CN110058486A - The detection method of mask plate component and mask plate component splicing precision - Google Patents
The detection method of mask plate component and mask plate component splicing precision Download PDFInfo
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- CN110058486A CN110058486A CN201910231879.3A CN201910231879A CN110058486A CN 110058486 A CN110058486 A CN 110058486A CN 201910231879 A CN201910231879 A CN 201910231879A CN 110058486 A CN110058486 A CN 110058486A
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- 238000001514 detection method Methods 0.000 title claims abstract description 24
- 238000012360 testing method Methods 0.000 claims abstract description 95
- 238000003032 molecular docking Methods 0.000 claims abstract description 14
- 239000004020 conductor Substances 0.000 claims description 61
- 239000000463 material Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 3
- 229920005591 polysilicon Polymers 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
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- 239000010410 layer Substances 0.000 description 64
- 238000010586 diagram Methods 0.000 description 15
- 238000000605 extraction Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 238000010276 construction Methods 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
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- Measurement Of Resistance Or Impedance (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention discloses a kind of mask plate component and the detection methods of mask plate component splicing precision, mask plate component includes more than two mask plates, more than two mask plates can mutually be spliced to form preset mask pattern, mask plate includes: basal layer, including mask regions and it is looped around the unmasked areas of mask regions side, mask regions include the mask pattern unit for being spliced to form mask pattern, and unmasked areas includes the splicing regions for splicing；And resistive layer, it is set to splicing regions and extends preset width along the first direction for being parallel to splicing interface；Wherein, the resistive layer of two neighboring mask plate docks to form testing resistance, and the resistance value of testing resistance is inversely proportional with the size for docking contact area.The detection method of mask plate component and mask plate component splicing precision provided by the invention, can intuitively, effectively monitor the splicing precision of mask plate component.
Description
Technical field
The present invention relates to field of display technology, and in particular to the inspection of a kind of mask plate component and mask plate component splicing precision
Survey method.
Background technique
Display panel develop, especially in, large scale display panel exploitation during (such as car-mounted display panel),
In array substrate preparation, since exposure machine equipment, mask plate (mask) size be small etc., conditions are limited, often need to carry out mask plate
Splicing exposure.Splicing precision is low to will cause exposure figure exception, and display panel is caused to occur concealed wire, bright line etc. during display
Problem.
How intuitively, effectively mask plate splicing precision is measured and is monitored, become technical problem urgently to be resolved.
Summary of the invention
The embodiment of the present invention provides the detection method of a kind of mask plate component and mask plate component splicing precision, it is intended to straight
It sees, effectively measuring and monitoring mask plate component splicing precision.
First aspect of the embodiment of the present invention provides a kind of mask plate component, and mask plate component includes more than two exposure masks
Plate, more than two mask plates can mutually splice to form preset mask pattern, and mask plate includes: basal layer, including exposure mask
Area and the unmasked areas for being looped around mask regions side, mask regions include the mask pattern list for being spliced to form mask pattern
Member, unmasked areas include the splicing regions for splicing；And resistive layer, it is set to splicing regions and splices interface along being parallel to
First direction extend preset width；Wherein, the resistive layer of two neighboring mask plate docks to form testing resistance, testing resistance
Resistance value is inversely proportional with the size for docking contact area.
According to an aspect of an embodiment of the present invention, resistive layer includes multiple resistive conductors, and multiple resistive conductors are along first direction
It is successively arranged at intervals at unmasked areas, each resistive conductor has predetermined line width along first direction；Wherein, two neighboring mask plate
Multiple resistive conductors, which correspond, to be docked and is connected in series to form testing resistance.
According to an aspect of an embodiment of the present invention, the resistive layer of two neighboring mask plate docks the testing resistance to be formed and is in
It is snakelike.
