CN110066981B - Forward-loading substrate positioning device and substrate loading method - Google Patents
Forward-loading substrate positioning device and substrate loading method Download PDFInfo
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- CN110066981B CN110066981B CN201910520212.5A CN201910520212A CN110066981B CN 110066981 B CN110066981 B CN 110066981B CN 201910520212 A CN201910520212 A CN 201910520212A CN 110066981 B CN110066981 B CN 110066981B
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- 239000000758 substrate Substances 0.000 title claims abstract description 81
- 238000011068 loading method Methods 0.000 title claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 39
- 238000000576 coating method Methods 0.000 claims abstract description 39
- 238000005452 bending Methods 0.000 claims description 2
- 239000006223 plastic coating Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 49
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000013077 target material Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a forward substrate positioning device and a substrate loading method, which relate to the technical field of film plating, and the forward substrate positioning device provided by the invention comprises: base plate, clamp plate and connecting piece, the connecting piece includes: the extension part is connected with the substrate, and one end of the extension part, which is away from the substrate, is connected with the boss part; the pressing plate is provided with a first through groove and a coating through hole, the first through groove and the coating through hole are arranged at intervals, and the connecting piece is inserted into the first through groove; the first through groove includes: the first end groove part is communicated with the first radial groove part and penetrates through the pressing plate respectively; the groove width of the first end groove part is larger than or equal to the diameter of the boss part, and the groove width of the first diameter groove part is smaller than the diameter of the boss part.
Description
Technical Field
The invention relates to the technical field of film plating, in particular to a normal substrate positioning device and a substrate loading method.
Background
When using a sputter coater, it is often necessary to attach the coated sheet to a substrate. In the prior art, a double-sided adhesive tape bonding or fixture fixing mode is generally adopted to realize the connection of the plating film and the substrate. However, the double-sided adhesive tape not only can generate glue marks on the plating film, but also can easily cause the breakage of the plating film when the plating film is disassembled due to the action of the double-sided adhesive tape; the clamp can firmly connect the plating film on the substrate, and the plating film is not easy to crack, but the clamp in the prior art is complex in operation, so that the disassembly and assembly efficiency of the plating film is lower.
Disclosure of Invention
The invention aims to provide a normal substrate positioning device and a substrate loading method, which are used for solving the technical problem that the efficiency of disassembling and assembling a coated sheet of the existing normal substrate positioning device is low.
In a first aspect, the present invention provides a positive-mount substrate positioning device, comprising: base plate, clamp plate and connecting piece, the connecting piece includes: the extension part is connected with the substrate, and one end of the extension part, which is away from the substrate, is connected with the boss part; the pressing plate is provided with a first through groove and a coating through hole, the first through groove and the coating through hole are arranged at intervals, and the connecting piece is inserted into the first through groove; the first through groove comprises: a first end groove portion and a first diameter groove portion, which are communicated with each other and respectively penetrate through the pressing plate; the groove width of the first end groove part is larger than or equal to the diameter of the boss part, and the groove width of the first diameter groove part is smaller than the diameter of the boss part.
With reference to the first aspect, the present invention provides a first possible implementation manner of the first aspect, wherein an end surface of the pressing plate opposite to the substrate is provided with a side groove, and the side groove extends along a circumferential direction of the coating through hole.
With reference to the first aspect, the present invention provides a second possible implementation manner of the first aspect, wherein the boss portion increases in radial dimension from an end connected to the extension portion to an end facing away from the extension portion.
With reference to the first possible implementation manner of the first aspect, the present invention provides a third possible implementation manner of the first aspect, where the forward-installed substrate positioning device includes a middle clamping plate, a second through slot is provided on the middle clamping plate, the middle clamping plate is disposed between the base plate and the pressing plate, and the extension portion is inserted into the second through slot.
With reference to the third possible implementation manner of the first aspect, the present invention provides a fourth possible implementation manner of the first aspect, wherein the second through slot includes: the second end groove part is communicated with the second diameter groove part and penetrates through the middle clamping plate respectively, the groove width of the second end groove part is larger than or equal to the diameter of the boss part, and the groove width of the second diameter groove part is smaller than the diameter of the boss part.
