CN110010665A - OLED display panel - Google Patents
OLED display panel Download PDFInfo
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- CN110010665A CN110010665A CN201910237985.2A CN201910237985A CN110010665A CN 110010665 A CN110010665 A CN 110010665A CN 201910237985 A CN201910237985 A CN 201910237985A CN 110010665 A CN110010665 A CN 110010665A
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- 229920000620 organic polymer Polymers 0.000 claims description 39
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of OLED display panel, and OLED display panel includes the electronic component setting area of corresponding electronic component setting position, and it includes transparent area and buffer area that area, which is arranged, in electronic component, and micro-nano structure is formed in buffer area；Micro-nano structure is arranged in the buffer area between transparent area and viewing area in the present invention, when being cut by laser or other techniques carry out borehole, the crackle that micro-nano structure can prevent the common electrode layers such as cathode from generating is extended to viewing area, the technical issues of alleviating cathode existing for existing comprehensive screen technology generated crackle extended into viewing area in borehole, and micro-nano structure can delay the water oxygen of borehole area side to invade during borehole again, final to promote device lifetime.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of OLED display panels.
Background technique
With the development of comprehensive screen technology, shielding the technology that the electronic components such as lower camera are placed under display screen is that development becomes
Gesture.The cathode tiling of existing OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) display panel is aobvious
Show panel, material is magnesium silver alloy or magnesium silver laminated construction, since silver has biggish reflectivity, ambient light to light
When line passes through cathode, it is lost more.
Therefore, as shown in Figure 1, the prior art is in order to guarantee to shield lower electronic component, such as the daylighting effect of camera, need by
Light emitting functional layer (including anode M1, luminescent layer and cathode M2 etc.) above camera is gone divided by formation transparent area (i.e. in Fig. 1
The region OP), i.e. borehole technology.
But due to cathode tiling display panel, during borehole, crackle caused by cathode expands into viewing area
Exhibition.
So there are the cathode technologies that generated crackle is extended into viewing area in borehole to ask for existing comprehensive screen technology
Topic, needs to improve.
Summary of the invention
The present invention provides a kind of OLED display panel, is produced with alleviating cathode existing for existing comprehensive screen technology in borehole
The technical issues of raw crackle is extended into viewing area.
To solve the above problems, technical solution provided by the invention is as follows:
The embodiment of the present invention provides a kind of OLED display panel, and the OLED display panel includes viewing area and corresponding electricity
Area is arranged in the electronic component that position is arranged in subcomponent, in which:
Electronic component setting area includes transparent area and buffer area, the buffer area around the transparent area and with
The viewing area contact；
The OLED display panel is formed with micro-nano structure in the buffer area；
The OLED display panel includes light emitting functional layer and encapsulated layer；The light emitting functional layer corresponds to the transparent area
Position offer light transmission through-hole, the encapsulated layer encapsulates the light transmission through-hole.
In OLED display panel provided in an embodiment of the present invention, the OLED display panel includes pixel defining layer, institute
Stating micro-nano structure includes the micro-nano groove being formed in the pixel defining layer.
In OLED display panel provided in an embodiment of the present invention, the micro-nano groove is the closing around the transparent area
Annular.
In OLED display panel provided in an embodiment of the present invention, the shape of the closed ring includes round or polygon
At least one of shape.
In OLED display panel provided in an embodiment of the present invention, the micro-nano structure includes that at least two micro-nanos are recessed
Slot.
In OLED display panel provided in an embodiment of the present invention, the cross sectional shape of the micro-nano groove include it is semicircle,
At least one of half elliptic, water-drop-shaped, rectangle, triangle.
In OLED display panel provided in an embodiment of the present invention, the encapsulated layer includes the first inorganic resistance being stacked
Interlayer, organic polymer layers and the second inorganic barrier layer；The light transmission through-hole is through first inorganic barrier layer and organic
Polymeric layer.
In OLED display panel provided in an embodiment of the present invention, the organic polymer layers are stopped by micro-nano structure, shape
In viewing area described in Cheng Yu.
In OLED display panel provided in an embodiment of the present invention, the transparent area is provided with filled layer, the filled layer
It is set in the light transmission through-hole, the encapsulated layer is formed on the filled layer.
In OLED display panel provided in an embodiment of the present invention, the material of the filled layer and the material of organic polymer layers
Expect identical.
