CN110089205A - Printed circuit board and manufacturing methods - Google Patents

Abstract

The present invention relates to the Printed circuit board and manufacturing methods that one kind can ensure productivity and economy, the printed circuit board that a kind of separation of the metal release layer for allowing to separate with the first metal layer in particular to utilization between the first metal layer and second metal layer manufactures the method for printed circuit board with core components and manufactured by this method.

Description

Printed circuit board and manufacturing method thereof

technical field

The present invention relates to a printed circuit board capable of ensuring productivity and economy and a method for manufacturing the same.

Background technique

A printed circuit board (PCB) is a component that is configured to integrate wiring and mount various components or enable electrical connection between components. With the development of technology, people are manufacturing printed circuit boards with various forms and functions.

Conventionally, as a method of manufacturing a printed wiring board, there is a method using a foamable tape film. As an example, as shown in FIG. 1, after preparing two copper foil laminates 10 sequentially laminated with a first copper foil layer 11, an insulating member 12 and a second copper foil layer 13, these are respectively adhered to a foamable After forming a multilayer structure on the upper and lower surfaces of the tape film 20, a through hole 14 is formed in a region of the second copper foil layer, and thereafter, the foamable tape film is removed from the multilayer structure and separated into 2 stacks 30 . By this method, thin multilayer printed circuit boards can be easily manufactured. However, when the copper foil laminate is laminated on the foam tape film, the drug may permeate into the laminate from the interface between the laminate and the foam tape film, or the surface of the separated laminate may be damaged. Film residue 20a exists (see (d) of FIG. 1 ). Short circuit (short) or the like occurs due to such film residues or infiltrated chemicals, which leads to a decrease in the production utilization rate of printed wiring boards and an increase in the defective rate.

SUMMARY OF THE INVENTION

technical problem

An object of the present invention is to provide a printed circuit board and a manufacturing method thereof capable of increasing the production utilization rate of the substrate and reducing the defective rate of the substrate.

Technical solutions

In order to achieve the above object, the present invention provides a method for manufacturing a printed circuit board. According to one example, the method includes: preparing a first metal layer, a metal release layer, and a second metal layer that is thinner than the first metal layer. The step (S100) of the metal part of the two metal layers; the step of preparing the core part for separation by stacking the metal part on the top and bottom of the insulating part so that the second metal layer is in contact with the insulating part (S200); A step of forming a multilayer structure by laminating a unit member including an insulating layer and a pattern-forming metal layer on each of the first metal layers of the separation core member (S300); after the insulating layer and the pattern-forming metal layer A step (S400) of forming a via hole in a region of the via hole; a step (S500) of applying gold plating to the via hole and the metal layer for pattern formation to form a gold plated layer; and from the multilayer structure obtained in the step (S500) The metal release layer and the first metal layer of the core member for separation are separated in the body, and the metal release layer is removed together with the second metal layer and the insulating member, thereby separately separating to obtain 2 metal layers adhered to the first metal layer. The step of forming a stack (S600).

Optionally, before the step (S600), it may further include: a step of cutting off the edge region of the multilayer structure obtained in the step (S500).

In addition, before the step (S300), it may further include: the separation core member obtained in the step (S200) penetrates in the vertical direction of the separation core member to form an interlayer used in the printed circuit board. A step of first guide holes of mutual registration (registration); and before said step (S400), further comprising: using X-rays to identify the inside of the multilayer structure obtained in said step (S300) a first guide hole, and forming a vertically penetrating second guide hole at the edge of the multilayer structure.

Here, the metal release layer can be selected from chromium (Cr), nickel (Ni), zinc (Zn), molybdenum (Mo), tungsten (W), cobalt (Co), lead (Pb), silver ( Ag), tantalum (Ta), copper (Cu), aluminum (Al), manganese (Mn), iron (Fe), titanium (Ti), tin (Sn), steel (Steel) and vanadium (V) At least one of them is formed.

For such a metal release layer, the amount of metal vapor deposition may be 0.5 to 20 mg/㎡.

In addition, the thickness of the first metal layer may be in the range of 6 to 35 μm, and the thickness of the second metal layer may be in the range of 0.5 to 5 μm.

In addition, unevenness may be formed on the surface of the first metal layer that is in contact with the insulating layer of the unit component. At this time, the average roughness (Ra) of the concavo-convex portion may be in a range of 3.0 to 6.5 μm. In this case, the bonding strength between the insulating layer and the first metal layer is in the range of 0.8 to 3.0 N/mm.

In the step (S600), when separating the metal release layer from the first metal layer, the release force between the metal release layer and the first metal layer may be in the range of 10 to 90 N/m.

In addition, the structures of the laminated bodies which are respectively separated centering on the core member for separation in the step (S600) may be the same as each other.

In another aspect, the present invention provides a printed circuit board manufactured by the aforementioned method. As an example, the printed circuit board sequentially includes a first metal layer, an insulating layer, and a metal layer for pattern formation, and includes: through holes formed in the insulating layer and the metal layer; The metal layer of the hole and the gold plating layer in the through hole.

