CN110047820B - Antenna packaging structure with air chamber and packaging method - Google Patents
Antenna packaging structure with air chamber and packaging method Download PDFInfo
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- CN110047820B CN110047820B CN201910439977.6A CN201910439977A CN110047820B CN 110047820 B CN110047820 B CN 110047820B CN 201910439977 A CN201910439977 A CN 201910439977A CN 110047820 B CN110047820 B CN 110047820B
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- H10W44/20—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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Abstract
The invention provides an antenna packaging structure with an air chamber and a packaging method, wherein the structure comprises the following steps: a rewiring layer comprising a first face and a second face opposite to each other; the cavity side wall is formed on the second surface of the rewiring layer; the substrate comprises a first surface and a second surface which are opposite to each other, an antenna metal layer is formed on the first surface of the substrate, the substrate is bonded to the side wall of the cavity, and the substrate, the side wall of the cavity and the rewiring layer enclose an air cavity; an antenna circuit chip electrically connected to the first surface of the rewiring layer; and the metal bump is formed on the first surface of the rewiring layer so as to realize the electrical extraction of the rewiring layer. According to the invention, the air cavity is arranged below the antenna metal layer, so that the loss of antenna signals can be greatly reduced compared with other packaging materials, and the receiving and transmitting efficiency of the antenna is effectively enhanced.
Description
Technical Field
The invention belongs to the field of semiconductor packaging, and particularly relates to an antenna packaging structure with an air cavity and a packaging method.
Background
As technology advances, various high-tech electronic products have been developed to facilitate life of people, including various electronic devices such as: notebook computers, cell phones, tablet computers (PADs), etc.
With the popularity of such high-tech electronic products and the increasing demand of people, in addition to the greatly increased functions and applications configured in such high-tech products, the function of wireless communication is increased in particular to match the mobile demands of people. Thus, people can use the high-tech electronic products at any place or any time through the high-tech electronic devices with the wireless communication function. Therefore, the flexibility and convenience of the use of the high-tech electronic products are greatly improved, and people are not limited in a fixed area, the limit of the use range is broken, and the application of the electronic products is really convenient for the life of people.
In the application of an antenna, such as in a mobile phone terminal, the antenna is required to be quickly combined by a plurality of functional chips, and the known method is to directly manufacture the antenna on the surface of a circuit board (PCB), which has the disadvantage that the antenna occupies extra circuit board area, and the transmission signal line is long, the efficiency is poor, the power consumption is high, the package volume is large, and especially the conventional PCB package has too large loss under 5G millimeter wave transmission. In terms of antenna packaging, theoretically any material will cause attenuation and loss of the antenna.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide an antenna packaging structure with an air chamber and a packaging method thereof, which are used for solving the problem of high loss of the antenna packaging structure in the prior art.
To achieve the above and other related objects, the present invention provides an antenna package structure having an air chamber, the antenna package structure comprising: a rewiring layer comprising opposing first and second sides; the cavity side wall is formed on the second surface of the rewiring layer; the substrate comprises a first surface and a second surface which are opposite to each other, an antenna metal layer is formed on the first surface of the substrate, the substrate is bonded to the chamber side wall, and the substrate, the chamber side wall and the rewiring layer enclose an air chamber; an antenna circuit chip electrically coupled to the first side of the rewiring layer; and the metal bump is formed on the first surface of the rewiring layer so as to realize the electrical extraction of the rewiring layer.
Optionally, the material of the chamber sidewall includes one of silicon, glass, metal and polymer.
Optionally, the antenna circuit chip includes one or two of an active component and a passive component, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.
Optionally, the substrate comprises a silicon substrate, and the thickness of the substrate ranges from 50 micrometers to 100 micrometers.
Optionally, the first surface of the substrate is bonded to the chamber sidewall, so that the antenna metal layer is encapsulated in the air chamber.
Optionally, the second surface of the substrate is bonded to the chamber sidewall, so that the antenna metal layer is located outside the air chamber.