The invention has the benefit that the present invention provides a kind of OLED display panel, the OLED display panel includes aobvious
Show that electronic component setting area of the area with corresponding electronic component setting position, electronic component setting area include transparent area and delay
Area is rushed, the buffer area is contacted around the transparent area and with the viewing area；The OLED display panel is in the buffer area
Inside it is formed with micro-nano structure；The OLED display panel includes light emitting functional layer and encapsulated layer；The light emitting functional layer is corresponding
The position of the transparent area offers light transmission through-hole, and the encapsulated layer encapsulates the light transmission through-hole；The present invention is by light emitting functional layer
Light transmission through-hole is opened up in the position of transparent area, eliminates and biggish light emitting functional layer is obstructed to light, improve light penetration,
Micro-nano structure is set in buffer area between transparent area and viewing area simultaneously, is being cut by laser or other techniques carry out
When borehole, the crackle that micro-nano structure can prevent the common electrode layers such as cathode from generating is extended to viewing area, is alleviated existing comprehensive
Cathode existing for screen technology the technical issues of generated crackle is extended into viewing area in borehole, and micro-nano structure may be used
It is final to promote device lifetime to delay the water oxygen of borehole area side to invade during borehole.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
The schematic diagram of OLED display panel in the existing comprehensive screen technology of Fig. 1.
Fig. 2 is the top view of OLED display panel provided in an embodiment of the present invention.
Fig. 3 is the first diagrammatic cross-section of OLED display panel A-A ' provided in an embodiment of the present invention.
Fig. 4 is second of diagrammatic cross-section of OLED display panel A-A ' provided in an embodiment of the present invention.
Fig. 5 is the third diagrammatic cross-section of OLED display panel A-A ' provided in an embodiment of the present invention.
Fig. 6 is the 4th kind of diagrammatic cross-section of OLED display panel A-A ' provided in an embodiment of the present invention.
Fig. 7 to Figure 15 is the processing procedure schematic diagram of OLED display panel provided in an embodiment of the present invention.
Specific embodiment
The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the present invention
Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is with being given the same reference numerals in the figure.
For the cathode technology that generated crackle is extended into viewing area in borehole existing for existing comprehensive screen technology
Problem, the embodiment of the present invention can be alleviated.
In one embodiment, as shown in Figures 2 to 6, OLED display panel provided in an embodiment of the present invention includes display
Area A2 is arranged in the electronic component that position is arranged in area A1 and corresponding electronic component 3, in which:
The electronic component setting area A2 includes transparent area A21 and buffer area A22, and the buffer area A22 is around described
It transparent area A21 and is contacted with the viewing area A1；
The OLED display panel is formed with micro-nano structure 4 in the buffer area；
The OLED display panel include light emitting functional layer (including first electrode M1 shown in Fig. 3, luminescent layer and second electricity
Pole M2) and encapsulated layer (including the first inorganic barrier layer M3, organic polymer layers M4 and the second inorganic barrier layer shown in Fig. 3
M5)；The position that the light emitting functional layer corresponds to the transparent area A21 offers light transmission through-hole, and the encapsulated layer encapsulation is described
Light through-hole.
Electronic component 3 can be a kind of electronic component, be also possible to the aggregate of a variety of electronic components, such as camera, light
Line sensor, fingerprint identification device based on infrared ray etc..
The present embodiment provides a kind of OLED display panels comprising the electronics of viewing area and corresponding electronic component setting position
Element is arranged area, and electronic component setting area includes transparent area and buffer area, the buffer area around the transparent area and
It is contacted with the viewing area；The OLED display panel is formed with micro-nano structure in the buffer area；The OLED display surface
Plate includes light emitting functional layer and encapsulated layer；The position that the light emitting functional layer corresponds to the transparent area offers light transmission through-hole,
The encapsulated layer encapsulates the light transmission through-hole；Light emitting functional layer is opened up light transmission through-hole in the position of transparent area by the present invention, removal
Biggish light emitting functional layer is obstructed to light, improves light penetration, while the buffering between transparent area and viewing area
Micro-nano structure is set in area, and when being cut by laser or other techniques carry out borehole, micro-nano structure can prevent cathode etc.
The crackle that public electrode generates is extended to viewing area, and it is generated in borehole to alleviate cathode existing for existing comprehensive screen technology
The technical issues of crackle is extended into viewing area, and micro-nano structure can delay the water of borehole area side during borehole
Oxygen invasion, it is final to promote device lifetime.
In one embodiment, as shown in figure 3, the OLED display panel includes the substrate functional layer M6 being stacked,
The drive circuit functionality layer M7 being formed in the substrate functional layer, the flatness layer being formed on the drive circuit functionality layer M7
M8；The pixel defining layer M9 being formed on the flatness layer M8, the light emitting functional layer being formed on the pixel defining layer M9, shape
Encapsulated layer in light emitting functional layer described in Cheng Yu.
Substrate functional layer M6 includes flexible substrate, buffering barrier layer and inorganic buffer layer etc..Drive circuit functionality layer includes
Low-temperature polycrystalline silicon layer, first grid insulating layer, first grid, second grid insulating layer, second grid, insulating layer, source-drain electrode layer
Deng.Pixel defining layer M7 is for defining light emitting region, and pixel defining layer M7 forms groove in light emitting region, in non-luminous region
Interior formation protrusion.Light emitting functional layer includes first electrode M1 (in the groove of pixel defining layer M7), luminescent layer and the second electricity
Pole M2 tiles on a display panel.
