CN110125541B - Laser bonding apparatus - Google Patents

Abstract

An embodiment of the present invention provides the following laser bonding apparatus, comprising: a platform having an upper surface parallel to a plane defined by a first direction and a second direction perpendicular to each other; a laser generator extending toward the irradiating laser light in the lower direction; the cylinder portion generates pressurizing force in the lower direction along a second pressurizing line spaced parallel to the first pressurizing line in the first direction; pressurizing part, arranged between the cylinder part and the platform, pressurizes the workpiece in the downward direction along the first pressurizing line; and a transmission part, arranged between the cylinder part and the pressurized The cylinder part and the pressurizing part are connected between the parts, and the transmission part transmits the pressurizing force from the first pressurizing line to the second pressurizing line.

Description

Laser bonding device

technical field

The invention relates to a laser bonding device, in particular to a display device with improved display quality.

Background technique

Recently, in order to electrically connect substrates or thin films constituting electronic devices, methods using laser bonding have been employed. The bonding quality of components such as the substrates may be affected by the material of the object to be bonded, the wavelength/output of the laser, the bonding speed, the pressure applied to the bonding site, and the like. Among them, the pressing force can be used as an important factor for determining the quality of the object to be joined.

Contents of the invention

An object of the present invention is to provide a laser bonding device with improved stability.

A laser bonding apparatus according to an embodiment of the present invention includes: a platform having an upper surface parallel to a plane defined by a first direction and a second direction perpendicular to each other, and an object to be processed is placed on the upper surface; a laser generator , irradiate the laser in the downward direction along the first pressurizing line perpendicular to the plane; the cylinder part is arranged on the upper part of the platform, and generates pressurizing force in the downward direction along the second pressurizing line, the second The pressurizing line is spaced parallel to the first pressurizing line in the first direction; the pressurizing part is arranged between the cylinder part and the platform, and moves downward along the first pressurizing line pressurizing the workpiece in one direction; and a transfer part arranged between the cylinder part and the pressurizing part to connect the cylinder part and the pressurizing part, and transfers the The pressurizing force is transmitted to the pressurizing part, and the transmitting part transmits the pressurizing force from the second pressurizing line to the first pressurizing line.

The upper surface of the transmission part includes at least one inclined surface inclined downward along the first direction.

The transmission portion includes: a first transmission portion connected to the cylinder portion and extending along the second direction; a second transmission portion having a plate shape parallel to the plane, the second transmission portion One side of the first direction is connected to the lower part of the first transmission part; and the connection part connects the side surface of the first transmission part and the upper surface of the second transmission part and includes the inclined surface, The inclined surface is inclined downward from the upper surface of the first transmission portion.

A laser bonding apparatus according to an embodiment of the present invention includes: a first connection member arranged on the upper surface of the first transmission portion and connecting a lower portion of the cylinder portion and an upper portion of the transmission portion; and at least one A second connection member is arranged on the other side of the first direction on the back surface of the second transmission portion, and connects the lower portion of the transmission portion and the upper portion of the pressurizing portion.

A plurality of the second transmission part and the connection part are respectively provided, and the plurality of the second transmission parts are respectively arranged on both sides of the first transmission part in the second direction, and the plurality of the connection parts parts are connected in one-to-one correspondence with the second transfer part.

A hole is defined in the pressing portion, the hole overlaps the first pressing line on the plane, and the laser beam generated by the laser generator is irradiated through the hole.

The pressurization part includes: a pressurization plate having a plate shape parallel to the plane; tool.

The pressing part further includes a tip fixed to the pressing tool, the tip being connected to the hole and allowing light to pass therethrough.

The press tool is detachable from the press plate.

The laser bonding apparatus according to the embodiment of the present invention further includes: a stage moving unit connected to the stage and moving the stage.

The laser bonding apparatus according to the embodiment of the present invention further includes: a monitoring section arranged adjacent to the table and measuring the shape and performance of the laser beam.

The laser bonding apparatus according to an embodiment of the present invention further includes: a frame including at least one guide rail extending in a direction perpendicular to the plane, the cylinder part, the transfer part and the pressurizing part are The guide rail moves up and down.

The laser bonding device according to the embodiment of the present invention further includes: at least one first moving part fixed to the cylinder part and installed on the guide rail; at least one second moving part fixed on the transmission part and installed on the guide rail. The guide rail; at least one third moving part is fixed to the pressing part and installed on the guide rail.

