CN110171082A - A kind of epoxy resin hot solids release agent and preparation method thereof - Google Patents

Abstract

The invention discloses a mold release agent for epoxy resin thermal solids and a preparation method thereof. The mold release agent for epoxy resin thermal solids comprises the following raw materials in parts by weight: 1 part of carboxymethyl cellulose, 1- 2 parts of polyvinylpyrrolidone, 1 to 2 parts of polyurea, 0.1 to 0.2 parts of emulsifier, 0.1 to 0.2 parts of defoamer, 50 to 100 parts of water, 0.1 to 0.2 parts of rust inhibitor and 10 to 50 parts of silicone oil. The preparation method comprises the following steps: mixing carboxymethylcellulose, polyvinylpyrrolidone, polyurea, emulsifier, defoamer and water, heating to 90-100°C and continuously stirring at high speed, and cooling to room temperature after the raw materials are dissolved; Then add rust inhibitor and silicone oil, stir evenly, that is. The release agent of the present invention has a fast film-forming speed, and the formed film is evenly distributed. On the one hand, it can reduce the bonding force between the mold and the epoxy resin hot solid, so that the demoulding is easy, and the surface of the sample has no defects after demoulding. On the other hand, it can prolong the service life of the cast iron mold.

Description

A kind of release agent for epoxy resin thermal solid and preparation method thereof

technical field

The invention relates to a release agent and a preparation method thereof, in particular to a release agent for epoxy resin thermal solids and a preparation method thereof, and belongs to the technical field of release agents.

Background technique

Epoxy resins are widely used in aviation, aerospace, electronic packaging, clean energy, automobiles and structural materials due to their outstanding advantages in terms of strength, adhesion, modulus, curing shrinkage, thermal stability and processability. . However, during the molding process of epoxy resin thermosolids and their products, due to the penetration and adhesion of epoxy resin, there is a strong bond between them and the mold, resulting in epoxy resin thermosolids and their products Incomplete appearance and quality defects during the demoulding process seriously affect the appearance and performance of the product.

In order to ensure good quality stability of epoxy resin hot solids and their products, it is first necessary to ensure that epoxy resin hot solids and their products have a good appearance and no quality loss. Therefore, the mold must be processed before the epoxy resin hot solid and its products are poured to ensure that the separation of the epoxy resin hot solid and its products from the mold is less difficult, and to ensure the integrity of the appearance of the processed product during demoulding. Various performance indexes of the prepared product can be made to meet the requirements. Epoxy resin thermal solid release agent is a type of isolation film applied between the product and the mold to prevent the molded epoxy resin thermal solid and its products from sticking to the mold, resulting in incomplete appearance of the product and quality defects. Make the product easy to come out of the mold, while ensuring the surface quality of the product and the mold intact.

Most of the epoxy resin release agents in the prior art contain components such as absolute ethanol and vacuum silicone grease, which are inflammable, explosive and expensive, which is unfavorable for large-scale production.

Contents of the invention

Purpose of the invention: In view of the problems that most of the existing epoxy resin release agents contain anhydrous ethanol, vacuum silicone grease and other components, are flammable and explosive, high in price, and unfavorable for large-scale production, the present invention provides an epoxy resin The invention relates to a release agent for hot solid, and provides a preparation method of the release agent.

Technical solution: A release agent for epoxy resin thermal solids according to the present invention comprises the following raw materials in parts by weight: 1 part of carboxymethyl cellulose, 1 to 2 parts of polyvinylpyrrolidone, 1 to 2 parts 0.1-0.2 parts of emulsifier, 0.1-0.2 parts of defoamer, 50-100 parts of water, 0.1-0.2 parts of rust inhibitor and 10-50 parts of silicone oil.

Preferably, the molecular weight of carboxymethyl cellulose is 1000-2000, and the purity is greater than 90%. The polyurea is preferably polynonyl urea.

