CN110085647A - A kind of packaging method and package system - Google Patents
A kind of packaging method and package system Download PDFInfo
- Publication number
- CN110085647A CN110085647A CN201910394450.6A CN201910394450A CN110085647A CN 110085647 A CN110085647 A CN 110085647A CN 201910394450 A CN201910394450 A CN 201910394450A CN 110085647 A CN110085647 A CN 110085647A
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- packaged
- cover board
- preset quantity
- stored
- substrate
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- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 238000005538 encapsulation Methods 0.000 claims description 27
- 239000000565 sealant Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 26
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000012536 packaging technology Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 19
- 238000011144 upstream manufacturing Methods 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Packages (AREA)
- Slot Machines And Peripheral Devices (AREA)
Abstract
The embodiment of the present invention provides a kind of packaging method and package system, belongs to field of display technology, can solve existing packaging technology can only encapsulate the display product of single model, the problem of influencing production efficiency, be unfavorable for cost control.Packaging method provided in an embodiment of the present invention, comprising: the cover board to be packaged of preset quantity is pre-stored；Wherein, at least partly model is different in the cover board to be packaged of the preset quantity；According to the type information of current substrate to be packaged, the cover board to be packaged of corresponding model is chosen from the cover board to be packaged of pre-stored preset quantity；The current substrate to be packaged be bonded box with the cover board to be packaged of corresponding model.
Description
Technical field
The invention belongs to field of display technology, and in particular to a kind of packaging method and package system.
Background technique
With the continuous development of display panel encapsulation technology, production efficiency and cost control that industry encapsulates display panel
The requirement of system is increasingly stringenter.Current packaging technology mainly from a substrate production line and a cover board production line jointly with
Complete, produce a kind of substrate to be packaged of model on substrate production line, produced simultaneously on cover board production line corresponding model to
The substrate of this kind of model is packaged to form display product by encapsulation cover plate with the cover board of corresponding model.
However, current packaging technology can only encapsulate the display product of single model, cause to pass through steaming on substrate production line
The substrate that depositing process is formed can only be produced serially, and flexibility is poor, can not flexibly be coped with small lot production, be influenced production efficiency.
Also, it is mainly worked at the same time at present using single-chamber room two-shipper platform, needs disposable two sets of mask plates, only encapsulate single model
Display product, it is lower to the utilization rate of mask plate, be unfavorable for the cost control of packaging technology.
Summary of the invention
The present invention is directed at least solve one of the technical problems existing in the prior art, a kind of packaging method and encapsulation are provided
System.
Solving technical solution used by present invention problem is a kind of packaging method, comprising:
The cover board to be packaged of preset quantity is pre-stored；Wherein, in the cover board to be packaged of the preset quantity at least
Some models are different；
According to the type information of current substrate to be packaged, chooses and correspond to from the cover board to be packaged of pre-stored preset quantity
The cover board to be packaged of model；
The current substrate to be packaged be bonded box with the cover board to be packaged of corresponding model.
Optionally, the cover board to be packaged to preset quantity is pre-stored, comprising:
Obtain the type information of substrate to be packaged；
According to the type information of the substrate to be packaged, the type information of corresponding cover board to be packaged is generated；
According to the type information of cover board to be packaged generated, preset quantity cover board to be packaged is pre-stored.
Optionally, the current substrate to be packaged paste box with the cover board to be packaged of the corresponding model described
After conjunction, further includes:
Obtain the first quantity of presently described cover board to be packaged；
Judge whether first quantity is lower than preset threshold；
If first quantity is lower than the preset threshold, the various types of cover boards to be packaged of the second quantity are carried out pre-
Storage；The sum of first quantity and second quantity are equal to the preset quantity.
Optionally, before the cover board to be packaged to preset quantity is pre-stored, further includes:
Pre-packaged processing is carried out to the cover board to be packaged of the preset quantity.
