp and is a film layer needing to be removed, namely the film layer belongs to a production waste film in the display substrate preparation process, the film layer overlapped with the first cutting area is clamped by the clamp, namely the production waste film is utilized as a film tearing handle, namely the film tearing handle clamped by the clamp is not required to be additionally arranged, and the cost can be saved.
According to the display substrate provided by the embodiment of the application, the display substrate is manufactured by the method provided by the embodiment of the application.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view illustrating a method for manufacturing a display substrate according to an embodiment of the present disclosure;
fig. 2 is a schematic front structure view of a display panel to which a first protective film is attached according to an embodiment of the present disclosure;
fig. 3 is a schematic view of a display panel to which a first protective film is attached according to an embodiment of the present disclosure;
fig. 4 is a schematic view of a first protective film of a display panel to which the first protective film is attached according to an embodiment of the present disclosure;
fig. 5 is a schematic view of a back structure of a display panel to which a first protective film is attached according to an embodiment of the present disclosure;
fig. 6 is a schematic front structural view of a display panel to which a first protective film and a second protective film are attached according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram illustrating a back side structure of a display panel to which a first protective film and a second protective film are attached according to an embodiment of the present disclosure;
FIG. 8 is a schematic view of a fastening component provided in accordance with an embodiment of the present application;
FIG. 9 is a schematic view of another fastening component provided in accordance with an embodiment of the present application;
fig. 10 is a schematic view of an arrangement manner of a supporting stage and a fixing member according to an embodiment of the present disclosure;
FIG. 11 is a schematic view of a fixture for holding all layers overlapping a first cutting region according to an embodiment of the present disclosure;
FIG. 12 is a schematic view of another fixture according to an embodiment of the present disclosure holding all film layers overlapping a first cutting region;
fig. 13 is a schematic view of another fixture provided in the embodiment of the present application for clamping all the film layers overlapping the first cutting region.
Detailed Description
An embodiment of the present application provides a method for manufacturing a display substrate, as shown in fig. 1, the method includes:
s101, arranging a first protective film on the whole back surface of the display panel; wherein the display panel has: the bending device comprises a to-be-bent area and a first cutting area, wherein the to-be-bent area is connected with the to-be-bent area in the extending direction of at least one to-be-bent area; the first protection film is provided with a second cutting area and a film area to be torn, and the film area to be torn is disconnected with other areas except the film area to be torn; the region to be torn comprises: the film tearing device comprises a first film to be torn and a second film to be torn, wherein the first film to be torn is superposed with the region to be bent, and an area formed by the second film to be torn and the second cutting region is superposed with the first cutting region;
s102, cutting and removing the first cutting area and the second cutting area;
s103, taking the first protection film of the second to-be-torn film area as a tearing start end, and tearing off the first protection film of the to-be-torn film area.
According to the preparation method of the display substrate, the first cutting area and the second cutting area are cut and removed, namely the first cutting area is separated from the display panel along the cutting line, and the second cutting area is separated from the first protection film along the cutting line, so that the first protection film of the second to-be-torn area can be directly torn by taking the first protection film of the second to-be-torn area as a tearing start end when the first protection film of the to-be-torn area is torn, and the tearing difficulty is reduced. And, because the first cutting region is separated from the display panel along the cutting line, the second cutting region is separated from the first protection film along the cutting line, and the region to be torn is disconnected from other regions except the region to be torn, the film layer in the peripheral region of the region to be torn cannot be taken up in the process of tearing the first protection film in the region to be torn, the form of the film layer in the peripheral region of the region to be torn cannot be influenced, and the stress distribution of the film layer in the peripheral region cannot be influenced. The first protection film of the film tearing region is directly torn, the problems that sintering residues, flatness is poor, the shape of a sintering edge is affected and the like caused by the fact that the first protection film is removed through laser sintering can be avoided, and the display panel can be prevented from being scratched. The preparation method of the display substrate provided by the embodiment of the application can ensure the film tearing yield while tearing off the first protection film of the region to be subjected to film tearing, and further ensure the preparation yield of the display substrate.