With reference to the third possible implementation manner of the first aspect, the present invention provides a fifth possible implementation manner of the first aspect, wherein the middle clamping plate includes: the device comprises a middle plate body, a first convex edge and a second convex edge, wherein the first convex edge and the second convex edge are arranged at intervals and are respectively connected with the middle plate body, the first convex edge and the second convex edge are surrounded to form a clamping piece area, the radial size of the clamping piece area is smaller than that of the coating through hole, and the first convex edge and the second convex edge are inserted into the side groove.
With reference to the fifth possible implementation manner of the first aspect, the present invention provides a sixth possible implementation manner of the first aspect, wherein the middle plate body is provided with a middle plate through hole, the middle plate through hole is located in the clamping piece area, and a radial dimension of the middle plate through hole is smaller than a radial dimension of the clamping piece area.
With reference to the third possible implementation manner of the first aspect, the present invention provides a seventh possible implementation manner of the first aspect, wherein a first limiting portion is connected to a side wall of the side groove facing the axis of the plated through hole; the middle clamping plate is provided with a second limiting part which is matched with the first limiting part.
In combination with the first aspect, a convex cylindrical surface is arranged on one side of the substrate facing the pressing plate, and the coating through hole is opposite to the convex cylindrical surface; the connecting pieces are arranged in more than or equal to two, and are used for enabling the pressing plate to bend along the circumference of the convex cylindrical surface.
In a second aspect, the present invention provides a substrate loading method, comprising the steps of: placing a coated substrate between a base plate and a pressing plate; the boss part passes through the first end groove part, and the first end groove part is sleeved with the extension part; the pressing plate is slid along the direction vertical to the axis of the connecting piece, so that the extension part slides into the first radial groove part, and the boss part is abutted against one side of the sliding pressing plate, which is away from the substrate.
The embodiment of the invention has the following beneficial effects: the connecting piece comprises an extending part and a boss part, the extending part is connected with the substrate, one end of the extending part, which is away from the substrate, is connected with the boss part, a first through groove and a film plating through hole are formed in the pressing plate, the first through groove and the film plating through hole are arranged at intervals, the connecting piece is inserted into the first through groove, the first through groove comprises a first end groove part and a first diameter groove part, the first end groove part and the first diameter groove part are communicated and respectively penetrate through the pressing plate, the groove width of the first end groove part is larger than or equal to the diameter of the boss part, the groove width of the first diameter groove part is smaller than the diameter of the boss part, the clamping of a film plating piece can be realized through the substrate and the pressing plate, and a target material can pass through the film plating through hole to film plating the film plating piece; the connecting piece can slide along the first through groove through the sliding pressing plate, so that the pressing plate and the plating film piece can be disassembled and assembled, the operation difficulty of disassembling and assembling the plating film piece is reduced, and the work efficiency of disassembling and assembling the plating film piece is improved.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the related art, the drawings that are required to be used in the description of the embodiments or the related art will be briefly described, and it is apparent that the drawings in the description below are some embodiments of the present invention, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.
FIG. 1 is a cross-sectional view of a positive-mount substrate positioning apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a platen of a positive substrate positioning apparatus according to an embodiment of the present invention;
FIG. 3 is a second schematic view of a platen of a positive-mount substrate positioning apparatus according to an embodiment of the present invention;
FIG. 4 is an enlarged view of a portion of the position A of FIG. 3;
FIG. 5 is a schematic view of a connector of a positive-mount substrate positioning device according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a positive substrate positioning device according to an embodiment of the present invention;
FIG. 7 is a schematic view of a middle clamping plate of a positive substrate positioning device according to an embodiment of the present invention;
FIG. 8 is a second cross-sectional view of a positive-mount substrate positioning apparatus according to an embodiment of the present invention;
FIG. 9 is an enlarged view of a portion of the B position of FIG. 8;
fig. 10 is a cross-sectional view of a base plate of a positive-mount substrate positioning device according to an embodiment of the present invention.
