CN110036070A - The manufacturing method of resin composition for encapsulating, solidfied material, electronic part apparatus and electronic part apparatus - Google Patents
The manufacturing method of resin composition for encapsulating, solidfied material, electronic part apparatus and electronic part apparatus Download PDFInfo
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- CN110036070A CN110036070A CN201680091380.1A CN201680091380A CN110036070A CN 110036070 A CN110036070 A CN 110036070A CN 201680091380 A CN201680091380 A CN 201680091380A CN 110036070 A CN110036070 A CN 110036070A
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- China
- Prior art keywords
- encapsulating
- resin
- resin composition
- mass
- substrate
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 117
- 239000000463 material Substances 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 62
- 239000003822 epoxy resin Substances 0.000 claims abstract description 60
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 60
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- 238000011049 filling Methods 0.000 claims abstract description 35
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims abstract description 21
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- YAVVGPBYBUYPSR-UHFFFAOYSA-N benzene;oxygen Chemical compound [O].C1=CC=CC=C1 YAVVGPBYBUYPSR-UHFFFAOYSA-N 0.000 claims 1
- 239000013034 phenoxy resin Substances 0.000 description 50
- 229920006287 phenoxy resin Polymers 0.000 description 49
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 33
- 229920001971 elastomer Polymers 0.000 description 33
- 239000005060 rubber Substances 0.000 description 33
- 239000000654 additive Substances 0.000 description 32
- 230000000996 additive effect Effects 0.000 description 31
- 230000000740 bleeding effect Effects 0.000 description 27
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 23
- 239000007822 coupling agent Substances 0.000 description 23
- 239000004615 ingredient Substances 0.000 description 17
- 239000002245 particle Substances 0.000 description 17
- -1 o-cresol phenol aldehyde Chemical class 0.000 description 16
- 239000000377 silicon dioxide Substances 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 15
- 150000001412 amines Chemical class 0.000 description 14
- 239000007788 liquid Substances 0.000 description 13
- 239000000047 product Substances 0.000 description 12
- 229910000077 silane Inorganic materials 0.000 description 11
- 125000003700 epoxy group Chemical group 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 150000002924 oxiranes Chemical class 0.000 description 9
- 229930185605 Bisphenol Natural products 0.000 description 8
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 7
- 238000003851 corona treatment Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 238000004381 surface treatment Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- 239000004848 polyfunctional curative Substances 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 150000004982 aromatic amines Chemical class 0.000 description 5
- 229940106691 bisphenol a Drugs 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000002401 inhibitory effect Effects 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 230000009974 thixotropic effect Effects 0.000 description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- MLPVBIWIRCKMJV-UHFFFAOYSA-N 2-ethylaniline Chemical compound CCC1=CC=CC=C1N MLPVBIWIRCKMJV-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 101150091203 Acot1 gene Proteins 0.000 description 2
- 102100025854 Acyl-coenzyme A thioesterase 1 Human genes 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229960000583 acetic acid Drugs 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical class NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000012362 glacial acetic acid Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PZKPUGIOJKNRQZ-UHFFFAOYSA-N 1-methylcyclohexa-3,5-diene-1,3-diamine Chemical compound CC1(N)CC(N)=CC=C1 PZKPUGIOJKNRQZ-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- BFLWXPJTAKXXKT-UHFFFAOYSA-N 3-methoxybenzene-1,2-diamine Chemical group COC1=CC=CC(N)=C1N BFLWXPJTAKXXKT-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- RQEOBXYYEPMCPJ-UHFFFAOYSA-N 4,6-diethyl-2-methylbenzene-1,3-diamine Chemical compound CCC1=CC(CC)=C(N)C(C)=C1N RQEOBXYYEPMCPJ-UHFFFAOYSA-N 0.000 description 1
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- MMFHFNMXSSUNTE-UHFFFAOYSA-N CC=1C(=C(C(=C(C=1)C(C1=C(C(=C(C=C1)N)N)N)C1=CC=CC=C1)C)C)C Chemical compound CC=1C(=C(C(=C(C=1)C(C1=C(C(=C(C=C1)N)N)N)C1=CC=CC=C1)C)C)C MMFHFNMXSSUNTE-UHFFFAOYSA-N 0.000 description 1
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920013646 Hycar Polymers 0.000 description 1
- 244000283207 Indigofera tinctoria Species 0.000 description 1
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 235000003283 Pachira macrocarpa Nutrition 0.000 description 1
- SJEYSFABYSGQBG-UHFFFAOYSA-M Patent blue Chemical compound [Na+].C1=CC(N(CC)CC)=CC=C1C(C=1C(=CC(=CC=1)S([O-])(=O)=O)S([O-])(=O)=O)=C1C=CC(=[N+](CC)CC)C=C1 SJEYSFABYSGQBG-UHFFFAOYSA-M 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 240000001085 Trapa natans Species 0.000 description 1
- 235000014364 Trapa natans Nutrition 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229940075614 colloidal silicon dioxide Drugs 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005040 ion trap Methods 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000006166 lysate Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000045 pyrolysis gas chromatography Methods 0.000 description 1
- 235000009165 saligot Nutrition 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Abstract
A kind of resin composition for encapsulating, curing agent, (C) it includes (A) epoxy resin, (B) at least one amino have the resin and (D) inorganic filling material of phenoxy group structure.
Description
Technical field
The present invention relates to the manufacturers of resin composition for encapsulating, solidfied material, electronic part apparatus and electronic part apparatus
Method.
Background technique
In recent years, highly integrated to the requirement of the electronic components such as semiconductor chip, for example, in most cases in semiconductor module
Flip-Chip Using body made of middle use engages semiconductor chip with substrate by solder projection.
Such semiconductor module is equipped on the small type mobile devices such as mobile phone, smart phone, and the market demand is
Increase year by year.In Flip-Chip Using body, use underfill as sealing material in order to ensure its insulating properties.Bottom
Portion's packing material shows mobility at room temperature, therefore is filled between chip and substrate and using capillarity, so
Afterwards by making cured method of underfill etc. obtain the leakproofness of Flip-Chip Using body.
In the manufacturing process of such semiconductor module, when solidifying uncured underfill, there is production
The problem of bleeding that the high ingredient of mobility contained in raw underfill is oozed out from underfill.If produced
Then there are the following problems for raw bleeding: from the high cloth on branch's pollution substrate of the mobility oozed out in underfill
Line, reliability and the zygosity decline of semiconductor module.
As the method for solving bleeding, such as disclose using the epoxy for being 600~1000 comprising number-average molecular weight
Resin (A), curing agent (B), organic solvent (C), coupling agent (D) and inorganic filler (E) insulation paste method (such as patent
Document 1).
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2000-178342 bulletin
Summary of the invention
Subject to be solved by the invention
But in recent years the electronic components such as semiconductor chip are increasingly required to minimize, it is all to electronic component is configured at
Distance until the wiring on side shortens.In the semiconductor module for having this kind of electronic component minimized, above-mentioned patent text
The method for offering 1 record is insufficient for inhibiting the generation of bleeding, it is desired to be able to tighter inhibit bleeding
The composition of generation.