The invention also provides an antenna packaging method with the air chamber, which comprises the following steps: 1) Providing a support substrate, and forming a separation layer on the support substrate; 2) Forming a rewiring layer on the separation layer, the rewiring layer comprising a first face connected with the separation layer and an opposite second face; 3) Forming a chamber side wall on the rewiring layer; 4) Providing a substrate, wherein an antenna metal layer is formed on a first surface of the substrate, bonding is carried out on the first surface or a second surface of the substrate and the chamber side wall, and an air chamber is formed by the substrate, the chamber side wall and the rewiring layer; 5) Stripping the rewiring layer and the support substrate based on the separation layer to expose a first face of the rewiring layer; 6) Providing an antenna circuit chip, and electrically bonding the antenna circuit chip to the first surface of the rewiring layer; 7) And forming a metal bump on the first surface of the rewiring layer to realize the electrical extraction of the rewiring layer.
Optionally, the support base comprises one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate.
Optionally, the separation layer includes a light-heat conversion layer, and step 5) irradiates the light-heat conversion layer with a laser to separate the light-heat conversion layer from the rewiring layer and the support substrate, thereby peeling the rewiring layer and the support substrate.
Optionally, step 2) fabricating the rewiring layer includes the steps of: 2-1) forming a first dielectric layer on the surface of the separation layer; 2-2) forming a seed layer on the surface of the first dielectric layer by adopting a sputtering process, forming a first metal layer on the seed layer, and etching the first metal layer and the seed layer to form a patterned first metal wiring layer; 2-3) forming a second dielectric layer on the surface of the patterned first metal wiring layer, and etching the second dielectric layer to form a second dielectric layer with patterned through holes; 2-4) filling conductive plugs in the patterned through holes, then forming a second metal layer on the surface of the second dielectric layer by adopting a sputtering process, and etching the metal layer to form a patterned second metal wiring layer.
Optionally, step 3) forming a chamber sidewall on the rewiring layer by using a printing process.
Optionally, the material of the chamber sidewall includes one of silicon, glass, metal and polymer.
Optionally, step 4) includes: 4-1) providing a substrate, forming a patterned photoresist layer on the substrate, wherein a window of the photoresist layer exposes the substrate; 4-2) forming a metal layer on the photoresist layer and the surface of the substrate; 4-3) removing the photoresist layer and the metal layer on the photoresist layer, and reserving the metal layer in the window to form the antenna metal layer.
Optionally, the substrate comprises a silicon wafer, and further comprises a step 4-4) of thinning the silicon wafer, wherein the thickness range of the thinned silicon wafer is between 50 micrometers and 100 micrometers.
Optionally, the antenna circuit chip includes one or two of an active component and a passive component, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.
Optionally, step 6) further includes a step of filling a seal protection layer between the antenna circuit chip and the rewiring layer.
Optionally, the first surface of the substrate is bonded to the chamber sidewall, so that the antenna metal layer is encapsulated in the air chamber.
Optionally, the second surface of the substrate is bonded to the chamber sidewall, so that the antenna metal layer is located outside the air chamber.
As described above, the antenna packaging structure with the air chamber and the packaging method of the invention have the following beneficial effects:
The invention can integrate all active components or passive components into one packaging structure through the circuit arrangement of different rewiring layers, and can effectively reduce the packaging size.
The antenna circuit chip, the rewiring layer, the antenna metal and other structures are arranged in a vertical arrangement structure, so that the conduction path between components can be effectively shortened, better electrical property and antenna efficiency are achieved, and meanwhile, lower power consumption is achieved.
According to the invention, the air cavity is arranged below the antenna metal layer, so that the loss of antenna signals can be greatly reduced compared with other packaging materials, and the receiving and transmitting efficiency of the antenna is effectively enhanced.
According to the invention, the antenna metal layer can be packaged in the air chamber, so that the antenna metal can be effectively protected, the damage of the antenna metal layer is avoided, and the stability of the antenna packaging structure is improved.
Drawings
Fig. 1 to 14 are schematic structural views showing steps of an antenna packaging method with an air chamber according to embodiment 1 of the present invention, wherein fig. 14 is a schematic structural view showing an antenna packaging structure with an air chamber according to embodiment 1 of the present invention.
Fig. 15 is a schematic structural diagram of an antenna package structure with an air chamber according to embodiment 2 of the present invention.
Description of element reference numerals
101. Support substrate
102. Separating layer
201. A first dielectric layer
202. First metal wiring layer
203. A second dielectric layer
204. Second metal wiring layer
205. Chamber side wall
601. Substrate sheet
602. Photoresist layer
603. Antenna metal layer
401. Antenna circuit chip
402. Sealing protection layer
501. Metal bump
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
As described in detail in the embodiments of the present invention, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of explanation, and the schematic drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For ease of description, spatially relative terms such as "under", "below", "beneath", "above", "upper" and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers may also be present.