Icon: 1-a substrate; 11-an outer convex cylindrical surface; 2-pressing plates; 21-a first through groove; 211-a first end slot portion; 212-a first diameter groove portion; 22-coating film through holes; 23-edge grooves; 24-a first limit part; 3-connectors; 31-an extension; 32-boss portions; 4-middle clamping plate; 41-a middle plate body; 411-second end slot portion; 412-a second diameter groove portion; 413—a middle plate through hole; 42-a first ledge; 43-second ledge.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Example 1
As shown in fig. 1, 2 and 5, the positioning device for a front-mounted substrate provided in the embodiment of the invention includes: base plate 1, clamp plate 2 and connecting piece 3, connecting piece 3 includes: extension 31 and boss 32, extension 31 is connected with base plate 1, one end of extension 31 away from base plate 1 is connected with boss 32; the pressing plate 2 is provided with a first through groove 21 and a coating through hole 22, the first through groove 21 and the coating through hole 22 are arranged at intervals, and the connecting piece 3 is inserted into the first through groove 21; the first through groove 21 includes: a first end groove 211 and a first diameter groove 212, the first end groove 211 and the first diameter groove 212 communicating and penetrating the platen 2, respectively; the groove width of the first end groove portion 211 is equal to or larger than the diameter of the boss portion 32, and the groove width of the first diameter groove portion 212 is smaller than the diameter of the boss portion 32. Wherein, the cross section of the first through groove 21 is trapezoid, the first end groove 211 is close to one end of the long side of the cross section, and the first diameter groove 212 is close to one end of the short side of the cross section; alternatively, the first end groove 211 is a first through hole, the first diameter groove 212 is a second through hole, the cross-sectional shapes of the first through hole and the second through hole are circular, the aperture of the first through hole is larger than that of the second through hole, and the cross section of the first through groove 21 is composed of two circular profiles intersecting each other.
Specifically, the radial dimension of the extension portion 31 is smaller than or equal to the groove width of the first radial groove portion 212 and smaller than the diameter of the boss portion 32, the coating film is placed between the substrate 1 and the pressing plate 2, the boss portion 32 passes through the first end groove portion 211 until the first end groove portion 211 is sleeved on the extension portion 31, the pressing plate 2 is slid along the extending direction of the first through groove 21, the extension portion 31 is slid into the first radial groove portion 212, and accordingly the boss portion 32 can be abutted against one side of the pressing plate 2, which is away from the substrate 1, so that the coating film is clamped between the substrate 1 and the pressing plate 2, and the target can pass through the coating film through hole 22 to be adsorbed on the coating film. When the plating film is to be removed, the pressing plate 2 is slid in the opposite direction so that the extension 31 slides into the first end groove portion 211, so that the pressing plate 2 can be moved in a direction away from the substrate 1, and the connecting piece 3 can be pulled out of the first through groove 21, so that the plating film can be picked up.
As shown in fig. 3 and 4, the end surface of the platen 2 opposite to the substrate 1 is provided with a side groove 23, and the side groove 23 extends in the circumferential direction of the plating through hole 22. Wherein, the diameter of the coating through hole 22 is smaller than the diameter of the coating film piece, the outer diameter of the side groove 23 is larger than the diameter of the coating film piece, and when the coating film piece is clamped between the base plate 1 and the pressing plate 2, the side groove 23 can accommodate the coating film substrate with a certain thickness, thereby avoiding the rupture or scratch of the coating film substrate caused by overlarge pressure of the pressing plate 2 on the coating film substrate.
As shown in fig. 5, the boss portion 32 increases in radial dimension from the end of the connection extension 31 toward the end facing away from the extension 31. On a section through the axis of the extension 31, the side surface of the boss portion 32 is inclined from one end close to the extension 31 to one end far from the extension 31 in a direction away from the axis of the extension 31. When the connector 3 slides from the first end groove 211 into the first diameter groove 212, the side surface of the boss 32 presses one end of the side wall of the first diameter groove 212 away from the substrate 1, so that the side surface of the boss 32 plays a guiding role on the platen 2. The final boss portion 32 abuts against the end face of the side, away from the substrate 1, of the pressing plate 2, the first radial groove portion 212 is slidably sleeved on the extending portion 31, and the pressing plate 2 applies pressure towards the direction of the substrate 1, so that a film plating sheet between the substrate 1 and the pressing plate 2 is clamped. The extension portion 31 is fixedly connected with the substrate 1 or is connected with the substrate 1 by screw fit, for example, the extension portion 31 is connected with the substrate 1 by screw fit, and the boss portion 32 can be moved towards or away from the substrate 1 by rotating the connecting piece 3, so that the acting force applied when the plating film is clamped can be adjusted.