The cylinder part includes: a case defining an inner space of the cylinder; a cylinder head arranged inside the case, having a plate shape to divide the inner space of the case, and dividing the inner space of the case The air pressure of the inner space is converted into the pressurizing force; and a cylinder rod is connected with the cylinder head and supplies the pressurizing force to the transmission part.

It also includes: a displacement sensor measuring the distance between the cylinder part and the transmission part according to the embodiment of the present invention.

The displacement sensor includes an encoder.

The laser beam has a straight beam shape.

A laser bonding apparatus according to an embodiment of the present invention includes: a platform having an upper surface parallel to a plane defined by a first direction and a second direction perpendicular to each other, and an object to be processed is placed on the upper surface; a laser generator , to irradiate laser light along the direction toward the platform; the cylinder part is arranged on the upper part of the platform, and generates pressure in the downward direction; the pressurizing part is arranged between the cylinder part and the platform, and in the downward direction pressing the workpiece; and a transmission part disposed between the cylinder part and the pressurizing part, transmitting the pressurizing force received from the cylinder part to the pressurizing part, the transmission part One side of the first direction is connected to the cylinder part, the other side of the first direction is connected to the pressurizing part, and the upper surface of the transmission part has At least one inclined surface inclined downwards with one side facing the other side.

The direction of the pressurizing force provided by the cylinder part to the transmitting part is separated from the direction of the pressurizing force provided by the pressurizing part to the platform along the first direction, and the laser beam is separated from the The area where the pressurizing part presses the workpiece overlaps.

The laser bonding device according to the embodiment of the present invention further includes: a first connection member arranged on one side of the transmission part in the first direction, and connects the lower part of the cylinder and the upper part of the transmission part; A component is arranged on the other side of the transfer part in the first direction and connects the lower part of the transfer part and the upper part of the pressurizing part.

According to the embodiments of the present invention, the stability of the laser bonding apparatus can be improved.

Description of drawings

FIG. 1 is an overall perspective view of a laser bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of the laser bonding apparatus shown in FIG. 1 .

3 is a sectional view of a cylinder portion according to an embodiment of the present invention.

4 is a cross-sectional view of a pressurizing portion according to an embodiment of the present invention.

Fig. 5 is a cross-sectional view of a transfer part according to an embodiment of the present invention.

6 is a cross-sectional view of a cylinder portion, a pressurizing portion, and a transmission portion according to an embodiment of the present invention.

7 is an overall perspective view of a laser bonding device according to another embodiment of the present invention.

Fig. 8 is a front view of the laser bonding device shown in Fig. 7 .

Fig. 9 is an overall perspective view of a laser bonding device according to another embodiment of the present invention.

Fig. 10 is a side view of a laser bonding apparatus according to another embodiment of the present invention.

Symbol Description

1000: Laser bonding device 100: Laser generator

200: Cylinder part 210: Housing

220: cylinder head 230: cylinder rod

300: Pressure section 310: Pressure plate

320: Pressure tool TT: Tip

400: Transfer Department 410: First Transfer Department

420: Second transmission part 430: Connection part

500: Platform 600: Framework

700: Platform Mobile MM: Mobile Parts

GR: Guide rail CN: Connecting part

PRL: Pressurized Line DM: Displacement Measuring Device

DMB: Measuring stick DMP: Measuring plate

HD: Measuring head SC: Measuring stick

MNT: Ministry of Surveillance

Detailed ways

The advantages, features, and methods for achieving the same of the present invention will become apparent when referring to the accompanying drawings and the embodiments described in detail. However, the present invention is not limited to the embodiments disclosed below, which can be embodied in various forms different from each other, but this embodiment is to make the disclosure of the present invention complete, and to understand the technical field to which the present invention belongs. It is provided that those having common knowledge fully inform the scope of the present invention, and the present invention is defined only by the scope described in the claims. Throughout the specification, the same reference numerals denote the same constituent elements.

When an element or layer is described as being "on" or "on" another element or layer, this includes not only immediately on the other element or layer but also intervening elements or layers. The case where other layers or other elements are provided.

In contrast, when an element is described as being "directly on" or "immediately on" another portion, it means that there are no intervening elements or layers. "And/or" means each of the items mentioned and all combinations of more than one.

