CN110079782A - A kind of production facility and the method that coated substrate is manufactured in the production facility - Google Patents

Abstract

The invention relates to a production facility comprising at least one inline coating machine in which substrates are carried by a substrate carrier coated with a film and comprising conditioning equipment for removing the film from the carrier. The purpose of the present invention is to propose a production facility with an inline coating machine to achieve high manufacturing speeds. This object is solved by a production facility comprising a carrier transfer system for transferring carriers to a membrane erosion cleaning module, and by a corresponding manufacturing method.

Description

Production facility and method of manufacturing coated substrates in the production facility

The invention relates to a production facility comprising at least one PVD (Physical Vapor Deposition) inline coating machine and/or at least one CVD (Chemical Vapor Deposition) inline coating machine, wherein the inline coating The substrate in the cloth machine is carried by a substrate carrier, the carrier and the substrate on the carrier are coated with the film during the conditioning device for removing the film from the carrier and the coating step of the method of manufacturing the coated substrate. The invention also relates to a method of manufacturing a substrate coated with a film using such a production facility, wherein the method comprises coating the film on a carrier and in at least one PVD coating chamber and/or at least one CVD coating chamber. Coating step on a substrate in a carrier.

Production facilities with inline coating machines are used in the industrial production of coated substrates, for example in the production of solar cells. A smooth and cost-effective production process is an existing need. A high quality film free of particle related defects is a further requirement.

The substrate carrier can receive multiple substrates in order to achieve high production speeds by coating multiple substrates at once. Usually the carrier is also coated together with the substrate. The carrier is reused. Depending on the multiple coatings, a large film thickness is formed on the carrier. This high thickness may interfere with fabrication methods.

Therefore, the carrier must be cleaned regularly. Various cleaning methods are known in the art, for example, chemical methods and mechanical methods. Cleaning can be done at an external cleaning service provider or at the manufacturer's cleaning department. For cleaning machine parts, various methods are used which are adapted to the particular object to be cleaned. DE 10 2010 060 664 A1 describes a mechanical cleaning and conditioning unit with a vacuum suction ejection unit, in which a particle-laden air flow is used to erode the membrane. During cleaning in this unit, a sacrificial substrate must be used on the carrier in order to avoid impermissible erosion of the carrier, especially at the unprotected edges of the carrier.

The film on the carrier may flake off, producing undesirable particles or 2D film ablation (also known as chipping or debris). Equipment for removing loose or weakly cohesive particles is known in the prior art. Those devices can clean substrate carriers while they are conveyed therethrough. WO 2013/017971 A1 describes a substrate and/or substrate carrier cleaning module with an ionized air curtain and a particle suction. DE 43 10 258 A1 describes a production facility for the plasma deposition of polymer coatings on headlight reflectors. The production facility includes a return system for substrate carriers that includes a cleaning module where debris is removed by rotating brushes. These tools will not remove the membrane.

Particles are not only a problem with thick films on substrate carriers. The membrane is partially porous such that when the membrane is in contact with atmospheric humidity outside the deposition chamber, the membrane absorbs water. The water in the porous membrane must be evacuated during subsequent evaporation. This consumes time and slows down the manufacturing process. In these cases, a low film thickness on the carrier is desired. High frequency cleaning outside of production facilities requires multiple carriers per facility and complex carrier logic.

US 2015/0368793 A1 describes a processing setup in which a processing chamber contains a deposition area and an area for removing coating material from a substrate carrier. The cleaning zone includes a radiant heater for heating at least one surface of the substrate carrier and for evaporating coating material from the substrate carrier. Thermal evaporation may only be suitable for selected coating materials, such as low melting point metals, at high temperatures above 500°C and at low pressures in vacuum chambers. Cleaning areas in vacuum deposition chambers require additional space. Therefore, the deposition chamber must have a large volume, and the emptying time of the chamber becomes long. Large chambers with many internal parts are expensive to manufacture. Maintenance of these chambers is also complex and expensive. Furthermore, many coating materials, such as many metal oxides, cannot be evaporated in the temperature range between 500°C and 1000°C.