Herein, bleeding be as the high ingredient of mobility solder resist substrate applied by semiconductor module (Japanese:
ソ ル ダ ー レ ジ ス ト substrate) surface exudation come and generate, in bleeding, the high ingredient of mobility exudation come
Degree also relies on the type of substrate.In addition, being particularly easy to occur in the case where substrate surface has carried out corona treatment
Bleeding.Therefore, from the viewpoint of inhibit bleeding generation, preferably without the plasma of substrate surface at
Reason.But corona treatment is used for the washing of substrate surface, therefore most feelings before the sealing of semiconductor module in process
It is unavoidable in manufacture under condition, it is expected that can press down in the case where substrate surface has carried out corona treatment
The generation of bleeding processed.
The purpose of a mode of the invention is, provides a kind of sealing resin group of generation for being able to suppress bleeding
Close object, the resin composition for encapsulating is solidified made of solidfied material and have the electronic part apparatus of the solidfied material and make
With the manufacturing method of the electronic part apparatus of the resin composition for encapsulating.
Means for solving the problems
In order to achieve the above object, the present inventors has made intensive studies, as a result, it has been found that, by that will include phenoxy group knot
The resin of structure is used for resin composition for encapsulating, so that the sealing resin combination for being able to suppress the generation of bleeding can be obtained
Object.
It is as described below for realizing the specific means of the above subject.
A kind of resin composition for encapsulating of 1 > of <, it includes the solidifications that (A) epoxy resin, (B) have at least one amino
Agent, (C) have the resin and (D) inorganic filling material of phenoxy group structure.
2 > of < resin composition for encapsulating according to 1 > of <, wherein (C) has the resin of phenoxy group structure
Weight average molecular weight MwIt is 500 or more and 100,000 or less.
3 > of < resin composition for encapsulating according to 1 > of <, wherein (C) has the resin of phenoxy group structure
Weight average molecular weight MwIt is 2,000 or more and 100,000 or less.
4 > of < resin composition for encapsulating according to any one of 1 > of <~<, 3 >, wherein (C) has
The resin of phenoxy group structure includes the following general formula (1) compound represented.
[changing 1]
(in general formula (1), A indicates structure shown in general formula (2), and end group B indicates base shown in hydroxyl or general formula (3)
Group；In general formula (2), R1And R2Separately indicate hydrogen atom or methyl；N indicates 1~1000 integer；N be 2 or more it is whole
When number, 2 or more A can be identical or different；2 end group B can be identical or different.)
5 > of < resin composition for encapsulating according to any one of 1 > of <~<, 4 >, wherein (C) has
The containing ratio of the resin of phenoxy group structure is 0.05 mass of mass %~2.0 % relative to resin composition for encapsulating.
6 > of < resin composition for encapsulating according to any one of 1 > of <~<, 5 > is used for electronic component dress
The sealing set.
A kind of solidfied material of 7 > of < is to solidify resin composition for encapsulating described in any one of 1 > of <~<, 6 >
Made of.
A kind of electronic part apparatus of 8 > of <, has:
Substrate with circuit layer；
The electronic component that configuration is electrically connected on the substrate and with the circuit layer；With
Configure the solidfied material described in 7 > of < in the substrate Yu the gap of the electronic component.
A kind of manufacturing method of electronic part apparatus of 9 > of < is included the substrate with circuit layer and is configured in institute
State on substrate and any one of 1 > of electronic component-use <~6 > of < for being electrically connected with the circuit layer described in sealing resin
The process of composition sealing.
Invention effect
A mode according to the present invention, can provide the generation for being able to suppress bleeding resin composition for encapsulating,
Solidfied material made of the resin composition for encapsulating is solidified and have the solidfied material electronic part apparatus and using should
The manufacturing method of the electronic part apparatus of resin composition for encapsulating.
Specific embodiment
Mode for carrying out the present invention is described in detail below.But the present invention is not by the following embodiments and the accompanying drawings
It limits.In the following embodiments, constituent element (also include element step etc.) unless specifically stated, be not must
It needs.It is also the same about numerical value and its range, it is not intended to limit the present invention.
In the disclosure, " process " this term is in addition to comprising other than the independent process of other process, though with it is other
It also include the process as long as the purpose for reaching the process in the case that process can not be distinguished clearly.
In the disclosure, the numberical range for using "~" to show includes to be recorded in the numerical value of the front and back of "~" and distinguished
As minimum value and maximum value.
In the disclosure stage by stage and in the numberical range of record, documented upper limit value or lower limit in 1 numberical range
Value also could alternatively be the upper limit or lower limit of other numberical ranges recorded stage by stage.In addition, recorded in the disclosure
Numberical range in, the upper limit or lower limit of the numberical range also could alternatively be value shown in embodiment.
In the disclosure, in the case where there are the two or more substances for being equivalent to each ingredient in the composition, as long as not having
There is special declaration, then the containing ratio of each ingredient in composition or content refer to the two or more substances being present in composition
Total containing ratio or content.
In the disclosure, in the case where there are the how two or more particles for being equivalent to each ingredient in the composition, as long as
There is no special declaration, then the partial size of each ingredient in composition refers to mixed with the two or more particles in the presence of composition
Close the relevant value of object.
In the disclosure, for " layer " this term, in addition to including when observing region present in this layer, being formed in
Except in the case of the region entirety, include the case where a part for being only formed in the region.
[resin composition for encapsulating]
The resin composition for encapsulating of the disclosure include (A) epoxy resin, (B) have at least one amino curing agent,
(C) with the resin and (D) inorganic filling material of phenoxy group structure.Resin composition for encapsulating for example can be used for electronic component
Sealing.Resin composition for encapsulating is able to suppress the generation of bleeding.As its reason, thus it is speculated that as follows.
Phenoxy resin contained in resin composition for encapsulating and mobility the reason of being likely to become bleeding are high
Ingredient between compatibility it is high.It is considered that: it is therefore, close in the case where assigning resin composition for encapsulating on substrate
There is a situation where separating to be inhibited on substrate, the generation of bleeding is inhibited a part of envelope resin combination.
In addition, we are believed that: in resin composition for encapsulating comprising the ingredient high as mobility, at 25 DEG C be liquid
In the case where the liquid-like constituents such as epoxy resin, the compatibility of phenoxy resin and liquid-like constituents is high, therefore suitably inhibits infiltration
There is the generation of elephant.
In addition, bleeding becomes easy generation in the case where substrate surface has carried out corona treatment.But
It, can in the case where substrate surface has carried out corona treatment by using above-mentioned resin composition for encapsulating
Inhibit the generation of bleeding.
Each ingredient contained in resin composition for encapsulating is illustrated below.
< (A) epoxy resin >
The resin composition for encapsulating of the disclosure includes (A) epoxy resin.(A) epoxy resin is to resin composition for encapsulating
Curability and cementability are assigned, assigns durability and heat resistance to the solidfied material of resin composition for encapsulating.
From the viewpoint of mobility, (A) epoxy resin preferably is contained in the epoxy resin at 25 DEG C for liquid.In addition,
Can also be combined in is solid epoxy resin at 25 DEG C, is not preferably influencing the mobility of resin composition for encapsulating
Being combined in range is solid epoxy resin at 25 DEG C.
It should be noted that each ingredient contained in resin composition for encapsulating will be at 25 DEG C in the disclosure
Viscosity is that 50Pas ingredient below is known as " being liquid at 25 DEG C ".
