CN110112278A - A kind of installation base plate and its light emitting device - Google Patents

Abstract

Embodiments of the present invention provide a mounting substrate and a light-emitting device thereof. The mounting substrate includes a base material, a pair of connecting pins, and a heat dissipation structure, wherein the pair of connecting pins are disposed on both ends of the base material and Wrapped to the back of the base material, the heat dissipation structure is arranged between the connection pins on the back of the base material and its height is equal to the height of the connection pins on the back side, the heat dissipation structure is used to install on the main surface of the base material The heat generated by the light-emitting device is guided out, thereby increasing the overall heat dissipation area of the light-emitting device, and further a layer of solder resist layer is arranged between the heat dissipation structure and the connection pins, and the solder resist layer is not connected to any The heat dissipation structure is connected, thereby maintaining the integrity of the heat dissipation structure, and avoiding the problem of mistakenly conducting the connection pins and the heat dissipation structure during welding, thereby losing the function of the heat dissipation structure for heat dissipation and avoiding the problem of short circuit.

Description

A mounting substrate and its light-emitting device

technical field

The present invention relates to the field of LED technology, and in particular, to a mounting substrate and a light-emitting device thereof.

Background technique

With the continuous development of science and technology, especially for LED-type energy-saving equipment, the need for more and more miniaturization, but its volume is reduced, and the heat generated during its work has not been reduced, and its heat dissipation There are still problems. The existing design method is to set a heat dissipation terminal on the back of the mounting board of the LED chip, and connect the heat dissipation terminal to the LED chip to transfer the heat generated by the LED chip to the outside, so as to achieve the effect of heat dissipation. However, the heat dissipation area of this structure is still too small. In particular, it is necessary to provide solder resist to cover the heat dissipation terminals to prevent the heat dissipation terminals from being energized by welding. Therefore, it is now necessary to design a method that can not only improve the heat dissipation efficiency but also avoid welding. Mounting board structure for energized light emitting devices.

SUMMARY OF THE INVENTION

The mounting substrate and the light-emitting device thereof provided by the embodiments of the present invention mainly solve the technical problem that the existing heat dissipation structure is provided with a solder resist layer to reduce the heat dissipation area of the device, resulting in a problem of low heat dissipation efficiency.

In order to solve the above technical problems, an embodiment of the present invention provides a mounting substrate, comprising: a substrate, disposed on both ends of the substrate and wrapped from the mounting surface of the substrate to the back of the substrate A pair of connection pins, and a heat dissipation structure disposed between the connection pins on the back of the base material and wrapped with the connection pins at the height of the back; between the heat dissipation structure and the A solder resist layer is also arranged between the connection pins, and the mounting surface of the base material is the surface that is in contact with the pads on the circuit board.

In other embodiments of the present invention, the solder resist layer is a film-like insulating layer formed of an insulating resin composition.

In other embodiments of the present invention, the solder resist layer is disposed on the base material between the heat dissipation structure and the connection pins, or is disposed between the heat dissipation structure and the connection pins substrate and the connecting pins.

In other embodiments of the present invention, the heat dissipation structure includes a heat dissipation main surface and a connecting portion that are connected to each other, wherein the heat dissipation main surface is fixed on the back surface of the base material, and the connecting portion is provided near the the mounting surface side of the substrate.

In other embodiments of the present invention, the connecting portion is a side edge of the heat dissipation main surface formed of a thermally conductive material that is close to the mounting surface of the base material and extends and wraps to the base along the mounting surface. The main surface of the material is formed on the main surface, and an extended bent portion of the thermally conductive structure is formed.

In other embodiments of the present invention, the mounting substrate further includes connection terminals, which are physically connected to the heat dissipation structure and extend through the base material to the main surface of the base material.

In other embodiments of the present invention, the connecting portion is a protruding pin formed by the heat dissipation main surface protruding along its vertical direction and bending to the mounting surface.

In other embodiments of the present invention, a connection through hole is further provided on the base material, and the connection terminal extends and wraps through the connection through hole to the main surface of the base material.