The object of the present invention is to propose a production facility with an inline coating machine for high production speeds and a simple method of producing coated substrates in the production facility.

This object is solved by a production facility comprising a carrier transfer system for transferring carriers to and from a carrier conditioning device comprising a membrane erosion cleaning module Sent back for use in a further coating step, wherein the conveyor system is configured to incorporate a carrier cleaning step into the manufacturing process.

The production facility according to the invention incorporates a carrier cleaning step into the manufacturing process by using a carrier transfer system that transfers the coated substrate carrier to a conditioning apparatus having at least one membrane erosion cleaning module, wherein The substrate carrier will be cleaned. Cleaned in the conditioning facility, the correspondingly conditioned substrate carrier is then fed back for further use in a deposition step in the manufacturing process.

The transfer system can be a partially automated or fully automated system. Less material builds up on the substrate carriers of the production facility according to the invention than in conventional production facilities of the prior art. By avoiding thick film stacking, film graining and grain fragmentation are all but avoided. Due to the less porous membrane material, less water accumulates at the surface of the substrate carrier. Fast turnaround times for substrates, short work times and ultimately fast methods of producing many coated substrates per unit of time are the resulting benefits.

Since the carrier is cleaned directly in the production facility, it does not have to be removed from the production facility and is not replaced by a cleaned carrier. Therefore, the complex carrier logic required in the prior art is not applicable.

The carrier conditioning device of the production facility according to the invention comprises a membrane erosion cleaning module. In the membrane erosion cleaning module, the coating on the substrate carrier is at least partially removed. The coating on the carrier can be deposited in one run or in multiple runs. The removal depends on several influencing variables, such as the material from the carrier, the membrane material and the cleaning method used. In some cases, the entire film thickness can be removed in one method step, for example, by inducing ablation of the entire film from its base. In other cases, the film is gradually removed, for example, by mechanical erosion of the film or by gradually etching the film thickness. It is possible to remove only some of all film layers so that the coating remains on the carrier after cleaning.

In some embodiments, the substrate carrier can be fully conditioned by cleaning for subsequent deposition methods. In other embodiments, other conditioning steps are performed in addition to cleaning in the carrier conditioning apparatus. Overall, the adjustment of the carrier can be carried out in several sub-steps. Conditioning substeps can also be placed before cleaning steps. Equipment modules can be assigned to method substeps. The carrier conditioning device may comprise an aftertreatment module arranged after the cleaning module on its way through the conditioning device. In an exemplary embodiment, the post-processing module is a cleaning module which is arranged after the etching module and removes etching residues. Furthermore, the carrier conditioning device may comprise a pretreatment module at the end of the path through the carrier conditioning device. The carrier can be pretreated in a pretreatment module such that subsequent deposition steps and/or subsequent carrier cleaning steps are performed in an improved manner due to the pretreatment of the carrier. In various exemplary embodiments, the pretreatment is surface corrugation, polishing, wetting, coating with a film material, an adhesive primer, or a non-stick primer.

In one embodiment, the production facility according to the invention comprises at least one coating machine with a carrier transport mechanism comprising a working path for transporting substrate carriers and The substrate is conveyed through at least one PVD coating chamber of the PVD coating machine and/or through at least one CVD coating chamber of the CVD coating machine, the carrier return system returning the substrate from a position after the coating chamber to the coating chamber. A position before the chamber, where the return path of the carrier extends in particular next to the working path, where the carrier return system includes the carrier conditioning device, and the return path extends through the conditioning device and the membrane erosion cleaning module; thus, the carrier return system Used as a carrier conveying system.

A substrate loading area of the coating machine may be positioned before the at least one coating chamber, and a substrate unloading area of the coating machine may be positioned after the at least one coating chamber. Thus, the loading area, one coating chamber or more than one coating chamber and the unloading chamber can generally be arranged in a straight line as in an inline coating machine. In another embodiment, one handling system on one side of the coating machine is used alternately as a loading area and an unloading area. The carrier return system returns the substrate carrier to the beginning of the working path after one pass along the working path through the coating machine for another pass through the coating machine.

