CN109941958B - Filling device of micro-channel chip - Google Patents

Abstract

The invention discloses a filling device of a micro-channel chip, which is used for filling functional materials in a micro-channel reaction area and comprises a first conveying assembly and a dry powder spraying assembly, wherein the dry powder spraying assembly comprises a powder spraying head, the powder spraying head corresponds to the reaction area of the micro-channel, the photoelectric probe and the powder spraying head are respectively connected through an external control system, and the external control system is used for controlling the dry powder spraying assembly to be positioned and filled. The invention utilizes the printing principle to combine with the manufacturing process of the microfluidic chip to print the microfluidic chip.

Description

A filling device for a microfluidic chip

technical field

The invention relates to the field of microfluidic technology, in particular to a filling device for a microfluidic chip.

Background technique

Microfluidic chip is a new interdisciplinary field and an important development frontier in many fields such as analytical science, micro-electromechanical processing, life science, chemical synthesis, analytical instruments and environmental science in the new century.

The processing technology of microfluidic analysis chips originated from the microfabrication of semiconductor and integrated circuit chips, but the processing size of the chip channel is much larger than that of large-scale integrated circuits. The size of the chip is about a few square centimeters, and the width and depth of the microchannel are on the order of microns. On the other hand, the selection of chip materials, the design of microchannels, the surface modification of microchannels and the fabrication of chips are the key issues of microfluidic analysis chips.

In the prior art, there are mainly methods such as laser engraving, chemical etching, and photolithography in the processing technology of microfluidic chips. These methods have their own advantages and disadvantages. The roughness is large, the repeatability is poor, and it is difficult to produce in batches, so it is difficult to be used as a general and effective chip processing method. With the development of modern numerical control micromachining technology, its processing accuracy and scale can meet the technical requirements of microfluidic chips, but the existing numerical control micromachining equipment is not designed for the design and processing of microfluidic chips , causing unnecessary waste and destruction of materials in application.

Therefore, there is still a lot of room for development in the prior art.

Contents of the invention

In view of the shortcomings of the above-mentioned prior art, the present invention provides a microfluidic chip printing system and its use method, which uses the principle of printing technology to manufacture microfluidic chips, has unique technical features, and improves the operating efficiency. flexibility.

In order to achieve the above object, the present invention adopts the following technical solutions: a filling device for a microfluidic chip, used for filling functional materials in the microfluidic reaction zone, including a first delivery component, the first delivery component includes The first head-end roller, the first end roller, and the first transfer substrate arranged between the first head-end roller and the first end roller, the first transfer substrate is loaded with micro-channels The first material layer; a dry powder spraying assembly, the dry powder spraying assembly is arranged between the first head roll and the first end roll. And corresponding to the first material layer; the dry powder spraying assembly includes a powder spraying head, the powder spraying head corresponds to the reaction zone of the micro-channel; a photoelectric probe, the photoelectric probe is located on the first Between the head end roller and the dry powder spraying assembly, the reaction zone on the micro-channel is positioned; the photoelectric probe and the powder spraying head are respectively connected through an external control system, and the dry powder is controlled by the external control system The powder spraying components are positioned for filling.

Preferably, it also includes a droplet assembly, the droplet assembly is arranged between the photoelectric probe and the first end roller, the droplet assembly includes several inkjet heads, and the position of the inkjet head is the same as that of the micro Corresponding to the reaction zone of the runner.

Preferably, it also includes: an electrostatic digital printing assembly, the electrostatic digital printing assembly is arranged between the photoelectric probe and the first end roller, and the electrostatic digital printing assembly corresponds to the reaction area of the microfluidic channel.

Preferably, it also includes: a slideway assembly, the electrostatic digital printing assembly, the dripping assembly, and the dry powder spraying assembly are installed on the slideway assembly, the electrostatic digital printing assembly, the dripping assembly . The dry powder spraying assembly is connected to the external control system through a servo motor, and the electrostatic digital printing assembly, the drop spraying assembly, and the dry powder spraying assembly are driven to shift or switch by the servo motor.

Preferably, the slideway assembly further includes a height adjuster, the electrostatic digital printing assembly, the dripping assembly, and the dry powder spraying group are connected to the servo motor through the height adjuster, and the external Under the control of the control system, the electrostatic digital printing assembly, the dripping assembly, and the dry powder spraying assembly are driven to move up and down by the servo motor.

