CN109979883A - A kind of integrated device mould group - Google Patents

Abstract

The invention discloses an integrated device module, comprising a substrate, an infrared detector arranged on the substrate, and a protective casing; wherein, the substrate is further integrated with one or more functional chips with different functions; the infrared detector is The device obtained by encapsulating the infrared detection chip based on WLP packaging technology; the infrared detector is attached to the substrate, and the pins of the infrared detector are electrically connected to the I/O interface of the substrate through metal leads; the protective shell and the substrate are fixedly connected, And a cavity for accommodating the infrared detector is formed between the protective casing and the base plate; the cavity wall corresponding to the position of the light-passing area on the window of the infrared detector has a through hole, and the size of the through-hole is larger than that of the light-passing area. size. The integrated device module provided by the present invention physically protects the infrared detector, avoids the infrared detector from being collided or scratched, and integrates functional chips with different functions on the substrate, eliminating the need for users to carry out secondary development and reducing the use cost. and difficulty of use.

Description

An integrated device module

technical field

The present invention relates to the technical field of wafer level packaging, in particular to an integrated device module.

Background technique

Infrared detectors in WLP package (wafer level package) are popular in the market due to their small size and reliable performance. However, the infrared detector obtained based on WLP packaging technology has high environmental requirements. During the transportation of the product, the infrared detector will inevitably collide with the external environment or be scratched, causing damage to the device. In addition, when users use WLP devices, they also need to carry out secondary development of WLP devices, which increases the difficulty for users to use WLP devices.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide an integrated device module, which solves the problem that the WLP device is damaged due to collision or scratching, and the secondary development is difficult.

In order to solve the above-mentioned technical problems, the present invention provides an integrated device module, comprising:

a substrate, an infrared detector arranged on the substrate, and a protective casing;

Wherein, more than one functional chip with different functions is also integrated on the substrate;

The infrared detector is a device obtained by packaging an infrared detection chip based on WLP packaging technology;

The infrared detector is attached and arranged on the substrate, and the pins of the infrared detector are electrically connected to the I/O interface of the substrate through metal leads;

The protective casing and the base plate are fixedly connected, and a cavity for accommodating the infrared detector is formed between the protective casing and the base plate; the cavity corresponds to the window of the infrared detector The cavity wall at the position of the light-passing area has a through hole, and the size of the through-hole is larger than the size of the area of the light-passing area.

Wherein, the functional chip includes any one or more chips of image processing chip, data storage chip, crystal oscillator or FPGA chip.

Wherein, the functional chip and the infrared detector are respectively arranged on two different surfaces of the substrate.

Wherein, one end of the protective casing connected to the infrared detector protrudes out of the infrared detector.

Wherein, the surface of the protective shell is also provided with an antistatic film layer.

Wherein, the substrate is a PCB board or a ceramic board.

Wherein, the I/O interface is a JEDEC standard interface.

The integrated device module provided by the present invention connects the infrared detector obtained by the WLP packaging technology with the substrate, and there is a standard I/O interface on the substrate, which can directly output and input the signal of the infrared detector chip. Back-end users do not need to bond and output the pins of the infrared detector when using it. In addition, a protective casing for protecting the infrared detector is also set on the substrate, so that the sides of the infrared detector, pins, leads and other components are all in the cavity formed by the casing and the substrate, which physically protects the infrared detector. The problem that the infrared detector is damaged due to collision or scratches between the infrared detector and objects in the external environment is avoided. In addition, functional chips with different functions are integrated on the substrate, so that the functions of the WLP device can be expanded, the user does not need to carry out secondary development, and the user's use cost and use difficulty are reduced.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following will briefly introduce the accompanying drawings used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only For some embodiments of the present invention, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.

1 is a schematic structural diagram of a protective casing provided by an embodiment of the present invention;

2 is a partial structural schematic diagram of an integrated device module provided by an embodiment of the present invention;

FIG. 3 is a schematic diagram of a backside structure of a substrate according to an embodiment of the present invention.

