CN110071381A - Cable socket connector assembly for electronic packing piece - Google Patents

Abstract

A cable receptacle connector assembly (102) for an electronic system (100) includes a receptacle assembly (106) having a receptacle substrate (116) that includes receptacle substrate conductors (118). The receptacle assembly has receptacle contacts (220) extending between terminating ends (224) and mating ends (226), the terminating ends terminating to corresponding receptacle substrate conductors, and the mating ends are configured Corresponding package contacts (156) are terminated to the electronic package (104) of the electronic system. The cable receptacle connector assembly includes a cable assembly (108) terminated to the receptacle assembly that includes an array of cables (200), each cable having a cable conductor (310) terminated to a corresponding receptacle substrate conductor. The receptacle contacts and the corresponding receptacle substrate conductors define electrical pathways (112) between cable conductors of the electrical cable and package conductors of the electronic package.

Description

Cable receptacle connector assemblies for electronic enclosures

technical field

The subject matter herein relates generally to cable receptacle connector assemblies for electronic enclosures of electronic systems.

Background technique

The continuing trend towards smaller, lighter and higher performance electronic components and higher density circuits has led to the development of surface mount technology in the design of printed circuit boards and electronic packages. Surface mountable packages allow electronic packages (eg, integrated circuits or computer processors) to be detachably connected to pads on the surface of the circuit board, rather than by contacts soldered in plated-through holes through the circuit board or pins. Surface mount technology can allow the density of components on the circuit board to increase, thereby saving space on the circuit board.

One form of surface mount technology includes receptacle connectors. The receptacle connector may include a substrate with terminals on one side of the substrate and an array of conductive solder elements (eg, ball grid array (BGA) or land grid array (LGA)) on the opposite side, which are provided by conductive wires through the substrate The vias are electrically connected through the substrate. The terminals engage contacts on the electronic package, and solder elements are secured to conductive pads on a main circuit board (eg, a motherboard) to electrically couple the electronic package to the main circuit board. Conventional architectures provide receptacle connectors between the electronic package and the main circuit board. The electronic package includes conductors on the bottom of the electronic package through which the signals are driven to the terminals of the receptacle connector and then through the receptacle connector to the main circuit board. The signals are then transferred to electrical connectors, such as high-speed electrical connectors, on the main circuit board. The routing of circuits between the mounting areas for the receptacle connectors and the high-speed electrical connectors and the mounting areas for the high-speed electrical connectors occupies board space on the main circuit board. Additionally, the electrical performance of electronic systems is degraded due to the multiple electrical interfaces between electronic packages and high-speed connectors. Conventional systems are struggling to meet signal and power output from electronic packages as smaller sizes and higher numbers of conductors are required while maintaining good electrical performance, and conventional electronic packages have a limited amount of power along the bottom of the electronic package. Surface area is used for conductors.

There remains a need for high-speed receptacle connector assemblies with improved electrical performance.

SUMMARY OF THE INVENTION

In accordance with the present invention, a cable receptacle connector assembly for an electronic system is provided that includes a receptacle assembly having a receptacle substrate that includes receptacle substrate conductors. The receptacle assembly has receptacle contacts extending between a terminating end and a mating end, the terminating end terminating to a corresponding receptacle substrate conductor, and the mating end being configured to be terminated to electronics of the electronic system Corresponding package contacts of the package. The cable receptacle connector assembly includes a cable assembly terminated to the receptacle assembly that includes an array of cables, each cable having cable conductors terminated to corresponding receptacle substrate conductors. The receptacle contacts and the corresponding receptacle substrate conductors define electrical pathways between cable conductors of the electrical cable and package conductors of the electronic package.

Description of drawings

1 is a schematic diagram of an electronic system including a contact receptacle connector assembly formed in accordance with an exemplary embodiment.

2 is a perspective view of an electronic system showing a contact receptacle connector assembly according to an exemplary embodiment.

3 is an exploded view of an electronic system showing a receptacle assembly and a cable assembly of a contact receptacle connector assembly in accordance with an exemplary embodiment.

4 is a side view of an electronic system according to an exemplary embodiment.

5 is an enlarged view of a portion of an electronic system according to an exemplary embodiment.

6 is a perspective view of a receptacle contact of a receptacle assembly according to an exemplary embodiment.

7 is an exploded view of a portion of a cable receptacle connector assembly showing the receptacle assembly.

8 is an exploded view of the cable receptacle connector assembly showing the receptacle assembly and the cable assembly.

9 is a top perspective view of a cable receptacle connector assembly according to an exemplary embodiment.

10 is a top view of a cable receptacle connector assembly according to an exemplary embodiment.

11 is a bottom perspective view of a cable receptacle connector assembly according to an exemplary embodiment.

12 is a top view of a cable receptacle connector assembly according to an exemplary embodiment.

Figure 13 is an enlarged bottom view of a portion of the cable receptacle connector assembly.

14 is a side view of a portion of an electronic system showing a cable receptacle connector assembly ready to mate with an electronic enclosure.

15 is a side view of a portion of an electronic system showing a cable receptacle connector assembly mated with an electronic enclosure.

16 is an enlarged side view of a portion of an electronic system showing a cable receptacle connector assembly ready to mate with an electronic enclosure.