On the other hand, the present invention provides a multilayer structure for forming a printed circuit board as an intermediate for manufacturing the aforementioned printed circuit board. The multilayer structure for forming a printed circuit board includes: a separation core member including an insulating member and metal members respectively laminated on the upper and lower surfaces of the insulating member; and unit members respectively laminated on the insulating member. The upper and lower sides of the core member for separation, and sequentially include an insulating layer and a metal layer for pattern formation, the metal member sequentially includes: a first metal layer; a metal release layer; and a thickness thinner than the first metal layer, and A second metal layer in contact with the insulating member.

Here, a first guide hole for mutual registration between layers in a printed circuit board may be formed vertically penetrating through the separation core member, and a first guide hole vertically penetrating may be formed at the edge of the multilayer structure. Two guide holes.

The metal release layer and the first metal layer can be separated by a force of 10 to 90 N/m.

In addition, unevenness may be formed on the surface of the first metal layer that is in contact with the insulating layer of the unit component.

Meanwhile, the present invention provides a printed circuit board including the aforementioned multilayer structure for forming a printed circuit board.

effect of invention

The manufacturing method of the printed circuit board of the present invention utilizes the metal release layer that can be released from the first metal layer and is interposed between the first metal layer and the second metal layer. The conventional manufacturing method of the tape film can reduce the defective rate while increasing the production operating rate of the printed circuit board.

In addition, by using the core member for separation instead of the foamable tape film, a plurality of printed wiring boards can be produced at the same time, and the productivity of the manufacturing process can be improved.

At the same time, it is possible to ensure ease of manufacture by minimizing warping in the manufacturing process due to the asymmetric structure of the printed circuit board and structural warping characteristics of the final product.

Description of drawings

FIG. 1 is a flow chart showing a manufacturing process of a conventional printed wiring board.

2 to 6 are cross-sectional views showing a manufacturing process of a printed circuit board according to an embodiment of the present invention.

FIG. 7 is a cross-sectional view showing a manufacturing process of a printed circuit board according to another embodiment of the present invention.

8 to 9 are sectional views showing the manufacturing process of the printed circuit board according to still another embodiment of the present invention.

Fig. 10 is a cross-sectional view showing another embodiment of the separation core member used in the present invention.

Symbol Description

10: Copper foil laminate, 11, 13: Copper foil, 12: Insulation member, 20: Foam tape film, 20a: Film residue, 30: Laminate, 100: Separation core member, 111a, 111b: First Metal layer, 112a, 112b: metal release layer, 113a, 113b: second metal layer, 120: insulating member, 111a-1, 111b-1: concavo-convex part, 131: first guide hole, 132: second guide hole , 200: multilayer structure, 210a, 210b: unit parts, 211a, 211b: insulating layer, 212a, 212b: metal layer for pattern formation, 213a, 213b: through hole, 214a, 214b: gold plating layer, 220a, 220b: Laminated body, 300, 400: multilayer structure, 310a, 310b, 410a, 420b: laminated body, X, Y: cutting site.

Detailed ways

The present invention will be described below.

The present invention is characterized in that, when manufacturing a printed circuit board, a metal release layer capable of being separated from the first metal layer is interposed between the first metal layer and the second metal layer. The metal release layer was separated from the first metal layer, and the metal release layer was removed together with the second metal layer to simultaneously manufacture two laminates to which the first metal layer was adhered. When manufacturing printed wiring boards according to the present invention, it is possible to reduce the defective rate while improving the productivity of the manufacturing process.

The inventors have learned that when two metal parts formed by vapor-depositing a metal layer (hereinafter referred to as "metal release layer") that can be released from the metal foil on one side of the metal foil are adhered to the insulating part When a printed circuit board is manufactured by separating parts in the upper and lower forms, the metal foil and the metal release layer can be easily separated in the separation process. Specifically, since the metal release layer is directly evaporated on one side of the metal foil by an evaporation method (for example, electrolytic evaporation (electro-deposition), etc.), it can be stably bonded to the metal foil in a normal state. Foil adheres. In addition, since the metal release layer is made of a metal that can be released from the metal foil, it can be separated from the metal foil by a predetermined external force.

It should be noted that since the metal release layer is formed by vapor deposition, the profile has almost zero (zero) flatness. Therefore, since the adhesive force (bonding force) of the metal release layer and the insulating member is low, the metal release layer and the insulating member may be separated during the lamination process. In addition, due to the lower bonding force of the metal release layer and the insulating part, the metal release layer is more likely to be separated from the metal foil than the metal foil during the separation process because the insulating part cannot support (hold) the metal release layer. separate from insulating parts.

What's more, in the separation process, the metal foil should be separated from the metal release layer and adhered to the laminate, but if the thickness of the metal foil is too thin, the metal foil may be deformed or damaged during separation. When the metal foil is formed into a circuit pattern, it cannot be directly patterned, but requires the trouble of forming a seed layer.

