CN110026693A - Laser boring method, device, electronic device and computer readable storage medium - Google Patents
Laser boring method, device, electronic device and computer readable storage medium Download PDFInfo
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- CN110026693A CN110026693A CN201910266889.0A CN201910266889A CN110026693A CN 110026693 A CN110026693 A CN 110026693A CN 201910266889 A CN201910266889 A CN 201910266889A CN 110026693 A CN110026693 A CN 110026693A
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- laser
- light beam
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- moment
- boring
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a kind of laser boring method, device, electronic device and computer readable storage mediums, it include the identical laser boring sub-device of two structure compositions in laser drilling device, the laser boring sub-device includes laser, beam expanding lens and the light concentrating components with laser focussing force, the laser that the laser issues passes sequentially through the beam expanding lens and light concentrating components, projects from the light-emitting surface of the light concentrating components；Wherein, the laser face being pierced by from the light concentrating components of two laser boring sub-devices, and it is located in a straight line, and it propagates along the vertical direction, based on this structure, the two beam laser that the present invention can use face are scanned the region in punching profile, so that the region in punching profile can produce raised or sunken Deng deformation, suitable for the wider array of substrate of thickness range, and aperture efficiency is improved relative to conventional ultrafast laser at silk cutting and boring method, and also the region for punching profile can voluntarily be separated.
Description
Technical field
This application involves technical field of laser processing more particularly to a kind of laser boring method, device, electronic device and meters
Calculation machine readable storage medium storing program for executing.
Background technique
As the 5th third generation mobile communication network technology is increasingly mature, people need to be continuously improved mobile communication terminal device
Screen accounting is just able to satisfy market demands, has caused each bound pair brittle transparent material and trnaslucent materials customizes cheesing techniques
It pursues, such as multiple Disciplinary Frontiers such as aperture under OLED screen screen, which has important application prospect.
Currently, ultrafast laser is that transparent material punching field application is more universal at silk patterning method cooperation other methods ceasma
Technology.But conventional ultrafast laser is at silk patterning method, has the small limitations such as low with aperture stability of processable substrate thicknesses range,
The time needed especially for thicker single side transparent substrate aperture is longer, and voluntarily separates more difficult, it is difficult to carry out big
Technical scale application, therefore it is necessary to design one kind, suitable thicknesses range is wider array of, efficient stable, not only can be applicable to transparent base
On plate, can be used on single side transparent substrate, can quickly form contoured and the method that separates contoured voluntarily and
Equipment.
Summary of the invention
The embodiment of the present application provides a kind of laser boring method, device, electronic device and computer readable storage medium, fits
It is wider with thickness range, and efficient stable, it can quickly form contoured and separate contoured voluntarily.
The embodiment of the present application first aspect provides a kind of laser drilling device, which includes two complete phases of structure composition
Same laser boring sub-device, the laser boring sub-device include laser, beam expanding lens and gathering with laser focussing force
Light component, the laser that the laser issues pass sequentially through the beam expanding lens and light concentrating components, go out light from the light concentrating components
It projects in face；Wherein, the laser face being pierced by from the light concentrating components of two laser boring sub-devices, and it is located at one
On straight line, and propagate along the vertical direction.
The embodiment of the present application second aspect provides a kind of laser boring method, and this method is applied to the embodiment of the present application first
The laser drilling device of aspect, comprising:
The laser boring sub-device controlled in the laser drilling device generates a branch of first laser light beam, and controls institute
It states punching profile of the first laser light beam in target base plate to be scanned the target base plate, make inside the target base plate
Orientation damage is generated along the punching profile；
Two laser boring sub-devices for controlling the laser drilling device generate second laser light beam respectively, and control institute
It states second laser light beam to be scanned in the target area that the punching profile surrounds, generates at least one deformation region,
In, the second laser light beam meets predetermined process standard, and the generation moment of second laser light beam described in two beams is respectively
One moment and the second moment, the second laser light beam that first moment generates scanned in the target area when a length of the
One duration, when a length of second duration that the second laser light beam that second moment generates scans in the target area；
After the duration of each second laser light beam scanning, controls corresponding laser boring sub-device and stop generating second
Laser beam.
The embodiment of the present application third aspect provides a kind of electronic device, which includes:
First control module generates a branch of first for controlling the laser boring sub-device in the laser drilling device
Laser beam, and control punching profile of the first laser light beam in target base plate and the target base plate is scanned,
Make to generate orientation damage along the punching profile inside the target base plate；
Second control module, two laser boring sub-devices for controlling the laser drilling device generate second respectively
Laser beam, and control the second laser light beam and be scanned in the target area that the punching profile surrounds, it generates extremely
A few deformation region, wherein the second laser light beam meets predetermined process standard, and second laser light beam described in two beams
Generating the moment is respectively the first moment and the second moment, and the second laser light beam that first moment generates is in the target area
When a length of first duration of interior scanning, the second laser light beam that second moment generates scanned in the target area when
A length of second duration；
Third control module after duration for scanning in each second laser light beam, controls corresponding laser boring
Sub-device stops generating second laser light beam.
