CN110120639B - Electronic equipment and electrical cabinet containing the same - Google Patents
Electronic equipment and electrical cabinet containing the same Download PDFInfo
- Publication number
- CN110120639B CN110120639B CN201910555299.XA CN201910555299A CN110120639B CN 110120639 B CN110120639 B CN 110120639B CN 201910555299 A CN201910555299 A CN 201910555299A CN 110120639 B CN110120639 B CN 110120639B
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- heat dissipation
- substrate
- electronic device
- circuit
- housing
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/30—Cabinet-type casings; Parts thereof or accessories therefor
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
- H02B1/565—Cooling; Ventilation for cabinets
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本公开实施例提供了一种电子设备和包含其的电气柜，该电子设备包括壳体和设置在壳体内的基板，基板上设置有形成电路的多个电子元器件，壳体包括设于其第一侧的进风口和设于其第二侧的出风口，在基板上形成至少一个散热通道，散热通道连通进风口和出风口。本公开通过在电子设备的壳体的底部和顶部分别设置进风口和出风口，且电子设备内的电子元器件之间形成至少一个散热通道，散热通道增加了电子元器件与外部气流的接触面积，有效地降低了电子元器件的热量，增加了散热效率，进风口和出风口使电子设备在无风扇的情况下能够达到高效散热的需求，提高系统长期运行的可靠性。
The embodiment of the present disclosure provides an electronic device and an electrical cabinet containing the same, the electronic device includes a housing and a substrate arranged in the housing, a plurality of electronic components forming a circuit are arranged on the substrate, the housing includes an air inlet arranged on a first side thereof and an air outlet arranged on a second side thereof, at least one heat dissipation channel is formed on the substrate, and the heat dissipation channel connects the air inlet and the air outlet. The present disclosure provides an air inlet and an air outlet at the bottom and the top of the housing of the electronic device, respectively, and at least one heat dissipation channel is formed between the electronic components in the electronic device, the heat dissipation channel increases the contact area between the electronic components and the external airflow, effectively reduces the heat of the electronic components, and increases the heat dissipation efficiency, the air inlet and the air outlet enable the electronic device to meet the requirements of efficient heat dissipation without a fan, and improve the reliability of the long-term operation of the system.
Description
Technical Field
The present disclosure relates to the field of electronic devices, and in particular, to an electronic device and an electrical cabinet including the same.
Background
Since electrical cabinets often involve components that are stored in a relatively large volume, such as inductors, it is difficult for manufacturers to modularize or miniaturize the electrical cabinets when they are manufactured. The switch power supply in the electric cabinet is used as one of important components in the electric cabinet, the service life of the switch power supply is greatly influenced by the heat dissipation effect of the switch power supply, and the heat dissipation of the switch power supply is only carried out on a closed shell, so that the heat in the switch power supply cannot be effectively dissipated, the service life of the switch power supply is reduced, and the use of the electric cabinet is influenced.
Disclosure of Invention
Aiming at the technical problems in the prior art, the disclosure provides electronic equipment and an electrical cabinet comprising the same, and the heat dissipation efficiency of the electronic equipment is effectively increased.
The embodiment of the disclosure provides electronic equipment, which comprises a shell and a substrate arranged in the shell, wherein a plurality of electronic components forming a circuit are arranged on the substrate, the shell comprises an air inlet arranged on a first side of the shell and an air outlet arranged on a second side of the shell, at least one heat dissipation channel is formed on the substrate, and the heat dissipation channel is communicated with the air inlet and the air outlet.
In some embodiments, a plurality of heat dissipation plates are disposed on the substrate, and heat dissipation channels are formed between the heat dissipation plates and the housing and/or between the heat dissipation plates.
In some embodiments, the heat dissipation plate is provided with a heat conduction layer abutted against the inner wall of the shell.
In some embodiments, the electronic component is disposed on the heat dissipation channel or on the heat dissipation plate.