In one embodiment, as shown in figure 3, the micro-nano structure 4 is micro- in the pixel defining layer including being formed in
Receive groove C.
In one embodiment, micro-nano groove C is formed in the protrusion of the pixel defining layer.
In one embodiment, the micro-nano groove C is the closed ring around the transparent area.
In one embodiment, the shape of the closed ring includes at least one of round or polygon.
In one embodiment, as shown in Figures 3 to 6, the micro-nano structure 4 includes at least two micro-nano groove C.
In one embodiment, as shown in Figures 3 to 6, the cross sectional shape of the micro-nano groove C includes semicircle, half ellipse
At least one of circle, water-drop-shaped, rectangle, triangle.
In one embodiment, as shown in figure 3, the encapsulated layer includes the first inorganic barrier layer M3 being stacked, has
Machine polymeric layer M4 and the second inorganic barrier layer M5；The light transmission through-hole is through the first inorganic barrier layer M3 and organic poly-
Close nitride layer M4.
In one embodiment, as shown in figure 4, on the basis of embodiment shown in Fig. 3, the transparent area A21 is provided with
Filled layer M10, the filled layer M10 are set in the light transmission through-hole, and the encapsulated layer is formed on the filled layer M10.
In one embodiment, as shown in figure 4, the transparent area is provided with filled layer M10, the filled layer M10 setting
In in the light transmission through-hole, the second inorganic barrier layer M5 is formed on the filled layer M10.
In one embodiment, it as shown in figure 5, the organic polymer layers M4 is stopped by micro-nano structure 4, is formed in described
In viewing area and buffer area.
In one embodiment, as shown in fig. 6, on the basis of embodiment shown in Fig. 5, the transparent area A21 is provided with
Filled layer M10, the filled layer M10 are set in the light transmission through-hole, and the encapsulated layer is formed on the filled layer M10.
In one embodiment, as shown in fig. 6, the transparent area is provided with filled layer M10, the filled layer M10 setting
In in the light transmission through-hole, the second inorganic barrier layer M5 is formed on the filled layer M10.
In one embodiment, the material of the filled layer M10 is identical as the material of organic polymer layers, has good
Light penetration.
In one embodiment, the embodiment of the invention also provides a kind of display devices, provided in an embodiment of the present invention aobvious
Showing device includes OLED display panel and electronic component 3, and OLED display panel includes that viewing area A1 and corresponding electronic component 3 are set
Area A2 is arranged in the electronic component of seated position, in which:
The electronic component setting area A2 includes transparent area A21 and buffer area A22, and the buffer area A22 is around described
It transparent area A21 and is contacted with the viewing area A1；
The OLED display panel is formed with micro-nano structure 4 in the buffer area；
The OLED display panel include light emitting functional layer (including first electrode M1 shown in Fig. 3, luminescent layer and second electricity
Pole M2) and encapsulated layer (including the first inorganic barrier layer M3, organic polymer layers M4 and the second inorganic barrier layer shown in Fig. 3
M5)；The position that the light emitting functional layer corresponds to the transparent area A21 offers light transmission through-hole, and the encapsulated layer encapsulation is described
Light through-hole.
The present embodiment provides a kind of display device, OLED display panel includes that position is arranged in viewing area and corresponding electronic component
The electronic component setting area set, electronic component setting area includes transparent area and buffer area, and the buffer area is around described
It transparent area and is contacted with the viewing area；The OLED display panel is formed with micro-nano structure in the buffer area；It is described
OLED display panel includes light emitting functional layer and encapsulated layer；The position that the light emitting functional layer corresponds to the transparent area offers
Light transmission through-hole, the encapsulated layer encapsulate the light transmission through-hole；Light emitting functional layer is opened up light transmission in the position of transparent area by the present invention
Through-hole eliminates and obstructs biggish light emitting functional layer to light, improves light penetration, at the same transparent area and viewing area it
Between buffer area in micro-nano structure is set, when being cut by laser or other techniques carry out borehole, micro-nano structure can be to prevent
The crackle that only common electrode layers such as cathode generate is extended to viewing area, alleviates cathode existing for existing comprehensive screen technology in borehole
When generated crackle the technical issues of being extended into viewing area, and micro-nano structure can delay borehole during borehole again
The water oxygen of area side is invaded, final to promote device lifetime.
In one embodiment, as shown in figure 3, the micro-nano structure 4 is micro- in the pixel defining layer including being formed in
Receive groove C.
In one embodiment, micro-nano groove C is formed in the protrusion of the pixel defining layer.
In one embodiment, the micro-nano groove C is the closed ring around the transparent area.
In one embodiment, the shape of the closed ring includes at least one of round or polygon.
In one embodiment, as shown in Figures 3 to 6, the micro-nano structure 4 includes at least two micro-nano groove C.
In one embodiment, as shown in Figures 3 to 6, the cross sectional shape of the micro-nano groove C includes semicircle, half ellipse
At least one of circle, water-drop-shaped, rectangle, triangle.