The embodiment of the present application fourth aspect provides a kind of electronic device, comprising: memory, processor and is stored in described deposit
On reservoir and the computer program that can run on the processor, when the processor executes the computer program, realize
The step in method that the embodiment of the present application second aspect provides.
The 5th aspect of the embodiment of the present application provides a kind of computer readable storage medium, is stored thereon with computer program,
When the computer program is executed by processor, the step in the method for the embodiment of the present application second aspect offer is realized.
The present invention provides a kind of laser boring method, device, electronic device and computer readable storage medium, laser is beaten
It include the identical laser boring sub-device of two structure compositions in aperture apparatus, the laser boring sub-device includes laser
Device, beam expanding lens and the light concentrating components with laser focussing force, the laser that the laser issues pass sequentially through the beam expanding lens
And light concentrating components, it is projected from the light-emitting surface of the light concentrating components；Wherein, from the optically focused of two laser boring sub-devices
The laser face being pierced by component, and be located in a straight line, and propagate along the vertical direction, it is based on this structure, the present invention can
With using two beam laser of face to punching profile in region be scanned so that punching profile in region can produce it is convex
It rises or the deformation such as recess, is suitable for the wider array of substrate of thickness range, and aperture efficiency is cut relative to conventional ultrafast laser at silk
Punch method is improved, and is also possible that the region of punching profile can voluntarily separate.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram for laser drilling device that the application first embodiment provides；
Fig. 2 is the structural schematic diagram for another laser drilling device that the application first embodiment provides；
Fig. 3 is a kind of flow diagram for laser boring method that the application second embodiment provides；
Fig. 4 is the original for generating orientation crack damage on single side transparent substrate using the laser boring method of second embodiment
Manage schematic diagram；
Fig. 5 is to generate the material object for orienting and damaging on single side transparent substrate using the laser boring method of second embodiment just
Face figure；
Fig. 6 is the signal of the punching profile generated on single side transparent substrate using the laser boring method of second embodiment
Figure；
Fig. 7 is to generate protrusion in the punching profile of single side transparent substrate using the laser boring method of second embodiment
The schematic diagram of deformation region；
Fig. 8 is to generate recess in the punching profile of single side transparent substrate using the laser boring method of second embodiment
The schematic diagram of deformation region；
Fig. 9 is the deformation generated in the punching profile of single side transparent substrate using the laser boring method of second embodiment
The schematic diagram in region；
Figure 10 is the schematic diagram for punching the region of profile in second embodiment and voluntarily separating with substrate, wherein dark parts
The region surrounded for punching profile.
Figure 11 is a kind of flow diagram for laser boring method that the application 3rd embodiment provides；
Figure 12 is a kind of structural schematic diagram for electronic device that the application fourth embodiment provides；
Figure 13 is the structural schematic diagram for another electronic device that the application fourth embodiment provides.
Specific embodiment
To enable present invention purpose, feature, advantage more obvious and understandable, below in conjunction with the application
Attached drawing in embodiment, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described reality
Applying example is only some embodiments of the present application, and not all embodiments.Based on the embodiment in the application, those skilled in the art
Member's every other embodiment obtained without making creative work, shall fall in the protection scope of this application.
First embodiment:
The application first embodiment provides a kind of laser drilling device, can be used based on the laser drilling device two-sided
Laser quickly forms contoured on single side transparent substrate, and contoured is automatically separated.The laser drilling device is suitable
Substrate thicknesses range is bigger, such as the substrate of 0.1mm to 3mm is applicable in, and stability is high, and aperture efficiency comparative's tradition is super
Fast laser filament cutting and boring method improves 50% to 80%, to be suitable for complicated large-scale application scene.
Referring to Fig. 1, which includes: the identical laser boring sub-device 11 of two structure compositions, institute
It states laser boring sub-device 11 and includes laser 111, beam expanding lens 112 and the light concentrating components 113 with laser focussing force, it is described
The laser that laser 111 issues passes sequentially through the beam expanding lens 112 and light concentrating components 113, goes out light from the light concentrating components 113
It projects in face；Wherein, the laser face being pierced by from the light concentrating components 113 of two laser boring sub-devices 11, and position
In on straight line, and propagate along the vertical direction.In Fig. 1, among two light concentrating components 113 is target base to be punctured
Plate, in the present embodiment, when in use, the target base plate in the present embodiment is horizontally disposed in two laser boring sub-devices
Light concentrating components 113 centre.Optionally, in one example, target base plate to be punctured is to the vertical of two light concentrating components
It is equidistant.