In some embodiments, the circuit is a dc-dc conversion circuit, the electronic component includes an input terminal and an output terminal at a first end of the substrate, and a bus capacitor, a dual-tube forward primary side circuit, a forward transformer, and a secondary side rectifying filter circuit sequentially connected on the substrate in a clockwise or counterclockwise direction, and a boost circuit is disposed between the input terminal and the bus capacitor.
In some embodiments, the heat dissipation plate includes a first heat dissipation plate and a second heat dissipation plate, the heat dissipation channel is formed between the first heat dissipation plate and the second heat dissipation plate, and the bus capacitor and the forward transformer are disposed in the heat dissipation channel.
In some embodiments, the heat dissipation device further comprises a vertical plate, wherein the vertical plate is arranged at a second end part opposite to the first end part on the substrate and is vertically connected with the substrate, and a heat dissipation channel is formed between the vertical plate and the heat dissipation plate.
In some embodiments, a flyback circuit is provided on the riser.
In some embodiments, the side plates of the shell are provided with heat dissipation ribs.
In some embodiments, the housing further comprises a mounting plate vertically disposed on the base plate, and the input terminal and the output terminal are disposed proximate to the mounting plate.
The embodiment of the disclosure also provides an electrical cabinet, which comprises a cabinet body and an air supply assembly for supplying air to the cabinet body, wherein the electrical cabinet further comprises the electronic equipment, and air flow generated by the air supply assembly sequentially flows through the air inlet and the air outlet.
Compared with the prior art, the electronic device has the beneficial effects that the air inlet and the air outlet are respectively formed at the bottom and the top of the shell of the electronic device, at least one heat dissipation channel is formed between electronic components in the electronic device, external air flows through the air inlet and enters the electronic device, heat of the electronic components is discharged from the air outlet through the heat dissipation channel, the contact area between the electronic components and the external air flow is increased by the heat dissipation channel, the heat of the electronic components is effectively reduced, the heat dissipation efficiency is increased, the air inlet and the air outlet enable the electronic device to achieve the high-efficiency heat dissipation requirement under the condition of no fan, and the reliability of long-term operation of the system is improved. The electric cabinet can timely cool and dissipate heat through the electronic equipment, and the service life is prolonged.
Drawings
In the drawings, which are not necessarily drawn to scale, like numerals may describe similar components in different views. The same reference numerals with letter suffixes or different letter suffixes may represent different instances of similar components. The accompanying drawings illustrate various embodiments by way of example in general and not by way of limitation, and together with the description and claims serve to explain the disclosed embodiments. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. Such embodiments are illustrative and not intended to be exhaustive or exclusive of the present apparatus or method.
Fig. 1 is a schematic structural view of a housing of an electronic device according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a partial structure of an electronic device according to an embodiment of the disclosure;
FIG. 3 is another partial schematic diagram of an electronic device according to an embodiment of the present disclosure;
FIG. 4 is a circuit diagram of an electronic device of an embodiment of the present disclosure;
FIG. 5 is a top view of an electronic device of an embodiment of the present disclosure;
Fig. 6 is a schematic structural view of an electrical cabinet according to an embodiment of the disclosure.
The reference numerals in the drawings denote components:
1-shell, 101-air inlet, 102-air outlet, 2-substrate, 3-heat radiation rib, 4-heat radiation plate, 401-first heat radiation plate, 402-second heat radiation plate, 5-input terminal, 6-output terminal, 7-bus capacitor, 8-double-tube forward primary side circuit, 9-forward transformer, 10-secondary side rectifying and filtering circuit, 11-booster circuit, 12-input EMI filtering circuit, 13-output EMI filtering circuit, 14-vertical plate, 15-electric cabinet, 151-cabinet body, 152-air supply assembly, 153-electronic equipment, 16-mounting plate and 17-flyback circuit.
Detailed Description
In order to better understand the technical solutions of the present disclosure, the following detailed description of the present disclosure is provided with reference to the accompanying drawings and the specific embodiments. Embodiments of the present disclosure will be described in further detail below with reference to the drawings and specific embodiments, but not by way of limitation of the present disclosure.