Therefore, in the present invention, the metal release layers 112a, 112b that can be separated from the first metal layer are sequentially stacked on one side of the first metal layer 111a, 111b in the manufacture of the printed circuit board, and the thickness ratio is determined. The separation core member 100 (see FIG. 2 ) obtained by adhering the two metal members of the second metal layer 113 a and 113 b with a thinner first metal layer to the upper and lower surfaces of the insulating member 120 , respectively. Such an invention can increase the operating rate of printed circuit boards while reducing the defective rate, and can manufacture multiple printed circuit boards at the same time, thereby improving the productivity of the manufacturing process.

<Manufacturing method of printed circuit board>

The manufacturing method of the printed circuit board of an embodiment of the present invention comprises: prepare the step (S100 ); the step of preparing the core member for separation by laminating the metal member on the upper and lower surfaces of the insulating member so that the second metal layer is in contact with the insulating member (S200); will include the insulating layer and the metal layer for pattern formation The step of forming a multilayer structure by stacking the unit parts on each first metal layer of the separation core part (S300); the step of forming a via hole in a region of the insulating layer and the pattern forming metal layer (S400 ); the step of forming a gold-plated layer by applying gold plating to the through hole and the metal layer for pattern formation (S500); and separating the separation core member from the multilayer structure obtained in the step (S500) The step of removing the metal release layer and the first metal layer, and removing the metal release layer together with the second metal layer and the insulating member, thereby separately obtaining two laminates with the first metal layer adhered (S600). It should be noted that it is not limited to the manufacturing method described above, and the steps of each process can be modified or selectively mixed and executed as needed.

In this case, it is preferable that the manufacturing method performs the steps ( S300 ) to ( S500 ) in the same manner for both the upper part and the lower part of the separation core member, centering on the separation core member.

The various steps performed when manufacturing a printed circuit board according to the present invention will be described below with reference to the accompanying FIGS. 2 to 9 .

(1) Step (S100): Preparation of Metal Parts

Referring to FIG. 2, the metal parts 110a, 110b include first metal layers 111a, 111b, metal release layers 112a, 112b, and second metal layers 113a, 113b.

In the present invention, after the metal release layer is vapor-deposited and stacked on the first metal layer, the second metal layer is bonded or vapor-deposited on the metal release layer to prepare a metal part separately, and in step (S200) In this method, a metal part is bonded to an insulating part to obtain a core part for separation. Because, when the metal release layer is formed by vapor deposition after the second metal layer is laminated on the insulating member, since the insulating member is a non-conductive material, in order to form the metal release layer by vapor deposition, a plasma state is required. additional equipment. Therefore, in the present invention, a metal member is separately prepared, and then bonded to an insulating member to obtain a core member for separation.

The first metal layers 111a, 111b are the parts that are adhered to one side of each laminated body after being separated (debonded) from the separation core member 100 through the metal release layer in the step (S600) as the separation step, While functioning as a support for a printed circuit board, it can function as a wiring layer by patterning without requiring a seed layer.

Such first metal layers 111a and 111b are not particularly limited as long as they are in the form of metal thin films made of conductive substances used in the industry to form circuit patterns. Non-limiting examples of the conductive substance include chromium (Cr), nickel (Ni), zinc (Zn), molybdenum (Mo), tungsten (W), cobalt (Co), lead (Pb), silver (Ag), tantalum (Ta), copper (Cu), aluminum (Al), manganese (Mn), iron (Fe), titanium (Ti), tin (Sn), steel (Steel), zinc (Zn) and vanadium (V), palladium (Pd), and the like may be used alone, or two or more of them may be mixed or used in the form of an alloy. Among them, it is preferable to use a copper thin film in consideration of economical efficiency.

In addition, although the thickness of the first metal layer is not particularly limited, when it is in the range of about 6 to 35 μm, it is possible to prevent deformation or damage of the circuit pattern layer or the insulating layer in the separated laminated body in the separation process. At the same time, a circuit pattern can be formed by patterning in a short period of time without the need for a seed layer to function as a wiring layer.

The first metal layers 111a, 111b include concavo-convex portions 111a-1, 111b-1 formed on surfaces in contact with the insulating layers 211a, 211b of the unit parts (see FIG. 10 ). The concavo-convex portions 111a-1, 111b-1 can further increase the adhesion (bonding force) between the first metal layers 111a, 111b and the insulating layers 211a, 211b. Therefore, when the first metal layer is separated from the metal release layer in the subsequent separation process, the occurrence of pattern peeling (Pattern Peel Off) defects caused by the decrease in the strength of the glass between the first metal layer and the insulating layer can be minimized .

Although the average roughness (Ra) of the concave-convex portion is not particularly limited, when it is in the range of about 3.0 to 6.5 μm, the bonding strength between the first metal layer and the insulating layer can be further increased to 0.8 to 0.8 μm. About 3.0N/mm.