Optionally, the cover board to be packaged to preset quantity carries out pre-packaged processing, comprising:
The cover board to be packaged of the preset quantity is cleaned；
Sealant coating is carried out to the cover board to be packaged of the preset quantity.
Optionally, it is described the target base plate be bonded box with the target cover board after, further includes:
The substrate to be packaged being bonded to box is subjected to ultra-violet curing with the cover board to be packaged of corresponding model.
Solving technical solution used by present invention problem is a kind of package system, comprising:
Pre-storing unit is pre-stored for the cover board to be packaged to preset quantity；Wherein, the preset quantity to
At least partly model is different in encapsulation cover plate；
Selection unit, for the type information according to current substrate to be packaged, from the to be packaged of pre-stored preset quantity
The cover board to be packaged of corresponding model is chosen in cover board；
It is bonded unit, for paste box with the cover board to be packaged of the corresponding model the current substrate to be packaged
It closes.
Optionally, the pre-storing unit includes:
First acquisition unit, for obtaining the type information of substrate to be packaged；
Generation unit generates the model of corresponding cover board to be packaged for the type information according to the substrate to be packaged
Information；
Pre-stored subelement, for the type information according to cover board to be packaged generated, by preset quantity lid to be packaged
Plate is pre-stored.
Optionally, the package system further include:
Second acquisition unit, for obtaining the first quantity of presently described cover board to be packaged；
Judging unit, for judging whether first quantity is lower than preset threshold；
Supplementary units, if for first quantity be lower than the preset threshold, by the second quantity it is various types of to
Encapsulation cover plate is pre-stored；The sum of first quantity and second quantity are equal to the preset quantity.
Optionally, the package system further include:
Solidified cell, for that will be carried out to the substrate to be packaged that box is bonded with the cover board to be packaged of corresponding model
Ultra-violet curing.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of packaging method provided in an embodiment of the present invention；
Fig. 2 is that the cover board to be packaged of a kind of pair of preset quantity provided in an embodiment of the present invention carries out the stream of pre-stored method
Journey schematic diagram；
Fig. 3 is the flow diagram of another packaging method provided in an embodiment of the present invention；
Fig. 4 is the flow diagram of another packaging method provided in an embodiment of the present invention；
Fig. 5 is the method that the cover board to be packaged of a kind of pair of preset quantity provided in an embodiment of the present invention carries out pre-packaged processing
Flow diagram；
Fig. 6 is the flow diagram of another packaging method provided in an embodiment of the present invention；
Fig. 7 is a kind of structural schematic diagram of package system provided in an embodiment of the present invention；
Fig. 8 is a kind of structural schematic diagram of pre-storing unit provided in an embodiment of the present invention；
Fig. 9 is the structural schematic diagram of another package system provided in an embodiment of the present invention；
Figure 10 is the structural schematic diagram of another package system provided in an embodiment of the present invention.
Description of symbols:
701- pre-storing unit, 702- selection unit, 703- fitting unit, 704- second acquisition unit, 705- judgement are single
The pre-stored son of member, 706- supplementary units, 707- solidified cell, 7011- first acquisition unit, 7012- generation unit and 7013-
Unit.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention, with reference to the accompanying drawing and specific embodiment party
Present invention is further described in detail for formula.
Embodiment one
The embodiment of the invention provides a kind of packaging method, which is displayed for the encapsulation of panel, can be with
Display panel (OLED, organic electroluminescence display) is sent a telegraph for organic light emission, or liquid crystal
Display panel (LCD, liquid crystal display) can also be other kinds of display panel, it is not limited here.This
Outside, which can be also used for the encapsulation of the battery products such as photovoltaic device.Below by taking display panel as an example, to the encapsulation side
Method describes in detail.Fig. 1 is a kind of flow diagram of packaging method provided in an embodiment of the present invention, as shown in Figure 1, the envelope
Dress method includes:
S101 is pre-stored the cover board to be packaged of preset quantity；Wherein, in the cover board to be packaged of preset quantity at least
Some models are different.