In the context of the present application, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, as well as embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings rather than the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
Example 1
As shown in fig. 1 to 14, the present embodiment provides an antenna packaging method with an air chamber, the packaging method including the steps of:
As shown in fig. 1, step 1) is first performed, a support substrate 101 is provided, and a separation layer 102 is formed on the support substrate 101.
As an example, the support base 101 includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate. In this embodiment, the supporting substrate 101 is a glass substrate, which has low cost, is easy to form the separation layer 102 on the surface of the glass substrate, and can reduce the difficulty of the subsequent stripping process.
As an example, the separation layer 102 includes a light-heat conversion Layer (LTHC), which is formed on the support substrate 101 by a spin coating process and then cured and molded by a curing process. The light-heat conversion Layer (LTHC) has stable performance and a smoother surface, is favorable for the subsequent manufacture of a rewiring layer, and has lower stripping difficulty in the subsequent stripping process.
As shown in fig. 2 to 5, step 2) is then performed to form a rewiring layer on the separation layer 102, the rewiring layer including a first face connected to the separation layer 102 and an opposite second face.
Step 2) fabricating the rewiring layer includes the steps of:
As shown in fig. 2, step 2-1) is performed, and a chemical vapor deposition process or a physical vapor deposition process is adopted to form a first dielectric layer 201 on the surface of the separation layer 102, where the material of the first dielectric layer 201 includes one or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass.
For example, PI (polyimide) is selected as the material of the first dielectric layer 201, so as to further reduce the process difficulty and the process cost.
As shown in fig. 3, step 2-2) is performed, a seed layer is formed on the surface of the first dielectric layer 201 by using a sputtering process, a first metal layer is formed on the seed layer, and the first metal layer and the seed layer are etched to form a patterned first metal wiring layer 202. The seed layer material comprises a stack of a titanium layer and a copper layer. The material of the first metal wiring layer 202 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium.
As shown in fig. 4, step 2-3) is performed, a second dielectric layer 203 is formed on the surface of the patterned first metal wiring layer 202 by using a chemical vapor deposition process or a physical vapor deposition process, and the second dielectric layer 203 is etched to form a second dielectric layer 203 with patterned through holes. The material of the second dielectric layer 203 includes one or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass.
For example, PI (polyimide) is selected as the material of the second dielectric layer 203, so as to further reduce the process difficulty and the process cost.
As shown in fig. 4, step 2-4) is performed, a conductive plug is filled in the patterned via hole, then a second metal layer is formed on the surface of the second dielectric layer 203 by adopting a sputtering process, and the metal layer is etched to form a patterned second metal wiring layer 204. The material of the second metal wiring layer 204 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium.
It should be noted that the above steps 2-3) to 2-4) may be repeated to form a rewiring layer having a multi-layered stacked structure to realize different wiring functions.
As shown in fig. 5, step 3) is performed, and a chamber sidewall 205 is formed on the rewiring layer.
For example, a printing process may be used to form the chamber sidewall 205 on the rewiring layer. The material of the chamber sidewall 205 includes one of silicon, glass, metal and polymer. In this embodiment, the material of the chamber sidewall 205 may be selected to be a polymer, so as to reduce the process difficulty and the process cost.
As shown in fig. 6 to 11, step 4) is performed, a substrate 601 is provided, an antenna metal layer 603 is formed on a first surface of the substrate 601, the first surface or the second surface of the substrate 601 is bonded to the chamber sidewall 205, and the substrate 601, the chamber sidewall 205 and the rewiring layer enclose an air chamber. According to the invention, the air cavity is arranged below the antenna metal layer 603, so that compared with other packaging materials, the loss of antenna signals can be greatly reduced, and the receiving and transmitting efficiency of the antenna is effectively enhanced.
Specifically, step 4) includes the steps of:
As shown in fig. 6 and 7, step 4-1) is first performed to provide a substrate 601, a patterned photoresist layer 602 is formed on the substrate 601, and a window of the photoresist layer 602 exposes the substrate 601. For example, the substrate 601 may be a silicon wafer or the like.