In the method for manufacturing a display substrate according to the embodiment of the present application, the region to be peeled is disconnected from other regions except the region to be peeled, for example, the first protection film may be cut along the boundary of the region to be peeled after the first protection film is attached.
The structure formed after step S101 is as shown in fig. 2 to 4, and includes a display panel 1 and a first protection film 2 disposed on the entire back surface of the display panel 1. In order to exemplify the regions of the display panel and the first protective film, fig. 3 shows only the display panel, and fig. 4 shows only the first protective film, wherein, as shown in fig. 3, the display panel 1 has: the bending device comprises a to-be-bent area 3 and a first cutting area 4 connected with the to-be-bent area 3 in the extending direction of at least one to-be-bent area 3. As shown in fig. 4, the first protection film 2 has a second cutting region 6 and a region to be torn 5, and the region to be torn 5 includes: the film cutting device comprises a first film area to be torn 7 and a second film area to be torn 8, wherein the first film area to be torn 7 is overlapped with the area to be bent 3, and an area formed by the second film area to be torn 8 and the second cutting area 6 is overlapped with the first cutting area 4. Subsequently, after step S102, the display panel attached with the first protection film as shown in fig. 2 may be turned over, as shown in fig. 5, so that the first protection film 2 faces upward, and when the first protection film of the region to be torn is torn, for example, the first protection film 2 of the region to be torn 5 in the region 9 in fig. 5 may be used as a tearing start end, and each film layer overlapped with the first cutting region 4 in the region 9 may be used as a tearing handle, so that each film layer covered by the first cutting region 4 in the region 9 rotates counterclockwise along the arrow direction, that is, counterclockwise, to directly tear the first protection film of the region to be torn.
Optionally, the first cutting area includes two chamfered areas of the display panel, and the cutting removes the first cutting area and the second cutting area, specifically including:
cutting off the first cutting area and the second cutting area in each chamfer area;
or, in one chamfering area, the first cutting area and the second cutting area are cut and removed, and in the other chamfering area, the first cutting area, the second cutting area and the area to be torn which is overlapped with the orthographic projection of the first cutting area are cut and removed.
It should be noted that, in order to facilitate bending and save assembly space, all the film layers of the display substrate covered by the chamfering area need to be removed.
Taking the display panel with the first protective film attached as shown in fig. 2 as an example, the first cut region 4 includes two left and right chamfered regions. When the first cutting area comprises two chamfer areas, the first protection film of the to-be-torn film area corresponding to one of the chamfer areas is taken as the tearing starting end.
Therefore, the first cutting area can be separated from the display panel along the cutting line by cutting along the cutting line only in one of the chamfering areas, the second cutting area is separated from the first protection film along the cutting line, and the first to-be-torn film area and the second to-be-torn film area are not cut, so that the second torn film area can be used as a tearing starting end, all the film layers of the display substrate covered by the chamfering area are removed in the other chamfering area, that is, the display panel and the first protection film can be cut along the boundary of the first cutting area, that is, the first to-be-torn film area and the second to-be-torn film area are also cut, so that the first to-be-torn film area and the second to-be-torn film area are separated, and all the film layers of the display substrate corresponding to the chamfering area can be removed.
Of course, the first cutting region and the second cutting region may be cut and removed in each chamfering region, and the second region to be torn corresponding to one of the chamfering regions is used as the beginning end of the torn film, so as to remove the first protection film in the whole region to be torn, and also to remove all the films of the display substrate corresponding to the chamfering region while tearing the film.
Optionally, the disposing a first protection film on the entire back surface of the display panel specifically includes:
attaching the first protective film to the back surface of the display panel through a first adhesive whole surface;
step S102 of cutting off the first cutting region and the second cutting region specifically includes:
s1021, cutting each film layer of the display panel penetrating through the first bonding glue along the boundary of the first cutting area from one side departing from the first protective film;
and S1022, cutting the first bonding glue and the first protective film along the boundary of the second cutting area.