Optionally, in the present embodiment, it is either other with focussing force that light concentrating components can be lens galvanometer
Lens set, the present embodiment do not limit this.
Optionally, as shown in Figure 1, in one example, the laser boring sub-device 11 further includes reflecting mirror 114, institute
It states reflecting mirror 114 to be set between the beam expanding lens 112 and the light concentrating components 113, the laser edge that the laser 111 issues
The optical path of horizontal direction passes through the beam expanding lens 112 and reaches the reflecting mirror 114, perpendicular in the reflection lower edge of the reflecting mirror 114
Histogram to optic path to the light concentrating components 113, projected from the light-emitting surface of the light concentrating components 113.
Optionally, in one embodiment, as shown in Figure 1, the structure of two laser boring sub-devices, about two
The midpoint of the light concentrating components constitutes origin symmetry arrangement.That is in Fig. 1, two light concentrating components are expanded about middle point symmetry, two
Mirror is about middle point symmetry, and two reflecting mirrors are about middle point symmetry, and two lasers are about middle point symmetry.
Optionally, in one embodiment, as shown in Fig. 2, the structure of two laser boring sub-devices, or about
(dotted line that A is identified in Fig. 2 represents the level where the midpoint of light concentrating components to horizontal plane where the midpoint of two light concentrating components
Face) constitute mirror symmetry arrangement.That is in Fig. 2, two light concentrating components are symmetrical about horizontal plane A where midpoint, and two beam expanding lens close
Horizontal plane A is symmetrical where midpoint, and two reflecting mirrors are symmetrical about horizontal plane A where midpoint, and two lasers are about midpoint institute
It is symmetrical in horizontal plane A.
Optionally, the parameters such as wavelength, power and the repetition rate of laser that laser issues in the present embodiment are according to reality
It needs to be arranged, the present embodiment does not limit this, and the laser beam that laser can provide includes but is not limited to gauss laser, shellfish
The multifocal hot spot etc. that Sai Er light beam, ultrafast laser are realized at silk focus on light beam, short-pulse laser and diffraction optics.
A kind of laser drilling device is present embodiments provided, includes two identical laser of structure composition in the device
Sub-device is punched, the laser boring sub-device includes laser, beam expanding lens and the light concentrating components with laser focussing force, institute
The laser for stating laser sending passes sequentially through the beam expanding lens and light concentrating components, projects from the light-emitting surface of the light concentrating components；Its
In, the laser face being pierced by from the light concentrating components of two laser boring sub-devices, and be located in a straight line, and
Propagate along the vertical direction, be based on this structure, the present invention can use two beam laser of face to the region in punching profile into
Row scanning is suitable for the wider array of substrate of thickness range so that the region in punching profile can produce raised or sunken Deng deformation,
And aperture efficiency is improved relative to conventional ultrafast laser at silk cutting and boring method, and is also possible that punching profile
Region can voluntarily separate.
Second embodiment:
The present embodiment provides a kind of laser boring method, which be can be applied to such as Fig. 1 and 2 and embodiment one
The laser drilling device of description, referring to Fig. 3, which includes:
A laser boring sub-device in step 301, control laser drilling device generates a branch of first laser light beam, and controls
Punching profile of the first laser light beam processed in target base plate is scanned target base plate, makes inside target base plate along perforating wheel
Exterior feature generates the damage of (special properties) orientation；
It is understood that target base plate to be punctured is horizontally disposed in two laser borings before step 301
Between two light concentrating components of sub-device.Optionally, accurate in order to punch, before step 301, further includes: for will
The laser boring sub-device for generating first laser, predicts whether point of irradiation of its light concentrating components in target base plate is located at perforating wheel
On exterior feature, if so, step 301 can be continued, if it is not, the position of the light concentrating components is then adjusted, so that the light concentrating components are in target
Point of irradiation on substrate is located on punching profile.
Optionally, in the present embodiment, target base plate can be single side transparent substrate, can also be two-side transparent substrate, this reality
Example is applied to be not limited in this respect.By taking single side transparent substrate as an example, as shown in figure 4, the first laser that a laser boring sub-device generates
Light beam is radiated on the transparent side of single side transparent substrate by lens 113, and the orientation damage of special properties is formd inside substrate
Hurt crackle (41 in Fig. 4), which can generate circle along punching profile scan inside single side transparent substrate
Orientation crack damage, and generate contour line as shown in Figure 5 (lines in Fig. 5) on single side transparent substrate surface.If this dozen
Hole profile is circle as shown in FIG. 6, the then wheel generated on single side transparent substrate according to the laser boring method of the present embodiment
Profile 61 as shown in fig. 6, for circle.