It include the epoxy resin at 25 DEG C for liquid, to there is resin composition for encapsulating as (A) epoxy resin
The tendency that mobility improves.
As the viscosity at 25 DEG C of (A) epoxy resin, preferably 50Pas hereinafter, more preferably 0.01Pas~
40Pas, further preferably 0.5Pas~30Pas.
In the disclosure, the viscosity at 25 DEG C of each ingredient contained in the resin composition for encapsulating such as (A) epoxy resin is
Refer to: being worth obtained by being measured under conditions of 25 DEG C and 10 revs/min of revolving speed using E type viscosimeter (3 ° of cone angle).
(A) type of epoxy resin is not particularly limited.As epoxy resin, can enumerate: naphthalene type epoxy resin；Bisphenol-A,
The diglycidyl ether-type epoxy resins such as Bisphenol F, bisphenol-A D, bisphenol S, hydrogenated bisphenol A；It is with o-cresol phenol aldehyde type epoxy resin
What is represented carries out epoxy resin obtained by epoxidation for the phenolic resin of phenols and aldehydes；Pass through phthalic acid, dimeric dibasic acid etc.
Glycidyl ester type epoxy resin obtained from the reacting of polyacid and epoxychloropropane；By diaminodiphenyl-methane, different
Glycidyl amine type epoxy resin obtained by the reacting of the amine compounds such as cyanurate and epoxychloropropane etc..
For the epoxide equivalent of (A) epoxy resin, from the viewpoint of viscosity adjustment, preferably 80g/eq~250g/
Eq, more preferably 85g/eq~240g/eq, further preferably 90g/eq~230g/eq.
The measuring method of the epoxide equivalent in the disclosure is recorded below.
Epoxy resin is dissolved in methyl ethyl ketone.Glacial acetic acid, cetyltrimethylammonium bromide and masking are added into lysate
Indicator (Japanese: ス ク リ ー Application indicates medicine) (will make patent blue 0.3g be dissolved in solution obtained by glacial acetic acid 100mL and make hundred
In phenol indigo plant 1.5g be dissolved in solution obtained by methanol 500mL mixing and prepare solution), with the perchloric acid solution for being adjusted to 0.1N
The color of solution is become pink and at the time of pink continues 1 minute as terminal by titration.In addition, blank test is carried out,
It is calculate by the following formula epoxide equivalent.
Epoxide equivalent (g/eq)=(1000 × W)/{ (S-B) × N }
W: sample mass
B: the amount of 0.1N perchloric acid solution used in blank test
S: the amount of 0.1N perchloric acid solution used in the titration of sample
N: the equivalent concentration (0.1N) of perchloric acid solution
(A) weight average molecular weight of epoxy resin is not particularly limited.As the weight average molecular weight of (A) epoxy resin, preferably
It is 100~1,000, more preferably 150~800, further preferably 200~500.
The measuring method of the weight average molecular weight (Mw) and number-average molecular weight (Mn) in the disclosure is recorded below.
Weight average molecular weight and number-average molecular weight are measured by gel permeation chromatography (GPC), use standard polystyren
Standard curve converted and exported.The condition of GPC is as shown below.
- GPC condition-
Pump: Hitachi's L-6000 type (Hitachi Co., Ltd's system)
Chromatographic column: below to amount to 3
Gelpack GL-R420
Gelpack GL-R430
Gelpack GL-R440
(the above are Hitachi Chemical Co., Ltd.'s systems, trade name)
Eluent: tetrahydrofuran
Measuring temperature: 25 DEG C
Flow: 2.05mL/ minutes
Detector: Hitachi L-3300 type RI (Hitachi Co., Ltd's system)
As (A) epoxy resin, commercially available product can be used.As (A) epoxy resin of commercially available product, can enumerate: Nippon Steel
Firmly aurification Co. Ltd. system bisphenol f type epoxy resin (name of an article: YDF-8170C), Nippon Steel & Sumitomo Metal Corporation's system are double
Phenol A type epoxy resin (name of an article: YD-128), Mitsui Chemicals, Inc's bisphenol A type epoxy resin (name of an article: R-140P),
Mitsubishi chemical Co., Ltd's amine type epoxy resin (name of an article: jER-630), Dainippon Ink Chemicals's naphthalene type epoxy resin (name of an article:
HP-4032) etc..(A) epoxy resin is not limited to these specific examples.(A) epoxy resin can be used alone, and can also incite somebody to action
Two or more is applied in combination.
It is preferably 10 matter of mass %~50 relative to resin composition for encapsulating for the containing ratio of (A) epoxy resin
Measure %, the more preferably 15 mass % of mass %~40, further preferably 20 mass of mass %~35 %.
< (B) has curing agent (specific curing agent) > of at least one amino
The resin composition for encapsulating of the disclosure includes the curing agent (hereinafter also referred to " (B) that (B) has at least one amino
Specific curing agent ").(B) specific curing agent is compared with aftermentioned other curing agent, and mobility can be prepared and working life is excellent by having
Resin composition for encapsulating tendency.
(B) as long as specific curing agent can make the curing agent of (A) epoxy resin cure be not particularly limited.As
(B) specific curing agent, as long as by polymerizeing cured curing agent together with epoxy resin, as long as sealing is made with tree
Resin composition for encapsulating has mobility when oil/fat composition, then is the specific curing agent of liquid at 25 DEG C and at 25 DEG C is
The specific curing agent of solid-like can be used.It include the curing agent at 25 DEG C for liquid as (B) specific curing agent, thus
Have the tendency that the mobility of resin composition for encapsulating improves.
It as (B) specific curing agent, can enumerate: chain fatty race amine, annular aliphatic amine, aliphatic-aromatic amine, fragrance
The amine systems curing agent such as race's amine.As amine system curing agent, from the viewpoint of heat resistance and electrical characteristics, optimization aromatic amine.
It is specific enumerable as amine system curing agent: m-phenylene diamine (MPD), 1,3- diaminotoluene, Isosorbide-5-Nitrae-diaminotoluene, 2,
4- diaminotoluene, 3,5- diethyl -2,4 di amino toluene, 3,5- diethyl -2,6- diaminotoluene, 2,4-
The aromatic amine curing agent that the aromatic rings such as diamino anisole are 1；2,4 '-diaminodiphenyl-methanes, 4,4 '-diamino
Diphenyl sulfone, 4,4 '-diamino diphenyl sulfones, 4,4 '-di-2-ethylhexylphosphine oxides (2- ethyl aniline), 3,3 '-diethyl -4,
4 '-diaminodiphenyl-methanes, 3,3 ', 5,5 '-tetramethyls -4,4 '-diaminodiphenyl-methane, 3,3 ', 5,5 '-four
The aromatic amine curing agent that the aromatic rings such as ethyl -4,4 '-diaminodiphenyl-methane are 2；The water of aromatic amine curing agent
Solve condensation product；Polytetrahydrofuran pair-P aminobenzoates (Japanese: Port リ テ ト ラ メ チ レ Application オ キ シ De ジ-p- ア ミ
ノ benzoic acid エ ス テ Le), polytetrahydrofuran it is double-P aminobenzoates (Japanese: Port リ テ ト ラ メ チ レ Application オ キ シ
De ジ-p- ア ミ ノ ベ Application ゾ エ ー ト) etc. with polyether structure aromatic amine；The contracting of aromatic diamine and epoxychloropropane
Close object；Aromatic diamine and the reaction product of styrene etc..