As shown in fig. 8, step 4-2) is then performed to form a metal layer on the photoresist layer 602 and the substrate 601.
As shown in fig. 9, step 4-3) is performed, where the photoresist layer 602 and the metal layer on the photoresist layer 602 are removed, and the metal layer in the window is reserved, so as to form the antenna metal layer 603.
As shown in fig. 10, step 4-4) is finally performed, and the thinned silicon wafer has a thickness ranging from 50 micrometers to 100 micrometers, so that the mechanical strength is ensured and the signal attenuation is reduced.
As shown in fig. 11, in this embodiment, the first surface of the substrate 601 is bonded to the chamber sidewall 205, and the substrate 601, the chamber sidewall 205 and the rewiring layer enclose an air chamber, so that the antenna metal layer 603 is encapsulated in the air chamber. According to the invention, the antenna metal layer 603 can be packaged in the air chamber, so that the antenna metal can be effectively protected, the damage of the antenna metal layer 603 is avoided, and the stability of the antenna packaging structure is improved. The antenna metal layer 603 may also be electrically connected to the rewiring layer by a metal wiring process or other processes.
As shown in fig. 12, step 5) is performed to peel off the rewiring layer and the support substrate 101 based on the separation layer 102, and expose the first surface of the rewiring layer.
Specifically, the separation layer 102 includes a light-heat conversion layer, which is irradiated with laser light here to separate the light-heat conversion layer from the rewiring layer and the support substrate 101, thereby peeling the rewiring layer and the support substrate 101.
As shown in fig. 13, step 6) is performed, and an antenna circuit chip 401 is provided, and the antenna circuit chip 401 is electrically bonded to the first surface of the rewiring layer.
For example, the antenna circuit chip 401 may be bonded to the first side of the rewiring layer by a soldering process or a ball-mounting process.
The antenna circuit chip 401 may be multiple, and the antenna circuit chip 401 includes one or two of an active component and a passive component, where the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor. The invention can integrate all active components or passive components into one packaging structure through the circuit arrangement of different rewiring layers, and can effectively reduce the packaging size.
In this embodiment, a gap is formed between the antenna circuit chip 401 and the rewiring layer, and the embodiment further includes a step of filling a seal protection layer 402 between the antenna circuit chip 401 and the rewiring layer, as shown in fig. 13. The dense protective layer can improve the structural strength between the antenna circuit chip 401 and the rewiring layer, and avoid damage to the antenna circuit chip 401 caused by extrusion or the like.
As shown in fig. 14, step 7) is finally performed, and a metal bump 501 is formed on the first surface of the rewiring layer to realize the electrical extraction of the rewiring layer. For example, the metal bump 501 may be one of tin solder, silver solder and gold-tin alloy solder.
As shown in fig. 14, the present embodiment further provides an antenna package structure having an air chamber, the antenna package structure including: a rewiring layer comprising opposing first and second sides; a chamber sidewall 205 formed on the second surface of the rewiring layer; a substrate 601, including a first surface and a second surface opposite to each other, where an antenna metal layer 603 is formed on the first surface of the substrate 601, the substrate 601 is bonded to the chamber sidewall 205, and the substrate 601, the chamber sidewall 205, and the rewiring layer enclose an air chamber; an antenna circuit chip 401, wherein the antenna circuit chip 401 is electrically connected to the first surface of the rewiring layer; and the metal bump 501 is formed on the first surface of the rewiring layer to realize the electrical extraction of the rewiring layer. According to the invention, the air cavity is arranged below the antenna metal layer 603, so that compared with other packaging materials, the loss of antenna signals can be greatly reduced, and the receiving and transmitting efficiency of the antenna is effectively enhanced.
The material of the chamber sidewall 205 includes one of silicon, glass, metal and polymer.
The antenna circuit chip 401 includes one or two of an active component including one of a power management circuit, a transmitting circuit, and a receiving circuit, and a passive component including one of a resistor, a capacitor, and an inductor. The invention can integrate all active components or passive components into one packaging structure through the circuit arrangement of different rewiring layers, and can effectively reduce the packaging size.
The substrate 601 comprises a silicon substrate, and the thickness of the substrate 601 ranges from 50 micrometers to 100 micrometers to ensure mechanical strength and reduce signal attenuation.