It should be noted that, taking the display panel with the first protective film attached as shown in fig. 2 and 5 as an example, the film-to-be-torn region is located between two second cutting regions, the boundary of the second cutting region for cutting includes a first sub-boundary 10 and a third sub-boundary 12, in fig. 2, the boundary between the first film-to-be-torn region and the second film-to-be-torn region is the second sub-boundary 11, and then the boundary of the first cutting region for cutting coincides with the first sub-boundary 10, the second sub-boundary 11 and the third sub-boundary 12. In specific implementation, each film layer of the display panel penetrating through the first adhesive glue (not shown) is cut along the first sub-boundary 10, the second sub-boundary 11 and the third sub-boundary 12 from the side away from the first protective film 2, and then the first adhesive glue and the first protective film 2 are cut along the first sub-boundary 10 and the third sub-boundary 12, so that the first protective film in the second cut region of the first sub-boundary 10 and the third sub-boundary 12 is broken, and the display panel is broken along the first sub-boundary 10, the second sub-boundary 11 and the third sub-boundary 12.
It should be noted that, for example, the method for manufacturing the display substrate provided in the embodiment of the application may adopt laser cutting, and a certain thickness is reserved on the first protection film as a buffer in consideration of the thickness tolerance of the display panel and the laser cutting depth tolerance, so as to prevent the first protection film from being damaged by the laser, and the thickness of the first adhesive is generally 25 micrometers (μm), which is relatively low, and the first adhesive is not cut at the second sub-boundary, so that the first adhesive can maintain integrity in the region to be peeled, and the first adhesive is convenient to tear. In the method for manufacturing a display substrate according to the embodiment of the present application, the first protection film is attached to the first protection film through the first bonding glue, and the first bonding glue and the first protection film are cut to penetrate through the first bonding glue and the first protection film only along the boundary of the second cutting region, so that the first bonding glue is also torn off in the subsequent process of tearing off the first protection film.
Of course, when the first bonding paste is cut, the first bonding paste may not be completely cut at the second sub-boundary, for example, half the thickness of the first bonding paste is cut.
Optionally, before or after the first protective film is disposed on the entire back surface of the display panel, the method further includes: attaching a second protective film to the front surface of the display panel through a second adhesive;
step S1021, cutting each film layer of the display panel penetrating the first adhesive along the boundary of the first cutting region, specifically including:
and cutting the second protective film, the second bonding glue and the display panel along the boundary of the first cutting area.
As shown in fig. 6, the first protection film 2, the first adhesive 13, and the second protection film 15 are attached to the front surface of the display panel 1 through the second adhesive 14, and the first protection film 2 is attached to the back surface of the display panel 1 through the first adhesive 13.
The first protective film 2 provided on the back surface of the display panel may be a base film or a Back Film (BF), and the second protective film 15 provided on the front surface of the display panel may be an upper protective film (TPF). The first adhesive 13 and the second adhesive 14 may be the same adhesive or different adhesives. When the first and second coating adhesives are the same coating adhesive, for example, the coating adhesive may be a Pressure Sensitive Adhesive (PSA). Of course, the first protective film may be another protective film in the process of manufacturing the display substrate.
Taking fig. 6 as an example, the cutting and removing the first cutting region and the second cutting region specifically includes: the second protective film 15, the second adhesive 14 and the display panel 1 are cut from the front surface of the display panel along the first sub-boundary 10, the second sub-boundary 11 and the third sub-boundary 12, and then the first adhesive and the first protective film 2 are cut along the first sub-boundary 10 and the third sub-boundary 12. Subsequently, the display panel shown in fig. 6 may be turned over, as shown in fig. 7, so that the first protection film 2 faces upward, and when the first protection film of the region to be torn is torn, for example, the first protection film of the region to be torn 5 in the region 9 in fig. 7 may be used as a beginning end of tearing, and the film covered by the first cutting region 4 in the region 9 may be used as a handle for tearing, so that the first protection film 2, the first adhesive 13, the display panel 1, the second adhesive 14, and the second protection film 15 stacked in the region 9 rotate counterclockwise along the arrow direction, and the first protection film of the region to be torn is directly torn.
