CN110102902A - A kind of excessive film plating layer process of laser ablation AF - Google Patents
A kind of excessive film plating layer process of laser ablation AF Download PDFInfo
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- CN110102902A CN110102902A CN201910384930.4A CN201910384930A CN110102902A CN 110102902 A CN110102902 A CN 110102902A CN 201910384930 A CN201910384930 A CN 201910384930A CN 110102902 A CN110102902 A CN 110102902A
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- 238000007747 plating Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 41
- 230000008569 process Effects 0.000 title claims abstract description 32
- 238000000608 laser ablation Methods 0.000 title claims abstract description 24
- 238000003754 machining Methods 0.000 claims abstract description 31
- 238000007781 pre-processing Methods 0.000 claims abstract description 24
- 238000012545 processing Methods 0.000 claims abstract description 24
- 238000002679 ablation Methods 0.000 claims abstract description 12
- 230000008676 import Effects 0.000 claims abstract description 5
- 238000011049 filling Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 14
- 238000005516 engineering process Methods 0.000 abstract description 9
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 230000003666 anti-fingerprint Effects 0.000 abstract description 5
- 230000002209 hydrophobic effect Effects 0.000 abstract description 4
- 125000001153 fluoro group Chemical group F* 0.000 abstract description 3
- 239000011159 matrix material Substances 0.000 abstract description 3
- 238000005459 micromachining Methods 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 11
- 150000002500 ions Chemical class 0.000 description 7
- 239000012528 membrane Substances 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 230000003434 inspiratory effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention belongs to laser micro-machining technology fields, more particularly to a kind of excessive film plating layer process of laser ablation AF, the excessive film plating layer on the surface of workpiece to be processed is the fluoro-containing coating anti-fingerprint film layer of hydrophobic oleophobic, ink layer and glass matrix are followed successively by below excessive film plating layer, this method comprises the following steps: S1, preprocessing map file is drawn according to the characteristic size of workpiece to be processed, and imports laser control system；S2 adjusts laser processing parameter according to preprocessing map file, adjusts laser scanning system, the focus of laser beam is made to fall in the top of workpiece to be processed upper surface；S3, determine the whole picture face machining path of workpiece to be processed, workpiece to be processed is moved to specified Working position by kinetic control system, laser beam is scanned ablation to workpiece to be processed according to whole picture face machining path, removes the excessive film plating layer on workpiece to be processed surface.The present invention is using the excessive film plating layer of kinetic control system cooperation laser ablation, and not only removal efficiency is high, and removal size easy to control and removal precision.
Description
Technical field
The invention belongs to laser micro-machining technology fields, and in particular to a kind of excessive film plating layer process of laser ablation AF.
Background technique
In recent years, Mobile Phone Consumption electronics is that development updates most fast one of industry, for meet the more demands of consumer with
And differentiation, major cell phone manufacturer constantly bring forth new ideas and develop.Only for enclosure material, smart phone industry be just faced with plastics,
The multiple choices such as metal, glass, ceramics.For consumer, enclosure material also have become selection smart phone it is important because
Element.But regardless of material, in machining process, it all be unable to do without various process of surface treatment, such as metal shell table
Surface treatment process includes the processes such as sandblasting, plating, PVD, spraying, anodic oxidation, and the shell of glass and ceramic material usually needs
By AF coating film treatment.
Dirt on the touch screens such as mobile phone be largely by fingerprint sweat and grease dust cause, how to make touch screen
It does not polluted in use by fingerprint, be not easy to be scratched and translucency is hardly influenced by coating, become and need in the market
It solves the problems, such as.Currently, mobile phone mainstream screen in the market is LED and OLED, fingerprint proof membrane is plated on its surface, can effectively be solved
Certainly this problem.Fingerprint proof membrane has highly dense fluorine-containing film layer, can be reduced the attachment of spot, fingerprint.Organic fluorine material has excellent
Hydro-oleophobicity, it is good to thermal stability, stronger anti-actinic heat and stability resistant to chemical etching etc..
