CN110112321B - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN110112321B CN110112321B CN201910470447.8A CN201910470447A CN110112321B CN 110112321 B CN110112321 B CN 110112321B CN 201910470447 A CN201910470447 A CN 201910470447A CN 110112321 B CN110112321 B CN 110112321B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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Abstract
The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, relates to the technical field of display, and aims to simplify the manufacturing process of the display panel comprising an opening area and improve the packaging reliability of the manufactured display panel near the opening area. The display panel includes: the display device comprises an opening region, a first packaging region and a display region; the first packaging area is positioned between the opening area and the display area, the first packaging area surrounds the opening area, and the display area surrounds the first packaging area; the display area comprises a vapor deposition film layer formed on the substrate; the first packaging area comprises a packaging layer formed on the substrate, the packaging layer and the vapor deposition layer are positioned on the same side of the substrate, the packaging layer and the vapor deposition layer are not overlapped, and the packaging layer surrounds the open hole area; the open area does not include the vapor deposition coating layer and the packaging layer.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method of the display panel and a display device.
[ background of the invention ]
With the increasing demand of users for diversified uses of display devices and the emergence of design requirements for high screen occupation of display devices, a display panel including an open region H as shown in fig. 1 is now emerging. And, the opening area H is surrounded by the display area AA to embed a device such as a camera therein, reducing the size of the bezel area of the display device.
How to manufacture the display panel including the opening region H and ensure the package reliability near the opening region H is an urgent problem to be solved at present.
[ summary of the invention ]
Embodiments of the present invention provide a display panel, a method for manufacturing the same, and a display device, so as to simplify a manufacturing process of the display panel including an opening region and improve a packaging reliability of the manufactured display panel near the opening region.
An embodiment of the present invention provides a display panel, including: the display device comprises an opening region, a first packaging region and a display region; the first packaging area is positioned between the opening area and the display area, the first packaging area surrounds the opening area, and the display area surrounds the first packaging area;
the display area comprises a vapor deposition film layer formed on the substrate;
the first packaging area comprises a packaging layer formed on the substrate, the packaging layer and the vapor deposition layer are positioned on the same side of the substrate, the packaging layer and the vapor deposition layer are not overlapped, and the packaging layer surrounds the open hole area;
the open area does not include the vapor deposition coating layer and the packaging layer.
The embodiment of the invention also provides a manufacturing method of the display panel, which comprises the following steps:
providing a substrate to be evaporated; the substrate to be evaporated comprises a first area and a second area surrounding the first area;
evaporating a second area of the substrate to be evaporated through an anti-deposition component and an evaporation source to form an evaporation coating layer in the second area of the substrate to be evaporated, wherein the evaporation coating layer is not formed in the first area so as to form an open hole area in the first area;
the first area covers the orthographic projection of the deposition prevention component on the plane of the substrate to be evaporated.
Optionally, the anti-deposition component comprises a heating assembly; the heating assembly is positioned on one side of the substrate to be evaporated, which is far away from the evaporation source;
through prevent that deposition part and evaporation source carry out the coating by vaporization in the second region of treating the coating by vaporization base plate, make the second region of treating the coating by vaporization base plate forms the coating by vaporization layer, first region does not form the coating by vaporization layer, includes:
heating a first area of the substrate to be evaporated by the heating assembly to enable the temperature T1 of the first area and the temperature T2 of the second area to satisfy the following conditions: T1-T2 is more than or equal to 50 ℃;
and forming a vapor-deposited film layer in the second area of the substrate to be vapor-deposited through the evaporation source and the heating assembly, wherein the vapor-deposited film layer is not formed in the first area.
Optionally, the heating assembly is used for heating the first area of the substrate to be evaporated, so that the temperature T1 of the first area is equal to or greater than 100 ℃ and equal to or less than T1 and equal to or less than 180 ℃.
Optionally, an area of an orthographic projection of the heating assembly on the plane where the substrate to be evaporated is located is smaller than an area of the first region.
Optionally, the deposition prevention component includes a blocking portion, and the blocking portion is located on one side of the substrate to be evaporated, which is close to the evaporation source; the shape and the size of the orthographic projection of the barrier part on the plane of the substrate to be evaporated are the same as those of the first area;
through prevent that deposition part and evaporation source carry out the coating by vaporization in the second region of treating the coating by vaporization base plate, make the second region of treating the coating by vaporization base plate forms the coating by vaporization layer, first region does not form the coating by vaporization layer, includes:
forming a vapor-deposited film layer on the second area of the substrate to be vapor-deposited through the evaporation source, and forming a vapor-deposited film layer on the surface of the barrier part close to one side of the evaporation source;
and removing the blocking part for forming the vapor deposition film layer from one side of the substrate to be vapor deposited close to the evaporation source, so that the vapor deposition film layer is formed in the second area of the substrate to be vapor deposited, and the vapor deposition film layer is not formed in the first area.