In order to solve the above technical problems, an embodiment of the present invention provides a light-emitting device, comprising the mounting substrate as described in any one of the above, and a light-emitting device disposed on the main surface of the mounting substrate, and a light-emitting device on the backside of the light-emitting device A heat-conducting layer is also arranged between the heat-dissipating structure and the heat-dissipating structure, and the heat generated during the operation of the light-emitting device is transferred to the heat-dissipating structure through the heat-conducting layer.

In other embodiments of the present invention, an encapsulation adhesive layer is further included, and the encapsulation adhesive layer is disposed on the main surface of the substrate and covers the light-emitting device.

The beneficial effects of the present invention are:

According to the mounting substrate and the light-emitting device thereof provided by the embodiments of the present invention, the mounting substrate includes a base material, a pair of connecting pins, and a heat dissipation structure, and the pair of connecting pins are disposed on both ends of the base material and Wrapped on the back of the substrate, the heat dissipation structure is arranged between the connection pins on the back of the substrate and its height is equal to the height of the back, the heat dissipation structure is used to generate the light-emitting device installed on the main surface of the substrate The heat of the light-emitting device is guided out, thereby increasing the overall heat dissipation area of the light-emitting device. A layer of solder resist layer is further arranged between the heat dissipation structure and the connection pins, and the solder resist layer is not connected to the heat dissipation structure. Therefore, the integrity of the heat dissipation structure is maintained, and the problem of misconnecting the connection pins with the heat dissipation structure during soldering and losing the function of the heat dissipation structure for heat dissipation and avoiding the occurrence of short circuits is avoided.

Description of drawings

FIG. 1 is a schematic structural diagram of a light-emitting device according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a mounting substrate provided by an embodiment of the present invention;

3 is a schematic diagram of a second structure of a mounting substrate provided by an embodiment of the present invention;

FIG. 4 is a schematic diagram of a third structure of a mounting substrate provided by an embodiment of the present invention.

Among them, 1 in the drawing is a light-emitting device, 10 is a mounting substrate, 11 is a base material, 12 is a connecting pin, 13 is a heat dissipation structure, 14 is a solder resist layer, 15 is a connecting terminal, and 101 is the main body of the base material. 102 is the back surface of the base material, 131 is the main surface for heat dissipation, 132 is the connecting portion, 20 is the light-emitting device, and 21 is the encapsulation adhesive layer.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below through specific embodiments in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

Example:

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of a light-emitting device according to an embodiment of the present invention. The light-emitting device 1 includes a mounting substrate 10 and a light-emitting device 20 , wherein the mounting substrate 10 includes a mounting substrate for mounting the light-emitting device 20 . The main surface 101 and the back surface 102, the light emitting device 20 is mounted on the main surface 101.

As shown in FIG. 2 , in this embodiment, the mounting substrate 10 specifically includes a base material 11 , a pair of connection pins 12 and a heat dissipation structure 13 , wherein the pair of connection pins 12 are disposed on the base material 11 . The two ends of the base material 11 are wrapped around the back side 102 of the base material 11. The heat dissipation structure 13 is arranged on the back side 102 of the base material 11, and is used to generate the light emitting device 20 disposed on the main surface 101. The heat diffuses out, thereby achieving the effect of accelerating heat dissipation.

In this embodiment, the heat dissipation structure 13 is disposed between the connection pins on the back of the base material. In an embodiment, its height is the same as the height of the connection pins 12 wrapped on the back side The heights are equal. In another embodiment, the height of the heat dissipation structure 13 can also be directly set to be equal to the height of the back surface.

In practical applications, the shape of the connecting pin 12 is similar to an inverted "T" shape, and a small protrusion is also provided on the vertical side of the inverted "T" shape, and the protrusion is used to provide a small bump for soldering the LED device. On the horizontal side of the inverted "T" shape, there is an extension part, the extension part is bent from the main surface 101 of the base material 11 to the side surface of the base material 11, and wraps the side surface of the base material 11 and extends to the back side 102 on.