17 is an enlarged side view of a portion of an electronic system showing a cable receptacle connector assembly mated with an electronic enclosure.

18 is a side view of a portion of an electronic system according to an exemplary embodiment.

19 is a side view of a portion of an electronic system according to an exemplary embodiment.

Detailed ways

FIG. 1 is a schematic diagram of an electronic system 100 formed in accordance with an exemplary embodiment. The electronic system 100 includes a cable receptacle connector assembly 102 that is electrically connected to an electronic package 104, such as an integrated circuit. The cable receptacle connector assembly 102 includes a receptacle assembly 106 configured to electrically connect directly to the electronic enclosure 104 and a cable assembly 108 that is directly electrically connected to the receptacle assembly 106 . The receptacle assembly 106 electrically connects the cable assembly 108 with the electronic enclosure 104 for routing away from the electronic enclosure 104 . In the exemplary embodiment, the socket assembly 106 is coupled to the top of the electronic package 104 and the bottom of the electronic package 104 is coupled to a main circuit board 110, such as a motherboard. The electronic system 100 allows the socket assembly 106 to be connected to the top of the electronic package 104 and the bottom of the electronic package 104 to be connected to the main circuit board 110 to increase performance and design efficiency by increasing the number of connection locations of the electronic package 104 . In an exemplary embodiment, components are coupled to multiple sides of electronic package 104 to increase the density of electronic system 100 and shorten the electrical path of electronic system 100 . This arrangement can reduce the number of electrical interfaces along the signal path to enhance the electrical performance of the electronic system 100 . For example, high-speed data signals may be transmitted from electronic package 104 directly to cable assembly 108 through receptacle assembly 106 rather than first being routed through main circuit board 110 .

In the exemplary embodiment, the electrical path 112 from the electronic package 104 to the cable assembly 108 passes through the receptacle assembly 106 and is not routed through the main circuit board 110 . For example, in the illustrated embodiment, the electrical paths 112 are high-speed electrical paths routed through the receptacle assembly 106 to the cable assembly 108, while other electrical paths 114 (eg, low-speed electrical paths and power electrical paths) are routed through the interface 120 in the electronic package 104 and the main circuit board 110. In the illustrated embodiment, the interface 120 is a ball grid array (BGA) with solder balls 122 soldered to the main contacts 124 on the upper surface 126 of the main circuit board 110 and the lower surface of the electronic package 104 between the upper and lower package contacts 128 . However, other types of interfaces, such as Land Grid Array (LGA), may be used in alternative embodiments. In various alternative embodiments, a receptacle connector (not shown) may be provided at the interface 120 between the electronic package 104 and the main circuit board 110 . Optionally, electrical paths 114 may include high-speed electrical paths.

In the exemplary embodiment, receptacle assembly 106 includes a receptacle substrate 116 having receptacle substrate conductors 118 that provide electrical pathways between electronic package 104 and cable assembly 108 . The socket substrate 116 may be a printed circuit board, and the socket substrate conductors 118 may be circuits, pads, traces, vias, etc. of the printed circuit board. The cable assembly 108 may be terminated directly to the receptacle substrate conductors 118 , such as by soldering to the receptacle substrate conductors 118 . The socket substrate conductors 118 may be electrically connected to the electronic package 104 using contacts, pins, solder balls, conductive spring posts, or other intermediate conductive elements. In an exemplary embodiment, the socket substrate 106 includes an interface on the bottom side for direct electrical connection to the electronic package 104, such as an LGA interface, a BGA interface, and the like. Thus, the socket substrate 106 electrically connects the cables of the cable assembly 108 to the top of the electronic package 104 .

In electronic system 100 , electronic system 100 includes heat sink 130 for dissipating heat from one or more components of electronic system 100 , such as from electronic package 104 and/or socket assembly 106 . In the illustrated embodiment, the heat spreader 130 is disposed over the socket assembly 106 such that the socket assembly 106 is disposed in the space between the heat spreader 130 and the electronic package 104 . Alternatively, the heat sink 130 may be mounted to the main circuit board 110 and/or the mounting block 130 below the main circuit board 110 . For example, fasteners 134 may be used to secure heat sink 130 to mounting block 132 . Optionally, mounting block 132 supports heat sink 130 and/or main circuit board 110 . Electronic package 104 and socket assembly 106 may be sandwiched between heat sink 130 and main circuit board 110 and/or mounting block 132 .

Optionally, components may include one or more compressible interfaces between them. For example, the socket assembly 106 may include a compressible interface detachable from the top of the electronic package 104 . The socket assembly 106 may be spring biased against the electronic package 104 when the heat sink 130 is coupled to the mounting block 132 . In the exemplary embodiment, cable receptacle connector assembly 102 includes a loading member 136 between heat sink 130 and receptacle assembly 106 . The loading member 136 may be spring loaded against the socket assembly 106 to mechanically press and hold the socket assembly 106 against the electronic package 104 . In the exemplary embodiment, the cable receptacle connector assembly 102 includes a receptacle frame 138 that supports the components of the cable receptacle connector assembly 102 . For example, the socket frame 138 may support the socket assembly 106 . The socket frame 138 may support the electronic package 104 . The receptacle frame 138 may support the cable assembly 108 . In an exemplary embodiment, the socket frame 138 may limit or stop compression at the compressible interface to prevent damage to various components. The socket frame 138 may guide or position various components relative to each other. The socket frame 138 may hold the various components together for mounting to other components.