In a specific implementation, the display panel to which the first protection film and the second protection film are attached still includes two left and right chamfered regions to be removed, and in the regions covered by the two chamfered regions, the second protection film, the second bonding glue and the display panel are cut through from the front surface of the display panel along the first sub-boundary, the second sub-boundary and the third sub-boundary, and the first bonding glue and the first protection film are cut through along the first sub-boundary and the third sub-boundary. In one of the chamfered regions, the second protective film, the second adhesive and the display panel are cut along the first sub-boundary, the second sub-boundary and the third sub-boundary from the front surface of the display panel, and the first adhesive and the first protective film are cut along the first sub-boundary and the third sub-boundary, while in the other chamfered region, the second protective film, the second adhesive, the display panel, the first adhesive and the first protective film are cut along the first sub-boundary, the second sub-boundary and the third sub-boundary.
It should be noted that the display panel provided in the embodiments of the present application may be an Organic Light-Emitting Diode (OLED) display panel, and specifically, the display area of the display panel includes: the substrate comprises a substrate base plate, a buffer layer, each film layer of a pixel circuit, each film layer of an electroluminescent device and an encapsulation layer. An adhesion layer with modification, hydrophilicity and heat-repelling functions can be further arranged between the buffer layer and each film layer of the pixel circuit, and the electroluminescent device is positioned in the display area and comprises a light-emitting layer. Wherein, chamfer district and wait that the bending zone is located display panel's non-display area, do not include the luminescent layer, chamfer district and wait that the bending zone includes promptly: the circuit board comprises a substrate base plate, a buffer layer, a film layer formed by stacking a plurality of layers of circuits and a packaging layer.
The base substrate may be a flexible base substrate or a non-flexible base substrate. When the substrate base plate is a flexible substrate base plate, the second protective film may be only attached to the display area, and in this case, each film layer of the display panel penetrating through the first adhesive glue is cut along the boundary of the first cutting area, which specifically includes: cutting through the display panel along the boundary of the first cutting area.
Optionally, before tearing the first protection film of the region to be torn, with the first protection film of the region to be torn overlapping with the orthographic projection of the first cutting region as a tearing start end, the method further includes:
and arranging a fixing part on the first protective film outside the region to be torn.
Thereby can further prevent to tear the peripheral rete of taking up and prevent that peripheral rete from splitting in the in-process of treating the dyestripping district, can also avoid treating the damage of each rete of bending district display panel and tearing or dragging the deformation, further improve the dyestripping yield.
After the cutting of the chamfered region, as shown in fig. 8, the first protection film is directed upward, and the fixing member 16 is disposed on the first protection film 2 outside the region to be torn 5.
Optionally, a fixing component is disposed on the first protection film outside the region to be torn, and specifically includes:
as shown in fig. 8, bar-shaped fixing members 17 are respectively disposed on the first protection films 2 at two sides of the tear-off folding region 5, and an orthogonal projection of the bar-shaped fixing members 17 is adjacent to an orthogonal projection of the to-be-torn-off region 5 in a direction perpendicular to a plane of the display panel.
Because in the direction perpendicular to the plane where the display panel is located, the orthographic projection of the bar-shaped fixing part 17 is adjacent to the orthographic projection of the to-be-torn-film area 5, and thus, the first protection film of the to-be-torn-film area 5 in the area 9 is taken as a tearing start end subsequently, and in the process of tearing off the first protection film of the to-be-torn-film area, the first protection film adjacent to the to-be-torn-film area cannot be taken up, and the first protection film adjacent to the to-be-torn-film area cannot be broken, so that the tearing yield and the display substrate yield are further improved.