Preferably, the emulsifier is one or more of nonylphenol polyoxyethylene ether, octylphenol polyoxyethylene ether, alkylphenol polyoxyethylene ether, and alkylphenol polyoxyethylene ether. The defoaming agent can be one of high carbon alcohol fatty acid ester complex, polyoxyethylene polyoxypropylene pentaerythritol ether, polyoxyethylene polyoxypropylene alcohol amine ether, polyoxypropylene glyceryl ether and polyoxypropylene polyoxyethylene glyceryl ether species or several. The rust inhibitor is preferably a composite amino alcohol rust inhibitor. The silicone oil is preferably methyl high-temperature silicone oil or ethyl high-temperature silicone oil, with a flash point higher than 250 degrees.

The preparation method of the release agent for epoxy resin thermosolid of the present invention comprises the steps of: mixing carboxymethyl cellulose, polyvinylpyrrolidone, polyurea, emulsifier, defoamer and water, heating to 90- Keep stirring at 100°C at high speed, and cool to room temperature after the raw materials are dissolved; then add rust inhibitor and silicone oil, stir evenly, and the product is ready.

Wherein, high-speed stirring refers to stirring at a speed of 300-1000 rpm. After the raw materials are dissolved, the cooling method is preferably natural cooling and low-speed stirring, and the stirring speed corresponding to the low-speed stirring is ≤100rpm.

The principle of the invention: the present invention uses carboxymethyl cellulose, polyvinylpyrrolidone and polyurea composite emulsion as the main components. The film is formed quickly, the effective components are evenly dispersed, and the product quality is stable. It is equipped with a small amount of rust inhibitor and silicone oil. The release agent for epoxy resin hot solid is prepared by shearing technology. After the release agent is painted on the surface of the cast iron mold, a protective film can be formed on the surface of the mold to prevent the epoxy resin from contacting the mold and reduce the impact of the epoxy resin on the mold surface. The penetration and adhesion of the mold, thereby reducing the difficulty of demoulding the hot solid epoxy resin; in addition, the invention adds a small amount of rust inhibitor and silicone oil, which can effectively reduce the rust of the cast iron mold, improve its surface finish, and prolong the durability of the cast iron mold. service life.

Beneficial effects: Compared with the existing epoxy resin release agent, the release agent of the present invention has transparent color, long storage time, fast film forming speed, and uniform distribution of the formed film. On the one hand, it can reduce the heat between the mold and the epoxy resin. The cohesive force between the solids makes it easy to release the hot solid epoxy resin without defects on the surface. On the other hand, it can prolong the service life of the cast iron mold; in addition, the release agent of the present invention does not contain absolute alcohol and vacuum silicone grease , Reduce the production cost of the release agent for epoxy resin thermal solids, increase the efficiency of the release agent, and improve the appearance and quality of epoxy resin thermal solids.

Detailed ways

The technical solutions of the present invention will be further described below in conjunction with the embodiments.

A kind of release agent for epoxy resin thermal solid of the present invention comprises following raw material: carboxymethyl cellulose, polyvinylpyrrolidone, polyurea, emulsifier, defoamer, water, rust inhibitor and silicone oil, each raw material The mass ratio is 1:1～2:1～2:0.1～0.2:0.1～0.2:50～100:0.1～0.2:10～50.

The preparation method of the mold release agent for epoxy resin hot solid comprises the following steps: mixing carboxymethyl cellulose, polyvinylpyrrolidone, polyurea, emulsifier, defoamer and water, heating to 90-100°C and maintaining high speed Stir, and cool to room temperature after the raw materials are dissolved; then add rust inhibitor and silicone oil, stir evenly, and the product is ready.

The mold release agent of the present invention is suitable for cast iron moulds. When in use, one layer of mold release agent is applied on the surface of the cleaned cast iron molds, and then it is allowed to dry naturally.