FIG. 2 is a perspective view of the electronic system 100 according to an exemplary embodiment. FIG. 3 is an exploded view of electronic system 100 according to an exemplary embodiment. FIG. 3 shows the electronic package 104 mounted to the main circuit board 110 . Alternatively, the electronic package 104 may be soldered to the main circuit board 110; however, in alternative embodiments, the electronic package 104 may be mechanically and/or electrically coupled to the main circuit board 110 by other means. The cable receptacle connector assembly 102 is ready to be coupled to the electronic package 104 .

In the illustrated embodiment, the heat sink 130 is located above the cable receptacle connector assembly 102 and is configured to mount to a mounting block 132 below the main circuit board 110 . In various other embodiments, electronic system 100 may be provided without heat sink 130 and/or without mounting block 132 . For example, the cable receptacle connector assembly 102 may be mounted to and supported by the main circuit board 110 above the electronic package 104, eg, using clips, fasteners, or other securing means.

The heat sink 130 includes a base 140 at the bottom of the heat sink 130 . Heat sink 130 includes mounting features 142 at base 140 for securing heat sink 130 to mounting block 132 . In the illustrated embodiment, the mounting features 142 are flanges or protrusions extending from opposite ends of the base 140 that have openings to receive the fasteners 134 . Other types of mounting features may be used in alternate embodiments. In the exemplary embodiment, heat sink 130 includes a plurality of heat sink fins 144 for dissipating heat from heat sink 130 . The heat dissipation fins 144 may be parallel plates. Other types of cooling fins, such as posts, may be provided in alternate embodiments.

In an exemplary embodiment, electronic package 104 is an integrated circuit component, such as an application specific integrated circuit (ASIC); however, other types of electronic packages may be used in alternative embodiments, such as chips, processors, memory devices, and the like. The electronic package 104 includes a substrate 150 having an upper surface 152 and a lower surface 154 . Electronic package 104 includes package contacts 156 defined by the circuitry of substrate 150 . In the exemplary embodiment, package contacts 156 are disposed on upper surface 152 and lower surface 154 . Package contacts 156 may include pads, traces, vias, or other types of contacts.

In the illustrated embodiment, the electronic package 104 includes electronic components 158 , such as chips, on the upper surface 152 . Electronic components 158 may be electrically connected to package contacts 156 through traces or circuits of substrate 150 . In the embodiment shown, the electronic components 158 are generally centered on the substrate 150 such that the platforms 160 are defined on all four sides of the electronic components 158 . Platform 160 extends to edge 162 of substrate 150 , defining the perimeter of substrate 150 . The size and shape of the substrate 150 and the size and shape of the electronic components 158 define the size and shape of the platform 160 and thus the amount of available substrate area on the upper surface 152 of the package contacts 156 .

After the electronic package 104 is mechanically and electrically coupled to the main circuit board 110 , the cable receptacle connector assembly 102 may be pre-assembled and mounted to the electronic package 104 and/or the main circuit board 110 . For example, the cable assembly 108 may be terminated to the receptacle assembly 106 in the receptacle frame 138 for coupling to the electronic package 104 . In the exemplary embodiment, socket frame 138 supports socket assembly 106 and loading member 136 . In the exemplary embodiment, socket assembly 106 includes a socket opening 170 therethrough that receives electronic component 158 . Optionally, a portion of electronic component 158 passes through socket opening 170 to interface with heat sink 130 .

The cable assembly 108 is terminated to the receptacle assembly 106 and is thus supported by the receptacle frame 138 . In the exemplary embodiment, cable assembly 108 includes a plurality of cables 200 each terminated to receptacle assembly 106 . For example, the cable 200 may be terminated directly to the receptacle substrate 116 , such as by soldering the cable 200 to the receptacle substrate conductors 118 of the receptacle substrate 116 . Any number of cables 200 may be provided depending on the specific application. For example, a greater number of cables 200 may be used in higher density applications to provide a greater number of electrical paths to the electronic package 104 . Alternatively, the cable 200 may be a shielded cable, providing electrical shielding for the electrical path. Alternatively, the cables 200 may be differential pair cables, wherein each cable 200 includes a pair of cable conductors. In an exemplary embodiment, the cables 200 may be terminated to the upper and/or lower surfaces of the receptacle substrate 116 . In the exemplary embodiment, cable assembly 108 includes a plurality of cable subassemblies 202 . Each cable subassembly 202 includes a plurality of cables 200 arranged in an array. Each cable subassembly 202 may be terminated to a corresponding area of the receptacle substrate 116 . For example, the upper cable subassembly 202 can be terminated to the upper surface of the receptacle substrate 116 and the lower cable subassembly 202 can be terminated to the lower surface of the receptacle substrate 116 . In an exemplary embodiment, the cable subassembly 202 may be routed from different sides of the receptacle substrate 116 . For example, in the illustrated embodiment, cable assembly 108 includes cable subassemblies 202 terminated to all four sides of receptacle substrate 116 that extend in four different directions (eg, north/south/east/west) . However, in various other embodiments, fewer cable subassemblies 202 may be provided, such as cable subassemblies 202 extending from two opposite sides in opposite directions (eg, north/south). The cable 200 may extend generally horizontally, eg, generally coplanar with the receptacle assembly 106 and/or parallel to the main circuit board 110 . Alternatively, different cable subassemblies 202 may be routed to different components. The cables 200 of the various cable subassemblies 202 can be tied together for cable management, eg, using cable ties, clips, ties, and the like.

