CN109974901B

CN109974901B - A flow meter system based on gas heat measurement

Info

Publication number: CN109974901B
Application number: CN201910293605.7A
Authority: CN
Inventors: 李诗华; 任海军; 徐荣华; 王建; 梁世展; 罗海强
Original assignee: ZENNER METERING TECHNOLOGY (SHANGHAI) Ltd
Current assignee: ZENNER METERING TECHNOLOGY (SHANGHAI) Ltd
Priority date: 2019-04-12
Filing date: 2019-04-12
Publication date: 2024-11-22
Anticipated expiration: 2039-04-12
Also published as: CN109974901A

Abstract

The invention relates to the technical field of flow meters, in particular to a flow meter system based on gas heat metering. The utility model provides a flowmeter system based on gas heat measurement, includes calorific value appearance, gas main pipeline, far away heat transfer volume flowmeter, buffer tank, basic station, cloud server, its characterized in that: the heat value instrument is positioned at the output end of the gas main pipeline, the output end of the gas main pipeline is connected with a plurality of branch pipelines, and the branch pipelines are provided with far heat transfer flow meters; a buffer tank is arranged on the gas main pipeline; the data signal output ends of the heat value meter and the remote heat transfer flow meter are connected with the signal input end of the base station through a wireless data communication line, and the signal output end of the base station is connected with the cloud server through a public network. Compared with the prior art, the main technical core is a fuel gas energy metering system consisting of three core components of a heat value meter, a wireless remote transmission flowmeter, a cloud platform and the like. The data can be collected more conveniently through the wireless network, and the method is quick and convenient.

Description

Flowmeter system based on gas heat metering

Technical Field

The invention relates to the technical field of flow meters, in particular to a flow meter system based on gas heat metering.

Background

Currently, natural gas metering modes mainly comprise three types of volumetric metering, mass metering and energy metering. The energy metering mode is mainly adopted in developed countries such as international natural gas trade and Europe and America, and the volume metering mode is still mainly adopted in China at present, and the metering instruments used comprise an orifice plate flowmeter, a turbine flowmeter, an ultrasonic flowmeter, a roots flowmeter, a vortex street flowmeter, a precession vortex flowmeter, a diaphragm gas meter and the like.

However, natural gas is valuable as an energy source for combustion in that it provides heat. However, natural gas is a multi-component mixed gas, and because of different sources of production places, the components and the content are different, so that the natural gas with the same volume and quality from different sources has different energy generated by combustion and different commodity values.

As mentioned above, the volume metering pricing is adopted, and in the air source supply link, the air source competition of different heating values is unfair; in the pipeline conveying link, the technical index of pipeline gas is affected, and the fair entering of a third party of a pipeline and the interconnection and intercommunication of the pipeline are prevented; in the sales link, natural gas energy can change along with the mixing of a gas source and a plurality of gas sources, so that the price of the natural gas is the same but the value is different.

On a large commodity transaction platform, commodity quality is a main factor for determining price. The calorific value is a key index for representing the quality and the utilization value of the natural gas, and the volume metering pricing mode is adopted to influence the fair competition of the natural gas with different qualities on a transaction platform, so that the natural gas with the same volume and quality from different sources has different energy generated by combustion, and the comparability of transaction price is poor, so that the fair transaction is influenced.

Disclosure of Invention

The invention provides a flowmeter system based on gas heat measurement, which aims to overcome the defects of the prior art and has the main technical core that the gas energy measurement system consists of three core components, namely a heat value meter, a wireless remote-transmission flowmeter, a cloud platform and the like. The data can be collected more conveniently through the wireless network, and the method is quick and convenient.

In order to achieve the above purpose, a flowmeter system based on gas heat measurement is designed, including calorific value appearance, gas main pipeline, far heat transfer volume flowmeter, buffer tank, basic station, cloud server, its characterized in that: the heat value instrument is positioned at the output end of the gas main pipeline, the output end of the gas main pipeline is connected with a plurality of branch pipelines, and the branch pipelines are provided with far heat transfer flow meters; a buffer tank is arranged on the gas main pipeline; the data signal output ends of the heat value meter and the remote heat transfer flow meter are connected with the signal input end of the base station through a wireless data communication line, and the signal output end of the base station is connected with the cloud server through a public network.

The heat value instrument comprises a communication module, a microprocessor MCU, a remote transmission module, a power management module, a data storage module, a lightning protection and static prevention module, wherein the microprocessor MCU is respectively connected with the remote transmission module, the power management module, the data storage module, the lightning protection and static prevention module and the communication module through lines, and the communication module is connected with a base station through a wireless data communication line.

The remote heat transfer flow meter can also be a remote heat transfer film meter or an ultrasonic meter.

The working method of the system is as follows:

s1: the heat value instrument collects heat value data in the gas main pipeline and then transmits the heat value data to the base station through wireless data;

S2: the remote heat transfer flow meter or the remote heat transfer film meter or the ultrasonic meter transmits the gas volume data of the branch pipeline to the base station;

s3: the base station transmits all data to the cloud server, the cloud server receives the data and distributes the data, and the heat value data of the heat value instrument are distributed to each remote heat transfer flow meter or remote heat transfer film meter or ultrasonic meter through the base station;

s4: after the remote transmission module of the remote heat transfer flowmeter or the remote heat transfer film meter or the ultrasonic meter receives the heat value data, the microprocessor MCU calculates by combining the gas volume data acquired by the microprocessor MCU, so that the heat data of each branch pipeline is calculated, and then the data is displayed from the display.

The microprocessor MCU comprises a microprocessor MCU chip U2, a chip U1, an interface J6 and an interface J13, wherein the model of the chip U1 is ADP1613, the model of the microprocessor MCU chip U2 is MSP430F5438, the 11 # port of the microprocessor MCU chip U2 is respectively connected with a power VCC port and one end of a capacitor C20, and the other end of the capacitor C20 is grounded; the 12 # port of the microprocessor MCU chip U2 is grounded; the No. 13 port of the microprocessor MCU chip U2 is connected with the No. 1 port of the low-frequency crystal oscillator Y2; the No. 14 port of the microprocessor MCU chip U2 is connected with the No. 4 port of the low-frequency crystal oscillator Y2; The 15 # port of the microprocessor MCU chip U2 is grounded; the 16 # port of the microprocessor MCU chip U2 is respectively connected with a power VCC port and one end of a capacitor C21, and the other end of the capacitor C21 is grounded; the No. 37 port of the MCU chip U2 is grounded; the No. 38 port of the MCU chip U2 is respectively connected with the VCC port of the power supply and one end of the capacitor C22, and the other end of the capacitor C22 is grounded; the 48 # port of the MCU chip U2 is respectively connected with the 2 # port of the interface J13 and one end of the resistor R55, and the other end of the resistor R55 is connected with the power VCC; the port 1 of the interface J13 is grounded; the No. 62 port of the microprocessor MCU chip U2 is connected with one end of a capacitor C23, and the other end of the capacitor C23 is grounded; the No. 63 port of the MCU chip U2 is grounded; the No. 64 port of the MCU chip U2 is respectively connected with the power VCC port and one end of the capacitor C24, and the other end of the capacitor C24 is grounded; the 87 # port of the microprocessor MCU chip U2 is connected with a power VCC port; the 88 number port of the microprocessor MCU chip U2 is grounded; the port 1 of the high-speed crystal oscillator Y1 is connected with one end of a capacitor C2, the port 2 of the high-speed crystal oscillator Y1 is connected with one end of the capacitor C1, and the other ends of the capacitor C1 and the capacitor C2 are grounded; The port 1 of the interface J6 is respectively connected with the port 22 of the microprocessor MCU chip U2 and one end of the resistor R4, and the other end of the resistor R4 is connected with the power VCC port; the port No. 2 of the interface J6 is connected with the port No. 73 of the microprocessor MCU chip U2; the port No. 3 of the interface J6 is connected with the port No. 72 of the microprocessor MCU chip U2; the port No. 4 of the interface J6 is grounded; the port 1 of the interface J1 is respectively connected with one end of a resistor R2 and a power VCC port, the other end of the resistor R2 is respectively connected with the port 3 of the interface J1 and one end of a key switch S1, and the other end of the key switch S1 is grounded; The port No. 2 of the interface J1 is connected with the port No. 91 of the microprocessor MCU chip U2; the port No. 4 of the interface J1 is grounded; the No. 9 port of the microprocessor MCU chip U2 is connected with the anode of the photodiode LED1, the cathode of the photodiode LED1 is connected with one end of a resistor R41, and the other end of the resistor R41 is grounded; the No.8 port of the microprocessor MCU chip U2 is connected with the anode of the photodiode LED2, the cathode of the photodiode LED2 is connected with one end of the resistor R42, and the other end of the resistor R42 is grounded; the port 1 of the chip U1 is connected with one end of a resistor R29, the other end of the resistor R29 is connected with one end of a capacitor C27, the other end of the capacitor C27 is respectively connected with the port 4 of the chip U1, one end of a resistor R66, one end of a capacitor C28, one end of a capacitor C29 and one end of a capacitor C30 and one end of a resistor R28, and the other end of the capacitor C28 is connected with the port 8 of the chip U1; The other end of the resistor R66 is grounded; the port No. 6 and the port No. 7 of the chip U1 are combined and connected with one end of the inductor L2, the other end of the capacitor C29 and one end of the resistor R64, and the other end of the resistor R64 is connected with the port No. 2 of the chip U11; the other end of the inductor L2 is respectively connected with the No. 5 port of the chip U1 and the anode of the diode D7, and the cathode of the diode D7 is respectively connected with one end of the resistor R27, the other end of the capacitor C30 and one end of the resistor R65, and the other end of the resistor R65 is connected with the No. 8 port of the chip U6; the other ends of the resistor R27 and the resistor R28 are connected with a No. 2 port of the chip U1; the port No. 3 of the chip U1 is connected with one end of a resistor R19, and the other end of the resistor R19 is connected with the port No. 52 of the microprocessor MCU chip U2.