According to an aspect of an embodiment of the present invention, splicing regions include being located at the first of mask regions two sides in a second direction
Region and second area, first area are equipped with multiple resistive conductors, and second area is equipped with multiple resistive conductors, second direction and first party
To intersection；In one mask plate in the multiple resistive conductors with another mask plate of first area second area multiple resistive conductor phases
Docking forms testing resistance.
According to an aspect of an embodiment of the present invention, splicing regions have the side edge extended in a first direction, mask plate
Spliced by side edge, resistive conductor has in side edge draws endpoint.
According to an aspect of an embodiment of the present invention, in side edge, the quantity of endpoint is drawn more than or equal to 100, and/
Or, the two neighboring spacing drawn between endpoint is greater than or equal to 3 μm.
According to an aspect of an embodiment of the present invention, the predetermined line width of resistive conductor is less than or equal to 3 μm；
And/or resistive conductor with a thickness of be less than or equal to 3 μm；
And/or the predetermined line width of resistive conductor and the ratio between the total length of testing resistance are 1:10000~1:1000.
It according to an aspect of an embodiment of the present invention, include two test contacts, two tests in two neighboring mask plate
Contact is connected to the both ends of testing resistance, and two test contacts are set to same mask plate or are divided into two mask plates.
According to an aspect of an embodiment of the present invention, the resistivity of the used material of resistive layer is 10-4Cm~10 Ω9
Ω cm, preferably semiconductor material, more preferably polysilicon and/or indium gallium zinc oxide.
On the other hand the embodiment of the present invention provides a kind of detection method of mask plate component splicing precision, method includes:
More than two mask plates are provided, mask plate includes basal layer and resistive layer, and basal layer includes mask regions and ring
It is wound on the unmasked areas of mask regions side, mask regions include mask pattern unit, and unmasked areas includes the splice region for splicing
Domain, resistive layer are set to splicing regions and extend preset width along the first direction for being parallel to splicing interface；
Splice more than two mask plates, mask pattern unit spliced is made to form preset mask pattern, it is two neighboring to cover
The resistive layer of diaphragm plate then is connected to each other to form testing resistance；
Detect the resistance value of testing resistance；
The splicing precision of two neighboring mask plate is determined according to resistance value.
The detection method of mask plate component and mask plate component splicing precision according to an embodiment of the present invention, on mask plate
It is provided with the resistive layer for extending preset width along the first direction for being parallel to splicing interface, mask plate component is spliced to form preset
Mask pattern, while the resistive layer of two neighboring mask plate docks to form testing resistance, the resistance value of testing resistance is with adjacent two
The difference of a mask plate splicing precision and it is different, therefore, by the resistance value of detection testing resistance, can be realized it is intuitive, accurate,
Effectively measuring and monitoring mask plate component splicing precision.
In some alternative embodiments, the resistive layer of mask plate includes multiple resistive conductors, and multiple resistive conductors are along first party
To being successively arranged at intervals at splicing regions, each resistive conductor has a default line width along first direction, two neighboring mask plate it is more
A resistive conductor, which corresponds, to be docked and is connected in series to form above-mentioned testing resistance, thereby increases testing resistance across stitching portion
Cabling quantity, the resistance value of testing resistance change with the difference of two neighboring mask plate splicing precision it is sensitiveer, from
And the splicing precision of mask plate component is fed back more accurately.
Detailed description of the invention
By reading detailed description of non-limiting embodiments referring to the drawings, other feature of the invention,
Objects and advantages will become more apparent upon, wherein the same or similar appended drawing reference indicates the same or similar feature, and attached drawing is simultaneously
It is not drawn according to actual ratio.
