CN110128581B - Encapsulation process of microstrip patch antenna - Google Patents
Encapsulation process of microstrip patch antenna Download PDFInfo
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- CN110128581B CN110128581B CN201910436184.9A CN201910436184A CN110128581B CN 110128581 B CN110128581 B CN 110128581B CN 201910436184 A CN201910436184 A CN 201910436184A CN 110128581 B CN110128581 B CN 110128581B
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- fluorine
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- containing polystyrene
- polystyrene microspheres
- potting
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000005538 encapsulation Methods 0.000 title claims abstract description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 33
- 239000011737 fluorine Substances 0.000 claims abstract description 33
- 239000004793 Polystyrene Substances 0.000 claims abstract description 28
- 229920002223 polystyrene Polymers 0.000 claims abstract description 28
- 238000005187 foaming Methods 0.000 claims abstract description 23
- 239000004005 microsphere Substances 0.000 claims abstract description 23
- 238000004382 potting Methods 0.000 claims abstract description 22
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 239000000178 monomer Substances 0.000 claims abstract description 7
- 238000012674 dispersion polymerization Methods 0.000 claims abstract description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical group N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 8
- 239000002270 dispersing agent Substances 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 4
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 4
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims 1
- -1 dodecyl methyl Chemical group 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 10
- 238000003780 insertion Methods 0.000 abstract description 2
- 230000037431 insertion Effects 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000002834 transmittance Methods 0.000 abstract description 2
- 238000003756 stirring Methods 0.000 description 4
- YJKHMSPWWGBKTN-UHFFFAOYSA-N 2,2,3,3,4,4,5,5,6,6,7,7-dodecafluoroheptyl 2-methylprop-2-enoate Chemical group CC(=C)C(=O)OCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)F YJKHMSPWWGBKTN-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920006327 polystyrene foam Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000010517 secondary reaction Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/16—Making expandable particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/005—Damping of vibrations; Means for reducing wind-induced forces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2325/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
- C08J2325/02—Homopolymers or copolymers of hydrocarbons
- C08J2325/04—Homopolymers or copolymers of styrene
- C08J2325/08—Copolymers of styrene
- C08J2325/14—Copolymers of styrene with unsaturated esters
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a potting process of a microstrip patch of a millimeter wave response antenna, and belongs to the field of response antenna packaging. The method comprises the following steps: a, preparing fluorine-containing polystyrene microspheres by taking styrene and fluorine-containing monomers as raw materials and adopting a dispersion polymerization method; b, continuously foaming the fluorine-containing polystyrene microspheres obtained in the step A to obtain primary foaming fluorine-containing polystyrene microspheres; and C, placing the micro-strip patch into a mold, placing the primary foaming fluorine-containing polystyrene microspheres into a gap between the micro-strip patch and the mold, and locking the mold for encapsulation. The invention adopts fluorine-containing polystyrene as the encapsulating material, thereby not only solving the problem of adhesion of the foaming material to the microstrip patch, but also solving the problems of high insertion loss, low transmittance and other electrical properties of the encapsulating medium of the microstrip patch of the millimeter wave antenna due to the advantages of low dielectric constant, low dielectric loss, good foaming uniformity and the like.
Description
Technical Field
The invention belongs to the field of antenna packaging, and particularly relates to a filling and sealing process of a microstrip patch antenna.
Background
The microstrip patch antenna has the advantages of small volume, light weight, thin section, easy conformal and the like, and is widely applied in the fields of wireless communication, remote sensing, aerospace and the like.
In order to improve the anti-vibration capability and the waterproof performance of products, most antennas adopt a structural mode of filling potting materials in the gap spaces of a base plate (or a bracket or a cavity), an outer cover and a printed board, and due to the requirement of antenna signal transmission, the selection of the outer cover materials and the potting materials has special requirements.
At present, a commonly used potting material is a rigid polyurethane foaming material which has the characteristics of small dielectric constant, small density, insolubility in water and the like, but is easy to expand through secondary reaction when meeting high temperature, so that the antenna bulges and deforms.
The polystyrene foam is prepared by taking polystyrene resin as a main body and adding additives such as a foaming agent and the like. It has closed pore structure, small water absorption and excellent water resistance; the density is low; the mechanical strength is good, and the buffering performance is excellent; the processability is good, and the molding forming is easy; high temperature adaptability and uniform structure. But the adhesive force to the microstrip patch is not good, and the adhesive is not suitable for being used as the encapsulating material of the microstrip patch antenna.
Disclosure of Invention
In order to solve the technical problem, the invention provides an encapsulation process of a microstrip patch antenna, which comprises the following steps:
a, preparing fluorine-containing polystyrene microspheres by taking styrene and fluorine-containing monomers as raw materials and adopting a dispersion polymerization method;
b, foaming the fluorine-containing polystyrene microspheres obtained in the step A to obtain primary foaming fluorine-containing polystyrene microspheres;
and C, placing the micro-strip patch into a mold, placing the primary foaming fluorine-containing polystyrene microspheres into a gap between the micro-strip patch and the mold, and locking the mold for encapsulation.