Relative terms such as "below", "beneath", "lower", "above", and "upper" are shown in the figure What is shown may be used for convenience in describing the correlation between one element or constituent element and another element or constituent element. Spatially relative terms should also be understood as terms including mutually different orientations of elements when used or operated, in addition to the orientation shown in the figures. Throughout the specification, the same reference numerals denote the same constituent elements.

Although terms such as first and second are used to describe various elements, components, and/or sections, it is obvious that these elements, components, and/or sections are not limited to the above-mentioned terms. The above-mentioned terms are used only to distinguish one element, constituent element, and/or section from another element, constituent element, and/or section. Therefore, within the scope of the technical idea of the present invention, it is obvious that a first element, a first constituent element, or a first section mentioned below may also be a second element, a second constituent element, or a second section.

The embodiment described in this specification is demonstrated with reference to the plan view and cross-sectional view which are ideal schematic diagrams of this invention. Therefore, the form of schematic diagrams may be deformed due to manufacturing techniques and/or tolerances and the like. Therefore, the embodiments of the present invention also include changes in forms produced according to the manufacturing process, and should not be limited to the specific forms shown in the drawings. Therefore, the regions illustrated in the drawings have a schematic nature, and the shapes of the regions illustrated in the drawings are used to illustrate specific forms of regions of elements, and should not be used to limit the scope of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is an overall perspective view of a laser bonding device according to an embodiment of the present invention, and FIG. 2 is a side view of the laser bonding device shown in FIG. 1 .

Referring to FIGS. 1 and 2 , a laser bonding apparatus 1000 according to an embodiment of the present invention can bond two or more workpieces SUB1 and SUB2 to each other using a laser beam LSR. The workpieces may be bonded to each other to be electrically connected. The workpieces SUB1 and SUB2 may be substrates, films, or electronic components. For example, according to an embodiment of the present invention, any one of the workpieces SUB1 and SUB2 may be a display panel, a touch panel or a printed circuit board, and the other may be a flexible circuit board.

The laser bonding apparatus 1000 includes a laser generator 100 , a cylinder unit 200 , a pressurizing unit 300 , a transfer unit 400 , a stage 500 , and a frame 600 .

The laser generator 100 generates a laser beam LSR. The laser beam LSR may be irradiated in a downward direction. In this embodiment, the cross-sectional shape of the laser beam LSR may be a linear beam (Line Beam) extending along one direction. Not limited to the drawings, the laser generator 100 may include an optical system (not shown) for processing the shape and intensity of the laser beam LSR.

The workpieces SUB1 , SUB2 are placed on the upper surface of the table 500 . The upper surface of the platform 500 may be parallel to a plane defined by a first direction DR1 and a second direction DR2 perpendicular to the first direction DR1 .

The stage 500 and the laser generator 100 may be arranged in a line to overlap on the plane. That is, the laser beam LSR generated from the laser generator 100 is irradiated toward the stage 500 .

For convenience of description, the direction in which the laser beam is irradiated is defined as the lower direction, and the direction opposite to the lower direction is defined as the upper direction. In this embodiment, the upper direction and the lower direction are parallel to the third direction DR3, and the third direction DR3 is defined by directions perpendicular to the first direction DR1 and the second direction DR2 respectively. The third direction DR3 may be a reference direction for distinguishing the front and back of components described later. However, an upper direction or a lower direction is a relative concept and can be converted into other directions.

The cylinder part 200 is arranged on the upper part of the platform 500 . The cylinder part 200 is arranged adjacent to one side of the laser generator 100 in the first direction DR1. The cylinder unit 200 generates pressurizing force in the downward direction. The direction of the pressing force generated from the cylinder portion 200 may be parallel to the direction in which the laser beam LSR is irradiated. Hereinafter, in FIG. 3 , the cylinder unit 200 will be described in more detail.

The pressurizing part 300 is arranged between the cylinder part 200 and the platform 500 . The pressing unit 300 receives pressing force from above to press the workpieces SUB1 and SUB2 placed on the table 500 . The direction of the pressing force provided by the pressing part 300 to the stage 500 may be the same as the direction in which the laser beam LSR is irradiated on the stage 500 . Hereinafter, the pressurizing unit 300 will be described in more detail with reference to FIG. 4 .

The transfer part 400 is arranged between the cylinder part 200 and the pressurizing part 300 . The transmitting unit 400 plays a role of transmitting the pressurizing force received from the cylinder unit 200 to the pressurizing unit 300 . Hereinafter, the transmission unit 400 will be described in more detail with reference to FIGS. 5 and 6 .