The metal release layers 112a, 112b are formed on one side of the first metal layer 111a, 111b. Since the metal release layer is directly evaporated and formed on the first metal layer, it can be stably maintained in the lamination process, through-hole formation process and gold-plating process (following steps (S300) to steps (S500)). Adhesion state of a metal layer. On the other hand, the second metal layer is directly evaporated and formed on the metal release layer, and such a second metal layer is adhered to the insulating member. That is, the metal release layers 112a, 112b are supported by the second metal layers 113a, 113b that are bonded in contact with the insulating member. Therefore, when separating the metal release layer 112a, 112b from the first metal layer 111a, 111b in the separation process (following steps (S600)), the metal release layer 112a, 112b and the first metal layer can be separated by a prescribed external force. Layers are separated from each other, and the metal release layers 112a, 112b are releasable metal layers that can be separated from the first metal layers 111a, 111b. Unlike polymer release films, interlayer peeling does not occur during the lamination process. Furthermore, unlike a foamable tape film, even if a part of the metal release layer is transcribed to the first metal layer during the separation process, no short circuit (short) occurs.

Such a metal release layer is selected from chromium (Cr), nickel (Ni), zinc (Zn), molybdenum (Mo), tungsten (W), cobalt (Co), lead (Pb), silver (Ag), tantalum At least one of the group consisting of (Ta), copper (Cu), aluminum (Al), manganese (Mn), iron (Fe), titanium (Ti), tin (Sn), steel (Steel), and vanadium (V) form. At this time, when the metal release layer and the first metal layer are dissimilar metals with low reactivity to each other, the laminated body can be avoided or damaged in the separation process, and the first metal layer can be separated from the first metal layer with less force. The metal layer is easy to separate. For example, when the first metal layer is a copper layer, the first metal release layer may be other components different from the copper layer, such as chromium, nickel, and the like.

Although there is no particular limitation on the thickness of the metal release layer, it will vary according to the amount of metal vapor deposition in nanometer units. In addition, the release force of the metal release layer also differs during the separation process depending on the amount of vapor deposition of the metal. That is, as the amount of metal vapor deposition increases, the release force of the metal release layer also increases during the separation process. For such reasons, when the metal vapor deposition amount is too much, in the separation process, the separation between the metal release layer and the first metal layer may not be easy; on the other hand, when the metal vapor deposition amount is too little, the During the lamination process, delamination between the metal release layer and the first metal layer may also occur. Therefore, in order to make the metal release layer avoid interlayer peeling in the lamination process and have a release force to the extent that it is easy to separate from the first metal layer in the separation process, the metal vapor deposition amount can be adjusted to about The range of 0.5 to 20 mg/㎡, preferably adjusted to the range of about 3.5 to 8 mg/㎡. According to such a metal vapor deposition amount, the metal release layer can have a thickness of about 20 nm or less, preferably about 5 to 20 nm, and in addition, in the separation process, it can pass about 10 to 90 N/m, preferably about 15 to 20 nm. A release force of 60 N/m, more preferably in the range of about 20 to 55 N/m separates the first metal layer.

Such a metal release layer can be formed by a vapor deposition method other than the conventional coating method. For example, at a temperature of 22°C, by using about 150-300 g/l (preferably, about 240-260 g/l) of chromic acid and about 1.5-3 g/l (preferably, about 2.2-2.5 g/l) of sulfuric acid ) electrolytic evaporation (electro-deposition), the metal release layer is directly evaporated and formed on one side of the first metal layer. At this time, the metal vapor deposition amount of the metal release layer may be in the range of about 0.5 to 20 mg/㎡.

As shown in FIG. 2 , the metal components 110a, 110b include second metal layers 113a, 113b formed on the other side of the aforementioned metal release layers 112a, 112b. The second metal layer 113a, 113b is the part that is separated and removed together with the metal release layer 112a, 112b in the separation step, and supports the metal by improving the adhesion between the metal release layer and the insulating part. A release layer that separates the metal release layer from the interface with the first metal layer in the separation step.

The thickness of the second metal layer 113a, 113b is not particularly limited as long as it is thinner than the thickness of the first metal layer 111a, 111b. According to an example, when the thickness of the first metal layer is about 6 to 35 μm, the thickness of the second metal layer may be in a range of about 0.5 to 5 μm.

Such a second metal layer is in the form of a thin metal film made of a conductive substance, and examples of the conductive substance are the same as those described above for the first metal layer. At this time, the composition of the second metal layer may be the same as or different from that of the first metal layer.

(2) Step (S200): Preparation of core member for separation

Referring to FIG. 2 , the separation core member 100 is in the form obtained by laminating the metal members 110a and 110b obtained in the step (S100) on the upper and lower surfaces of the insulating member 120 respectively, and the second metal layer of the metal member 113a and 113b are in contact with and joined to the insulating member 120 . Such a separation core member 100 has the same form as the metal foil laminates in this industry, and delamination is less likely to occur due to physical or thermal shock during the lamination process.