In the potting process, the step A meets at least one of the following conditions:
the mass ratio of the styrene to the fluorine-containing monomer is 18: 2-6;
the fluorine-containing monomer is dodecafluoroheptyl methacrylate;
the preparation temperature is 60-100 ℃;
the preparation time is 10-20 h;
the step A also comprises a catalyst, a dispersant and a solvent.
In the potting process, in the step a, the catalyst is azobisisobutyronitrile; the dispersing agent is polyvinylpyrrolidone; the solvent is a mixed solution of ethanol and water, wherein the volume ratio of the ethanol to the water is 1.5: 1.
In the potting process, in the step A, the amount of the catalyst is 0.5-2.5 wt% of the amount of the raw materials; the dosage of the dispersing agent is 2-5.5 wt% of the dosage of the raw materials; the volume weight ratio of the solvent to the raw material is 8-10 mL: 1g of the total weight of the composition.
In the encapsulating process, in the step B, the foaming temperature is 80 +/-5 ℃; the foaming time is 3-5 min.
In the filling and sealing process, the particle size of the primary foaming fluorine-containing polystyrene microsphere is 2000 +/-100 microns.
In the potting process, in the step C, the potting temperature is 100-125 ℃.
In the potting process, in the step C, the potting time is 40-60 min.
In the encapsulating process, in the step C, the encapsulating pressure is 35-90 KPa.
The invention has the beneficial effects that:
the invention adopts fluorine-containing polystyrene as the encapsulating material, thereby not only solving the problem of adhesion of the foaming material to the microstrip patch, but also solving the problems of high insertion loss, low transmittance and other electrical properties of the encapsulating medium of the microstrip patch of the millimeter wave antenna due to the advantages of low dielectric constant, low dielectric loss, good foaming uniformity and the like.
Obviously, many modifications, substitutions, and variations are possible in light of the above teachings of the invention, without departing from the basic technical spirit of the invention, as defined by the following claims.
The present invention will be described in further detail with reference to the following examples. It should not be understood that the scope of the above-described subject matter of the present invention is limited to the following examples. All the technologies realized based on the above contents of the present invention belong to the scope of the present invention.
Drawings
FIG. 1 is a schematic view of an encapsulation mold and encapsulated microstrip sheets
FIG. 2 shows the fluorine-containing polystyrene microspheres once expanded prepared in example 1.
Fig. 3 is a potting mold.
FIG. 4 shows the micro-strip patch obtained after the fluorine-containing polystyrene is encapsulated.
Detailed Description
A schematic diagram of the encapsulation mold and the resulting micro-tape chip encapsulated is shown in fig. 1.
Example 1
Preparation of fluorine-containing polystyrene: in a condenser equipped with a mechanical stirrer, a condenser tube and N2And (3) adding 0.8g of polyvinylpyrrolidone, 108mL of absolute ethyl alcohol and 72mL of deionized water into a 250mL three-necked bottle of an inlet and outlet device, uniformly stirring, placing in a water bath at the temperature of 100 ℃, then adding a mixed solution of 18g of styrene monomer, 2g of dodecafluoroheptyl methacrylate and 0.1g of azobisisobutyronitrile, stirring (200r/min), reacting for 12 hours, cooling, terminating the reaction, and removing unreacted monomers and dispersing agents to finally obtain white powdery fluorine-containing polystyrene microspheres.
Primary foaming: and (3) foaming the fluorine-containing polystyrene microspheres prepared in the step (1) at 80 ℃ for 3min to obtain the once-foamed fluorine-containing polystyrene microspheres with the particle size of 2000 +/-100 microns, which is shown in figure 2.
Encapsulating: placing the micro-strip patch into a mold, placing the primary foamed fluorine-containing polystyrene microspheres into a gap between the micro-strip patch and the mold (see fig. 3), locking the mold, placing the mold under a pressure of 80KPa, and encapsulating at 110 ℃ for 60min to obtain the micro-strip patch, which is shown in fig. 4.
Example 2
Preparation of fluorine-containing polystyrene: in a condenser equipped with a mechanical stirrer, a condenser tube and N2And (3) adding 0.4g of polyvinylpyrrolidone, 108mL of absolute ethyl alcohol and 72mL of deionized water into a 250mL three-necked bottle of an inlet and outlet device, uniformly stirring, placing in a water bath at the temperature of 80 ℃, then adding a mixed solution of 18g of styrene monomer, 2g of dodecafluoroheptyl methacrylate and 0.2g of azobisisobutyronitrile, stirring (200r/min), reacting for 10 hours, cooling, terminating the reaction, and removing unreacted monomers and a dispersing agent to finally obtain white powdery fluorine-containing polystyrene microspheres.