It should be noted that, in consideration of the mechanical movement tolerance, the distance between the two strip-shaped fixing parts may also be slightly larger than the width of the film-to-be-torn area, for example, the distance between the two strip-shaped fixing parts may be larger than or equal to the width of the film-to-be-torn area + the mechanical movement tolerance x 2.
Alternatively, in fig. 8, the fixing member 16 further includes a connecting member 18 connecting the two strip-shaped fixing members 17.
Optionally, the fixing component includes a buffer layer and a metal layer located on the buffer layer, and a fixing component is disposed on the first protection film outside the region to be torn, specifically including:
outside the region to be bent, a buffer layer controlling the fixing part is in contact with the first protection film.
According to the preparation method of the display substrate provided by the embodiment of the application, the buffer layer in the fixing part is in contact with the first protective film, so that static electricity release caused by direct contact of the metal layer and the first protective film can be avoided, and the fixing part can be prevented from moving on the first protective layer due to contact of the buffer layer and the first protective film.
Taking the example where the fixing member includes two bar-shaped fixing members 17, as shown in fig. 9, the bar-shaped fixing members 17 include: a buffer layer 19 and a metal layer 20 on the buffer layer 19.
Optionally, the buffer layer is made of silicon gel, the metal layer is made of stainless steel, for example, and a high-strength alloy material may be selected as the material of the metal layer.
According to the preparation method of the display substrate, the buffer layer in the fixing part is made of silica gel, so that static electricity can be prevented from being released.
Optionally, after the second protective film is attached to the front surface of the display panel through a second adhesive, the method further includes: disposing a cover plate over the second protective film; the orthographic projection of the cover plate is not overlapped with the orthographic projection of the region to be bent and the orthographic projection of the first cutting region;
after the first protection film of the region to be torn is torn by taking the first protection film of the region to be torn overlapped with the orthographic projection of the first cutting region as a tearing start end, the method further comprises the following steps:
and placing the first cutting area and the area to be bent of the display panel on a supporting carrier, wherein the first protective film deviates from the supporting carrier.
It should be noted that, the cover plate may be, for example, a glass cover plate (CG), in general, the chamfer area and the to-be-bent area are not provided with CG, after the cutting process, so that the first protection film faces upward, and then the to-be-bent area is in a suspended state compared with the area provided with CG.
Taking the display panel shown in fig. 6 as an example, the display panel is placed on the support stage and the fixing member is provided. As shown in fig. 10, after the dicing process, the display panel 1 to which the first protective film 2 and the second protective film 15 are attached is placed on a support stage 21, and the buffer layer 19 of the bar-shaped fixing member 17 is controlled to be in contact with the first protective film 2.
Optionally, with the first protection film of the second to-be-torn region as a tearing start end, tearing off the first protection film of the to-be-torn region, specifically including:
utilize anchor clamps centre gripping with the rete that first cutting zone overlaps, control anchor clamps drive with the rete that first cutting zone overlaps to waiting to tear the rete rotation of membrane district, and follow the line of cut of first protection film removes, tears the first protection film of waiting to tear the membrane district.
Utilize anchor clamps centre gripping with the rete that first cutting region overlaps to thereby control contained angle rotation and removal tear the first protection film in treating the dyestripping district more easily. In addition, the film layer overlapped with the first cutting area is clamped by the clamp and is a film layer needing to be removed, namely the film layer belongs to a production waste film in the display substrate preparation process, the film layer overlapped with the first cutting area is clamped by the clamp, namely the production waste film is utilized as a film tearing handle, namely the film tearing handle clamped by the clamp is not required to be additionally arranged, and the cost can be saved.