AF, also known as hydrophobic film or fingerprint proof membrane (AF film) are mainly sunk organic fluoride material by vacuum coating technology
Thus product may be used on substrate, making substrate surface have the function of Water-proof and oil-proof, scratch resistant, anti-fingerprint, anti-pollution and easy to clean etc.
Find out the importance of this tunic, but during vacuum coating this layer of fluoride easily overflow be plated to the glass cover-plate back side, cause to seal
It fills insecure, influences being made for later process.Conventional method removes film layer of overflowing and depends on manually with non-dust cloth to be processed
Workpiece surface rubs repeatedly, not only time-consuming but also be not easy to control scale and damage more ink layer and scratch glass, influences work
Part intensity reduces production yield.In addition, existing yellow light manufacturing process for film layer of overflowing processing there is also being not thorough phenomenon,
The problems such as polluting environment.And removing the film plating layer that overflows need to ensure that material reaches hydrophilic effect and encapsulates convenient for product, while not energy loss
The glass for hurting bottom will also control within 1 μm the removal depth of ink layer, and ink damage seriously will affect the later period of iPad
Processing procedure, for example color value is caused to detect, hundred lattice test failures.Therefore, anti-fingerprint is plated for existing 3C Product screen cover board
The excessive plating phenomenon that is generated in membrane process and influence encapsulation problem, it is necessary to designing a kind of can effectively remove at a high speed excessive film plating layer
Laser processing technology method.
Summary of the invention
In order to overcome the shortcomings of the prior art described above, the object of the present invention is to provide a kind of excessive plated films of laser ablation AF
Layer process method can effectively remove at a high speed excessive film plating layer.
To achieve the above object, the film plating layer process the technical scheme is that a kind of laser ablation AF overflows, it is to be added
The excessive film plating layer on the surface of work workpiece is the fluoro-containing coating anti-fingerprint film layer of hydrophobic oleophobic, is followed successively by ink below the film plating layer that overflows
Layer and glass matrix, this method comprises the following steps:
S1 draws preprocessing map file according to the characteristic size of workpiece to be processed, and imports laser control system；
S2 adjusts laser processing parameter according to preprocessing map file, adjusts laser scanning system, fall in the focus of laser beam to be added
The top of work workpiece surface；
S3 determines the whole picture face machining path of workpiece to be processed, is moved to workpiece to be processed by kinetic control system specified
Working position, laser beam is scanned ablation to workpiece to be processed according to whole picture face machining path, removes work to be processed
The excessive film plating layer on part surface.
Further, for large product, step S3 specifically: according to preprocessing map file, controlled using galvanometer and movement
System cooperation processed fits the whole picture face machining path of workpiece to be processed；Workpiece to be processed is moved to by kinetic control system
Specified Working position, laser beam are scanned ablation to workpiece to be processed according to the whole picture face machining path fitted,
Remove the excessive film plating layer on workpiece to be processed surface.
Further, for small sized product, step S3 specifically: select preprocessing map file for the whole picture of workpiece to be processed
Face machining path；Select CCD vision positioning system to workpiece to be processed positioning after, by kinetic control system by workpiece to be processed
Be moved to specified Working position, laser beam is scanned ablation to workpiece to be processed according to preprocessing map file, removal to
The excessive film plating layer on workpieces processing surface.
Further, in step S3, laser scanning system is adjusted, the focus of laser beam is made to fall in workpiece to be processed upper surface
The top position 8-10 ㎜ at.
Further, effect when laser processing, to the point spacing or line spacing and laser beam of the filling of preprocessing map file
Spot diameter is equal.
Further, the filling mode of preprocessing map file is two-way filling, and line fills spacing between 20~300 μm.
Further, workpiece to be processed is fixed on vacuum absorbing platform, controls vacuum suction by kinetic control system
Workpiece to be processed is accurately positioned in the movement of platform.
Further, it is equipped in the machining area of workpiece to be processed and takes out dirt device and ion blowning installation, smoke dirt device
The inflatable mouth of suction inlet and ion blowning installation is towards the machining area of workpiece to be processed.
Further, the scanning speed of galvanometer is 5000~30000 ㎜/s.