The communication module comprises a chip U9, a chip U12, a chip U14, a chip U23, a chip U24, a chip U26 and an interface J3, wherein the model of the chip U9 is MAX488SE, the model of the chip U12 is TD501D485, the model of the chip U14 is DS1302, the model of the chip U23 is B8279S0, the model of the chip U24 is GDT2026-15-C2, and the model of the chip U26 is B0505LS-1W. The port 1 of the chip U12 is respectively connected with one end of the capacitor C37, the positive electrode of the capacitor C36 and the port 8 of the chip U6, and the port 2 of the chip U12, the other end of the capacitor C37 and the negative electrode of the capacitor C36 are grounded; The port No. 5 of the chip U12 is connected with the port No. 6 of the microprocessor MCU chip U2; the port No. 8 of the chip U12 is respectively connected with the cathode of the voltage stabilizing diode TVS2, the anode of the voltage stabilizing diode TVS3, the port No. 1 of the chip U23 and one end of the resistor R53, the anode of the voltage stabilizing diode TVS2 is respectively connected with the port No. 10 of the chip U12, the anode of the voltage stabilizing diode TVS1, one end of the resistor R59 and one end of the capacitor C40, and the other ends of the resistor R59 and the capacitor C40 are respectively connected with the port No. 1 of the chip U24 and the ground; the port 9 of the chip U12 is respectively connected with the cathode of the voltage stabilizing diode TVS1, the cathode of the voltage stabilizing diode TVS3, the port 3 of the chip U23 and one end of the resistor R54, and the port 4 of the chip U23 is respectively connected with the port 2 of the chip U24, one end of the resistor R49 and the port 2 of the interface J3; The other end of the resistor R53 and the port No. 2 of the chip U23 are respectively connected with the port No. 3 of the chip U24, the other end of the resistor R49 and the port No. 1 of the interface J3; the port 3 of the interface J3 is connected with one end of a resistor R67, and the other end of the resistor R67 is grounded; the port 4 of the interface J3 is connected with one end of a resistor R68, and the other end of the resistor R68 is connected with the port 8 of the chip U6; the port 5 of the interface J3 is connected with the port 3 of the chip U26, and the port 2 of the chip U26 is grounded; the port 6 of the interface J3 is connected with the port 4 of the chip U26, and the port 1 of the chip U26 is connected with the port 8 of the chip U6; The No. 11 port of the chip U26 is connected with the No. 31 port of the microprocessor MCU chip U2; the No. 11 port of the chip U26 is connected with the No. 32 port of the microprocessor MCU chip U2; the port No. 1 of the chip U14 is connected with the port No. 39 of the microprocessor MCU chip U2; the port No. 2 of the chip U14 is grounded; the ports No. 3 and No. 6 of the chip U14 are connected with one end of a capacitor C59, and the other end of the capacitor C59 is grounded; the port No. 4 of the chip U14 is connected with the port No. 39 of the microprocessor MCU chip U2; the port No. 5 of the chip U14 is connected with the port No. 40 of the microprocessor MCU chip U2; The port 7 of the chip U14 is connected with one end of a capacitor C51, and the other end of the capacitor C51 is grounded; the No. 8 port of the chip U14 is connected with the No. 40 port of the microprocessor MCU chip U2; the port 1 of the chip U9 is connected with one end of a capacitor C11, and the other end of the capacitor C11 is grounded; the port 1 of the chip U9 is connected with one end of a resistor R60, and the other end of the resistor R60 is connected with the port 39 of the microprocessor MCU chip U2; the port No. 3 of the chip U9 is connected with one end of a resistor R61, and the other end of the resistor R61 is connected with the port No. 40 of the microprocessor MCU chip U2; the port No. 4 of the chip U9 is grounded; The port 5 of the chip U9 is respectively connected with one ends of a resistor R36 and a resistor R46, the other end of the resistor R36 is respectively connected with the anodes of a diode D8, a diode D9 and a voltage stabilizing diode TVS4, the cathodes of the diode D8 and the diode D9 are connected with the cathodes of a diode D10 and a diode D11, the anodes of the diode D10 and the diode D11 and the other end of the resistor R46 are combined and respectively connected with the port 6 of the chip U9 and one end of a resistor R35, and the other end of the resistor R35 is connected with the cathode of the voltage stabilizing diode TVS 4; the port 7 of the chip U9 is respectively connected with one ends of a resistor R45 and a resistor R34 and anodes of a diode D12 and a diode D13, cathodes of the diode D12 and the diode D13 are connected with cathodes of a diode D14 and a diode D15, anodes of the diode D14 and the diode D15 are respectively connected with one end of a resistor R32 and a cathode of a voltage stabilizing diode TVS5, an anode of the voltage stabilizing diode TVS5 is connected with the other end of the resistor R34, and the other end of the resistor R32 is respectively connected with the other end of the resistor R45 and the port 8 of the chip U9; the port 1 of the interface J3 is connected with the port B of the heat value instrument, and the port 2 of the interface J3 is connected with the port A of the heat value instrument.

The remote transmission module comprises a remote transmission module chip U1, an interface J10, an interface J11, an interface J12, an interface J14 and an interface J17, wherein the model of the chip U1 is SIM800A; the No. 2 port of the remote transmission module chip U1 is grounded; the No. 7 port of the remote transmission module chip U1 is connected with the No. 8 port; the No. 9 port of the remote transmission module chip U1 is connected with one end of a resistor R5, and the other end of the resistor R5 is connected with the No. 54 port of the microprocessor MCU chip U2; the 10 # port of the remote transmission module chip U1 is respectively connected with one end of a resistor R6 and one end of a resistor R7, the other end of the resistor R6 is connected with the 53 # port of the microprocessor MCU chip U2, and the other end of the resistor R7 is grounded; The No. 15 port of the remote transmission module chip U1 is connected with one end of a capacitor C5, and the other end of the capacitor C5 is grounded; the 17 # and 18 # ports of the remote transmission module chip U1 are grounded; the No. 26 port of the remote transmission module chip U1 is connected with one end of the capacitor C6, the other end of the capacitor C6 and the No. 29 port of the remote transmission module chip U1 are connected with the ground; the No. 34 port of the remote transmission module chip U1 is connected with one end of a resistor R19, and the other end of the resistor R19 is grounded; the ports of No. 39, no. 45 and No. 46 of the remote transmission module chip U1 are grounded; the 52 # port of the remote transmission module chip U1 is connected with one end of a resistor R9, the other end of the resistor R9 is connected with the base electrode of a triode Q1, the emitter electrode of the triode Q1 is grounded, the collector electrode of the triode Q1 is connected with one end of a resistor R8, the other end of the resistor R8 is connected with the cathode of a light emitting diode LED1, and the anode of the light emitting diode LED1 is connected with the 55 # port, the 56 # port and the 57 # port of the remote transmission module chip U1; The port No. 58 and the port No. 59 of the remote transmission module chip U1 are grounded; the 60 # port of the remote transmission module chip U1 is connected with the 1# port of the antenna interface A1, and the 2# to 5# ports of the antenna interface A1 are grounded; the 61 to 65 ports of the remote transmission module chip U1 are grounded; the ports of the No. 55, no. 56 and No. 57 of the remote transmission module chip U1 are connected with the positive electrode of the capacitor C1, one end of the capacitor C2, the capacitor C3 and one end of the capacitor C4, and the negative electrode of the capacitor C1, the other end of the capacitor C2, the capacitor C3 and the other end of the capacitor C4 are connected with the ground; the ports 1 and 2 of the interfaces J17 and J10 are grounded; the port 1 of the interface J11 is grounded; the port 2 of the interface J11 is connected with one end of a resistor R50, and the other end of the resistor R50 is connected with a power VCC port; The port 1 of the interface J12 is grounded; the port 2 of the interface J12 is connected with one end of a resistor R51, and the other end of the resistor R51 is connected with a power VCC port; the ports from No. 1 to No. 4 of the interface J14 are connected with the ports No. 55, no. 56 and No. 57 of the remote transmission module chip U1; the ports 5 to 8 of the interface J14 are grounded; the port 9 of the interface J14 is connected with the port 1 of the remote transmission module chip U1; the port 10 of the interface J14 is respectively connected with one end of a capacitor C25, the collector of a triode Q13 and the port 1 of a chip U1, the emitter of the triode Q13 is divided into two paths, one path is combined with the other end of the capacitor C25 and grounded, the other path is connected with one end of a resistor R38, the other end of the resistor R38 is respectively connected with the base of the triode Q13 and one end of a resistor R37, and the other end of the resistor R37 is connected with the port 23 of a microprocessor MCU chip U2; The No. 11 port of the interface J14 is connected with the No. 16 port of the remote transmission module chip U1; the 12 # port of the interface J14 is respectively connected with one end of a capacitor C26, the collector of a triode Q14 and the 16 # port of a chip U1, the emitter of the triode Q14 is divided into two paths, one path is combined with the other end of the capacitor C26 and grounded, the other path is connected with one end of a resistor R31, the other end of the resistor R31 is respectively connected with the base of the triode Q14 and one end of a resistor R30, and the other end of the resistor R30 is connected with the 1 # port of a microprocessor MCU chip U2; the No.13 port of the interface J14 is connected with the No. 24 port of the microprocessor MCU chip U2; The No. 15 port of the interface J14 is connected with the No. 75 port of the microprocessor MCU chip U2; the 17 # port of the interface J14 is grounded; the 18 # port of the interface J14 is connected with a power VCC port; the 19 # port of the interface J14 is connected with the 54 # port of the microprocessor MCU chip U2; the port 20 of the interface J14 is connected with the port 53 of the microprocessor MCU chip U2.