Fig. 1 shows the splicing construction schematic diagram of mask plate component according to an embodiment of the present invention；
Fig. 2 shows the partial structural diagrams in the area Tu1Zhong A；
Fig. 3 shows the resistance schematic diagram of a layer structure of two neighboring mask plate according to an embodiment of the present invention；
Fig. 4 shows the splicing construction schematic diagram of two neighboring mask plate in Fig. 3；
Fig. 5 shows the partial structural diagram in the area Tu4Zhong B；
Fig. 6 shows a kind of structural schematic diagram of mask plate according to an embodiment of the present invention；
Fig. 7 shows the splicing construction schematic diagram of mask plate in Fig. 6；
Fig. 8 shows the structural schematic diagram of another middle mask plate according to an embodiment of the present invention；
Fig. 9 shows the splicing construction schematic diagram of mask plate in Fig. 8；
Figure 10 shows the detection method flow chart of mask plate component splicing precision according to an embodiment of the present invention.
In figure:
100- mask plate；
110- basal layer；The mask regions 111-；112- unmasked areas；
120- resistive layer；121- resistive conductor；121a- first resistor line；121b- second resistance line；121c- 3rd resistor
Line；The 4th resistive conductor of 121d-；122- draws endpoint；
130- tests contact；
The first area S1-；S2- second area；
L1- first side edge；L2- second side edge.
Specific embodiment
The feature and exemplary embodiment of various aspects of the invention is described more fully below, in order to make mesh of the invention
, technical solution and advantage be more clearly understood, below in conjunction with drawings and the specific embodiments, the present invention is carried out further detailed
Description.It should be understood that specific embodiment described herein is only configured to explain the present invention, it is not configured as limiting this hair
It is bright.To those skilled in the art, the present invention can be in the case where not needing some details in these details
Implement.The description of embodiment is preferably managed just for the sake of being provided by showing example of the invention of the invention below
Solution.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence " including ... ", it is not excluded that including
There is also other identical elements in the process, method, article or equipment of the element.
Combine Fig. 1 to Fig. 9 that the mask plate component of the embodiment of the present invention is described in detail first.
Fig. 1 shows a kind of splicing construction schematic diagram of mask plate component according to an embodiment of the present invention, and Fig. 2 shows A in Fig. 1
The partial structural diagram in area.Please with reference to Fig. 1 and Fig. 2, mask plate component provided in an embodiment of the present invention include two with
On mask plate 100, each mask plate 100 include mask pattern unit (not shown), more than two mask plates 100
Can mutually it splice to form preset mask pattern (not shown), to be conveniently used in the preparation work of display panel
Skill, wherein in being conveniently used in, the preparation process of large scale display panel.
Wherein, mask plate 100 includes basal layer 110 and the resistive layer 120 being set on basal layer 110.Basal layer 110 wraps
It includes mask regions 111 and is looped around the unmasked areas 112 of 111 side of mask regions, mask regions 112 include above-mentioned mask pattern list
Member, unmasked areas 112 include the splicing regions for splicing.Resistive layer 120 is set to splicing regions and splices boundary along being parallel to
The first direction in face extends preset width.The docking of resistive layer 120 of two neighboring mask plate 100 forms testing resistance, electricity to be measured
The resistance value of resistance is inversely proportional with the size for docking contact area, and in other words, the splicing precision of two neighboring mask plate 100 changes
Become, the contact area that the resistive layer 120 of two mask plates 100 docks changes correspondingly, according to resistance formula, due to resistive layer
120 resistivity is certain and the length of testing resistance is certain, so as to cause testing resistance resistance value with docking contact area
Change and changes.
Above-mentioned resistance formula is
Wherein, R is the resistance value of testing resistance；ρ is the resistivity of testing resistance, is material used by resistive layer 120
The electrical properties of itself；L is the total length of testing resistance, the overall length for the testing resistance that two neighboring mask plate 100 is spliced to form
Degree is certain, does not change with the change of two neighboring mask plate 100 splicing precision；S is the cross-sectional area of testing resistance, with phase
Adjacent two mask plates 100 splice the change of precision and change, such as two neighboring mask plate 100 splices precision and reduces, and two
The contact area that the resistive layer 120 of a mask plate 100 docks reduces therewith, and the cross-sectional area of testing resistance is caused to reduce, thus
The resistance value R of testing resistance increases.