Further, laser used by laser scanning system is ultraviolet laser, wavelength 355nm, pulsewidth <
20ns, output frequency are 20~200KHz, and output power is 0.5~5W, and Q pulse width is 1 ~ 20 μ s.
Compared with prior art, the invention has the following advantages:
(1) the excessive film plating layer process of laser ablation AF provided by the invention first determines the whole picture face processing road of workpiece to be processed
Diameter, then workpiece to be processed is moved to by kinetic control system by specified Working position, laser beam is according to whole picture face processing road
Diameter ablation is scanned to workpiece to be processed come remove the excessive film plating layer on workpiece to be processed surface can effectively remove it is excessive
The excessive film plating layer being plated on glass cover-plate, convenient for encapsulation；
(2) for the present invention using the excessive film plating layer of kinetic control system cooperation laser ablation, not only removal efficiency is high, but also is easy to control
Remove size and removal precision；
(3) film plating layer that overflows is removed using process provided by the invention, can control removal depth to ink layer 1 μm with
It is interior, while the glass of ink layer bottom will not be damaged, low, production yield height is influenced on workpiece strength；
(4) present invention determines the whole picture face machining path of workpiece to be processed according to the size of product, for small-size product, directly
Breadth covering is carried out after positioning by CCD vision positioning system directly to process；For large product, pass through galvanometer and motion control
System cooperates the whole picture face machining path for first fitting workpiece to be processed, is processed further according to the path of fitting, overcomes big
The problem of breadth processing need to splice, and this processing method can be mentioned significantly by galvanometer and kinetic control system cooperation
High processing efficiency.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the flow diagram of the excessive film plating layer process of laser ablation AF provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram of the excessive film plating layer process of laser ablation AF provided in an embodiment of the present invention；
Fig. 3 is the index path of the excessive film plating layer process of laser ablation AF provided in an embodiment of the present invention；
In figure: 1, laser, 2, beam expanding lens, the 3, first total reflective mirror, the 4, second total reflective mirror, 5, galvanometer, 6, field lens, 7, vacuum suction
Platform, 8, workpiece to be processed.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1, the embodiment of the present invention provides a kind of excessive film plating layer process of laser ablation AF, workpiece to be processed
Surface excessive film plating layer be hydrophobic oleophobic fluoro-containing coating anti-fingerprint film layer, overflow film plating layer below be followed successively by ink layer and glass
Glass matrix, this method comprises the following steps:
S1 draws preprocessing map file according to the characteristic size of workpiece to be processed, and imports laser control system；
S2 adjusts laser processing parameter according to preprocessing map file, adjusts laser scanning system, fall in the focus of laser beam to be added
The top of work workpiece surface；
S3 determines the whole picture face machining path of workpiece to be processed, is moved to workpiece to be processed by kinetic control system specified
Working position, laser beam is scanned ablation to workpiece to be processed according to whole picture face machining path, removes work to be processed
The excessive film plating layer on part surface.
The present invention is using the excessive film plating layer of kinetic control system cooperation laser ablation, and not only removal efficiency is high, and speed is fast, and
It is easy to control removal size and removal precision, can control the removal depth to ink layer within 1 μm, while oil will not be damaged
The glass of layer of ink bottom influences low, production yield height on workpiece strength.
Further, for having a size of 150 × 150 ㎜~250 × 250 ㎜ large product, using unlimited visual field technology
Whole picture face machining path, step S3 are fitted according to preprocessing map file specifically: according to preprocessing map file, using galvanometer and movement
Control system cooperates the whole picture face machining path for fitting workpiece to be processed；Workpiece to be processed is moved to finger by kinetic control system
Fixed Working position, laser beam are scanned ablation to workpiece to be processed according to the whole picture face machining path fitted, go
Except the excessive film plating layer on workpiece to be processed surface.As shown in Fig. 2, being existed after incident light enters galvanometer 5 by the focussing force of field lens 6
The top of 8 upper surface of workpiece to be processed, workpiece to be processed 8 are located on vacuum absorbing platform, pass through the movement of kinetic control system
It drives the workpiece to be processed 8 mobile, is fitted by x, y of the cooperative movement control system that runs at high speed of galvanometer 5 to movement whole
Breadth machining path, then keep laser beam overlap ratio certain by adjusting laser parameter, it is about 250 that spot diameter is acted in the case of defocus
μm, laser beam high-velocity scanning point is mapped to workpiece to be processed surface, galvanometer run at high speed speed and with kinetic control system
X, y is combined to motor bidirectional-movement, overcomes the problem of large format processing need to splice, and this processing method passes through galvanometer
Processing efficiency can be greatly improved with kinetic control system cooperation, so that process time is greatly shortened, greatly improve
Removal efficiency, and whole picture face is continuous.