Preferably, the filling device is arranged in an isolation room, and the isolation room is provided with a transfer port through which the first transfer substrate enters and exits.

Beneficial effects: (1), for example, the use of gravure printing components can effectively shorten the process cycle of the entire chip production, the first curing step and the printing step of the first material layer are carried out simultaneously, and in the first glue coating component The gluing is that the first discharge die can also be filled with the corresponding first material, and there is no need to proceed to the next step after one step is completed, which effectively saves time and solves the problem of complicated operability and processing cycle. long question.

(2) Each device of the whole system can be used independently, and the specific operation steps of the whole system can be selected according to different chip properties with good repeatability.

(3) Some components in the device have multi-selection operations, so different microfluidic chips can be printed, not just one, but can basically be used as a general and effective microfluidic chip processing system, and Compared with the existing technology, there is a great breakthrough.

(4) The properties of the first press-fit assembly can be selected, but when the number of layers of the chip is relatively large and the thickness is relatively large, it may involve the problem of the hardness of the press-fit device, so in the present invention The hardness of the first pressing component described in the above can be selected, which can be well applied to various chip manufacturing processes.

(5) The printing process of the entire microfluidic chip is similar to a production line, and the filling device is provided with multiple inkjet heads and powder spray heads, the electrodes are embossed, the first material layer is embossed, and the base plate is packaged etc. can all be operated in batches, which solves the deficiencies in the prior art.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to the structures shown in these drawings without creative effort.

1 is a schematic structural diagram of a microfluidic chip printing system according to Embodiment 1 of the present invention;

2 is a schematic structural view of the first material layer printing device according to Embodiment 1 of the present invention;

3 is a schematic structural view of a surface treatment device according to Embodiment 1 of the present invention;

Fig. 4 is the structural representation of the filling device of embodiment 1 of the present invention;

5 is a schematic structural view of an electrode printing device according to Embodiment 1 of the present invention;

FIG. 6 is a schematic structural diagram of a bottom plate packaging device according to Embodiment 1 of the present invention;

7 is a schematic structural view of the first punching assembly according to Embodiment 1 of the present invention;

FIG. 8 is a schematic structural view of the filling structure of the first material layer according to Embodiment 1 of the present invention;

FIG. 9 is a flow chart of the microfluidic chip printing method according to Embodiment 1 of the present invention.

Explanation of reference numbers:

The realization of the purpose of the present invention, functional characteristics and advantages will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Mutually

For the positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

In the present invention, unless otherwise specified and limited, the terms "connection" and "fixation" should be understood in a broad sense, for example, "fixation" can be a fixed connection, a detachable connection, or an integral body; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be an internal communication between two elements or an interaction relationship between two elements, unless otherwise clearly defined. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In addition, in the present invention, descriptions such as "first", "second" and so on are used for description purposes only, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the technical solutions of the various embodiments can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist , nor within the scope of protection required by the present invention.

According to the present invention shown in FIG. 1 , a microfluidic chip printing system is proposed. The microfluidic chip is produced conveniently and quickly, and the efficiency is significantly improved on the basis of limited technology. The microfluidic chip printing system includes: a first conveying assembly 1, and the first conveying assembly 1 includes a first head-end roller 10 , and the first transfer substrate 12 arranged between the first head end roller 10 and the first end roller 11, the first transfer substrate 12 adopts a transparent medical grade PMM first gravure template 2110, PC, CBC, COC, COP, PS, and other polymer coils, with widths ranging from 50mm to 360mm and thicknesses ranging from 0.1mm to 2mm. Specific specifications and dimensions are determined according to product size and layout; the conveying surface of the first conveying substrate 12 is level with the ground.

As shown in Figure 2, the microfluidic chip printing system also includes a first material layer 9 gravure printing device 2, and the first material layer 9 gravure printing device 2 includes a printing assembly 21, and the printing assembly 21 includes :

The first discharge die 210, so that the first material flows out from the first discharge die 210, the first material can be a medical grade thermoplastic or thermosetting powder resin or pellet resin, etc. What this embodiment adopts is a kind of thermoplastic pellet resin;

Further, an infrared heater 216 is provided on one side of the first discharge die 210 to heat the first material to make it flow out more smoothly.