It should be noted that the cutting line of the first protection film is a boundary of the region to be torn, and the clamp clamps all the films overlapping the first cutting region. Taking the display panel to attach the first protection film and the second protection film as an example, as shown in fig. 11, the first protection film 2, the first adhesive 13, the display panel 1, the second adhesive 14, and the second protection film 15 overlapped with the first cutting region 4 are clamped by the clamp 22, and then the clamp is controlled to drive the film overlapped with the first cutting region to rotate counterclockwise and move along the cutting line of the first protection film, so as to tear off the first protection film 2 of the film to be torn. Further, the jig may be clamped at any area of the film layer overlapping the first cutting zone, for example, as shown in fig. 12, the jig 22 may be clamped at an area covered by the second cutting zone 6. Of course, it is also possible that the clamp 22 clamps the area covered by the area 5 to be torn and the second cutting area 6, as shown in fig. 13.
Next, a method for manufacturing a display substrate using a fixing member and a jig according to an embodiment of the present application will be described by taking as an example that a first protective film and a second protective film are attached to the entire surface of a display panel, where the method for manufacturing a display substrate includes:
s301, arranging a first protective film on the back surface of the display panel through a first bonding glue whole surface, and arranging a second protective film on the front surface of the display panel through a second bonding glue whole surface;
s302, cutting a second protective film, a second adhesive and a display panel along a first sub-boundary, a second sub-boundary and a third sub-boundary from the front side of the display panel in one chamfering area, cutting the first adhesive and the first protective film along the first sub-boundary and the third sub-boundary, and cutting the second protective film, the second adhesive, the display panel, the first adhesive and the first protective film along the first sub-boundary, the second sub-boundary and the third sub-boundary in the other chamfering area;
s303, turning over the display panel to enable the first protection film to face upwards, and controlling the fixing part to be in contact with the first protection film to enable the orthographic projection of the fixing part to be adjacent to the orthographic projection of the film to be torn;
s304, utilize anchor clamps centre gripping and the rete that the chamfer district overlaps, control anchor clamps drive the rete that overlaps with the chamfer district to treat the dyestripping district and rotate, and follow the line of cut of first protection film removes, tears the first protection film of treating the dyestripping district.
In the method for manufacturing a display substrate using a fixing member and a jig according to the embodiments of the present disclosure, for example, a cutting process may be performed using a laser cutting device, and a laser cutting depth and a laser cutting position may be controlled. It is also desirable to utilize an auxiliary device having a fixing member and a jig, wherein the fixing member can be coupled to the cylinder prop to control the fixing member to be in contact with the first protection film, and the fixing member can be controlled to be in contact with the first protection film in an electrically controlled manner. The clamp can also control the clamp to clamp the film layer overlapped with the chamfering area in an electric control mode.
Next, taking the display panel with the first protective film, the second protective film, and the cover plate attached thereon as an example, the method for manufacturing the display substrate using the supporting stage, the fixing member, and the clamp according to the embodiment of the present application is exemplified, and the method for manufacturing the display substrate includes:
s401, arranging a first protective film on the back surface of the display panel through a first bonding glue whole surface, arranging a second protective film on the front surface of the display panel through a second bonding glue whole surface, and arranging a cover plate on one side, far away from the display panel, of the second protective film; wherein, no cover plate is arranged in the chamfer area and the area corresponding to the area to be bent;
s402, cutting a second protective film, a second adhesive and a display panel along a first sub-boundary, a second sub-boundary and a third sub-boundary from the front side of the display panel in one chamfering area, cutting the first adhesive and the first protective film along the first sub-boundary and the third sub-boundary, and cutting the second protective film, the second adhesive, the display panel, the first adhesive and the first protective film along the first sub-boundary, the second sub-boundary and the third sub-boundary in the other chamfering area;
s403, turning over the display panel to enable the first protective film to face upwards, and placing the first cutting area and the area to be bent of the display panel on a supporting platform deck;
s404, controlling a fixing part to be in contact with the first protection film, so that the orthographic projection of the fixing part is adjacent to the orthographic projection of the film to be torn;
s405, utilize the rete of anchor clamps centre gripping and chamfer district overlapping, control anchor clamps drive the rete with chamfer district overlapping to treat the dyestripping district and rotate, and follow the line of cut of first protection film removes, tears treat the dyestripping district first protection film.