As (B) specific curing agent, commercially available product can be used.As (B) specific curing agent of commercially available product, can enumerate: day
This chemical drug Co. Ltd. system amine hardener (name of an article: Kayahard-AA), Mitsubishi chemical Co., Ltd's amine hardener (name of an article:
JER cure (registered trademark) W, jER cure (registered trademark) 113 etc.), ALBEMARLE JAPAN CORPORATION amine
Curing agent (name of an article: ETHACURE 300) etc..(B) specific curing agent is not limited to these specific examples.(B) specific curing agent can be with
It is used alone a kind, two or more can also be applied in combination.
(A) epoxy resin and the containing ratio of (B) specific curing agent in resin composition for encapsulating are not particularly limited,
(A) the ratio between the equivalents of epoxy group contained in epoxy resin and the equivalents of amino contained in (B) specific curing agent do not have yet
It is particularly limited to.In order to inhibit less respective unreacted, the equivalents of amino contained in (B) specific curing agent is opposite
The ratio (equivalents/epoxy group equivalents of amino) of the equivalents of the epoxy group contained in (A) epoxy resin preferably exists
0.6~1.4 range, more preferably 0.7~1.3 range, further preferably 0.8~1.2 range.
The content of (B) specific curing agent in resin composition for encapsulating is not particularly limited.With regard to (B) specific curing agent
It is preferably 5 mass relative to 100 mass parts of (A) epoxy resin from viewpoints such as mobility, insulating reliabilities for content
Part~60 mass parts, more preferably 10 mass parts~50 mass parts.
Resin composition for encapsulating may include other curing agent in addition to (B) specific curing agent.As other solidifications
Agent can be enumerated: phenol system curing agent, acid anhydrides system curing agent, imidazoles system curing agent, carboxylic acid dihydrazide system curing agent etc..
When other curing agent in addition to (B) specific curing agent are applied in combination, with regard to its in resin composition for encapsulating
It is excellent relative to 100 mass parts of (A) epoxy resin from viewpoints such as mobility, insulating reliabilities for the content of its curing agent
It is selected as 0.5 mass parts~5.0 mass parts, more preferably 1.0 mass parts~3.0 mass parts.
When other curing agent in addition to (B) specific curing agent are applied in combination, with regard to its in resin composition for encapsulating
For the containing ratio of its curing agent, from viewpoints such as mobility, insulating reliabilities, it is preferably relative to curing agent component total amount
The 1 mass % of mass %~50, the more preferably 5 mass % of mass %~35, further preferably 8 mass of mass %~20 %.
< (C) has resin (phenoxy resin) > of phenoxy group structure
The resin composition for encapsulating of the disclosure includes resin (hereinafter also referred to " (C) benzene that (C) has phenoxy group structure
Oxygroup resin ").Resin composition for encapsulating comprising (C) phenoxy resin has the effect of the generation of inhibition bleeding, and
And there is excellent heat resistance and excellent moisture-proof, there is the tendency of the reliability after helping to improve packaging body sealing.
It should be noted that, as " phenoxy group structure ", referring to the knot for being bonded with oxygen atom on phenyl ring in the disclosure
Structure not only includes phenoxy group (C6H 5- O-), it further include a part of substituted structure, a part of phenoxy group of phenoxy group
The structure etc. reacted by hydrogenation etc..
For (C) phenoxy resin, at 25 DEG C be the phenoxy resin of liquid, be solid-like phenoxy resin it is equal
It can be used.In the case where (C) phenoxy resin is liquid, having can be easy to be dissolved in inclining in resin composition for encapsulating
To.On the other hand, in the case where (C) phenoxy resin is solid-like, by making (C) phenoxy resin be dissolved in (A) epoxy
At least one of resin and (B) specific curing agent, thus resin composition for encapsulating is easy to become uniformly, to obtain stable
The tendency of characteristic.As (C) phenoxy resin, it preferably is contained in the phenoxy resin at 25 DEG C for liquid, thus has sealing to use
The tendency that the mobility of resin combination improves.
(C) phenoxy resin in resin composition for encapsulating can with gel permeation chromatography, pyrolysis gas chromatography,
The methods of infrared spectrum analysis detects.
As (C) phenoxy resin, as long as the phenoxy resin with phenoxy group structure does not have then in the molecular structure
Especially limitation.(C) phenoxy resin has at least one of epoxy group and hydroxyl preferably in skeleton.As (C) phenoxy group
Resin can be enumerated: the phenoxy resin with bisphenol backbone, the phenoxy resin with phenolic aldehyde skeleton, the benzene with naphthalene skeleton
Oxygroup resin, phenoxy resin with biphenyl backbone etc..As the bis-phenol structure in the phenoxy resin with bisphenol backbone,
Bisphenol A-type structure, bisphenol-f type structure, bisphenol S type structure, bmminated bisphenol-A type structure and hydrogenated bisphenol A type structure can be enumerated
Deng.Phenoxy resin can have epoxy group, in this case, as long as the epoxide equivalent of phenoxy resin is more than 250g/eq
Can, it in addition can be 1000g/eq or more, or 3,000g/eq or more.
It should be noted that being 250eq or less in epoxide equivalent about the resin with phenoxy group structure and epoxy group
When, it is set as being included in (A) epoxy resin, when epoxide equivalent is more than 250eq, is set as being included in (C) phenoxy resin.
For (C) phenoxy resin, from the viewpoint of cost, mobility and heat resistance, preferably comprise selected from Bisphenol F
It is at least one kind of in the copolymerization epoxy resin of type epoxy resin, bisphenol A type epoxy resin and bisphenol-f type and bisphenol A-type, more preferably
Include the following general formula (1) compound represented.
[changing 2]
In general formula (1), A indicates structure shown in general formula (2), and end group B indicates base shown in hydroxyl or general formula (3)
Group.In general formula (2), R1And R2Separately indicate hydrogen atom or methyl.N indicates 1~1000 integer.It is 2 or more in n
Integer when, 2 or more A can be identical or different.2 end group B can be identical or different.
Just weight average molecular weight (the M of (C) phenoxy resinw) for, it is excellent from the viewpoint of more appropriately inhibiting exudation
It is selected as 500 or more, more preferably 2,000 or more.In addition, MwFrom the viewpoint of heat resistance and preferably 5,000 or more, from
From the perspective of further suitably inhibiting exudation, more preferably 20,000 or more.MwFrom the viewpoint of mobility and it is preferred that
It is 100,000 or less.
As (C) phenoxy resin, commercially available product can be used.As (C) phenoxy resin of commercially available product, can enumerate: three
JER1256, jER4250 of water chestnut Chemical Co., Ltd., jER4275, Nippon Steel & Sumitomo Metal Corporation YP-50,
YP-50S, YP-70, ZX-1356-2, FX-316, YPB-43C, YPB-43M etc..(C) phenoxy resin is not limited to this
A little specific examples.(C) phenoxy resin can be used alone, two or more can also be applied in combination.