First laser light beam can be bessel beam in the present embodiment, or ultrafast laser at silk focus on light beam,
It can also be the multifocal hot spot etc. that diffraction optics is realized, the present embodiment is not limited in this respect.
Optionally, the wavelength of first laser light beam, power and repetition rate can be depending on the thickness of target base plate, this
Embodiment does not limit this.For example, the wavelength of first laser light beam is 1030nm, function for the target base plate with a thickness of 2mm
Rate is 25W, repetition rate 35kHZ.
Step 302, two laser boring sub-devices for controlling laser drilling device generate second laser light beam respectively, and control
Second laser light beam processed is scanned in the target area that punching profile surrounds, and generates at least one deformation region, wherein the
Dual-laser light beam meets predetermined process standard, and when the generation moment of two beam second laser light beams is respectively the first moment and second
It carves, when a length of first duration that the second laser light beam that the first moment generated scans in target area, what the second moment generated
When a length of second duration that second laser light beam scans in target area；It is understood that above-mentioned deformation region be
It is generated in target area.Wherein, deformation region is raised or sunken, and internal stress distribution balance may make in punching profile
Portion's material voluntarily separates.
It originally is in embodiment, second laser light beam can be Gaussian beam, and however, it is not limited to this.Optionally, second swashs
The predetermined process standard of light light beam includes but is not limited to: the wavelength of second laser light beam be 5000nm to 12000nm (wherein,
The wavelength of 10600nm is particularly suitable), power be 10W to 400W, repetition rate be 1HZ to 100kHZ, line width be 0.15mm extremely
2.5mm.For example, the second laser light beam used is wavelength for 10600nm, power 100W for the target base plate of 2mm thickness,
Repetition rate is 15kHZ, and line width is the gauss laser beam of 0.25mm.
Optionally, in the present embodiment, in target area the distance of scanned region distance target area 0.5mm extremely
Between 5mm, second laser light beam is avoided to act on except target area.Second laser light beam carries out 1-N times in target area
Scanning, wherein N is not less than 2.
It, can basis for the position in the laser scanning region of two second laser light beams and scanning times in step 302
Actual conditions determine.For example, for the target base plate of 2mm thickness, it is assumed that punching profile is circle, then swashing in target area is arranged
Optical scanning region is the circular concentric circles, and the small 1mm of the radius ratio of the concentric circles circle, second laser light beam is in the concentric circles
Scanned in regions 500 times, two heat-affected zones for having certain vertical range can be formed in two parts up and down of substrate,
Substrate regions where the heat-affected zone are deformation region.The deformation that the deformation region can be protrusion is also possible to be recessed
Deformation, according to the difference of the material of substrate etc., the Deformation Types of generation are also different.In one example, such as Fig. 7 institute
Show, in the laser scanning region that the two beam second laser light beams projected from lens 113 act on target area, forms the shape of protrusion
Become region 71.In another example, as shown in figure 8, acting on target area from the two beam second laser light beams that lens 113 project
Laser scanning region in, form the deformation region 81 of recess.Either protrusion or be recessed, second laser light beam act on as
In border circular areas in Fig. 9, deformation region will be generated in border circular areas (dash area in Fig. 9 is deformation region).Ginseng
See Figure 10, the darker regions in Figure 10 are the region punching profile and surrounding, in practice, the end of scan of second laser light beam
Afterwards, the darker regions in Figure 10 can be automatically separated from target base plate.
In the present embodiment, the focussing force of first laser light beam and second laser light beam in light concentrating components (lens or galvanometer)
The laser beam for meeting foregoing description can be formed down.
Step 303, after the duration of each second laser light beam scanning, control corresponding laser boring sub-device and stop
Generate second laser light beam.
It is understood that at the beginning of two second laser light beam scannings and the duration of scanning can in the present embodiment
Can be all different, the time that two laser boring sub-devices stop generating second laser light beam may also be different.
Optionally, in all embodiments of the application, it can be set in laser drilling device and filled with two laser boring
The control device for setting connection controls two laser boring sub-devices and realizes above-mentioned steps 301-303.The control device can integrate
It, can also be independently of two laser boring sub-devices into some laser boring sub-device.The present embodiment is not limited in this respect.
In the present embodiment, in the target area that punching profile surrounds, the geomery of second laser light beam scanning, and
The quantity of scanning area and position, it is related with the shape and size of target area.It is understood that target area is smaller, it can
A laser scanning region is only arranged, target area is larger, multiple laser scanning regions can be set, to realize target area
Be automatically separated.
In the present embodiment, the geomery of punching profile can be preset and the corresponding of corresponding laser scanning region is closed
System, in the corresponding relationship, can be set the information such as position, quantity, shape and the size in laser scanning region.