FIG. 4 is a side view of the electronic system 100 according to an exemplary embodiment. FIG. 5 is an enlarged view of a portion of electronic system 100 according to an exemplary embodiment. During assembly, the electronic package 104 is positioned over the main circuit board 110 and is mechanically and electrically connected to the upper surface 126 of the main circuit board 110 , eg, using solder balls 122 .

During assembly, the cable receptacle connector assembly 102 is positioned over the electronic package 104 and is mechanically and electrically connected to the upper surface of the electronic package 104 . The receptacle frame 138 may align and position the cable receptacle connector assembly 102 relative to the electronic package 104 . When assembled, a portion of the electronic component 158 extends through the cable receptacle connector assembly 102 to interface with the heat sink 130 .

During assembly, the heat sink 130 is positioned over the cable receptacle connector assembly 102 and the electronic package 104 . In the exemplary embodiment, heat spreader 130 is in thermal contact with the upper surface of electronic component 158 to dissipate heat from electronic component 158 . When assembled, the electronic package 104 and the cable receptacle connector assembly 102 are positioned in the gap 172 between the heat sink 130 and the main circuit board 110 .

During assembly, fasteners 134 are used to secure heat sink 130 to mounting block 132 . Tightening of the fasteners 134 can draw the heat sink 130 closer to the main circuit board 110 . Optionally, the bottom of the heat sink 130 is pressed against the cable receptacle connector assembly 102 to load the cable receptacle connector assembly 102 against the electronic package 104 . For example, the loading member 136 at the top of the cable receptacle connector assembly 102 engages the bottom of the heat sink and provides a loading force in a downward direction to load the cable receptacle connector assembly 102 against the electronic package 104 .

Among the loading members 136 , the loading members 136 include one or more loading beams 210 that are configured to be spring biased against the heat sink 130 . The load beams 210 may be connected together, such as through a plate, or may be separate load beams 210, such as to the socket assembly 106 or to the heat sink 130. The load beam 210 exerts a downward spring force on the socket substrate 116 to bias the socket assembly 106 against the electronic package 104 . For example, in an exemplary embodiment, the socket assembly 106 may include a plurality of socket contacts 220 (shown in FIG. 6 ) between the socket substrate 116 and the substrate 150 of the electronic package 104 . The receptacle contacts 220 may be compressible. The receptacle contacts 220 may define a separable mating interface with the electronic package 104 . The receptacle contacts 220 may be LGA contacts. During assembly, downward movement of the cable receptacle connector assembly 102 may spring-load the receptacle contacts 220 against the electronic package 104 to ensure a good electrical connection between the receptacle assembly 106 and the electronic package 104 .

In an exemplary embodiment, socket frame 138 may limit compression or downward movement of heat sink 130 . The receptacle frame 138 may limit downward movement of the cable receptacle connector assembly 102 relative to the electronic package 104 , such as by bottoming out against the main circuit board 110 . The socket frame 138 may prevent damage to the electronic package 104 . The receptacle frame 138 may prevent damage to the receptacle contacts 220 .

FIG. 6 is a perspective view of a receptacle contact 220 according to an exemplary embodiment. The receptacle contact 220 includes a base 222 between a terminating end 224 and a mating end 226 . The terminations 224 are configured to be terminated to the socket substrate 116 . The mating end 226 is configured to mate with the electronic package 104 . In the illustrated embodiment, the terminations 224 include compliant pins, such as eye-of-pin contacts, that are configured to be press-fit into plated through holes of the socket substrate 116 . Other types of terminations 224 may be provided in alternate embodiments. In the illustrated embodiment, the receptacle contact 220 includes a stabilizing beam 228 extending from the base 222 at the termination end 224 . The stabilization beams 228 are configured to engage the socket substrate 116 to stabilize the socket contacts 220 on the socket substrate 116 .

The receptacle contact 220 includes a spring beam 230 extending from the base 222 at the mating end 226 . The spring beam 230 is deflectable. In the embodiment shown, the spring beam 230 includes two beam arms separated by a gap; however, the spring beam 230 may have other shapes, including a single beam arm, in alternate embodiments. In the exemplary embodiment, receptacle contacts 220 include hooks 232 at their distal ends that define mating interfaces 234 for mating with corresponding package contacts 156 of electronic package 104 . In the exemplary embodiment, mating interface 234 is a separable mating interface. The spring beams 230 can be resiliently deflected during abutment of the spring biased hooks 232 against the package contacts 156 to ensure electrical connection between the receptacle contacts 220 and the package contacts 156 .