First direction is, for example, the X-direction in Fig. 1 and Fig. 2.
It is understood that having distinguished mask regions with being only through dotted line in Fig. 1 and Fig. 6, Fig. 8 hereafter
111 and unmasked areas 112, and in actual mask plate 100, the mark for distinguishing mask regions 111 and unmasked areas 112 can be set
Know line or other identifier, can also be not provided with.
Mask plate component according to an embodiment of the present invention, being provided on mask plate 100 has pre- fixed width along first direction
The resistive layer 120 of degree, mask plate component are spliced to form preset mask pattern, while the resistive layer of two neighboring mask plate 100
120, which occur docking, forms testing resistance, the resistance value of testing resistance with two neighboring mask plate 100 splicing precision it is different without
Together, therefore, by detecting the resistance value of testing resistance, it can be realized and intuitively, accurately and efficiently measure and monitor mask plate component
Splicing precision, and detect simple to operate, detection efficiency with higher.
It is understood that resistive layer 120 can be set in the surface of basal layer 110, such as two neighboring mask plate 100
The splicing for realizing mask plate 100 can be overlapped by splicing regions, resistive layer 120 is then set to the direction and its phase of a splicing regions
The surface for another splicing regions that overlapped, when the splicing regions of two mask plates 100 overlap joint, their resistive layer 120 is docked
Form testing resistance；Such as resistive layer 120 is set to the surface of basal layer 110 again, and has in the side edge of mask plate 100 and draw
Position out, two neighboring mask plate 100 are spliced by side edge, so that their docking of resistive layer 120 forms testing resistance.
Resistive layer 120 can also be the interlayer being set to inside basal layer 110, and have in the side edge of mask plate 100
Position is drawn, two neighboring mask plate 100 is spliced by side edge, so that their docking of resistive layer 120 forms testing resistance.
It will also be appreciated that resistive layer 120 can be continuous layer structure (as depicted in figs. 1 and 2), it is also possible to non-
The layer structure (as shown in Figure 3 and Figure 4) of connection, as long as the electricity to be measured that the docking of resistive layer 120 of two neighboring mask plate 100 is formed
The resistance value of resistance is inversely proportional with the size for docking contact area.
Fig. 3 shows 120 structural schematic diagram of resistive layer of two neighboring mask plate 100, and Fig. 4 shows two neighboring in Fig. 3 cover
The splicing construction schematic diagram of diaphragm plate 100, Fig. 5 show the partial structural diagram in the area Tu4Zhong B.Please with reference to Fig. 3 to Fig. 5,
In some embodiments, resistive layer 120 includes multiple resistive conductors 121, and multiple resistive conductors 121 are successively spaced setting along first direction
In splicing regions, each resistive conductor 121 has predetermined line width H along first direction；Wherein, two neighboring mask plate 100 is multiple
Resistive conductor 121, which corresponds, to be docked and is connected in series to form testing resistance.
In these embodiments, the resistive layer 120 of mask plate 100 includes multiple resistive conductors 121, multiple resistive conductors 121
Splicing regions are successively arranged at intervals at along first direction, each resistive conductor 121 has a predetermined line width H along first direction, and adjacent two
Multiple resistive conductors 121 of a mask plate 100, which correspond, to be docked and is connected in series to form above-mentioned testing resistance, is thus increased
Cabling quantity of the testing resistance across stitching portion, the resistance value of testing resistance with the difference of two neighboring mask plate splicing precision and
What is changed is sensitiveer, to feed back the splicing precision of mask plate component more accurately.
It is realized it is understood that the series connection of resistive conductor 121 can be by the electrode wires for being set to splicing regions
's.In other embodiments, the resistive layer 120 for being also possible to two neighboring mask plate 100 docks, and multiple resistive conductors can be realized
121 series connection forms testing resistance.