The printing plate roller 211 corresponding to the first discharge die 210 is set, and the printing plate roller 211 corresponds to the rotation direction of the first head end roller 10 and the first end roller 11, and the printing plate roller 211 Rotating vertically on the ground, the surface of the printing plate roller 211 is provided with a first gravure template 2110; the first discharge die 210 is in contact with the first gravure template 2110, and the first discharge die 210 While discharging, it will also play the role of paving the first material and the first gravure template 2110, and the printing plate roller 211 is kept at least tangent to the upper surface of the first transmission belt; The first material can be in contact with the first transfer substrate 12, and the first curing device 214 disposed below the first transfer substrate 12, in this embodiment, according to the selected adhesive layer and the properties of the first material It is a kind of thermoplastic, so the first curing device 214 is a cold air knife, and the first curing device 214 corresponds to the printing plate roller 211, so that the first material filled in the first gravure template 2110 solidified to form the first material layer 9 with micro-channels 90, the first material layer 9 is driven by the first transfer substrate 12 to escape from the first gravure template 2110 and move toward the first end Roller 11 moves.

Specifically, the printing assembly 21 further includes: at least one hot pressing roller 215, the hot pressing roller 215 is arranged between the first discharge die 210 and the first conveying substrate 12, and The first gravure template 2110 is tangent, and the rolling push has a pressing effect on the first material, so that the first material filled in the first gravure template 2110 passes through the hot pressing roller 215 , fully filling the first gravure template 2110 , and at the same time ensuring that the first material is fully filled in the first gravure template 2110 before pressing.

Specifically, a first accommodating chamber 2111 is provided inside the printing plate roller 211, and a first thermostat 2112 is provided in the first accommodating chamber 2111, and the first thermostat 2112 maintains the temperature of the first material. , so that the part close to the first thermostat 2112 will not solidify, and the first thermostat 2112 is detachably connected to the first accommodating cavity 2111 .

Specifically, the functional layer gravure printing device also includes: a first gluing assembly 22, the first gluing assembly 22 is arranged before entering the printing assembly 21, and the first gluing assembly 22 includes: a corresponding A first glue-coating die 220 suspended on the upper surface of the first transfer substrate 12, so that the first glue is extruded from the first glue-coat die 220; and against the first transfer base The first carrier 221 on the lower surface of the material 12, in this embodiment, the first carrier 221 is a roller device, corresponding to the rotation of the first conveying substrate 12, the first carrier 221 and the first carrier 221 A glue coating die 220 is matched correspondingly, so that the surface of the first conveying substrate 12 on the first conveying substrate 12 is attached with a first adhesive layer. In this embodiment, the adhesive layer is a kind of hot melt adhesive.

Specifically, the functional layer gravure printing device further includes: a thermostatic assembly 24, which includes a heat preservation machine, and the thermostatic assembly 24 is arranged between the first gluing assembly 22 and the printing assembly 21 , keeping the temperature of the first transmission substrate 12 coated with the adhesive layer, so that the adhesive layer is not cured.

In this embodiment, since the nature of the first glue used is hot melt glue, the nature of the first material is also thermoplastic, so the corresponding thermostat assembly 24, hot pressing roller 215, first thermostat 2112, The first curing devices are all configured corresponding to their properties. When the properties of the adhesive layer adopt UV glue, the properties of the first material are also selected to be similar. At this time, the heat press roller 215 is replaced It is the pressing roller 215, that is, the heating equipment for closing the hot pressing roller 215, the first thermostat 2112 and the infrared heater 216 are both in the off state, and the first curing device is a light machine or an LED light strip, No specific limitation is made in the present invention.

Specifically, it also includes a first corona machine 23 arranged corresponding to the first conveying substrate 12, and the first corona machine 23 is arranged before the first gluing assembly 22 for improving the first conveying The surface tension of the substrate 12 increases the adhesion of the adhesive layer.

Specifically, the printing assembly 21 also includes a first embossing roller 212 and a second embossing roller 213; Hold the first transfer substrate 12 so that the first transfer substrate 12 is fully in contact with the first material in the first gravure template 2110 to form a bonding area, as described in this embodiment The shape of the bonding area corresponds to the radian of the printing plate roll 211, the first embossing roll 212 corresponds to the entrance of the bonding area, and the second embossing roll 213 corresponds to the exit of the bonding area, so The first curing device 214 is correspondingly arranged in the bonding area, and the first embossing roller 212 and the second embossing roller 213 have a certain distance from each other. In this embodiment, the arc length of the bonding area is about It accounts for 30% to 50% of the entire circumference, and the specific spacing can be adjusted according to the curing speed of the material.