Optionally, the barrier comprises a non-stick film layer;
and forming the non-stick film layer on one side of the substrate to be evaporated, which is close to the evaporation source, in any one or more modes of jet printing, silk screen printing, spin coating or etching.
Optionally, the barrier comprises a ceramic crystal or a long chain fatty acid ester.
Optionally, the blocking portion includes a magnetic material, the blocking portion is fixed to a side of the substrate to be evaporated close to the evaporation source through a magnet, and the magnet is located on a side of the substrate to be evaporated away from the evaporation source; the shape and the size of the orthographic projection of the barrier part on the plane of the substrate to be evaporated are the same as those of the first area;
forming a vapor deposition film layer in the second area of the substrate to be vapor deposited through the evaporation source, and forming the vapor deposition film layer on the surface of the barrier part close to the evaporation source, wherein the vapor deposition film layer further comprises the following steps:
the blocking part is arranged on one side, close to the evaporation source, of the substrate to be evaporated through a charge coupled device alignment system, the magnet is arranged on one side, far away from the evaporation source, of the substrate to be evaporated, and the orthographic projection of the blocking part on the plane of the substrate to be evaporated is aligned with the first area.
Optionally, the magnet comprises a flexible magnet.
Optionally, the substrate to be evaporated includes a driving circuit layer, the driving circuit layer is only located in the second region, and the driving circuit layer and the deposition prevention component do not overlap in the orthographic projection of the substrate to be evaporated.
The embodiment of the invention also provides a display device which comprises the display panel and the light sensing module positioned in the opening area.
According to the display panel, the manufacturing method thereof and the display device provided by the embodiment of the invention, the opening area surrounded by the display area is arranged in the display panel, and the evaporation coating layer and the packaging layer are not formed in the opening area, so that the light transmittance at the opening area is ensured, a light sensing module such as a camera, a light sensor, an iris recognition sensor and the like is conveniently arranged in the opening area in the follow-up process, the screen occupation ratio of the display panel is improved on the basis of enriching the use functions of the manufactured display panel, and the comprehensive screen design is favorably realized.
In addition, according to the display panel provided by the embodiment of the invention, the first packaging area is arranged between the display area and the opening area, and only the packaging layer is formed in the first packaging area, so that the packaging layer is not overlapped with the evaporation coating layer, and the packaging layer can be prevented from being formed on the evaporation coating layer. Because the packaging layer contains organic or inorganic materials, the bonding force between the packaging layer and the vapor deposition film layer is poor, and the bonding force between the packaging layer and the substrate to be vapor deposited is strong, the packaging layer can be prevented from being stripped, the surface of the vapor deposition film layer close to the open hole area can be surrounded by the packaging layer, and the packaging reliability near the open hole area is ensured.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic top view of a display panel including an opening region according to the prior art;
FIG. 2 is a schematic cross-sectional view along BB' of FIG. 1;
fig. 3 is a schematic top view of a display panel according to an embodiment of the invention;
FIG. 4 is a schematic cross-sectional view taken along line CC' of FIG. 3;
FIG. 5 is another schematic cross-sectional view taken along line CC' of FIG. 3;
fig. 6 is a schematic flowchart illustrating a manufacturing method of a display panel according to an embodiment of the present invention;
FIG. 7 is a schematic top view of a substrate to be vapor deposited according to an embodiment of the present invention;
FIG. 8 is a schematic diagram showing a positional relationship among a substrate to be vapor-deposited, an evaporation source, and an anti-deposition member according to an embodiment of the present invention;
FIG. 9 is a side view corresponding to FIG. 8;
FIG. 10 is a schematic diagram illustrating a positional relationship among a heating element, an evaporation source, and a substrate to be evaporated according to an embodiment of the present invention;
FIG. 11 is a flowchart illustrating a method for fabricating a display panel using a heating element according to an embodiment of the present invention;
fig. 12 is a schematic flowchart illustrating a method for manufacturing a display panel according to another embodiment of the present invention;
FIG. 13 is a schematic flow chart corresponding to FIG. 12;
FIG. 14 is a schematic diagram showing a positional relationship among a magnet, a barrier, a substrate to be vapor-deposited, and an evaporation source according to an embodiment of the present invention;
FIG. 15 is a schematic diagram of a luminescent layer deposition process according to an embodiment of the present invention;
FIG. 16 is a schematic diagram of a mask for manufacturing a display panel including an opening region according to the prior art;
fig. 17 is a schematic diagram of a display device according to an embodiment of the present invention.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that although the terms first, second, etc. may be used herein to describe various regions in embodiments of the invention, these regions should not be limited by these terms. These terms are only used to distinguish one region from another. For example, a first region may also be referred to as a second region, and similarly, a second region may also be referred to as a first region, without departing from the scope of embodiments of the present invention.