In this embodiment, the first surface of the substrate 601 is bonded to the chamber sidewall 205, such that the antenna metal layer 603 is encapsulated within the air chamber. According to the invention, the antenna metal layer 603 can be packaged in the air chamber, so that the antenna metal can be effectively protected, the damage of the antenna metal layer 603 is avoided, and the stability of the antenna packaging structure is improved.
Example 2
As shown in fig. 15, the present embodiment provides an antenna packaging structure with an air chamber and a packaging method, and the basic steps and structures are as in embodiment 1, wherein the difference between the structure and embodiment 1 is that the second surface of the substrate 601 is bonded to the chamber sidewall 205, so that the antenna metal layer 603 is located outside the air chamber. The packaging structure and the method can enable the antenna metal layer 603 to be exposed at the top of the antenna packaging structure, can be beneficial to the electric connection between the antenna metal layer 603 and other elements, and can enhance the efficiency of signal receiving and transmitting of the antenna metal layer 603.
As described above, the antenna packaging structure with the air chamber and the packaging method of the invention have the following beneficial effects:
The invention can integrate all active components or passive components into one packaging structure through the circuit arrangement of different rewiring layers, and can effectively reduce the packaging size.
The antenna circuit chip, the rewiring layer, the antenna metal and other structures are arranged in a vertical arrangement structure, so that the conduction path between components can be effectively shortened, better electrical property and antenna efficiency are achieved, and meanwhile, lower power consumption is achieved.
According to the invention, the air cavity is arranged below the antenna metal layer, so that the loss of antenna signals can be greatly reduced compared with other packaging materials, and the receiving and transmitting efficiency of the antenna is effectively enhanced.
According to the invention, the antenna metal layer can be packaged in the air chamber, so that the antenna metal can be effectively protected, the damage of the antenna metal layer is avoided, and the stability of the antenna packaging structure is improved.
Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (15)
1. An antenna package structure with an air chamber, the antenna package structure comprising:
A rewiring layer comprising opposing first and second sides;
A chamber side wall adopting a printing process is formed on the second surface of the rewiring layer;
The substrate comprises a first surface and a second surface which are opposite to each other, an antenna metal layer is formed on the first surface of the substrate, the substrate is bonded to the chamber side wall, the air chamber is defined by the substrate, the chamber side wall and the rewiring layer, and the antenna metal layer is electrically connected with the rewiring layer through a metal connecting process; wherein the substrate comprises a silicon substrate, and the thickness range of the silicon substrate is between 50 micrometers and 100 micrometers;
an antenna circuit chip electrically coupled to the first side of the rewiring layer;
And the metal bump is formed on the first surface of the rewiring layer so as to realize the electrical extraction of the rewiring layer.
2. The antenna package with air chamber of claim 1, wherein: the material of the chamber side wall comprises one of silicon, glass, metal and polymer.
3. The antenna package with air chamber of claim 1, wherein: the antenna circuit chip comprises one or two of an active component and a passive component, wherein the active component comprises one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component comprises one of a resistor, a capacitor and an inductor.
4. The antenna package with air chamber of claim 1, wherein: and the first surface of the substrate is bonded to the side wall of the cavity so that the antenna metal layer is packaged in the air cavity.
5. The antenna package with air chamber of claim 1, wherein: and the second surface of the substrate is bonded to the chamber side wall so that the antenna metal layer is positioned outside the air chamber.
6. An antenna packaging method with an air chamber, comprising the steps of:
1) Providing a support substrate, and forming a separation layer on the support substrate;
2) Forming a rewiring layer on the separation layer, the rewiring layer comprising a first face connected with the separation layer and an opposite second face;
3) Forming a chamber side wall on the rewiring layer by adopting a printing process;
4) Providing a substrate, wherein an antenna metal layer is formed on a first surface of the substrate, bonding is carried out on the first surface or a second surface of the substrate and the chamber side wall, an air chamber is defined by the substrate, the chamber side wall and the rewiring layer, and the antenna metal layer is electrically connected with the rewiring layer through a metal wire connecting process; wherein the substrate comprises a silicon substrate, and the thickness range of the silicon substrate is between 50 micrometers and 100 micrometers;
5) Stripping the rewiring layer and the support substrate based on the separation layer to expose a first face of the rewiring layer;
6) Providing an antenna circuit chip, and electrically bonding the antenna circuit chip to the first surface of the rewiring layer;
7) And forming a metal bump on the first surface of the rewiring layer to realize the electrical extraction of the rewiring layer.