Further, for having a size of 80 × 80 ㎜~150 × 150 ㎜ small sized product, step S3 specifically: selection is pre-
Process the whole picture face machining path that map file is workpiece to be processed；After selecting CCD vision positioning system to position workpiece to be processed, lead to
It crosses kinetic control system and workpiece to be processed is moved to specified Working position, laser beam is according to preprocessing map file to work to be processed
Part is scanned ablation, removes the excessive film plating layer on workpiece to be processed surface.
Further, in step S3, adjusting laser scanning system makes the focus of laser beam be located at workpiece to be processed upper surface
The top position 8-10 ㎜ at, laser facula is in out-of-focus appearance, at this time act on spot diameter can achieve 250 μm, light can be made
It is bigger that spot acts on the area on material, promotes removal efficiency, and guarantee certain removal effect；It is with this working (finishing) area
When 4000mm2, process time can be optimized within 5s.As shown in figure 3, the laser scanning system of the present embodiment includes laser
1,2, two total reflective mirrors of beam expanding lens, galvanometer 5 and field lens 6, the light that laser 1 issues are all-trans after beam expanding lens 2 expands by first
Mirror 3, the second total reflective mirror 4 are reflected into galvanometer 5, act on workpiece to be processed 8 after focusing using field lens 6.
Further, effect when laser processing, to the point spacing or line spacing and laser beam of the filling of preprocessing map file
Spot diameter is equal, and the hot spot processed can be made tangent, has ensured micro and macro removal effect.The present invention is according to poly-
Burnt spot diameter calculation formula: the λ FM2/ π of d=4 D(d: focal beam spot diameter；λ: wavelength；F: the focal length of lens；D: galvanometer entrance pupil hot spot
Diameter；M2: beam quality) theoretical spot size is calculated, the light beam of laser is arranged in the spot size in combination to material
Point spacing, superposition degree and arrangement mode carry out corresponding laser machined parameters modification, laser by practical function effect
Beam defocus acts on workpiece to be processed, and the spot diameter after defocus is equal with point spaced lines spacing, and hot spot is tangent, so
Realize the excessive film plating layer of efficient large format removal surface A F.
Further, the filling mode of the preprocessing map file imported in laser control system is two-way filling, according to laser
Beam acts on the size of workpiece to be processed surface hot spot, and line fills spacing between 20~300 μm.
Further, workpiece to be processed is fixed on vacuum absorbing platform, controls vacuum suction by kinetic control system
Workpiece to be processed is accurately positioned in the movement of platform.The kinetic control system of the present embodiment includes x-axis and y-axis, passes through x-axis direction
The way moving in x-axis direction and y-axis direction that vacuum absorbing platform is controlled with the High Precision Linear Motor in y-axis direction, from
And workpiece to be processed is accurately positioned.The laser scanning system of the present embodiment is located on the Z axis of High Precision Linear Motor, combining wireless
The whole picture face machining path that visual field technology fits processes workpiece to be processed precise positioning.
Further, it is equipped in the machining area of workpiece to be processed and takes out dirt device and ion blowning installation, smoke dirt device
The inflatable mouth of suction inlet and ion blowning installation is towards the machining area of workpiece to be processed.The sample machining area of the present embodiment
Dirt device and ion blowning installation are taken out equipped with strength, the dust generated during coating removal can be taken away in time, avoid powder
Dirt covering influences technological effect, makes sample surface cleaning after processing is completed, does not have to carry out subsequent cleaning process.Ion blowning installation
For the powder of generation to blow off glass sample surface in time, takes out dirt device and include negative inspiratory pressure equipment and set with negative inspiratory pressure
Standby connected pumping dirt pipe, for the powder of generation to be extracted out in time；Take out the suction inlet of dirt pipe and the inflatable mouth of ion blowning installation
It is tilted a certain angle between vacuum absorbing platform respectively.