Further, the printing assembly 21 also includes a release device 217 corresponding to the gravure roll, and a release liquid is stored in the release device 217; when the first material is pre-coated on the second Before a gravure template 2110, the stripper 217 is sprayed on the first gravure template 2110, so that an isolation layer is formed between the first material and the first gravure template 2110, and the release The molding agent can be polytetrafluoroethylene; fluororesin powder; fluororesin coating, etc., which are not specifically limited in the present invention.

Specifically, as shown in FIG. 2, a first punching assembly 3 is also included between the printing assembly 21 and the end fixing roller, and the first punching assembly 3 includes: The first die-cutting roll 30 and the first cut-off roll 31 above the base material 12 and below the first conveying base material 12; so that the first die-cut roll 30 corresponds to the first cut-off roll 31 Cooperate, through holes are set on the first material layer 9 through the first die-cutting roller 30, the first die-cutting roller 30 corresponds to the first cutting roller 31, and the first punching assembly 3 is in Coding holes are punched on both sides of the first base material to determine the position of the microfluidic channel 90 on the chip, and to cooperate with the alignment of subsequent bonding and packaging reagents. The method is: each type of coding hole represents a signal, corresponding to the corresponding micro-channel 90 area, the position signal is obtained through photoelectric identification, and transmitted to the external control system, the external control system gives corresponding action instructions, such as spraying Note test machine, etc.

Specifically, as shown in FIG. 3 , the microfluidic chip printing system also includes a surface treatment device 4, and the surface treatment device 4 includes a surface liquid sprayer 41 arranged corresponding to the microfluidic channel 90 to spray The surface treatment of the micro-channel 90 is carried out with the first liquid to obtain a second material layer 92 , and the second material layer 92 is attached to the surface of the micro-channel 90 .

Further, the surface treatment device 4 also includes a second corona machine 40, a dryer 42 or a refrigerator 43, and the second corona machine 40, a surface liquid spraying machine 41, a dryer 42 or a refrigerator 43 are sequentially away from the The first head-end roll 10 is arranged, and the dryer and the refrigerating machine are selected according to the characteristics of the characteristic layer, whether both are needed or one of the two is selected, and the second corona machine 40 is used to treat the first material The surface of the layer 9 is corona treated to increase the dyne value of the first material layer 9 .

The surface treatment material can be a liquid material such as a hydrophobic or hydrophilic or biocompatible protein that improves the flow channel surface of the microfluidic chip.

Specifically, as shown in FIG. 4, a filling device 5 is also provided between the surface treatment device 4 and the first end roller 11, and the filling device 5 includes: correspondingly arranged above the micro flow channel 90 nozzles, so as to fill the second material liquid stored in the nozzles into the reaction zone of the second material layer 92 microchannel 90 to obtain a third material layer 93 .

Further, the filling device 5 also includes a dry powder spraying assembly 50, corresponding to the first material layer 9; the dry powder spraying assembly 50 includes a powder spraying head 500, and the powder spraying head 500 is connected to the micro The reaction zone of the flow channel 90 corresponds to;

Further, a photoelectric probe 54 is also included, and the photoelectric probe 54 is arranged between the surface treatment device 4 and the dry powder spraying assembly 50 to locate the reaction zone on the microchannel 90; The photoelectric probe 54 and the powder spraying head 500 are respectively connected through an external control system, and the external control system controls the positioning and filling of the dry powder spraying assembly 50 .

Further, it also includes a dripping assembly 51, the dripping assembly 51 is arranged between the photoelectric probe 54 and the first end roller 11, the dripping assembly 51 includes several inkjet heads 510, the inkjet The position of the head 510 corresponds to the reaction area of the micro-channel 90 , similar to the inkjet printing mechanism, the inkjet head 510 can be filled with various kinds of reagents.

Further, it also includes: an electrostatic digital printing assembly 52, the electrostatic digital printing assembly 52 is arranged between the photoelectric probe 54 and the first end roller 11, the electrostatic digital printing assembly 52 and the micro flow channel 90 Corresponding to the reaction area, the electrostatic digital printing component 52 is similar to the Xerox electrostatic digital printing machine, and is transferred to the acupuncture point by means of electrostatic adsorption of relief bumps corresponding to the size of the chip reaction acupuncture point.