As shown in fig. 1 and fig. 2, fig. 2 is a schematic cross-sectional view taken along BB ' of fig. 1, and during the research process, the inventor found that, at present, when preparing a display panel including an opening region H ', taking the example of forming a through hole in the opening region H ', firstly, a hole digging operation is performed on the substrate base 1 ', and a through hole penetrating through the substrate base 1 ' is formed in the substrate base 1 ', and the area of the through hole is equal to the area of the required opening region H '. In order to prevent water, oxygen, etc. in the external environment from entering the display panel from the opening region H ', an encapsulation layer F' is formed around the opening region H 'at the periphery of the opening region H'. However, as shown in fig. 1 and 2, when a plurality of film layers 4 ' including a light emitting layer and the like are formed by an evaporation process, since it is impossible to form an island-shaped non-evaporation region 2 ' in the film layer 4 ' in the prior art, when an encapsulation layer F ' is formed at the edge of the non-evaporation region 2 ' to encapsulate a display panel, as shown in fig. 2, the encapsulation layer F ' is formed on the film layer 4 ' obtained by the evaporation, since the encapsulation layer contains an organic or inorganic material, the bonding between the encapsulation layer F ' and the evaporation film layer is weak, on the one hand, the bonding force between the encapsulation layer F ' and the film layer 4 ' is poor, and peeling is easily generated, on the other hand, the surface of the film layer 4 ' close to the open region H ' cannot be surrounded by the encapsulation layer F ', and water and oxygen and the like in the external environment can enter the display panel from this, which greatly affects the encapsulation reliability of the display panel, affecting the lifetime of the display panel.
Based on this, an embodiment of the present invention provides a display panel, as shown in fig. 3 and fig. 4, fig. 3 is a schematic top view of the display panel provided in the embodiment of the present invention, and fig. 4 is a schematic cross-sectional view taken along CC' of fig. 3, wherein the display panel includes an opening region H, a first encapsulation region 111, and a display region AA; the first encapsulation area 111 is located between the opening area H and the display area AA, and the first encapsulation area 111 surrounds the opening area H and the display area AA surrounds the first encapsulation area 111. The display area AA includes a vapor deposited film layer 4 formed on the base substrate 100; the vapor deposited film layer 4 may include one or more of a light emitting layer, a hole transport layer, a hole injection layer, an electron transport layer, an electron injection layer, and a cathode layer.
The first encapsulation region 111 includes an encapsulation layer F formed on the base substrate 100, the encapsulation layer F and the vapor-deposited film layer 4 being located on the same side of the base substrate 100, the encapsulation layer F not overlapping with the vapor-deposited film layer 4, the encapsulation layer F surrounding the open hole region H. The open region H does not include the vapor deposited film layer 4 and the encapsulation layer F.
According to the display panel provided by the embodiment of the invention, the opening region H surrounded by the display region AA is arranged in the display panel, and the opening region H does not comprise the vapor deposition film layer 4 and the packaging layer F, so that the light transmittance of the opening region H is ensured, a light sensing module such as a camera, a light sensor, an iris recognition sensor and the like is conveniently arranged in the opening region H subsequently, the screen occupation ratio of the display panel is improved on the basis of enriching the use functions of the manufactured display panel, and the full screen design is favorably realized.
In addition, according to the display panel provided by the embodiment of the invention, the first encapsulation area 111 is arranged between the display area AA and the opening area H, and only the encapsulation layer F is formed in the first encapsulation area 111, so that the encapsulation layer F is not overlapped with the vapor deposition film layer 4, and the encapsulation layer F can be prevented from being formed on the vapor deposition film layer 4, and the encapsulation layer F is directly contacted with the vapor deposition material 4. Because the bonding force between the packaging layer F and the vapor deposition film layer 4 is poor, and the bonding force between the packaging layer F and the substrate to be vapor deposited 1 is strong, the packaging layer F can be prevented from being peeled off, the surface of the vapor deposition film layer 4 close to the perforated area H can be surrounded by the packaging layer F, and the packaging reliability near the perforated area H is ensured.
For example, in the embodiment of the present invention, the specific structure of the open region H is not limited, for example, the open region H may be a through hole structure as shown in fig. 4, or, as shown in fig. 5, fig. 5 is another schematic cross-sectional view along CC' of fig. 3, where the open region H may also be a blind hole structure, at this time, the substrate 100 may not be cut, the substrate 100 is a complete whole structure, and the vapor deposition layer 4 is not formed only at the open region H, so as to ensure the light transmittance at the open region H.
As shown in fig. 3, the display panel further includes a second encapsulation region 112 located at the periphery of the display region AA, and an encapsulation layer F is also formed in the second encapsulation region 112.