S102 is selected from the cover board to be packaged of pre-stored preset quantity according to the type information of current substrate to be packaged
Take the cover board to be packaged of corresponding model.
Current substrate to be packaged be bonded box with the cover board to be packaged of corresponding model by S103.
It should be noted that utilizing packaging method provided in an embodiment of the present invention, upstream head board assembly line in above-mentioned S101
Various types of cover boards to be packaged can be produced simultaneously, and the cover board to be packaged that can temporarily produce upstream head board assembly line carries out
It is pre-stored, until pre-stored cover board quantity to be packaged reaches preset quantity.The preset quantity can need for a production batch
The quantity wanted can also flexibly be set according to user demand, to guarantee the efficiency of encapsulation.
In above-mentioned S102, upstream substrate production line can be transmitted downwards the type information of the substrate to be packaged of production, can
Type information with the substrate to be packaged transmitted according to upstream substrate production line, obtains the model of matching cover board to be packaged
Information selects the cover board to be packaged of model corresponding with currently substrate to be packaged from pre-stored cover board to be packaged.
It is in above-mentioned S103, the substrate to be packaged for being provided with the devices such as display element, driving circuit is corresponding with selection
Cover board to be packaged be bonded to box, and box thickness can be configured according to product situation, realizes protection of the cover board to substrate, complete
At the encapsulation of panel.
Packaging method provided in an embodiment of the present invention, can by being pre-stored to various types of cover boards to be packaged,
When being packaged, cover board corresponding with substrate to be packaged is chosen from pre-stored cover board to be packaged, may be implemented simultaneously
The mixes line production for producing various types of display panels improves the flexibility of production, avoids and only produces a kind of showing for model
The waste for showing product, improves production efficiency.
The packaging method provided based on the above embodiment carries out the packaging method below in conjunction with attached drawing further detailed
Explanation.
Embodiment two
The embodiment of the invention provides the cover boards to be packaged of a kind of pair of preset quantity to carry out pre-stored method, and Fig. 2 is this
The cover board to be packaged for a kind of pair of preset quantity that inventive embodiments provide carries out the flow diagram of pre-stored method, such as Fig. 2
It is shown, this method comprises:
S201 obtains the type information of substrate to be packaged.
S202 generates the type information of corresponding cover board to be packaged according to the type information of the substrate to be packaged.
Preset quantity cover board to be packaged is pre-stored by S203 according to the type information of cover board to be packaged generated.
It should be noted that the type information for the substrate to be packaged that upstream substrate production line transmits downwards is obtained, due to one
The model of substrate is corresponding with the model of cover board in a display product, obtains the type information of substrate to be packaged, then can be with
According to the type information of substrate to be packaged, the type information of corresponding cover board to be packaged is generated, that is, obtains what needs were pre-stored
The model of cover board to be packaged.Cover board to be packaged with the specified model is pre-stored, until pre-stored cover board to be packaged
Quantity reaches preset quantity.
The method being pre-stored using cover board to be packaged provided in an embodiment of the present invention, can be according to the demand of substrate to be packaged
Amount, is pre-stored cover board to be packaged, to realize the mixes line production of display product, single model is avoided to show production
Caused by waste, improve production efficiency.
Embodiment three
The embodiment of the invention provides another packaging method, Fig. 3 is another encapsulation side provided in an embodiment of the present invention
The flow diagram of method, as shown in figure 3, the packaging method includes:
S101 is pre-stored the cover board to be packaged of preset quantity；Wherein, in the cover board to be packaged of preset quantity at least
Some models are different.
S102 is selected from the cover board to be packaged of pre-stored preset quantity according to the type information of current substrate to be packaged
Take the cover board to be packaged of corresponding model.
Current substrate to be packaged be bonded box with the cover board to be packaged of corresponding model by S103.
S104 obtains the first quantity of current cover board to be packaged.