The insulating member 120 functions as a support for the core member for separation, and is removed together with the second metal layers 113a, 113b and the metal release layers 112a, 112b in the separation step. As for the insulating member 120 that can be used in the present invention, as long as it is well known in the industry, it can be used without special limitations, for example, it can be soft materials such as polyimide (PI); (glass fiber), BT, epoxy resin, phenolic resin and other mixed materials of rigid materials. Among them, if a prepreg material (prepreg) in a semi-cured state including epoxy resin resin and glass fiber is used, it will be seamlessly attached to the metal part when it is bonded to the metal part, so that not only can the lamination process The delamination between the layers is minimized, and, in terms of mass production, it is easier to manufacture than other materials.

(3) Step (S300): Formation of a multilayer structure

As shown in FIG. 3 , on each of the first metal layers 111 a and 111 b of the separation core member 100 prepared in the step ( S200 ), a pattern-forming metal layer including insulating layers 211 a and 211 b and one side thereof is laminated. The unit parts 210 a , 210 b of 212 a , 212 b are pressed together to form the multilayer structure 200 . At this time, the insulating layers 211a, 211b are in contact with the first metal layers 111a, 111b.

The multilayer structure 200 includes an insulating layer 211a and a pattern-forming metal layer 212a sequentially stacked on top of the separation core member 100 (that is, the first metal layer 111a ); The insulating layer 211b and the pattern-forming metal layer 212b on the lower surface of the separation core member 110 (that is, the first metal layer 111b).

At this time, the insulating layer and the metal layer for pattern formation are respectively independently arranged on the upper part and the lower part centering on the isolation core member. Therefore, the insulating layer can be divided into an upper insulating layer 211a and a lower insulating layer 211b, respectively, and the pattern-forming metal layer can also be divided into a pattern-forming upper metal layer 212a and a pattern-forming lower metal layer 212b. Next, still another configuration of the present invention that is used for the upper part and the lower part centering on the separation core member can also be similarly distinguished.

The details will be described below with reference to FIG. 3 . The multilayer structure 200 is stacked on the pattern forming lower metal layer 212b in this order of the lower insulating layer 211b, the isolation core member 100, the upper insulating layer 211a, and the pattern forming upper metal layer 212a.

The upper insulating layer 211a and the lower insulating layer 211b are parts that electrically connect the interconnected layers in the final printed circuit board to form the appearance of the printed circuit board and provide durability. Like the insulating member 120 of the aforementioned separation core member 100, the material of such an insulating layer can be a thermosetting resin with adhesive properties, can be a soft material such as polyimide (PI), utilize glass fiber, BT, epoxy resin, etc. , Rigid materials of mixed materials such as phenolic resin, etc. The thermal expansion coefficient may be adjusted by uniformly distributing an inorganic filler, glass fiber, etc. on the entirety of the insulating layer, or the thermal expansion coefficient of a polymer substance and glass fiber may be separately adjusted and used.

According to one example, the upper insulating layer 211a and the lower insulating layer 211b may have the same structure as the insulating member 120 of the separation core member 100, and these 120, 211a, and 211b may be made of semi-cured prepreg material (prepreg )constitute.

The upper metal layer 212a for pattern formation and the lower metal layer 212b for pattern formation can not only perform the function of electrical conduction in the inner layer, but also can function as a heat path. The thickness of the metal layer is not particularly limited, for example, it may be in the range of 9 to 12 μm (1/4 to 1/3 ounce (oz)).

In the present invention, although the lower metal layer 212b for pattern formation, the lower insulating layer 211b, the core member 100 for separation, the upper insulating layer 211a, and the upper metal layer 212a for pattern formation are sequentially stacked in an example, the stacking order of these can be changed as necessary. Cases where they are partially deformed or selectively mixed also fall within the scope of the present invention.

(4) Step (S400): Formation of through-holes

The patterning of the multilayer structure obtained in the step ( S300 ) forms via holes in a region of the metal layer and the insulating layer.

As shown in FIG. 4 , one or more through-holes 213 a , 213 b are formed symmetrically or asymmetrically on the upper and lower portions of the separation core member 100 . At this time, the through holes may be divided into upper through holes 213a and lower through holes 213b.

The through holes can be formed by methods known in the industry. For example, the through hole may be formed by irradiating the portion where the through hole is to be formed with laser light. At this time, there is no special limitation on the position, shape, and number of the through holes, which can be freely adjusted as required.

After forming the through hole, a post-processing process for removing impurities formed on the inner wall during processing the through hole as necessary may be performed.

(5) Step (S500): forming a through hole and a gold-plated layer of the metal layer for pattern formation

After that, gold plating is performed on the through holes 213a, 213b and the metal layers 212a, 212b for pattern formation to form gold plating layers 214a, 214b (see FIG. 5 ). At this time, the gold-plated layers 214a, 214b may be formed on the inner walls of the through-holes 213a, 213b, or filled inside the through-holes 213a, 213b to form the gold-plated layers 214a, 214b. In addition, the metal layer 212a, 212b for pattern formation which forms the said gold-plated layer 214a, 214b is the part of the metal layer 212a, 212b for pattern formation in which the via-hole was not formed.