The content of (C) phenoxy resin in resin composition for encapsulating is not particularly limited.With regard to (C) phenoxy resin
For content, go out from the viewpoint for the generation for suitably inhibiting bleeding in the state of maintaining high fluidity and high-fire resistance
Hair, is preferably 0.1 mass parts~15 mass parts, more preferably 0.5 mass parts~10 relative to 100 mass parts of (A) epoxy resin
Mass parts, further preferably 1.5 mass parts~6 mass parts.
(C) in resin composition for encapsulating as long as the containing ratio of phenoxy resin can obtain inhibiting the production of bleeding
The range of raw effect is then not particularly limited.For example, for the containing ratio of (C) phenoxy resin, from the viewpoint of heat resistance
It sets out, is preferably 3.0 mass % hereinafter, more preferably 2.0 mass % or less relative to resin composition for encapsulating.In addition, just
It (C) is preferably 2.0 relative to resin composition for encapsulating from the viewpoint of mobility for the containing ratio of phenoxy resin
Quality % hereinafter, more preferably 1.5 mass % hereinafter, further preferably 0.05 mass of mass %~1.0 %.In addition, just (C)
For the containing ratio of phenoxy resin, suitably inhibit bleeding from the state of maintaining high fluidity and high-fire resistance
It is preferably 0.05 mass %~2.0 mass % relative to resin composition for encapsulating from the perspective of generation, more preferably 0.1
The mass % of quality %~1.5, further preferably 0.3 mass of mass %~1.2 %.
There are the content and containing ratio of (C) phenoxy resin more high, inhibits the effect of the generation of bleeding is bigger to incline
To, have the content of (C) phenoxy resin and containing ratio more low, more can inhibit the mobility as caused by Efficient Adhesive Promotion decline
Tendency.
< (D) inorganic filling material >
The resin composition for encapsulating of the disclosure includes (D) inorganic filling material.
The solidfied material of resin composition for encapsulating comprising (D) inorganic filling material has heat-resisting cyclicity, moisture-proof and answers
Power reduces excellent tendency.
As (D) inorganic filling material, it is not particularly limited.As the specific example of (D) inorganic filling material, can enumerate
The silica such as colloidal silicon dioxide, hydrophobic silica, spherical silicon dioxide, talcum etc., from mobility when coating
Viewpoint is set out, preferably spherical silicon dioxide.
In the disclosure, silica is that " spherical " refers to following situation.
Firstly, existing not completely being heated when spheroidizing to native silicon dioxide or synthetic silica
The shape of the particle of melting does not become just spherical situation.Made of being fused to each other additionally, there are the particle of two or more melting
The case where particle is mingled in wherein.Other particle surfaces are attached to additionally, there are the silica steam of evaporation and are solidified, result
Obtain the case where adhering to fine-grained spherical silicon dioxide particle.Although so-called silica be essentially it is spherical, allow this
The particle of sample shape mixes wherein, but for example when with the sphericity of Wadell [(circle equal with the projected area of particle
Diameter)/(the external minimum diameter of a circle with the perspective view of particle)] and when indicating the sphericity of particle, when the value is 0.9 or more
When particle is the 90 mass % or more of inorganic filling material silica entirety, then silica is referred to as " spherical ".
As (D) inorganic filling material, from the viewpoint of mobility, preferably average grain diameter is 0.01 μm~20 μm of ball
Shape silica, the spherical silicon dioxide that more preferable average grain diameter is 0.02 μm~10 μm.
The measuring method of the average grain diameter in the disclosure is recorded below.
Average grain diameter refers to: using laser diffraction/(Co., Ltd.'s hole field scattering formula particle size distribution device LA-920
Make made), it utilizes and is worth obtained by the size distribution measurement based on population and its frequency.As dispersion solvent, in order to
Dispersed particle and use of water is preferred, any one of acetone or alcohol.As determination condition, by particle concentration in terms of quality criteria
Tens of ppm~hundreds of ppm are set as, ultrasonic treatment time is set as 30 minutes, measuring temperature is set as room temperature (25 DEG C).
In addition, the specific surface area of (D) inorganic filling material is not particularly limited.Wherein, from the sight of mobility and reliability
Point sets out, and the specific surface area of (D) inorganic filling material is preferably 0.3mm2/ g~300mm2/ g, more preferably 1.0mm2/ g~
100mm2/g.It should be noted that the specific surface area of (D) inorganic filling material is based on JIS Z 8830 by the N2 adsorption under 77K
Ability measures.
As (D) inorganic filling material, commercially available product can be used.As (D) inorganic filling material of commercially available product, can enumerate
Co., Ltd.'s Admatechs spherical silicon dioxide (name of an article: SO-E2, SE2300, SE2200-SEJ etc.).(D) inorganic fill
Material is not limited to these specific examples.(D) inorganic filling material can be used alone, two or more combination can also be made
With.
(D) inorganic filling material can be implements surface treatment using at least one kind of in following (F) coupling agents in advance
Inorganic filling material can also will utilize (F) coupling agent to implement (D) inorganic filling material of surface treatment and table is not carried out
(D) inorganic filling material of surface treatment is applied in combination.(D) for implementing surface treatment by using utilization (F) coupling agent is inorganic
The compatibility of packing material, (D) inorganic filling material and resin component improves, and has the behaviour that resin composition for encapsulating can be improved
The tendency of the property made and mobility and the toughness of solidfied material, elasticity modulus and bonding force.
(D) inorganic filling material and (F) are even when with regard to being surface-treated using (F) coupling agent to (D) inorganic filling material
For the ratio for joining agent, relative to (D) inorganic filling material, (F) coupling agent is preferably 0.2 mass of mass %~5.0 %, more excellent
It is selected as the 0.3 mass % of mass %~3.0, further preferably 0.4 mass of mass %~2.0 %.
For the content of (D) inorganic filling material, from viewpoints such as mobility, insulating reliabilities, relative to (A) ring
100 mass parts of oxygen resin are preferably 5 mass parts~80 mass parts, more preferably 20 mass parts~70 mass parts.
For the containing ratio of (D) inorganic filling material, from viewpoints such as mobility, insulating reliabilities, relative to close
Envelope is preferably the 40 mass % of mass %~85 with resin combination, more preferably the 50 mass % of mass %~75, further preferably
For 55 mass of mass %~70 %.
It include that (D) for utilizing (F) coupling agent to implement surface treatment in advance inorganic is filled out in above-mentioned resin composition for encapsulating
In the case where filling material, from viewpoints such as mobility, cementabilities, (F) coupling agent is utilized to implement (D) of surface treatment in advance
The content of inorganic filling material is preferably 5 mass parts~80 mass parts relative to 100 mass parts of (A) epoxy resin, more preferably
20 mass parts~70 mass parts.
It include that (D) for utilizing (F) coupling agent to implement surface treatment in advance inorganic is filled out in above-mentioned resin composition for encapsulating
In the case where filling material, from viewpoints such as mobility, cementabilities, containing ratio is preferably relative to resin composition for encapsulating
The 40 mass % of mass %~85, the more preferably 50 mass % of mass %~75, further preferably 55 mass of mass %~70 %.
< (E) rubber additive >
The resin composition for encapsulating of the disclosure can according to need comprising (E) rubber additive.
It is excellent that the solidfied material of resin composition for encapsulating comprising (E) rubber additive has the tendency that stress mitigates.
(E) type of rubber additive is not particularly limited, and can suitably select from known rubber additive.