In alternate embodiments, the receptacle contacts 220 may have other shapes and features. For example, the receptacle contacts 220 may include solder tails at the mating ends 226 that are configured to solder to the electronic package 104 . In other various embodiments, the socket contacts 220 may be solder balls used to solder the socket assembly 106 to the electronic package 104 .

FIG. 7 is an exploded view of a portion of the cable receptacle connector assembly 102 showing the receptacle assembly 106 . In the exemplary embodiment, socket assembly 106 includes socket substrate 116 , socket frame 138 , loading member 136 , and insulator 240 positioned between socket substrate 116 and loading member 136 .

The insulator 240 electrically isolates the socket substrate 116 from the loading member 136 . The insulator 240 includes an upper surface 242 and a lower surface 244 . The lower surface 244 may rest on the socket substrate 116 . The upper surface 242 may support the loading member 136 . The insulator 240 includes insulator openings 246 that are aligned with the receptacle openings 170 in the receptacle substrate 116 . Insulator 240 may be similar in size and shape to loading member 136 and/or socket substrate 116 . In alternate embodiments, insulator 240 may have other shapes. In other various embodiments, the socket assembly 106 may include multiple insulators, rather than a single insulator 240 , such as a standoff mounted to the socket substrate 116 for supporting the loading member 136 .

Loading member 136 includes a body 250 having an upper surface 252 and a lower surface 254 . The body 250 may be a board. Load beam 210 extends above upper surface 252 for interfacing with heat sink 130 . Alternatively, the load beam 210 may extend below the lower surface 254 to interface with the insulator 240 . The lower surface 254 rests on the insulator 240 . Body 250 includes load beam 210 . Of the loading members 136 , the loading members 136 are stamped and formed components having the loading beams 210 stamped from the body 250 . Any number of load beams 210 may be provided. Alternatively, the loading beams 210 may be distributed around the perimeter of the loading member 136 to spread the loading force around the loading member 136 . For example, in the embodiment shown, the load beams 210 are provided on all four sides of the body 250 . Optionally, the load beams 210 may extend in different directions for counteracting compressive loads from the heat sink 130 . In alternate embodiments, the loading member 136 may have other shapes and features. The loading member 136 exerts an activation spring load on the socket assembly 106 to load or press the socket assembly 106 against the electronic package 104 . For example, the activation spring load may be a force greater than the spring force of the receptacle contacts 220 to overcome the spring force and compress the receptacle contacts 220 to load the receptacle contacts 220 against the electronic package 104 .

In alternative embodiments, the socket assembly 106 may include multiple individual loading beams mounted directly to the socket substrate 116 rather than providing a single loading member above the socket substrate 116 . For example, the load beam 210 may be similar to the receptacle contacts 220 and configured to mount to the upper surface of the receptacle substrate 116 so that when the heat sink 130 is loaded against the receptacle assembly 106, the load beam 210 is spring biased against heat dissipation device 130. In various other embodiments, the load beam 210 may be a coil spring between the heat sink and the socket substrate 116 . In alternate embodiments, the load beam 210 may be part of the heat sink 130 rather than being part of the socket assembly 106 .

The socket substrate 116 may be a printed circuit board, and the socket substrate conductors 118 may be circuits of the printed circuit board. The socket substrate 116 includes an upper surface 260 and a lower surface 262 . The socket opening 170 extends through the socket substrate 116 between the upper surface 260 and the lower surface 262 . The socket substrate 116 includes a platform 264 surrounding the socket opening 170 . The platform 264 is defined by an inner edge 266 surrounding the socket opening 170 and an outer edge 268 along the perimeter of the socket substrate 116 . The socket substrate 116 includes a first side wall 270 and a second side wall 272 opposite the first side wall 270 . The socket substrate 116 includes a first end wall 274 and a second end wall 276 opposite the first end wall 274 . In the exemplary embodiment, socket substrate 116 includes corners 278 at the intersections between side walls 270 , 272 and end walls 274 , 276 . In the illustrated embodiment, the socket substrate 116 is generally rectangular; however, in alternate embodiments, the socket substrate 116 may have other shapes.

The socket substrate conductors 118 include pads, traces, vias, etc. that extend along one or more layers of the socket substrate 116 . In an exemplary embodiment, portions of the various socket substrate conductors 118 may be exposed on the upper surface 260 and portions of the various socket substrate conductors 118 may be exposed on the lower surface 262 .

In the exemplary embodiment, receptacle substrate conductors 118 include contact pads 280 for electrical connection with corresponding cables 200 . Contact pads 280 may be provided at or near one or more of the outer edges 268 . For example, in the embodiment shown, contact pads 280 are provided along first side wall 270 , second side wall 272 , first end wall 274 and second end wall 276 for mating with corresponding cables 200 . Contact pads 280 may be provided on the upper surface 260 and/or the lower surface 262 for electrical connection with the corresponding cable 200 .

In the exemplary embodiment, the receptacle substrate conductors 118 include plated through holes 282 for electrical connection with corresponding receptacle contacts 220 . Plated through holes 282 may be associated with corresponding contact pads 280 . Plated through holes 282 may be provided at upper surface 260 and/or lower surface 262 . In the exemplary embodiment, the receptacle contacts 220 are coupled to corresponding through holes 282 at the lower surface 262 to extend below the receptacle substrate 116 for electrical connection with the electronic package 104 .