For example, the shape in laser scanning region can be set to circle for circular punching profile, if punching profile
Radius is smaller, and it is the concentric circles for punching profile, the radius of the radius ratio punching profile of concentric circles that laser scanning region, which can be set,
It is smaller can (such as small 1mm), the position in laser scanning region, quantity, shape and size have determined that as a result,；If perforating wheel
Wide radius is larger, can change multiple (such as two) the circular laser scanning regions of setting, the position in laser scanning region and
As long as the setting of size meets, the radius in laser scanning region adds up the radius for being no more than punching profile, and different laser are swept
It retouches and is not overlapped between region.
In another example for the punching profile of rectangle (including square), the shape in laser scanning region be can be set to
Round or rectangular, the present embodiment is still by taking circle as an example, for rectangular punching profile, the quantity in laser scanning region
It is 4, is set in the region at rectangular four angles, the distance in circular laser scanning region to rectangular side is in certain model
In enclosing, such as in 0.5mm-5mm, circular laser scanning region is not overlapped each other.Optionally, in one example, four circles
The laser scanning area size of shape is consistent, and the laser scanning region on diagonal line is about rectangular central symmetry.Second laser
Light beam scans this several laser scanning region, can generate several independent heat affected areas on the material of punching contoured interior
(i.e. above-mentioned deformation region).
Optionally, two laser boring sub-devices for controlling laser drilling device generate second laser light beam respectively, and control
Second laser light beam processed is scanned in the target area that punching profile surrounds, and generating at least one deformation region includes:
The geomery of preset punching profile and the corresponding relationship in laser scanning region are obtained, beating for target base plate is obtained
The geomery of hole profile, the geomery of the punching profile based on corresponding relationship and target base plate, determines target base plate
The information in the laser scanning region in profile is punched, information includes position, quantity, shape and the size in laser scanning region；
According to the information in laser scanning region, the laser scanning region in target area is determined；
Two laser boring sub-devices of control laser drilling device generate second laser light beam respectively, and control second and swash
Light light beam is scanned in laser scanning region, generates at least one deformation region.
Optionally, in the present embodiment, the generation time of two beam second laser light beams is different with scanning duration, then punches profile
The direction to fall off when interior substrate voluntarily separates is different.
In one example, the-the first moment of generation moment of two beam second laser light beams is identical as the second moment, and two beams
Second laser light beam is equal with the second duration in the-the first duration of duration of laser scanning scanned in regions.That is two beam second lasers
Light beam generates and scans the laser scanning region in target area simultaneously, after identical scanning duration, two beam second laser light
Beam can be simultaneously stopped, and after laser beam stops a period of time, the substrate (i.e. clout) punched in profile can be biggish along deformation
Direction falls off.
In one example, the-the first moment of generation moment of two beam second laser light beams is identical as the second moment, two beams
Dual-laser light beam is different in the duration of laser scanning scanned in regions, and it is equal that the first duration is greater than the second duration.That is two beams second
Laser beam generates and scans simultaneously the laser scanning region in target area, but the heating time of the one side in laser scanning region
Longer, the heating time of another side is shorter, and after laser beam stops a period of time, clout is along a heating time longer emaciated face
It falls.
In one example, the-the first moment of generation moment of two beam second laser light beams is different from the second moment, wherein one
Beam second laser light beam first acts on target area, acts on target area after another beam second laser light beam, works as laser
After light beam stops a period of time, clout falling off on single side transparent substrate on one side along rear a branch of light action.Wherein, two beam second
End of scan time of the laser beam in target area can be identical
Optionally, in the present embodiment, second is generated respectively in two laser boring sub-devices of control laser drilling device
Laser beam, and control second laser light beam and be scanned in the target area that punching profile surrounds, generate at least one shape
Before becoming region, further includes:
Predetermined process standard based on second laser light beam, the focusing parameter of two light concentrating components and light concentrating components and mesh
The distance of substrate is marked, predicts whether second laser light beam meets preset requirement in the radius of the irradiation area of target substrate surface；
If meeting, two laser boring sub-devices for continuing to control laser drilling device generate second laser light respectively
Beam, and control second laser light beam and be scanned in the target area that punching profile surrounds, generate at least one deformation region；
If not meeting, two light concentrating components are adjusted at a distance from target base plate, until predicting second laser light beam in mesh
The radius for marking the irradiation area of substrate surface meets preset requirement.
Optionally, in the present embodiment, the irradiation area that second laser light beam irradiates target substrate surface is a circle, and
It is not the insignificant point of a radius, optionally, the radius of irradiation area meets the radius that preset requirement may is that irradiation area
For 0.15mm to 2.5mm.
In the present embodiment, after the stopping of second laser light beam, target base plate can be stood to a period of time at room temperature, such as
One minute is stood, without other ancillary measures, profile is punched and expects voluntarily to separate from target base plate.