As the specific example of (E) rubber additive, acrylic rubber, urethane rubber, organic silicon rubber, fourth two can be enumerated
Alkene rubber etc..For (E) rubber additive, at 25 DEG C be the rubber additive of liquid and at 25 DEG C be solid-like rubber
Glue additive can be used.
(E) in the case that rubber additive is solid-like at 25 DEG C, as the form of (E) rubber additive, without spy
It does not limit, can enumerate that particle shape, powdered, material is granular etc..From the viewpoint of heat resistance, (E) rubber additive is preferably grain
Sub- shape.(E) in the case that rubber additive is particle shape, the average grain diameter of (E) rubber additive is preferably 0.01 μm~20 μm,
More preferably 0.02 μm~10 μm, further preferably 0.03 μm~5 μm.
(E) in the case that rubber additive is liquid at 25 DEG C, as (E) rubber additive, can enumerate polybutadiene,
Hycar, polyisoprene, polypropylene oxide, polydiorganosiloxanepolyurea (Japanese: Port リ ジ オ Le ガ ノ
シ ロ キ サ Application) etc. low molecular weight compositions.The weight average molecular weight of above-mentioned low molecular weight compositions is preferably 5,000~80,000, more
Preferably 8,000~50,000.
(E) it in the case that rubber additive is solid-like at 25 DEG C, is preferably heated and dissolves it in (A) epoxy
It is used after in resin or (B) specific curing agent.In addition, (E) rubber additive can be used to be had and epoxy reaction in end
Group rubber additive.For in (E) rubber additive that end has with the group of epoxy reaction, at 25 DEG C
Be for the rubber additive of liquid and at 25 DEG C solid-like rubber additive can be used.As the base with epoxy reaction
Group, can enumerate carboxyl, hydroxyl, amino etc..
As (E) rubber additive, commercially available product can be used.As (E) rubber additive of commercially available product, can enumerate: space
Emerging production Co. Ltd. system CTBN1300, ATBN1300-16, CTBN1008-SP in portion etc.；TORAY DOWCORNING Co., Ltd.
Silicone rubber powder (name of an article: AY42-119) processed；JSR Corp.'s rubber powder (name of an article: XER81) etc..(E) rubber
Additive is not limited to these specific examples.(E) rubber additive can be used alone, two or more combination can also be made
With.
In the case that resin composition for encapsulating includes (E) rubber additive, as the content of (E) rubber additive, from
The viewpoints such as mobility, adaptation are set out, and are preferably 0.2 mass parts~5.0 mass parts relative to 100 mass parts of (A) epoxy resin,
More preferably 0.5 mass parts~3.0 mass parts.
Resin composition for encapsulating include (E) rubber additive in the case where, just (E) rubber additive containing ratio and
Speech, is preferably 0.05 matter of mass %~5.0 relative to resin composition for encapsulating from viewpoints such as mobility, adaptations
Measure %, the more preferably 0.1 mass % of mass %~4.0, further preferably 0.4 mass of mass %~3.0 %.
< (F) coupling agent >
Resin composition for encapsulating can according to need comprising (F) coupling agent.
Resin composition for encapsulating comprising (F) coupling agent has the tendency that excellent adhesion.
(F) type of coupling agent is not particularly limited, and can suitably select from known coupling agent.As (F)
The specific example of coupling agent can be enumerated: have at least one kind of silane compound in primary amino group, secondary amino group and tertiary amino,
Silane compound with epoxy group, the silane compound with sulfydryl, the silane compound with alkyl, the silicon with phenyl
Hydride compounds, the silane compound with urea groups, the silane compound with methylacryloyl, the silane with acryloyl group
The silane based compounds such as compound, silane compound with vinyl；Titanate esters based compound etc..In these, used from sealing
From the perspective of the adaptation of resin combination, preferably with the silane compound of epoxy group.
As (F) coupling agent, commercially available product can be used.It as (F) coupling agent of commercially available product, can enumerate: SHIN-ETSU HANTOTAI's chemistry work
Industry Co. Ltd. system KBM-303, KBM-402, KBM-403, KBE-403, KBE-903, KBE-9103, KBM-573,
KBM-502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-1003, KBE-585, KBM-9659,
KBM-803, KBE-846, KBE-9007, X-12-967C, KBM-103, KBM-202SS etc..(F) coupling agent is not limited to
These specific examples.(F) coupling agent can be used alone, two or more can also be applied in combination.
(F) coupling agent can also be used as the surface treating agent of (D) inorganic filling material and to be attached to (D) inorganic fill material
The state on the surface of material is included in resin composition for encapsulating.
In the case that resin composition for encapsulating includes (F) coupling agent, from viewpoints such as mobility, heat resistances, (F) is even
The content of connection agent is preferably 0.2 mass parts~5.0 mass parts, more preferably 0.5 matter relative to 100 mass parts of (A) epoxy resin
Measure part~3.0 mass parts.
In the case that resin composition for encapsulating includes (F) coupling agent, from viewpoints such as mobility, heat resistances, (F) is even
The containing ratio of connection agent is preferably the 0.05 mass % of mass %~5, more preferably 0.1 mass % relative to resin composition for encapsulating
~4.0 mass %, further preferably 0.4 mass of mass %~3.0 %.
The other ingredient > of <
In the range of the effect of the generation for the bleeding that is inhibited, resin composition for encapsulating can further basis
It needs and includes to become the agent, pigment such as carbon black, dyestuff, ion trap agent, defoaming agent, levelling agent, anti-for improving shaking for operability
Oxidant, curing accelerator, reactive diluent, organic solvent etc..
The preparation method > of < resin composition for encapsulating
The resin composition for encapsulating of the disclosure can obtain as follows: by (A) epoxy resin, (B) specific curing agent, (C)
Other additives such as phenoxy resin and (D) inorganic filling material and (E) rubber additive, (F) coupling agent disposably or
Rand is implemented to heat as needed respectively, while being stirred, melting, mix, dispersing, thus obtains.Especially at (A)
Epoxy resin, (B) specific curing agent, (C) phenoxy resin etc. are to glue if with solid states cooperation sometimes in solid situation
Degree rises, operability declines, therefore preferably mixed etc. after liquid and heating in advance.As they mixing, stir
The device mixing, disperse etc., is not particularly limited, can enumerate: having the mixing and kneading machine, triple-roller mill, ball of agitating device, heating device etc.
Grinding machine, planetary-type mixer, ball mill etc..Using these devices by mentioned component mixing, mixing and deaeration as needed, thus
Available resin composition for encapsulating.
The physical property > of < resin composition for encapsulating
The viscosity of resin composition for encapsulating is not particularly limited.Wherein, from the viewpoint of mobility, sealing resin
The viscosity of composition preferably at 25 DEG C be 0.1Pas~100.0Pas, more preferably at 25 DEG C for 0.1Pas~
50.0Pa·s.It should be noted that E type viscosimeter (cone angle can be used in the viscosity of the resin composition for encapsulating at 25 DEG C
3 °, 10 revs/min of revolving speed) it measures.