S105, judges whether the first quantity is lower than preset threshold.
If the first quantity is lower than the preset threshold, S106 is executed；If the first quantity is not less than the preset threshold, execute
S102。
The various types of cover boards to be packaged of second quantity are pre-stored by S106；The sum of first quantity and the second quantity
Equal to preset quantity.
It should be noted that in above-mentioned S104, with the use for treating encapsulation cover plate in production, pre-stored lid to be packaged
The quantity of plate can gradually decrease, in order to avoid the quantity as cover board to be packaged it is very few caused by production disruption, need in real time it is right
First quantity of current cover board to be packaged is monitored, to obtain the first quantity of current cover board to be packaged.
In above-mentioned S105, a threshold value can be preset to the quantity of pre-stored cover board to be packaged, i.e., cover board to be packaged
Quantity lower limit.When the quantity of cover board to be packaged is higher than the threshold value, then normal execute encapsulation production technology.When lid to be packaged
When the quantity of plate is lower than the threshold value, in order to guarantee normal production process for encapsulating, need to mend remaining cover board to be packaged
It fills.
In above-mentioned S106, the cover board to be packaged of the second quantity can be supplemented, so that the quantity of cover board to be packaged is mended
Reach preset quantity after filling, realize automatic continuous production, guarantees production efficiency.
Example IV
The embodiment of the invention provides another packaging method, Fig. 4 is another encapsulation side provided in an embodiment of the present invention
The flow diagram of method, the packaging method include:
S401 carries out pre-packaged processing to the cover board to be packaged of preset quantity.
S101 is pre-stored the cover board to be packaged of preset quantity；Wherein, in the cover board to be packaged of preset quantity at least
Some models are different.
S102 is selected from the cover board to be packaged of pre-stored preset quantity according to the type information of current substrate to be packaged
Take the cover board to be packaged of corresponding model.
Current substrate to be packaged be bonded box with the cover board to be packaged of corresponding model by S103.
It should be noted that needing to treat encapsulation cover plate before treating encapsulation cover plate and be pre-stored and carrying out pre-packaged place
Reason, with guarantee pre-stored cover board to be packaged meet with the matched requirement of substrate to be packaged, be subsequent cover board to be packaged with wait seal
It fills being bonded to box for substrate and convenience is provided, improve production efficiency.
Embodiment five
The embodiment of the invention provides the method that the cover board to be packaged of a kind of pair of preset quantity carries out pre-packaged processing, Fig. 5
For a kind of pair of preset quantity provided in an embodiment of the present invention cover board to be packaged carry out pre-packaged processing method process signal
Figure, as shown in figure 5, this method comprises:
S501 cleans the cover board to be packaged of preset quantity.
S502 carries out sealant coating to the cover board to be packaged of preset quantity.
It should be noted that the pretreatment for treating encapsulation cover plate may include treating encapsulation cover plate to be cleaned, treat envelope
Capping plate carries out sealant coating, can also treat encapsulation cover plate and carry out other pre-packaged processing in the prior art, right at this
Specific pre-packaged processing mode is without limiting.
Embodiment six
The embodiment of the invention provides another packaging method, Fig. 6 is another encapsulation side provided in an embodiment of the present invention
The flow diagram of method, as shown in fig. 6, the packaging method includes:
S101 is pre-stored the cover board to be packaged of preset quantity；Wherein, in the cover board to be packaged of preset quantity at least
Some models are different.
S102 is selected from the cover board to be packaged of pre-stored preset quantity according to the type information of current substrate to be packaged
Take the cover board to be packaged of corresponding model.
Current substrate to be packaged be bonded box with the cover board to be packaged of corresponding model by S103.
The substrate to be packaged being bonded to box is carried out ultra-violet curing with the cover board to be packaged of corresponding model by S601.