In practical applications, the heat dissipation structure 13 is arranged at the middle position of the back surface 102 of the substrate 11 . Preferably, the area of the heat dissipation structure 13 should be selected to be one half and one third of the overall area of the back surface 102 . The two are more suitable, so that the maximum heat dissipation area can be maximized, and a certain setting space can be left for the solder resist layer 14. At the same time, the overall height of the heat dissipation structure 13 is equivalent to the overall height of the light emitting device 100. It can even be slightly larger, and the higher part can be used to connect with the heat dissipation device on the base material 11 to further increase the heat dissipation area and the heat dissipation speed.

In this embodiment, the heat dissipation structure 13 is specifically composed of a heat dissipation main surface 131 and a connecting part 132 , and the connecting part 132 is arranged on the side close to the mounting surface of the base material 11 , and the mounting surface here refers to the When installing the light-emitting device 100 according to the method, the surface that is in contact with the main board by welding, specifically, one of the side surfaces between the main surface and the back surface of the light-emitting device 100 .

In practical applications, the connecting portion 132 is specifically arranged in the middle of the mounting surface, and the connecting portion 132 is connected to the light-emitting device 20 and the heat dissipation main surface 131 respectively. This arrangement makes the heat dissipation structure 13 during installation. It can be directly contacted with the main board surface of the device, and the heat can be quickly transferred to the main board for heat dissipation. The specific structure is shown in FIG. 3 . The edge extends and wraps along the mounting surface to the extended bent portion formed by the main surface 101 of the substrate 11 .

In this embodiment, the mounting substrate 10 further includes connection terminals 15 , which are physically connected to the heat dissipation structure 13 and extend through the base material 11 to the main surface 101 of the substrate 11 .

In order to cooperate with the installation of the connection terminal 15 , a connection through hole is further provided on the base material 11 , and the connection terminal 15 extends and wraps through the connection through hole to the main surface 101 of the base material 11 .

Based on this structure, the connecting portion 132 should be set as a protruding pin formed by the heat dissipation main surface protruding along its vertical direction and bending to the mounting surface.

In this embodiment, the solder resist layer 14 is disposed between the heat dissipation structure 13 and the connection pins 12, and is not connected to the heat dissipation structure 13. In practical applications, the solder resist layer Specifically, 14 may be arranged only on the back side 102 of the base material 11, that is, on the base material 11 between the heat dissipation structure 13 and the connecting pins 12. The end position is disposed close to the side of the pin. Further, the solder resist layer 14 can also cover a part of the connecting pin 12 , as shown in FIG. 4 .

In this embodiment, the light emitting device 100 further includes an encapsulation adhesive layer 21 , and the encapsulation adhesive layer 21 is disposed on the main surface 101 of the substrate 11 and covers the light emitting device 20 . The encapsulation adhesive layer 21 can also be formed by processing an encapsulation film, specifically by covering a resin film layer with a fluorescent material on the main surface 101 of the processed collective substrate 11, and then baking at a high temperature. The gum film layer is melted on the main surface 101 so as to cover and encapsulate the light emitting device 20 .

To sum up, in the mounting substrate and the light-emitting device thereof provided by the embodiments of the present invention, the mounting substrate includes a base material, a pair of connection pins, and a heat dissipation structure, and the pair of connection pins are disposed on two sides of the base material. The end position is wrapped to the back of the base material, the heat dissipation structure is arranged on the back of the base material, and is arranged between the connection pins on the back side, the heat dissipation structure is used to install the light emitting on the main surface of the base material. The heat generated by the device is guided out, thereby increasing the overall heat dissipation area of the light-emitting device, and further, a solder resist layer is arranged on the base material between the heat dissipation structure and the connection pins. It is connected with the heat dissipation structure, thereby maintaining the integrity of the heat dissipation structure, and avoiding the mistaken connection between the connection pins and the heat dissipation structure during welding and the loss of the function of the heat dissipation structure for heat dissipation.