In the method for manufacturing a display substrate using a support stage, a fixing member, and a jig according to the embodiments of the present application, for example, a cutting process may be performed using a laser cutting apparatus, and an auxiliary apparatus having a support stage, a fixing member, and a jig may be used.
According to the display substrate provided by the embodiment of the application, the display substrate is manufactured by the method provided by the embodiment of the application.
The display substrate provided by the embodiment of the application is manufactured by adopting the manufacturing method of the display substrate provided by the embodiment of the application, so that the first protection film of the region to be subjected to film tearing can be torn off, the film tearing yield can be guaranteed, and the manufacturing yield of the display substrate can be further guaranteed.
To sum up, according to the display substrate and the manufacturing method thereof provided by the embodiment of the application, the first cutting area and the second cutting area are cut and removed, that is, the first cutting area is separated from the display panel along the cutting line, and the second cutting area is separated from the first protection film along the cutting line, so that the first protection film of the second to-be-torn area can be directly torn by using the first protection film of the second to-be-torn area as a tearing start end when the first protection film of the to-be-torn area is torn, and the difficulty in tearing the film is reduced. And, because the first cutting region is separated from the display panel along the cutting line, the second cutting region is separated from the first protection film along the cutting line, and the region to be torn is disconnected from other regions except the region to be torn, the film layer in the peripheral region of the region to be torn cannot be taken up in the process of tearing the first protection film in the region to be torn, the form of the film layer in the peripheral region of the region to be torn cannot be influenced, and the stress distribution of the film layer in the peripheral region cannot be influenced. The first protection film of the film tearing region is directly torn, the problems that sintering residues, flatness is poor, the shape of a sintering edge is affected and the like caused by the fact that the first protection film is removed through laser sintering can be avoided, and the display panel can be prevented from being scratched. The preparation method of the display substrate provided by the embodiment of the application can ensure the film tearing yield while tearing off the first protection film of the region to be subjected to film tearing, and further ensure the preparation yield of the display substrate.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A method for preparing a display substrate, the method comprising:
arranging a first protective film on the whole back surface of the display panel; wherein the display panel has: the bending device comprises a to-be-bent area and a first cutting area, wherein the to-be-bent area is connected with the to-be-bent area in the extending direction of at least one to-be-bent area; the first protection film is provided with a second cutting area and a film area to be torn, and the film area to be torn is disconnected with other areas except the film area to be torn; the region to be torn comprises: the film tearing device comprises a first film to be torn and a second film to be torn, wherein the first film to be torn is superposed with the region to be bent, and an area formed by the second film to be torn and the second cutting region is superposed with the first cutting region;
cutting off the first cutting area and the second cutting area;
and tearing off the first protection film of the to-be-torn film region by taking the first protection film of the second to-be-torn film region as a tearing start end.
2. The method according to claim 1, wherein the first cutting region comprises two chamfered regions of the display panel, and cutting away the first cutting region and the second cutting region comprises:
cutting off the first cutting area and the second cutting area in each chamfer area;
or, in one chamfering area, the first cutting area and the second cutting area are cut and removed, and in the other chamfering area, the first cutting area, the second cutting area and the area to be torn which is overlapped with the orthographic projection of the first cutting area are cut and removed.
3. The method according to claim 1, wherein the disposing the first protection film on the entire back surface of the display panel specifically comprises:
attaching the first protective film to the back surface of the display panel through a first adhesive whole surface;
cutting off the first cutting area and the second cutting area, specifically including:
cutting each film layer of the display panel penetrating the first laminating glue from one side away from the first protective film along the boundary of the first cutting area;
and cutting the first bonding glue and the first protective film along the boundary of the second cutting area.