When resin composition for encapsulating is used for flip-chip underfill etc., as at 100 DEG C~120 DEG C
It is nearby filled in index when tens of μm~hundreds of μm of close gap, the viscosity of resin composition for encapsulating is preferably at 110 DEG C
It is down 0.40Pas hereinafter, being more preferably 0.25Pas at 110 DEG C hereinafter, being further preferably at 110 DEG C
0.15Pas hereinafter, be particularly preferably 0.12Pas at 110 DEG C hereinafter, be in turn preferably 0.10Pas at 110 DEG C with
Under.It should be noted that rheometer AR2000 (TA can be used in the viscosity of the resin composition for encapsulating at 110 DEG C
Instrument Japan Co. Ltd. system, aluminium cone 40mm, shear velocity 32.5/ second) it is measured.
For resin composition for encapsulating, at measured at 25 DEG C using E type viscosimeter 2.5 revs/min of revolving speed
The ratio between viscosity when viscosity is with 10 revs/min of revolving speed [(viscosity at 2.5 revs/min of revolving speed)/it is (viscous at 10 revs/min of revolving speed
Degree)], i.e. thixotropic index be preferably 0.5~1.5, more preferably 0.8~1.2.When thixotropic index within the above range when, have
Leg (Japanese: Off ィ レ ッ ト) formative when resin composition for encapsulating is used as underfill further increases
Tendency.It should be noted that the viscosity and thixotropic index of resin composition for encapsulating can be by being suitable for each ingredient of selection
Ratio of components is set as desired range.
It is 25 DEG C, 24 hours as the working life of index relevant to the storage stability of resin composition for encapsulating
The rate of change in viscosity before and after storage under environment, is calculated by following formula.
Working life (%)=100 × [viscosity before (viscosity before viscosity-storage after storage)/storage]
The smaller expression storage stability of the numerical value of working life is higher, preferably 150% hereinafter, more preferably 130% hereinafter,
Further preferably 100% or less.
[solidfied material]
The solidfied material of the disclosure is made of the resin composition for encapsulating solidification for the generation that will inhibit bleeding.
Such as at 80 DEG C~165 DEG C heat treatment in 1 minute~150 minutes is carried out to resin composition for encapsulating and makes its solidification, by
This can make solidfied material, as described later, solidfied material as the sealing material of encapsulated electronic components come using.
[electronic part apparatus]
The electronic part apparatus of the disclosure has: the substrate with circuit layer；Configuration on aforesaid substrate and with above-mentioned electricity
The electronic component of road floor electrical connection；With the solidfied material for the disclosure configured in aforesaid substrate Yu the gap of above-mentioned electronic component.This
Disclosed electronic part apparatus can use the resin composition for encapsulating encapsulated electronic components of the disclosure and obtain.Pass through utilization
The resin composition for encapsulating of the disclosure carrys out encapsulated electronic components, the electronic part apparatus of the disclosure it is resistance to temperature cycling excellent
It is different.
It as electronic part apparatus, can enumerate: in lead frame, the band carrier that wiring is completed, rigid wiring plate, flexible cloth
Line plate, glass, silicon wafer etc., which have, carries semiconductor chip, transistor, diode, thyristor etc. on the substrate of circuit layer
The electronic components such as the passive elements such as active component, capacitor, resistor, electric resistance array, coil, switch, and by necessary part
Electronic part apparatus obtained by resin composition for encapsulating sealing with the disclosure etc..
As one of the object that can apply the disclosure, can especially enumerate in rigid wiring plate, flexible wiring board or glass
On be formed by wiring on using convex block connection to semiconductor element progress flip-chip bond obtained by semiconductor device.As
Specific example can enumerate flip-chip BGA (Ball Grid Array, ball grid array), LGA (Land Grid Array, plane
Grid array), the electronic part apparatus such as COF (Chip On Film, pasting chip).
The resin composition for encapsulating of the disclosure is suitable as the underfill of flip-chip excellent in reliability.
As the flip-chip field of the particularly suitable resin composition for encapsulating using the disclosure, just like lower component: connecting wiring base
The convex block material of plate and semiconductor element is without using previous solder containing pb but uses the lead-free solders such as Sn-Ag-Cu system
Flip-chip semiconductor component.For carrying out convex block company using lead-free solder more crisp compared with previous kupper solder in terms of physical property
The resin composition for encapsulating of flip-chip obtained by connecing, the disclosure can also maintain good reliability.In addition, by chip
When the wafer-level packages body such as level CSP is installed on substrate, by the resin composition for encapsulating of the application disclosure, may be implemented can
By the raising of property.
[manufacturing method of electronic part apparatus]
The manufacturing method of the electronic part apparatus of the disclosure is included the substrate with circuit layer and is configured in above-mentioned base
The process that the resin composition for encapsulating for the electronic component-use disclosure being electrically connected on plate and with foregoing circuit layer is sealed.
Using the resin composition for encapsulating of the disclosure to substrate and the work that is sealed of electronic component with circuit layer
Sequence is not particularly limited.It can be mentioned, for example: rear injection mode, after connection electronic component and with the substrate of circuit layer,
Resin composition for encapsulating is assigned using gap of the capillarity to electronic component and substrate, is then sealed with resin group
Close the curing reaction of object；And first coating method, first to substrate and at least one of electronic component with circuit layer
Surface assigns the resin composition for encapsulating of the disclosure, be thermally compressed and when electronic component being made to be connected to substrate, disposably
Ground carries out the connection of electronic component and substrate and the curing reaction of resin composition for encapsulating.
As the adding method of resin composition for encapsulating, casting mode, the method for salary distribution, mode of printing etc. can be enumerated.
Condition of cure when resin composition for encapsulating as the gap for making to be imparted to electronic component and substrate solidifies, does not have
It is particularly limited to, such as carries out heat treatment in 1 minute~150 minutes preferably at 80 DEG C~165 DEG C.
By using the resin composition for encapsulating of the disclosure, the generation that bleeding can be easily manufactured is inhibited
The electronic part apparatus such as flip-chip fixing body.
Embodiment
Illustrate the present invention below based on embodiment, but the present invention is not limited by following embodiments.It should be noted that
In embodiment below, part and % indicate mass parts and quality % in no special declaration.
(embodiment 1~14, comparative example 1)
Cooperate each ingredient in the way of becoming composition shown in table 1 and table 2, is carried out with triple-roller mill and vacuum mixing and kneading machine
It is kneaded dispersion, thus makes the resin composition for encapsulating of embodiment 1~14 and comparative example 1.It should be noted that matching in table
Conjunction unit is mass parts, and in addition "-" indicates " mismatching ".In addition, inorganic filling material in resin composition for encapsulating contains
There is rate (quality %) by the use level of each ingredient to calculate.
As (A) epoxy resin, materials described below is prepared.
Epoxy resin 1: amine type epoxy resin (the Mitsubishi chemical Co., Ltd's system, trade name of the epoxy group with 3 functions
" jER-630 ", epoxide equivalent 96g/eq, weight average molecular weight 290)
Epoxy resin 2: bisphenol f type epoxy resin (Nippon Steel & Sumitomo Metal Corporation's system, trade name " YDF-
8170C ", epoxide equivalent 160g/eq, weight average molecular weight 350)
As (B) specific curing agent, materials described below is prepared.
Amine hardener 1: diaminotoluene type amine hardener (Mitsubishi chemical Co., Ltd's system, trade name " jER Cure
W”)
Amine hardener 2: tetramethyl triaminotriphenyl methane NH2 type amine hardener (Nippon Kayaku K. K's system, trade name
" Kayahard-AA ")
As (C) phenoxy resin, materials described below is prepared.