The laser bonding apparatus 1000 according to the embodiment of the present invention may further include at least one first connecting part CN1 and at least one second connecting part CN2. The first connection member CN1 connects the cylinder part 200 and the transmission part 400 . The second connection part CN2 connects the transmission part 400 and the pressurization part 300 . According to this embodiment, on the plane, the first connecting part CN1 may be arranged apart from the second connecting part CN2 along the first direction DR1. Hereinafter, referring to FIG. 6 , the connection members CN1 and CN2 will be described in more detail.

The frame 600 is arranged on the first direction DR1 side of the cylinder part 200 , the pressurizing part 300 and the transmission part 400 . The cylinder part 200 , the pressurizing part 300 and the transmission part 400 may be fixed to any one side wall of the frame 600 . The frame 600 functions as a support for fixing the cylinder unit 200 , the pressurizing unit 300 , and the transmission unit 400 so as not to move on the plane.

The frame 600 according to this embodiment includes a first guide rail GR1 and a second guide rail GR2 disposed on the side wall. Specifically, the first guide rail GR1 and the second guide rail GR2 are arranged on the side wall of the frame 600 adjacent to the cylinder part 200 , the pressurizing part 300 and the transmission part 400 . The first guide rail GR1 and the second guide rail GR2 may extend along a third direction DR3 that is an upper direction and a lower direction, respectively.

The laser bonding apparatus 1000 according to the present embodiment may further include first to third moving parts MM1, MM2, MM3. The present invention does not particularly limit the respective numbers of the first to third moving parts MM1, MM2, MM3.

The first moving member MM1 is connected to the cylinder part 200 . The second moving part MM2 is connected to the transfer part 400 . The third moving part MM3 is connected to the pressing part 300 . The first moving part MM1 is installed on the first guide rail GR1. The second moving part MM2 and the third moving part MM3 are installed on the second guide rail GR2.

As the first to third moving parts MM1 , MM2 , MM3 are installed on the first guide rail GR1 and the second guide rail GR2 , the cylinder part 200 , the pressurizing part 300 and the transmission part 400 may be fixed to the frame 600 .

As an example, at least one groove G is formed on the outer surfaces of the first guide rail GR1 and the second guide rail GR2 respectively. At least one protrusion (not shown) may be formed on the inner surface of the first to third moving parts MM1, MM2, MM3, and the first to third moving parts MM1, MM2, MM3 may be installed on the first The guide rail GR1 and the second guide rail GR2. However, this is only an illustration of a certain installation method, and the present invention does not specifically limit the installation method between the first to third moving parts MM1 , MM2 , MM3 and the first guide rail GR1 and the second guide rail GR2 .

Protrusions (not shown) formed on the first to third moving parts MM1 , MM2 , MM3 and grooves G formed on the first and second guide rails GR1 and GR2 may extend along the third direction DR3 . Therefore, the first to third moving parts MM1, MM2, and MM3 can move upward or downward along the extending direction of the first guide rail GR1 and the second guide rail GR2. That is, the cylinder part 200, the pressurization part 300, and the transmission part 400 can reciprocate along the upper direction or the lower direction which is the extension direction of the 1st guide rail GR1 and the 2nd guide rail GR2.

In this embodiment, the configuration of one first guide rail GR1 and two second guide rails GR2 disposed on the side wall of the frame 600 is described, but the present invention does not limit the number of guide rails. Moreover, according to another embodiment of the present invention, the frame 600 may only include any one of the first guide rail GR1 and the second guide rail GR2. In this case, the first to third moving parts MM1, MM2, MM3 can all be installed on one guide rail.

The laser bonding apparatus 1000 according to the present embodiment may further include a stage moving part 700 disposed at a side or a lower portion of the stage 500 . The platform moving part 700 is connected to the platform 500 to move the platform 500 on the plane, or move upward or downward. The present invention does not specifically limit the shape, size and moving direction of the platform moving part 700 . In another embodiment of the present invention, the platform moving part 700 may be omitted. 3 is a sectional view of a cylinder portion according to an embodiment of the present invention.

Referring to FIG. 3 , a cylinder part 200 according to an embodiment of the present invention includes a housing 210 , a cylinder head 220 and a cylinder rod 230 .