4. The method of claim 3, wherein before or after the first protective film is disposed on the entire back surface of the display panel, the method further comprises: attaching a second protective film to the front surface of the display panel through a second adhesive;
cutting each film layer of the display panel penetrating the first bonding glue along the boundary of the first cutting area, and specifically comprises:
and cutting the second protective film, the second bonding glue and the display panel along the boundary of the first cutting area.
5. The method of claim 1, wherein before the first protective film of the to-be-torn region is torn, taking the first protective film of the to-be-torn region overlapping with the orthographic projection of the first cutting region as a tearing start end, the method further comprises:
and arranging a fixing part on the first protective film outside the region to be torn.
6. The method according to claim 5, wherein disposing a fixing member on the first protection film outside the region to be torn comprises:
and strip-shaped fixing parts are respectively arranged on the first protection films on two sides of the region to be torn, and the orthographic projection of each strip-shaped fixing part is adjacent to the orthographic projection of the region to be torn in the plane direction perpendicular to the display panel.
7. The method according to claim 5, wherein the fixing member comprises a buffer layer and a metal layer located on the buffer layer, and the fixing member is disposed on the first protection film outside the region to be torn, specifically comprising:
outside the region to be bent, a buffer layer controlling the fixing part is in contact with the first protection film.
8. The method of claim 4, wherein after the attaching the second protective film to the front surface of the display panel by the second adhesive, the method further comprises: disposing a cover plate over the second protective film; the orthographic projection of the cover plate is not overlapped with the orthographic projection of the region to be bent and the orthographic projection of the first cutting region;
after the first protection film of the region to be torn is torn by taking the first protection film of the region to be torn overlapped with the orthographic projection of the first cutting region as a tearing start end, the method further comprises the following steps:
and placing the first cutting area and the area to be bent of the display panel on a supporting carrier, wherein the first protective film deviates from the supporting carrier.
9. The method according to claim 1, wherein the tearing of the first protection film of the second region to be torn with the first protection film of the second region to be torn as a tearing start end comprises:
utilize anchor clamps centre gripping with the rete that first cutting zone overlaps, control anchor clamps drive with the rete that first cutting zone overlaps to waiting to tear the rete rotation of membrane district, and follow the line of cut of first protection film removes, tears the first protection film of waiting to tear the membrane district.
10. A display substrate, wherein the display substrate is prepared by the method of any one of claims 1 to 9.
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| CN110854058A (en) * | 2019-10-25 | 2020-02-28 | 深圳市华星光电技术有限公司 | Fixing device and manufacturing method of display panel |
| US11244843B2 (en) | 2019-10-25 | 2022-02-08 | Tcl China Star Optoelectronics Technology Co., Ltd | Fixing device and method of manufacturing display panel |
| CN113150702B (en) * | 2021-04-29 | 2022-10-18 | 业成科技（成都）有限公司 | Optical film assembly, processing method thereof and electronic equipment |
| CN113690286B (en) * | 2021-08-24 | 2024-05-07 | 京东方科技集团股份有限公司 | Protective film, display module, manufacturing method of display module and display device |
| CN114479695B (en) * | 2022-01-13 | 2023-11-03 | 昆山国显光电有限公司 | Protective film structure and display panel |
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| WO2014065248A1 (en) * | 2012-10-25 | 2014-05-01 | 日本電気硝子株式会社 | Glass film cutting method |
| CN109166894A (en) * | 2018-08-31 | 2019-01-08 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof, protective film and display device |
| CN109585700A (en) * | 2018-12-14 | 2019-04-05 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display device |
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| WO2014065248A1 (en) * | 2012-10-25 | 2014-05-01 | 日本電気硝子株式会社 | Glass film cutting method |
| CN109166894A (en) * | 2018-08-31 | 2019-01-08 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof, protective film and display device |
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