In one embodiment, as shown in figure 3, the encapsulated layer includes the first inorganic barrier layer M3 being stacked, has
Machine polymeric layer M4 and the second inorganic barrier layer M5；The light transmission through-hole is through the first inorganic barrier layer M3 and organic poly-
Close nitride layer M4.
In one embodiment, as shown in figure 4, on the basis of embodiment shown in Fig. 3, the transparent area A21 is provided with
Filled layer M10, the filled layer M10 are set in the light transmission through-hole, and the encapsulated layer is formed on the filled layer M10.
In one embodiment, as shown in figure 4, the transparent area is provided with filled layer M10, the filled layer M10 setting
In in the light transmission through-hole, the second inorganic barrier layer M5 is formed on the filled layer M10.
In one embodiment, it as shown in figure 5, the organic polymer layers M4 is stopped by micro-nano structure 4, is formed in described
In viewing area and buffer area.
In one embodiment, as shown in fig. 6, on the basis of embodiment shown in Fig. 5, the transparent area A21 is provided with
Filled layer M10, the filled layer M10 are set in the light transmission through-hole, and the encapsulated layer is formed on the filled layer M10.
In one embodiment, as shown in fig. 6, the transparent area is provided with filled layer M10, the filled layer M10 setting
In in the light transmission through-hole, the second inorganic barrier layer M5 is formed on the filled layer M10.
In one embodiment, the material of the filled layer M10 is identical as the material of organic polymer layers, has good
Light penetration.
Meanwhile in one embodiment, the embodiment of the invention also provides a kind of OLED display panel preparation method, this hairs
OLED display panel preparation method that bright embodiment provides the following steps are included:
Step 31: preparing substrate functional layer M6, drive circuit functionality layer M7, flatness layer M8 and pixel defining layer M9.
As shown in fig. 7, forming substrate functional layer M6, drive circuit functionality layer M7, flatness layer M8 and pixel defining layer M9；This
When, OLED display panel includes substrate functional layer M6, the drive circuit functionality layer M7 being formed in the substrate functional layer, is formed
Flatness layer M8 on the drive circuit functionality layer M7；The pixel defining layer M9 being formed on the flatness layer M8.
Step 32: forming micro-nano groove C in the predeterminated position of pixel defining layer M9.
As shown in figure 8, passing through one of the techniques such as nano impression, photoetching far from substrate functional layer M6 on pixel defining layer M9
Multiple annular micro-nano groove C of side surface manufacturing cycle setting, the position of the micro-nano groove is preferably around transparent area A21
Cut edge, period >=2；The compound buffer area A22 constituted around transparent area A21 of the multiple micro-nano chase unit.
Step 33: preparation light emitting functional layer, the first inorganic barrier layer M3 and organic polymer layers M4.
As shown in figure 9, be sequentially prepared on the pixel defining layer M9 for being provided with buffer area first electrode M1, luminescent layer and
Then second electrode M2 forms the first inorganic barrier layer M3 and organic polymer layers M4.Wherein, pass through the techniques systems such as inkjet printing
Standby organic polymer layers M4 is whole face printing, i.e., covers viewing area A1 and electronic component setting area A2 simultaneously.First nothing
The constituent material of machine barrier layer M3 includes but is not limited to aluminium oxide, titanium oxide, silicon nitride, carbonitride of silicium, silicon oxynitride, silica
Deng.The constituent material of the organic polymer layers M4 includes but is not limited to acrylic acid, epoxy resin, organic siliconresin, polypropylene
Esters of gallic acid, polycarbonate etc..
Step 34: light transmission through-hole is formed in transparent area A21.
As shown in Figure 10, it under the non-vacuum environment full of nitrogen, will be wrapped in transparent area A21 by technologies such as laser-induced thermal etchings
Include the part film layer removal including light emitting functional layer, the first inorganic barrier layer M3 and organic polymer layers M4.According to what is shielded comprehensively
Design is different, and the depth of borehole, position and shape are also different.
Step 35: the second inorganic barrier layer M5 of preparation.
The second inorganic barrier layer M5 is prepared in OLED display panel after borehole.First inorganic barrier layer M3, You Jiju
Close nitride layer M4 and the compound composition encapsulated layer of the second inorganic barrier layer M5.Pass through ALD (Atomic Layer Deposition atom
Layer deposition), PLD (Pulsed Laser Deposition, pulse laser deposition), CVD (Chemical Vapor
Deposition, chemical vapor deposition) etc. techniques preparation the second inorganic barrier layer M5, covering OLED display panel it is all
Area A2 is arranged in region, including viewing area A1 and electronic component.
So far, OLED display panel shown in Fig. 3 is obtained.
Meanwhile in one embodiment, the embodiment of the invention also provides a kind of OLED display panel preparation method, this hairs
OLED display panel preparation method that bright embodiment provides the following steps are included:
Step 41: preparing substrate functional layer M6, drive circuit functionality layer M7, flatness layer M8 and pixel defining layer M9.