The power management module comprises a chip U1, a chip U3, a chip U7, a chip U11, a chip U19, a chip U20, an interface J2, an interface J5, an interface J15 and an interface J16, wherein the model of the chip U1 is ADP1613, the model of the chip U3 is HM7333PR, the model of the chip U7 is LM2596S-12, the model of the chip U11 is AMS1117-5.0, the model of the chip U19 is SPX29302, and the model of the chip U20 is LTC4412HV. The port 1 of the chip U1 is connected with one end of a resistor R29, the other end of the resistor R29 is connected with one end of a capacitor C27, the other end of the capacitor C27 is respectively connected with the port 4 of the chip U1, a capacitor C28, one ends of the capacitor C29 and the capacitor C30, a resistor R66 and one end of the resistor R28, the other end of the capacitor C28 is connected with the port 8 of the chip U1, the other end of the resistor R66 is grounded, the other end of the capacitor C29 is respectively connected with one end of an inductor L2, the ports 6 and 7 of the chip U1 and one end of a resistor R64, and the other end of the resistor R64 is connected with the port 8 of the chip U6; The port 2 of the chip U1 is connected with one end of a resistor R27 and the other end of a resistor R28 respectively, the other end of the resistor R27 is connected with the cathode of a diode D7, the other end of a capacitor C30 and one end of a resistor R65 respectively, the other end of the resistor R65 is connected with the port 8 of the chip U6, and the anode of the diode D7 is connected with the port 5 of the chip U1 and the other end of an inductor L2 respectively; the port 1 of the chip U7 is respectively connected with one end of a capacitor C62 and a capacitor C63, the anode of a capacitor C3, the cathode of a diode D19, the anode of a diode D31, one end of a resistor R80 and the port 1 of a power tube SI2, the cathode of the capacitor C3, the other end of the capacitor C62 and the capacitor C63 and the port 6 of the chip U7 are combined and divided into seven paths, the first path is grounded, the second path is connected with the port 3 of the chip U7, the third path is connected with the port 5 of the chip U7, the fourth path is connected with the anode of a diode D5, the fifth path is connected with the cathode of a capacitor C4, the sixth path is connected with one end of the capacitor C64, and the seventh path is connected with one end of the capacitor C65, the other ends of the capacitor C64 and the capacitor C65 are respectively connected with a No. 4 port of the chip U7, one end of the inductor L1 and the anode of the capacitor C4, and the other end of the inductor L1 is respectively connected with a No. 2 port of the chip U7 and the cathode of the diode D5; the anode of the diode D19 is connected with the No. 1 port of the interface J5, and the No. 2 port of the interface J5 is grounded; the port No. 2 and the port No. 3 of the chip U20 are grounded; the port No. 4 of the chip U20 is respectively connected with one end of a resistor R14 and the port No. 25 of the microprocessor MCU chip U2, and the other end of the resistor R14 is connected with a power VCC end; the port No. 5 of the chip U20 is connected with the port No. 1 of the power tube SI1, the port No. 2 of the power tube SI1 is respectively connected with one end of the resistor R69, the cathode of the diode D18 and the port No. 2 of the power tube SI2, and the port No. 3 of the power tube SI2 is connected with the cathode of the diode D31; The other end of the resistor R80D is grounded; the anode of the diode D18 is connected with the No. 1 port of the interface J2, and the No. 2 port of the interface J2 is grounded; the other end of the resistor R69 is connected with one end of the resistor R71, and the other end of the resistor R71 is grounded; the No. 6 port of the chip U20 is divided into 9 paths, the first path is connected with the cathode of the diode D2, and the anode of the diode D2 is connected with a 12V direct current power supply; the second path is connected with the positive electrode of the capacitor C53, and the negative electrode of the capacitor C53 is grounded; the third path is connected with the anode of the diode D3; the fourth path is connected with the anode of the capacitor C7; the fifth path is connected with one end of a capacitor C8, and the negative electrode of the capacitor C7 and the other end of the capacitor C8 are grounded; The sixth path is connected with the No. 2 port of the chip U3; the seventh path is connected with the anode of the diode D16; the eighth path is connected with the emitter of the triode Q10; the ninth path is connected with one end of a resistor R52, the other end of the resistor R52 is respectively connected with one end of a resistor R26 and the collector of a triode Q9, the emitter of the triode Q9 is grounded, and the other end of a base electrode connecting resistor R25 of the triode Q9 is connected with the 21 # port of a microprocessor MCU chip U2; the other end of the resistor R26 is connected with the base electrode of the triode Q10, the collector electrode of the triode Q10 is connected with the anode of the diode D1, and the cathode of the diode D1 is respectively connected with the cathode of the diode D16, the anode of the capacitor C42, one end of the capacitor C43 and the No. 2 port of the chip U19; The negative electrode of the capacitor C42 and the other end of the capacitor C43 are respectively connected with the No. 6 port and the No. 3 port of the chip U19 in 8 paths; the third path is grounded; one end of the fourth path connecting resistor R10; the fifth path is connected with one end of the capacitor C44; the sixth path is connected with the cathode of the capacitor C45; the seventh path is connected with the cathode of the light emitting diode LED 4; an eighth path is connected with the cathode of the capacitor C46; the other end of the resistor R10 is respectively connected with the No. 5 port of the chip U19 and one end of the resistor R9; the anode of the light-emitting diode LED4 is connected with one end of a resistor R8, the other end of the resistor R8, the positive poles of a capacitor C45 and a capacitor C46, the other ends of a capacitor C44 and a resistor R9 are combined and connected with a number 4 port of a chip U19; The port 1 of the chip U3 is grounded; the port No. 3 of the chip U3 is divided into 3 paths, and the first path is connected with one end of the capacitor C9; the second path is connected with a power VCC end; the third path is connected with the anode of the capacitor C10; the negative electrode of the capacitor C10 and the other end of the capacitor C9 are grounded; the port No. 3 of the chip U11 is respectively connected with one end of a capacitor C6, the anode of a capacitor C5 and the cathode of a diode D4, the anode of the diode D4 is connected with the port No. 3 of a power SI3, and the port No. 2 of the power SI3 is respectively connected with the cathode of the diode D3 and one end of a resistor R15; the port 1 of the power tube SI3 is connected with one end of a resistor R16, the other ends of the resistor R15 and the resistor R16 are connected with the collector of a triode Q18 in a combined mode, the emitter of the triode Q18 is grounded, the base of the triode Q18 is connected with one end of a resistor R17, and the other end of the resistor R17 is connected with the port 51 of a microprocessor MCU chip U2; The port No. 2 of the chip U11 is respectively connected with one end of the capacitor C58, the positive electrode of the capacitor C14, one end of the resistor R18 and the port No. 8 of the chip U6, the other end of the resistor R18 is respectively connected with one end of the resistor R44 and the port No. 2 of the chip U11, and the other end of the resistor R44 is grounded; the port 1 of the chip U11, the other ends of the capacitor C6 and the capacitor C58, and the negative electrodes of the capacitor C5 and the capacitor C14 are grounded; the port 1 of the interface J15 is divided into two paths, and one path is grounded; the other path is connected with one end of a capacitor C61, the other end of the capacitor C61 is respectively connected with a No. 2 port of an interface J15, one end of a resistor R48 and a No. 32 port of a microprocessor MCU chip U2, and the other end of the resistor R48 is connected with a power VCC port; The port 1 of the interface J16 is divided into two paths, and one path is grounded; the other path is connected with one end of a capacitor C60, the other end of the capacitor C60 is respectively connected with a No.2 port of an interface J16, one end of a resistor R47 and a No. 31 port of a microprocessor MCU chip U2, and the other end of the resistor R47 is connected with a power VCC port; the port 1 of the inductor SI4 is connected with one end of a resistor R70, the other end of the resistor R70 is respectively connected with one end of a resistor R57 and the collector of a triode Q2, the emitter of the triode Q2 is grounded, the base of the triode Q2 is connected with one end of a resistor R56, and the other end of the resistor R56 is connected with the port 21 of a microprocessor MCU chip U2; The other end of the resistor R57 is respectively connected with a No.2 port of the inductor SI4, the anode of the capacitor C66 and the cathode of the diode D34, and the cathode of the capacitor C66 is grounded; the port 3 of the inductor SI4 is connected with one end of a resistor R63, and the other end of the resistor R63 is connected with the port 2 of the U19; the anode of diode D34 is connected to the power supply VCC terminal.

The data storage module comprises a chip U4 and a chip U5, wherein the types of the chip U4 and the chip U5 are AT24C256, the ports from No. 1 to No. 4 of the chip U4 are grounded, the port from No. 5 of the chip U4 is connected with one end of a resistor R7, the port from No. 6 of the chip U4 is connected with one end of a resistor R6, the port from No. 7 of the chip U4 is connected with one end of a resistor R5, the other ends of the port from No. 8, the resistor R5, the resistor R6 and the resistor R7 of the chip U4 are divided into two paths, one path is connected with one end of a capacitor C12, the other end of the capacitor C12 is grounded, and the other path is connected with a power VCC end; the power VCC end is connected to the No. 1 port of chip U5, and the 2 # to 4 # port of chip U5 is grounded, and the No. 5 port of chip U5 is connected with the 47 # port of microprocessor MCU chip U2, and the No. 6 port of chip U5 is connected with the 46 # port of microprocessor MCU chip U2, and the No. 7 port of chip U5 is connected with the No. 7 port of chip U4, and the 8 # port of chip U5 divides two ways, connects capacitor C13's one end all the way, and capacitor C13's the other end ground connection, another way connection power VCC end.