Phenoxy resin 1: phenoxy resin (Mitsubishi chemical Co., Ltd's system, trade name with bisphenol A-type structure
" 1001 ", weight average molecular weight 900)
Phenoxy resin 2: phenoxy resin (Mitsubishi chemical Co., Ltd's system, trade name with bisphenol A-type structure
" 1007 ", weight average molecular weight 2900)
Phenoxy resin 3: phenoxy resin (Mitsubishi chemical Co., Ltd's system, trade name with bisphenol A-type structure
" 1010 ", weight average molecular weight 5500)
Phenoxy resin 4: phenoxy resin (Mitsubishi chemical Co., Ltd's system, trade name with bisphenol A-type structure
" 1256 ", weight average molecular weight 50,000)
Phenoxy resin 5: phenoxy resin (Nippon Steel & Sumitomo Metal Corporation's system, quotient with bisphenol-f type structure
The name of an article " ZX-1356-2 ", weight average molecular weight 50,000)
As (D) inorganic filling material, materials described below is prepared.
Inorganic filling material 1: 0.5 μm of average grain diameter of the ball that processing is implemented with the silane compound with epoxy group
Shape silica (Co., Ltd.'s Admatechs system, trade name " SE2200-SEJ ")
As colorant, carbon black (Mitsubishi chemical Co., Ltd's system, trade name " MA-100 ") is prepared.
For the resin composition for encapsulating for using above-mentioned material to obtain, the evaluation of each characteristic has been carried out as described below.
In addition, showing each numerical value in table 1 below and table 2.
(1) mobility: viscosity and thixotropic index
For the viscosity (room temperature viscosity, Pas) at 25 DEG C of resin composition for encapsulating, with E type viscosimeter (cone angle
3 °, 10 revs/min of revolving speed) it is determined with sample size 2.5mL.In addition, the thixotropic index at 25 DEG C be set as 2.5 turns of revolving speed/
Minute when viscosity with 10 revs/min of revolving speed when the ratio between viscosity [(viscosity at 2.5 revs/min of revolving speed)/(10 revs/min of revolving speed
Viscosity when clock)].
For the viscosity (Pas) at 110 DEG C, use rheometer AR2000 (aluminium cone 40mm, shear velocity 32.5/ second)
It is determined with sample size 0.7mL.
(2) heat resistance: glass transition temperature (Tg) and thermal expansion coefficient (CTE)
By resin composition for encapsulating according at 150 DEG C 120 minutes condition solidify, thus make test film (φ 4mm ×
20mm).For made test film, thermo-mechanical analysis device (TA Instrument Japan Co. Ltd. system, quotient are used
Name of an article TMAQ400) according to load 15g, -50 DEG C of measuring temperature~220 DEG C and 5 DEG C/min of heating rate of condition measurement glass
Change transition temperature (Tg) and thermal expansion coefficient (CTE).
The thermal expansion coefficient of Tg temperature range below is set as CTE1, by the thermal expansion coefficient of the temperature range of Tg or more
It is set as CTE2.Tg and CTE indicates thermal stability, and Tg is preferably 100 DEG C~130 DEG C or so, and the CTE1 and CTE2 the low the more preferred.
(3) measurement of length is oozed out
Ar is carried out to solder resist substrate2Corona treatment (400W, 2 minutes) uses the sealing being filled in syringe
Resin combination is with the needle of 25G to progress Ar2Spue 30mg on the solder resist substrate of corona treatment, is potted,
Solidify 120 minutes at 150 DEG C.After solidification, with the length of optics measurement microscope exudation.Substrate was used respectively in FR-4 (day
Vertical chemical conversion Co. Ltd. system, MRC-E-679) on be formed with (the Taiyo Ink Manufacturing Co., Ltd PSR- of solder resist 1
4000-AUS308) and the substrate of solder resist 2 (Taiyo Ink Manufacturing Co., Ltd PSR-4000-AUS703).With regard to two bases
For plate, the exudation length the short the more preferred.
[table 1]
[table 2]
By the result of table 1 and table 2 it is found that the heat resistance and mobility of the resin composition for encapsulating of embodiment 1~14 are excellent
It is different, and compared with the resin composition for encapsulating of comparative example 1, it oozes out short.It follows that the sealing resin group of the present embodiment
The generation of bleeding can be inhibited in the state of maintaining high-fire resistance and high fluidity by closing object.
Whole documents, patent application and the technical standard recorded in this specification, with it is specific and respectively record each document,
The case where patent application and technical standard, is introduced in this specification with degree as reference.
Claims (9)
1. a kind of resin composition for encapsulating, it includes (A) epoxy resin, (B) to have the curing agent of at least one amino, (C) tool
There are the resin and (D) inorganic filling material of phenoxy group structure.
2. resin composition for encapsulating according to claim 1, wherein (C) has the resin of phenoxy group structure
Weight average molecular weight MwIt is 500 or more and 100,000 or less.
3. resin composition for encapsulating according to claim 1, wherein (C) has the resin of phenoxy group structure
Weight average molecular weight MwIt is 2,000 or more and 100,000 or less.
4. resin composition for encapsulating described in any one of according to claim 1~claim 3, wherein (C) has
The resin of phenoxy group structure includes the following general formula (1) compound represented,
In general formula (1), A indicates structure shown in general formula (2), and end group B indicates group shown in hydroxyl or general formula (3)；It is logical
In formula (2), R1And R2Separately indicate hydrogen atom or methyl；N indicates 1~1000 integer；When the integer that n is 2 or more, 2
A above A is identical or different；2 end group B are identical or different.
5. resin composition for encapsulating described in any one of according to claim 1~claim 4, (C) has benzene oxygen
The containing ratio of the resin of based structures is 0.05 mass of mass %~2.0 % relative to resin composition for encapsulating.
6. resin composition for encapsulating described in any one of according to claim 1~claim 5 is used for electronic component dress
The sealing set.
7. a kind of solidfied material is to solidify resin composition for encapsulating described in any one of 1~claim 6 of claim
Made of.
8. a kind of electronic part apparatus, has:
Substrate with circuit layer；
The electronic component that configuration is electrically connected on the substrate and with the circuit layer；With
Configure the solidfied material as claimed in claim 7 in the substrate and the gap of the electronic component.
9. a kind of manufacturing method of electronic part apparatus is included the substrate with circuit layer and is configured on the substrate
And sealing resin described in any one of electronic component-use 1~claim 6 of claim being electrically connected with the circuit layer
The process of composition sealing.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2016/086387 WO2018105057A1 (en) | 2016-12-07 | 2016-12-07 | Resin composition for sealing, cured product, electronic component device, and method for producing electronic component device |
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| CN202510074713.0A Division CN119823535A (en) | 2016-12-07 | Sealing resin composition, cured product, electronic component device, and method for manufacturing electronic component device |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP7251583B2 (en) | 2023-04-04 |
| KR20190085016A (en) | 2019-07-17 |
| JPWO2018105057A1 (en) | 2019-10-24 |
| WO2018105057A1 (en) | 2018-06-14 |
| JP6935803B2 (en) | 2021-09-15 |
| JP2021185242A (en) | 2021-12-09 |
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