In some embodiments, the testing resistance that multiple resistive conductors 121 of two neighboring mask plate 100 are connected in series to form
It is serpentine-like.Thus, it is possible to increase the total length of testing resistance, be conducive to make the resistance value size of testing resistance appropriate, convenient for intuitive
Detection, and be conducive to improve the variation sensitivity of testing resistance.Even if two neighboring mask plate 100 occurs small inclined when splicing
It moves, the resistance value of testing resistance can also occur significantly to change, to intuitively, effectively show two neighboring mask plate 100
Splicing precision.
Further, the splicing regions of mask plate 100 have the side edge extended in a first direction, and mask plate 100 passes through
The side edge is spliced, and resistive conductor 121 has in side edge draws endpoint 122.The resistive layer of two neighboring mask plate 100
The 120 extraction endpoint 122 by being arranged in a one-to-one correspondence docks, and will not influence the splicing between mask plate 100.
Further, in the one side edge of mask plate 100, the quantity for drawing endpoint 122 is greater than or equal to 100.So that phase
Cabling quantity of the testing resistance across stitching portion that adjacent two mask plates 100 are spliced to form is more, feeds back mask plate more accurately
The splicing precision of component.
Further, the two neighboring spacing drawn between endpoint 122 is greater than or equal to 3 μm.Make multiple extraction endpoints 122
It is distributed in the appropriate section of side edge, can fully react the splicing precision of entire mask plate 100.
Further, the predetermined line width H of resistive conductor 121 is less than or equal to 3 μm.Make the predetermined line width H of resistive conductor 121 upper
It states in range, the resistance value of obtained testing resistance can preferably reflect the splicing precision between two mask plates, improve
Detect the accuracy of mask plate component splicing precision.
Further, the thickness of resistive conductor 121 is less than or equal to 3 μm.The thickness of resistive conductor 121 refers to resistive conductor 121
In the size of the thickness direction of mask plate 100, as Fig. 3 into Fig. 5 perpendicular to the direction of paper.The thickness of resistive conductor 121 is set to exist
In above range, the resistance value of obtained testing resistance can preferably reflect the splicing precision between two mask plates, mention
The accuracy of high detection mask plate component splicing precision.
Further, the ratio between total length of the predetermined line width H of resistive conductor 121 and testing resistance is 1:10000~1:1000.
The resistance value size for advantageously allowing testing resistance is appropriate, convenient for detection, and is conducive to improve the variation sensitivity of testing resistance,
To improve the accuracy and intuitive of detection mask plate component splicing precision.
In the mask plate component of the embodiment of the present invention, the resistive layer 120 of mask plate 100 can be using arbitrarily with appropriate electrical
The material of resistance rate, such as the resistivity of the used material of resistive layer 120 is 10-4Cm~10 Ω9Ω cm, then for example, 10-2
Cm~10 Ω6Ω·cm.Optionally, resistive layer 120 is used using active area in semiconductor material, such as semiconductor devices
Material, such as polysilicon and/or indium gallium zinc oxide, but not limited to this.It is formed using the docking of resistive layer 120 of above-mentioned material
Testing resistance, resistance value size is appropriate, and two neighboring mask plate 100 is when splicing when small offset occurs, testing resistance
Significant change can also occur for resistance value, and convenient for monitoring, testing result is intuitive, reliable.
In some embodiments, the structure having the same of mask plate 100 in mask plate component, therefore can appoint to take and cover
Diaphragm plate 100 carries out being spliced to form preset mask pattern, and replacement and the batch production processing of mask plate 100 are also more convenient.Fig. 6 shows
The structural schematic diagram of a kind of mask plate according to an embodiment of the present invention out, please with reference to Fig. 6, the splicing regions of mask plate 100
First area S1 and second area S2 including being located at 111 two sides of mask regions in a second direction, first area S1 are equipped with multiple electricity
Line 121 is hindered, second area S2 is equipped with multiple resistive conductors 121, and wherein second direction intersects with first direction, such as intersects vertically.