The above-mentioned Encapsulation layer F may be formed by an Encapsulation adhesive (frit), or a Thin Film Encapsulation layer (TFE for short) formed by stacking an inorganic layer and an organic layer, it should be noted that a barrier wall (bank) is generally disposed in a Thin Film Encapsulation process, and the barrier wall is used to block an organic layer in the Thin Film Encapsulation layer so as to stop the organic layer in advance, when the barrier wall (bank) is disposed herein, the Encapsulation layer F may refer to the barrier wall (bank), and the barrier wall (bank) is formed by any one or more of a Planarization Layer (PLN), a pixel definition layer (PLN), and a support pillar (Photo Spacer), and they all belong to organic Film layers, that is, when the barrier wall (bank) is disposed, the lower surface of the barrier wall (bank) does not contact with an evaporation material. Illustratively, as shown in fig. 4 and 5, the encapsulation layer F is made of an encapsulation adhesive (frit).
Referring to fig. 3, fig. 4, fig. 6, fig. 7, fig. 8, and fig. 9, fig. 6 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention, fig. 7 is a schematic top view of a substrate to be evaporated according to an embodiment of the present invention, fig. 8 is a schematic position relationship diagram of the substrate to be evaporated, an evaporation source, and an anti-deposition member according to an embodiment of the present invention, and fig. 9 is a corresponding side view of fig. 8, where the method includes:
step S1: providing a substrate 1 to be evaporated as shown in fig. 7; the substrate to be evaporated 1 includes a first region 11 and a second region 12 surrounding the first region 11. The area of the first region 11 is larger than the area of the opening region H to be formed.
Step S2: the second region 12 of the substrate 1 to be vapor-deposited is vapor-deposited by the deposition preventing member 2 and the evaporation source 3, so that the vapor-deposited film layer 4 is formed in the second region 12 of the substrate 1 to be vapor-deposited, and the display region AA of the display panel shown in fig. 1 is formed in the second region 12. The vapor deposition layer 4 is not formed in the first region 11, so that an opening region H of the display panel is formed in the first region 11. The first region 11 covers the orthographic projection of the deposition-preventing component 2 on the plane of the substrate 1 to be evaporated. That is, the area of the first region 11 is equal to or larger than the area of the orthographic projection of the deposition-preventing member 2 on the plane of the substrate 1 to be vapor-deposited.
Step S3: an encapsulation layer F is formed at the edge of the first region 11, the encapsulation layer F and the vapor deposition film layer 4 are located on the same side of the substrate 1 to be vapor deposited, the encapsulation layer F and the vapor deposition film layer 4 are not overlapped, and the encapsulation layer F surrounds the opening region H.
For example, when the manufacturing method provided by the embodiment of the present invention is used to manufacture a display panel, after the substrate 1 to be vapor-deposited is provided, first, as shown in fig. 8 and 9, the deposition preventing member 2 may be correspondingly disposed at the first region 11 of the substrate 1 to be vapor-deposited. Then, the evaporation source 3 is turned on, and the evaporation material volatilized from the evaporation source 3 moves to the substrate 1 to be evaporated and then undergoes cold deposition. In the second area 12 of the substrate 1 to be evaporated, where the deposition-preventing component 2 is not disposed, the evaporation material may be deposited normally, so as to form the evaporation film layer 4 at the second area 12, and the evaporation film layer 4 may subsequently participate in the display process of the display panel, that is, the second area 12 forms the display area AA of the display panel shown in fig. 1. In the first region 11 where the deposition-preventing member 2 is provided in the substrate 1 to be vapor-deposited, the deposition of the vapor deposition material can be prevented by the provision of the deposition-preventing member 2, so that in the first region 11, the above vapor deposition film layer 4 may not be formed, so as to facilitate the subsequent formation of the encapsulation layer F at the edge of the first region 11, and the formation of the opening region H surrounded by the encapsulation layer F as shown in fig. 3 in the first region 11.
As can be seen from the above manufacturing process of the display panel, in the manufacturing method of the display panel provided in the embodiment of the present invention, the deposition prevention member 2 is selected, and the first region 11 covers the orthographic projection of the deposition prevention member 2 on the plane where the substrate 1 to be evaporated is located, so that the deposition of the evaporation material evaporated from the evaporation source 3 in the first region 11 can be avoided, that is, the evaporation coating layer 4 can be formed in the second region 12 by adopting the method, and the evaporation coating layer 4 is prevented from being formed in the first region 11 surrounded by the second region 12, so that a light sensing module such as a camera, a light sensor, an iris recognition sensor, and the like can be subsequently arranged in the first region 11.
Moreover, by adopting the method provided by the embodiment of the invention, the deposition prevention part 2 is used for avoiding the formation of the evaporation coating layer 4 in the first area 11, so that when the display panel is packaged, the packaging layer F can be formed on the substrate 1 to be evaporated because the evaporation coating layer 4 is not arranged at the edge of the first area 11, and the packaging layer F is prevented from being formed on the evaporation coating layer 4. Because the bonding force between the packaging layer F and the vapor deposition film layer 4 is poor, and the bonding force between the packaging layer F and the substrate to be vapor deposited 1 is strong, the packaging layer F can be prevented from being peeled off, the surface of the vapor deposition film layer 4 close to the open hole region H can be surrounded by the packaging layer F, water and oxygen in the external environment can be prevented from entering from the open hole region H, and the packaging reliability near the open hole region H is ensured.