In the actually discussed embodiment, the conditioning device is a component of the coating machine. The carrier return system therein not only has the function of returning the carrier to the starting point after the coating operation of the substrate to perform the coating operation of other substrates. In addition, the carrier return system has the function of a carrier transfer system that transfers the carriers to and returns from the conditioning device.

The return path of the carrier in the carrier return system may be provided in a layer below the layer in which the deposition chamber is positioned, in which the coating of the substrate takes place.

Depending on the local situation in the production facility, the return path can be located next to the deposition chamber in the same layer or in a layer above the deposition chamber. In some embodiments, the return path may extend partially along the working path, wherein in those embodiments the working path is at least partially a bi-directional path. In some embodiments, one loading station is used as a substrate carrier loading area and as a substrate carrier unloading area.

A production facility according to the invention may comprise at least two coating machines, each of the coating machines having a transport mechanism with a carrier return system, wherein the carrier transport mechanism of the coating machine is coupled to the carrier A conveyor system that conveys the carriers to a conditioning device configured as a common cleaning device for cleaning the carriers coming from the coating machine.

In such embodiments, the conditioning apparatus is typically used to condition substrate carriers from at least two coating machines. The carriers are effectively cleaned by means of a carrier transfer system that transfers the carriers from the coating machine to the conditioning device and is coupled to the coating machine or a carrier return system of the coating machine. Thus, the carrier is efficiently and quickly available for further use. The carrier can be sent to the conditioning device after one run or after several runs. When carrier adjustment is required, the criteria can be run count, accumulated film thickness, onset of delamination, or other parameters.

Membrane erosion cleaning modules may include mechanical erosion cleaning means, ie brushes or particle jet sources or high pressure water jet sources. Mechanical cleaning methods can advantageously be used, for example, if the film to be removed has poor adhesion on the substrate carrier or on a non-stick coating on the substrate carrier, or if the film is more aggressive than the substrate carrier. Significantly faster weak or brittle membranes.

In an embodiment of the invention, the membrane erosion cleaning module comprises at least one chemical cleaning arrangement, ie a spray head for etching fluid or a dispensing head for etchant vapor. With this cleaning arrangement, liquid or gaseous etching substances can be dispensed as required, so that the substrate carrier is treated and cleaned mainly frontally (full). Even distribution of etchant along a line or along an area can be achieved, for example, by using a linear slit nozzle or by a point nozzle arrangement.

The carrier conditioning device may include in its cleaning module or other modules a plasma source or an antenna for electromagnetic radiation. A plasma generated by a plasma source may be provided for forming reactive radicals in the etchant vapor. A plasma may also be provided to form ions for sputtering the film of the carrier. Different plasma sources are operated with DC voltage or AC voltage. Plasma can be used to deposit films, for example non-stick films can also be deposited. In case no plasma is generated, an AC voltage can be coupled via the antenna in the conditioning device. Heating of the water-loaded hygroscopic film can be provided by microwave radiation, wherein delamination of the film is induced by evaporating the water in the film.

The membrane erosion cleaning module may include a fluid container filled with an etchant. Thus, the cleaning module can be formed as a kind of wet bench, in which the carrier is then immersed in a liquid tank or tanks. Cleaning is caused by contact of the carrier with liquid in the tank, such as etchant. The membrane erosion cleaning module may also include a fluid container and an ultrasonic source. The ultrasonic source can increase the interaction between the fluid in the tank and the substrate carrier, or it can stimulate vibration of the substrate carrier or a membrane thereon.

According to an embodiment of the invention, the membrane erosion cleaning module comprises a thermal cleaning arrangement, ie a heating unit and/or a cooling unit. The heater element may be, for example, a resistive heater, a lamp field, an induction coil, co-acting with a conductive carrier or a gas burner. The function of the heater may be heating of the cleaning fluid, heating of the carrier or heating of the surface of the substrate carrier to be cleaned. The effect of heating may be an increase in the activity of the detergent. Heating can also be used to decompose or vaporize or melt the membrane to be cleaned or an auxiliary membrane (eg sacrificially the underlying layer). The heating partially causes the interface between the carrier and the film thereon to degrade.