The lightning protection and antistatic module comprises a chip U6, a chip U33 and a chip U27, wherein the model of the chip U6 is HM9226, the model of the chip U33 is CD74HC04, and the model of the chip U27 is WRF1212S-3WR2. The ports No. 1, no. 5 and No. 9 of the chip U6 are divided into three paths, the first path is grounded, the second path is connected with one end of a resistor R22, the third path is connected with one end of a capacitor C18 and one end of a capacitor C19, the other end of the resistor R22 is respectively connected with one end of a resistor D6, the other ends of the capacitor C18 and the capacitor C19, one ends of a resistor R23 and a resistor R24, the anodes of a diode D27 and a diode D29, the cathodes of the diode D27 and the diode D29 are combined and connected with the cathodes of a diode D228 and a diode D30, the anodes of the diode D228 and the diode D30 are divided into two paths, one path is grounded, the other path is respectively connected with the cathodes of a capacitor C69, a capacitor C68 and a capacitor C67, the other end of the capacitor C69 is connected with the anode of a diode D17, the cathode of the diode D17 is connected with one end of a resistor R58, and the other end of the resistor R58 is connected with the port No. 3 of the chip U27; the other ends of the resistor R23 and the resistor R24 are respectively connected with the anode of the capacitor C67 and one end of the inductor L4, and the other end of the inductor L4 is respectively connected with the anode of the capacitor C68 and the No. 2 port of the chip U27; the anode of the diode D6 is respectively connected with the No. 8 port of the chip U6 and one end of the inductor L3, the other end of the inductor L3 is respectively connected with the No. 3 port of the chip U6, one end of the capacitor C16 and one end of the capacitor C17, the anode of the capacitor C15 and the No. 8 port of the chip U6, and the other ends of the capacitor C16 and the capacitor C17 and the cathode of the capacitor C15 are grounded; the port No. 4 of the chip U6 is connected with one end of a resistor R20, and the other end of the resistor R20 is connected with the port No. 52 of the microprocessor MCU chip U2; the port 1 of the chip U33 is connected with the port 39 of the microprocessor MCU chip U2, the port 2 of the chip U33 is connected with the port 3 of the chip U33, the port 4 of the chip U33 is connected with the port 39 of the microprocessor MCU chip U2, the port 5 of the chip U33 is connected with the port 40 of the microprocessor MCU chip U2, the port 6 of the chip U33 is connected to the port 9 of the chip U33 through a network identifier SIGN1_IN, the port 7 of the chip U33 is grounded, the port 8 of the chip U33 is connected with the port 40 of the microprocessor MCU chip U2, the port 11 and the port 13 of the chip U33 are respectively grounded IN two paths, one path is connected with one end of the capacitor C57, and the other end of the capacitor C57 is connected with the port 14 of the chip U33; the port No. 1 of the chip U27 is grounded, the port No. 6 of the chip U27 is connected with the positive electrode of the capacitor C70, the negative electrode of the capacitor C70 is respectively connected with the port No. 7 of the chip U27 and the negative electrode of the capacitor C71, and the positive electrode of the capacitor C71 is connected with the port No. 8 of the chip U27.

Compared with the prior art, the invention provides a flowmeter system based on gas heat metering, which mainly has the technical core that the gas energy metering system consists of three core components of a heat value meter, a wireless remote-transmission flowmeter, a cloud platform and the like. The data can be collected more conveniently through the wireless network, and the method is quick and convenient.

Through the circuit design in the transformation calorific value appearance, make calorific value appearance possess short-range wireless and wireless teletransmission function, realize the wireless data interaction of calorific value appearance and cloud platform, make things convenient for the collection of data.

Drawings

FIG. 1 is a schematic diagram of a system connection according to the present invention.

FIG. 2 is a schematic diagram of the connection of the control modules in the heat value meter.

FIG. 3 is a flow chart of the system of the present invention.

Fig. 4 is a schematic diagram of a control circuit of the calorimeter.

FIG. 5 is a schematic diagram of the internal microprocessor circuit of the calorimeter.

FIG. 6 is a schematic circuit diagram of the internal communication module of the heat value meter.

FIG. 7 is a schematic circuit diagram of an internal power management module of the heat value instrument.

FIG. 8 is a schematic circuit diagram of the internal data storage module of the heat value instrument.

FIG. 9 is a schematic diagram of the lightning protection and static protection module inside the heat value meter.

Fig. 10 is a schematic circuit diagram of a remote transmission module in the heat value meter.

Referring to fig. 1,1 is a buffer tank, 2 is a calorific value meter, 3 is a remote heat transfer flow meter, 4 is a base station, 5 is a cloud server, 6 is a fuel gas main pipeline, and 7 is a branch pipeline.

Detailed Description

The invention is further described below with reference to the accompanying drawings.

As shown in fig. 1, the heat value instrument 2 is positioned at the output end of the gas main pipeline 6, the output end of the gas main pipeline 6 is connected with a plurality of branch pipelines 7, and the branch pipelines 7 are provided with a remote heat transfer flow meter 3; a buffer tank 1 is arranged on the gas main pipeline 6; the data signal output ends of the heat value meter 2 and the remote heat transfer flow meter 3 are connected with the signal input end of the base station 4 through a wireless data communication line, and the signal output end of the base station 4 is connected with the cloud server 5 through a public network.

The telemetering flowmeter 3 may be a telemetering diaphragm meter or an ultrasonic meter.

The remote heat transfer flow meter 3 and the heat value instrument 2 can be connected in a wired or short-distance wireless mode, and a heat value instrument 2 can be arranged on a pipeline on one side of each remote heat transfer flow meter 3 according to actual situation requirements.

As shown in fig. 2, the heat value meter 2 includes a communication module, a microprocessor MCU, a remote transmission module, a power management module, a data storage module, a lightning protection and antistatic module, wherein the microprocessor MCU is connected with the remote transmission module, the power management module, the data storage module, the lightning protection and antistatic module and the communication module through lines, and the communication module is connected with the base station 4 through a wireless data communication line.

As shown in fig. 3, the working method of the system of the present invention is as follows:

As shown in fig. 4 to 10, the microprocessor MCU includes a microprocessor MCU chip U2, a chip U1, an interface J6, and an interface J13, the model of the chip U1 is ADP1613, the model of the microprocessor MCU chip U2 is MSP430F5438, the 11-number port of the microprocessor MCU chip U2 is connected to a power VCC port and one end of a capacitor C20, respectively, and the other end of the capacitor C20 is grounded; the 12 # port of the microprocessor MCU chip U2 is grounded; the No. 13 port of the microprocessor MCU chip U2 is connected with the No. 1 port of the low-frequency crystal oscillator Y2; the No. 14 port of the microprocessor MCU chip U2 is connected with the No. 4 port of the low-frequency crystal oscillator Y2; The 15 # port of the microprocessor MCU chip U2 is grounded; the 16 # port of the microprocessor MCU chip U2 is respectively connected with a power VCC port and one end of a capacitor C21, and the other end of the capacitor C21 is grounded; the No. 37 port of the MCU chip U2 is grounded; the No. 38 port of the MCU chip U2 is respectively connected with the VCC port of the power supply and one end of the capacitor C22, and the other end of the capacitor C22 is grounded; the 48 # port of the MCU chip U2 is respectively connected with the 2 # port of the interface J13 and one end of the resistor R55, and the other end of the resistor R55 is connected with the power VCC; the port 1 of the interface J13 is grounded; the No. 62 port of the microprocessor MCU chip U2 is connected with one end of a capacitor C23, and the other end of the capacitor C23 is grounded; the No. 63 port of the MCU chip U2 is grounded; the No. 64 port of the MCU chip U2 is respectively connected with the power VCC port and one end of the capacitor C24, and the other end of the capacitor C24 is grounded; the 87 # port of the microprocessor MCU chip U2 is connected with a power VCC port; the 88 number port of the microprocessor MCU chip U2 is grounded; the port 1 of the high-speed crystal oscillator Y1 is connected with one end of a capacitor C2, the port 2 of the high-speed crystal oscillator Y1 is connected with one end of the capacitor C1, and the other ends of the capacitor C1 and the capacitor C2 are grounded; The port 1 of the interface J6 is respectively connected with the port 22 of the microprocessor MCU chip U2 and one end of the resistor R4, and the other end of the resistor R4 is connected with the power VCC port; the port No. 2 of the interface J6 is connected with the port No. 73 of the microprocessor MCU chip U2; the port No. 3 of the interface J6 is connected with the port No. 72 of the microprocessor MCU chip U2; the port No. 4 of the interface J6 is grounded; the port 1 of the interface J1 is respectively connected with one end of a resistor R2 and a power VCC port, the other end of the resistor R2 is respectively connected with the port 3 of the interface J1 and one end of a key switch S1, and the other end of the key switch S1 is grounded; The port No. 2 of the interface J1 is connected with the port No. 91 of the microprocessor MCU chip U2; the port No. 4 of the interface J1 is grounded; the No. 9 port of the microprocessor MCU chip U2 is connected with the anode of the photodiode LED1, the cathode of the photodiode LED1 is connected with one end of a resistor R41, and the other end of the resistor R41 is grounded; the No.8 port of the microprocessor MCU chip U2 is connected with the anode of the photodiode LED2, the cathode of the photodiode LED2 is connected with one end of the resistor R42, and the other end of the resistor R42 is grounded; the port 1 of the chip U1 is connected with one end of a resistor R29, the other end of the resistor R29 is connected with one end of a capacitor C27, the other end of the capacitor C27 is respectively connected with the port 4 of the chip U1, one end of a resistor R66, one end of a capacitor C28, one end of a capacitor C29 and one end of a capacitor C30 and one end of a resistor R28, and the other end of the capacitor C28 is connected with the port 8 of the chip U1; The other end of the resistor R66 is grounded; the port No. 6 and the port No. 7 of the chip U1 are combined and connected with one end of the inductor L2, the other end of the capacitor C29 and one end of the resistor R64, and the other end of the resistor R64 is connected with the port No. 2 of the chip U11; the other end of the inductor L2 is respectively connected with the No. 5 port of the chip U1 and the anode of the diode D7, and the cathode of the diode D7 is respectively connected with one end of the resistor R27, the other end of the capacitor C30 and one end of the resistor R65, and the other end of the resistor R65 is connected with the No. 8 port of the chip U6; the other ends of the resistor R27 and the resistor R28 are connected with a No. 2 port of the chip U1; the port No. 3 of the chip U1 is connected with one end of a resistor R19, and the other end of the resistor R19 is connected with the port No. 52 of the microprocessor MCU chip U2.