As shown in fig. 7, forming substrate functional layer M6, drive circuit functionality layer M7, flatness layer M8 and pixel defining layer M9；This
When, OLED display panel includes substrate functional layer M6, the drive circuit functionality layer M7 being formed in the substrate functional layer, is formed
Flatness layer M8 on the drive circuit functionality layer M7；The pixel defining layer M9 being formed on the flatness layer M8.
Step 42: forming micro-nano groove C in the predeterminated position of pixel defining layer M9.
As shown in figure 8, passing through one of the techniques such as nano impression, photoetching far from substrate functional layer M6 on pixel defining layer M9
Multiple annular micro-nano groove C of side surface manufacturing cycle setting, the position of the micro-nano groove is preferably around transparent area A21
Cut edge, period >=2；The compound buffer area A22 constituted around transparent area A21 of the multiple micro-nano chase unit.
Step 43: preparation light emitting functional layer, the first inorganic barrier layer M3 and organic polymer layers M4.
As shown in figure 9, be sequentially prepared on the pixel defining layer M9 for being provided with buffer area first electrode M1, luminescent layer and
Then second electrode M2 forms the first inorganic barrier layer M3 and organic polymer layers M4.Wherein, pass through the techniques systems such as inkjet printing
Standby organic polymer layers M4 is whole face printing, i.e., covers viewing area A1 and electronic component setting area A2 simultaneously.First nothing
The constituent material of machine barrier layer M3 includes but is not limited to aluminium oxide, titanium oxide, silicon nitride, carbonitride of silicium, silicon oxynitride, silica
Deng.The constituent material of the organic polymer layers M4 includes but is not limited to acrylic acid, epoxy resin, organic siliconresin, polypropylene
Esters of gallic acid, polycarbonate etc..
Step 44: light transmission through-hole is formed in transparent area A21.
As shown in Figure 10, it under the non-vacuum environment full of nitrogen, will be wrapped in transparent area A21 by technologies such as laser-induced thermal etchings
Include the part film layer removal including light emitting functional layer, the first inorganic barrier layer M3 and organic polymer layers M4.According to what is shielded comprehensively
Design is different, and the depth of borehole, position and shape are also different.
Step 45: filled layer M10 is set in light transmission through-hole.
As shown in figure 11, under the non-vacuum environment full of nitrogen, filled layer M10, filled layer are set in light transmission through-hole
The constituent material of M10 can be identical as the constituent material of organic polymer layers M4, can also be different.
Step 46: the second inorganic barrier layer M5 of preparation.
The second inorganic barrier layer M5 is prepared in OLED display panel after borehole.First inorganic barrier layer M3, You Jiju
Close nitride layer M4 and the compound composition encapsulated layer of the second inorganic barrier layer M5.It is inorganic by the second of the preparation of the techniques such as ALD, PLD, CVD
Barrier layer M5 covers all areas of OLED display panel, including area A2 is arranged in viewing area A1 and electronic component.
So far, OLED display panel shown in Fig. 4 is obtained.
Meanwhile in one embodiment, the embodiment of the invention also provides a kind of OLED display panel preparation method, this hairs
OLED display panel preparation method that bright embodiment provides the following steps are included:
Step 51: preparing substrate functional layer M6, drive circuit functionality layer M7, flatness layer M8 and pixel defining layer M9.
As shown in fig. 7, forming substrate functional layer M6, drive circuit functionality layer M7, flatness layer M8 and pixel defining layer M9；This
When, OLED display panel includes substrate functional layer M6, the drive circuit functionality layer M7 being formed in the substrate functional layer, is formed
Flatness layer M8 on the drive circuit functionality layer M7；The pixel defining layer M9 being formed on the flatness layer M8.
Step 52: forming micro-nano groove C in the predeterminated position of pixel defining layer M9.
As shown in figure 8, passing through one of the techniques such as nano impression, photoetching far from substrate functional layer M6 on pixel defining layer M9
Multiple annular micro-nano groove C of side surface manufacturing cycle setting, the position of the micro-nano groove is preferably around transparent area A21
Cut edge, period >=2；The compound buffer area A22 constituted around transparent area A21 of the multiple micro-nano chase unit.
Step 53: preparation light emitting functional layer, the first inorganic barrier layer M3.
As shown in figure 12, first electrode M1, luminescent layer are sequentially prepared on the pixel defining layer M9 for being provided with buffer area
And second electrode M2, then form the first inorganic barrier layer M3.Wherein, the organic polymer prepared by techniques such as inkjet printings
Layer M4 is whole face printing, i.e., covers viewing area A1 and electronic component setting area A2 simultaneously.The structure of the first inorganic barrier layer M3
It include but is not limited to aluminium oxide, titanium oxide, silicon nitride, carbonitride of silicium, silicon oxynitride, silica etc. at material.
Step 54: light transmission through-hole is formed in transparent area A21.