The method for forming the gold-plated layer is not particularly limited, and it can be performed according to a common method known in the industry.

(6) Step S600: separating two laminated bodies from the multilayered structure

The separation core member except the first metal layer is removed from the multilayer structure obtained in the step (S500) to obtain two laminates with the first metal layer adhered on one side.

As shown in FIG. 6, if the metal release layers 112a, 112b of the separation core member 100 are separated (debonded) from the first metal layers 111a, 111b, the two The second metal layer 113a, 113b and the insulating member 120 remove the two metal release layers 112a, 112b together, and then they can be separated from the multilayer structure 200 to obtain the two metal layers 111a, 111b laminated on one side. stacks 220a, 220b.

According to one example, when the same manufacturing steps are performed on the upper part and the lower part of the separation core member 100, the structures of the respective laminates 220a and 220b separated around the separation core member 100 are identical to each other. At this time, each laminated body 220a, 220b includes insulating layers 211a, 211b and metal layers 212a, 212b for pattern formation on the first metal layers 111a, 111b, and includes: The through holes 213a, 213b of the metal layers 212a, 212b; and the gold plating layers 214a, 214b formed on the through holes 213a, 213b and the metal layers 212a, 212b for pattern formation.

At this time, in the separated laminated bodies 220a, 220b, even if the through holes 213a, 213b are formed in an asymmetrical structure (unbalanced structure) in the vertical direction, since the upper part is maintained centered on the separation core member 100 in the aforementioned manufacturing process, The vertically symmetrical structure between the laminated body and the lower laminated body can thus minimize warpage characteristics that occur during the manufacturing process. In addition, printed circuit boards having various structures can be produced at the same time.

(7) A circuit pattern may be formed on and/or under the laminate separated in the step (S600) case.

According to one example, the laminated body 220a obtained in the step (S600) includes the first metal layer 111a and the gold-plated layer 214a, and a specified Shaped circuit pattern (not shown). At this time, when the gold-plated layer 214a is in the form of a thin film, it can be used as a seed layer (seedlayer), and a second gold-plated layer (not shown) with a desired thickness is further formed on it to form a circuit pattern (not shown). icon).

There is no special limitation on the method of forming the circuit pattern, and it can be performed according to a common method known in the industry.

In this way, after the circuit pattern having a predetermined shape is formed on the laminated body, by further performing the usual printed circuit board manufacturing processes known in the industry on the laminated body, for example, solder resist forming process, etching, etc. And wiring engineering, electronic component placement engineering, etc. to complete the production of printed circuit boards.

The manufacturing method of the above-mentioned printed circuit board does not need to perform the above-described steps in order to manufacture, and according to the design specifications, the steps of each process can be modified or selectively mixed for execution.

On the other hand, the warpage phenomenon of the printed circuit board has a great influence on the process rate and productivity during the mounting of the printed circuit board. Furthermore, this phenomenon may cause transfer errors in the packaging and assembly process. An extremely important factor in defects that replace or render a printed circuit board electrically non-conductive. A printed circuit board is a structure formed by laminating multiple materials. The main cause of the warping phenomenon is the difference in the coefficient of thermal expansion (CTE) of each laminated material. As another cause of the influence, there is a well-known factor of elasticity of each material (Young's modulus ), temperature changes, moisture absorption, mechanical loads, etc. applied in the project.

As mentioned above, since the bending characteristics of the printed circuit board are mainly caused by the difference in thermal expansion and contraction between the laminated materials and the load, in order to reduce the difference, another feature of the present invention is that by changing the laminated material laminated into multiple layers Composition and thickness (dielectric thickness control), thermal expansion coefficient (CTE) and other physical properties to minimize bending characteristics.

For this reason, in the present invention, as one or more insulating layers used in the aforementioned step (S300), those configured to make the resin contents (Resin contents) constituting the insulating layer, the material of the constituting resin, or The composition, the coefficient of thermal expansion (CTE) of the components constituting the insulating layer, and the thickness of the insulating layer are different, or the insulating layers are configured so that all of these are different.

An embodiment of the present invention for controlling the degree of curvature of the printed circuit board is as follows.

The degree of warping of the multilayer structure used to form the printed circuit board or the finally manufactured printed circuit board obtained in each manufacturing step is firstly predicted or measured in advance.

Afterwards, if the predicted or measured bending value is a (+) value, an insulating member having a structure capable of correcting the (+) value is used for the insulating layer used in the subsequent lamination process. For example, an insulating member in which i) the content of resin is adjusted to be less, or ii) the thickness is adjusted to be smaller, or iii) the coefficient of thermal expansion (CTE) is adjusted to be lower, etc. may be used.

Conversely, if the predicted or measured bending value is a (-) value, it can be used later in the lamination engineering: i) the resin content is adjusted higher, or ii) the thermal expansion coefficient is higher, and/or iii) the thickness is adjusted Adjust the higher edge piece to correct for the curvature.