The communication module comprises a chip U9, a chip U12, a chip U14, a chip U23, a chip U24, a chip U26 and an interface J3, wherein the model of the chip U9 is MAX488SE, the model of the chip U12 is TD501D485, the model of the chip U14 is DS1302, the model of the chip U23 is B8279S0, the model of the chip U24 is GDT2026-15-C2, and the model of the chip U26 is B0505LS-1W. The port 1 of the chip U12 is respectively connected with one end of the capacitor C37, the positive electrode of the capacitor C36 and the port 8 of the chip U6, and the port 2 of the chip U12, the other end of the capacitor C37 and the negative electrode of the capacitor C36 are grounded; The port No. 5 of the chip U12 is connected with the port No. 6 of the microprocessor MCU chip U2; the port No. 8 of the chip U12 is respectively connected with the cathode of the voltage stabilizing diode TVS2, the anode of the voltage stabilizing diode TVS3, the port No. 1 of the chip U23 and one end of the resistor R53, the anode of the voltage stabilizing diode TVS2 is respectively connected with the port No. 10 of the chip U12, the anode of the voltage stabilizing diode TVS1, one end of the resistor R59 and one end of the capacitor C40, and the other ends of the resistor R59 and the capacitor C40 are respectively connected with the port No. 1 of the chip U24 and the ground; the port 9 of the chip U12 is respectively connected with the cathode of the voltage stabilizing diode TVS1, the cathode of the voltage stabilizing diode TVS3, the port 3 of the chip U23 and one end of the resistor R54, and the port 4 of the chip U23 is respectively connected with the port 2 of the chip U24, one end of the resistor R49 and the port 2 of the interface J3; The other end of the resistor R53 and the port No. 2 of the chip U23 are respectively connected with the port No. 3 of the chip U24, the other end of the resistor R49 and the port No. 1 of the interface J3; the port 3 of the interface J3 is connected with one end of a resistor R67, and the other end of the resistor R67 is grounded; the port 4 of the interface J3 is connected with one end of a resistor R68, and the other end of the resistor R68 is connected with the port 8 of the chip U6; the port 5 of the interface J3 is connected with the port 3 of the chip U26, and the port 2 of the chip U26 is grounded; the port 6 of the interface J3 is connected with the port 4 of the chip U26, and the port 1 of the chip U26 is connected with the port 8 of the chip U6; The No. 11 port of the chip U26 is connected with the No. 31 port of the microprocessor MCU chip U2; the No. 11 port of the chip U26 is connected with the No. 32 port of the microprocessor MCU chip U2; the port No. 1 of the chip U14 is connected with the port No. 39 of the microprocessor MCU chip U2; the port No. 2 of the chip U14 is grounded; the ports No. 3 and No. 6 of the chip U14 are connected with one end of a capacitor C59, and the other end of the capacitor C59 is grounded; the port No. 4 of the chip U14 is connected with the port No. 39 of the microprocessor MCU chip U2; the port No. 5 of the chip U14 is connected with the port No. 40 of the microprocessor MCU chip U2; The port 7 of the chip U14 is connected with one end of a capacitor C51, and the other end of the capacitor C51 is grounded; the No. 8 port of the chip U14 is connected with the No. 40 port of the microprocessor MCU chip U2; the port 1 of the chip U9 is connected with one end of a capacitor C11, and the other end of the capacitor C11 is grounded; the port 1 of the chip U9 is connected with one end of a resistor R60, and the other end of the resistor R60 is connected with the port 39 of the microprocessor MCU chip U2; the port No. 3 of the chip U9 is connected with one end of a resistor R61, and the other end of the resistor R61 is connected with the port No. 40 of the microprocessor MCU chip U2; the port No. 4 of the chip U9 is grounded; The port 5 of the chip U9 is respectively connected with one ends of a resistor R36 and a resistor R46, the other end of the resistor R36 is respectively connected with the anodes of a diode D8, a diode D9 and a voltage stabilizing diode TVS4, the cathodes of the diode D8 and the diode D9 are connected with the cathodes of a diode D10 and a diode D11, the anodes of the diode D10 and the diode D11 and the other end of the resistor R46 are combined and respectively connected with the port 6 of the chip U9 and one end of a resistor R35, and the other end of the resistor R35 is connected with the cathode of the voltage stabilizing diode TVS 4; the port 7 of the chip U9 is respectively connected with one ends of a resistor R45 and a resistor R34 and anodes of a diode D12 and a diode D13, cathodes of the diode D12 and the diode D13 are connected with cathodes of a diode D14 and a diode D15, anodes of the diode D14 and the diode D15 are respectively connected with one end of a resistor R32 and a cathode of a voltage stabilizing diode TVS5, an anode of the voltage stabilizing diode TVS5 is connected with the other end of the resistor R34, and the other end of the resistor R32 is respectively connected with the other end of the resistor R45 and the port 8 of the chip U9; the port 1 of the interface J3 is connected with the port B of the heat value instrument (2), and the port 2 of the interface J3 is connected with the port A of the heat value instrument (2).

The data storage module comprises a chip U4 and a chip U5, wherein the types of the chip U4 and the chip U5 are AT24C256, the No. 1 to No. 4 ports of the chip U4 are grounded, the No. 5 port of the chip U4 is connected with one end of a resistor R7, the No. 6 port of the chip U4 is connected with one end of a resistor R6, the No. 7 port of the chip U4 is connected with one end of the resistor R5, the other ends of the No. 8 port of the chip U4, the resistor R5, the resistor R6 and the resistor R7 are divided into two paths, one path is connected with one end of a capacitor C12, the other end of the capacitor C12 is grounded, and the other path is connected with a power VCC end; the power VCC end is connected to the No. 1 port of chip U5, and the 2 # to 4 # port of chip U5 is grounded, and the No. 5 port of chip U5 is connected with the 47 # port of microprocessor MCU chip U2, and the No. 6 port of chip U5 is connected with the 46 # port of microprocessor MCU chip U2, and the No. 7 port of chip U5 is connected with the No. 7 port of chip U4, and the 8 # port of chip U5 divides two ways, connects capacitor C13's one end all the way, and capacitor C13's the other end ground connection, another way connection power VCC end.

The lightning protection and static prevention module comprises a chip U6, a chip U33 and a chip U27, wherein the model of the chip U6 is HM9226, the model of the chip U33 is CD74HC04, and the model of the chip U27 is WRF1212S-3WR2. The ports No. 1, no. 5 and No. 9 of the chip U6 are divided into three paths, the first path is grounded, the second path is connected with one end of a resistor R22, the third path is connected with one end of a capacitor C18 and one end of a capacitor C19, the other end of the resistor R22 is respectively connected with one end of a resistor D6, the other ends of the capacitor C18 and the capacitor C19, one ends of a resistor R23 and a resistor R24, the anodes of a diode D27 and a diode D29, the cathodes of the diode D27 and the diode D29 are combined and connected with the cathodes of a diode D228 and a diode D30, the anodes of the diode D228 and the diode D30 are divided into two paths, one path is grounded, the other path is respectively connected with the cathodes of a capacitor C69, a capacitor C68 and a capacitor C67, the other end of the capacitor C69 is connected with the anode of a diode D17, the cathode of the diode D17 is connected with one end of a resistor R58, and the other end of the resistor R58 is connected with the port No. 3 of the chip U27; the other ends of the resistor R23 and the resistor R24 are respectively connected with the anode of the capacitor C67 and one end of the inductor L4, and the other end of the inductor L4 is respectively connected with the anode of the capacitor C68 and the No. 2 port of the chip U27; the anode of the diode D6 is respectively connected with the No. 8 port of the chip U6 and one end of the inductor L3, the other end of the inductor L3 is respectively connected with the No. 3 port of the chip U6, one end of the capacitor C16 and one end of the capacitor C17, the anode of the capacitor C15 and the No. 8 port of the chip U6, and the other ends of the capacitor C16 and the capacitor C17 and the cathode of the capacitor C15 are grounded; the port No. 4 of the chip U6 is connected with one end of a resistor R20, and the other end of the resistor R20 is connected with the port No. 52 of the microprocessor MCU chip U2; the port 1 of the chip U33 is connected with the port 39 of the microprocessor MCU chip U2, the port 2 of the chip U33 is connected with the port 3 of the chip U33, the port 4 of the chip U33 is connected with the port 39 of the microprocessor MCU chip U2, the port 5 of the chip U33 is connected with the port 40 of the microprocessor MCU chip U2, the port 6 of the chip U33 is connected to the port 9 of the chip U33 through a network identifier SIGN1_IN, the port 7 of the chip U33 is grounded, the port 8 of the chip U33 is connected with the port 40 of the microprocessor MCU chip U2, the port 11 and the port 13 of the chip U33 are respectively grounded IN two paths, one path is connected with one end of the capacitor C57, and the other end of the capacitor C57 is connected with the port 14 of the chip U33; the port No. 1 of the chip U27 is grounded, the port No. 6 of the chip U27 is connected with the positive electrode of the capacitor C70, the negative electrode of the capacitor C70 is respectively connected with the port No. 7 of the chip U27 and the negative electrode of the capacitor C71, and the positive electrode of the capacitor C71 is connected with the port No. 8 of the chip U27.