As shown in fig. 6, the normal substrate positioning device comprises a middle clamping plate 4, a second through groove is formed in the middle clamping plate 4, the middle clamping plate 4 is arranged between the base plate 1 and the pressing plate 2, and the extension part 31 is inserted into the second through groove. Wherein the second through groove and the first through groove 21 extend in the same direction, and a film plating sheet is placed between the middle clamping plate 4 and the pressing plate 2; when the plating film is required to be clamped, the pressing plate 2 and the middle clamping plate 4 are moved, the extension part 31 slides along the first through groove 21 and the second through groove, so that the boss part 32 is abutted against one side of the pressing plate 2, which is away from the middle clamping plate 4, and the plating film is clamped by the pressing plate 2 and the middle clamping plate 4; when the plating film is required to be detached, the pressing plate 2 and the middle clamping plate 4 are moved to enable the boss part 32 to be opposite to the first end groove part 211, so that the plating film and the pressing plate 2 can be detached; in the process, the plating film is arranged between the pressing plate 2 and the middle clamping plate 4, and friction between the plating film and the substrate 1 can be avoided through the middle clamping plate 4, so that scratching of the plating film can be avoided.
As shown in fig. 7, the second through slot includes: the second end slot 411 and the second diameter slot 412 are connected, and the second end slot 411 and the second diameter slot 412 are respectively penetrated through the middle clamping plate 4, the slot width of the second end slot 411 is larger than or equal to the diameter of the boss 32, and the slot width of the second diameter slot 412 is smaller than the diameter of the boss 32. When the first through groove 21 is sleeved on the connecting piece 3, the first end groove part 211 is opposite to the second end groove part 411, the first diameter groove part 212 is opposite to the second diameter groove part 412, and when the boss part 32 is opposite to the first end groove part 211, the pressing plate 2 and the middle clamping plate 4 can be detached from the connecting piece 3.
As shown in fig. 7, 8 and 9, the middle clamping plate 4 includes: the middle plate body 41, the first protruding edge 42 and the second protruding edge 43 are arranged at intervals, and are respectively connected with the middle plate body 41, the first protruding edge 42 and the second protruding edge 43 enclose to form a clamping piece area, the radial size of the clamping piece area is smaller than the radial size of the coating film through hole 22, and the first protruding edge 42 and the second protruding edge 43 are inserted into the side groove 23. Wherein, a gap communicated with the clamping piece area is formed between the first convex edge 42 and the second convex edge 43, when the pressing plate 2 is separated from the middle clamping plate 4, a lamellar tool can be inserted between the coating film piece and the middle plate body 41 through the gap, so that the coating film piece can be tilted conveniently. A clamping piece area is formed between the first convex edge 42 and the second convex edge 43, the film plating piece is placed in the clamping piece area, and the film plating piece is limited through the first convex edge 42 and the second convex edge 43. In addition, when the connecting piece 3 is inserted into the first through groove 21 and the second through groove, the first convex edge 42 and the second convex edge 43 are inserted into the side groove 23, and the side groove 23 limits the first convex edge 42 and the second convex edge 43, so that the plating film sheet in the clamping piece area is coaxial with the plating film through hole 22, and the target material is sputtered on the plating film sheet through the plating film through hole 22.
As shown in fig. 7, the middle plate body 41 is provided with a middle plate through hole 413, the middle plate through hole 413 is located in the clip area, and the radial dimension of the middle plate through hole 413 is smaller than the radial dimension of the clip area. By providing the middle plate through hole 413 on the middle plate body 41, the contact area between the middle plate body 41 and the plating film is reduced, so that the abrasion of the middle plate body 41 to the plating film can be reduced.