Further, the scanning speed of galvanometer is 5000~30000 ㎜/s.
Further, laser machined parameters include output power, frequency, the scan rate of vibrating mirror, filling line of laser
Spacing, the delay of switch light and defocus distance etc.；Laser used by the laser scanning system of the present embodiment is ultraviolet laser
Device, wavelength 355nm, pulsewidth < 20ns, output frequency are 20~200KHz, and output power is 0.5~5W；Tune can also be passed through
The delay of laser switch light is saved, keeps processing edge effect more attractive.The present invention reduces beam energy density, single pulse energy,
It is minimum to the damage of substrate ink material on the basis of the excessive film plating layer that material surface can be effectively removed at a high speed, glass nondestructive wound,
Not only it ensure that the service performance of material itself, but also significantly reduced processing procedure cost, and improved production capacity.
Embodiment one
Test platform is constructed, the ultraviolet nanosecond laser that pulsewidth is less than 20ns is chosen, wavelength selection 355nm selects clear aperature
For the high-speed vibrating mirror of 10mm, booting preheating 6 minutes obtains preprocessing map file according to workpiece to be processed appearance and size, imports laser
Control system can realize that breadth covering is directly processed by CCD vision positioning for small sized product, then for super large web product
It needs to fit the machining path in whole picture face by control galvanometer and kinetic control system using unlimited visual field technology, adjusts and swash
Photo-scanning system is located at focus at 8 ~ 10mm of workpiece to be processed upper surface, acts on 250 μm of spot diameter；Pass through motion control system
Workpiece to be processed is moved to specified Working position by system, and 5 μ of laser processing parameter output power 3.2w, Q pulse width is arranged
S, scan rate of vibrating mirror 30000mm/s, frequency 120KHz, map file filling line spacing be 250 μm, processing times 1 time, laser beam root
The path fitted according to unlimited visual field technology is scanned ablation to workpiece to be processed, and removal workpiece to be processed surface is overflow
Film plating layer.
The strength test of workpiece, color measurement, opacity test, ink thickness test, form water droplet angle are surveyed after processing
Examination, MEK test, the test of hundred lattice, pencil test, paper tape friction testing are qualification, and wherein strength test results processing front and back is strong
Spend no significant difference；Hundred lattice test values are in 4B or more；Pencil tests 1H/300g counterweight ink without scuffing, and nothing falls off；MEK is surveyed
Formation testing ink falls off without corrugation, nothing；Paper tape friction testing can guarantee to be greater than 30 circles；Color data is in standard value interval range；
Opacity data each point is all larger than 3.8；Ink thickness reduces within 1 μm.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (10)
- The film plating layer process 1. a kind of laser ablation AF overflows, which is characterized in that this method comprises the following steps:S1 draws preprocessing map file according to the characteristic size of workpiece to be processed, and imports laser control system；S2 adjusts laser processing parameter according to preprocessing map file, adjusts laser scanning system, fall in the focus of laser beam to be added The top of work workpiece surface；S3 determines the whole picture face machining path of workpiece to be processed, is moved to workpiece to be processed by kinetic control system specified Working position, laser beam is scanned ablation to workpiece to be processed according to whole picture face machining path, removes work to be processed The excessive film plating layer on part surface.
- The film plating layer process 2. a kind of laser ablation AF as described in claim 1 overflows, which is characterized in that produced for large size Product, step S3 specifically: according to preprocessing map file, the whole of workpiece to be processed is fitted using galvanometer and kinetic control system cooperation Breadth machining path；Workpiece to be processed is moved to specified Working position by kinetic control system, laser beam is according to fitting Whole picture face machining path out is scanned ablation to workpiece to be processed, removes the excessive film plating layer on workpiece to be processed surface.