The basic working principle is as follows: the power management module obtains power from an external or internal lithium battery, then reduces the power to a certain value and provides the power to the microprocessor MCU, the microprocessor MCU starts the communication module to obtain data in the flowmeter in a wired mode (two-wire 485 communication or 4-wire 422 communication), such as pressure, temperature, flow rate, volume and the like, the data are stored in the data storage module by the microprocessor MCU, the remote transmission module is started after the proper time comes, and finally, the data are transmitted to the cloud platform or the server in a wireless remote transmission mode through the existing mobile network (mobile, communication or telecommunication GSM, CDMA and the like), and the cloud platform or the server performs statistics, analysis and the like on the received data, which is the basic principle of a circuit.

The remote heat value instrument consists of a heat value instrument and a DTU remote transmission module, and is directly connected with the mains supply and used for detecting heat value data of pipeline gas; the DTU remote transmission module is used for carrying out wireless communication with the cloud platform, uploading the heat value data detected by the heat value instrument to the cloud platform, and acquiring related instructions issued by the cloud platform.

The DTU power management module obtains power from an external or internal lithium battery, then reduces the power to a certain value and provides the power for the microprocessor, the microprocessor starts the communication module to obtain data of the heat value instrument, such as heat value data, white number and the like, the data are stored in the data storage module by the microprocessor, the remote transmission module is started after the proper time comes, and finally the data are transmitted to the cloud platform or the server in a wireless remote transmission mode through the existing mobile network (mobile, communication or GSM, CDMA and the like), and the cloud platform or the server performs statistics, analysis and the like on the received data.

Claims

1. The utility model provides a flowmeter system based on gas heat measurement, includes calorific value appearance, gas main pipeline, far away heat transfer volume flowmeter, buffer tank, basic station, cloud server, its characterized in that: the heat value instrument (2) is positioned at the output end of the gas main pipeline (6), the output end of the gas main pipeline (6) is connected with a plurality of branch pipelines (7), and a remote heat transfer flow meter (3) is arranged on the branch pipelines (7); a buffer tank (1) is arranged on the gas main pipeline (6); the data signal output ends of the heat value instrument (2) and the remote heat transfer flow meter (3) are connected with the signal input end of the base station (4) through a wireless data communication line, and the signal output end of the base station (4) is connected with the cloud server (5) through a public network; the heat value instrument (2) comprises a communication module, a microprocessor MCU, a remote transmission module, a power management module, a data storage module and a lightning protection and antistatic module, wherein the microprocessor MCU is respectively connected with the remote transmission module, the power management module, the data storage module, the lightning protection and antistatic module and the communication module through lines, and the communication module is connected with the base station (4) through a wireless data communication line;

The microprocessor MCU comprises a microprocessor MCU chip U2, a chip U1, an interface J6 and an interface J13, wherein the model of the chip U1 is ADP1613, the model of the microprocessor MCU chip U2 is MSP430F5438, the 11 # port of the microprocessor MCU chip U2 is respectively connected with a power VCC port and one end of a capacitor C20, and the other end of the capacitor C20 is grounded; the 12 # port of the microprocessor MCU chip U2 is grounded; the No. 13 port of the microprocessor MCU chip U2 is connected with the No.1 port of the low-frequency crystal oscillator Y2; the No. 14 port of the microprocessor MCU chip U2 is connected with the No. 4 port of the low-frequency crystal oscillator Y2; the 15 # port of the microprocessor MCU chip U2 is grounded; the 16 # port of the microprocessor MCU chip U2 is respectively connected with a power VCC port and one end of a capacitor C21, and the other end of the capacitor C21 is grounded; the No. 37 port of the MCU chip U2 is grounded; the No. 38 port of the MCU chip U2 is respectively connected with the VCC port of the power supply and one end of the capacitor C22, and the other end of the capacitor C22 is grounded; the 48 # port of the MCU chip U2 is respectively connected with the 2 # port of the interface J13 and one end of the resistor R55, and the other end of the resistor R55 is connected with the power VCC; the port 1 of the interface J13 is grounded; the No. 62 port of the microprocessor MCU chip U2 is connected with one end of a capacitor C23, and the other end of the capacitor C23 is grounded; the No. 63 port of the MCU chip U2 is grounded; the No. 64 port of the MCU chip U2 is respectively connected with the power VCC port and one end of the capacitor C24, and the other end of the capacitor C24 is grounded; the 87 # port of the microprocessor MCU chip U2 is connected with a power VCC port; the 88 number port of the microprocessor MCU chip U2 is grounded;

the port 1 of the high-speed crystal oscillator Y1 is connected with one end of a capacitor C2, the port 2 of the high-speed crystal oscillator Y1 is connected with one end of the capacitor C1, and the other ends of the capacitor C1 and the capacitor C2 are grounded;

The port 1 of the interface J6 is respectively connected with the port 22 of the microprocessor MCU chip U2 and one end of the resistor R4, and the other end of the resistor R4 is connected with the power VCC port; the port No. 2 of the interface J6 is connected with the port No. 73 of the microprocessor MCU chip U2; the port No. 3 of the interface J6 is connected with the port No. 72 of the microprocessor MCU chip U2; the port No. 4 of the interface J6 is grounded;

The port 1 of the interface J1 is respectively connected with one end of a resistor R2 and a power VCC port, the other end of the resistor R2 is respectively connected with the port 3 of the interface J1 and one end of a key switch S1, and the other end of the key switch S1 is grounded; the port No. 2 of the interface J1 is connected with the port No. 91 of the microprocessor MCU chip U2; the port No. 4 of the interface J1 is grounded; the No. 9 port of the microprocessor MCU chip U2 is connected with the anode of the photodiode LED1, the cathode of the photodiode LED1 is connected with one end of a resistor R41, and the other end of the resistor R41 is grounded;

the No. 8 port of the microprocessor MCU chip U2 is connected with the anode of the photodiode LED2, the cathode of the photodiode LED2 is connected with one end of the resistor R42, and the other end of the resistor R42 is grounded;

The port 1 of the chip U1 is connected with one end of a resistor R29, the other end of the resistor R29 is connected with one end of a capacitor C27, the other end of the capacitor C27 is respectively connected with the port 4 of the chip U1, one end of a resistor R66, one end of a capacitor C28, one end of a capacitor C29 and one end of a capacitor C30 and one end of a resistor R28, and the other end of the capacitor C28 is connected with the port 8 of the chip U1; the other end of the resistor R66 is grounded; the port No. 6 and the port No. 7 of the chip U1 are combined and connected with one end of the inductor L2, the other end of the capacitor C29 and one end of the resistor R64, and the other end of the resistor R64 is connected with the port No.2 of the chip U11; the other end of the inductor L2 is respectively connected with the No. 5 port of the chip U1 and the anode of the diode D7, and the cathode of the diode D7 is respectively connected with one end of the resistor R27, the other end of the capacitor C30 and one end of the resistor R65, and the other end of the resistor R65 is connected with the No. 8 port of the chip U6; the other ends of the resistor R27 and the resistor R28 are connected with a No.2 port of the chip U1; the port No. 3 of the chip U1 is connected with one end of a resistor R19, and the other end of the resistor R19 is connected with the port No. 52 of the microprocessor MCU chip U2;

The communication module comprises a chip U9, a chip U12, a chip U14, a chip U23, a chip U24, a chip U26 and an interface J3, wherein the model of the chip U9 is MAX488SE, the model of the chip U12 is TD501D485, the model of the chip U14 is DS1302, the model of the chip U23 is B8279S0, the model of the chip U24 is GDT2026-15-C2, and the model of the chip U26 is B0505LS-1W; the port 1 of the chip U12 is respectively connected with one end of the capacitor C37, the positive electrode of the capacitor C36 and the port 8 of the chip U6, and the port 2 of the chip U12, the other end of the capacitor C37 and the negative electrode of the capacitor C36 are grounded; the port No. 5 of the chip U12 is connected with the port No. 6 of the microprocessor MCU chip U2; the port No. 8 of the chip U12 is respectively connected with the cathode of the voltage stabilizing diode TVS2, the anode of the voltage stabilizing diode TVS3, the port No. 1 of the chip U23 and one end of the resistor R53, the anode of the voltage stabilizing diode TVS2 is respectively connected with the port No. 10 of the chip U12, the anode of the voltage stabilizing diode TVS1, one end of the resistor R59 and one end of the capacitor C40, and the other ends of the resistor R59 and the capacitor C40 are respectively connected with the port No. 1 of the chip U24 and the ground; the port 9 of the chip U12 is respectively connected with the cathode of the voltage stabilizing diode TVS1, the cathode of the voltage stabilizing diode TVS3, the port 3 of the chip U23 and one end of the resistor R54, and the port 4 of the chip U23 is respectively connected with the port 2 of the chip U24, one end of the resistor R49 and the port 2 of the interface J3; the other end of the resistor R53 and the port No. 2 of the chip U23 are respectively connected with the port No. 3 of the chip U24, the other end of the resistor R49 and the port No. 1 of the interface J3; the port 3 of the interface J3 is connected with one end of a resistor R67, and the other end of the resistor R67 is grounded; the port 4 of the interface J3 is connected with one end of a resistor R68, and the other end of the resistor R68 is connected with the port 8 of the chip U6; the port 5 of the interface J3 is connected with the port 3 of the chip U26, and the port 2 of the chip U26 is grounded; the port 6 of the interface J3 is connected with the port 4 of the chip U26, and the port 1 of the chip U26 is connected with the port 8 of the chip U6; the No. 11 port of the chip U26 is connected with the No. 31 port of the microprocessor MCU chip U2; the No. 11 port of the chip U26 is connected with the No. 32 port of the microprocessor MCU chip U2;