A thermal cleaning arrangement may include at least one laser. The light emitted by the laser can be at least partially absorbed in or beneath the film and at least cause ablation and partial evaporation of the film by local heating there. Lasers can have wavelengths and powers tuned to specific cleaning tasks. The laser beam can be focused or expanded linearly or two-dimensionally.

The carrier conditioning device may include a material collection unit that collects film material removed from the carriers in the cleaning module. Materials used to make coatings on substrates should be put to good use and not wasted. During continuous production in production facilities, large quantities of material are deposited and removed in cleaning methods. Especially for valuable membrane materials, such as noble metals, there is a need to recycle membrane residues removed during cleaning. In the production plant according to the invention recycling is achieved simply because the same film is always removed in the cleaning module.

The object of the present invention is also solved by a method of manufacturing a substrate coated with a film using the production facility of the present invention, wherein the method also comprises at least one conditioning step carried out in a substrate conditioning unit, wherein the conditioning step comprises at least one substep: This means that the film from the carrier is at least partially eroded in the cleaning module. Cleaning steps performed inside the production facility indirectly contribute to high-quality films with low particle counts. The productivity of the method is improved compared with conventional methods, and the cost of running production facilities is reduced compared with the prior art.

Different discussed features and options may be combined with each other at the discretion of the skilled person without departing from the scope of the present disclosure.

In the following, the invention will be explained with the aid of figures, which show:

Figure 1 Production facility according to the invention with an inline coating machine comprising a cleaning module;

Figure 2 Production facility with cleaning module and aftertreatment module;

Figure 3 Production facility with a cleaning module, a post-treatment module and a pre-treatment module;

Figure 4 Production facility with two inline coating machines and a common cleaning tool;

Figure 5 has a cleaning module with brushes;

Figure 6 has a cleaning module with a particle injection source;

Figure 7 has a cleaning module with a showerhead for etching fluid;

Fig. 8 cleaning module with dispensing head for etchant vapor;

Figure 9 has a cleaning module with etching fluid in a fluid container;

Figure 10 has a cleaning module with a laser;

Figure 11 has a cleaning module with a plasma source;

Figure 12 has a cleaning module with a heating unit and a cooling unit;

Figure 13 Cleaning module with ultrasonic source and

Figure 14 Cleaning module with water jet source.

Figure 1 schematically shows a production facility 1 with an inline coating machine 2 as an embodiment of the invention. During intended use of the production facility, substrates are loaded on the substrate carrier 5 in the substrate carrier loading area 26 (shown in FIGS. 4-13 ). In some embodiments, the substrate carrier 5 can receive multiple substrates, eg, solar wafers. The substrate carrier 5 can also be designed for one large substrate, for example a glass plate, whose area is in the order of square meters, instead of several small substrates. From the loading area 26, the substrate carrier 5 extends along the working path 3 in the inline coating machine 2, on which the main continuous manufacturing process of the film can be run. The production facility 1 has a carrier transport system 4 comprising a carrier transport mechanism of a coating machine for transporting substrate carriers 5 . The actual deposition takes place in the deposition chamber 6, which is a PVD chamber. In various embodiments, it is a CVD chamber. Those broadly classified chambers include other chambers, such as those used for atomic layer deposition (ALD). The individual chambers in an inline coating machine can be separated from each other by known means, eg by chamber valves or differential pump stages. The coating method in the coating chamber 6 may be a vacuum method, which assumes an underpressure generated by a vacuum pump. In other embodiments, an atmospheric or atmospheric coating method is performed in the deposition chamber 6 . The coating machine 2 may comprise further chambers, such as additional transfer chambers and more than one deposition chamber 6 . In the illustrated embodiment, the deposited substrates are unloaded from the substrate carrier 5 in the carrier unloading area 27 .