It as shown in figure 13, under vacuum conditions, will include light-emitting function in transparent area A21 by technologies such as laser-induced thermal etchings
Part film layer removal including layer, the first inorganic barrier layer M3.
Step 55: preparation organic polymer layers M4.
As shown in figure 14, organic polymer layers M4, borehole in the present embodiment are prepared in the OLED display panel after borehole
Technique can carry out after the first inorganic barrier layer M3 preparation and before organic polymer layers M4 preparation, therefore without going when borehole
Except organic polymer layers M4.Meanwhile the overlay area of organic polymer layers M4 is only viewing area and buffer area in the present embodiment,
Buffer area can play the role of confinement to organic polymer layers M4 before curing.
Step 56: the second inorganic barrier layer M5 of preparation.
The second inorganic barrier layer M5 is prepared in OLED display panel after borehole.First inorganic barrier layer M3, You Jiju
Close nitride layer M4 and the compound composition encapsulated layer of the second inorganic barrier layer M5.It is inorganic by the second of the preparation of the techniques such as ALD, PLD, CVD
Barrier layer M5 covers all areas of OLED display panel, including area A2 is arranged in viewing area A1 and electronic component.
So far, OLED display panel shown in fig. 5 is obtained.
Meanwhile in one embodiment, the embodiment of the invention also provides a kind of OLED display panel preparation method, this hairs
OLED display panel preparation method that bright embodiment provides the following steps are included:
Step 61: preparing substrate functional layer M6, drive circuit functionality layer M7, flatness layer M8 and pixel defining layer M9.
As shown in fig. 7, forming substrate functional layer M6, drive circuit functionality layer M7, flatness layer M8 and pixel defining layer M9；This
When, OLED display panel includes substrate functional layer M6, the drive circuit functionality layer M7 being formed in the substrate functional layer, is formed
Flatness layer M8 on the drive circuit functionality layer M7；The pixel defining layer M9 being formed on the flatness layer M8.
Step 62: forming micro-nano groove C in the predeterminated position of pixel defining layer M9.
As shown in figure 8, passing through one of the techniques such as nano impression, photoetching far from substrate functional layer M6 on pixel defining layer M9
Multiple annular micro-nano groove C of side surface manufacturing cycle setting, the position of the micro-nano groove is preferably around transparent area A21
Cut edge, period >=2；The compound buffer area A22 constituted around transparent area A21 of the multiple micro-nano chase unit.
Step 63: preparation light emitting functional layer, the first inorganic barrier layer M3.
As shown in figure 12, first electrode M1, luminescent layer are sequentially prepared on the pixel defining layer M9 for being provided with buffer area
And second electrode M2, then form the first inorganic barrier layer M3.Wherein, the organic polymer prepared by techniques such as inkjet printings
Layer M4 is whole face printing, i.e., covers viewing area A1 and electronic component setting area A2 simultaneously.The structure of the first inorganic barrier layer M3
It include but is not limited to aluminium oxide, titanium oxide, silicon nitride, carbonitride of silicium, silicon oxynitride, silica etc. at material.
Step 64: light transmission through-hole is formed in transparent area A21.
It as shown in figure 13, under vacuum conditions, will include light-emitting function in transparent area A21 by technologies such as laser-induced thermal etchings
Part film layer removal including layer, the first inorganic barrier layer M3.
Step 65: preparation organic polymer layers M4.
As shown in figure 14, organic polymer layers M4, borehole in the present embodiment are prepared in the OLED display panel after borehole
Technique can carry out after the first inorganic barrier layer M3 preparation and before organic polymer layers M4 preparation, therefore without going when borehole
Except organic polymer layers M4.Meanwhile the overlay area of organic polymer layers M4 is only viewing area and buffer area in the present embodiment,
Buffer area can play the role of confinement to organic polymer layers M4 before curing.
Step 66: filled layer M10 is set in light transmission through-hole.
As shown in figure 15, under vacuum conditions, filled layer M10, the constituent material of filled layer M10 are set in light transmission through-hole
Can be identical as the constituent material of organic polymer layers M4, it can also be different.
Step 67: the second inorganic barrier layer M5 of preparation.
The second inorganic barrier layer M5 is prepared in OLED display panel after borehole.First inorganic barrier layer M3, You Jiju
Close nitride layer M4 and the compound composition encapsulated layer of the second inorganic barrier layer M5.It is inorganic by the second of the preparation of the techniques such as ALD, PLD, CVD
Barrier layer M5 covers all areas of OLED display panel, including area A2 is arranged in viewing area A1 and electronic component.
So far, OLED display panel shown in fig. 6 is obtained.