The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
In this disclosure, when a particular device is described as being located between a first device and a second device, there may or may not be an intervening device between the particular device and either the first device or the second device. When it is described that a particular device is connected to other devices, the particular device may be directly connected to the other devices without intervening devices, or may be directly connected to the other devices without intervening devices.
All terms (including technical or scientific terms) used in this disclosure have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs, unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
The embodiment of the disclosure provides an electronic device, as shown in fig. 1 and 2, which comprises a housing 1 and a substrate 2 arranged in the housing 1, wherein a plurality of electronic components forming a circuit are arranged on the substrate 2, the electronic components can emit certain heat in the use process, the housing 1 comprises an air inlet 101 arranged at one side of the housing and an air outlet 102 arranged at the other side of the housing, the air inlet 101 and the air outlet 102 can be arranged in a certain sequence, the number and arrangement mode of the air inlet 101 and the air outlet 102 can be selected according to the heat dissipation requirement, at least one heat dissipation channel is formed on the substrate 2, a plurality of electronic component devices are arranged on the heat dissipation channel, and the heat dissipation channel is communicated with the air inlet 101 and the air outlet 102.
Specifically, in this embodiment, a dc-dc conversion circuit may be disposed on the substrate 2, where the substrate 2 is configured to carry the circuit structure of this embodiment, and as shown in fig. 3, an input terminal 5 and an output terminal 6 are disposed at a first end of the substrate 2, and a bus capacitor 7, a dual-pipe forward side circuit 8, a forward transformer 9 and a secondary side rectifying and filtering circuit 10 sequentially connected in a clockwise or counterclockwise direction are further disposed on the substrate 2, where the input terminal 5 and the output terminal 6 are disposed at the same end of the substrate 2, so that the connection between the dc-dc conversion circuit on the substrate 2 and an external circuit is more convenient, and the bus capacitor 7, the dual-pipe forward side circuit 8, the forward transformer 9 and the secondary side rectifying and filtering circuit 10 sequentially connected on the substrate may be arranged in a shape of a few words, and further, devices between the input terminal 5 and the output terminal 6 are sequentially connected and, for example, are annularly disposed in a clockwise or counterclockwise direction, so that the electronic components on the substrate 2 are disposed more reasonably, but the space on the substrate cannot be utilized, and the circuit failure caused by cross connection or the circuit failure can be avoided.
Further, an external air flow supply device is arranged outside the electronic equipment, generated external air flow can enter the shell 1 through the air inlet 101 of the electronic equipment, flows through the heat dissipation channel and finally is discharged through the air outlet 102, and the external air flow can take away heat generated by the operation of a plurality of electronic components on the substrate 2 in the circulation process, so that the electronic equipment can dissipate heat efficiently without a fan, and the structure is improved.
According to the electronic device, the air inlet 101 and the air outlet 102 are respectively formed in the bottom and the top of the shell 1 of the electronic device, at least one heat dissipation channel is formed in the electronic device, and a plurality of electronic component devices are arranged on the heat dissipation channels, so that external air flows into the electronic device through the air inlet 101, heat generated by the electronic component devices is discharged from the air outlet 102 through the heat dissipation channels, the contact area between the electronic component devices and the external air flows is increased through the arrangement of the heat dissipation channels, the heat of the electronic component devices is effectively reduced, the heat dissipation efficiency is improved, the air inlet 101 and the air outlet 102 enable the electronic device to achieve the high-efficiency heat dissipation requirement under the condition of no fan, and the long-term running reliability of the system is improved. The electric cabinet 15 can timely cool down and dissipate heat through the electronic equipment, and the service life is prolonged.