- The film plating layer process 3. a kind of laser ablation AF as described in claim 1 overflows, which is characterized in that for small-sized production Product, step S3 specifically: select preprocessing map file for the whole picture face machining path of workpiece to be processed；Select CCD vision positioning system After system is to workpiece to be processed positioning, workpiece to be processed is moved to by kinetic control system by specified Working position, laser beam Ablation is scanned to workpiece to be processed according to preprocessing map file, removes the excessive film plating layer on workpiece to be processed surface.
- The film plating layer process 4. a kind of laser ablation AF as described in claim 1 overflows, it is characterised in that: in step S2, adjust Laser scanning system is saved, falls in the focus of laser beam at the top position 8-10 ㎜ of workpiece to be processed upper surface.
- The film plating layer process 5. a kind of laser ablation AF as described in claim 1 overflows, it is characterised in that: when laser processing, It is equal with the effect spot diameter of laser beam to the point spacing or line spacing of the filling of preprocessing map file.
- The film plating layer process 6. a kind of laser ablation AF as claimed in claim 5 overflows, it is characterised in that: preprocessing map file Filling mode is two-way filling, and line fills spacing between 20~300 μm.
- The film plating layer process 7. a kind of laser ablation AF as described in claim 1 overflows, it is characterised in that: workpiece to be processed is solid Due on vacuum absorbing platform, the movement of vacuum absorbing platform is controlled by kinetic control system work to be processed is accurately positioned Part.
- The film plating layer process 8. a kind of laser ablation AF as described in claim 1 overflows, it is characterised in that: in workpiece to be processed Machining area be equipped with and take out dirt device and ion blowning installation, the inflatable mouth of the suction inlet and ion blowning installation of taking out dirt device is equal Towards the machining area of workpiece to be processed.
- The film plating layer process 9. a kind of laser ablation AF as described in claim 1 overflows, it is characterised in that: the scanning speed of galvanometer Degree is 5000~30000 ㎜/s.
- The film plating layer process 10. a kind of laser ablation AF as described in claim 1 overflows, it is characterised in that: laser scanning system Laser used by uniting is ultraviolet laser, and wavelength 355nm, pulsewidth < 20ns, output frequency is 20~200KHz, output Power is 0.5~5W.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110834155A (en) * | 2019-12-23 | 2020-02-25 | 雷科股份有限公司 | Method and equipment for applying AOI (argon oxygen decarburization) to laser etching of thin copper coil |
| CN111421238A (en) * | 2020-03-10 | 2020-07-17 | 大族激光科技产业集团股份有限公司 | Laser grooving method |
| CN112044873A (en) * | 2020-09-23 | 2020-12-08 | 夏禹纳米科技（深圳）有限公司 | Laser removal method for waterproof material on surface of electronic element |
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| CN113853063A (en) * | 2021-09-09 | 2021-12-28 | 深圳市海目星激光智能装备股份有限公司 | Dielectric material removing method, laser removing apparatus and electronic device |
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| CN111421238A (en) * | 2020-03-10 | 2020-07-17 | 大族激光科技产业集团股份有限公司 | Laser grooving method |
| CN112044873A (en) * | 2020-09-23 | 2020-12-08 | 夏禹纳米科技（深圳）有限公司 | Laser removal method for waterproof material on surface of electronic element |
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| CN114591003A (en) * | 2022-03-07 | 2022-06-07 | 江西群泰科技有限公司 | Method for reducing AF spraying plating ink |
| CN114473227A (en) * | 2022-03-28 | 2022-05-13 | 武汉华工激光工程有限责任公司 | Laser processing method for corrosion-resistant black sculpture of stainless steel |
| CN114799488A (en) * | 2022-05-26 | 2022-07-29 | 卡门哈斯激光科技（苏州）有限公司 | Method for removing PET blue film of power battery with assistance of laser |
| CN117733358A (en) * | 2024-01-04 | 2024-03-22 | 江苏富乐华半导体科技股份有限公司 | Reworking method for engraving two-dimensional codes on copper-clad plate |
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Application publication date: 20190809 |