Thereafter, the empty substrate carrier 5 is returned by the carrier return system 7 to the substrate carrier loading area 26 so that the carrier 5 is available for a corresponding next use in the next run there. In the production facility 1 according to the invention, the carriers are not only returned in their entirety. Furthermore, the substrate carrier 5 is adjusted, correspondingly restored, by a carrier adjustment device 9 through which the return path 8 extends. Consequently, the carrier 5 is also physically restored to a better state than it was after the last deposition. This adjustment includes film removal cleaning so that the film thickness on the substrate carrier 5 is lower at the exit of the carrier return system 7 than at its entry. In extreme cases, the film is completely removed from the substrate carrier 5 by the film erosion cleaning module 10 .

In the different figures, the same reference numbers designate the same or similar objects. Comments made on one figure apply to the other figure accordingly, after due account is taken of existing differences.

FIG. 2 schematically shows a production plant 1 ′ according to the invention, wherein the coating machine 2 comprises a post-processing module 11 next to the cleaning module 10 in the conditioning device 9 . In the aftertreatment module 11 different work can be carried out on the carrier 5 than in the cleaning module 10 . For example, residues left from the cleaning module 10 are eliminated therein.

Compared to FIG. 2 , the carrier adjustment device 9 in the embodiment of FIG. 3 additionally includes a preprocessing module 12 . In the pretreatment module 12 , the carrier 5 is pretreated, which produces benefits in the subsequent deposition or in the subsequent cleaning. Exemplary pretreatments may be the application of an adhesive primer, a non-stick primer, or a sacrificial layer.

FIG. 4 shows a production facility with two deposition machines 2 and a common adjustment tool for adjustment, which includes cleaning the carriers 5 from the two coating machines 2 . In an embodiment of the invention, the adjustment device 9 is an independent tool serving the two coating machines 2 . The carrier transport system 4 is coupled to a carrier return system 7 of the coating machine 2 . The carrier transport system 4 is fully automatic in the embodiment shown in FIG. 4 . In an alternative embodiment not shown, the carrier transfer system 4 has a storage location for the carriers 5 to be cleaned and a signal output for an operator who manually transfers the carriers 5 to the adjustment tool and From there it is returned to the coating machine 2 after cleaning.

Figures 5 to 14 are diagrams illustrating some different cleaning modules 10, 10', 10", 10"', 10" as part of an embodiment of a production facility 1, 1', 1", 1"' according to the invention ". The carrier 5 shown in the side view is an open working plate (flat steel plate), only its low thickness is visible in the figure, while the large surface of its supporting base plate is not visible. In the described embodiment, the carrier 5 comprises recesses for the substrates, ie for the solar wafers. In different embodiments, the carrier consists of different materials, eg stainless steel, aluminum alloy or carbon fiber composite material. The carrier 5 may be supported by drive rollers that transport the carrier 5 through the cleaning module 10 . In the cleaning module 10 shown in FIG. 5 , the film is eroded by the brushes 13 . The eroded membrane material is removed from the cleaning module 10 by suction means. The material of the brush 13 , its rotational speed and the pressing force on the brush are adjusted so that the film is eroded and the substrate carrier 5 is not eroded more than admissible.

Another mechanically working cleaning module 10 ′ is shown in FIG. 6 . The mechanical film abrasion is performed therein by using the particle ejection source 14 . It uses, for example, pressurized air and sharp-edged particles sprayed on the carrier 5 to at least partially remove the film. The ejected particles and removed membrane parts are removed by suction. FIG. 14 shows an embodiment in which a water jet source 25 is used instead of the particle jet source 14 .

In the cleaning module shown in FIG. 7 , a liquid substance, respectively an etching fluid 16 , such as an acid or a leachate, is sprayed on the carrier 5 in order to etch or otherwise remove the film of the carrier 5 . Figure 9 shows a cleaning module 10''' in which a fluid container 19 with etchant is positioned, wherein the carrier 5 is inserted into this container 19. In the embodiment of FIG. 13 , the fluid container is coupled to an ultrasound source 24 .

When the cleaning module 10, 10', 10", 10"' is only used to remove one specific film, then the recovery of valuable material (eg indium from the ITO film) can be beneficial.