The socket frame 138 includes a top portion 290 and a bottom portion 292 . The socket frame 138 includes support members 294 for supporting the socket substrate 116 . In the illustrated embodiment, support members 294 are provided at the corners of the socket frame 138 for supporting the corners 278 of the socket substrate 116 . In the exemplary embodiment, socket frame 138 includes one or more heat sink positioning surfaces 296 at top 290 that are configured to engage and position heat sink 130 relative to socket frame 138 . Heat sink positioning surface 296 may define a stop surface for preventing heat sink 130 from lowering toward socket assembly 106 . In the exemplary embodiment, the socket frame 138 includes one or more electronic package positioning surfaces 298 at the bottom 292 that are configured to engage and position the electronic package 104 relative to the socket frame 138 . The electronic package positioning surface 298 may position the electronic package 104 relative to the socket substrate 116 . During loading of the socket assembly 106 onto the electronic package 104 , the electronic package positioning surfaces 298 may bottom out against the electronic package 104 to prevent damage to the socket contacts 220 . Optionally, bottom 292 may be configured to bottom out against main circuit board 110 during assembly to prevent damage to electronic package 104 , load beam 210 and/or receptacle contacts 220 .

FIG. 8 is an exploded view of the cable receptacle connector assembly 102 showing the receptacle assembly 106 and the cable assembly 108 . The cable assembly 108 includes a plurality of cable subassemblies 202 that are configured to be terminated to the receptacle assembly 106 . The receptacle assembly 106 is shown in an assembled state in which the receptacle substrate 116 is retained in and supported by the receptacle frame 138 and the loading member 136 and insulator 240 are coupled to the receptacle substrate 116 . When the loading member 136 and the insulator 240 are coupled to the receptacle substrate 116 , the contact pads 280 are exposed to terminate the cable 200 to the receptacle substrate 116 . Support member 294 may be used to position insulator 240 and loading member 136 .

Each cable subassembly 202 includes an array 300 of cables 200 . The cables 200 can be tied together. Each cable subassembly 202 includes a ground bus 302 that is configured to be electrically connected to each cable 200 and to the receptacle substrate 116 . In the illustrated embodiment, the ground bus 302 includes a faceplate 304 and a plurality of ground fingers 306 extending from the faceplate 304 . The ground fingers 306 are configured to terminate to corresponding contact pads 280 on the socket substrate 116 . For example, ground fingers 306 may be soldered to corresponding contact pads 280 . The panel 304 shares each ground finger 306 with each other and with each cable 200 . In alternative embodiments, instead of using the ground bus 302 , the cable 200 may include ground conductors, such as drain wires that may be terminated to corresponding contact pads 280 .

Cable 200 includes cable conductors 310 configured to terminate to corresponding contact pads 280 . For example, cable conductors 310 may be soldered to contact pads 280 . The cable conductors 310 may be exposed by stripping the ends of the cable 200 . Alternatively, the cables 200 may be twinaxial cables each having a pair of signal cable conductors 310 that carry differential pair signals. Optionally, each cable 200 may include ground cable conductors 310 , such as drain wires and/or cable braids, configured to electrically connect to the ground bus 302 .

FIG. 9 is a top perspective view of the cable receptacle connector assembly 102 according to an exemplary embodiment. 10 is a top view of a cable receptacle connector assembly 102 according to an exemplary embodiment. 11 is a bottom perspective view of a cable receptacle connector assembly 102 according to an exemplary embodiment. FIG. 12 is a bottom view of the cable receptacle connector assembly 102 according to an exemplary embodiment.

When assembled, the socket substrate 116 is retained in and supported by the socket frame 138 . The loading member 136 and the insulator 240 are coupled to the socket substrate 116 . The cable assembly 108 extends from the receptacle assembly 106 . The cable 200 is terminated to the receptacle substrate conductors 118 of the receptacle substrate 116 . The cable subassemblies 202 extend from the receptacle substrate 116 in respective directions. In the illustrated embodiment, the cable subassembly 202 is shown extending from all four sides of the receptacle substrate 116 (eg, from the first side wall 270, from the second side wall 272, from the first end wall 274 and from the second end wall); however, in alternative embodiments, fewer cable subassemblies 202 may be provided, such as from three sides, two sides, or a single side. In the illustrated embodiment, the cable subassembly 202 is shown with corresponding receptacle substrate conductors 118 terminated on the upper surface 260 and the lower surface 262; however, in alternate embodiments, the cable subassembly 202 may be provided only on the upper surface 260 and the lower surface 262. On surface 260 or only on lower surface 262.

In the exemplary embodiment, the bottom of the cable receptacle connector assembly 102 is configured to be electrically connected to the electronic package 104 . Thus, the socket contacts 220 ( FIG. 11 ) extend from the lower surface 262 of the socket substrate 116 . The receptacle contacts 220 are terminated at the lower surface 262 to corresponding receptacle substrate conductors 118, eg, press fit in corresponding through holes 282 (FIG. 12). The receptacle substrate conductors 118 on the upper surface 260 are routed through the receptacle substrate 116 to the lower surface 262 for electrical connection with the corresponding receptacle contacts 220 at the lower surface 262 .