The housing 210 defines the inner space of the cylinder part 200 . Air may be supplied to the inside of the housing 210 from the outside. In this embodiment, the housing 210 has a rectangular parallelepiped shape. However, the present invention does not particularly limit the shape of the housing 210 .

The cylinder head 220 is arranged inside the housing 210 . The cylinder head 220 has a plate shape parallel to the plane. The cylinder head 220 may divide a space inside the housing 210 . The cylinder head 220 may move in an upward or downward direction by the air pressure inside the housing 210 . That is, the cylinder head 220 may convert the air pressure inside the housing 210 into a pressurized force.

The cylinder rod 230 is disposed on the lower surface of the cylinder head 220 . The upper portion of the cylinder rod 230 is connected to the cylinder head 220 . The cylinder rod 230 has a rod shape extending downward. The cylinder rod 230 supplies the pressurized force applied from the cylinder head 220 to the transmission part 400 . The lower portion of the cylinder rod 230 is connected to the first connecting member CN1.

Although not shown in the drawings, the laser bonding apparatus 1000 according to the embodiment of the present invention may further include a motor part (not shown). A motor part (not shown) may be connected to the cylinder part 200 to generate pressure to move the cylinder part 200 in an up and down direction. 4 is a cross-sectional view of a pressurizing portion according to an embodiment of the present invention.

Referring to FIG. 4 , the pressing part 300 includes a pressing plate 310 , a pressing tool 320 and a tip TT.

The pressing plate 310 has a plate shape parallel to the plane. The pressing tool 320 may be disposed at a lower portion of the pressing plate 310 to be fixed to the pressing plate 310 . The pressing tool 320 is arranged to be biased to the other side of the first direction DR1 in the rear surface of the pressing plate 310 . According to this embodiment, the pressing tool 320 may be designed to be detachable from the pressing plate 310 .

According to this embodiment, the hole H penetrating downward may be defined in the press plate 310 and the press tool 320 . The hole H may extend from the upper surface of the pressing plate 310 to the back of the pressing tool 320 . The laser beam LSR generated from the laser generator 100 may pass through the hole H and be irradiated toward the table 500 ( FIG. 1 ).

The tip TT is arranged at the lower part of the pressing tool 320 , and the tip TT directly contacts the workpiece ( FIG. 1 , FIG. 2 ) to provide a pressing force. The tip TT may be formed of a transparent material. As examples, the tip TT may include glass, quartz, plastic, and the like.

The tip TT has a tapered shape with a sharp lower end in cross section. That is, the cross-sectional width of the tip TT may be narrowed adjacent to the platform 500 . The tip TT may extend in the second direction DR corresponding to the beam shape of the laser beam LSR ( FIG. 1 ).

According to the present embodiment, a part of the tip TT is inserted inside the hole H formed in the press tool 320 so that the tip TT can be fixed to the press tool 320 . The laser beam LSR passes through the tip TT so that it can be irradiated onto the platform 500 .

According to the present embodiment, the tip TT may be designed to be detachable from the press tool 320 . Therefore, even if the tip TT is damaged due to pressing force, it is easily replaced.

Fig. 5 is a cross-sectional view of a transfer part according to an embodiment of the present invention. 6 is a cross-sectional view of a cylinder portion, a pressurizing portion, and a transmission portion according to an embodiment of the present invention.

Referring to FIG. 5 and FIG. 6 , the transmission part 400 includes a first transmission part 410 , a second transmission part 420 and a connection part 430 . The first transmission part 410 has a cuboid shape extending in the first direction DR2 and the third direction DR3. According to the present embodiment, a first connection part CN1 may be disposed on the upper surface of the first transfer part 410 . That is, the first connecting member CN1 connects the first transmission part 410 and the cylinder rod 230 of the cylinder part 200 . The pressurized force supplied from the cylinder rod 230 is supplied to the first transmission part 410 through the first connection part CN1.

The second transfer part 420 is disposed at a lower portion of the first transfer part 410 . Specifically, one side of the second transfer part 420 in the first direction DR1 may be connected with a lower portion of the first transfer part 410 . The second transmission part 420 extends from the lower part of the first transmission part 410 to the other side of the first direction DR1.

According to the present embodiment, a plurality of second delivery parts 420 may be provided. As shown in FIG. 5 , the two second transmission parts 420 may be respectively arranged at both ends of the first transmission part 410 in the second direction DR2 .