Further, a first limiting part 24 is connected to the side wall of the side groove 23 facing the axis of the coating through hole 22; the middle clamping plate 4 is provided with a second limiting part which is matched with the first limiting part 24. The first limiting part 24 is a bump, the second limiting part is a groove matched with the bump, and the first limiting part 24 is matched with the second limiting part, so that the accurate connection position of the pressing plate 2 and the middle clamping plate 4 can be ensured, and the coating through hole 22 is coaxial with the clamping piece area; or, the first limiting portion 24 is a plurality of first protruding blocks arranged along the circumferential direction of the side groove 23 at intervals, the second limiting portion is a plurality of second protruding blocks arranged along the circumferential direction of the first protruding edge 42 and the second protruding edge 43 at intervals, and when the first protruding edge 42 and the second protruding edge 43 are inserted into the side groove 23, the first protruding blocks and the second protruding blocks are arranged in a staggered manner, so that the platen 2 can be prevented from rotating relative to the middle clamping plate 4 around the axis of the film plating through hole 22.
Furthermore, two coating through holes 22 are formed in the pressing plate 2, the two coating through holes 22 are arranged at intervals, two coating sheets can be clamped between the pressing plate 2 and the middle clamping plate 4, and targets can pass through the coating through holes 22 to be respectively sputtered on the two coating sheets, so that the two coating sheets can be dismounted and coated simultaneously.
As shown in fig. 10, a convex cylindrical surface 11 is arranged on one side of the base plate 1 facing the pressing plate 2, and a coating through hole 22 is arranged opposite to the convex cylindrical surface 11; the number of the connecting pieces 3 is two or more, and the connecting pieces are used for bending the pressing plate 2 along the circumference of the convex cylindrical surface 11. When the boss part 32 is abutted against the end face of one side of the pressing plate 2, which is away from the substrate 1, the pressing force of the boss part 32 on the pressing plate 2 can enable the pressing plate 2 and the film plating piece to bend along the circumference of the convex cylindrical surface 11, when the film plating piece rotates in the inner cavity of the film plating machine, the bent film plating piece can approach to the coaxial direction with the driving shaft of the film plating machine, and further the distances from each position on the film plating piece to the target are ensured to be approximately equal, so that the thickness uniformity of the sputtered film plating on the film plating piece can be ensured.
Example two
The substrate loading method provided by the embodiment of the invention comprises the following steps: placing a coated substrate between a base plate 1 and a pressing plate 2; passing the boss portion 32 through the first end groove portion 211, and sleeving the first end groove portion 211 with the extension portion 31; the platen 2 is slid in a direction perpendicular to the axis of the connector 3, so that the extension portion 31 slides into the first radial groove portion 212, and the boss portion 32 abuts against a side of the sliding platen 2 facing away from the substrate 1. By the boss portion 32 abutting against the platen 2, a force in the direction of the substrate 1 can be applied to the platen 2, and the plating sheet can be sandwiched between the substrate 1 and the platen 2.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (9)
1. A positive-fit substrate positioning device, comprising: base plate (1), clamp plate (2) and connecting piece (3), connecting piece (3) include: an extension part (31) and a boss part (32), wherein the extension part (31) is connected with the substrate (1), and one end of the extension part (31) away from the substrate (1) is connected with the boss part (32);
the pressing plate (2) is provided with a first through groove (21) and a coating through hole (22), the first through groove (21) and the coating through hole (22) are arranged at intervals, and the connecting piece (3) is inserted into the first through groove (21);
the first through groove (21) includes: a first end groove (211) and a first diameter groove (212), wherein the first end groove (211) and the first diameter groove (212) are communicated and respectively penetrate through the pressing plate (2);
the radial dimension of the extension part (31) is smaller than or equal to the groove width of the first diameter groove part (212), the groove width of the first end groove part (211) is larger than or equal to the diameter of the boss part (32), and the groove width of the first diameter groove part (212) is smaller than the diameter of the boss part (32);
a convex cylindrical surface (11) is arranged on one side of the substrate (1) facing the pressing plate (2), and the coating through hole (22) is opposite to the convex cylindrical surface (11);
the connecting pieces (3) are more than or equal to two, and are used for bending the pressing plate (2) along the circumference of the convex cylindrical surface (11).