Detailed ways

In order to make those skilled in the art better understand the solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

As shown in FIGS. 1 and 2 , FIG. 1 is a schematic structural diagram of a protective casing provided by an embodiment of the present invention, and FIG. 2 is a partial structural schematic diagram of an integrated device module provided by an embodiment of the present invention, which may specifically include:

a substrate 2, an infrared detector 1 arranged on the substrate 2, and a protective casing 3;

Specifically, the substrate 2 may be a PCB board, a ceramic board or a substrate made of other materials, which is not specifically limited in the present invention.

Wherein, the substrate 2 is further integrated with one or more functional chips with different functions;

Infrared detector 1 is a device obtained by packaging an infrared detection chip based on WLP packaging technology;

The infrared detector 1 is attached and arranged on the substrate 2, and the pins of the infrared detector 1 are electrically connected to the I/O interface of the substrate 2 through metal leads;

The protective shell 3 and the base plate 2 are fixedly connected, as shown in Figures 1 and 2. In the actual assembled module, the protective shell 3 in Figure 1 is fastened to the structural component in Figure 2, and is consistent with Figure 2. In 2, the edge positions of the substrate 2 are fixedly connected, and then a cavity for accommodating the chip is formed between the protective shell 3 and the substrate 2; the cavity wall corresponding to the position of the light-passing area on the window of the infrared detector 1 has a through hole 4. The function of the through hole 4 is mainly to enable the light-passing area on the window to receive external light signals. Therefore, the size of the through-hole 4 is larger than the area of the light-passing area to avoid blocking the light-passing area.

It should be noted that the integrated device module provided in the present invention is a product obtained by further developing the infrared detector 1 obtained by the WLP packaging technology.

Wafer-level packaging (WLP) uses wafers as the packaging processing object, rather than the traditional packaging system which uses a single chip as the processing object. All packaging and testing operations have been completed on the wafer before chip dicing, so almost all manufacturing processes are completed in the wafer factory, excluding the traditional process of the packaging factory. When a wafer comes out of the foundry, the packaging process is directly carried out on the whole chip, and when it is finally cut, one is the packaged IC products, which is economical in terms of time and cost; this application is based on The infrared detector obtained by packaging the chip with the wafer-level packaging technology, through which the chip is packaged, the integration degree of the chip is improved to a great extent, the structure is smaller, and the layout is more compact. However, even the IC products of infrared detectors formed by wafer-level packaging require secondary development by back-end users, and some users do not have the ability and conditions for secondary development. And the chip of the IC product will be affected by the external environment to a certain extent during the transportation process.

In the integrated device module provided in this embodiment, the infrared detector 1 is one of IC products obtained after wafer-level packaging, and is packaged on the substrate 2, so that the substrate 2 has pins and leads. The I/O interface electrically connected to the pins may specifically be packaged using LCC packaging, BGA packaging or other packaging technologies, which is not limited in this embodiment. Connect the pins of the infrared detector 1 to the pins of the substrate 2 through metal leads, then the signals of the infrared detector 1 can be input and output through the I/O interface of the substrate 2. Specifically, the I/O interface It may be a JEDEC standard interface or another interface with similar functions, which is not limited in this embodiment. When the back-end user uses it, there is no need to process the pins of the infrared detector 1, which provides convenience for the user.

Secondly, a protective casing 3 is also provided, so that the infrared detector 1, pins and metal leads are all arranged in the cavity formed by the protective casing 3 and the substrate 2, so as to form a physical protection for the infrared detector 1 to avoid infrared The detector 1 and its pins and other components are bumped or scratched by the external environment during transportation. In addition, a through hole 4 is also provided at the window position of the infrared detector 1 , so that the light signal can be incident to the window through the through hole 4 .

In addition, in addition to the infrared detector 1 packaged on the substrate 2, a plurality of chips with different functions are also integrated. Because in the actual application process, the realization of the function of the infrared detector often needs to be used in conjunction with other functional chips, so that the complete function of the infrared detector can be realized. If only the infrared detector 1 exists in the module, the back-end user needs to carry out secondary development of the module when putting it into application, which makes the use of the infrared detector more cumbersome. In this application, the infrared detector and other functional chips are directly integrated on the same substrate, so that the user can obtain a product with complete infrared detector functions, which does not require the user to carry out secondary development, and provides convenience for the user.