According to the present embodiment, the second connecting part CN2 may be provided in plural. As shown in FIG. 5 , the two second connecting parts CN2 are respectively arranged at the lower part of the second transmission part 420 . The second connection parts CN2 are respectively arranged to be biased to the other side of the second transmission part 420 in the first direction DR1 . The second connecting member CN2 connects the second transmission part 420 and the pressing plate 310 of the pressing part 300 (see FIGS. 1 and 2 ). The pressurizing force provided to the second transfer part 420 may be provided to the pressurizing plate 310 through the second connection part CN2. No connection part is arranged on one side of the second transfer part 420 in the first direction DR1. That is, one side of the second transfer part 420 in the first direction DR1 is separated from the pressurizing part 300 .

The connection part 430 is disposed on the other side of the first transmission part 410 in the first direction DR1. One side of the connection part 430 in the first direction DR1 may be in contact with the other side of the first transfer part in the first direction DR1.

According to the present embodiment, the connection part 430 is provided in plural. As shown in FIG. 5 , the two connection parts 430 may be arranged to be in contact with both side edge positions of the second direction DR2 on the other side of the first transfer part 410 . The connection part 430 is connected to the second transmission part 420 in a one-to-one correspondence. Respective upper surfaces of the second transmission parts 420 are respectively in contact with respective lower surfaces of the connection parts 430 .

According to the present embodiment, respective upper surfaces of the connection parts 430 may be inclined in a lower direction along the first direction DR1. Hereinafter, the upper surface is defined as an inclined surface IS. Specifically, the inclined surface IS is connected to the upper surface of the first transmission part 410 at one side of the first direction DR1, and may incline downward toward the other side of the first direction DR1. The inclined surface IS may be connected to the other side of the second transfer part 420 in the first direction DR1 on the other side of the first direction DR1 .

Referring to FIG. 6 , a laser beam (not shown) generated from a laser generator 100 may be irradiated along the first pressurization line PRL1 . A laser beam (not shown) is irradiated onto the stage 500 through the tip TT of the pressing part 300 . Also, the pressurizing force provided by the pressurizing part 300 may overlap the first pressurizing line PRL1. Therefore, the area on the workpiece (not shown) to be joined may be the same in plan as the irradiation area of the laser beam (not shown) and the pressing area of the pressing section 300 .

The pressurization force generated by the cylinder part 200 may be provided along a second pressurization line PRL2 spaced parallel to the first pressurization line PRL1 in the first direction DR1 .

The transmission part 400 transmits the pressurization force supplied from the cylinder part 200 from the second pressurization line PRL2 to the first pressurization line PRL1.

Unlike the embodiment of the present invention, when the pressure is applied from the cylinder part 200 to the pressurizing part 300 along the second pressurizing line PRL2 in the laser bonding apparatus that does not include the transfer part 400 having the inclined surface IS, there may be Moment is generated in the pressurizing unit 300 . That is, the cylinder part 200 supplies the pressurizing force to one side of the first direction DR1 of the pressurizing part 300, and thus the force in the upper direction may be applied to the other side of the first direction DR1 of the pressurizing part 300 where the pressurizing tool 320 is arranged. . In this case, the pressure that needs to be applied to the workpiece ( FIGS. 1 and 2 ) along the first pressure line PRL1 may be lost, or the pressure from the pressurizing part 300 to the workpiece ( FIGS. 1 and 2 ) may be lost. The direction of the supplied pressurizing force may deviate from the first pressurizing line PRL1. However, according to an embodiment of the present invention, the moment generated in the pressurizing part 300 can be canceled by the connecting part 430 of the transmitting part 400 . That is, the connection part 430 of the transmission part 400 can prevent the pressing part 300 from being distorted by the force from the upper direction by being fixed, and can prevent the loss of the pressing force applied to the workpiece (FIG. 1, FIG. 2). As a result, according to the embodiments of the present invention, the stability of the laser bonding apparatus can be improved.

7 is an overall perspective view of a laser bonding device according to another embodiment of the present invention, and FIG. 8 is a front view of the laser bonding device shown in FIG. 7 .

For convenience of description, points different from one embodiment of the present invention are mainly described, and omitted parts refer to one embodiment of the present invention. In addition, the same reference numerals are used for the constituent elements described above, and overlapping descriptions of the above constituent elements are omitted.