FIG. 13 is an enlarged bottom view of a portion of the cable receptacle connector assembly 102 . Cable 200 is shown terminated to receptacle assembly 106 . In the illustrated embodiment, each cable 200 includes a pair of signal cable conductors 312 and a ground cable connector 314 . The signal cable conductors 312 are stripped at the ends of the cable 200 and are configured to be soldered to corresponding contact pads 280 . In the illustrated embodiment, the ground cable conductors 314 include drain wires and/or cable braids of the cable 200 . Ground cable conductors 314 are electrically connected to panel 304 of ground bus 302 . Ground fingers 306 extend from panel 304 to terminate to corresponding contact pads 280 . Optionally, ground fingers 306 may be soldered to contact pads 280 . In the illustrated embodiment, the contact pads 280 are arranged in a ground-signal-signal-ground arrangement for termination to the signal cable conductors 312 and the ground cable conductors 314 . Optionally, the cable receptacle connector assembly 102 may include one or more strain relief features for securing the cable 200 to the receptacle assembly 106 . Strain relief features may extend from or connect to the socket frame 138 .

The receptacle contacts 220 extend from the lower surface 262 of the receptacle substrate 116 . Stabilizing beams 228 stabilize the receptacle contacts 220 at the lower surface 262 . Spring beams 230 extend below lower surface 262 and position receptacle contacts 220 for electrical connection with electronic package 104 . The receptacle contacts 220 are arranged in an array, such as a grid. The receptacle contacts 220 may be signal receptacle contacts or ground receptacle contacts. Alternatively, the signal receptacle contacts may be arranged in pairs surrounded by corresponding ground receptacle contacts, which provide electrical shielding between the corresponding signal receptacle contacts. The receptacle contacts 220 may include power receptacle contacts. The receptacle contacts 220 are electrically connected to corresponding contact pads 280 on the upper surface 260 or the lower surface 262 . The receptacle contacts 220 are associated with package contacts 156 (eg, SMT pads) on the upper surface 152 of the electronic package 104 .

FIG. 14 is a side view of a portion of electronic system 100 showing cable receptacle connector assembly 102 ready to mate with electronic enclosure 104 . FIG. 15 is a side view of a portion of electronic system 100 showing cable receptacle connector assembly 102 mated with electronic enclosure 104 . FIG. 16 is an enlarged side view of a portion of electronic system 100 showing cable receptacle connector assembly 102 ready to mate with electronic enclosure 104 . FIG. 17 is an enlarged side view of a portion of electronic system 100 showing cable receptacle connector assembly 102 mated with electronic enclosure 104 .

During mating, the cable receptacle connector assembly 102 is aligned with and lowered onto the electronic package 104 . The receptacle contacts 220 are used for electrical connection to the receptacle assembly 106 and the electronic package 104 . The socket contacts 220 extend from the lower surface 262 of the socket substrate 116 and are spring loaded against the substrate 150 of the electronic package 104 . The spring beams 230 are deflectable between the socket substrate 116 and the substrate 150 of the electronic package 104 . The mating ends 226 of the receptacle contacts 220 are aligned with corresponding package contacts 156 on the upper surface 152 of the substrate 150 of the electronic package 104 . The receptacle assembly 106 is configured to be compressed in the downward direction 320 to deflect the receptacle contacts 220 and spring-load the receptacle contacts 220 against the electronic package 104 . For example, the heat sink 130 may be pressed down against the socket assembly 106 . In the exemplary embodiment, the loading member 136 distributes the load from the heat sink 130 to press down on the receptacle assembly 106 and compress the receptacle contacts 220 . In other various embodiments, the socket contacts 220 may be solder balls, such as BGAs, that are configured to be soldered to the electronic package 104 rather than having compressible socket contacts 220 .

The receptacle assembly 106 is used to attach the cable 200 of the cable assembly 108 directly to the electronic enclosure 104 . The cable conductors 310 are electrically connected to the corresponding package contacts 156 of the electronic package 104 through the socket contacts 220 and the socket substrate conductors 118 . The electrical path does not pass through the main circuit board 110 to the cable assembly 108 . The electrical paths between the cable conductors 310 and the electronic package 104 are short and there are few electrical interfaces. Electronic system 100 provides good electrical performance for high speed signals from electronic package 104 . The electronic system 100 provides electrical connections to the upper surface 152 and the lower surface 154 of the substrate 150 of the electronic package 104 to provide a higher density and/or a smaller footprint. By connecting the cables 200 of the cable assemblies 108 to the receptacle assemblies 106, the electronic system 100 eliminates the need for routing high-speed signals through the main circuit board 110 and/or through separate electrical connectors mounted to the main circuit board 110, eliminating components costs and assembly of components to reduce costs.

18 is a side view of a portion of electronic system 100 showing cable receptacle connector assembly 102 mated with electronic package 104 and main circuit board 110, according to an exemplary embodiment. In the illustrated embodiment, the electronic package 104 is mated to the top of the cable receptacle connector assembly 102 , and the cable receptacle connector assembly 102 is mated to the top of the main circuit board 110 . For example, receptacle contacts 220 (shown in FIG. 6 ) may be provided on the top and bottom of the receptacle substrate 116 . Heat spreader 130 may be thermally coupled to electronic package 104 .