The cleaning module 10"' shown in FIG. A plasma source 21 is included which ionizes the etchant vapor 18 and forms chemically active free radicals so that the carrier 5 can be etched clean at a lower temperature than without the plasma. The cleaning module 10"' in this embodiment is vacuum chamber.

In the embodiment of Fig. 10, the carrier 5 is cleaned by locally rapid heating of the film with a laser 20, so that it is at least partially delaminated. In the layering process, water or other substances evaporated at low temperature may be involved, wherein as an auxiliary measure the substance is embedded in the membrane or arranged under the membrane.

In an exemplary embodiment, the substrate carrier 5 consists of stainless steel. The fabrication method is basically a sputtering process of a 100nm thick indium tin oxide (ITO) film on both sides of the substrate. The substrate carrier was used for 50 deposition runs. An ITO film with a thickness of about 5 μm was thus formed on the carrier. The carrier 5 is then cleaned in a separate laser cleaning tool. A _CO2 laser with 100W electric power is used in it, and the infrared beam emitted by it is well absorbed by the ITO film, so that the film is delaminated. By scanning the laser, the entire surface of the carrier is subsequently cleaned, and then the other side of the carrier is cleaned. The removed film material is collected to recycle indium in the ITO film. Another embodiment uses a fiber laser with a power of 1 kW and a wavelength of about 1000 nm. The surface of the substrate carrier 5 was cleaned with an areal cleaning speed of 72 cm ² /s, so that one side of the carrier 5 was cleaned within 36 seconds. The type and power of the laser 20 can be adjusted for the film material and production facility requirements.

In the embodiment of Figure 12, cleaning is performed by thermal shock. In the embodiment shown, the shock is generated by a rapid temperature change, which is induced by the heating unit 22 and the cooling unit 23 . In a specific embodiment, the heating unit is a halogen lamp field. In one embodiment, the cooling unit 22 is a spraying device of liquid nitrogen.

Components disclosed in this invention may be combined with each other at the discretion of the skilled person even if the combination is not explicitly described here before. Features described in succession at the same time must not be misinterpreted as mandatory feature combinations.

reference sign

1, 1', 1", 1"' Production Facility

2 coating machines

3 work path

4 Carrier conveying system

5 Substrate carrier

6 coating room

7 Carrier return system

8 return path

9 Carrier adjustment device

10, 10', 10", 10"', 10"" membrane erosion cleaning modules

11 Post-processing module

12 preprocessing module

13 brushes

14 Particle injection source

15 nozzles

16 Etching fluid

17 distribution head

18 Etchant vapor

19 Fluid container

20 lasers

21 including plasma source

22 heating unit

23 cooling unit

24 ultrasonic source

25 water jet source

26 Substrate carrier loading area

27 Substrate carrier unloading area.

Claims (15)