The port No. 1 of the chip U14 is connected with the port No. 39 of the microprocessor MCU chip U2; the port No.2 of the chip U14 is grounded; the ports No. 3 and No. 6 of the chip U14 are connected with one end of a capacitor C59, and the other end of the capacitor C59 is grounded; the port No. 4 of the chip U14 is connected with the port No. 39 of the microprocessor MCU chip U2; the port No. 5 of the chip U14 is connected with the port No. 40 of the microprocessor MCU chip U2; the port 7 of the chip U14 is connected with one end of a capacitor C51, and the other end of the capacitor C51 is grounded; the No. 8 port of the chip U14 is connected with the No. 40 port of the microprocessor MCU chip U2;

The port 1 of the chip U9 is connected with one end of a capacitor C11, and the other end of the capacitor C11 is grounded; the port 1 of the chip U9 is connected with one end of a resistor R60, and the other end of the resistor R60 is connected with the port 39 of the microprocessor MCU chip U2; the port No. 3 of the chip U9 is connected with one end of a resistor R61, and the other end of the resistor R61 is connected with the port No. 40 of the microprocessor MCU chip U2; the port No. 4 of the chip U9 is grounded; the port 5 of the chip U9 is respectively connected with one ends of a resistor R36 and a resistor R46, the other end of the resistor R36 is respectively connected with the anodes of a diode D8, a diode D9 and a voltage stabilizing diode TVS4, the cathodes of the diode D8 and the diode D9 are connected with the cathodes of a diode D10 and a diode D11, the anodes of the diode D10 and the diode D11 and the other end of the resistor R46 are combined and respectively connected with the port 6 of the chip U9 and one end of a resistor R35, and the other end of the resistor R35 is connected with the cathode of the voltage stabilizing diode TVS 4; the port 7 of the chip U9 is respectively connected with one ends of a resistor R45 and a resistor R34 and anodes of a diode D12 and a diode D13, cathodes of the diode D12 and the diode D13 are connected with cathodes of a diode D14 and a diode D15, anodes of the diode D14 and the diode D15 are respectively connected with one end of a resistor R32 and a cathode of a voltage stabilizing diode TVS5, an anode of the voltage stabilizing diode TVS5 is connected with the other end of the resistor R34, and the other end of the resistor R32 is respectively connected with the other end of the resistor R45 and the port 8 of the chip U9; the port 1 of the interface J3 is connected with the port B of the heat value instrument (2), and the port 2 of the interface J3 is connected with the port A of the heat value instrument (2);

The remote transmission module comprises a remote transmission module chip U1, an interface J10, an interface J11, an interface J12, an interface J14 and an interface J17, wherein the model of the chip U1 is SIM800A; the No. 2 port of the remote transmission module chip U1 is grounded; the No. 7 port of the remote transmission module chip U1 is connected with the No. 8 port; the No. 9 port of the remote transmission module chip U1 is connected with one end of a resistor R5, and the other end of the resistor R5 is connected with the No. 54 port of the microprocessor MCU chip U2; the 10 # port of the remote transmission module chip U1 is respectively connected with one end of a resistor R6 and one end of a resistor R7, the other end of the resistor R6 is connected with the 53 # port of the microprocessor MCU chip U2, and the other end of the resistor R7 is grounded; the No. 15 port of the remote transmission module chip U1 is connected with one end of a capacitor C5, and the other end of the capacitor C5 is grounded; the 17 # and 18 # ports of the remote transmission module chip U1 are grounded; the No. 26 port of the remote transmission module chip U1 is connected with one end of the capacitor C6, the other end of the capacitor C6 and the No. 29 port of the remote transmission module chip U1 are connected with the ground; the No. 34 port of the remote transmission module chip U1 is connected with one end of a resistor R19, and the other end of the resistor R19 is grounded; the ports of No. 39, no. 45 and No. 46 of the remote transmission module chip U1 are grounded; the 52 # port of the remote transmission module chip U1 is connected with one end of a resistor R9, the other end of the resistor R9 is connected with the base electrode of a triode Q1, the emitter electrode of the triode Q1 is grounded, the collector electrode of the triode Q1 is connected with one end of a resistor R8, the other end of the resistor R8 is connected with the cathode of a light emitting diode LED1, and the anode of the light emitting diode LED1 is connected with the 55 # port, the 56 # port and the 57 # port of the remote transmission module chip U1; the port No. 58 and the port No. 59 of the remote transmission module chip U1 are grounded; the 60 # port of the remote transmission module chip U1 is connected with the 1 # port of the antenna interface A1, and the 2 # to 5 # ports of the antenna interface A1 are grounded; the 61 to 65 ports of the remote transmission module chip U1 are grounded;

The ports of the No. 55, no. 56 and No. 57 of the remote transmission module chip U1 are connected with the positive electrode of the capacitor C1, one end of the capacitor C2, the capacitor C3 and one end of the capacitor C4, and the negative electrode of the capacitor C1, the other end of the capacitor C2, the capacitor C3 and the other end of the capacitor C4 are connected with the ground;

The ports 1 and 2 of the interfaces J17 and J10 are grounded;

The port 1 of the interface J11 is grounded; the port 2 of the interface J11 is connected with one end of a resistor R50, and the other end of the resistor R50 is connected with a power VCC port;

the port 1 of the interface J12 is grounded; the port 2 of the interface J12 is connected with one end of a resistor R51, and the other end of the resistor R51 is connected with a power VCC port;

The ports from No. 1 to No. 4 of the interface J14 are connected with the ports No. 55, no. 56 and No. 57 of the remote transmission module chip U1; the ports 5 to 8 of the interface J14 are grounded; the port 9 of the interface J14 is connected with the port 1 of the remote transmission module chip U1; the port 10 of the interface J14 is respectively connected with one end of a capacitor C25, the collector of a triode Q13 and the port 1 of a chip U1, the emitter of the triode Q13 is divided into two paths, one path is combined with the other end of the capacitor C25 and grounded, the other path is connected with one end of a resistor R38, the other end of the resistor R38 is respectively connected with the base of the triode Q13 and one end of a resistor R37, and the other end of the resistor R37 is connected with the port 23 of a microprocessor MCU chip U2; the No. 11 port of the interface J14 is connected with the No. 16 port of the remote transmission module chip U1; the 12 # port of the interface J14 is respectively connected with one end of a capacitor C26, the collector of a triode Q14 and the 16 # port of a chip U1, the emitter of the triode Q14 is divided into two paths, one path is combined with the other end of the capacitor C26 and grounded, the other path is connected with one end of a resistor R31, the other end of the resistor R31 is respectively connected with the base of the triode Q14 and one end of a resistor R30, and the other end of the resistor R30 is connected with the 1 # port of a microprocessor MCU chip U2; the No. 13 port of the interface J14 is connected with the No. 24 port of the microprocessor MCU chip U2; the No. 15 port of the interface J14 is connected with the No. 75 port of the microprocessor MCU chip U2; the 17 # port of the interface J14 is grounded; the 18 # port of the interface J14 is connected with a power VCC port; the 19 # port of the interface J14 is connected with the 54 # port of the microprocessor MCU chip U2; the port 20 of the interface J14 is connected with the port 53 of the microprocessor MCU chip U2;

The power management module comprises a chip U1, a chip U3, a chip U7, a chip U11, a chip U19, a chip U20, an interface J2, an interface J5, an interface J15 and an interface J16, wherein the model of the chip U1 is ADP1613, the model of the chip U3 is HM7333PR, the model of the chip U7 is LM2596S-12, the model of the chip U11 is AMS1117-5.0, the model of the chip U19 is SPX29302, and the model of the chip U20 is LTC4412HV; the port 1 of the chip U1 is connected with one end of a resistor R29, the other end of the resistor R29 is connected with one end of a capacitor C27, the other end of the capacitor C27 is respectively connected with the port 4 of the chip U1, a capacitor C28, one ends of the capacitor C29 and the capacitor C30, a resistor R66 and one end of the resistor R28, the other end of the capacitor C28 is connected with the port 8 of the chip U1, the other end of the resistor R66 is grounded, the other end of the capacitor C29 is respectively connected with one end of an inductor L2, the ports 6 and 7 of the chip U1 and one end of a resistor R64, and the other end of the resistor R64 is connected with the port 8 of the chip U6; the port 2 of the chip U1 is connected with one end of a resistor R27 and the other end of a resistor R28 respectively, the other end of the resistor R27 is connected with the cathode of a diode D7, the other end of a capacitor C30 and one end of a resistor R65 respectively, the other end of the resistor R65 is connected with the port 8 of the chip U6, and the anode of the diode D7 is connected with the port 5 of the chip U1 and the other end of an inductor L2 respectively;

the port 1 of the chip U7 is respectively connected with one end of a capacitor C62 and a capacitor C63, the anode of a capacitor C3, the cathode of a diode D19, the anode of a diode D31, one end of a resistor R80 and the port 1 of a power tube SI2, the cathode of the capacitor C3, the other end of the capacitor C62 and the capacitor C63 and the port 6 of the chip U7 are combined into seven paths, the first path is grounded, the second path is connected with the port 3 of the chip U7, the third path is connected with the port 5 of the chip U7, the fourth path is connected with the anode of a diode D5, the fifth path is connected with the cathode of a capacitor C4, the sixth path is connected with one end of a capacitor C64, the seventh path is connected with one end of a capacitor C65, the other ends of the capacitor C64 and the capacitor C65 are respectively connected with the port 4 of the chip U7, one end of an inductor L1 and the anode of the capacitor C4, and the other end of the inductor L1 is respectively connected with the port 2 of the chip U7 and the cathode of the diode D5; the anode of the diode D19 is connected with the No.1 port of the interface J5, and the No.2 port of the interface J5 is grounded;