According to above-described embodiment:
The embodiment of the present invention provides a kind of OLED display panel comprising position is arranged in viewing area and corresponding electronic component
Area is arranged in electronic component, and electronic component setting area includes transparent area and buffer area, and the buffer area surrounds the light transmission
It area and is contacted with the viewing area；The OLED display panel is formed with micro-nano structure in the buffer area；The OLED is aobvious
Show that panel includes light emitting functional layer and encapsulated layer；It is logical that the position that the light emitting functional layer corresponds to the transparent area offers light transmission
Hole, the encapsulated layer encapsulate the light transmission through-hole；Light emitting functional layer is opened up light transmission through-hole in the position of transparent area by the present invention, is gone
In addition to obstructing biggish light emitting functional layer to light, light penetration is improved, while slow between transparent area and viewing area
Setting micro-nano structure in area is rushed, when being cut by laser or other techniques carry out borehole, micro-nano structure can prevent cathode
Etc. common electrode layers generate crackle to viewing area extend, alleviate cathode existing for existing comprehensive screen technology and produced in borehole
The technical issues of raw crackle is extended into viewing area, and micro-nano structure can delay borehole area side during borehole
Water oxygen invasion, it is final to promote device lifetime.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of OLED display panel, which is characterized in that the OLED display panel includes that viewing area and corresponding electronic component are set
Area is arranged in the electronic component of seated position, in which:
Electronic component setting area includes transparent area and buffer area, the buffer area around the transparent area and with it is described
Viewing area contact；
The OLED display panel is formed with micro-nano structure in the buffer area；
The OLED display panel includes light emitting functional layer and encapsulated layer；The light emitting functional layer corresponds to the position of the transparent area
It sets and offers light transmission through-hole, the encapsulated layer encapsulates the light transmission through-hole.
2. OLED display panel as described in claim 1, which is characterized in that the OLED display panel includes pixel definition
Layer, the micro-nano structure includes the micro-nano groove being formed in the pixel defining layer.
3. OLED display panel as claimed in claim 2, which is characterized in that the micro-nano groove is around the transparent area
Closed ring.
4. OLED display panel as claimed in claim 3, which is characterized in that the shape of the closed ring include it is round or
At least one of polygon.
5. OLED display panel as claimed in claim 2, which is characterized in that the micro-nano structure includes at least two described micro-
Receive groove.
6. OLED display panel as claimed in claim 2, which is characterized in that the cross sectional shape of the micro-nano groove includes semicircle
At least one of shape, half elliptic, water-drop-shaped, rectangle, triangle.
7. such as OLED display panel as claimed in any one of claims 1 to 6, which is characterized in that the encapsulated layer includes that stacking is set
The first inorganic barrier layer, organic polymer layers and the second inorganic barrier layer set；The light transmission through-hole is inorganic through described first
Barrier layer and organic polymer layers.
8. OLED display panel as claimed in claim 7, which is characterized in that the organic polymer layers are hindered by micro-nano structure
Gear, is formed in the viewing area.
9. such as OLED display panel as claimed in any one of claims 1 to 6, which is characterized in that the transparent area is provided with filling
Layer, the filled layer are set in the light transmission through-hole, and the encapsulated layer is formed on the filled layer.
10. OLED display panel as claimed in claim 9, which is characterized in that the material and organic polymer of the filled layer
The material of layer is identical.
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| CN201910237985.2A CN110010665A (en) | 2019-03-27 | 2019-03-27 | OLED display panel |
| PCT/CN2019/110985 WO2020192088A1 (en) | 2019-03-27 | 2019-10-14 | Oled display panel and preparation method therefor, and display apparatus |
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| CN201910237985.2A CN110010665A (en) | 2019-03-27 | 2019-03-27 | OLED display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379837A (en) * | 2019-07-22 | 2019-10-25 | 京东方科技集团股份有限公司 | Display panel, boring method and electronic equipment |
| CN110459694A (en) * | 2019-07-30 | 2019-11-15 | 武汉天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN110503896A (en) * | 2019-08-09 | 2019-11-26 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN110571253A (en) * | 2019-08-29 | 2019-12-13 | 武汉华星光电半导体显示技术有限公司 | A display panel and mask |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060128042A1 (en) * | 2004-12-10 | 2006-06-15 | Osram Opto Semiconductors Gmbh | Method for encapsulating at least one organic light-emitting (OLED) device and OLED device |