In the manufacturing process of the display panel, as shown in fig. 7, each film layer required for display is usually first deposited on a large substrate 1 to be deposited, and then cut into the display panel with a smaller size as shown in fig. 3.
For example, when the opening region H is a through hole structure as shown in fig. 4, a substrate to be evaporated (i.e., the substrate 100 in fig. 4) may be cut to form a through hole in the first region 11 of the substrate to be evaporated, where the shape and area of the through hole are the same as those of the opening region to be formed, that is, the area of the through hole is smaller than that of the first region 11, and then the cut substrate to be evaporated is evaporated by using the deposition-preventing member 2, where the area of the deposition-preventing member 2 is larger than that of the through hole, and during the evaporation, the deposition-preventing member 2 covers the through hole on the substrate to be evaporated. When the opening region H is a blind hole structure as shown in fig. 5, the substrate to be vapor-deposited need not be cut.
Illustratively, in the embodiment of the present invention, the deposition prevention part 2 may be formed by a heating assembly. As described above, the vapor-deposited film layer 4 is formed in the following general principle: the evaporation material is sublimated into gas in the evaporation source 3, and after the evaporation material is volatilized to the substrate 1 to be evaporated, the evaporation material is deposited in the cooling state, so that the evaporation film layer 4 is formed on the substrate 1 to be evaporated. Therefore, the heating assembly is arranged at the position corresponding to the first area 11 of the substrate 1 to be evaporated, so that the temperature of the first area 11 can be increased, the evaporation material can be prevented from being subjected to cold deposition at the first area 11, and the evaporation coating layer 4 can be prevented from being formed at the first area 11. In the second region 12 where the heating element 21 is not provided, the evaporation material can be deposited normally in contact with cold, and the evaporation film layer 4 is formed in the second region 12.
Exemplarily, as shown in fig. 10 and fig. 11, fig. 10 is a schematic diagram of a positional relationship among a heating element, an evaporation source and a substrate to be evaporated according to an embodiment of the present invention, fig. 11 is a schematic flowchart of a method for manufacturing a display panel by using a heating element according to an embodiment of the present invention, and when the heating element 21 is selected as an anti-deposition component, the heating element 21 is disposed on a side of the substrate 1 to be evaporated away from the evaporation source 3.
As shown in fig. 11, the step S2 is a step of depositing the vapor deposition layer 4 on the second region 12 of the substrate 1 to be vapor deposited by the deposition preventing member 2 and the evaporation source 3 in the second region 12 of the substrate 1 to be vapor deposited, and the vapor deposition layer 4 is not formed on the first region 11, and includes:
step S21: the heating assembly 21 heats the first region 11 of the substrate 1 to be evaporated, so that the temperature difference between the temperature T1 of the first region 11 and the temperature T2 of the second region 12 satisfies: T1-T2 is more than or equal to 50 ℃;
step S22: the evaporation coating layer 4 is formed in the second area 12 of the substrate 1 to be evaporated by the evaporation source 3 and the heating unit 21, and the evaporation coating layer 4 is not formed in the first area 11.
For example, the process of forming the vapor deposition layer 4 by vapor deposition may be performed in a vapor deposition chamber (not shown) having a certain temperature. The temperature T1 of the first zone 11 can be controlled to ensure that the temperature T1 of the first zone 11 is equal to or more than 100 ℃ and equal to or less than T1 and equal to or less than 180 ℃ so that the temperature difference between the first zone 11 and the second zone 12 is equal to or more than T1-T2 and equal to or more than 50 ℃.
Illustratively, as shown in fig. 10, an orthographic projection area of the heating element 21 on the plane of the substrate 1 to be evaporated is smaller than an area of the first region 11. Treat the coating by vaporization base plate 1 at heating element 21 like this and heat the back, through heating element 21's heat radiation, can avoid making the area that treats the higher region of temperature in coating by vaporization base plate 1 be greater than the area of first region 11, and then avoid appearing in the display panel originally should have the regional condition by the coating by vaporization of coating by vaporization layer 4 of design. Specifically, the size of the heating assembly 21 may be set according to the heat radiation range of different heat sources, which is not limited in the embodiment of the present invention.
In addition to the above-mentioned manner of selecting the heating assembly 21 to form the deposition-preventing member 2, alternatively, in the embodiment of the present invention, the deposition-preventing member 2 may also be configured to include the blocking portion 22, as shown in fig. 8 and 9, when the blocking portion 22 is selected as the deposition-preventing member 2, the blocking portion 22 may be disposed on the side of the substrate 1 to be evaporated close to the evaporation source 3; and the shape and size of the orthographic projection of the barrier section 22 on the plane of the substrate 1 to be evaporated are set to be the same as those of the first region 11.