1. A production facility (1, 1', 1", 1"') comprising: - at least one PVD inline coating machine (2) and/or at least one CVD coating machine (2), wherein in said coating machine (2) the substrate is carried by a substrate carrier (5), During the coating step of the method of manufacturing a coated substrate, said carrier (5) and said substrate on said carrier (5) are coated with a film together, and - an adjustment device (9) for removing said membrane from said carrier (5), It is characterized in that, The production facility (1, 1', 1", 1"') comprises a carrier transfer system (4) for transferring carriers (5) to a module comprising a membrane erosion cleaning (10, 10', 10", 10"', 10"") said carrier adjustment device (9), and the carrier (5) is sent back from said adjustment device (9) for further coating cloth step, wherein the transfer system (4) is configured to incorporate a carrier cleaning step into the manufacturing process. 2. Production facility (1, 1', 1") according to claim 1, characterized in that The production facility (1, 1', 1") comprises at least one inline coating machine (2) with a carrier transport mechanism comprising: - a working path (2) for transporting the substrate carrier (5) and the substrates with it through at least one PVD coating of the PVD coating machine (2) a cloth chamber (6) and/or at least one CVD coating chamber (6) passing through said CVD coating machine (2), and - a carrier return system (7) that returns a substrate from a position after said coating chamber (6) to a position before said coating chamber (6), wherein said The return path (8) of the carrier (5) extends in particular next to the working path (2), wherein the carrier return system (7) comprises the carrier adjustment device (9) and the return The path (8) extends through the conditioning device (9) and the membrane erosion cleaning modules (10, 10', 10", 10"', 10"") so that the carrier return system (7) is As said carrier conveying system (4). 3. Production facility (1"') according to claim 1, characterized in that The production facility comprises at least two coating machines (2), each of the coating machines (2) having a transport mechanism with a carrier return system (7), wherein the coating machines Said carrier transfer mechanism of the cloth machine (2) is coupled to a carrier transfer system (4) which transfers the carriers (5) to said conditioning device (9), said The conditioning device (9) is configured as a common conditioning tool for cleaning the carriers (5) coming from the coating machine (2). 4. Production facility (1, 1', 1", 1"') according to at least one of claims 1 to 3, characterized in that the carrier conditioning device (9) comprises a post-processing module ( 11), the post-processing module (11) is arranged behind the cleaning module (10, 10', 10", 10"', 10"") on the return path (8). 5. Production facility (1, 1', 1", 1"') according to at least one of claims 1 to 4, characterized in that the carrier conditioning device (9) comprises a pretreatment module ( 12), said pre-processing module (12) is located within said conditioning device (9) at the end of said return path (8). 6. Production facility (1, 1', 1", 1"') according to at least one of claims 1 to 5, characterized in that the membrane erosion cleaning module (10, 10') comprises a mechanical Aggressive cleaning means, ie brush (13), or particle jet source (14), or high pressure water jet source (25). 7. Production facility (1, 1', 1", 1"') according to at least one of claims 1 to 5, characterized in that the membrane erosion cleaning module (10", 10"') At least one chemical cleaning arrangement is included, namely a spray head (15) for etching fluid (16), or a distribution head (17) for etchant vapor (18). 8. The production facility (1, 1', 1", 1"') according to at least one of the preceding claims, characterized in that the regulating device (9) comprises an antenna for electromagnetic radiation or a plasma body source (21). 9. Production facility (1, 1', 1", 1"') according to at least one of claims 1 to 5, characterized in that the membrane erosion cleaning module (10"") comprises Fluid container (19) for etchant. 10. The production facility (1, 1', 1", 1"') according to at least one of the preceding claims, characterized in that the membrane erosion cleaning module (10, 10"") comprises a fluid container and an ultrasonic source (24). 11. Production facility (1, 1', 1", 1"') according to at least one of claims 1 to 5, characterized in that the membrane erosion cleaning module comprises a thermal cleaning arrangement, i.e. heating unit (22) and/or cooling unit (23). 12. Production facility (1, 1', 1", 1"') according to at least one of claims 1 to 5, characterized in that the membrane erosion cleaning module (20) comprises a thermal cleaning arrangement, The thermal cleaning arrangement includes at least one laser (20). 13. The production facility (1, 1', 1", 1"') according to claim 12, characterized in that said film is an indium tin oxide film on a stainless steel carrier 5 and that said laser (20 ) is a _CO2 laser or a fiber laser. 14. Production facility (1, 1', 1", 1"') according to claim 1, characterized in that said carrier adjustment device (9) comprises a material collection unit which collects from Membrane material removed by said carrier in said cleaning module (10, 10', 10", 10"', 10""). 15. A method for producing coated substrates in a production facility (1, 1', 1", 1"') according to at least one of claims 1 to 14, wherein said method comprises On the substrate in the carrier (5) in at least one PVD coating chamber (6) and/or in at least one CVD coating chamber of the coating machine (2) and on the carrier (5) The coating step of cloth film, It is characterized in that, The method also includes: - the step of transferring the carriers (5) to said carrier conditioning device (9) using a carrier transfer system, said carrier conditioning device comprising membrane erosion cleaning modules (10, 10', 10", 10"', 10""), - at least one conditioning step performed in said substrate conditioning unit (9), wherein said conditioning step comprises at least one sub-step of: 10"") to at least partially erode the film from said carrier (5), and - use said carrier transfer system to return the carrier (5) from said conditioning device (9) for further coating The step used in the Cloth step.