7. The method of packaging an antenna with an air chamber as claimed in claim 6, the method is characterized in that: the support base includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate.
8. The method of packaging an antenna with an air chamber as claimed in claim 6, the method is characterized in that: the separation layer comprises a light-heat conversion layer, and step 5) the light-heat conversion layer is irradiated by laser so as to separate the light-heat conversion layer from the rewiring layer and the support substrate, and then the rewiring layer and the support substrate are peeled off.
9. The method of packaging an antenna with an air chamber as claimed in claim 6, the method is characterized in that: step 2) fabricating the rewiring layer includes the steps of:
2-1) forming a first dielectric layer on the surface of the separation layer;
2-2) forming a seed layer on the surface of the first dielectric layer by adopting a sputtering process, forming a first metal layer on the seed layer, and etching the first metal layer and the seed layer to form a patterned first metal wiring layer;
2-3) forming a second dielectric layer on the surface of the patterned first metal wiring layer, and etching the second dielectric layer to form a second dielectric layer with patterned through holes;
2-4) filling conductive plugs in the patterned through holes, then forming a second metal layer on the surface of the second dielectric layer by adopting a sputtering process, and etching the metal layer to form a patterned second metal wiring layer.
10. The method of packaging an antenna with an air chamber as claimed in claim 6, the method is characterized in that: the material of the chamber side wall comprises one of silicon, glass, metal and polymer.
11. The method of packaging an antenna with an air chamber as claimed in claim 6, the method is characterized in that: step 4) comprises:
4-1) providing a substrate, forming a patterned photoresist layer on the substrate, wherein a window of the photoresist layer exposes the substrate;
4-2) forming a metal layer on the photoresist layer and the surface of the substrate;
4-3) removing the photoresist layer and the metal layer on the photoresist layer, and reserving the metal layer in the window to form the antenna metal layer.
12. The method of packaging an antenna with an air chamber as claimed in claim 6, the method is characterized in that: step 6) further includes the step of filling a seal protection layer between the antenna circuit chip and the rewiring layer.
13. The method of packaging an antenna with an air chamber as claimed in claim 6, the method is characterized in that: the antenna circuit chip comprises one or two of an active component and a passive component, wherein the active component comprises one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component comprises one of a resistor, a capacitor and an inductor.
14. The method of packaging an antenna with an air chamber as claimed in claim 6, the method is characterized in that: and the first surface of the substrate is bonded to the side wall of the cavity so that the antenna metal layer is packaged in the air cavity.
15. The method of packaging an antenna with an air chamber as claimed in claim 6, the method is characterized in that: and the second surface of the substrate is bonded to the chamber side wall so that the antenna metal layer is positioned outside the air chamber.
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| CN201910439977.6A CN110047820B (en) | 2019-05-24 | 2019-05-24 | Antenna packaging structure with air chamber and packaging method |
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| CN201910439977.6A CN110047820B (en) | 2019-05-24 | 2019-05-24 | Antenna packaging structure with air chamber and packaging method |
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| CN112420526B (en) * | 2019-08-20 | 2024-07-02 | 江苏长电科技股份有限公司 | Double-substrate laminated structure and packaging method thereof |
| CN112421206A (en) * | 2019-08-20 | 2021-02-26 | 江苏长电科技股份有限公司 | Double-substrate laminated structure and packaging method thereof |
| CN111415921B (en) * | 2020-03-30 | 2021-06-29 | 华进半导体封装先导技术研发中心有限公司 | An antenna package structure and its manufacturing method |
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| CN108879114A (en) * | 2017-05-16 | 2018-11-23 | 华为技术有限公司 | Integrated antenna packages structure and terminal |
| CN109755227B (en) * | 2019-01-09 | 2024-04-26 | 盛合晶微半导体(江阴)有限公司 | Packaging structure and preparation method thereof |
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| CN108417559A (en) * | 2017-02-08 | 2018-08-17 | 日月光半导体制造股份有限公司 | Semiconductor package device and method of manufacturing the same |
| CN109326569A (en) * | 2017-07-31 | 2019-02-12 | 群创光电股份有限公司 | packaging element and manufacturing method thereof |
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