When the anti-deposition member is configured to include the blocking portion 22, as shown in fig. 12 and 13, fig. 12 is a schematic flow chart of a manufacturing method of another display panel according to an embodiment of the present invention, fig. 13 is a schematic flow chart of a structure corresponding to fig. 12, and the step S2 is as follows: through prevent that deposition part 2 and evaporation source 3 treat the second region 12 of coating by vaporization base plate 1, make the second region 12 of treating coating by vaporization base plate 1 form coating by vaporization layer 4, first region 11 does not form coating by vaporization layer 4, includes:
step S21': forming a vapor deposition film layer 4 on the second area 12 of the substrate 1 to be vapor deposited by the evaporation source 3, and forming the vapor deposition film layer 4 on the surface of the barrier section 22 on the side close to the evaporation source 3;
step S22': the barrier section 22 for forming the vapor deposition layer 4 is removed from the side of the substrate 1 to be vapor deposited close to the evaporation source 3, so that the vapor deposition layer 4 is formed in the second region 12 of the substrate 1 to be vapor deposited, and the vapor deposition layer 4 is not formed in the first region 11. Illustratively, when the barrier section 22 formed with the vapor deposition film layer 4 is removed from the substrate 1 to be vapor deposited, plasma bombardment may be employed.
Illustratively, the barrier 22 includes a non-stick film layer; when the non-stick film layer is formed, the non-stick film layer can be formed on one side of the substrate 1 to be evaporated, which is close to the evaporation source 3, in any one or more modes of jet printing, silk-screen printing, spin coating or etching.
Alternatively, the barrier portion 22 may be formed by ceramic crystal or long chain fatty acid ester, so as to be easily removed from the substrate 1 to be evaporated.
For example, the blocking portion 22 may be made of a magnetic material. When the blocking portion 22 is made of a magnetic material, the blocking portion 22 can be fixed to a side of the substrate 1 to be evaporated close to the evaporation source 3 by the magnet 7, as shown in fig. 14, fig. 14 is a schematic diagram of a positional relationship among the magnet, the blocking portion, the substrate to be evaporated and the evaporation source in an embodiment of the present invention, wherein the magnet 7 is located on a side of the substrate 1 to be evaporated away from the evaporation source 3; the shape and size of the orthogonal projection of the barrier section 22 on the plane of the substrate 1 to be vapor-deposited are the same as those of the first region 11.
When the stopper 22 is provided to include the magnetic material, the above step S21': the method comprises the following steps of forming a vapor deposition film layer 4 in a second area 12 of a substrate 1 to be vapor deposited through an evaporation source 3, and forming the vapor deposition film layer 4 on the surface of a barrier section 22 close to the evaporation source 3, wherein the method comprises the following steps:
step S20': as shown in fig. 14, the stopper 22 including the magnetic material is disposed on the side of the substrate 1 to be vapor-deposited close to the evaporation source 3 by an alignment system (not shown), and the magnet 7 is disposed on the side of the substrate 1 to be vapor-deposited away from the evaporation source 3, so that the orthographic projection of the stopper 22 including the magnetic material on the plane of the substrate 1 to be vapor-deposited is aligned with the first region 11. In this state, the position of the stopper 22 is not moved by the magnetic attraction between the magnet 7 and the stopper 22. Illustratively, the alignment system may be a CCD (charge coupled device alignment system).
After the blocking section 22 is disposed on the side of the substrate 1 to be vapor-deposited close to the evaporation source 3 by the magnet 7, the evaporation source 3 is turned on for vapor deposition. This coating by vaporization process can continue to refer to fig. 13, only need overcome the magnetic force effect between magnet 7 and the barrier portion 22 through external force after the coating by vaporization, will include that barrier portion 22 of magnetic material removes the effect that can realize not having coating by vaporization layer 4 on first region 11 from treating coating by vaporization base plate 1, and simple process easily operates.
For example, after the evaporation of the evaporation film layer 4 is completed, the magnet 7 may be removed, or the magnet 7 may be left in the display panel. Optionally, the magnet 7 includes a flexible magnet to adapt to bending and folding operations of the flexible display panel.
Illustratively, the organic light emitting display panel can be manufactured by adopting the manufacturing method provided by the embodiment of the invention. The organic light emitting display panel includes an organic light emitting device for emitting light, the organic light emitting device including an anode, a light emitting layer, and a cathode, which are stacked, and a hole injection layer and a hole transport layer between the light emitting layer and the anode, and an electron injection layer and an electron transport layer between the light emitting layer and the cathode. Correspondingly, the vapor-deposited film layer 4 may be one or more of a luminescent layer, an electron transport layer, an electron injection layer, a hole transport layer, a hole injection layer and a cathode.
For example, a Fine Metal Mask (FMM) may be used when a light emitting layer is formed by evaporation, and an Open Mask (Open Mask) may be used when an electron transport layer, an electron injection layer, a hole transport layer, a hole injection layer, and a cathode layer are formed by evaporation.