Further, it also includes: a slideway assembly 53, the electrostatic digital printing assembly 52, the drop spray assembly 51, and the dry powder spraying assembly 50 are installed on the slideway assembly 53, and the electrostatic digital printing assembly 52 , the dripping assembly 51, the dry powder spraying assembly 50 are connected to the external control system through the servo motor 530, and the electrostatic digital printing assembly 52, the dripping assembly 51, the The displacement or switch of the dry powder spraying assembly 50.

In the present invention, the electrostatic digital printing assembly 52, the drip spraying assembly 51, and the dry powder spraying assembly 50 are optional parts, and the filling method can be selected according to the nature of the chip, and a device can be selected for filling. You can choose both, or you can choose both, which is not limited in this aspect.

Specifically, the slide assembly 53 also includes a height adjuster 531, and the electrostatic digital printing assembly 52, the dripping assembly 51, and the dry powder spraying group pass through the height adjuster 531 and the servo motor 530 connected, under the control of the external control system, the electrostatic digital printing assembly 52, the dripping assembly 51, and the dry powder spraying assembly 50 are driven to move up and down by the servo motor 530.

Specifically, as shown in FIG. 5 , the microfluidic chip printing system further includes an electrode printing device 6, and the electrode printing device 6 includes: a second conveying assembly 60, and the second conveying assembly 60 includes a first Two head-end rollers 600, a second end roller 601, and a second conveying substrate 602 arranged between the second head-end roller 600 and the second end roller 601 are used to convey electrode raw materials. In this embodiment The electrode raw material can be a copper foil or aluminum foil suitable for biochemical detection, and can also be used as a thin film material such as a metal coating suitable for the electrode, and the present invention does not specifically limit it;

A cutting assembly 61 is also included, and the cutting assembly 61 includes: respectively corresponding to the circular film cutter 610, the second cutting roller 611, the traction Roller, the circular film cutter 610 is set corresponding to the second cutting roller 611; the second conveying substrate 602 transmits electrode raw materials through the circular film cutting knife 610, between the cutting roller and the The traction roller establishes the connection, and the electrode sheet and the remaining material around the electrode sheet are cut out by the corresponding matching of the circular film cutter 610 and the cutting roller on the second conveying substrate 602; in this embodiment, the The traction roller is connected with the electrode raw material, the traction roller is far away from the second head end roller 600, and the traction roller is corresponding to the speed of the second conveying substrate 602 to wrap the remaining material and the winding on the traction roller. The rest of the electrode sheet is on the second transmission substrate 602 , and the second transmission substrate 602 is provided with a turning roller 623 .

Specifically, the polar printing assembly device further includes: a third conveying assembly 62, the third conveying assembly 62 includes a third head end roller 620, a third end roller 621, and a 620, the third transmission base material 622 between the third end rollers 621, the third transmission base material 622 is also provided with a turning roller 623, through the turning roller 623, the side with the third adhesive layer faces to the The electrode sheet, the third transfer substrate 622 is used to transfer the second base layer;

The third gluing assembly 63, the third gluing assembly 63 is arranged on the third conveying substrate 622 between the third head end roller 620 and the turning roller 623, the third gluing assembly 63 Including, corresponding to the third glue-coating die 630 suspended on the upper surface of the third conveying substrate 622, so that the glue is extruded from the third glue-coating die 630; and

The third carrier 631 against the lower surface of the third conveying substrate 622, the third carrier 631 is correspondingly matched with the third glue-coating die 630, so that the upper surface of the second base layer is attached to the third carrier. Adhesive layer; in this embodiment, the property of the third adhesive layer is the same as that of the second adhesive layer 94 . In this embodiment, the first carrier, the second carrier and the third carrier are all roller devices.

The third end roller 621 is tangent to the second conveying substrate 602 between the cutting assembly 61 and the second pressing assembly 64, and the third end roller 621 is in contact with the second conveying substrate 602. The substrate 602 is correspondingly rotated for transferring the second base layer into the second transfer substrate 602 .