19 is a side view of a portion of electronic system 100 showing cable receptacle connector assembly 102 mated with electronic package 104 and showing the electronic package mated with main circuit board 110 in accordance with an exemplary embodiment 104. In the illustrated embodiment, the electronic enclosure 104 mates with the top of the cable receptacle connector assembly 102 . For example, receptacle contacts 220 (shown in FIG. 6 ) may be disposed on the top of the receptacle substrate 116 to mate to the bottom of the electronic package 104 . The electronic package 104 is mated to the bottom of the main circuit board 110, eg, using a ball grid array. Heat spreader 130 may be thermally coupled to electronic package 104 .

Claims (15)

1. the cable socket connector assembly (102) that one kind is used for electronic system (100), comprising:

Jack assemblies (106) comprising the socket substrate (116) with socket substrate conductor (118), the jack assemblies have The receptacle connector (220) extended between termination end (224) and abutting end (226), the termination end terminate to corresponding socket Substrate conductor, the abutting end are configured to terminate to the corresponding packaging part touching of the electronic packing piece (104) of the electronic system Head (156)；And

CA cable assembly (108), terminates to the jack assemblies, and the CA cable assembly has the array of cable (200), Mei Ge electricity Cable has the cable conductor (310) for terminating to corresponding socket substrate conductor；

Wherein, the receptacle connector and the corresponding socket substrate conductor are limited to the cable conductor and the electricity of the cable Electric pathway (112) between the package conductor of sub- packaging part.

2. cable socket connector assembly (102) as described in claim 1, wherein the abutting end of the receptacle connector (220) (226) jack assemblies (106) are electrically connected by the packaging part contact (156) for directly engaging the electronic packing piece (104) Cable conductor (310) to the electronic packing piece, also, the cable (200) directly engages the socket substrate conductor (118), the CA cable assembly (108) is electrically connected to the jack assemblies.

3. cable socket connector assembly (102) as described in claim 1, wherein the abutting end of the receptacle connector (220) It (226) include spring beam (230), the spring beam is configured to elastic deflection against the electronic packing piece (104).

4. cable socket connector assembly (102) as described in claim 1 further includes engaging the jack assemblies (106) Loaded members (136), the loaded members have at least one loading beam (210), at least one described loading beam is inserted described Apply downward spring force on seat substrate (116), to bias the receptacle connector (220) against the electronic packing piece (104) Packaging part contact (156).

5. cable socket connector assembly (102) as described in claim 1, wherein the cable conductor (310) is welded to institute State corresponding socket substrate conductor (118).

6. cable socket connector assembly (102) as described in claim 1, wherein the receptacle connector (220) is configured to Corresponding packaging part contact of the spring loads against the electronic packing piece (104) at separable mating interface (120) (156)。

7. cable socket connector assembly (102) as described in claim 1, wherein the socket substrate (116) includes upper table Face (260) and lower surface (262), the receptacle connector (220) extend from the lower surface to engage the electronic packing piece (104) upper surface.

8. cable socket connector assembly (102) as claimed in claim 7, wherein the socket substrate conductor (118) has The termination end (224) of plated through hole (282), the receptacle connector (220) receives in corresponding plated through hole.

9. cable socket connector assembly (102) as claimed in claim 7, wherein the socket substrate conductor (118) includes Engagement pad (280) at least one of the upper surface (260) and the lower surface (262), the cable conductor (310) the corresponding engagement pad of the socket substrate conductor is terminated to.

10. cable socket connector assembly (102) as described in claim 1, wherein the receptacle connector (220) includes letter Number receptacle connector and grounding receptacle contact, the signal plug contact arrangement is pairs of, and the cable conductor (310) includes signal electricity Cable conductor and earth cable conductor, the signal cable conductor are arranged to pair in each cable (200), and the signal cable is led Body end is connected to corresponding signal plug contact, and the earth cable conductor termination is to corresponding grounding receptacle contact.

11. cable socket connector assembly as described in claim 1, wherein the socket substrate (116) includes limiting periphery The outer edge (268) on side and the inward flange (266) for limiting receptacle openings (170), the receptacle openings are configured to receive electronic seal Piece installing, the socket substrate conductor (118) arrange that the signal contact is along described along at least one of described outer edge At least one of inward flange arrangement.

12. cable socket connector assembly as described in claim 1, wherein the socket substrate (116) includes the first side wall With second sidewall (270,272) and the first end wall and the second end wall (274,276), the socket substrate conductor (118) along At least one of the first side wall and second sidewall (270,272) arrangement.

13. cable socket connector assembly as claimed in claim 12, wherein the socket substrate conductor (118) is along institute State at least one of the first end wall and the second end wall (274,276) arrangement.

14. cable socket connector assembly as described in claim 1, wherein the socket substrate (116) includes by wherein Receptacle openings (170), the receptacle openings are configured to receive the electronic packing piece.

15. cable socket connector assembly as described in claim 1, wherein the jack assemblies and the CA cable assembly are matched It is set to the gap (172) received between the electronic packing piece and the radiator (130) for being thermally coupled to the electronic packing piece In.