| CN105870355A (en) * | 2016-05-27 | 2016-08-17 | 京东方科技集团股份有限公司 | Flexible OLED device and preparation method thereof |
| CN107359185A (en) * | 2017-07-27 | 2017-11-17 | 京东方科技集团股份有限公司 | A kind of display panel and display device |
| CN107658332A (en) * | 2017-10-25 | 2018-02-02 | 京东方科技集团股份有限公司 | A kind of display panel, display device and preparation method |
| CN108615747A (en) * | 2018-05-03 | 2018-10-02 | 昆山国显光电有限公司 | Display screen and display device |
| CN108666347A (en) * | 2018-04-26 | 2018-10-16 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN109087935A (en) * | 2018-08-20 | 2018-12-25 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display panel |
| CN109120753A (en) * | 2018-08-21 | 2019-01-01 | 武汉天马微电子有限公司 | Display panel and display device |
| CN109300970A (en) * | 2018-11-30 | 2019-02-01 | 上海天马微电子有限公司 | Display panels and display devices |
| CN109326225A (en) * | 2018-12-06 | 2019-02-12 | 武汉天马微电子有限公司 | Display panel, manufacturing method of display panel and display device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106105388B (en) * | 2014-03-06 | 2018-07-31 | 株式会社半导体能源研究所 | Light-emitting device |
| CN110010665A (en) * | 2019-03-27 | 2019-07-12 | 武汉华星光电半导体显示技术有限公司 | OLED display panel |
-
2019
- 2019-03-27 CN CN201910237985.2A patent/CN110010665A/en active Pending
- 2019-10-14 WO PCT/CN2019/110985 patent/WO2020192088A1/en active Application Filing
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060128042A1 (en) * | 2004-12-10 | 2006-06-15 | Osram Opto Semiconductors Gmbh | Method for encapsulating at least one organic light-emitting (OLED) device and OLED device |
| CN105870355A (en) * | 2016-05-27 | 2016-08-17 | 京东方科技集团股份有限公司 | Flexible OLED device and preparation method thereof |
| CN107359185A (en) * | 2017-07-27 | 2017-11-17 | 京东方科技集团股份有限公司 | A kind of display panel and display device |
| CN107658332A (en) * | 2017-10-25 | 2018-02-02 | 京东方科技集团股份有限公司 | A kind of display panel, display device and preparation method |
| CN108666347A (en) * | 2018-04-26 | 2018-10-16 | 上海天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN108615747A (en) * | 2018-05-03 | 2018-10-02 | 昆山国显光电有限公司 | Display screen and display device |
| CN109087935A (en) * | 2018-08-20 | 2018-12-25 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display panel |
| CN109120753A (en) * | 2018-08-21 | 2019-01-01 | 武汉天马微电子有限公司 | Display panel and display device |
| CN109300970A (en) * | 2018-11-30 | 2019-02-01 | 上海天马微电子有限公司 | Display panels and display devices |
| CN109326225A (en) * | 2018-12-06 | 2019-02-12 | 武汉天马微电子有限公司 | Display panel, manufacturing method of display panel and display device |
Cited By (44)
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|---|---|---|---|---|
| WO2020192088A1 (en) * | 2019-03-27 | 2020-10-01 | 武汉华星光电半导体显示技术有限公司 | Oled display panel and preparation method therefor, and display apparatus |
| CN110379837B (en) * | 2019-07-22 | 2022-04-15 | 京东方科技集团股份有限公司 | Display panel, drilling method and electronic device |
| US11314279B2 (en) | 2019-07-22 | 2022-04-26 | Boe Technology Group Co., Ltd. | Display panel, hole forming method, and electronic equipment |
| CN110379837A (en) * | 2019-07-22 | 2019-10-25 | 京东方科技集团股份有限公司 | Display panel, boring method and electronic equipment |
| CN110459694A (en) * | 2019-07-30 | 2019-11-15 | 武汉天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| CN110459694B (en) * | 2019-07-30 | 2021-11-05 | 武汉天马微电子有限公司 | Display panel, manufacturing method thereof and display device |
| US11069760B2 (en) | 2019-08-09 | 2021-07-20 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display device with through hole defined in electronic element setup region corresponding to electronic elements |
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| US11695015B2 (en) | 2020-05-27 | 2023-07-04 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Array substrate, method of manufacturing the same, and display panel |
| CN111725267A (en) * | 2020-06-02 | 2020-09-29 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN113851598A (en) * | 2020-06-28 | 2021-12-28 | 北京小米移动软件有限公司 | Display module, manufacturing method thereof and terminal equipment |
| CN113851598B (en) * | 2020-06-28 | 2024-06-11 | 北京小米移动软件有限公司 | Display module, manufacturing method thereof and terminal equipment |
| CN111969017A (en) * | 2020-08-21 | 2020-11-20 | 合肥维信诺科技有限公司 | Display panel and preparation method thereof |
| CN112086489A (en) * | 2020-09-08 | 2020-12-15 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN112086489B (en) * | 2020-09-08 | 2024-03-08 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| WO2022111134A1 (en) * | 2020-11-30 | 2022-06-02 | 京东方科技集团股份有限公司 | Display panel and preparation method therefor, and display device |
| US12058885B2 (en) | 2020-12-23 | 2024-08-06 | Samsung Display Co., Ltd. | Display device including compensation layer |
| CN115552650A (en) * | 2021-04-29 | 2022-12-30 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof, and display device |
| US12193310B2 (en) | 2021-04-29 | 2025-01-07 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate and manufacturing method thereof, and display device |
| WO2022226899A1 (en) * | 2021-04-29 | 2022-11-03 | 京东方科技集团股份有限公司 | Display substrate, preparation method therefor, and display apparatus |
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| WO2020192088A1 (en) | 2020-10-01 |
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Application publication date: 20190712 |