Specifically, the electrode printing device 6 further includes: a second pressing assembly 64, the second pressing assembly 64 is arranged between the cutting assembly 61 and the second end roller 601 on the second On the conveying substrate 602, the second lamination assembly 64 includes a third lamination roller 640 and a fourth lamination roller 641, the third lamination roller 640 is tangent to the upper surface of the second conveyance substrate 602 , the fourth pressing roller 641 is tangent to the lower surface of the second conveying substrate 602, through the corresponding cooperation of the third pressing roller 640 and the fourth pressing roller 641, the electrode sheet is attached to the On the adhesive layer of the second base layer, a second base layer with electrode sheets is formed. In this embodiment, the electrode sheets are embossed into the third adhesive layer, so that the electrode sheets and the third adhesive layer Layers flush.

Specifically, the third terminal fixing roller is the first pressing roller 710 .

Specifically, a second thermostat 65 is also included, and the second thermostat 65 is arranged between the third end fixing roller and the third gluing assembly 63, corresponding to the second glued layer. The base layer is heated at a constant temperature, so as to facilitate stable adhesion when the second base layer and the electrode sheet are pressed together.

Specifically, a second punching assembly 66 is also provided between the second pressing assembly 64 and the second end roller 601. The second punching assembly 66, the two punching assemblies include: The second convex roller 660 and the second backup roller 661 above the second transfer substrate 602 and below the second transfer substrate 602; so that the first die-cutting roller 30 and the first backup roller 31 is correspondingly matched, and a through hole is set on the second base layer through the first die-cutting roller 30 .

Specifically, as shown in Figure 6, the microfluidic chip printing system also includes:

electrode strip 73; and

The bottom plate packaging device 7, the bottom plate packaging device 7 includes: a second glue coating component 72 and a first pressing component 71,

The second gluing assembly 72 includes a second gluing die 722 corresponding to the upper surface of the first material layer 9 , so that the second glue is extruded from the second gluing die 722 , in this embodiment, the second glue is photosensitive glue, ultraviolet curing glue (UV glue); The second glue-coating die is correspondingly matched, so that the bonding area on the surface of the first material layer 9 is attached to the second glue layer 94; the first pressing component 71 is provided with the second glue-coating component 72 and the Between the first end rollers 11, the first pressing assembly 71 includes a first pressing roller 710 and a second pressing cylinder 711 corresponding to each other, and the first conveying base with the first material layer 9 The material 12 and the electrode belt 73 pass through between the first pressing roller 710 and the second pressing roller synchronously, and the electrode belt is passed through the first pressing roller 710 and the second pressing roller. 73 is pressed together with the first material layer 9 to form a microfluidic chip strip.

Further, the second end roller 601 is connected with the electrode belt 73 , and transfers the second base layer with the electrode onto the first transfer substrate 12 .

Further, the second gluing assembly 72 also includes a gluing roller 720, on which a second gravure template 7200 is arranged, and the shape of the second gravure template 7200 is consistent with that of the non-microchannel Area 91 corresponds;

The second gluing die 722, the second gluing die 722 corresponds to the gluing roller 720, scrapes the encapsulation adhesive layer into the second gravure template 7200;

Adhesive roller 723, the adhesive roller 720 and the adhesive roller 723 are arranged oppositely, and the adhesive roller 720 and the adhesive roller 723 rotate in opposite directions, so that the encapsulation glue layer in the second gravure template 7200 is transferred To the non-micro-channel region 91 on the first material layer 9 , a second adhesive layer 94 is formed, and the second carrier is a rubber roller 723 in this embodiment.

In the present invention, the bottom plate packaging device may also have a screen roll, and the screen roll 72 may also be a screen offset plate and a second glue-coating die 722 corresponding to the screen offset plate. The glue leakage pattern of the offset plate corresponds to the non-micro-channel 91 area of the first material layer 9, the second glue-coating die 722 is arranged above the screen, and the second glue-coating die 722 passes through Driven by a servo motor 530, cyclically sliding on the screen, printing the adhesive layer on the non-microfluidic layer, the servo motor 530 is connected to an external control system; or, the second gluing assembly 72 is a screen roll 721 and a glue coating die arranged in the screen roll 721, the glue leakage pattern of the screen roll 721 corresponds to the non-micro-channel 91 area of the first material layer 9, through The manner in which the glue-coating die transfers the encapsulation glue layer to the non-microchannel 91 area is not specifically limited in the present invention.

Specifically, the first pressing roller 710 of the first pressing assembly 71 is provided with a second accommodating chamber 7100, and the second accommodating chamber 7100 is provided with a second curing device 7101 for curing the encapsulant. layer is cured.