Referring to FIG. 7 and FIG. 8 , the laser bonding apparatus 1000 - 1 according to another embodiment of the present invention may further include a first displacement sensor DM1 . The first displacement sensor DM1 includes a measuring plate DMP and a measuring rod DMB.

The measuring plate DMP is connected to the cylinder part 200 . In this embodiment, it is arranged at the lower end of the casing 210 (see FIG. 3 ) of the cylinder unit 200 . However, the present invention does not particularly limit the arrangement and connection relationship of the measurement board DMP.

The measurement plate DMP has a plate shape parallel to said plane and extends in the second direction DR2.

The measuring rod DMB is arranged on one side of the second direction DR2 of the measuring plate DMP. The measuring rod DMB penetrates the measuring plate DMP. The lower end of the measuring rod DMB is fixed to the upper surface of the first transmission part 410 of the transmission part 400 .

Although not shown, a scale may be marked on the outer surface of the measuring stick DMB. As the cylinder part 200 moves in the upper and lower directions, the measurement plate DMP may move in the upper and lower directions together. At this time, the measuring rod DMB does not move. The distance d between the cylinder part 200 and the transfer part 400 may be measured by measuring the position where the measuring plate DMP contacts the measuring rod DMB.

According to the present embodiment, the point in time at which a predetermined pressing force is provided on the platform 500 can be measured. The irradiation time point of the laser beam LSR of the laser generator 100 can be controlled by measuring the time point. That is, according to this embodiment, it is possible to prevent the workpiece ( FIG. 1 , FIG. 2 ) from being damaged by pressurizing force or heat, or from reducing joining accuracy by controlling the pressurization timing and irradiation timing.

As shown in FIGS. 8 and 9 , the first displacement sensor DM1 is designed to measure the distance between the cylinder portion 200 and the transmission portion 400 , but the present invention is not limited thereto. According to another embodiment of the present invention, in order to measure the size of the pressurized force, the first displacement sensor can be designed to measure the distance between at least any two of the cylinder part 200, the pressurized part 300, the transfer part 400 and the platform 500 .

Fig. 9 is an overall perspective view of a laser bonding device according to another embodiment of the present invention.

For the convenience of description, points different from one embodiment of the present invention are mainly described, and the omitted part refers to one embodiment of the present invention. In addition, the same reference numerals are used for the constituent elements described above, and overlapping descriptions of the above constituent elements are omitted.

Referring to FIG. 9 , a laser bonding apparatus 1000-2 according to another embodiment of the present invention may further include a second displacement sensor DM2.

The second displacement sensor DM2 may include a measuring plate DMP, a measuring head HD, and a measuring rod SC. The measuring plate DMP is arranged at the lower portion of the housing 210 (refer to FIG. 3 ) of the cylinder part 200 . The measurement plate DMP extends in the second direction DR2 and has a plate shape parallel to said plane. The measuring head HD is arranged on top of the measuring plate DMP. Specifically, the measuring head HD is arranged on one side of the measuring plate DMP in the second direction DR2. The measuring head HD can move upward and downward together with the cylinder unit 200 . In another embodiment of the invention, the measurement panel DMP can be omitted. In this case, the measuring head HD may be fixed to the cylinder unit 200 by directly contacting the cylinder unit 200 .

The measuring stick SC is fixed to any one of the second moving parts MM2. Therefore, the measuring rod SC can move in the third direction DR3 together with the transmission part 400 . The measuring rod SC extends in the upper and lower directions. The measuring rod SC is arranged facing the measuring head HD. Although not shown, a scale may be marked on the outside of the measuring stick SC. The measuring head HD can sense the scale marked on the measuring stick SC. As an example, the measuring head HD may be an encoder (Encoder). Therefore, the second displacement sensor DM2 may measure the distance between the cylinder part 200 and the transmission part 400 .

In FIG. 9, although the measuring rod SC is designed so that it may be fixed to the 2nd moving member MM2, this invention is not limited to this. For example, according to another embodiment of the present invention, within the range where the measuring rod SC faces the measuring head HD, the measuring rod SC may be in direct contact with the transmitting part 400 to be fixed on the transmitting part 400 .

Fig. 10 is a side view of a laser bonding apparatus according to another embodiment of the present invention.