As mentioned above, at least one heat dissipation channel is formed on the substrate 2, and in order to form the heat dissipation channel, in some embodiments, as shown in fig. 2, a plurality of heat dissipation plates 4 are provided on the substrate 2, and the heat dissipation plates 4 are arranged along the direction from the air inlet 101 to the air outlet 102, so that at least one heat dissipation channel along the air inlet 101 to the air outlet 102 can be formed between the heat dissipation plates 4 and the housing 1 and between the plurality of heat dissipation plates 4, a plurality of electronic components can be arranged on the heat dissipation channel formed between the heat dissipation plates 4 and the housing 1, and the electronic components are arranged on the heat dissipation channel, so that the air flow entering from the air inlet 101 flows along the heat dissipation channel and dissipates the heat of the electronic components on the heat dissipation channel.
In addition, can also arrange electronic components on heating panel 4, like this when not blocking the flow of outside air current in casing 1, through the direct contact of heating panel 4 and electronic components, with the heat direct conduction of electronic components to heating panel 4 on, turn into large tracts of land low temperature with the small tracts of land high temperature of electronic components, increase the efficiency that the heat was taken away to outside air current, further strengthen the radiating effect, in addition, can also promote the utilization ratio of casing 1 inner space.
In some embodiments, in order to enhance the heat dissipation effect, the heat dissipation plate 4 may be made of copper or graphite, so as to efficiently conduct heat, in the structure, the heat dissipation plate 4 may be made of heat dissipation scales, and the heat dissipation scales are formed by multiple layers of plates arranged at intervals, so that external air flow can smoothly circulate in gaps between the plates, and the heat dissipation efficiency is increased while space is saved.
In some embodiments, a heat conducting layer (not shown in the figure) abutting against the inner wall of the housing 1 is disposed on the heat dissipation plate 4, so that heat of the heat dissipation plate 4 is transferred to the housing 1 in a direct contact manner, and heat dissipation area and heat dissipation efficiency of the electronic device can be increased by the housing 1.
Further, the material of heat conduction layer should be able to conduct heat with high efficiency, such as heat conduction silicone grease, graphene, copper, etc., or the heat conduction layer adopts G800 heat conduction pad, and G800 heat conduction pad can laminate the heat exchange surface, guarantees the heat conduction effect. The material of the heat conducting layer is not particularly limited, and the heat conducting effect can be ensured.
Further, as shown in fig. 3 and 5, an input terminal 5 and an output terminal 6 are disposed at a first end of the substrate 2, the input terminal 5 may be disposed near the air inlet 101, the output terminal 6 is disposed near the air outlet 102, other electronic components, such as a bus capacitor 7, a double-tube forward primary side circuit 8, a forward transformer 9 and a secondary side rectifying and filtering circuit 10, a boost circuit 11 is disposed between the input terminal 5 and the bus capacitor 7 and is connected in a zigzag manner on the substrate 2, and when the input voltage value of the dc-dc converter is reduced to a predetermined voltage value, the boost circuit 11 is used for providing an output voltage higher than the input voltage value of the dc-dc converter to supply power to the bus capacitor 7 so as to maintain the voltage value of the bus capacitor 7 higher than the minimum operating voltage of the double-tube forward side circuit 8, the forward transformer 9 and the secondary side rectifying and filtering circuit 10 at the subsequent stage.
In some embodiments, the heat dissipation plate 4 includes a first heat dissipation plate 401 and a second heat dissipation plate 402, where the first heat dissipation plate 401 and the second heat dissipation plate 402 are disposed opposite to each other and form a heat dissipation channel therebetween, the busbar capacitance 7 and the forward transformer 9 are disposed in the heat dissipation channel, and the busbar capacitance 7 and the forward transformer 9 are sequentially vertically arranged along a direction from the air inlet 101 to the air outlet 102, the first heat dissipation plate 401 is vertically arranged along a direction from the air inlet 101 to the air outlet 102, so that an external airflow flows through the first heat dissipation plate 401 to take away heat, and the first heat dissipation plate includes at least one heat dissipation fin.