Example 1

First, 1g of carboxymethylcellulose with a molecular weight of 1000, 1g of polyvinylpyrrolidone, 1g of polynonyl urea, 0.1g of octylphenol polyoxyethylene ether, and 0.1g of polyoxyethylene polyoxypropanolamine ether were added with Heat 50mL of distilled water (stirring rate 300rpm) in a high-speed stirring device to 90°C. After all the solids are dissolved, keep warm for 2h, and naturally cool to room temperature (stirring rate 100rpm), then add 0.1g compound amino alcohol rust inhibitor and 10g of methyl high-temperature silicone oil, stirred evenly to obtain a release agent for epoxy resin hot solid.

Example 2

First, 1g of carboxymethylcellulose with a molecular weight of 1000, 1.2g of polyvinylpyrrolidone, 1.2g of polynonyl urea, 0.15g of octylphenol polyoxyethylene ether, and 0.15g of polyoxyethylene polyoxypropylene pentaerythritol ether were added to the belt. In 60mL of distilled water with a high-speed stirring device (stirring rate 500rpm), heat up to 95°C. After all the solids are dissolved, keep warm for 2h, and naturally cool to room temperature (stirring rate 100rpm), then add 0.12g of compound amino alcohol rust inhibitor and 30g methyl high-temperature silicone oil, stir to obtain a release agent for epoxy resin thermal solids.

Example 3

First, add 1g of carboxymethyl cellulose with a molecular weight of 1000, 1.2g of polyvinylpyrrolidone, 1.5g of polynonyl urea, 0.18g of octylphenol polyoxyethylene ether, and 0.15g of polyoxypropylene glyceryl ether into the tank with high-speed stirring In 80mL of distilled water in the device (stirring rate 800rpm), heat up to 99°C. After all the solids are dissolved, keep warm for 2h, and naturally cool to room temperature (stirring rate 100rpm), then add 0.15g compound amino alcohol rust inhibitor and 50g formazan base high-temperature silicone oil, and stir evenly to obtain a release agent for epoxy resin thermal solids.

Example 4

First, 1g of carboxymethylcellulose with a molecular weight of 1500, 1.5g of polyvinylpyrrolidone, 1.2g of polynonyl urea, 0.2g of octylphenol polyoxyethylene ether, and 0.18g of polyoxypropylene polyoxyethylene glyceryl ether were added to the belt. In 90mL of distilled water with a high-speed stirring device (stirring rate 1000rpm), heat up to 100°C. After all the solids are dissolved, keep warm for 2h, and naturally cool to room temperature (stirring rate 100rpm), then add 0.2g compound amino alcohol rust inhibitor and 10g of ethyl high-temperature silicone oil, stirred evenly to obtain a mold release agent for epoxy resin hot solid.

Example 5

First, 1g of carboxymethylcellulose with a molecular weight of 1800, 1.8g of polyvinylpyrrolidone, 1.8g of polynonyl urea, 0.2g of octylphenol polyoxyethylene ether, and 0.2g of higher alcohol fatty acid ester compound were added to the belt. 100mL of distilled water with a high-speed stirring device (stirring rate 900rpm), heated up to 90°C, after all the solids were dissolved, kept warm for 2h, naturally cooled to room temperature (stirring rate 100rpm), then added 0.2g compound amino alcohol rust inhibitor and 30g of ethyl high-temperature silicone oil, stirred evenly to obtain a mold release agent for epoxy resin hot solid.

Example 6

First, 1g of carboxymethylcellulose with a molecular weight of 2000, 2g of polyvinylpyrrolidone, 2g of polynonyl urea, 0.2g of octylphenol polyoxyethylene ether, and 0.2g of polyoxyethylene polyoxypropanolamine ether were added with High-speed stirring device 100mL distilled water (stirring rate 1000rpm), heat up to 95 ° C, after the solids are completely dissolved, keep warm for 2 hours, naturally cool to room temperature (stirring rate 100rpm), then add 0.2g compound amino alcohol rust inhibitor and 50g Ethyl high-temperature silicone oil, stirred evenly to obtain a release agent for epoxy resin thermal solids.