2. The positive-mount substrate positioning device according to claim 1, wherein an end surface of the pressing plate (2) opposite to the base plate (1) is provided with a side groove (23), and the side groove (23) extends in a circumferential direction of the coating through hole (22).
3. The positive-going substrate positioning device according to claim 1, wherein the boss portion (32) increases in radial dimension from an end to which the extension portion (31) is attached to an end facing away from the extension portion (31).
4. The positive-mount substrate positioning device according to claim 2, wherein the positive-mount substrate positioning device comprises a middle clamping plate (4), a second through groove is formed in the middle clamping plate (4), the middle clamping plate (4) is arranged between the base plate (1) and the pressing plate (2), and the extension part (31) is inserted into the second through groove.
5. The positive-going substrate positioning device of claim 4, wherein said second through slot comprises: the second end groove part (411) and the second diameter groove part (412), the second end groove part (411) and the second diameter groove part (412) are communicated and respectively penetrate through the middle clamping plate (4), the groove width of the second end groove part (411) is larger than or equal to the diameter of the boss part (32), and the groove width of the second diameter groove part (412) is smaller than the diameter of the boss part (32).
6. The positive-fit substrate positioning device according to claim 4, wherein the middle clamping plate (4) comprises: the novel high-strength plastic coating device comprises a middle plate body (41), a first convex edge (42) and a second convex edge (43), wherein the first convex edge (42) and the second convex edge (43) are arranged at intervals and are respectively connected with the middle plate body (41), the first convex edge (42) and the second convex edge (43) enclose to form a clamping piece area, the radial size of the clamping piece area is smaller than that of the coating through hole (22), and the first convex edge (42) and the second convex edge (43) are both inserted into the side groove (23).
7. The positive-fit substrate positioning device according to claim 6, wherein a middle plate through hole (413) is provided on the middle plate body (41), the middle plate through hole (413) is located in the clip area, and a radial dimension of the middle plate through hole (413) is smaller than a radial dimension of the clip area.
8. The positioning device for the normal substrate according to claim 4, wherein a first limiting part (24) is connected to a side wall of the side groove (23) facing the axis of the coating through hole (22);
the middle clamping plate (4) is provided with a second limiting part which is matched with the first limiting part (24).
9. A substrate loading method using the normal substrate positioning apparatus according to any one of claims 1 to 8, comprising the steps of:
placing a coated substrate between a base plate (1) and a pressing plate (2);
passing the boss portion (32) through the first end groove portion (211), and fitting the first end groove portion (211) with the extension portion (31);
sliding the pressing plate (2) along the direction perpendicular to the axis of the connecting piece (3), sliding the extension part (31) into the first radial groove part (212), and enabling the boss part (32) to be abutted against one side of the sliding pressing plate (2) deviating from the base plate (1);
and respectively fastening a plurality of connecting pieces (3) so that the pressing plate (2) presses the film-coated substrate and bends the film-coated substrate along the substrate (1) towards the convex cylindrical surface (11) of the pressing plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910520212.5A CN110066981B (en) | 2019-06-17 | 2019-06-17 | Forward-loading substrate positioning device and substrate loading method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910520212.5A CN110066981B (en) | 2019-06-17 | 2019-06-17 | Forward-loading substrate positioning device and substrate loading method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110066981A CN110066981A (en) | 2019-07-30 |