Further, since the encapsulation adhesive layer used in this embodiment is an ultraviolet curing adhesive, the second curing device 7101 is an ultraviolet light machine, and the ultraviolet light is an LED light strip, which is arranged in the second accommodation chamber 7100 The position closest to the first conveying substrate 12 ; the first pressing roller 710 is made of transparent material to ensure good light transmission.

Specifically, the hardness of the second pressing cylinder 711 is 20-40; the hardness of the first pressing roller 710 is 80-100; so that the first pressing roller 710, the second pressing roller When the cylinders 711 are pressed against each other, the second lamination cylinder 711 is extruded and deformed, forcing the electrode belt 73 , the first material layer 9 and the first lamination roller 710 to be in strip-shaped contact.

Further, the first bonding assembly further includes: a transparent third bonding cylinder 712 with a hardness of 20-40, the third bonding cylinder 712 is sleeved on the outside of the first bonding roller 710 and connected to the The second pressing cylinder 711 corresponds.

Further, the first pressing roller 710 is made of quartz; the second pressing cylinder 711 and the third pressing cylinder 712 are made of silica gel.

Since in the present invention, the number of embossed layers is changeable, when the number of laminated layers is large or the chip semi-finished product to be laminated has a certain rigidity, the first pressing roller can be adjusted accordingly 710 , the appropriate hardness of the second pressing cylinder 711 and the third pressing cylinder 712 to make the pressing more sufficient without damaging the chip.

Further, an external conveying assembly (not shown) is also provided between the second gluing assembly 72 and the first pressing assembly 71: the external conveying assembly includes a head roller and a tail roller, and is arranged on the The outer first conveying substrate 12 between the first roller and the tail roller; The transfer substrate 12 is covered on the adhesive layer with a layout.

Further, the microfluidic chip printing system also includes a packaging device, and the packaging is arranged between the first pressing assembly 71 and the first end roller 11, so as to realize the control of the microfluidic chip. Chip strips are cut and packaged in this embodiment, and the packaging device is a vacuum blister machine.

The packaging device also includes a printing assembly, and the printing device includes a digital inkjet printer group, which prints two-dimensional codes and codes on the chip.

Specifically, the microfluidic chip printing system also includes a detection device, the detection device is arranged on the first conveying substrate 12 between the printing assembly and the first end roller 11, the detection device It includes an artificial intelligence visual scanning machine, and in this embodiment, the visual scanning machine is a microfluidic chip detection machine.

Specifically, the conveying assembly also includes a number of correcting limiters 8, each of which includes: a limit hole arranged on the first conveying substrate 12, and a hole corresponding to the limiter. Deviation correcting rollers provided in positioning holes; during the displacement of the first conveying substrate 12, the deviation correcting rollers are constantly matched with the limiting holes to avoid deviation from the conveying route.

Each of the devices described in the present invention is placed in an isolation room, and the isolation room is provided with a transfer port through which the first transfer substrate enters and exits, mainly to prevent component contamination.

A method of printing a microfluidic chip, as shown in Figure 9, comprising the following steps:

A first transmission substrate 12 and a printing plate roller 211 are provided, and the printing plate roller 211 rotates driven by the first transmission substrate 12 .

S1: first corona step: increasing the surface dyne value of the first transfer substrate 12 through the first corona machine 23, so that the dyne value is increased to 30 dyne to 60 dyne.

S2: First glue coating step: setting a first glue layer on the side of the first transfer substrate 12 corresponding to the printing plate roller 211, the thickness of the first glue layer is between 1.5 microns and 10 microns.

S3: Constant temperature step: use the constant temperature component 24 to keep the temperature of the first adhesive layer constant, so that the first adhesive layer is not cured.

S4: pre-demoulding step: before the first material is coated on the first gravure template 2110, spray the release liquid on the first gravure template 2110 through the stripper 217, so that the An isolation layer is formed between the first material layer 9 and the first gravure template 2110 .

S5: Gravure printing step: the first material flows out from the first discharge die 210 and fills into the printing plate roller 211 provided with the first gravure template 2110 on its surface.

S6: punching step, the first punching component 3 punches the first transfer substrate 12 with the first material layer 9 and/or the first material layer 9 .