Primary foaming: and (2) foaming the fluorine-containing polystyrene microspheres prepared in the step (1) at 80 ℃ for 5min to obtain the once-foamed fluorine-containing polystyrene microspheres with the particle size of 2000 +/-100 microns.
Encapsulating: placing the micro-strip patch into a mold, placing the primary foamed fluorine-containing polystyrene microspheres into a gap between the micro-strip patch and the mold (see figure 2), locking the mold, placing the mold under a pressure of 50KPa, and encapsulating at 100 deg.C for 40 min.
Claims (9)
1. The encapsulation process of the microstrip patch antenna is characterized by comprising the following steps of:
preparing fluorine-containing polystyrene microspheres by using styrene and dodecyl methyl acrylate as raw materials and adopting a dispersion polymerization method;
b, foaming the fluorine-containing polystyrene microspheres obtained in the step A to obtain primary foaming fluorine-containing polystyrene microspheres;
placing the micro-strip patch into a mold, placing the primary foaming fluorine-containing polystyrene microspheres into a gap between the micro-strip patch and the mold, and locking the mold for encapsulation;
in the step A, the mass ratio of the styrene to the fluorine-containing monomer is 18: 2-6.
2. The potting process of claim 1, wherein step a satisfies at least one of:
the preparation temperature is 60-100 ℃;
the preparation time is 10-20 h;
the step A also comprises a catalyst, a dispersant and a solvent.
3. The potting process of claim 2, wherein in step a, the catalyst is azobisisobutyronitrile; the dispersing agent is polyvinylpyrrolidone; the solvent is a mixed solution of ethanol and water, wherein the volume ratio of the ethanol to the water is 1.5: 1.
4. The potting process according to claim 3, wherein in step A, the amount of the catalyst is 0.5-2.5 wt% of the amount of the raw materials; the dosage of the dispersing agent is 2-5.5 wt% of the dosage of the raw materials; the volume weight ratio of the solvent to the raw material is 8-10 mL: 1g of the total weight of the composition.
5. The encapsulation process according to any one of claims 1 to 4, wherein in the step B, the foaming temperature is 80 ± 5 ℃; the foaming time is 3-5 min.
6. The potting process of claim 5, wherein the primary expanded fluorine-containing polystyrene microspheres have a particle size of 2000 ± 100 μm.
7. The potting process of any of claims 1 to 4 or 6, wherein in step C the temperature of the potting is 100 to 125 ℃.
8. The potting process of claim 7, wherein in step C, the potting time is 40-60 min.
9. The potting process of claim 8, wherein in step C, the potting pressure is 35-90 KPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910436184.9A CN110128581B (en) | 2019-05-23 | 2019-05-23 | Encapsulation process of microstrip patch antenna |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910436184.9A CN110128581B (en) | 2019-05-23 | 2019-05-23 | Encapsulation process of microstrip patch antenna |
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| CN110128581A CN110128581A (en) | 2019-08-16 |
| CN110128581B true CN110128581B (en) | 2021-12-31 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW495528B (en) * | 1997-01-20 | 2002-07-21 | Sekisui Plastics | Expandable thermoplastic resin beads and expanded molded articles manufactured therefrom |
| CN1478120A (en) * | 2000-12-04 | 2004-02-25 | ���Ŵ�ѧ | Foamed cellular particles of expandable polymer composition |
| CN103855458A (en) * | 2012-11-30 | 2014-06-11 | 台湾积体电路制造股份有限公司 | Embedding low-K materials in antennas |
| CN105683270A (en) * | 2013-11-11 | 2016-06-15 | 陶氏环球技术有限责任公司 | Styrene-carboxylic acid copolymer foam |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8912242B2 (en) * | 2011-02-10 | 2014-12-16 | Fina Technology, Inc. | Polar polystyrene copolymers for enhanced foaming |
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- 2019-05-23 CN CN201910436184.9A patent/CN110128581B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW495528B (en) * | 1997-01-20 | 2002-07-21 | Sekisui Plastics | Expandable thermoplastic resin beads and expanded molded articles manufactured therefrom |
| CN1478120A (en) * | 2000-12-04 | 2004-02-25 | ���Ŵ�ѧ | Foamed cellular particles of expandable polymer composition |
| CN103855458A (en) * | 2012-11-30 | 2014-06-11 | 台湾积体电路制造股份有限公司 | Embedding low-K materials in antennas |
| CN105683270A (en) * | 2013-11-11 | 2016-06-15 | 陶氏环球技术有限责任公司 | Styrene-carboxylic acid copolymer foam |
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Denomination of invention: A Sealing Process for Microstrip Patch Antennas Granted publication date: 20211231 Pledgee: Chengdu financial holding Financing Guarantee Co.,Ltd. Pledgor: CHENGDU XINGSHUI TECHNOLOGY Co.,Ltd. Registration number: Y2024510000032 |
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