Please with reference to Fig. 7, multiple resistive conductors 121 of first area S1 and in another mask plate 100 second in a mask plate 100
Multiple resistive conductors 121 of region S2 are connected to each other to form testing resistance.
Second direction is, for example, the Y-direction in Fig. 6 and Fig. 7.
As a specific example, mask plate 100 has opposite first side edge L1 and second side in a second direction
The first area S1 of edge L2, mask plate 100 are adjacent with first side edge L1, and second area S2 is adjacent with second side edge L2.
First area S1 along first direction be sequentially arranged at intervals with first resistor line 121a, N number of second resistance line 121b with
And 3rd resistor line 121c, N >=1.Wherein one end of first resistor line 121a is drawn to obtain an exit by first side edge L1
Point 122, one end of 3rd resistor line 121c is drawn to obtain an extraction endpoint 122, second resistance line 121b by first side edge L1
Both ends drawn to obtain two extraction endpoints 122 by first side edge L1.
Second area S2 is sequentially arranged at intervals with N+1 the 4th resistive conductor 121d, the 4th resistive conductor 121d along first direction
Both ends drawn to obtain two extraction endpoints 122 by second side edge L2.
The extraction endpoint 122 of the extraction endpoint 122 of first side edge L1 orthographic projection in a second direction and second area S2
Orthographic projection in a second direction is completely coincident or partially overlaps.
The first side edge L1 of a mask plate 100 and the second side edge L2 phase of another mask plate 100 are spliced as a result,
When, in a mask plate 100 in the multiple resistive conductors 121 and another mask plate 100 of first area S1 second area S2 it is more
A resistive conductor 121 is connected to each other to form testing resistance, and testing resistance is in the form of a serpentine.
In this example, positioned at the resistive layer 110 of first area S1 and another mask plate 100 in a mask plate 100
In positioned at the resistive layer 110 of second area S2 be connected to each other the testing resistance to be formed, both ends are located on the same mask plate 100.
This makes the test point of testing resistance apart from relative close, more convenient test operation.
Further, first resistor line 121a can be is prolonged towards mask regions 111 in a second direction by first side edge L1
Stretch preset distance.Further, 3rd resistor line 121c can be by first side edge L1 in a second direction towards mask regions 111
Extend preset distance.Further, second resistance line 121b can be U-shaped, and has between U-shaped bottom edge and first side edge L1
There is preset distance.Further, the 4th resistive conductor 121d can be U-shaped, and has between U-shaped bottom edge and second side edge L2
Preset distance.
Certainly, first resistor line 121a and 3rd resistor line 121c are not limited to the linear type shown in figure, they can
To be each independently arbitrary curve.Similarly, second resistance line 121b and the 4th resistive conductor 121d is not limited to show in figure
That shows is U-shaped, they can be each independently arbitrary curve, such as camber line.As first resistor line 121a, second resistance line
121b, 3rd resistor line 121c and the 4th resistive conductor 121d be curve when, can effectively increase testing resistance length and
Reduce the occupied space of resistive layer 120, to be conducive to reduce the area occupied of unmasked areas 112, improves the benefit of mask plate 100
With rate.
As another specific example, Fig. 8 and Fig. 9 are please referred to, it is similar with the specific example of said one, it is different
It is that first area S1 is sequentially arranged at intervals with first resistor line 121a and M second resistance line 121b along first direction, M >=1,
Wherein one end of first resistor line 121a is drawn to obtain an extraction endpoint 122 by first side edge L1, second resistance line 121b's
It is drawn to obtain two extraction endpoints 122 by first side edge L1 in both ends；Second area S2 is successively spaced setting along first direction
There are M the 4th resistive conductor 121d and 3rd resistor line 121c, wherein one end of 3rd resistor line 121c is drawn by second side edge L2
An extraction endpoint 122 is obtained out, and the both ends of the 4th resistive conductor 121d are drawn to obtain two extraction endpoints by second side edge L2
122。
In this example, positioned at the resistive layer 110 of first area S1 and another mask plate 100 in a mask plate 100
In positioned at the resistive layer 110 of second area S2 be connected to each other the testing resistance to be formed, both ends are divided on two mask plates 100.