| CN110066981B true CN110066981B (en) | 2023-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910520212.5A Active CN110066981B (en) | 2019-06-17 | 2019-06-17 | Forward-loading substrate positioning device and substrate loading method |
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1800436A (en) * | 2005-01-05 | 2006-07-12 | 三星Sdi株式会社 | Device for the calibration of salver and its fixer |
| JP2006233236A (en) * | 2005-02-22 | 2006-09-07 | Shin Meiwa Ind Co Ltd | A substrate stand for a film forming apparatus, a film forming apparatus, and a film forming method. |
| CN101358333A (en) * | 2007-08-02 | 2009-02-04 | 鸿富锦精密工业（深圳）有限公司 | Clamping device of sputtering substrate |
| TW200909599A (en) * | 2007-08-17 | 2009-03-01 | Hon Hai Prec Ind Co Ltd | Device for fixing backing |
| CN102007572A (en) * | 2008-04-16 | 2011-04-06 | 应用材料公司 | Wafer processing deposition shielding components |
| CN201952490U (en) * | 2010-12-06 | 2011-08-31 | 中国科学院上海硅酸盐研究所 | Coating clamp for coated substrate |
| CN102337511A (en) * | 2010-07-20 | 2012-02-01 | 东京毅力科创株式会社 | Shield member, components thereof and substrate mounting table comprising shield member |
| CN202830161U (en) * | 2012-07-18 | 2013-03-27 | 爱发科豪威光电薄膜科技(深圳)有限公司 | Glass substrate holder |
| JP2013065887A (en) * | 2012-12-25 | 2013-04-11 | Denso Corp | Electronic device |
| TW201447048A (en) * | 2013-03-04 | 2014-12-16 | Ebara Corp | Plating apparatus |
| CN105483652A (en) * | 2015-12-07 | 2016-04-13 | 武汉华星光电技术有限公司 | Chemical vapor deposition device and use method thereof |
| CN206570400U (en) * | 2017-03-28 | 2017-10-20 | 京东方科技集团股份有限公司 | Substrate fixture and sputter |
| CN207845819U (en) * | 2017-12-14 | 2018-09-11 | 南京仁厚科技有限公司 | A kind of upper plated film support plate |
| CN208266255U (en) * | 2018-05-17 | 2018-12-21 | 深圳市正和忠信股份有限公司 | A kind of PVD film coating jig of miniature workpiece |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104752274B (en) * | 2013-12-29 | 2017-12-19 | 北京北方华创微电子装备有限公司 | Processing chamber and semiconductor processing equipment |
-
2019
- 2019-06-17 CN CN201910520212.5A patent/CN110066981B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1800436A (en) * | 2005-01-05 | 2006-07-12 | 三星Sdi株式会社 | Device for the calibration of salver and its fixer |
| JP2006233236A (en) * | 2005-02-22 | 2006-09-07 | Shin Meiwa Ind Co Ltd | A substrate stand for a film forming apparatus, a film forming apparatus, and a film forming method. |
| CN101358333A (en) * | 2007-08-02 | 2009-02-04 | 鸿富锦精密工业（深圳）有限公司 | Clamping device of sputtering substrate |
| TW200909599A (en) * | 2007-08-17 | 2009-03-01 | Hon Hai Prec Ind Co Ltd | Device for fixing backing |
| CN102007572A (en) * | 2008-04-16 | 2011-04-06 | 应用材料公司 | Wafer processing deposition shielding components |
| CN102337511A (en) * | 2010-07-20 | 2012-02-01 | 东京毅力科创株式会社 | Shield member, components thereof and substrate mounting table comprising shield member |
| CN201952490U (en) * | 2010-12-06 | 2011-08-31 | 中国科学院上海硅酸盐研究所 | Coating clamp for coated substrate |
| CN202830161U (en) * | 2012-07-18 | 2013-03-27 | 爱发科豪威光电薄膜科技(深圳)有限公司 | Glass substrate holder |
| JP2013065887A (en) * | 2012-12-25 | 2013-04-11 | Denso Corp | Electronic device |
| TW201447048A (en) * | 2013-03-04 | 2014-12-16 | Ebara Corp | Plating apparatus |
| CN105483652A (en) * | 2015-12-07 | 2016-04-13 | 武汉华星光电技术有限公司 | Chemical vapor deposition device and use method thereof |
| CN206570400U (en) * | 2017-03-28 | 2017-10-20 | 京东方科技集团股份有限公司 | Substrate fixture and sputter |
| CN207845819U (en) * | 2017-12-14 | 2018-09-11 | 南京仁厚科技有限公司 | A kind of upper plated film support plate |
| CN208266255U (en) * | 2018-05-17 | 2018-12-21 | 深圳市正和忠信股份有限公司 | A kind of PVD film coating jig of miniature workpiece |
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| CN110066981A (en) | 2019-07-30 |
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