Although the present invention exemplifies bending control by CTE matching of two or more insulating layers stacked in multiple layers, or dielectric thickness control (dielectric thickness control) such as resin content, resin thickness, etc., but other In a coreless printed circuit board that does not use a CCL (copper clad laminate, copper clad laminate) core, the thickness of the metal layer and/or circuit pattern stacked in multiple layers is different from each other to improve The case of bending properties also falls within the scope of the present invention.

As a result, in the present invention, not only the bending phenomenon caused in the aforementioned manufacturing process can be minimized, but also the quality of the printed circuit board forming intermediate obtained in the separation process or the final printed circuit board manufactured can be significantly improved. bending properties.

(8) Optionally, the present invention may further include: cutting the edge of the multilayer structure obtained in the step (S500) Edge steps.

According to another example of the present invention, in addition to the aforementioned steps (S100) to (S600), the method for manufacturing a printed circuit board may further include: before the step (S600), cutting off the multiple Steps on the edges of the layer structure.

Specifically, the unit member used in the step (S300) may have a size (ie, length in the longitudinal direction and in the width direction) larger than or equal to the separation core member. It should be noted that, as shown in FIG. 7, when the size of the unit parts 210a, 210b is larger than the separation core part 100, if the unit parts are stacked on both sides of the separation core part and pressed tightly, then The insulating layer material of the unit part will surround the edge of the separating core part. In this case, the edge X of the multilayer structure 300 needs to be removed by cutting before the separation step.

Thereafter, as described above in the step (S600), by separating in the multilayer structure 200 and removing the separation core member 100 (except for the first metal layers 111a, 111b), the first metal layer laminated on one side can be obtained. Two laminated bodies 310a, 310b of 111a, 111b.

(9) Optionally, the present invention may further include: a step of forming guide holes in the multilayer structure.

According to another example of the present invention, in addition to the aforementioned steps (S100) to (S600), the method for manufacturing a printed circuit board may further include before the step (S300): A step of forming a first guide hole for layer-to-layer mutual registration (registration) in a printed circuit board by penetrating the core member in the vertical direction of the core member for separation; before the step (S400) It may also include: using X-rays to identify the first guide hole inside the multilayer structure obtained in the step (S300), and forming a second guide hole vertically penetrating at the edge of the multilayer structure; and Before the step (S600), it may further include: a step of cutting the edge of the multilayer structure obtained in the step (S500). In the present invention, by forming the first guide hole and the second guide hole, the registration between layers in the printed circuit board is improved, so that the occurrence rate of disconnection between layers or short circuit between wirings can be minimized, Furthermore, reliability can be improved.

As shown in FIGS. 8 and 9 , the first guide hole 131 is formed vertically penetrating through the edge of the separation core member 100 obtained in the step ( S200 ) (see (b) of FIG. 8 ). Thereafter, the unit members 210a and 210b are stacked on the upper and lower surfaces of the separation core member formed with the first guide hole 131, respectively, and compressed to form a multilayer structure 400 (see FIG. 8(c)). At this time, the inside of the first guide hole 131 is filled with the material (for example, thermosetting resin, prepreg material) of the insulating layers 211a, 211b of the unit component. In addition, optionally, when the size of the unit parts 210a, 210b is larger than the size of the separation core part 100, as shown in FIG. 8, the insulating layer material of the unit parts will surround the edge of the separation core part. Afterwards, the first guide hole 131 of the multilayer structure 400 is identified by X-rays, and the second guide hole 132 vertically penetrating the multilayer structure 400 is formed (see (d) of FIG. 8 ). At this time, the second guide hole 132 may be formed in a region corresponding to the position of the first guide hole 131, or may be separated from the first guide hole 131 and formed on the edge of the multilayer structure. area. After that, as described above in the step (S400), via holes 213a, 213b are formed in a region of the insulating layer and the metal layer for pattern formation of the multilayer structure, and the via holes and the metal layer for pattern formation are formed. Layers of gold are plated to form gold plated layers 214a, 214b. At this time, the inner wall of the second guide hole 132 is also plated with gold (see FIG. 8( d )). Next, the edge region (Y) of the multilayer structure 400 is removed by cutting along the inner side of the first guide hole 131 (see (f) of FIG. 9 ). Thereafter, as described above in the step (S600), by separating from the multilayer structure 400 and removing the separation core member 100 (except for the first metal layers 111a, 111b), the first metal layer laminated on one side can be obtained. Two laminated bodies 410a and 410b of 111a and 111b (see (g) of FIG. 9 ).

After the first guide hole and the second guide hole are formed, desmearing and deburring can be selectively performed to remove pollutants on the inner wall of the hole and the substrate.

<Printed circuit board>

In another aspect, the present invention provides a printed circuit board manufactured according to the aforementioned method for manufacturing a printed circuit board.