A kind of laser boring method is present embodiments provided, a branch of first is generated by one laser boring sub-device of control and swashs
Light light beam, and control punching profile of the first laser light beam in target base plate and target base plate is scanned, make target base plate
The internal orientation damage that special properties are generated along punching profile；And two laser boring sub-devices of control laser drilling device
Second laser light beam is generated respectively, and is controlled second laser light beam and carried out in the target area that the punching profile on substrate surrounds
Scanning, generates at least one deformation region, and the expectation of perforating wheel exterior feature can be made to terminate scanning in two beam second laser light beams
It is voluntarily separated after a period of time, and the scheme of the present embodiment is applicable in because using the material in double excitation heating punching profile
In the wider array of substrate of thickness range, and aperture efficiency is improved relative to conventional ultrafast laser at silk cutting and boring method.
3rd embodiment:
In the present embodiment by taking target base plate is with a thickness of the transparent planar substrate of 2mm as an example, second embodiment is described in detail
In laser boring method, wherein assuming that punching profile be circle.Referring to Figure 11, this method includes the following steps:
Step 1101, on a thickness of 2m transparent planar substrate, controlling a laser boring sub-device with a branch of wavelength is
1030nm, power 25W, the first laser light beam that repetition rate is 35kHZ are scanned along punching profile, make transparent flat base
The inside of plate generates orientation damage along punching contour direction；
Wherein, after step 1101, stop the generation of first laser light beam.
Two step 1102, control laser beams punch sub-device, and two beam powers of generation are 100W, and repetition rate is
15kHZ, laser scanning sector scanning 500 of the Gaussian laser beam (second laser light beam) that line width is 0.25mm in punching profile
It is secondary, generate the independent heat-affected zone that 2 vertical direction deformation distances are about 0.8mm；
Wherein, the shape in laser scanning region is circle, and is concentric circles, the radius in laser scanning region with punching profile
Radius than punching profile is 1mm small.
It is understood that the shape in laser scanning region, size, position and quantity can determines according to actual conditions,
It is not limited to data cited by the present embodiment.
In step 1102, two beam second laser light beams act on punching profile at the time of and duration can be it is identical.
That is two beam second laser light beams act on the material in punching profile simultaneously, and terminate to heat simultaneously.The scanning of second laser light beam
Duration can according to the thickness of substrate determine, can be scanning 500 times needs durations.
After step 1102, it is only necessary to by transparent planar substrate in being stored at room temperature 1 minute or so, punch the material in profile
Material is voluntarily separated with substrate realization.
In the present embodiment, it is less than ± 1 ° by the round profile inner hole inner wall taper that the above method is prepared, edge collapses
While surface roughness Ra is between 30nm-300nm less than 10 μm.
Fourth embodiment:
Referring to Figure 12, the present embodiment proposes a kind of electronic device, comprising:
First control module 1201, it is a branch of for controlling the generation of the laser boring sub-device in the laser drilling device
First laser light beam, and control punching profile of the first laser light beam in target base plate and the target base plate is swept
It retouches, makes to generate orientation damage along the punching profile inside the target base plate；
Second control module 1202, two laser boring sub-devices for controlling the laser drilling device generate respectively
Second laser light beam, and control the second laser light beam and be scanned in the target area that the punching profile surrounds, it produces
At least one raw deformation region, wherein the second laser light beam meets predetermined process standard, and second laser light described in two beams
The generation moment of beam is respectively the first moment and the second moment, and the second laser light beam that first moment generates is in the target
When a length of first duration of scanned in regions, the second laser light beam that second moment generates scan in the target area
When a length of second duration；
Third control module 1203 after duration for scanning in each second laser light beam, controls corresponding laser
Sub-device is punched to stop generating second laser light beam.
Optionally, in the present embodiment, first moment is identical as second moment, and first duration is equal to institute
State the second duration；Alternatively, first moment is identical as second moment, and when first duration is greater than described second
It is long；Alternatively, first moment is different from second moment.
Optionally, the second control module 1202, for obtaining geomery and the laser scanning area of preset punching profile
The corresponding relationship in domain obtains the geomery of the punching profile of the target base plate, is based on the corresponding relationship and the mesh
The geomery for marking the punching profile of substrate, determines the information in the laser scanning region in the punching profile of the target base plate,
The information includes position, quantity, shape and the size in laser scanning region；According to the information in the laser scanning region,
Determine the laser scanning region in the target area；Control two laser boring sub-devices difference of the laser drilling device
Second laser light beam is generated, and controls the second laser light beam and is scanned in the laser scanning region, is generated at least
One deformation region.