It should be noted that by ultraviolet light irradiate etc. modes to substrate to be packaged after being bonded to box and corresponding model to
Encapsulation cover plate is solidified, so that the sealant between substrate to be packaged and cover board to be packaged is solidified, realizes the patch of the two
It closes.It is understood that can also be solidified by modes such as heating cure or spontaneous curings, it is not limited here.
Based on the same inventive concept, the embodiment of the invention also provides a kind of package systems, below in conjunction with attached drawing, to this
Package system is further elaborated.
Embodiment seven
The embodiment of the invention provides a kind of package system, Fig. 7 is a kind of package system provided in an embodiment of the present invention
Structural schematic diagram, as shown in fig. 7, the package system includes: pre-storing unit 701, selection unit 702 and fitting unit 703.
Pre-storing unit 701 is pre-stored for the cover board to be packaged to preset quantity；Wherein, preset quantity to
At least partly model is different in encapsulation cover plate；
Selection unit 702, for the type information according to current substrate to be packaged, from pre-stored preset quantity wait seal
The cover board to be packaged of corresponding model is chosen in capping plate；
It is bonded unit 703, for be bonded box with the cover board to be packaged of corresponding model current substrate to be packaged.
It is understood that the packaging method that package system provided in an embodiment of the present invention and above-described embodiment one provide
Implementation is similar, and details are not described herein.
Embodiment eight
The embodiment of the invention provides a kind of pre-storing unit, Fig. 8 is provided in an embodiment of the present invention a kind of pre-stored single
The structural schematic diagram of member, as shown in figure 8, the pre-storing unit includes: first acquisition unit 7011, generation unit 7012 and prestores
Store up subelement 7013.
First acquisition unit 7011, for obtaining the type information of substrate to be packaged；
Generation unit 7012 generates the model of corresponding cover board to be packaged for the type information according to substrate to be packaged
Information；
Preset quantity is waited sealing by pre-stored subelement 7013 for the type information according to cover board to be packaged generated
Capping plate is pre-stored.
It is understood that the lid to be packaged that pre-storing unit provided in an embodiment of the present invention and above-described embodiment two provide
The realization principle of the pre-stored method of plate is similar, and details are not described herein.
Embodiment nine
The embodiment of the invention provides another package system, Fig. 9 is another encapsulation system provided in an embodiment of the present invention
The structural schematic diagram of system, as shown in figure 9, the package system includes: pre-storing unit 701, selection unit 702, fitting unit
703, second acquisition unit 704, judging unit 705 and supplementary units 706.
Pre-storing unit 701 is pre-stored for the cover board to be packaged to preset quantity；Wherein, preset quantity to
At least partly model is different in encapsulation cover plate；
Selection unit 702, for the type information according to current substrate to be packaged, from pre-stored preset quantity wait seal
The cover board to be packaged of corresponding model is chosen in capping plate；
It is bonded unit 703, for be bonded box with the cover board to be packaged of corresponding model current substrate to be packaged.
Second acquisition unit 704, for obtaining the first quantity of current cover board to be packaged.
Judging unit 705, for judging whether the first quantity is lower than preset threshold.
Supplementary units 706, if being lower than preset threshold for the first quantity, by the various types of lids to be packaged of the second quantity
Plate is pre-stored；The sum of first quantity and the second quantity are equal to preset quantity.
Package system provided in an embodiment of the present invention is similar with the realization principle of packaging method that above-described embodiment three provides,
Details are not described herein.
Embodiment ten
The embodiment of the invention provides another package system, Figure 10 is another encapsulation system provided in an embodiment of the present invention
The structural schematic diagram of system, as shown in Figure 10, the package system include: pre-storing unit 701, selection unit 702, fitting unit
703 and solidified cell 707.
Pre-storing unit 701 is pre-stored for the cover board to be packaged to preset quantity；Wherein, preset quantity to
At least partly model is different in encapsulation cover plate；
Selection unit 702, for the type information according to current substrate to be packaged, from pre-stored preset quantity wait seal
The cover board to be packaged of corresponding model is chosen in capping plate；
It is bonded unit 703, for be bonded box with the cover board to be packaged of corresponding model current substrate to be packaged.