Other features in the specific example of said one also can be applied in another specific example, herein not
It repeats again.
In some embodiments, the docking of resistive layer 120 of two neighboring mask plate 100 forms testing resistance, testing resistance
Both ends be connected separately with test contact 130, test contact 130 be set to corresponding mask plate 100, specifically, as Fig. 2 to scheme
Shown in 9, tests one end coupled in contact 130 and testing resistance and be located at same mask plate 100, in order to detection device
Connection, facilitate test operation.Further, referring to figure 3. to shown in Fig. 7, two test contacts 130 are located at same mask plate
On 100, i.e., so that two test contact 130 apart from relative close, easily facilitate the connection of detection device, facilitate test grasp
Make.
A kind of detection method of mask plate component splicing precision provided in an embodiment of the present invention will be illustrated next, Figure 10 is shown
A kind of flow chart of the detection method of mask plate component splicing precision according to an embodiment of the present invention, please refers to Figure 10, method packet
It includes:
S10, provides more than two mask plates, and mask plate includes basal layer and resistive layer, basal layer include mask regions with
And it is looped around the unmasked areas of mask regions side, mask regions include mask pattern unit, and unmasked areas includes the spelling for splicing
Region is connect, resistive layer is set to splicing regions and extends preset width along the first direction for being parallel to splicing interface.
In step S10, more than two mask plates can be taken from the mask plate in any one of the above mask plate component
100。
S20 splices more than two mask plates, and mask pattern unit spliced is made to form preset mask pattern, and adjacent two
The resistive layer of a mask plate then is connected to each other to form testing resistance.
In step S20, as long as connecting method can be as it was noted above, can make the exposure mask figure of more than two mask plates
Case unit spliced forms preset mask pattern, and the resistive layer of two neighboring mask plate is connected to each other to form testing resistance.
S30 detects the resistance value of testing resistance.
In step S30, the resistance value of detection testing resistance, this hair can be carried out using equipment known in the art and means
It is bright to be not particularly limited.Such as using electricity characteristic measuring equipment, then for example distinguish two electrodes of resistance instrument using resistance instrument
It is connect with the both ends of testing resistance, the resistance value of testing resistance can be obtained.When testing resistance is connected with above-mentioned test contact
When, so that two electrodes of resistance instrument is tested contact with two respectively and contacts the resistance value that testing resistance can be obtained.
S40 determines the splicing precision of two neighboring mask plate according to resistance value.
In step S40, the testing resistance of two neighboring mask plate being spliced to form, resistance value is with two neighboring mask plate
Splice the difference of precision and different, by the resistance value of detection testing resistance, can be realized intuitive, effectively measuring and monitoring and cover
The splicing precision of diaphragm plate component, and detect simple to operate, detection efficiency with higher.
The mask plate component as involved in detection method can be any one of the above mask plate component, detection
Method also has other above-mentioned beneficial effects, and details are not described herein.
According to present invention embodiment as described above, these embodiments details all there is no detailed descriptionthe, also not
Limiting the invention is only the specific embodiment.Obviously, as described above, can make many modifications and variations.This explanation
These embodiments are chosen and specifically described to book, is principle and practical application in order to better explain the present invention, thus belonging to making
Technical field technical staff can be used using modification of the invention and on the basis of the present invention well.The present invention is only by right
The limitation of claim and its full scope and equivalent.