Optionally, which further includes detection module, for two laser borings in control laser drilling device
Sub-device generates second laser light beam respectively, and controls second laser light beam and swept in the target area that punching profile surrounds
It retouches, before generating at least one deformation region, the focusing of predetermined process standard, two light concentrating components based on second laser light beam is joined
Several and light concentrating components are at a distance from target base plate, radius of the prediction second laser light beam in the irradiation area of target substrate surface
Whether preset requirement is met；If so, two laser boring sub-devices for continuing to control laser drilling device generate second respectively
Laser beam, and control second laser light beam and be scanned in the target area that punching profile surrounds, generate at least one shape
Become region；Otherwise, two light concentrating components are adjusted at a distance from target base plate, until predicting second laser light beam in target base plate
The radius of the irradiation area on surface meets preset requirement.
Further in the present embodiment, a kind of electronic device is also provided, referring to Figure 13, which includes: storage
Device 1301, processor 1302 and it is stored in the computer program that can be run on the memory 1301 and on the processor,
When processor 1302 executes the computer program, the step in the method as described in second embodiment and 3rd embodiment is realized
Suddenly.Optionally, which can be control device described in above-mentioned second embodiment, for controlling two laser borings
Sub-device.
Further, the embodiment of the present application also provides a kind of computer readable storage medium, the computer-readable storages
Medium can be in the electronic device being set in the various embodiments described above, which can be earlier figures 13
Memory in illustrated embodiment.It is stored with computer program on the computer readable storage medium, which is held by processor
Method in the method as described in second embodiment and 3rd embodiment is realized when row.Further, which can storage medium
It can also be that USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), RAM, magnetic or disk etc. are various
It can store the medium of program code.
In several embodiments provided herein, it should be understood that disclosed device and method can pass through it
Its mode is realized.For example, the apparatus embodiments described above are merely exemplary, for example, the division of the module, only
Only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple module or components can be tied
Another system is closed or is desirably integrated into, or some features can be ignored or not executed.Another point, it is shown or discussed
Mutual coupling, direct-coupling or communication connection can be through some interfaces, the INDIRECT COUPLING or logical of device or module
Letter connection can be electrical property, mechanical or other forms.
The module as illustrated by the separation member may or may not be physically separated, aobvious as module
The component shown may or may not be physical module, it can and it is in one place, or may be distributed over multiple
On network module.Some or all of the modules therein can be selected to realize the mesh of this embodiment scheme according to the actual needs
's.
It, can also be in addition, can integrate in a processing module in each functional module in each embodiment of the application
It is that modules physically exist alone, can also be integrated in two or more modules in a module.Above-mentioned integrated mould
Block both can take the form of hardware realization, can also be realized in the form of software function module.
If the integrated module is realized in the form of software function module and sells or use as independent product
When, it can store in a computer readable storage medium.Based on this understanding, the technical solution of the application is substantially
The all or part of the part that contributes to existing technology or the technical solution can be in the form of software products in other words
It embodies, which is stored in a readable storage medium storing program for executing, including some instructions are used so that a meter
It calculates machine equipment (can be personal computer, server or the network equipment etc.) and executes each embodiment the method for the application
All or part of the steps.And readable storage medium storing program for executing above-mentioned includes: USB flash disk, mobile hard disk, ROM, RAM, magnetic or disk etc.
The various media that can store program code.
It should be noted that for the various method embodiments described above, describing for simplicity, therefore, it is stated as a series of
Combination of actions, but those skilled in the art should understand that, the application is not limited by the described action sequence because
According to the application, certain steps can use other sequences or carry out simultaneously.Secondly, those skilled in the art should also know
It knows, the embodiments described in the specification are all preferred embodiments, and related actions and modules might not all be this Shen
It please be necessary.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, there is no the portion being described in detail in some embodiment
Point, it may refer to the associated description of other embodiments.
The above are to laser boring method provided herein, device, electronic device and computer readable storage medium
Description, for those skilled in the art, according to the embodiment of the present application thought, in specific embodiments and applications
There will be changes, and to sum up, the contents of this specification should not be construed as limiting the present application.
Claims (10)
1. a kind of laser drilling device, which is characterized in that including the identical laser boring sub-device of two structure compositions, institute
Stating laser boring sub-device includes laser, beam expanding lens and the light concentrating components with laser focussing force, and the laser issues
Laser pass sequentially through the beam expanding lens and light concentrating components, from the light-emitting surface of the light concentrating components project；Wherein, from described in two
The laser face being pierced by the light concentrating components of laser boring sub-device, and be located in a straight line, and pass along the vertical direction
It broadcasts.