For the convenience of description, points different from one embodiment of the present invention are mainly described, and the omitted part refers to one embodiment of the present invention. In addition, the same reference numerals are used for the constituent elements described above, and overlapping descriptions of the above constituent elements are omitted.

Referring to FIG. 10 , a laser bonding apparatus 1000-3 according to another embodiment of the present invention may further include a monitoring part MNT. The monitoring part MNT is arranged adjacent to the platform 500 . The monitoring part MNT may be arranged on the same plane as the platform 500 .

The monitoring unit MNT is connected to the platform moving unit 700 . The monitoring unit MNT may move together with the platform 500 via the moving unit 700 , and may also move independently of the platform 500 .

The monitor MNT plays a role of measuring the shape and performance of the laser beam LSR to be supplied to the stage 500 . Although not shown, the monitoring unit MNT may include an optical system. According to the present embodiment, it is possible to directly measure the laser beam LSR to be supplied to the platform 500 without splitting the laser beam LSR using a beam splitter. Therefore, the measurement accuracy of the laser beam LSR can be improved.

The above has been described with reference to the embodiments, but it should be understood that various modifications and changes can be made to the present invention by those skilled in the art without departing from the spirit and scope of the present invention described in the claims. Moreover, the embodiments disclosed in the present invention are not used to limit the technical idea of the present invention, and all technical ideas within the scope described in the claims and their equivalent scope should be interpreted as being included in the scope of rights of the present invention.

Claims (9)

1. A laser bonding apparatus comprising:

a stage having an upper surface parallel to a plane defined by a first direction and a second direction perpendicular to each other, and on which an object to be processed is placed;

a laser generator configured to irradiate laser in a downward direction along a first voltage line perpendicular to the plane;

a cylinder portion disposed at an upper portion of the stage, generating a pressurizing force along a second pressurizing line in a lower direction, the second pressurizing line being spaced apart from the first pressurizing line in parallel in the first direction;

a pressing portion arranged between the cylinder portion and the platform, and pressing the processed object along the first pressing line in a lower direction; and

a transfer portion that is arranged between the cylinder portion and the pressurization portion to connect the cylinder portion and the pressurization portion, transfers the pressurization force received from the cylinder portion to the pressurization portion,

wherein the transmission part includes:

a first transfer part connected to the cylinder part and extending in the second direction;

a second transfer part disposed at a lower portion of the first transfer part, one side of the second transfer part in the first direction being connected with the lower portion of the first transfer part; and

a connection part connecting a side surface of the first transfer part and an upper surface of the second transfer part,

wherein the second transmission portion and the connection portion are respectively provided in plurality,

a plurality of the second transfer portions are respectively arranged on both sides of the first transfer portion in the second direction,

the plurality of connecting portions are connected in a one-to-one correspondence with the second transmitting portions,

the transmitting portion transmits the pressing force from the second pressing line to the first pressing line.

2. The laser bonding apparatus of claim 1,

the connection portion includes at least one inclined surface inclined in a downward direction from an upper surface of the transmission portion along the first direction.

3. The laser bonding apparatus of claim 1, further comprising:

a first connection member disposed on the upper surface of the first transfer portion, connecting a lower portion of the cylinder portion and an upper portion of the transfer portion; and

at least one second connection member disposed on the other side of the first direction on a back surface of the second transmission portion and connecting a lower portion of the transmission portion and an upper portion of the pressurization portion.

4. The laser bonding apparatus of claim 1,

a hole is defined in the pressing portion,

the hole overlaps the first pressing line on the plane,

a laser beam generated at the laser generator is irradiated through the hole.

5. The laser bonding apparatus of claim 4,

the pressing portion includes:

a pressing plate having a plate shape parallel to the plane; and

a pressing tool disposed at a lower portion of the pressing plate,

the hole penetrates the pressing plate and the pressing tool.

6. The laser bonding apparatus of claim 5,

the pressurizing part also comprises a tip part fixed on the pressurizing tool,

the tip portion is connected to the hole and allows light to pass therethrough.

7. The laser bonding apparatus of claim 5, wherein,

the pressing tool is detachable from the pressing plate.

8. The laser bonding apparatus of claim 1,

further comprising: and a frame including at least one guide rail extending in a direction perpendicular to the plane, the cylinder part, the transfer part, and the pressurization part moving up and down by means of the guide rail.

9. The laser bonding apparatus of claim 1,

further comprising: a displacement sensor measuring a distance between the cylinder part and the transfer part.

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