As shown in fig. 15, fig. 15 is a schematic view of an embodiment of the present invention when a light emitting layer is evaporated, wherein a support plate 81 and a magnetic plate 82 are further disposed on a side of the substrate 1 to be evaporated away from the evaporation source 3, a mask plate 83 is disposed on a side of the substrate 1 to be evaporated close to the evaporation source 3, and the support plate 81 is used to support the substrate 1 to be evaporated, so as to ensure positional stability and flatness of the substrate 1 to be evaporated during an evaporation process. The mask 83 may be made of a magnetic material. The magnetic plate 82 is used for balancing the gravity of the mask 83 and the substrate 1 to be evaporated so as to reduce the influence of the gravity of the mask 83 and the substrate 1 to be evaporated on the flatness of the mask 83 below the substrate 1 to be evaporated, thereby ensuring the flatness of the film layer 4 to be evaporated. For example, in the embodiment shown in fig. 15, the mask 83 is a fine metal mask, and the vapor deposition film layer 4 includes light emitting layers of different colors.
Optionally, when performing evaporation of a film layer, as shown in fig. 15, the rotating device 10 may further be used to drive the substrate 1 to be evaporated, the supporting plate 81, the magnetic plate 82, and the mask plate 83 to rotate, so that the thickness of the formed evaporated film layer 4 at each position is uniform.
Illustratively, as shown in fig. 15, the substrate to be vapor-deposited 1 includes a driving circuit layer 5 on a side of the substrate to be vapor-deposited 1 close to the vapor-deposited film layer 4, and the driving circuit layer 5 is only located in the second region 12. Illustratively, the driving circuit layer 5 includes a thin film transistor. The driving circuit layer 5 is electrically connected with the vapor deposition film layer 4 to drive the vapor deposition film layer 4 to participate in luminescence in the display process. As shown in fig. 15, the driving circuit layer 5 does not overlap with the orthographic projection of the deposition-preventing member 2 on the substrate 1 to be vapor-deposited. The embodiment of the invention further improves the light transmittance of the open hole region H in the manufactured display panel by avoiding the formation of the driving circuit layer 5 in the first region 11.
For example, in manufacturing the display panel shown in fig. 3, before the vapor deposition layer 4 is formed on the substrate 1 to be vapor deposited, the driving circuit layer 5 is first formed in the second region 12 of the substrate 1 to be vapor deposited. Then, the substrate 1 to be vapor-deposited on which the driving circuit layer 5 is formed is turned upside down, that is, the side of the substrate 1 to be vapor-deposited on which the driving circuit layer 5 is formed is turned downward, the side of the substrate 1 to be vapor-deposited on which the driving circuit layer 5 is not formed is turned upward, the evaporation source 3 is positioned below the substrate 1 to be vapor-deposited, and then the evaporation source 3 is turned on to perform vapor deposition to form the vapor-deposited film layer 4. The manufacturing process of the driving circuit layer 5 is the same as that of the prior art, and is not described herein again.
When the blocking portion is selected to manufacture the display panel including the open region H as shown in fig. 3, as described above, no matter a method of forming a non-stick film layer by spray printing, screen printing, spin coating or etching is adopted, or a method of forming a non-stick film layer by magnet adsorption is adopted, the blocking portion can be fixed on one side of the substrate 1 to be evaporated close to the evaporation source 3, after evaporation is completed, the blocking portion is removed, so that the evaporation material deposited on the blocking portion can be removed from the substrate to be evaporated, and an effect of forming the open region H surrounded by the display region AA in the display panel is achieved. In the prior art, since the opening region is surrounded by the display region of the display panel, a normal mask process cannot be adopted (a shielding part corresponding to the opening region H cannot be suspended in the mask). Therefore, in order to manufacture a display panel including the opening region H in the prior art, as shown in fig. 16, fig. 16 is a schematic diagram of a mask plate for manufacturing a display panel including the opening region in the prior art, after the shielding part 91 corresponding to the opening region is disposed in the mask plate, a connection part 92 for connecting the shielding part 91 and a frame of the mask plate needs to be disposed, so that not only the vapor deposition layer cannot be formed at a position corresponding to the connection part 92 in the display panel, but also the display effect of the display panel is affected, and when the mask plate with such a structure is used for vapor deposition, uneven stress is caused when one side of the mask plate provided with the connection part 92 and other positions in the mask plate are in mesh-open state, which easily causes wrinkles and deformation of the mask plate, and affects the vapor deposition effect. By adopting the method provided by the embodiment of the invention, the connecting part 92 shown in fig. 16 does not need to be formed, and the process is simple and easy to operate.
It should be understood that the shape of the opening region H of the display panel in fig. 3 is only an illustration, and in the embodiment of the present invention, through the corresponding design of the shape of the deposition prevention part 2, display panels including opening regions H of various shapes can be manufactured, which greatly reduces the difficulty of the process of manufacturing the display panel including the opening region H.