In some embodiments, the base plate 2 further includes a vertical plate 14 disposed at a second end portion of the base plate 2 opposite to the first end portion, as shown in fig. 3, where the vertical plate 14 is connected to the base plate 2 vertically, and is vertically disposed along a direction from the air inlet 101 to the air outlet 102, so as to avoid blocking the circulation of the external air flow, and a flyback circuit 17 (as shown in fig. 5) is disposed on the vertical plate 14. Thus, between the side surface of the shell 1 and the vertical plate 14, between the vertical plate 14 and the first heat dissipation plate 401, between the first heat dissipation plate 401 and the second heat dissipation plate 402, a plurality of heat dissipation channels can be formed between the second heat dissipation plate 402 and the shell 1, and the vertical plate 14 is arranged perpendicular to the substrate 2, so that not only can the space occupied by the vertical plate 14 be saved, but also the length and the size of equipment can be reduced, the first heat dissipation plate 401 is arranged close to the vertical plate 14 relative to the second heat dissipation plate 402, so that the wiring distance on the substrate 2 is reduced, and the anti-interference performance of components on the first heat dissipation plate is increased.
Corresponding to the dc-dc conversion circuit according to the present embodiment, a plurality of electronic components can be arranged on different heat dissipation plates 4, so that the heat dissipation effect in the case 1 can be further improved.
In some embodiments, as shown in fig. 3, 4 and 5, the boost circuit 11 includes, for example, a third diode (D3), a first inductor (L1), a third power electronic switch (T3) and a first capacitor (C1), the third diode (D3) and the third power electronic switch (T3) can be disposed on a side surface of the first heat dissipation plate 401, and the third power electronic switch (T3) is attached to the first heat dissipation plate 401 to improve heat dissipation efficiency of the third power electronic switch (T3).
In some embodiments, continuing with fig. 3-5, the dual-tube forward side circuit 8 includes a fourth diode (D4), a fifth diode (D5), a first power electronic switch (T1), and a second power electronic switch (T2), wherein the fourth diode and the fifth diode are disposed on one side of the first heat sink 401 and the first power electronic switch and the second power electronic switch are disposed on the other side of the first heat sink 401.
In some embodiments, and referring again to fig. 3-5, the secondary side rectifying and filtering circuit 10 includes a sixth diode (D6), a seventh diode (D7), an eighth diode (D8), a ninth diode (D9), a second inductor (L2), a third inductor (L3), a third capacitor (C3), and a fourth capacitor (C4), wherein the sixth diode (D6) and the seventh diode (D7) are disposed on one side of the third heat sink plate 403, and the eighth diode (D8) and the ninth diode (D9) are disposed on the other side of the third heat sink plate 403.
In some embodiments, the DC-DC conversion circuit on the substrate 2 further comprises an input EMI filter circuit 12 and an output EMI filter circuit 13, wherein the input EMI filter circuit 12 is arranged between the input terminal 5 and the bus capacitor 7 and is connected with the boost circuit 11, the output EMI filter circuit 13 is arranged between the secondary rectifying filter circuit 10 and the output terminal 6, the input EMI filter circuit 12 and the output EMI filter circuit 13 are respectively arranged at two corners of the first end part, namely, the input EMI filter circuit 12 is arranged near the input terminal 5, and the output EMI filter circuit 13 is arranged near the output terminal 6.
In some embodiments, as shown in fig. 1, a heat dissipation rib 3 is arranged on a side plate of the shell 1, the contact area between external air flow and the shell 1 is increased through the heat dissipation rib 3, and the heat dissipation of the shell 1 is accelerated.
In some embodiments, as shown in fig. 2, the housing 1 further includes a mounting plate 16 vertically provided on the substrate 2, the electronic device is vertically mounted by the mounting plate 16, the input terminal 5 and the output terminal 6 are provided near the mounting plate 16, and a fixing cable connecting the electronic components may be fixed to the mounting plate 16 to increase connection reliability between the electronic components.