Solidified cell 707, it is ultraviolet for that will be carried out to the substrate to be packaged that box is bonded with the cover board to be packaged of corresponding model
Solidification.
Package system provided in an embodiment of the present invention is similar with the realization principle of packaging method that above-described embodiment six provides,
Details are not described herein.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, essence of the invention is not being departed from
In the case where mind and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of packaging method characterized by comprising
The cover board to be packaged of preset quantity is pre-stored；Wherein, in the cover board to be packaged of the preset quantity at least partly
Model is different；
According to the type information of current substrate to be packaged, corresponding model is chosen from the cover board to be packaged of pre-stored preset quantity
Cover board to be packaged；
The current substrate to be packaged be bonded box with the cover board to be packaged of corresponding model.
2. packaging method according to claim 1, which is characterized in that the cover board to be packaged to preset quantity carries out pre-
Storage, comprising:
Obtain the type information of substrate to be packaged；
According to the type information of the substrate to be packaged, the type information of corresponding cover board to be packaged is generated；
According to the type information of cover board to be packaged generated, preset quantity cover board to be packaged is pre-stored.
3. packaging method according to claim 1, which is characterized in that it is described by the current substrate to be packaged with it is described
The cover board to be packaged of corresponding model carries out after being bonded to box, further includes:
Obtain the first quantity of presently described cover board to be packaged；
Judge whether first quantity is lower than preset threshold；
If first quantity is lower than the preset threshold, the various types of cover boards to be packaged of the second quantity are prestored
Storage；The sum of first quantity and second quantity are equal to the preset quantity.
4. packaging method according to claim 1, which is characterized in that carried out in the cover board to be packaged to preset quantity
Before pre-stored, further includes:
Pre-packaged processing is carried out to the cover board to be packaged of the preset quantity.
5. packaging method according to claim 4, which is characterized in that the cover board to be packaged to preset quantity carries out pre-
Encapsulation process, comprising:
The cover board to be packaged of the preset quantity is cleaned；
Sealant coating is carried out to the cover board to be packaged of the preset quantity.
6. packaging method according to claim 4, which is characterized in that described by the target base plate and the target lid
Plate carries out after being bonded to box, further includes:
The substrate to be packaged being bonded to box is subjected to ultra-violet curing with the cover board to be packaged of corresponding model.
7. a kind of package system characterized by comprising
Pre-storing unit is pre-stored for the cover board to be packaged to preset quantity；Wherein, the preset quantity is to be packaged
At least partly model is different in cover board；
Selection unit, for the type information according to current substrate to be packaged, from the cover board to be packaged of pre-stored preset quantity
The middle cover board to be packaged for choosing corresponding model；
It is bonded unit, for be bonded box with the cover board to be packaged of the corresponding model the current substrate to be packaged.
8. package system according to claim 7, which is characterized in that the pre-storing unit includes:
First acquisition unit, for obtaining the type information of substrate to be packaged；
Generation unit generates the type information of corresponding cover board to be packaged for the type information according to the substrate to be packaged；
Pre-stored subelement, for the type information according to cover board to be packaged generated, by preset quantity cover board to be packaged into
Row is pre-stored.
9. package system according to claim 7, which is characterized in that further include:
Second acquisition unit, for obtaining the first quantity of presently described cover board to be packaged；
Judging unit, for judging whether first quantity is lower than preset threshold；
Supplementary units, it is if being lower than the preset threshold for first quantity, the second quantity is various types of to be packaged
Cover board is pre-stored；The sum of first quantity and second quantity are equal to the preset quantity.
10. package system according to claim 7, which is characterized in that further include:
Solidified cell, it is ultraviolet for that will be carried out to the substrate to be packaged that box is bonded with the cover board to be packaged of corresponding model
Solidification.
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