To sum up, the integrated device module provided by the present invention can well protect the infrared detector 1 from the influence of the external environment, and integrates chips with various functions, so that the user can obtain a module with complete functions product, which is convenient for users to use.

Optionally, in another specific embodiment of the present invention, it may further include:

The functional chips include any one or more of image processing chips, data storage chips, crystal oscillators or FPGA chips.

In the practical application of infrared detectors, image processing chips, data storage chips, crystal oscillators, and FPGA chips are several functional chips commonly used in infrared detectors. One or more of these kinds of chips and the infrared detector 1 are integrated into the same module, which is convenient for users to use.

Optionally, in another specific embodiment of the present invention, it may also include:

Each functional chip and infrared detector are respectively arranged on two different surfaces of the substrate.

Specifically, as shown in FIG. 3 , FIG. 3 is a schematic diagram of a backside structure of a substrate provided by an embodiment of the present invention, and a plurality of functional chips 5 are integrated and disposed on the backside of the substrate at the same time. The functional chips 5 and the infrared detectors 1 are respectively arranged on two different surfaces of the substrate 2, making full use of the space area of the two different surfaces of the substrate 2, reducing the size of the substrate 2, and making the module structure tend to be more miniaturized.

Of course, if the integrated device module provided by the present invention has a large enough space for accommodating the integrated device module during use, each functional chip and infrared detector in the integrated device module can also be arranged on the same side of the substrate. On the surface, this is not limited in the present invention.

Optionally, in another specific embodiment of the present invention, it may also include:

The protective shell 3 is a plastic shell;

The end of the protective casing 3 connected to the infrared detector 1 protrudes out of the infrared detector. 1

Specifically, the protective casing 3 and the edge of the window of the infrared detector 1 are attached to each other and protrude from the surface of the window, that is, the edge of the through hole 4 protrudes from the surface of the window, which is beneficial to protect the interior of the protective casing 3 The infrared detector 1 and its related components.

Optionally, in another specific embodiment of the present invention, it may further include:

The surface of the protective casing 3 is also provided with an antistatic film layer.

For the infrared detector 1 obtained based on WLP technology, static electricity can seriously damage the circuit structure of the chip and damage the performance of the chip. During the transportation and assembly of the module, static electricity will inevitably be generated. The performance of the infrared detector 1 and other functional chips 4 is affected, and an antistatic film layer, specifically a conductive film layer, can be provided on the surface of the protective casing 3 to facilitate the elimination of static electricity.

The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments may be referred to each other. As for the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant part can be referred to the description of the method.

Claims (7)

1. a kind of integrated device mould group, which is characterized in that including substrate, infrared detector on the substrate is set, and Protect shell；

Wherein, also integrally disposed on the substrate to have more than one and the functional chip with different function；

The infrared detector is to encapsulate the device that infrared detecting chip obtains based on WLP encapsulation technology；

The infrared detector fitting is arranged on the substrate, and the pin of the infrared detector passes through metal lead wire and institute State the I/O interface electrical connection of substrate；

The protection shell is fixedly connected with the substrate, and is formed described in receiving between the protection shell and the substrate The cavity of infrared detector；The cavity wall that the cavity corresponds to light passing zone position on the window of the infrared detector has through-hole, And the size of the through-hole is greater than the size of the transparent zone area.

2. integrated device mould group as described in claim 1, which is characterized in that the functional chip include picture processing chip, Any one or more chip in pin-saving chip, crystal resonator or fpga chip.

3. integrated device mould group as claimed in claim 2, which is characterized in that the functional chip and the infrared detector point Two different surfaces of the substrate are not set.

4. integrated device mould group as described in claim 1, which is characterized in that the protection shell and the infrared detector phase One end even protrudes from the infrared detector.

5. integrated device mould group as claimed in claim 4, which is characterized in that the surface of the protection shell is additionally provided with antistatic Film layer.

6. such as integrated device mould group described in any one of claim 1 to 5, which is characterized in that the substrate is pcb board or ceramics Plate.

7. integrated device mould group as claimed in claim 6, which is characterized in that the I/O interface is JEDEC standard interface.