Claims (10)
1. a kind of mask plate component, which is characterized in that including more than two mask plates, more than two mask plates can
Mutually to form preset mask pattern, the mask plate includes: for splicing
Basal layer including mask regions and is looped around the unmasked areas of the mask regions side, and the mask regions include for spelling
The mask pattern unit to form the mask pattern is connect, the unmasked areas includes the splicing regions for splicing；And
Resistive layer is set to the splicing regions and extends preset width along the first direction for being parallel to splicing interface；
Wherein, the resistive layer of the two neighboring mask plate docks to form testing resistance, the resistance value of the testing resistance
It is inversely proportional with the size for docking contact area.
2. mask plate component according to claim 1, which is characterized in that the resistive layer includes multiple resistive conductors, multiple
The resistive conductor is successively arranged at intervals at the splicing regions along the first direction, and each resistive conductor is along the first party
To with predetermined line width；
Wherein, multiple resistive conductors of the two neighboring mask plate correspond dock and be connected in series to form it is described to
Measuring resistance.
3. mask plate component according to claim 2, which is characterized in that the resistive layer of the two neighboring mask plate
It is serpentine-like to dock the testing resistance formed.
4. mask plate component according to claim 2 or 3, which is characterized in that the splicing regions include in a second direction
First area and second area positioned at the mask regions two sides, the first area are equipped with multiple resistive conductors, and described the
Two regions are equipped with multiple resistive conductors, and the second direction intersects with the first direction；
Second described in the multiple resistive conductors and another described mask plate of first area described in one mask plate
Multiple resistive conductors in region are connected to each other to form the testing resistance.
5. mask plate component according to claim 2, which is characterized in that the splicing regions have along the first direction
The side edge of extension, the mask plate are spliced by the side edge, and the resistive conductor has in the side edge draws
Endpoint.
6. mask plate component according to claim 5, which is characterized in that in the side edge, the number for drawing endpoint
It measures more than or equal to 100, and/or, the two neighboring spacing drawn between endpoint is greater than or equal to 3 μm.
7. mask plate component according to claim 2, which is characterized in that the predetermined line width of the resistive conductor be less than or
Equal to 3 μm；
And/or the thickness of the resistive conductor is less than or equal to 3 μm；
And/or the ratio between the predetermined line width of the resistive conductor and the total length of the testing resistance are 1:10000~1:
1000。
8. mask plate component according to claim 1, which is characterized in that include two surveys in the two neighboring mask plate
Contact is tried, two test contacts are connected to the both ends of the testing resistance, and two test contacts are set to together
One mask plate is divided into two mask plates.
9. mask plate component according to claim 1, which is characterized in that the resistivity of the used material of resistive layer is
10-4Cm~10 Ω9Ω cm, the material are preferably semiconductor material, more preferably polysilicon and/or the oxidation of indium gallium zinc
Object.
10. a kind of detection method of mask plate component splicing precision characterized by comprising
More than two mask plates are provided, the mask plate includes basal layer and resistive layer, the basal layer include mask regions with
And it is looped around the unmasked areas of the mask regions side, the mask regions include mask pattern unit, and the unmasked areas includes
For the splicing regions of splicing, the resistive layer is set to the splicing regions and prolongs along the first direction for being parallel to splicing interface
Stretch preset width；
Splice more than two mask plates, the mask pattern unit spliced is made to form preset mask pattern, adjacent two
The resistive layer of a mask plate then is connected to each other to form testing resistance；
Detect the resistance value of the testing resistance；
The splicing precision of the two neighboring mask plate is determined according to the resistance value.
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| CN201910231879.3A CN110058486B (en) | 2019-03-26 | 2019-03-26 | Mask plate assembly and detection method for splicing precision of mask plate assembly |
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| CN201910231879.3A CN110058486B (en) | 2019-03-26 | 2019-03-26 | Mask plate assembly and detection method for splicing precision of mask plate assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220326599A1 (en) * | 2020-05-08 | 2022-10-13 | Beijing Boe Display Technology Co., Ltd. | Mask plate |
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| Publication number | Publication date |
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| CN110058486B (en) | 2022-06-28 |
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