The embodiment of the disclosure further provides an electrical cabinet 15, as shown in fig. 6, the electrical cabinet 15 includes a cabinet body 151 and an air supply assembly 152 for supplying air to the cabinet body 151, the air supply assembly 152 may employ a compressor to enable the top of the electrical cabinet 15 to form negative pressure, that is, the air flow from bottom to top generated by a cooling fan carried by the compressor, and the electrical cabinet 15 further includes the above-mentioned electronic device, as shown in fig. 6, the air flow generated by the air supply assembly 152 flows through the air inlet 101, the heat dissipation channel and the air outlet 102 in sequence, so that the heat dissipation efficiency of the electronic device 153 can be effectively improved by the external air flow generated by the air supply assembly 152, without dissipating heat by a fan or other air supply components.
Furthermore, although exemplary embodiments have been described herein, the scope thereof includes any and all embodiments having equivalent elements, modifications, omissions, combinations (e.g., of the various embodiments across schemes), adaptations or alterations based on the present disclosure. The elements in the claims are to be construed broadly based on the language employed in the claims and are not limited to examples described in the present specification or during the practice of the application, which examples are to be construed as non-exclusive. It is intended, therefore, that the specification and examples be considered as exemplary only, with a true scope and spirit being indicated by the following claims and their full scope of equivalents.
The above description is intended to be illustrative and not restrictive. For example, the above-described examples (or one or more aspects thereof) may be used in combination with each other. For example, other embodiments may be used by those of ordinary skill in the art upon reading the above description. In addition, in the above detailed description, various features may be grouped together to streamline the disclosure. This is not to be interpreted as an intention that the disclosed features not being claimed are essential to any claim. Rather, the disclosed subject matter may include less than all of the features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description as examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that these embodiments may be combined with one another in various combinations or permutations. The scope of the disclosure should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
The above embodiments are merely exemplary embodiments of the present disclosure, which are not intended to limit the present disclosure, the scope of which is defined by the claims. Various modifications and equivalent arrangements of parts may be made by those skilled in the art, which modifications and equivalents are intended to be within the spirit and scope of the present disclosure.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910555299.XA CN110120639B (en) | 2019-06-25 | 2019-06-25 | Electronic equipment and electrical cabinet containing the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910555299.XA CN110120639B (en) | 2019-06-25 | 2019-06-25 | Electronic equipment and electrical cabinet containing the same |
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| CN110120639A CN110120639A (en) | 2019-08-13 |
| CN110120639B true CN110120639B (en) | 2025-02-28 |
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| CN201910555299.XA Active CN110120639B (en) | 2019-06-25 | 2019-06-25 | Electronic equipment and electrical cabinet containing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118765080B (en) * | 2024-06-17 | 2025-03-21 | 上海摩瓦新能源科技有限公司 | Electronic devices |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107070256A (en) * | 2017-02-17 | 2017-08-18 | 许继电气股份有限公司 | A kind of power model and the photovoltaic combining inverter using the module |
| CN209805206U (en) * | 2019-06-25 | 2019-12-17 | 阿特拉斯·科普柯(无锡)压缩机有限公司 | Electronic equipment and electrical cabinet comprising same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000190163A (en) * | 1998-12-22 | 2000-07-11 | Mitsubishi Electric Corp | Control board |
| CN205029193U (en) * | 2015-08-25 | 2016-02-10 | 深圳市伊力科电源有限公司 | Non intermittented power source machine cabinet |
| CN105939594B (en) * | 2016-06-30 | 2018-12-14 | 海信集团有限公司 | The radiator and electronic equipment of electronic equipment |
| CN207233842U (en) * | 2017-10-19 | 2018-04-13 | 佛山市安第斯电子有限公司 | A kind of ups power |
| CN109390956B (en) * | 2018-12-25 | 2025-01-28 | 北京思源清能电气电子有限公司 | An SVG unit structure |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107070256A (en) * | 2017-02-17 | 2017-08-18 | 许继电气股份有限公司 | A kind of power model and the photovoltaic combining inverter using the module |
| CN209805206U (en) * | 2019-06-25 | 2019-12-17 | 阿特拉斯·科普柯(无锡)压缩机有限公司 | Electronic equipment and electrical cabinet comprising same |
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