Fig. 17 is a schematic view of a display device according to an embodiment of the present invention, wherein the display device includes the display panel 200 and the light sensing module 300 located in the opening region H of the display panel 200. For example, the display device may be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic book, or a television, and the embodiment of the present invention is not limited thereto.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (6)
1. A display panel, comprising: the display device comprises an opening region, a first packaging region and a display region; the first packaging area is positioned between the opening area and the display area, the first packaging area surrounds the opening area, and the display area surrounds the first packaging area;
the display area comprises a vapor deposition film layer formed on the substrate;
the first packaging area comprises a packaging layer formed on the substrate, the packaging layer and the vapor deposition layer are positioned on the same side of the substrate, the packaging layer comprises packaging glue, the packaging glue and the vapor deposition layer are not overlapped in the display area and the first packaging area, and the packaging glue surrounds the opening area;
the open area does not include the vapor deposition coating layer and the packaging layer.
2. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a substrate to be evaporated; the substrate to be evaporated comprises a first area and a second area surrounding the first area;
evaporating a second area of the substrate to be evaporated through an anti-deposition component and an evaporation source to form an evaporation coating layer in the second area of the substrate to be evaporated, wherein the evaporation coating layer is not formed in the first area so as to form an open hole area in the first area; the first area covers the orthographic projection of the deposition prevention component on the plane of the substrate to be evaporated;
forming a packaging layer on the edge of the first area, wherein the packaging layer and the vapor deposition layer are positioned on the same side of the substrate to be vapor deposited, the packaging layer comprises packaging glue, the packaging glue and the vapor deposition layer are not overlapped in the second area and the first area, and the packaging glue surrounds the opening area;
the anti-deposition component comprises a heating assembly; the heating assembly is positioned on one side of the substrate to be evaporated, which is far away from the evaporation source; through prevent that deposition part and evaporation source carry out the coating by vaporization in the second region of treating the coating by vaporization base plate, make the second region of treating the coating by vaporization base plate forms the coating by vaporization layer, first region does not form the coating by vaporization layer, includes: heating a first area of the substrate to be evaporated by the heating assembly to enable the temperature T1 of the first area and the temperature T2 of the second area to satisfy the following conditions: T1-T2 is more than or equal to 50 ℃; and forming a vapor-deposited film layer in the second area of the substrate to be vapor-deposited through the evaporation source and the heating assembly, wherein the vapor-deposited film layer is not formed in the first area.
3. The method of manufacturing according to claim 2,
the heating assembly is used for heating the first area of the substrate to be evaporated, so that the temperature T1 of the first area is more than or equal to 100 ℃ and less than or equal to T1 and less than or equal to 180 ℃.
4. The method of manufacturing according to claim 2,
the area of the orthographic projection of the heating component on the plane of the substrate to be evaporated is smaller than that of the first area.
5. The manufacturing method according to claim 2, wherein the substrate to be evaporated comprises a driving circuit layer, the driving circuit layer is only located in the second region, and the driving circuit layer and the deposition prevention part do not overlap in an orthographic projection of the substrate to be evaporated.
6. A display device, comprising the display panel of claim 1, wherein a light sensing module is disposed in the opening region.
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| WO2021203329A1 (en) * | 2020-04-08 | 2021-10-14 | 京东方科技集团股份有限公司 | Display substrate and method for preparing same, and display apparatus |
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| CN101338410A (en) * | 2007-07-06 | 2009-01-07 | 昆山维信诺显示技术有限公司 | A cleaning plate for evaporation process and an evaporation process method using the cleaning plate |
| CN109273494A (en) * | 2018-09-21 | 2019-01-25 | 云谷（固安）科技有限公司 | A kind of OLED display panel, its production method and display device |
| CN109301085A (en) * | 2018-09-30 | 2019-02-01 | 京东方科技集团股份有限公司 | A display substrate, its manufacturing method, and a display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101338410A (en) * | 2007-07-06 | 2009-01-07 | 昆山维信诺显示技术有限公司 | A cleaning plate for evaporation process and an evaporation process method using the cleaning plate |
| CN109273494A (en) * | 2018-09-21 | 2019-01-25 | 云谷（固安）科技有限公司 | A kind of OLED display panel, its production method and display device |
| CN109301085A (en) * | 2018-09-30 | 2019-02-01 | 京东方科技集团股份有限公司 | A display substrate, its manufacturing method, and a display device |
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Effective date of registration: 20211026 Address after: No.8, liufangyuan Henglu, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: WUHAN TIANMA MICROELECTRONICS Co.,Ltd. Patentee after: Wuhan Tianma Microelectronics Co.,Ltd. Shanghai Branch Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 201201 Patentee before: SHANGHAI TIANMA AM-OLED Co.,Ltd. |