S71: Using the second corona machine 40 to increase the surface dyne value of the first material layer 9 to increase the dyne value to 30 dyne to 60 dyne. Transfer the first feed liquid and the second feed liquid stored in the surface treatment device 4 and/or the nozzle to the micro-channel 90 ; and obtain a hydrophilic layer or a hydrophobic layer through drying and/or refrigerator treatment.

S8: Specifically, the filling step also includes: a dry powder transfer mechanism, and the dry powder transfer mechanism includes: a powder nozzle, a powder transfer roller respectively arranged above the first material layer 9, and a powder roller arranged on the first material layer 9. The printing roller below the first conveying substrate 12 ; with the cooperation of the printing roller, the powder sent from the powder outlet nozzle is filled in the micro-channel 90 through the powder transfer roller.

S9: glue printing step: using screen printing or rotary screen printing or flexographic printing method, avoiding the micro flow channel 90, and coating the second glue layer 94 on the bonding area surface of the first material layer 9;

S10: Pressing step: the electrode strip 73 and the first material layer 9 with the second glue are synchronously sent between the first pressing roller 710 and the second pressing roller, so that the electrode strip 73 Correspondingly attached to the bonding area;

S11: second curing step: a second curing device is provided in the first pressing roller 710 and/or the second pressing roller, and the second curing device corresponds to the second adhesive, so that the The electrode strip 73 is pressed together with the first material layer 9 to realize the curing of the second adhesive.

Specifically, the second curing step includes: a belt-shaped ultraviolet curing device arranged in the first pressing roller 710, the second adhesive layer 94 is an ultraviolet curing glue, and the second pressing roller is a flexible The second pressing roll, when the flexible second pressing roll and the first pressing roll 710 are co-pressed, so that the electrode belt 73, the first transfer substrate 12 and the first pressing roll Roller 710 has a planar curing area.

Specifically, the gravure printing step, the first curing step, the filling step, the glue printing step, the pressing step, and the second curing step are repeated in sequence, at least once.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Under the conception of the present invention, the equivalent structural transformation made by using the description of the present invention and the contents of the accompanying drawings, or directly/indirectly used in Other relevant technical fields are included in the patent protection scope of the present invention.

Claims (2)

1. a filling device of a microfluidic chip, for filling functional materials in the reaction zone of the microfluidic, it is characterized in that, comprising: The first conveying assembly, the first conveying assembly includes a first head end roller, a first end roller, and a first conveying substrate arranged between the first head end roller and the first end roller, the first end roller A transport substrate is loaded with a first material layer provided with micro-channels; The dry powder spraying assembly, the dry powder spraying assembly is arranged between the first end roller and the first end roller, and corresponds to the first material layer; the dry powder spraying assembly includes a powder spraying head, the The powder spray head corresponds to the reaction zone of the micro-channel; A photoelectric probe, the photoelectric probe is set between the first end roller and the dry powder spraying assembly to locate the reaction zone on the micro-channel; the photoelectric probe and the powder spraying head are respectively controlled by external System connection, through the external control system to control the positioning and filling of the dry powder spraying assembly; It also includes a drop ejection assembly, the drop ejection assembly is arranged between the photoelectric probe and the first end roller, the drop ejection assembly includes several inkjet heads, the position of the inkjet head is in relation to the position of the micro flow channel corresponding to the reaction zone; It also includes: an electrostatic digital printing assembly, the electrostatic digital printing assembly is arranged between the photoelectric probe and the first end roller, and the electrostatic digital printing assembly corresponds to the reaction area of the micro-channel; The slideway assembly, the electrostatic digital printing assembly, the dripping assembly, and the dry powder spraying assembly are installed on the slideway assembly, the electrostatic digital printing assembly, the dripping assembly, and the dry powder spraying assembly The components are connected to the external control system through the servo motor, and the displacement or switch of the electrostatic digital printing component, the drip spray component, and the dry powder spray component is driven by the servo motor; The slideway assembly also includes a height regulator, the electrostatic digital printing assembly, the dripping assembly, and the dry powder spraying group are connected to the servo motor through the height regulator, and are controlled by the external control system Next, the electrostatic digital printing assembly, the dripping assembly, and the dry powder spraying assembly are driven to move up and down by the servo motor. 2 . The filling device according to claim 1 , characterized in that, the filling device is arranged in a compartment, and the compartment is provided with a transfer port through which the first transfer substrate enters and exits. 3 .

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