As an example, the printed circuit board includes a first metal layer 111a, an insulating layer 211a, and a metal layer 212a for pattern formation in sequence, and has a through hole 213a formed in the insulating layer 211a and the metal layer 212a for pattern formation; and Formed on the metal layer 212a where the through hole is not formed and the gold plating layer 214a of the through hole 213a. Such a printed circuit board can be manufactured in accordance with a method of manufacturing a double-sided printed circuit board known in the industry.

Although the above has been described centering on the embodiment, this is only an example, and is not intended to limit the present invention. Those skilled in the art of the present invention can implement it without departing from the essential characteristics of the present embodiment. Various modifications and applications not illustrated above. For example, each constituent element specifically presented in the embodiment may be implemented with modifications. Also, points of difference related to such modifications and applications should be construed as falling within the scope of the present invention defined in the appended claims.

Claims (15)

1. A method for manufacturing a printed circuit board, comprising: The step of preparing a metal part sequentially comprising a first metal layer, a metal release layer, and a second metal layer whose thickness is thinner than the first metal layer (S100); The step of preparing the separation core member by stacking the metal member on the upper surface and the lower surface of the insulating member so that the second metal layer is in contact with the insulating member (S200); a step of laminating unit members including an insulating layer and a metal layer for pattern formation on each of the first metal layers of the separation core member to form a multilayer structure (S300); A step of forming a via hole in a region of the insulating layer and the metal layer for pattern formation (S400); A step of forming a gold-plated layer by performing gold-plating on the through hole and the metal layer for pattern formation (S500); and separating the metal release layer and the first metal layer of the separation core member from the multilayer structure obtained in the step (S500), and removing the metal release layer together with the second metal layer and the insulating member, Thereby, the step of separately separating to obtain two laminated bodies with the first metal layer adhered thereto (S600). 2. The method of manufacturing a printed circuit board according to claim 1, wherein Before the step (S600), it further includes: a step of cutting off the edge region of the multilayer structure obtained in the step (S500). 3. The method of manufacturing a printed circuit board according to claim 2, wherein Before the step (S300), it also includes: the separation core component obtained in the step (S200) penetrates in the vertical direction of the separation core component to form an interlayer registration for the printed circuit board the steps of the first pilot hole; and Before the step (S400), it also includes: using X-rays to identify the first guide hole inside the multilayer structure obtained in the step (S300), and forming a vertical through hole at the edge of the multilayer structure Second pilot hole steps. 4. The method of manufacturing a printed circuit board according to claim 1, wherein The metal release layer is selected from the group consisting of chromium, nickel, zinc, molybdenum, tungsten, cobalt, lead, silver, tantalum, copper, aluminum, manganese, iron, titanium, tin, steel, zinc and vanadium At least one formed. 5. The method of manufacturing a printed circuit board according to claim 1, wherein The vapor deposition amount of the metal release layer is 0.5 to 20 mg/㎡. 6. The method of manufacturing a printed circuit board according to claim 1, wherein The thickness of the first metal layer is in the range of 6 to 35 μm, and the thickness of the second metal layer is in the range of 0.5 to 5 μm. 7. The method of manufacturing a printed circuit board according to claim 1, wherein concavo-convex portions are formed on the surface of the first metal layer in contact with the insulating layer of the unit component, The average roughness of the concavo-convex portion is in the range of 3.0 to 6.5 μm, and the bonding strength between the insulating layer and the first metal layer is in the range of 0.8 to 3.0 N/mm. 8. The method of manufacturing a printed circuit board according to claim 1, wherein When separating the metal release layer from the first metal layer, the release force between the metal release layer and the first metal layer is in the range of 10 to 90 N/m. 9. The method of manufacturing a printed circuit board according to claim 1, wherein The structures of the laminated bodies respectively separated around the core member for separation are identical to each other. 10. A printed circuit board, characterized in that, Manufactured by the method of any one of claims 1 to 9. 11. A multilayer structure for forming a printed circuit board, characterized in that it comprises: A separation core member comprising an insulating member and metal members laminated on and under the insulating member, respectively; and a unit part which is laminated on the upper side and the lower side of the separation core part respectively, and which sequentially includes an insulating layer and a metal layer for pattern formation, The metal part sequentially includes: a first metal layer in contact with the insulating layer; a metal release layer; and a second metal layer thinner than the first metal layer and in contact with the insulating part. 12. The multilayer structure for forming a printed circuit board according to claim 11, wherein, On the edge of the separation core part, a first guide hole for mutual registration between layers in the printed circuit board is formed vertically through, A vertically penetrating second guide hole is formed on the edge of the multilayer structure. 13. The multilayer structure for forming a printed circuit board according to claim 11, wherein, The metal release layer is separated from the first metal layer by a force of 10 to 90 N/m. 14. The multilayer structure for forming a printed circuit board according to claim 11, wherein, Concave-convex portions are formed on the surface of the first metal layer in contact with the insulating layer of the unit component. 15. A printed circuit board characterized in that, A multilayer structure for forming a printed circuit board according to any one of claims 11 to 14 is included.