Test respectively the performance of the release agent prepared in Examples 1 to 6. The test method is: brush a layer of release agent on the cast iron mold surface that has been removed, dry it naturally, and then pour the stirred epoxy resin System, release the mold after curing, observe the release effect and the surface integrity of the epoxy resin curing system.

The test results are shown in Table 1 below.

Analysis Table 1:

(1) Analysis of film-forming time and film-forming thickness shows that the mold release agent for epoxy resin thermal solids of the present invention is faster at room temperature, and this is because the viscosity of the mold release agent emulsion prepared by the present invention is higher than that of similar substances The solution should be low (due to the low solid content and monomer dispersion), so the drying speed is fast after being coated on the mold; wherein, the carboxymethyl cellulose with a molecular weight of 1000 is selected for use in Examples 1 to 3, and the obtained epoxy The mold release agent for resin hot solid has the fastest film forming speed at room temperature, and the film forming time is less than 10 minutes;

(2) Analysis of the film thickness and the demoulding situation after use shows that the release agent for epoxy resin thermal solids of the present invention has excellent demoulding effect, which is specifically shown in that the demoulding of the sample is easy, and the sample after demoulding The surface is complete and smooth, because the monomers in the release agent emulsion of the present invention are dispersed, the molecular weight is relatively small, and it is easier to enter the pores of the cast iron mold. Generally, it only needs to be painted once, and does not need to be painted repeatedly. Brush, you can achieve a good demoulding effect.

Claims (10)

1. A mold release agent for epoxy resin thermal solids, characterized in that, in parts by weight, comprising the following raw materials: 1 part of carboxymethyl cellulose, 1 to 2 parts of polyvinylpyrrolidone, 1 to 2 parts of polyvinylpyrrolidone, Urea, 0.1-0.2 parts of emulsifier, 0.1-0.2 parts of defoamer, 50-100 parts of water, 0.1-0.2 parts of rust inhibitor and 10-50 parts of silicone oil. 2. The mold release agent for epoxy resin thermal solid according to claim 1, characterized in that the molecular weight of the carboxymethyl cellulose is 1000-2000, and the purity is greater than 90%. 3. The mold release agent for epoxy resin thermal solid according to claim 1, characterized in that, the polyurea is polynonylidene urea. 4. release agent for epoxy resin thermal solid according to claim 1, is characterized in that, described emulsifying agent is nonylphenol polyoxyethylene ether, octylphenol polyoxyethylene ether, alkylphenol polyoxyethylene One or more of ether, alkylphenol polyoxyethylene ether. 5. epoxy resin thermal solid release agent according to claim 1, is characterized in that, described defoamer is higher carbon alcohol fatty acid ester complex, polyoxyethylene polyoxypropylene pentaerythritol ether, polyoxyethylene One or more of polyoxypropylene glycol amine ether, polyoxypropylene glyceryl ether and polyoxypropylene polyoxyethylene glyceryl ether. 6. The mold release agent for epoxy resin thermal solids according to claim 1, characterized in that, the rust inhibitor is a compound amino alcohol rust inhibitor. 7. The mold release agent for epoxy resin thermal solids according to claim 1, wherein the silicone oil is methyl high-temperature silicone oil or ethyl high-temperature silicone oil, and the flash point is higher than 250 degrees. 8. a kind of preparation method of release agent for epoxy resin thermosolid according to claim 1 is characterized in that, comprises the steps: with carboxymethyl cellulose, polyvinylpyrrolidone, polyurea, emulsifier, defoaming agent Mix agent and water, heat to 90-100°C and continue to stir at high speed, cool to room temperature after the raw materials are dissolved; then add rust inhibitor and silicone oil, stir evenly to get ready. 9 . The method for preparing a mold release agent for epoxy resin thermal solids according to claim 8 , wherein the high-speed stirring is stirring at a speed of 300-1000 rpm. 10. The method for preparing a mold release agent for epoxy resin thermal solids according to claim 8, wherein the cooling method is natural cooling and low-speed stirring, and when stirring at low speed, the stirring speed is ≤ 100rpm.