2. laser drilling device according to claim 1, which is characterized in that the laser boring sub-device further includes reflection
Mirror, the reflecting mirror are set between the beam expanding lens and the light concentrating components, and the laser that the laser issues is along level side
To optical path pass through the beam expanding lens and reach the reflecting mirror, the optic path under the reflection of the reflecting mirror along the vertical direction
To the light concentrating components, projected from the light-emitting surface of the light concentrating components.
3. laser drilling device according to claim 1 or 2, which is characterized in that two laser boring sub-devices
Structure, the midpoint about two light concentrating components constitute origin symmetry arrangement or about the midpoints of two light concentrating components
The horizontal plane at place constitutes mirror symmetry arrangement.
4. a kind of laser boring method, which is characterized in that be applied to laser boring as described in any one of claims 1-3 and fill
It sets, which includes:
It controls a laser boring sub-device in the laser drilling device and generates a branch of first laser light beam, and control described the
Punching profile of one laser beam in target base plate is scanned the target base plate, makes inside the target base plate along institute
It states punching profile and generates orientation damage；
Two laser boring sub-devices for controlling the laser drilling device generate second laser light beam respectively, and control described
Dual-laser light beam is scanned in the target area that the punching profile surrounds, and generates at least one deformation region, wherein institute
It states second laser light beam and meets predetermined process standard, and the generation moment of second laser light beam described in two beams was respectively the first moment
With the second moment, the second laser light beam that first moment generates scanned in the target area when a length of first when
When a length of second duration long, that the second laser light beam that second moment generates scans in the target area；
After the duration of each second laser light beam scanning, controls corresponding laser boring sub-device and stop generating second laser
Light beam.
5. laser boring method according to claim 4, which is characterized in that first moment and the second moment phase
Together, and first duration is equal to second duration；Alternatively, first moment and second moment are identical and described
First duration is greater than second duration；Alternatively, first moment is different from second moment.
6. laser boring method according to claim 4, which is characterized in that the two of the control laser drilling device
A laser boring sub-device generates second laser light beam respectively, and controls the second laser light beam and surround in the punching profile
Target area in be scanned, generating at least one deformation region includes:
The geomery of preset punching profile and the corresponding relationship in laser scanning region are obtained, beating for the target base plate is obtained
The geomery of hole profile, the geomery of the punching profile based on the corresponding relationship and the target base plate, determines institute
The information in the laser scanning region in the punching profile of target base plate is stated, the information includes the position in laser scanning region, number
Amount, shape and size；
According to the information in the laser scanning region, the laser scanning region in the target area is determined；
Two laser boring sub-devices for controlling the laser drilling device generate second laser light beam respectively, and control described
Dual-laser light beam is scanned in the laser scanning region, generates at least one deformation region.
7. according to the described in any item laser boring methods of claim 4-6, which is characterized in that the control laser boring
Two laser boring sub-devices of device generate second laser light beam respectively, and control the second laser light beam in the punching
It is scanned in the target area that profile surrounds, before generating at least one deformation region, further includes:
The focusing parameter and the light concentrating components of predetermined process standard based on second laser light beam, two light concentrating components
At a distance from the target base plate, predict that the radius of irradiation area of the second laser light beam in the target substrate surface is
It is no to meet preset requirement；
If so, two laser boring sub-devices for continuing to control the laser drilling device generate second laser light beam respectively,
And control the second laser light beam and be scanned in the target area that the punching profile surrounds, generate at least one deformation
Region；
If it is not, two light concentrating components are then adjusted at a distance from the target base plate, until predicting the second laser light
Beam meets preset requirement in the radius of the irradiation area of the target substrate surface.
8. a kind of electronic device characterized by comprising
First control module generates a branch of first laser for controlling the laser boring sub-device in the laser drilling device
Light beam, and control punching profile of the first laser light beam in target base plate and the target base plate is scanned, make institute
It states and generates orientation damage along the punching profile inside target base plate；
Second control module, two laser boring sub-devices for controlling the laser drilling device generate second laser respectively
Light beam, and control the second laser light beam and be scanned in the target area that the punching profile surrounds, generate at least one
A deformation region, wherein the second laser light beam meets predetermined process standard, and the generation of second laser light beam described in two beams
Moment is respectively the first moment and the second moment, and the second laser light beam that first moment generates is swept in the target area
When a length of first duration retouched, the second laser light beam that second moment generates scanned in the target area when it is a length of
Second duration；
Third control module after duration for scanning in each second laser light beam, controls corresponding laser boring dress
It sets stopping and generates second laser light beam.
9. a kind of electronic device, comprising: memory, processor and be stored on the memory and can transport on the processor
Capable computer program, which is characterized in that when the processor executes the computer program, realize in claim 4 to 7 and appoint
Step in the method for anticipating.
10. a kind of computer readable storage medium, is stored thereon with computer program, which is characterized in that the computer program
When being executed by processor, the step in any one the method in claim 4 to 7 is realized.
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