The LEDs provided in the foregoing embodiments can be applied to various light-emitting fields, for example, they can be made into backlight modules and applied to the display backlight field (which can be backlight modules of terminals such as TVs, monitors, and mobile phones). At this point, it can be applied to the backlight module. In addition to being applied to the field of display backlighting, it can also be applied to the field of button backlighting, photography, home lighting, medical lighting, decoration, automobiles, transportation, etc. When used in the field of key backlight, it can be used as a key backlight source for mobile phones, calculators, keyboards, etc. with key devices; when used in the field of photography, it can be used as a flash for cameras; when used in home lighting, it can be made into floor lamps and desk lamps. , lighting, ceiling lamps, downlights, projection lamps, etc.; when used in the field of medical lighting, it can be made into surgical lights, low electromagnetic lighting, etc.; when used in the field of decoration, it can be made into various decorative lights, such as various color lights Lights, landscape lighting, advertising lights; when used in the automotive field, it can be made into car lights, car lights, etc.; when used in the transportation field, it can be made into various traffic lights, and can also be made into various street lights. The above-mentioned applications are only several applications exemplified in this embodiment, and it should be understood that the applications of the LEDs in this embodiment are not limited to the several fields of the above-mentioned examples.

The above content is a further detailed description of the embodiments of the present invention in combination with specific embodiments, and it cannot be considered that the specific implementation of the present invention is limited to these descriptions. For those of ordinary skill in the technical field of the present invention, without departing from the concept of the present invention, some simple deductions or substitutions can be made, which should be regarded as belonging to the protection scope of the present invention.

Claims (10)

1. a kind of installation base plate characterized by comprising substrate is set on the positive both ends position of the substrate simultaneously It wraps up from the mounting surface of the substrate to a pair of of connection pin at the back side of the substrate, and the back side of the substrate is set The connection pin between and with the connection pin radiator structure that be wrapped in the height at the back side equal；It is dissipated described Solder mask is additionally provided between heat structure and the connection pin, the mounting surface of the substrate is and the contact pads on circuit board One side.

2. installation base plate according to claim 1, which is characterized in that the solder mask is by the resin combination with insulating properties The film-shaped insulative layer that object is formed.

3. installation base plate according to claim 1 or 2, which is characterized in that the solder mask is set to the radiator structure On substrate between the connection pin, or the substrate being set between the radiator structure and the connection pin and institute It states on connection pin.

4. installation base plate according to claim 3, which is characterized in that the radiator structure includes heat dissipation master interconnected Face and interconnecting piece, wherein the heat dissipation interarea is fixed on the back side of the substrate, and the interconnecting piece is set to the peace of the substrate Dress face side.

5. installation base plate according to claim 4, which is characterized in that the interconnecting piece be formed as Heat Conduction Material described in The side of the mounting surface close to the substrate in heat dissipation interarea extends the master of package to the substrate along the mounting surface Face and the interarea formed a conductive structure extension bending part.

6. installation base plate according to claim 4, which is characterized in that the installation base plate further includes connection terminal, described Connection terminal and the radiator structure physical connection, and pass through the interarea that the substrate extends to the substrate.

7. installation base plate according to claim 6, which is characterized in that the interconnecting piece is by the heat dissipation interarea along it Raised pin vertical direction protrusion and be bent to form to the mounting surface.

8. installation base plate according to claim 7, which is characterized in that be additionally provided with connection through-hole, institute on the substrate It states connection terminal and extends package to the interarea of the substrate across the connection through-hole.

9. a kind of light emitting device, which is characterized in that including such as described in any item installation base plates of claim 1-7, and be set to Luminescent device on the interarea of the installation base plate is additionally provided between the back side and the radiator structure of the luminescent device Heat-conducting layer, by the heat-conducting layer by generated heat transfer in the luminescent device course of work to the radiator structure On.

10. light emitting device according to claim 9, which is characterized in that it further include encapsulation glue-line, the encapsulation glue-line setting In on the interarea of the substrate, and cover the luminescent device.