the port No. 2 and the port No. 3 of the chip U20 are grounded; the port No. 4 of the chip U20 is respectively connected with one end of a resistor R14 and the port No. 25 of the microprocessor MCU chip U2, and the other end of the resistor R14 is connected with a power VCC end; the port No. 5 of the chip U20 is connected with the port No. 1 of the power tube SI1, the port No. 2 of the power tube SI1 is respectively connected with one end of the resistor R69, the cathode of the diode D18 and the port No. 2 of the power tube SI2, and the port No. 3 of the power tube SI2 is connected with the cathode of the diode D31; the other end of the resistor R80D is grounded; the anode of the diode D18 is connected with the No. 1 port of the interface J2, and the No. 2 port of the interface J2 is grounded; the other end of the resistor R69 is connected with one end of the resistor R71, and the other end of the resistor R71 is grounded; the No. 6 port of the chip U20 is divided into 9 paths, the first path is connected with the cathode of the diode D2, and the anode of the diode D2 is connected with a 12V direct current power supply; the second path is connected with the positive electrode of the capacitor C53, and the negative electrode of the capacitor C53 is grounded; the third path is connected with the anode of the diode D3; the fourth path is connected with the anode of the capacitor C7; the fifth path is connected with one end of a capacitor C8, and the negative electrode of the capacitor C7 and the other end of the capacitor C8 are grounded; the sixth path is connected with the No. 2 port of the chip U3; the seventh path is connected with the anode of the diode D16; the eighth path is connected with the emitter of the triode Q10; the ninth path is connected with one end of a resistor R52, the other end of the resistor R52 is respectively connected with one end of a resistor R26 and the collector of a triode Q9, the emitter of the triode Q9 is grounded, and the other end of a base electrode connecting resistor R25 of the triode Q9 is connected with the 21 # port of a microprocessor MCU chip U2; the other end of the resistor R26 is connected with the base electrode of the triode Q10, the collector electrode of the triode Q10 is connected with the anode of the diode D1, and the cathode of the diode D1 is respectively connected with the cathode of the diode D16, the anode of the capacitor C42, one end of the capacitor C43 and the No. 2 port of the chip U19; the negative electrode of the capacitor C42 and the other end of the capacitor C43 are respectively connected with the No. 6 port and the No. 3 port of the chip U19 in 8 paths; the third path is grounded; one end of the fourth path connecting resistor R10; the fifth path is connected with one end of the capacitor C44; the sixth path is connected with the cathode of the capacitor C45; the seventh path is connected with the cathode of the light emitting diode LED 4; an eighth path is connected with the cathode of the capacitor C46; the other end of the resistor R10 is respectively connected with the No. 5 port of the chip U19 and one end of the resistor R9; the anode of the light-emitting diode LED4 is connected with one end of a resistor R8, the other end of the resistor R8, the positive poles of a capacitor C45 and a capacitor C46, the other ends of a capacitor C44 and a resistor R9 are combined and connected with a number 4 port of a chip U19;

The port 1 of the chip U3 is grounded; the port No. 3 of the chip U3 is divided into 3 paths, and the first path is connected with one end of the capacitor C9; the second path is connected with a power VCC end; the third path is connected with the anode of the capacitor C10; the negative electrode of the capacitor C10 and the other end of the capacitor C9 are grounded;

The port No. 3 of the chip U11 is respectively connected with one end of a capacitor C6, the anode of a capacitor C5 and the cathode of a diode D4, the anode of the diode D4 is connected with the port No. 3 of a power SI3, and the port No.2 of the power SI3 is respectively connected with the cathode of the diode D3 and one end of a resistor R15; the port 1 of the power tube SI3 is connected with one end of a resistor R16, the other ends of the resistor R15 and the resistor R16 are connected with the collector of a triode Q18 in a combined mode, the emitter of the triode Q18 is grounded, the base of the triode Q18 is connected with one end of a resistor R17, and the other end of the resistor R17 is connected with the port 51 of a microprocessor MCU chip U2; the port No.2 of the chip U11 is respectively connected with one end of the capacitor C58, the positive electrode of the capacitor C14, one end of the resistor R18 and the port No. 8 of the chip U6, the other end of the resistor R18 is respectively connected with one end of the resistor R44 and the port No.2 of the chip U11, and the other end of the resistor R44 is grounded; the port 1 of the chip U11, the other ends of the capacitor C6 and the capacitor C58, and the negative electrodes of the capacitor C5 and the capacitor C14 are grounded; the port 1 of the interface J15 is divided into two paths, and one path is grounded; the other path is connected with one end of a capacitor C61, the other end of the capacitor C61 is respectively connected with a No.2 port of an interface J15, one end of a resistor R48 and a No. 32 port of a microprocessor MCU chip U2, and the other end of the resistor R48 is connected with a power VCC port;

The port 1 of the interface J16 is divided into two paths, and one path is grounded; the other path is connected with one end of a capacitor C60, the other end of the capacitor C60 is respectively connected with a No. 2 port of an interface J16, one end of a resistor R47 and a No. 31 port of a microprocessor MCU chip U2, and the other end of the resistor R47 is connected with a power VCC port;

The port 1 of the inductor SI4 is connected with one end of a resistor R70, the other end of the resistor R70 is respectively connected with one end of a resistor R57 and the collector of a triode Q2, the emitter of the triode Q2 is grounded, the base of the triode Q2 is connected with one end of a resistor R56, and the other end of the resistor R56 is connected with the port 21 of a microprocessor MCU chip U2; the other end of the resistor R57 is respectively connected with a No. 2 port of the inductor SI4, the anode of the capacitor C66 and the cathode of the diode D34, and the cathode of the capacitor C66 is grounded; the port 3 of the inductor SI4 is connected with one end of a resistor R63, and the other end of the resistor R63 is connected with the port 2 of the U19; the anode of the diode D34 is connected with the power VCC end;

the data storage module comprises a chip U4 and a chip U5, wherein the types of the chip U4 and the chip U5 are AT24C256, the ports from No. 1 to No. 4 of the chip U4 are grounded, the port from No. 5 of the chip U4 is connected with one end of a resistor R7, the port from No. 6 of the chip U4 is connected with one end of a resistor R6, the port from No. 7 of the chip U4 is connected with one end of a resistor R5, the other ends of the port from No. 8, the resistor R5, the resistor R6 and the resistor R7 of the chip U4 are divided into two paths, one path is connected with one end of a capacitor C12, the other end of the capacitor C12 is grounded, and the other path is connected with a power VCC end;

The port 1 of the chip U5 is connected with the power VCC end, the ports 2 to 4 of the chip U5 are grounded, the port 5 of the chip U5 is connected with the port 47 of the microprocessor MCU chip U2, the port 6 of the chip U5 is connected with the port 46 of the microprocessor MCU chip U2, the port 7 of the chip U5 is connected with the port 7 of the chip U4, the port 8 of the chip U5 is divided into two paths, one path is connected with one end of the capacitor C13, the other end of the capacitor C13 is grounded, and the other path is connected with the power VCC end;

The lightning protection and static prevention module comprises a chip U6, a chip U33 and a chip U27, wherein the model of the chip U6 is HM9226, the model of the chip U33 is CD74HC04, and the model of the chip U27 is WRF1212S-3WR2; the ports No. 1, no. 5 and No. 9 of the chip U6 are divided into three paths, the first path is grounded, the second path is connected with one end of a resistor R22, the third path is connected with one end of a capacitor C18 and one end of a capacitor C19, the other end of the resistor R22 is respectively connected with one end of a resistor D6, the other ends of the capacitor C18 and the capacitor C19, one ends of a resistor R23 and a resistor R24, the anodes of a diode D27 and a diode D29, the cathodes of the diode D27 and the diode D29 are combined and connected with the cathodes of a diode D228 and a diode D30, the anodes of the diode D228 and the diode D30 are divided into two paths, one path is grounded, the other path is respectively connected with the cathodes of a capacitor C69, a capacitor C68 and a capacitor C67, the other end of the capacitor C69 is connected with the anode of a diode D17, the cathode of the diode D17 is connected with one end of a resistor R58, and the other end of the resistor R58 is connected with the port No. 3 of the chip U27; the other ends of the resistor R23 and the resistor R24 are respectively connected with the anode of the capacitor C67 and one end of the inductor L4, and the other end of the inductor L4 is respectively connected with the anode of the capacitor C68 and the No. 2 port of the chip U27; the anode of the diode D6 is respectively connected with the No. 8 port of the chip U6 and one end of the inductor L3, the other end of the inductor L3 is respectively connected with the No. 3 port of the chip U6, one end of the capacitor C16 and one end of the capacitor C17, the anode of the capacitor C15 and the No. 8 port of the chip U6, and the other ends of the capacitor C16 and the capacitor C17 and the cathode of the capacitor C15 are grounded; the port No. 4 of the chip U6 is connected with one end of a resistor R20, and the other end of the resistor R20 is connected with the port No. 52 of the microprocessor MCU chip U2;

The port 1 of the chip U33 is connected with the port 39 of the microprocessor MCU chip U2, the port 2 of the chip U33 is connected with the port 3 of the chip U33, the port 4 of the chip U33 is connected with the port 39 of the microprocessor MCU chip U2, the port 5 of the chip U33 is connected with the port 40 of the microprocessor MCU chip U2, the port 6 of the chip U33 is connected to the port 9 of the chip U33 through a network identifier SIGN1_IN, the port 7 of the chip U33 is grounded, the port 8 of the chip U33 is connected with the port 40 of the microprocessor MCU chip U2, the port 11 and the port 13 of the chip U33 are respectively grounded IN two paths, one path is connected with one end of the capacitor C57, and the other end of the capacitor C57 is connected with the port 14 of the chip U33;

The port 1 of the chip U27 is grounded, the port 6 of the chip U27 is connected with the positive electrode of the capacitor C70, the negative electrode of the capacitor C70 is respectively connected with the port 7 of the chip U27 and the negative electrode of the capacitor C71, and the positive electrode of the capacitor C71 is connected with the port 8 of the chip U27;

the working method of the flowmeter system is as follows:

2. A gas heat metering based flowmeter system as set forth in claim 1 wherein: the remote heat transfer flow meter (3) can also be a remote heat transfer film meter or an ultrasonic meter.